JP2003234020A5 - - Google Patents

Claims (3)

芯材粒子、前記芯材粒子の表面に形成された導電性金属層、及び、前記導電性金属層の表面に形成された絶縁層からなる導電性微粒子であって、前記芯材粒子は、平均粒子径が０．５〜３０μｍであり、
前記導電性金属層は、表面に前記導電性金属層の最外層と実質的に連続である高さ０．０５〜４μｍの微小突起を有する
ことを特徴とする導電性微粒子。Core particles, conductive metal layer formed on the surface of the core particle, and conductive fine particles comprising an insulating layer formed on the surface of the conductive metal layer, the core particle is an average The particle size is 0.5-30 μm,
The conductive metal layer has a fine projection having a height of 0.05 to 4 μm substantially continuous with the outermost layer of the conductive metal layer on a surface thereof. 芯材粒子は、樹脂からなることを特徴とする請求項１記載の導電性微粒子。  2. The conductive fine particle according to claim 1, wherein the core particle is made of a resin. 微小突起は、１粒子当たりの平均突起数が８以上であり、かつ、下記式（２）で表される突起密度係数が０．２５以上であることを特徴とする請求項１または２記載の絶縁被覆導電性微粒子。
Ｄ＝Ｎ／［４×（ｒ＋ｈ）²÷（２×ｒ×ｈ＋ｈ²）］ （２）
式中、Ｄは突起密度係数を表し、Ｎは１粒子当たりの平均突起数を表し、ｒは導電性微粒子の平均半径を表し、ｈは微小突起の平均高さを表す。3. The fine protrusions have an average number of protrusions per particle of 8 or more and a protrusion density coefficient represented by the following formula (2) of 0.25 or more. Insulating coated conductive fine particles.
D = N / [4 × (r + h) ² ÷ (2 × r × h + h ² )] (2)
In the formula, D represents the projection density coefficient, N represents the average number of projections per particle, r represents the average radius of the conductive fine particles, and h represents the average height of the microprojections.