JP2003188527A - Reflow soldering device - Google Patents
Reflow soldering deviceInfo
- Publication number
- JP2003188527A JP2003188527A JP2001387738A JP2001387738A JP2003188527A JP 2003188527 A JP2003188527 A JP 2003188527A JP 2001387738 A JP2001387738 A JP 2001387738A JP 2001387738 A JP2001387738 A JP 2001387738A JP 2003188527 A JP2003188527 A JP 2003188527A
- Authority
- JP
- Japan
- Prior art keywords
- cooling air
- substrate
- reflow
- heating means
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、融点の高いはんだ
に適するリフローはんだ付け装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow soldering apparatus suitable for solder having a high melting point.
【０００２】[0002]
【従来の技術】図３に示されるように、従来のリフロー
はんだ付け装置は、炉体１の内部にワーク搬送用のコン
ベア２が設けられ、このコンベア２に沿ってプリヒート
用の予加熱装置３と、リフロー用の本加熱装置４とが配
列されている。さらに、炉体１のワーク搬出側に冷却フ
ァン装置５が設けられている。コンベア２により搬送さ
れるワーク６は、基板上にソルダペーストを介し電子部
品が搭載されている。2. Description of the Related Art As shown in FIG. 3, in a conventional reflow soldering apparatus, a conveyor 2 for transferring a work is provided inside a furnace body 1, and a preheating apparatus 3 for preheating is provided along the conveyor 2. And the main heating device 4 for reflow are arranged. Further, a cooling fan device 5 is provided on the workpiece carry-out side of the furnace body 1. The work 6 conveyed by the conveyor 2 has electronic components mounted on a substrate via a solder paste.
【０００３】そして、予加熱装置３によりワーク６をプ
リヒートし、本加熱装置４によりワーク６をはんだ融点
以上に加熱してソルダペーストをリフローし、冷却ファ
ン装置５によりワーク６を冷却する。Then, the work 6 is preheated by the preheating device 3, the work 6 is heated to a temperature equal to or higher than the solder melting point by the main heating device 4 to reflow the solder paste, and the work 6 is cooled by the cooling fan device 5.
【０００４】このようなリフローはんだ付け装置におい
て、融点の低い錫−鉛共晶はんだのソルダペーストを用
いる場合、ワーク６の加熱温度は、ワーク６の基板に搭
載された電子部品の耐熱性が問題となるほど高くはな
い。In such a reflow soldering apparatus, when a solder paste of a tin-lead eutectic solder having a low melting point is used, the heating temperature of the work 6 is a heat resistance of electronic parts mounted on the substrate of the work 6. Is not so high.
【０００５】一方、環境問題の観点から鉛を用いない鉛
フリーはんだでリフローはんだ付けをする場合は、鉛フ
リーはんだの融点が高いので、ワーク６の加熱温度を上
げる必要がある。On the other hand, in the case of reflow soldering with lead-free solder that does not use lead from the viewpoint of environmental problems, it is necessary to raise the heating temperature of the work 6 because the melting point of lead-free solder is high.
【０００６】[0006]
【発明が解決しようとする課題】このような鉛フリーは
んだを用いてリフローはんだ付けをする場合は、基板の
一側面に搭載された電子部品の耐熱性が損なわれるおそ
れがある。When reflow soldering is performed using such lead-free solder, the heat resistance of electronic components mounted on one side surface of the board may be impaired.
【０００７】本発明は、このような点に鑑みなされたも
ので、基板に搭載された電子部品の耐熱性を損なうこと
なく、沸点の高い鉛フリーはんだによるリフローはんだ
付けを確実にできるリフローはんだ付け装置を提供する
ことを目的とするものである。The present invention has been made in view of the above points, and can reliably perform reflow soldering with lead-free solder having a high boiling point without impairing heat resistance of electronic components mounted on a substrate. The purpose is to provide a device.
【０００８】[0008]
【課題を解決するための手段】請求項１に記載された発
明は、一側面に電子部品を搭載した基板の他側面を加熱
して基板に電子部品をリフローはんだ付けするリフロー
加熱手段と、基板の一側面に沿って電子部品冷却用の冷
却風を生じさせる部品温度上昇抑制手段とを具備したリ
フローはんだ付け装置であり、部品温度上昇抑制手段の
冷却風により、基板の一側面に搭載された電子部品を強
制冷却するとともに、リフロー加熱手段により基板の他
側面を高温に加熱することで、基板の一側面に位置する
電子部品の本体部分と他側面に位置するリフローはんだ
付け部分との間に十分な温度差を確保でき、電子部品の
耐熱性を損なうことなく、沸点の高い鉛フリーはんだに
よるリフローはんだ付けをすることができる。According to a first aspect of the present invention, there is provided a reflow heating means for heating another side of a board having an electronic component mounted on one side to reflow solder the electronic part to the board, and a board. A reflow soldering apparatus having a component temperature rise suppressing means for generating cooling air for cooling electronic components along one side surface of the board, and the reflow soldering device is mounted on one side surface of the board by the cooling wind of the component temperature increase suppressing means. Between the main part of the electronic component located on one side of the board and the reflow soldering part located on the other side, by forcibly cooling the electronic part and heating the other side of the board to a high temperature by the reflow heating means. A sufficient temperature difference can be secured, and reflow soldering with lead-free solder having a high boiling point can be performed without impairing the heat resistance of electronic components.
