KR20100012154A - Reflow device - Google Patents

Reflow device Download PDF

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Publication number
KR20100012154A
KR20100012154A KR1020080073384A KR20080073384A KR20100012154A KR 20100012154 A KR20100012154 A KR 20100012154A KR 1020080073384 A KR1020080073384 A KR 1020080073384A KR 20080073384 A KR20080073384 A KR 20080073384A KR 20100012154 A KR20100012154 A KR 20100012154A
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KR
South Korea
Prior art keywords
printed circuit
circuit board
air
infrared
transfer passage
Prior art date
Application number
KR1020080073384A
Other languages
Korean (ko)
Inventor
송태인
황영춘
Original Assignee
주식회사 화이널포스트
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Application filed by 주식회사 화이널포스트 filed Critical 주식회사 화이널포스트
Priority to KR1020080073384A priority Critical patent/KR20100012154A/en
Publication of KR20100012154A publication Critical patent/KR20100012154A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: A reflow apparatus is provided to improve heating efficiency of a printed circuit board, to enhance oxidation prevention and bonding strength of soldering parts, and to reduce electricity consumption. CONSTITUTION: A reflow apparatus(10) comprises a bottom body(11) and a top body(12) which is connected to the top of the bottom body with a lifter. A printed circuit board feed path(15) in which printed circuit boards are transferred through a conveyor(16) is formed between the top and bottom bodies. The printed circuit board feed path includes a pre-heating zone in which top infrared heater units(20) and bottom infrared heater units(21) are arranged along the printed circuit board feed path, a reflow zone in which a top blow heater unit(30) and a bottom blow heater unit(31) are installed to face each other, and a cooling zone in which a cooling unit(19) for cooling a printed circuit board in which electronic components are soldered is installed.

Description

Reflow Device {REFLOW DEVICE}

The present invention relates to a reflow apparatus, and more particularly, to a reflow apparatus for soldering an electronic component to a printed circuit board by applying heat to a printed circuit board on which the electronic component is mounted to melt the solder.

Surface Mounted Technology (SMT) is a technology for mounting and soldering surface mounted electronic components to the surface of a printed circuit board (PCB). Surface-mount technology has the advantage that the distance between the electronic components can be compact, the both sides of the substrate can be used, and the assembly of the printed circuit board is easy to automate.

The surface mounting process of soldering electronic components to a printed circuit board using surface mounting technology is made of various processes, and a device used in each surface mounting process is called a surface mount device (SMD). The surface mounting apparatus includes a loader for supplying a printed circuit board, a screen printer for applying solder cream mixed with solder and an adhesive to a printed circuit board, and a screen printer for mounting electronic components on a printed circuit board. Mounters, soldering devices for soldering electronic components to printed circuit boards, and unloaders for loading printed circuit boards on which electronic components are soldered. Among these, a reflow device is typical as a soldering device. The reflow apparatus solders the electronic component to the printed circuit board by heating the transfer of the printed circuit board on which the electronic component is mounted to the conveyor and melting the solder applied to the printed circuit board.

The reflow apparatus has a pre-heating zone, a reflow zone, and a cooling zone formed along a printed circuit board transfer passage through which the printed circuit board is transferred. The pre-heating zone and the reflow zone are provided with a heater unit for applying heat to melt the solder applied to the printed circuit board, and the cooling zone is provided with a cooling unit for cooling the heated printed circuit board. As a heater unit used in a reflow apparatus, a convection method for heating air and injecting heated air onto a printed circuit board is widely used.

However, in the convection method, when the hot air is sprayed onto the printed circuit board, the electronic component mounted on the printed circuit board may be pushed out by the hot air to leave the home position, and rapid heating may be difficult. In addition, the convection method consumes a lot of power to generate hot air, and requires a large amount of nitrogen (N 2 ) gas to prevent oxidation of the solder and to increase the soldering strength, and thus, maintenance costs are high.

The present invention is to solve the above problems, by using infrared rays to heat the printed circuit board, to reduce the power consumption, to suppress the use of nitrogen (N 2 ) gas, the structure is simple and reduced in size The purpose is to provide a reflow apparatus that can be.

The reflow apparatus according to the present invention for achieving the above object is disposed in the printed circuit board transfer passage for heating the printed circuit board transferred along the printed circuit board transfer passage, the transfer is carried along the printed circuit board transfer passage An infrared heater unit having an infrared emitter for emitting infrared rays to a printed circuit board, and a filter glass disposed between the infrared emitter and a conveyor to filter infrared rays emitted from the infrared emitter to emit infrared rays of a specific wavelength to the printed circuit board. It is characterized by including.

