JP2003179396A - Board support method, board support device, and component mounting unit - Google Patents
Board support method, board support device, and component mounting unitInfo
- Publication number
- JP2003179396A JP2003179396A JP2001375963A JP2001375963A JP2003179396A JP 2003179396 A JP2003179396 A JP 2003179396A JP 2001375963 A JP2001375963 A JP 2001375963A JP 2001375963 A JP2001375963 A JP 2001375963A JP 2003179396 A JP2003179396 A JP 2003179396A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- supporting
- circuit board
- board
- rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板を支持する基
板支持方法及び基板支持装置並びに部品実装装置に関
し、特に、部品実装時に発生し易い基板の振動を抑制す
る技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate supporting method for supporting a substrate, a substrate supporting device, and a component mounting device, and more particularly to a technique for suppressing vibration of the substrate which tends to occur during component mounting.
【０００２】[0002]
【従来の技術】一般に、表面実装用の基板の多くは、ソ
ルダーペーストの印刷工程、接着剤の塗布工程、電子部
品の装着工程、加熱リフロー工程等の複数の工程を経て
商品化される。これらの工程では、印刷機のスキージや
塗布ノズル、或いは電子部品吸着ノズルで回路基板を上
方から押し付ける際に、回路基板が下方に撓むようにな
る。このため、回路基板を下方から支持することによっ
て回路基板の撓みを抑える技術が開発されている。2. Description of the Related Art In general, many surface mounting substrates are commercialized through a plurality of processes such as a solder paste printing process, an adhesive applying process, an electronic component mounting process, and a heat reflow process. In these steps, the circuit board bends downward when the circuit board is pressed from above by the squeegee of the printing machine, the coating nozzle, or the electronic component suction nozzle. Therefore, a technique has been developed for suppressing the bending of the circuit board by supporting the circuit board from below.
【０００３】また、近年、電子部品を回路基板に実装す
る部品実装設備では、生産性向上の実現のために高速化
が要求されている。最近では、電子部品１点当たりの装
着時間が０．１秒より短い部品実装装置も実用化されて
いる。このような高速化の傾向は今後も進むと考えら
れ、実装に係る各要素技術の急速な進展が切望されてい
る。In recent years, component mounting equipment for mounting electronic components on a circuit board has been required to operate at high speed in order to improve productivity. Recently, a component mounting apparatus in which the mounting time per electronic component is shorter than 0.1 seconds has been put into practical use. It is considered that such a trend toward higher speeds will continue in the future, and there is a strong demand for rapid progress in each elemental technology for mounting.
【０００４】部品実装装置では、高速化の進展に伴い、
電子部品装着時に吸着ノズルが電子部品を高速で連続し
て回路基板に押し付けることで発生する基板振動が大き
くなるという問題がある。また、電子部品の小型化に伴
い回路基板へのソルダーペーストの印刷面積が小さくな
ることに起因して、ソルダーペーストと電子部品との接
触面積がより小さくなる傾向にある。これにより、電子
部品の保持力が小さくなるため、高速化で基板振動が大
きくなる状況下では、部品の位置ズレや欠品等の不良発
生が増大するという問題が生じる。In the component mounting apparatus, with the progress of high speed,
There is a problem that the board vibration generated when the suction nozzle continuously presses the electronic parts against the circuit board at high speed during mounting of the electronic parts becomes large. In addition, the contact area between the solder paste and the electronic component tends to become smaller due to the smaller printing area of the solder paste on the circuit board as the electronic component becomes smaller. As a result, the holding force of the electronic component is reduced, and under the situation where the substrate vibration is increased due to the increased speed, there arises a problem that the positional deviation of the component or the occurrence of defects such as missing items increases.
【０００５】前記問題を解決するため、例えば、回路基
板の全面を支持することができれば、回路基板の撓みを
より有効に抑えることが容易になる。しかし、回路基板
の下面に電子部品が既に実装されている場合には、その
電子部品を避けつつ基板下面を支持しなければならな
い。これにより、下面を支持できなくなった部位に電子
部品を装着する状況が生じるが、その場合に、回路基板
の上下振動を抑えることは難しい。さらに、回路基板が
上側に反っている場合には、回路基板の全面を支持した
としても、部品装着する都度に回路基板が上下に振動す
る現象を抑えることは難しい。In order to solve the above-mentioned problem, for example, if the entire surface of the circuit board can be supported, it becomes easy to more effectively suppress the bending of the circuit board. However, when an electronic component is already mounted on the lower surface of the circuit board, the lower surface of the board must be supported while avoiding the electronic component. As a result, a situation arises in which the electronic component is mounted on a site where the lower surface cannot be supported, but in that case, it is difficult to suppress vertical vibration of the circuit board. Further, when the circuit board is warped upward, it is difficult to suppress the phenomenon that the circuit board vibrates up and down every time a component is mounted, even if the entire surface of the circuit board is supported.