【０００９】請求項２に記載された発明は、請求項１記
載のリフロー加熱手段が、基板の他側面に対し赤外線を
輻射する輻射式加熱手段と、温度コントロールされた熱
風を基板の他側面を経て循環させる熱風式加熱手段とを
具備したリフローはんだ付け装置であり、輻射式加熱手
段から輻射された赤外線により基板の他側面を強力に加
熱できるとともに、熱風式加熱手段で温度コントロール
された熱風により基板の他側面を均一に加熱でき、沸点
の高い鉛フリーはんだによるリフローはんだ付けを確実
にできる。According to a second aspect of the present invention, the reflow heating means according to the first aspect includes a radiant heating means for radiating infrared rays to the other side surface of the substrate and hot air whose temperature is controlled on the other side surface of the substrate. It is a reflow soldering device equipped with hot air type heating means to circulate through, and can strongly heat the other side of the substrate by infrared rays radiated from the radiation type heating means, and by hot air whose temperature is controlled by the hot air type heating means. The other side of the board can be heated uniformly, and reflow soldering with lead-free solder with a high boiling point can be reliably performed.
【００１０】請求項３に記載された発明は、請求項２記
載の輻射式加熱手段がハロゲンランプヒータを備えたリ
フローはんだ付け装置であり、このハロゲンランプヒー
タは、電圧制御により赤外線エネルギをコントロールし
やすく、基板の加熱温度を容易に所定温度に保つことが
できる。The invention described in claim 3 is a reflow soldering device in which the radiant heating means according to claim 2 is provided with a halogen lamp heater, and this halogen lamp heater controls infrared energy by voltage control. The heating temperature of the substrate can be easily maintained at a predetermined temperature.
【００１１】請求項４に記載された発明は、請求項１乃
至３のいずれか記載の部品温度上昇抑制手段が、基板の
一側面に沿って流れる冷却風を供給する冷却風供給部
と、冷却風供給部と対向して設置され電子部品冷却後の
冷却風を回収する冷却風回収部とを具備したリフローは
んだ付け装置であり、冷却風供給部と冷却風回収部とに
より、それらの間に冷却風の通路を明確に形成でき、リ
フロー加熱手段と部品温度上昇抑制手段との相互干渉を
防止できる。According to a fourth aspect of the present invention, the component temperature increase suppressing means according to any one of the first to third aspects includes a cooling air supply section for supplying cooling air flowing along one side surface of the substrate, and a cooling air supply section. A reflow soldering device having a cooling air collecting unit for collecting cooling air after cooling an electronic component, the cooling air collecting unit being installed between the cooling air supplying unit and the cooling air collecting unit. A passage for the cooling air can be clearly formed, and mutual interference between the reflow heating means and the component temperature rise suppressing means can be prevented.
【００１２】請求項５に記載された発明は、請求項１乃
至４のいずれか記載のリフローはんだ付け装置におい
て、炉体と、炉体内で基板を搬送するコンベアとを備
え、コンベアは、基板搬送用の１対の無端チェンと、こ
れらの無端チェンを移動自在に案内する１対のガイドレ
ールと、これらのガイドレールと炉体の内壁面との間に
水平に設けられた遮蔽板とを具備したリフローはんだ付
け装置であり、遮蔽板によりコンベアのガイドレールと
炉体の内壁面との間を塞いだので、この間での相互の熱
移動をできるだけ抑制して、リフロー加熱手段と部品温
度上昇抑制手段との相互干渉を防止できる。According to a fifth aspect of the present invention, in the reflow soldering apparatus according to any one of the first to fourth aspects, a furnace body and a conveyer for conveying the substrate in the furnace body are provided, and the conveyer conveys the substrate. And a pair of guide rails for movably guiding the endless chains, and a shield plate horizontally provided between the guide rails and the inner wall surface of the furnace body. This is a reflow soldering device that uses a shield plate to block the space between the guide rail of the conveyor and the inner wall surface of the furnace body. Mutual interference with the means can be prevented.