In the present invention, the infrared radiator may include a ceramic base and a heater coupled to the ceramic base to heat the ceramic base such that the ceramic base emits infrared rays.

In the present invention, the infrared heater unit may be replaced by the filter glass so as to change the wavelength of the infrared radiation emitted to the printed circuit board conveyed along the printed circuit board transfer passage.

In the present invention, a plurality of infrared radiators may be disposed in a direction crossing the printed circuit board transfer passage, and the filter glass may extend to a length capable of covering all of the plurality of infrared radiators.

In the present invention, the infrared heater unit is along the printed circuit board transfer path and the upper infrared heater unit disposed on the upper portion of the printed circuit board transfer passage for heating the upper surface of the printed circuit board transferred along the printed circuit board transfer passage In order to heat the lower surface of the printed circuit board to be transferred may be divided into a lower infrared heater unit disposed under the printed circuit board transfer passage.

In the present invention, the distance between the upper filter glass of the upper infrared heater unit and the upper surface of the printed circuit board conveyed along the printed circuit board transfer passage is greater than the distance between the lower filter glass of the lower infrared heater unit and the lower surface of the printed circuit board. Can be small.

The reflow apparatus according to the present invention is disposed in a printed circuit board transfer passage for heating a printed circuit board, and includes an air heating heater for heating air, and air heated by the air heating heater to the printed circuit board transfer passage. The apparatus may further include a hot air heater unit having a forced blower and an air circulation unit for circulating air between the air heating heater and the printed circuit board transfer passage.

In the present invention, the air circulation unit comprises a heating circuit in which an air heating heater is located, a blowing chamber in which a blower is located to blow air heated in the heating chamber connected to the heating chamber, and air blown by the blower. The distribution chamber connected to the blower chamber to spread on the substrate movement path, the plurality of nozzles connected to the distribution chamber to spray the air from the distribution chamber to the printed circuit board transported along the printed circuit board transfer path, and the air heated the printed circuit board. A suction port may be provided to connect the heating chamber and the printed circuit board transfer passage to recover the heating chamber.

In the present invention, the heating chamber is disposed between the blowing chamber and the distribution chamber, and a heating air inlet for connecting the blowing chamber and the heating chamber is formed in the middle of the blowing chamber, and a plurality of connecting the blowing chamber and the distribution chamber are provided on the side of the blowing chamber. The through hole may be formed.

In the present invention, the air circulation unit is arranged to be spaced apart from each other along the printed circuit board transfer passage between the distribution chamber and the printed circuit board transfer passage so as to cover a portion of the opening and the opening connecting the distribution chamber and the printed circuit board transfer passage. Further comprising a plurality of guide ducts, the plurality of nozzles may be formed to extend in a direction crossing the printed circuit board transfer passage between each of the plurality of guide ducts.

In the present invention, the plurality of guide ducts are a recovery air inlet for recovering air heated in the printed circuit board conveyed along the printed circuit board conveying passage, and a direction connected to the recovered air inlet and crossing the printed circuit board conveying passage. And a recovery air flow path connected to the recovery air flow path for flowing out the air flowing along the recovery air flow path toward the suction port.

In the present invention, the air circulation unit further includes an intake air guide member disposed to be spaced apart from the plurality of recovery air outlets so as to divert the flow direction of the air flowing out of the plurality of recovery air outlets formed in the plurality of guide ducts toward the inlet. can do.

In the present invention, the hot air heater unit is an upper hot air heater unit disposed above the printed circuit board transfer passage for heating the upper surface of the printed circuit board transferred along the printed circuit board transfer passage, along the printed circuit board transfer passage It is divided into a lower hot air heater unit disposed under the printed circuit board transfer passage to heat the lower surface of the printed circuit board, and between the upper hot wind heater unit and the upper surface of the printed circuit board transferred along the printed circuit board transfer passage. The interval may be smaller than the interval between the lower hot air heater unit and the lower surface of the printed circuit board to be transferred along the printed circuit board transfer passage.

The reflow apparatus according to the present invention heats the printed circuit board by radiating an infrared ray of a suitable wavelength to the printed circuit board, thereby improving the heating efficiency of the printed circuit board, preventing oxidation of the soldered portion and increasing the adhesive strength. Therefore, the power consumption can be greatly reduced. In addition, since it is not necessary to reduce the use of nitrogen gas or to prevent the use of nitrogen gas for oxidation, there is an effect that the maintenance cost is low, the structure is simple, the size can be simplified and the size can be reduced.