【０００６】上述した回路基板の振動問題を解決するた
めの従来の技術は、例えば、特開昭６２−８４５９０号
公報や特開昭６３−２８３１９９号公報に記載されてい
る。これらの技術では、回路基板を、下方だけでなく上
方からも押さえることによって振動の発生を低減してい
る。しかし、このような支持方法では、電子部品の実装
可能範囲に制限が生じるため、回路基板の種類によって
は実用化できないことがある。Conventional techniques for solving the above-mentioned vibration problem of the circuit board are described in, for example, Japanese Patent Laid-Open Nos. 62-84590 and 63-283199. In these techniques, generation of vibration is reduced by pressing the circuit board not only from below but also from above. However, such a supporting method limits the mountable range of the electronic component, and thus may not be put to practical use depending on the type of the circuit board.
【０００７】また、回路基板の下面を支持する方法とし
て、特開平３−２８９１９９号公報に記載される技術が
知られている。この技術では、基板サポートブロック上
面に吸着パッドを設け、この吸着パッドを真空ポンプに
接続することによって、回路基板を吸着して振動を抑え
ている。しかし、吸着用の真空ポンプや配管が必要にな
るので、回路基板を保持するテーブルが高速で動作する
形式の部品実装装置では、テーブルの高速動作が困難に
なるので実用化が難しい。As a method for supporting the lower surface of the circuit board, the technique described in Japanese Patent Laid-Open No. 3-289199 is known. In this technique, a suction pad is provided on the upper surface of the substrate support block, and the suction pad is connected to a vacuum pump to suck the circuit board and suppress vibration. However, since a vacuum pump for suction and piping are required, it is difficult to put the table holding the circuit board into practical use because it is difficult to operate the table at high speed in a component mounting apparatus of a type that operates at high speed.
【０００８】さらに、基板支持部材の上面に制振ゴムを
張り付けるように構成した技術が、特開平１１−２０４
９９５号公報に記載されている。制振ゴムは、衝撃、振
動吸収性に優れ、外力を受けても殆ど反発せずにエネル
ギーを吸収するゴムであり、物性、耐久性は一般のゴム
と同様で、常温域（５〜３５℃）で優れた制振性能を発
揮する。この公報に記載の技術では、基板支持部材と基
板との間に保持力が無く、回路基板は基板支持部材の上
で跳ね上がり振動することになるため、保持力を持たせ
るために上記真空ポンプと接続する方式を採用する必要
がある。Further, a technique in which a damping rubber is attached to the upper surface of the substrate supporting member is disclosed in Japanese Patent Laid-Open No. 11-204.
It is described in Japanese Patent Publication No. 995. Damping rubber is a rubber that has excellent shock and vibration absorption properties, absorbs energy with little repulsion even when subjected to external force, and has the same physical properties and durability as ordinary rubber, and is in the normal temperature range (5 to 35 ° C). ) Shows excellent vibration damping performance. In the technique described in this publication, there is no holding force between the substrate support member and the substrate, and the circuit board will bounce and vibrate on the substrate support member. It is necessary to adopt a connection method.
【０００９】以下、上記制振ゴムを用いた従来の基板支
持方法の一例を、図１２を参照して説明する。図１２
（ａ）に示すように、電子部品を装着する回路基板１
は、固定ガイド２の上端に回路基板１の搬送方向に沿っ
て延設された鍔部３と、この鍔部３に向けて頂部を接近
／離反可能に支持された可動ガイド４とによって狭持さ
れて支持されている。An example of a conventional substrate supporting method using the above-mentioned vibration damping rubber will be described below with reference to FIG. 12
As shown in (a), a circuit board 1 on which electronic components are mounted
Is clamped by a flange portion 3 extending along the conveyance direction of the circuit board 1 on the upper end of the fixed guide 2 and a movable guide 4 whose top is supported so as to be able to approach / separate toward the flange portion 3. Has been supported.