【００１３】[0013]
【発明の実施の形態】以下、本発明を図１および図２に
示された一実施の形態を参照しながら詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described in detail with reference to the embodiment shown in FIGS.
【００１４】図１に示されるように、炉体11の内部に、
ワーク12を搬送するコンベア13が配設されている。図示
された炉体部分は、リフロー用の本加熱領域であるが、
この本加熱領域の上流側には、ワーク12をプリヒートす
る予加熱領域（図示せず）が設けられている点は、従来
のリフローはんだ付け装置と同様である。As shown in FIG. 1, inside the furnace body 11,
A conveyor 13 that conveys the work 12 is provided. The furnace part shown is the main heating area for reflow,
As in the conventional reflow soldering device, a preheating region (not shown) for preheating the work 12 is provided on the upstream side of the main heating region.
【００１５】コンベア13により搬送されるワーク12は、
基板12aの一側面すなわち上側面に電子部品12bの本体部
分を搭載し、この電子部品12bの本体部分から突出され
たリード部分を基板12aの小孔に挿入して基板12aの他側
面すなわち下側面に露出させたものであり、このリード
部分が、基板12aの下側面にリフローはんだ付けされる
リフローはんだ付け部分となる。The work 12 conveyed by the conveyor 13 is
The main body portion of the electronic component 12b is mounted on one side surface of the substrate 12a, that is, the upper side surface, and the lead portion protruding from the main body portion of the electronic component 12b is inserted into the small hole of the substrate 12a, that is, the other side surface of the substrate 12a, that is, the lower side surface. This lead portion serves as a reflow soldering portion to be reflow soldered to the lower surface of the substrate 12a.
【００１６】コンベア13の下側には、基板12aの下側面
を加熱して基板12aに電子部品12bをリフローはんだ付け
するリフロー加熱手段14が設けられ、また、コンベア13
の上側には、基板12aの上側面に沿って電子部品冷却用
の冷却風を生じさせる部品温度上昇抑制手段15が設けら
れている。Below the conveyor 13, there is provided a reflow heating means 14 for heating the lower surface of the board 12a to reflow solder the electronic component 12b to the board 12a.
A component temperature rise suppressing means 15 for generating cooling air for cooling electronic components is provided on the upper side of the substrate 12a along the upper side surface of the substrate 12a.
【００１７】リフロー加熱手段14は、基板12aの下側面
に対し赤外線を輻射する輻射式加熱手段16と、温度コン
トロールされた熱風を基板12aの下側面を経て循環させ
る熱風式加熱手段17とを具備している。The reflow heating means 14 comprises a radiant heating means 16 for radiating infrared rays to the lower surface of the substrate 12a, and a hot air heating means 17 for circulating hot air whose temperature is controlled through the lower surface of the substrate 12a. is doing.
【００１８】熱風式加熱手段17は、図１に示されるよう
に１対の仕切板21の間に、上面を開口した函体22が設置
され、この函体22の内部に下側から複数のヒータ23と、
パンチング板で形成した整流板24と、温度調節用の熱電
対25とが順次設置され、函体22の上端に熱風吹出口26が
開口されている。As shown in FIG. 1, the hot-air type heating means 17 is provided with a box body 22 having an upper surface opened between a pair of partition plates 21, and inside the box body 22, a plurality of boxes are arranged from the lower side. Heater 23,
A straightening plate 24 formed of a punching plate and a thermocouple 25 for temperature adjustment are sequentially installed, and a hot air outlet 26 is opened at the upper end of the box 22.
【００１９】さらに、函体22の上端縁と１対の仕切板21
の上端水平板部27との間に熱風回収口28がそれぞれ開口
され、これらの熱風回収口28は、函体22と１対の仕切板
21との間に形成された熱風回収通路31を介して、図２に
も示されるように炉体11の底部に沿って設けられた熱風
吸込通路32に連通され、さらに、炉体11の下部に上向き
に設置された熱風循環ファン33の吸込口34に連通されて
いる。Further, the upper edge of the box 22 and a pair of partition plates 21
The hot air recovery ports 28 are opened between the upper end horizontal plate portion 27 and the hot air recovery ports 28, and the hot air recovery ports 28 and the box 22 and a pair of partition plates.
2 is connected to a hot air suction passage 32 provided along the bottom portion of the furnace body 11 through a hot air recovery passageway 31 formed between the furnace body 11 and the lower portion of the furnace body 11. Is communicated with a suction port 34 of a hot air circulation fan 33 installed upward.