Hereinafter, a reflow apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3, the reflow apparatus 10 according to an embodiment of the present invention is coupled to the upper and lower portions of the lower body 11 by the lower body 11 and the lifter 13 to be opened and closed. Upper body 12. A printed circuit board transfer path 15 through which the printed circuit board 14 is transferred is formed between the lower body 11 and the upper body 12, and the printed circuit board 14 has a printed circuit board 14. The conveyor 16 for conveying () is installed to be traveling. The conveyor 16 is composed of a pair of chains 17 and 18 spaced apart from each other to support the printed circuit board 14 at both ends. In the present invention, the conveyor 16 is not limited to this configuration, and the printed circuit board 14 has its upper surface 14a exposed to the upper body 12 and the lower surface 14b facing the lower body 11. It can be changed to another structure that can be transferred to a state.

As shown in FIGS. 1 and 2, a pre-heat for preheating the printed circuit board 14 to which the solder is applied along the printed circuit board transfer path 15 between the lower body 11 and the upper body 12. -Pre-Heating Zone (P-Zone), Reflow Zone (R-Zone) for heating the printed circuit board 14 above the melting point of the solder, and heated printed circuit board 14 A cooling zone (C-Zone) for cooling is formed. The pre-heating zone (P-Zone), the reflow zone (R-Zone), and the cooling zone (C-Zone) are arranged in order from upstream to downstream of the printed circuit board transfer passage 15.

A plurality of upper infrared heater units are heated in the pre-heating zone (P-Zone) to a high temperature (eg, about 180 ° C.) below the melting point of the solder to preheat the printed circuit board 14 transported by the conveyor 16. 20 and a plurality of lower infrared heater units 21 are disposed along the printed circuit board transfer passage 15. In the reflow zone (R-Zone), the printed circuit board 14 is placed at a high temperature corresponding to the melting point of the solder to solder the electronic components mounted on the upper and lower surfaces 14a and 14b of the printed circuit board 14. , A plurality of upper hot air heater units 30 and a plurality of lower hot air heater units 31, which are heated to about 230 ° C., are disposed along the printed circuit board transfer passage 15. The preheating of the printed circuit board 14 by arranging a pre-heating zone P-Zone upstream of the reflow zone R-Zone is caused when the printed circuit board 14 is suddenly heated to a high temperature. This is to prevent heat shock. The cooling zone C-Zone is provided with a cooling unit 19 for cooling the printed circuit board 14 to which the electronic components are soldered.

As shown in FIG. 2, the plurality of lower infrared heater units 21 include a plurality of infrared emitters 22 arranged in a line in the vertical direction of the printed circuit board transfer path 15, and the plurality of upper infrared heaters. The unit 20 also has the same structure as the plurality of lower infrared heater units 21. The plurality of lower infrared heater units 21 and the plurality of upper infrared heater units 20 are disposed up and down to be symmetrical with each other. As shown in FIGS. 4 and 5, the upper infrared heater unit 20 includes a plurality of infrared emitters 22 and one upper filter glass 25 for emitting infrared rays, and a lower infrared heater unit 21. Includes a plurality of infrared emitters 22 and one lower filter glass 26 that emit infrared light.

As shown in FIG. 4, the infrared radiator 22 of the upper infrared heater unit 20 includes a ceramic plate 23 having a rectangular plate shape and a heating wire 24 spirally coupled to one surface of the ceramic base 23. do. The infrared radiator 22 of the lower infrared heater unit 21 also has the same structure as the infrared radiator 22 of the upper infrared heater unit 20. The heating wire 24 receives power and generates heat. When the heating wire 24 generates heat, the ceramic base 23 is heated to emit infrared rays. The plurality of infrared emitters 22 are coupled in a row to the fixed plate 27, and a temperature sensor 28 for sensing a temperature is installed between two infrared emitters 22 disposed in the center of the fixed plate 27. . The reflow apparatus 10 according to the present invention senses the temperature from the temperature sensor 28 and adjusts the intensity of the power applied to the heating wire 24, thereby passing through the pre-heating zone (P-Zone). The heating temperature for (14) can be controlled. In the present invention, the ceramic base 23 may be changed to an infrared radiating object other than ceramic emitting infrared rays when heated, and the heating wire 24 may be changed to another type of heater capable of heating the infrared emitting material. Can be.

As shown in FIG. 5, the upper infrared heater unit 20 includes an upper filter glass 25 for filtering infrared rays emitted from the plurality of infrared emitters 22 together with the plurality of infrared emitters 22. The upper infrared heater unit 20 is disposed between the plurality of infrared ray radiators 22 and the printed circuit board transfer passage 15 to emit infrared rays of a specific wavelength to the printed circuit board transfer passage 15. The lower infrared heater unit 21 includes a lower filter glass 26 for filtering infrared rays emitted from the plurality of infrared emitters 22 together with the plurality of infrared emitters 22. The lower filter glass 26 is disposed between the plurality of infrared emitters 22 and the printed circuit board transfer passage 15.

The upper filter glass 25 and the lower filter glass 26 filter infrared rays emitted from the infrared emitter 22 so that infrared rays of a specific wavelength are emitted to the printed circuit board 14. The upper infrared heater unit 20 and the lower infrared heater unit 21 are each upper filter glass 25 and lower filter glass 26 so as to change the wavelength of the infrared radiation emitted according to the type of the printed circuit board 14. Is installed to be replaced. Since the wavelength of infrared rays suitable for heating may vary according to the type of the printed circuit board 14, when the type of the printed circuit board 14 is changed, the upper filter glass 25 and the lower filter glass 26 may have different filtering characteristics. By appropriate replacement, the heating efficiency of the printed circuit board 14 can be improved. The wavelength of the infrared rays emitted to the printed circuit board 14 may be adjusted to an appropriate wavelength selected from 1 μm to 100 μm according to the type of the printed circuit board 14.

The upper filter glass 25 and the lower filter glass 26 are provided in each of the upper infrared heater unit 20 and the lower infrared heater unit 21 to facilitate replacement and installation. Therefore, the upper filter glass 25 and the lower filter glass 26 may cover the printed circuit board transfer passage so as to cover both the infrared radiators 22 of each of the upper infrared heater unit 20 and the lower infrared heater unit 21. It consists of the shape extended in the vertical direction of (15). The size and number of infrared emitters 22, the thickness and type of filter glass 25 and 26, and the distance between the infrared emitter 22 and filter glass 25 and 26, such as the upper infrared heater unit 20 and the lower part. The structure of each of the infrared heater units 21 is the same.

In the present invention, the arrangement direction of the infrared radiators 22 of each of the upper infrared heater unit 20 or the lower infrared heater unit 21 is not limited to the vertical direction of the printed circuit board transfer passage 15. That is, the direction in which the infrared emitters 22 are disposed may be perpendicular to the printed circuit board transfer path 15 or may be oblique as long as it crosses the printed circuit board transfer path 15. An extension direction of the upper filter glass 25 or the lower filter glass 26 may also be changed in various directions crossing the printed circuit board transfer path 15 according to the arrangement direction of the infrared emitters 22.

As shown in FIG. 5, it is advantageous to arrange the upper infrared heater unit 20 closer to the printed circuit board 14 than the lower infrared heater unit 21 to improve the soldering state of the printed circuit board 14. That is, the distance A between the upper filter glass 25 and the upper surface 14a of the printed circuit board 14 is the distance B between the lower filter glass 26 and the lower surface 14b of the printed circuit board 14. It is possible to fuse the solder applied to the printed circuit board 14 to the printed circuit board 14 more stably and smoothly. Typically, more electronic components are mounted on the upper surface 14a than the lower surface 14b of the printed circuit board 14, and when the solder is melted under heat, the upper surface of the printed circuit board 14 flows downward by gravity. It is advantageous for soldering quality that 14a is heated more than lower surface 14b. For example, the distance A between the upper filter glass 25 and the upper surface 14a of the printed circuit board 14 is 45 mm, and the lower filter glass 26 and the lower surface 14b of the printed circuit board 14 are 45 mm. The distance B between them can be made into 55 mm.

As shown in Figure 6, the reflow zone (R-Zone) is installed so that the upper hot air heater unit 30 and the lower hot air heater unit 31 face each other. The upper hot air heater unit 30 and the lower hot air heater unit 31 heat the air and blow the heated air to the printed circuit board 14 to heat the printed circuit board 14. same. In order to improve the soldering state of the printed circuit board 14, the upper hot air heater unit 30 may be located closer to the printed circuit board 14 than the lower hot air heater unit 31. Each of the upper hot air heater unit 30 and the lower hot air heater unit 31 includes an air heating heater 32 for heating air, a blower 33 for forcibly blowing the heated air to the printed circuit board 14, And an air circulation unit 36 for circulating air injected into the printed circuit board 14.