【００２０】この熱風循環ファン33は、吸込口34がケー
シング35の中央部に開口され、ケーシング35の内部に、
電動モータ36により回転駆動される放射状の羽根車37が
回転自在に軸支され、図２に示されるように熱風吸込通
路32と異なる位置でケーシング35の函体22側に吐出口38
が開口され、この吐出口38から、羽根車37の外周より放
出された冷却風を函体22内に吐出するシロッコファンな
どの遠心式ファンである。In this hot air circulation fan 33, the suction port 34 is opened in the central portion of the casing 35, and inside the casing 35,
A radial impeller 37 rotatably driven by an electric motor 36 is rotatably supported by a shaft, and as shown in FIG. 2, at a position different from the hot air intake passage 32, a discharge port 38 is provided on the casing 22 side of the casing 35.
Is a centrifugal fan such as a sirocco fan that discharges the cooling air discharged from the outer periphery of the impeller 37 from the discharge port 38 into the box 22.
【００２１】前記輻射式加熱手段16は、函体22の熱風吹
出口26に複数のハロゲンランプヒータ41が所定ピッチで
配置されたものである。The radiant heating means 16 has a plurality of halogen lamp heaters 41 arranged at a predetermined pitch at the hot air outlet 26 of the box 22.
【００２２】これらのハロゲンランプヒータ41は、Ｖ字
形に形成された反射板42の上側に、基板12aの下側面と
対向するように設けられた直管型のランプヒータであ
り、電圧制御によりこれらのハロゲンランプヒータ41か
ら輻射される赤外線エネルギをコントロールできる。These halogen lamp heaters 41 are straight tube type lamp heaters provided on the upper side of a V-shaped reflector 42 so as to face the lower side surface of the substrate 12a. The infrared energy radiated from the halogen lamp heater 41 can be controlled.
【００２３】このように、基板12aの下面側からの加熱
手段として、ハロゲンランプヒータ41による赤外線加熱
と、熱電対25およびヒータ23により温度コントロールさ
れた熱風循環加熱とを併用する。As described above, as the heating means from the lower surface side of the substrate 12a, the infrared heating by the halogen lamp heater 41 and the hot air circulating heating whose temperature is controlled by the thermocouple 25 and the heater 23 are used together.
【００２４】前記部品温度上昇抑制手段15は、ワーク搬
送経路の上側に、基板12aの上側面に沿って流れる冷却
風を供給する冷却風供給部43と、冷却風供給部43と対向
して設置され電子部品冷却後の冷却風を回収する冷却風
回収部44とを配設したものである。The component temperature rise suppressing means 15 is installed above the work transfer path so as to face the cooling air supply section 43 and the cooling air supply section 43 for supplying the cooling air flowing along the upper surface of the substrate 12a. And a cooling air collecting section (44) for collecting the cooling air after cooling the electronic components.
【００２５】冷却風供給部43は、炉体11の上部に供給部
本体45が嵌着され、この供給部本体45の下部からワーク
進行方向と対向する方向に、基板12aの全幅にわたって
設けられた偏平形のまたは複数の冷却風吹出ノズル46が
突設されたものである。The cooling air supply unit 43 has a supply unit main body 45 fitted on the upper part of the furnace body 11, and is provided across the entire width of the substrate 12a from the lower part of the supply unit main body 45 in the direction opposite to the work advancing direction. A flat type or a plurality of cooling air blowing nozzles 46 are provided so as to project.
【００２６】一方、冷却風回収部44は、炉体11の上部に
回収部本体47が嵌着され、この回収部本体47の下部に、
冷却風吹出ノズル46から供給された冷却風を回収する冷
却風回収口48が、冷却風吹出ノズル46に対応して開口さ
れたものである。On the other hand, in the cooling air collecting part 44, a collecting part body 47 is fitted on the upper part of the furnace body 11, and a lower part of the collecting part body 47 is
A cooling air collecting port 48 for collecting the cooling air supplied from the cooling air blowing nozzle 46 is opened corresponding to the cooling air blowing nozzle 46.
【００２７】冷却風回収部44から炉体11上に開口された
排気口51と、冷却風供給部43から炉体11上に開口された
給気口52との間には、冷却風循環系53が設けられてい
る。A cooling air circulation system is provided between an exhaust port 51 opened from the cooling air recovery unit 44 above the furnace body 11 and an air supply port 52 opened from the cooling air supply unit 43 above the furnace body 11. 53 are provided.
【００２８】この冷却風循環系53には、冷却風供給部43
に所定の風量を供給するとともに供給した風量と同風量
を冷却風回収部44から排気させるファン54と、冷却風供
給部43から噴出される冷却風を設定された温度に制御可
能な温調ユニット55とが設けられている。The cooling air circulation system 53 includes a cooling air supply unit 43.