As shown in FIGS. 6 and 7, the air circulation unit 36 includes a heating chamber 37 in which the air heating heater 32 is located, and a blowing chamber in which the blowing fan 34 of the blower device 33 is located. 38) and evenly spraying the air in the distribution chamber 39, the distribution chamber 39 for spreading the air blown from the blowing chamber 38 to the printed circuit board movement path 15 evenly to the printed circuit board 14 It has a plurality of nozzles 40 for. The heating chamber 37 is connected to the printed circuit board transfer passage 15 through a pair of suction ports 41 formed in a pair of shielding plates 48 for sealing both left and right sides of the distribution chamber 39. The heating chamber 37 is located between the blowing chamber 38 and the distribution chamber 39. The air blowing chamber 38 is connected to the heating chamber 37 through a heating air inlet 42 formed in the middle of the air blowing chamber 38, and provides a plurality of through holes 43 formed at both front and rear sides of the air blowing chamber 38. It is connected to the distribution chamber 39 through. The blower chamber 38 is provided with a pair of air distribution members 44 for distributing and guiding air introduced through the heated air inlet 42 to both front and rear sides of the blower chamber 38.

On both front and rear sides of the distribution chamber 39, the upper inclined guide member 45, the plurality of guide ribs 46 coupled to the upper inclined guide member 45, and the lower ends coupled to the lower ends of the plurality of guide ribs 46. The inclined guide member 47 is located. The upper inclined guide member 45 guides the air exiting the blowing chamber 38 through the plurality of through holes 43 to the distribution chamber 39, and the plurality of guide ribs 46 guides the plurality of through holes 43. Guide the air out through the plurality of nozzles (40). The lower inclined guide member 47 guides the air flowing along the plurality of guide ribs 46 toward the center of the distribution chamber 39.

As shown in FIGS. 6 to 8, the distribution chamber 39 has a printed circuit board transfer passage (see FIG. 10) through an opening 49 (see FIG. 10) formed between the distribution chamber 39 and the printed circuit board transfer passage 15. 15). In the opening 49, a plurality of guide ducts 50 extending in the vertical direction of the printed circuit board transfer passage 15 are disposed along the printed circuit board transfer passage 15. Each of the guide ducts 50 covers a portion of the opening 49 and extends in a vertical direction of the printed circuit board transfer passage 15 between each of the plurality of guide ducts 50. ) Is formed. The plurality of guide ducts 50 serve to form the plurality of nozzles 40 and to recover the air injected through the guides to the inlet 41. In order to prevent the air injected through the plurality of nozzles 40 from escaping to the left and right ends of each of the plurality of guide ducts 50, a leakage preventing member is disposed between the left and right ends of the adjacent guide ducts 50. 59) is located. The plurality of leak preventing members 59 prevent the air injected through the plurality of nozzles 40 from leaking to the left and right ends of the plurality of guide ducts 50 so that the sprayed air is directed toward the printed circuit board transfer path 15. Be focused.

In the center of the distribution chamber 39, between the air flowing through the plurality of through holes 43 formed in front of the blower chamber 38 and the air flowing through the plurality of through holes 43 formed in the rear of the blower chamber 38. Partition plate 54 is located to reduce the collision of. Air flowing through the plurality of through-holes 43 formed in front of the blowing chamber 38 is injected through the plurality of nozzles 40 positioned in front of the partition plate 54, and behind the blowing chamber 38. Air flowing through the formed plurality of through holes 43 is injected through the plurality of nozzles 40 positioned behind the partition plate 54. The partition plate 54 is formed with a plurality of through holes 55 connecting the front and rear spaces of the distribution chamber 39 partitioned around the partition plate 54.

8 and 9, the plurality of guide ducts 50 are guide ducts 50 for recovering the air injected into the printed circuit board transfer passage 15 through the nozzle 40 formed therebetween. Left and right sides of the recovery air flow path 51, the recovery air flow path 51 formed between the recovery air flow path 51 and the printed circuit board transfer path 15 extending in the longitudinal direction of It has a pair of recovery air outlet 53 formed at the end. When the blower 33 is operated, the air injected through the nozzle 40 to heat the printed circuit board 14 is sucked into the pair of recovery air inlets 52 and flows to the left and right sides of the recovery air flow path 51. After that, it flows out through the pair of recovered air outlets 53.

A pair of intake air guide members 56 are disposed at left and right ends of the guide duct 50 to guide the air flowing out through the pair of recovery air outlets 53 to the pair of intake ports 41. As shown in FIG. 7, the pair of intake air guide members 56 are disposed to be somewhat spaced apart from left and right ends of the plurality of guide ducts 50. An intake air flow path 58 through which air flows is formed between the left and right ends of each of the pair of intake air guide members 56 and the plurality of guide ducts 50. The air flowing out through the recovery air outlets 53 of the plurality of guide ducts 50 flows toward the pair of inlets 41 along the pair of intake air passages 58 and is sucked into the heating chamber 37. . The intake air guide member 56 has a plurality of suction holes 57 connected to the printed circuit board transfer passage 15. A part of the air that is injected into the printed circuit board transfer passage 15 and heats the printed circuit board 14 is sucked through the plurality of suction holes 57 and flows into the heating chamber 37.