A fan 54 for supplying a predetermined amount of air to the cooling air collecting unit 44 and a fan 54 for exhausting the same amount as the supplied amount of air from the cooling air collecting unit 44, and a temperature control unit capable of controlling the cooling air ejected from the cooling air supply unit 43 to a set temperature. 55 and are provided.
【００２９】このように、基板12aの上側面に搭載され
た電子部品12bの温度上昇を抑制する部品温度上昇抑制
手段15は、基板搬送経路と平行に冷却風を供給し、その
供給側と対向する側より冷却風を回収して排気させるこ
とで、基板搬送経路上に冷却風の移動経路を形成し、こ
の冷却風の移動経路中に搬入された基板上面側の電子部
品12bを冷却する。As described above, the component temperature rise suppressing means 15 for suppressing the temperature rise of the electronic component 12b mounted on the upper side surface of the substrate 12a supplies cooling air in parallel with the substrate transport path and faces the supply side. By collecting and exhausting the cooling air from the cooling side, a movement path of the cooling air is formed on the substrate transport path, and the electronic component 12b on the upper surface side of the substrate carried into the movement path of the cooling air is cooled.
【００３０】図２に示されるように、前記コンベア13
は、基板搬送用の１対の無端チェン56と、これらの無端
チェン56を移動自在に案内する１対のガイドレール57
と、これらのガイドレール57の上面と炉体11の内壁面と
の間に水平に設けられた遮蔽板58とを具備したものであ
る。As shown in FIG. 2, the conveyor 13
Is a pair of endless chains 56 for transferring substrates, and a pair of guide rails 57 for movably guiding these endless chains 56.
And a shield plate 58 horizontally provided between the upper surfaces of the guide rails 57 and the inner wall surface of the furnace body 11.
【００３１】次に、この実施の形態の作用効果を説明す
る。Next, the function and effect of this embodiment will be described.
【００３２】基板12aを下面側から加熱する加熱手段と
しては、電圧制御により赤外線エネルギをコントロール
できるハロゲンランプヒータ41を主たる加熱手段とする
が、このハロゲンランプヒータ41による加熱だけでは、
加熱均一性に欠け、基板12aの下側面に場所による温度
差が生ずるので、熱電対25により通電制御されたヒータ
23を介し温度制御された熱風の循環機構を補助的な加熱
手段として、基板12aの下側リフロー面を均一に加熱
し、基板12aの導電部と電子部品12bのリード部分との間
にあるソルダペーストをリフローする。As the heating means for heating the substrate 12a from the lower surface side, the halogen lamp heater 41 which can control the infrared energy by voltage control is the main heating means.
Since the heating uniformity is poor and a temperature difference occurs depending on the location on the lower surface of the substrate 12a, a heater whose current is controlled by the thermocouple 25 is used.
Using the hot air circulation mechanism whose temperature is controlled via 23 as an auxiliary heating means, the lower reflow surface of the substrate 12a is uniformly heated, and the solder between the conductive portion of the substrate 12a and the lead portion of the electronic component 12b is soldered. Reflow the paste.
【００３３】その際、熱風は、基板12aの上側面以上に
吹上がらないように、下面側で回収する循環対流方式と
し、熱風回収口28から熱風回収通路31、熱風吸込通路32
を経て熱風循環ファン33の吸込口34に吸込む。At this time, the hot air is collected from the lower side of the substrate 12a so that it does not blow up above the upper surface of the substrate 12a.
Through the suction port 34 of the hot air circulation fan 33.
【００３４】この熱風循環ファン33の吐出口38から函体
22内に吐出された風は、熱電対25で検出された温度に基
づいて温調されたヒータ23の加熱作用により所定温度の
熱風となり、多孔状の整流板24により均一化された流れ
となり、基板12aの下側面に接触した後、熱風回収口28
に回収される。From the outlet 38 of this hot air circulation fan 33 to the box
The air discharged into 22 becomes hot air of a predetermined temperature due to the heating action of the heater 23 whose temperature is adjusted based on the temperature detected by the thermocouple 25, and becomes a uniform flow by the porous straightening plate 24. After contacting the lower surface of the substrate 12a, the hot air recovery port 28
Will be collected.
【００３５】一方、基板12aの上面側の冷却手段とし
て、冷却風供給部43の冷却風吹出ノズル46から噴出され
た冷却風は、基板12aの上側面に沿って平行にかつ基板1
2aの進行方向と逆方向に移動し、基板12a上の雰囲気温
度を低減するとともに、基板12a上の電子部品12bと衝突
して、この電子部品12bを強制冷却する。On the other hand, as the cooling means on the upper surface side of the substrate 12a, the cooling air blown from the cooling air blowing nozzle 46 of the cooling air supply unit 43 is parallel to the upper side surface of the substrate 12a and the substrate 1a.