In the present invention, the arrangement direction of the guide duct 50 is not limited to the vertical direction of the printed circuit board transfer passage 15, but the printed circuit board transfer passage 15 such as the oblique direction with the printed circuit board transfer passage 15. It can be changed in various directions across. Likewise, the extending direction of the plurality of nozzles 40 may also be changed in various directions crossing the printed circuit board transfer path 15.

Hereinafter, with reference to the accompanying drawings will be described the operation of the reflow apparatus 10 according to an embodiment of the present invention.

As shown in FIG. 1, when the conveyor 16 is operated with a solder coated and an electronic component mounted thereon, the printed circuit board 14 is connected to the printed circuit board. It is transferred to the pre-heating zone (P-Zone) along the transfer passage (15). As shown in FIG. 5, in the pre-heating zone P-Zone, the upper infrared heater unit 20 and the lower infrared heater unit 21 are the upper surface 14a and the lower surface 14b of the printed circuit board 14. Infrared radiation is used to preheat the printed circuit board 14 to a high temperature (eg, 180 ° C.) below the melting point of the solder. At this time, the printed circuit board 14 is closer to the upper infrared heater unit 20 so that the upper surface 14a is heated more than the lower surface 14b.

The preheated printed circuit board 14 while passing through the pre-heating zone P-Zone is continuously transferred to the reflow zone R-Zone. As shown in FIG. 6, in the pre-heating zone P-Zone, the upper hot air heater unit 30 and the lower hot air heater unit 31 spray hot air to the printed circuit board 14 to print the printed circuit board 14. ) Is heated to a high temperature (eg, about 230 ° C.) corresponding to the melting point of the solder. At this time, as the solder applied to the printed circuit board 14 is melted, the electronic component is soldered to the printed circuit board 14. The hot air injected from the pre-heating zone (P-Zone) into the printed circuit board transfer passage 15 is heated most of the printed circuit board 14, and most of it does not escape to the outside. Or it is sucked into the lower hot air heater unit 31 is reheated and then sprayed again.

The circulation of air in the pre-heating zone P-Zone is shown in FIG. 10. When the blower 33 is operated, the air heated by the air heater 32 in the heating chamber 37 flows into the blower chamber 38 through the heated air inlet 42 in the center of the blower chamber 38. Air introduced into the blowing chamber 38 flows to the distribution chamber 39 through a plurality of through holes 43 formed on both front and rear sides of the blowing chamber 38. At this time, the upper inclined guide member 45, the guide rib 46, and the lower inclined guide member 47 guide air introduced into the distribution chamber 39 toward the plurality of nozzles 40. Air introduced into the distribution chamber 39 is injected into the printed circuit board transfer passage 15 through the plurality of nozzles 40.

Air injected into the printed circuit board transfer path 15 impinges on the printed circuit board 14 and then flows into a pair of recovered air inlets 52 formed in each of the plurality of guide ducts 50. The air sucked into the plurality of guide ducts 50 flows out through a pair of recovery air outlets 53 formed at both left and right ends of each of the plurality of guide ducts 50. The air flowing out through the plurality of recovery air outlets 53 strikes the pair of intake air guide members 56 and the flow direction thereof is bent toward the pair of intake ports 41 to be sucked into the heating chamber 37. The air sucked into the heating chamber 37 is heated again by the air heating heater 32 and then passes through the blower chamber 38 and the distribution chamber 39 through the plurality of nozzles 40 again to the printed circuit board transfer passage ( 15) is sprayed. As the air in the printed circuit board transfer passage 15 circulates, the temperature variation hardly occurs, and the molten state of the solder applied to the printed circuit board 14 to be transferred can be maintained uniformly.

On the other hand, when the type of the printed circuit board 14 is changed, by replacing the upper filter glass 25 and the lower filter glass 26 with one capable of emitting infrared rays of a wavelength suitable for heating the new printed circuit board 14. The heating efficiency of the printed circuit board 14 can be improved.