It moves in the direction opposite to the traveling direction of 2a, reduces the ambient temperature on the substrate 12a, collides with the electronic component 12b on the substrate 12a, and forcibly cools the electronic component 12b.
【００３６】この冷却風は、冷却風回収部44の冷却風回
収口48から全量が吸引回収されるので、基板12aより下
側の加熱領域に流れない。Since the entire amount of this cooling air is sucked and collected from the cooling air collecting port 48 of the cooling air collecting portion 44, it does not flow into the heating region below the substrate 12a.
【００３７】このように、部品温度上昇抑制手段15の冷
却風により、基板12aの上側面に搭載された電子部品12b
を強制冷却するとともに、下側のリフロー加熱手段14に
より基板12aの下側面を高温に加熱することで、基板12a
の上側面に位置する電子部品12bの本体部分と、下側面
に位置するリフローはんだ付け部分としてのリード部分
との間に十分な温度差を確保でき、電子部品12bの耐熱
性を損なうことなく、沸点の高い鉛フリーはんだによる
リフローはんだ付けをすることができる。As described above, the cooling air of the component temperature rise suppressing means 15 causes the electronic component 12b mounted on the upper surface of the substrate 12a.
Is forcedly cooled, and the lower surface of the substrate 12a is heated to a high temperature by the reflow heating means 14 on the lower side.
A body portion of the electronic component 12b located on the upper side surface, and a sufficient temperature difference between the lead portion as a reflow soldering portion located on the lower side surface can be secured, without impairing the heat resistance of the electronic component 12b, Reflow soldering with lead-free solder with a high boiling point is possible.
【００３８】その際、部品温度上昇抑制手段15は、冷却
風供給部43と冷却風回収部44との間に、水平に移動する
冷却風の通路を明確に形成でき、冷却風が下側のリフロ
ー加熱手段14側に入り込むことがないので、リフロー加
熱手段14と部品温度上昇抑制手段15との相互干渉を防止
できる。At this time, the component temperature rise suppressing means 15 can clearly form a passage for the cooling air which moves horizontally between the cooling air supply part 43 and the cooling air recovery part 44, and the cooling air is directed downward. Since it does not enter the reflow heating means 14 side, mutual interference between the reflow heating means 14 and the component temperature rise suppressing means 15 can be prevented.
【００３９】また、リフロー加熱手段14は、輻射式加熱
手段16のハロゲンランプヒータ41から輻射された赤外線
により基板12aの下側面を強力に加熱できるとともに、
熱風式加熱手段17で温度コントロールされた熱風により
基板12aの下側面を均一に加熱でき、沸点の高い鉛フリ
ーはんだによるリフローはんだ付けを基板全面で確実に
できる。Further, the reflow heating means 14 can strongly heat the lower surface of the substrate 12a by the infrared rays radiated from the halogen lamp heater 41 of the radiation type heating means 16, and
The lower surface of the substrate 12a can be uniformly heated by the hot air whose temperature is controlled by the hot air heating means 17, and reflow soldering with lead-free solder having a high boiling point can be surely performed on the entire surface of the substrate.
【００４０】その際、熱風式加熱手段17のヒータ23など
は遠赤外線を多く輻射するが、ハロゲンランプヒータ41
は、近赤外線を多く輻射するので、ワーク12に遠赤外線
を吸収しやすい部分と、近赤外線を吸収しやすい部分と
が混在する場合にも対応できる。加えて、熱風からの熱
伝導による加熱方式も併用しているので、ワーク12に混
在する種々の材質に対応できる。At this time, the heater 23 of the hot-air type heating means 17 radiates a lot of far infrared rays, but the halogen lamp heater 41
Since a large amount of near infrared rays are radiated, it is possible to cope with the case where the work 12 has a portion that easily absorbs far infrared rays and a portion that easily absorbs near infrared rays. In addition, since a heating method using heat conduction from hot air is also used, various materials mixed in the work 12 can be handled.
【００４１】さらに、ハロゲンランプヒータ41は、電圧
制御により赤外線エネルギをコントロールしやすく、基
板12aの加熱温度を容易に所定温度に保つことができ
る。Further, the halogen lamp heater 41 can easily control the infrared energy by voltage control, and can easily keep the heating temperature of the substrate 12a at a predetermined temperature.
【００４２】また、図２に示された遮蔽板58により、コ
ンベア13のガイドレール57と炉体11の内壁面との間を塞
いだので、この間での熱風および冷風の相互の移動を防
止して、リフロー加熱手段14と部品温度上昇抑制手段15
との相互干渉を防止できる。Further, since the shield plate 58 shown in FIG. 2 blocks the space between the guide rail 57 of the conveyor 13 and the inner wall surface of the furnace body 11, mutual movement of hot air and cold air between them is prevented. Reflow heating means 14 and component temperature rise suppressing means 15
Mutual interference with can be prevented.