In the above description, the infrared heater units 20 and 21 are installed in the pre-heating zone P-Zone, and the hot air heater units 30 and 31 are installed in the reflow zone R-Zone. The invention is not limited to this configuration. That is, the infrared heater units 20 and 21 may be installed in both the pre-heating zone P-zone and the reflow zone R-Zone, and the infrared heater unit (only in the reflow zone R-Zone). 20) 21 may be installed.

Since the reflow apparatus 10 according to the present invention heats the printed circuit board 14 by emitting infrared rays of an appropriate wavelength according to the printed circuit board 14, the heating efficiency of the printed circuit board 14 may be improved. It can prevent the oxidation of soldering part and increase the adhesive strength. In addition, it is possible to reduce the use of nitrogen gas to prevent oxidation, or to reduce the maintenance cost and simplify the structure by not using nitrogen gas. In addition, power consumption can be greatly reduced, and the overall size can be reduced.

The present invention described above is not limited to the configuration and operation as shown and described. That is, the present invention is capable of various changes and modifications within the spirit and scope of the appended claims.

1 is a side view schematically showing a reflow apparatus according to an embodiment of the present invention.

2 is a plan view showing a lower body of the reflow apparatus according to an embodiment of the present invention.

Figure 3 is a front view schematically showing a reflow apparatus according to an embodiment of the present invention.

Figure 4 is a plan view showing a part of the upper infrared heater unit of the reflow apparatus according to an embodiment of the present invention.

5 is a side view schematically showing an upper infrared heater unit and a lower infrared heater unit of the reflow apparatus according to an embodiment of the present invention.

6 is a side view illustrating the upper hot air heater unit and the lower hot air heater unit of the reflow apparatus according to an embodiment of the present invention.

7 is an exploded perspective view of the upper hot air heater unit of the reflow apparatus according to an embodiment of the present invention.

8 is an exploded bottom perspective view of the upper hot air heater unit of the reflow apparatus according to an embodiment of the present invention.

9 is a perspective view showing a guide duct of the reflow apparatus according to an embodiment of the present invention.

10 is a perspective view illustrating an air circulation structure of the upper hot air heater unit of the reflow apparatus according to an embodiment of the present invention.

♣ Explanation of symbols for the main parts of the drawing ♣

10: reflow device 14: printed circuit board

15: transfer path of printed circuit board 16: conveyor

19: cooling unit 20, 21: upper, lower infrared heater unit

22: infrared emitter 23: ceramic base

24: heating wire 25, 26: upper, lower filter glass

30, 31: upper, lower hot air heater unit 32: air heating heater

33: blower 36: air circulation unit

37: heating chamber 38: ventilation chamber

39: distribution chamber 40: nozzle

41: inlet 42: heating air inlet

50: guide duct 54: partition plate

56: intake air guide member

Claims (13)