【００４３】なお、基板12aの上側面に沿って流れる冷
却風を供給し排気する冷却風循環系53には、冷却風の温
度をコントロールする温調ユニット55だけでなく、加熱
されたワーク12から発生するフラックスヒュームを回収
するフィルタ機構（図示せず）も設けることが望まし
い。The cooling air circulation system 53 for supplying and exhausting the cooling air flowing along the upper side surface of the substrate 12a is not limited to the temperature control unit 55 for controlling the temperature of the cooling air, but also for the heated work 12. It is also desirable to provide a filter mechanism (not shown) for collecting the generated flux fumes.
【００４４】また、図示された実施の形態では、基板12
aの上面側の冷却手段として基板12aの進行方向と逆方向
に冷却風を流すようにしているが、基板12aの進行方向
と同方向に冷却風を流すようにしても良い。Also, in the illustrated embodiment, the substrate 12
Although the cooling air is made to flow in the direction opposite to the traveling direction of the substrate 12a as the cooling means on the upper surface side of a, the cooling air may be made to flow in the same direction as the traveling direction of the substrate 12a.
【００４５】[0045]
【発明の効果】請求項１記載の発明によれば、部品温度
上昇抑制手段の冷却風により、基板の一側面に搭載され
た電子部品を強制冷却するとともに、リフロー加熱手段
により基板の他側面を高温に加熱することで、基板の一
側面に位置する電子部品の本体部分と他側面に位置する
リフローはんだ付け部分との間に十分な温度差を確保で
き、電子部品の耐熱性を損なうことなく、沸点の高い鉛
フリーはんだによるリフローはんだ付けをすることがで
きる。According to the first aspect of the present invention, the cooling air of the component temperature rise suppressing means forcibly cools the electronic components mounted on one side surface of the substrate and the reflow heating means controls the other side surface of the substrate. By heating to a high temperature, a sufficient temperature difference can be secured between the main body part of the electronic component located on one side of the board and the reflow soldering part located on the other side, without impairing the heat resistance of the electronic component. It is possible to perform reflow soldering with lead-free solder, which has a high boiling point.
【００４６】請求項２記載の発明によれば、輻射式加熱
手段から輻射された赤外線により基板の他側面を強力に
加熱できるとともに、熱風式加熱手段で温度コントロー
ルされた熱風により基板の他側面を均一に加熱でき、沸
点の高い鉛フリーはんだによるリフローはんだ付けを確
実にできる。According to the second aspect of the present invention, the other side surface of the substrate can be strongly heated by the infrared rays radiated from the radiant heating means, and the other side surface of the substrate can be heated by the hot air whose temperature is controlled by the hot air type heating means. Uniform heating is possible, and reflow soldering with lead-free solder with a high boiling point can be reliably performed.
【００４７】請求項３記載の発明によれば、ハロゲンラ
ンプヒータは、電圧制御により赤外線エネルギをコント
ロールしやすく、基板の加熱温度を容易に所定温度に保
つことができる。According to the third aspect of the invention, the halogen lamp heater can easily control the infrared energy by voltage control, and can easily maintain the substrate heating temperature at a predetermined temperature.
【００４８】請求項４記載の発明によれば、冷却風供給
部と冷却風回収部とにより、それらの間に冷却風の通路
を明確に形成でき、リフロー加熱手段と部品温度上昇抑
制手段との相互干渉を防止できる。According to the fourth aspect of the present invention, the cooling air supply portion and the cooling air recovery portion can clearly form the passage of the cooling air between them, and the reflow heating means and the component temperature rise suppressing means can be formed. Mutual interference can be prevented.
【００４９】請求項５記載の発明によれば、遮蔽板によ
りコンベアのガイドレールと炉体の内壁面との間を塞い
だので、この間での相互の熱移動を防止して、リフロー
加熱手段と部品温度上昇抑制手段との相互干渉を防止で
きる。According to the fifth aspect of the present invention, since the guide rail of the conveyor and the inner wall surface of the furnace body are closed by the shield plate, mutual heat transfer between them is prevented, and the reflow heating means is provided. Mutual interference with the component temperature rise suppressing means can be prevented.
【図１】本発明に係るリフローはんだ付け装置の一実施
の形態を示すワーク搬送方向の断面図である。FIG. 1 is a cross-sectional view of a reflow soldering apparatus according to an embodiment of the present invention in a work transfer direction.
【図２】同上はんだ付け装置のワーク搬送方向と直交す
る方向の断面図である。FIG. 2 is a cross-sectional view of the same soldering device in a direction orthogonal to the work transfer direction.
【図３】従来のリフローはんだ付け装置を示す断面図で
ある。FIG. 3 is a sectional view showing a conventional reflow soldering device.
11 炉体 12a 基板 12b 電子部品 13 コンベア 14 リフロー加熱手段 15 部品温度上昇抑制手段 16 輻射式加熱手段 17 熱風式加熱手段 41 ハロゲンランプヒータ 43 冷却風供給部 44 冷却風回収部 56 無端チェン 57 ガイドレール 58 遮蔽板 11 furnace body 12a substrate 12b electronic components 13 conveyor 14 Reflow heating means 15 Parts temperature rise suppression means 16 Radiant heating means 17 Hot air heating means 41 Halogen lamp heater 43 Cooling air supply unit 44 Cooling air collection unit 56 endless chain 57 Guide rail 58 Shield
フロントページの続き (72)発明者 山下 文弘 埼玉県狭山市大字上広瀬591番地11 株式 会社タムラエフエーシステム内 Ｆターム(参考） 5E319 AC01 CC33 CC49 CC58 CC60 CD35 GG03 GG11 Continued front page (72) Inventor Fumihiro Yamashita 11 shares, 591 Kamihirose, Sayama-shi, Saitama Company Tamura FA System F term (reference) 5E319 AC01 CC33 CC49 CC58 CC60 CD35 GG03 GG11
Claims (5)
面を加熱して基板に電子部品をリフローはんだ付けする
リフロー加熱手段と、 基板の一側面に沿って電子部品冷却用の冷却風を生じさ
せる部品温度上昇抑制手段とを具備したことを特徴とす
るリフローはんだ付け装置。1. A reflow heating means for heating the other side of a board having electronic parts mounted on one side to reflow solder the electronic parts to the board, and cooling air for cooling the electronic parts along one side of the board. A reflow soldering device, comprising: a component temperature rise suppressing means to be generated.
と、 温度コントロールされた熱風を基板の他側面を経て循環
させる熱風式加熱手段とを具備したことを特徴とする請
求項１記載のリフローはんだ付け装置。2. The reflow heating means comprises a radiation type heating means for radiating infrared rays to the other side surface of the substrate, and a hot air type heating means for circulating hot air whose temperature is controlled through the other side surface of the substrate. The reflow soldering device according to claim 1, which is characterized in that.
タを備えたことを特徴とする請求項２記載のリフローは
んだ付け装置。3. The reflow soldering device according to claim 2, wherein the radiant heating means includes a halogen lamp heater.
給部と、 冷却風供給部と対向して設置され電子部品冷却後の冷却
風を回収する冷却風回収部とを具備したことを特徴とす
る請求項１乃至３のいずれか記載のリフローはんだ付け
装置。4. The component temperature rise suppressing means is provided with a cooling air supply part for supplying cooling air flowing along one side surface of the substrate, and the cooling air supply part is installed to face the cooling air supply part and collects the cooling air after cooling the electronic parts. The reflow soldering device according to any one of claims 1 to 3, further comprising:
レールと、 これらのガイドレールと炉体の内壁面との間に水平に設
けられた遮蔽板とを具備したことを特徴とする請求項１
乃至４のいずれか記載のリフローはんだ付け装置。5. A furnace body and a conveyer for conveying a substrate in the furnace body, the conveyer comprising a pair of endless chains for conveying the substrate and a pair of guide rails for movably guiding the endless chains. And a shield plate provided horizontally between these guide rails and the inner wall surface of the furnace body.
5. The reflow soldering device according to any one of 4 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001387738A JP4017388B2 (en) | 2001-12-20 | 2001-12-20 | Reflow soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001387738A JP4017388B2 (en) | 2001-12-20 | 2001-12-20 | Reflow soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003188527A true JP2003188527A (en) | 2003-07-04 |
| JP4017388B2 JP4017388B2 (en) | 2007-12-05 |
Family
ID=27596475
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001387738A Expired - Fee Related JP4017388B2 (en) | 2001-12-20 | 2001-12-20 | Reflow soldering equipment |
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| Country | Link |
|---|---|
| JP (1) | JP4017388B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013132673A (en) * | 2011-12-27 | 2013-07-08 | Nihon Superior Co Ltd | Joint material used for joining utilizing near-infrared ray, and joining method |
-
2001
- 2001-12-20 JP JP2001387738A patent/JP4017388B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013132673A (en) * | 2011-12-27 | 2013-07-08 | Nihon Superior Co Ltd | Joint material used for joining utilizing near-infrared ray, and joining method |
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| Publication number | Publication date |
|---|---|
| JP4017388B2 (en) | 2007-12-05 |
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