A reflow apparatus for soldering an electronic component to a printed circuit board by heating a solder-coated printed circuit board while melting the solder by transferring the printed circuit board to a conveyor along a printed circuit board transfer path. An infrared emitter disposed in the printed circuit board conveying path for heating the printed circuit board conveyed along the printed circuit board conveying path, and emitting infrared rays to the printed circuit board conveyed along the printed circuit board conveying path; And an infrared heater unit having a filter glass disposed between the infrared radiator and the conveyor to filter infrared rays emitted from the infrared radiator to radiate infrared rays of a specific wavelength to the printed circuit board. Low device. The method of claim 1, And the infrared radiator comprises a ceramic base and a heater coupled to the ceramic base to heat the ceramic base such that the ceramic base emits infrared light. The method of claim 1, And said filter glass is replaceable so that said infrared heater unit can change the wavelength of infrared rays radiated to said printed circuit board conveyed along said printed circuit board conveyance passage. The method of claim 1, And a plurality of infrared radiators are disposed in a direction crossing the printed circuit board transfer passage, and the filter glass extends to a length capable of covering all of the plurality of infrared radiators. The method of claim 1, The infrared heater unit includes an upper infrared heater unit disposed above the printed circuit board conveying path and the printed circuit board conveying path to heat the upper surface of the printed circuit board conveyed along the printed circuit board conveying path. And a lower infrared heater unit disposed below the printed circuit board transfer path to heat the lower surface of the printed circuit board being transferred. The method of claim 5, wherein The distance between the upper filter glass of the upper infrared heater unit and the upper surface of the printed circuit board conveyed along the printed circuit board transfer path is greater than the distance between the lower filter glass of the lower infrared heater unit and the lower surface of the printed circuit board. Reflow apparatus, characterized in that small. The method of claim 1, An air heater disposed in the printed circuit board transfer passage for heating the printed circuit board, and a blower for forcibly blowing air heated by the air heating heater to the printed circuit board transfer passage; And a hot air heater unit having an air circulation unit for circulating air between the air heating heater and the printed circuit board transfer passage. The method of claim 7, wherein The air circulation unit includes a heating chamber in which the air heating heater is located, a blowing chamber in which the blower is located to blow air heated in the heating chamber and connected to the heating chamber, and air blown by the blower. A distribution chamber connected to the blower chamber for spreading on a printed circuit board movement path, a plurality of nozzles connected to the distribution chamber for spraying air from the distribution chamber to the printed circuit board conveyed along the printed circuit board transport passage; And a suction port connecting the heating chamber and the printed circuit board transfer passage to recover the air heated on the printed circuit board to the heating chamber. The method of claim 8, The heating chamber is disposed between the blowing chamber and the distribution chamber, and a heating air inlet for connecting the blowing chamber and the heating chamber is formed in the middle of the blowing chamber, and the blowing chamber and the distribution chamber are located at the side of the blowing chamber. A plurality of through-holes are formed to connect the reflow apparatus. The method of claim 8, The air circulation unit is spaced apart from each other along the printed circuit board transfer passage between the distribution chamber and the printed circuit board transfer passage so as to cover an opening connecting the distribution chamber and the printed circuit board transfer passage. And a plurality of guide ducts disposed, wherein the plurality of nozzles are formed to extend in a direction crossing the printed circuit board transfer passage between each of the plurality of guide ducts. The method of claim 10, The plurality of guide ducts may include a recovery air inlet for recovering air heated in the printed circuit board, which is transported along the printed circuit board transport path, and connected to the recovery air inlet and cross the printed circuit board transport path. And a recovery air outlet connected to the recovery air flow path for flowing out the air flowing along the recovery air flow path toward the intake port. The method of claim 11, The air circulation unit further includes an intake air guide member disposed to be spaced apart from the plurality of recovery air outlets in order to divert the flow direction of the air flowing out of the plurality of recovery air outlets formed in the plurality of guide ducts toward the intake port. Reflow apparatus characterized in that. The method of claim 7, wherein The hot air heater unit may include an upper hot air heater unit disposed on an upper portion of the printed circuit board transfer passage to heat an upper surface of the printed circuit board transferred along the printed circuit board transfer passage, and the printed circuit board transfer passage. The printed circuit is divided into a lower hot air heater unit disposed below the printed circuit board transfer passage to heat the lower surface of the printed circuit board, and is transported along the upper hot wind heater unit and the printed circuit board transfer passage. The interval between the upper surface of the substrate is smaller than the interval between the lower hot air heater unit and the lower surface of the printed circuit board conveyed along the printed circuit board transfer passage.
KR1020080073384A 2008-07-28 2008-07-28 Reflow device KR20100012154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080073384A KR20100012154A (en) 2008-07-28 2008-07-28 Reflow device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080073384A KR20100012154A (en) 2008-07-28 2008-07-28 Reflow device

Publications (1)

Publication Number Publication Date
KR20100012154A true KR20100012154A (en) 2010-02-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113333890A (en) * 2021-05-31 2021-09-03 郑晓静 PCB circuit board pre-welding device and method and circuit board welding equipment
CN114347681A (en) * 2022-01-28 2022-04-15 天津长荣科技集团股份有限公司 Method for transferring offset printing product to gravure printing
CN115835527A (en) * 2022-12-26 2023-03-21 苏州易启康电子科技有限公司 Circuit board SMT process and equipment thereof
CN116213871A (en) * 2023-03-03 2023-06-06 北京铁科世纪科技有限公司 Hot air type reflow soldering device and method for SMT (surface mounted technology) patch

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113333890A (en) * 2021-05-31 2021-09-03 郑晓静 PCB circuit board pre-welding device and method and circuit board welding equipment
CN114347681A (en) * 2022-01-28 2022-04-15 天津长荣科技集团股份有限公司 Method for transferring offset printing product to gravure printing
CN115835527A (en) * 2022-12-26 2023-03-21 苏州易启康电子科技有限公司 Circuit board SMT process and equipment thereof
CN115835527B (en) * 2022-12-26 2023-11-07 苏州易启康电子科技有限公司 SMT (surface mounting technology) technology and equipment for circuit board
CN116213871A (en) * 2023-03-03 2023-06-06 北京铁科世纪科技有限公司 Hot air type reflow soldering device and method for SMT (surface mounted technology) patch
CN116213871B (en) * 2023-03-03 2023-08-25 北京铁科世纪科技有限公司 Hot air type reflow soldering device and method for SMT (surface mounted technology) patch

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