【００１０】回路基板１の下面には電子部品５が既に実
装されており、この電子部品５の実装位置を避けて回路
基板１の下面に当接する基板支持部材６が、上下動可能
に支持されたサポートプレート７上に配設されている。
なお、可動ガイド４の下方に延びる左右の当接部材４ａ
は、サポートプレート７の上昇時にサポートプレート７
の両端部に当接して押し上げられ、回路基板１の両端部
を鍔部３との間で狭持する。An electronic component 5 is already mounted on the lower surface of the circuit board 1, and a substrate supporting member 6 that abuts the lower surface of the circuit board 1 while avoiding the mounting position of the electronic component 5 is supported so as to be vertically movable. It is arranged on the support plate 7.
The left and right abutting members 4a extending below the movable guide 4 are provided.
Is the support plate 7 when the support plate 7 is raised.
The two ends of the circuit board 1 are pushed up by being abutted against each other, and the both ends of the circuit board 1 are held between the flange part 3 and the both ends.
【００１１】ここで、基板支持部材６には、ピン型の基
板支持部材６ａとブロック型の基板支持部材６ｂとがあ
り、基板支持部材６ａ，６ｂの各上面には、制振ゴム１
０ａ，１０ｂがそれぞれに固定されている。そして、電
子部品５を吸着保持した吸着ノズル８が、回路基板１の
上方から、クリーム半田（或いは接着剤）９の印刷され
たランド上に電子部品５を押圧することで回路基板１上
に電子部品５を実装する。この際、基板支持部材６ａ，
６ｂは、上方から押圧された回路基板１を下方から支持
し、吸着ノズル８による部品実装動作に伴う回路基板１
の撓みを極力減少させている。Here, the substrate supporting member 6 includes a pin type substrate supporting member 6a and a block type substrate supporting member 6b, and the damping rubber 1 is provided on each upper surface of the substrate supporting members 6a and 6b.
0a and 10b are fixed to each. Then, the suction nozzle 8 that holds the electronic component 5 by suction presses the electronic component 5 from above the circuit board 1 onto the land on which the cream solder (or adhesive) 9 is printed. Mount the component 5. At this time, the substrate support member 6a,
6b supports the circuit board 1 pressed from above from below, and the circuit board 1 accompanying the component mounting operation by the suction nozzle 8
The flexure of is reduced as much as possible.
【００１２】[0012]
【発明が解決しようとする課題】ところで、制振ゴム１
０ａ，１０ｂを基板支持部材６ａ，６ｂの上面に取り付
けると、基板支持部材６ａ，６ｂのみの場合に比べて、
部品実装位置近傍の回路基板１の上下方向への撓み量は
増加するが、回路基板１全体の撓み量はむしろ小さくな
る。しかし、上記のような基板支持構成では、基板支持
部材６ａ，６ｂで下面を支持されていない部位に電子部
品５を装着する場合、回路基板１の撓みを抑制する効果
は得られにくくなる。By the way, the damping rubber 1
When 0a and 10b are attached to the upper surfaces of the substrate supporting members 6a and 6b, compared with the case where only the substrate supporting members 6a and 6b are provided,
The amount of vertical deflection of the circuit board 1 near the component mounting position increases, but the amount of deflection of the circuit board 1 as a whole becomes rather small. However, in the board supporting structure as described above, when the electronic component 5 is mounted on a portion whose lower surface is not supported by the board supporting members 6a and 6b, it is difficult to obtain the effect of suppressing the bending of the circuit board 1.
【００１３】具体的には、回路基板１の下側に基板支持
部材６ａ，６ｂが位置しない部位に電子部品５を実装す
る場合には、図１２（ｂ）に示すように、回路基板１が
下側に大きく撓んでしまう。この場合、基板支持部材６
ａ，６ｂの上部に固定された制振ゴム１０ａ，１０ｂ自
身が弾性変形し、回路基板１の撓みを若干軽減させる。
この状態から、電子部品５の実装動作を終了した吸着ノ
ズル８が上昇すると、回路基板１自身の反力と制振ゴム
１０ａ、１０ｂの弾性復元力により、図１２（ｃ）に示
すように、回路基板１が跳ね上がってしまう。この場
合、制振ゴム１０ａ，１０ｂには通常のゴムほどの反力
は働かないが、制振ゴム１０ａ，１０ｂから回路基板１
が離れ易く、回路基板１の跳ね上がりを抑制する力が働
かないため、回路基板１の振動を抑える効果は期待でき
ない。Specifically, when the electronic component 5 is mounted on the lower side of the circuit board 1 where the board supporting members 6a and 6b are not located, as shown in FIG. It will bend significantly downward. In this case, the substrate support member 6
The vibration damping rubbers 10a and 10b fixed to the upper portions of a and 6b are elastically deformed to slightly reduce the bending of the circuit board 1.
When the suction nozzle 8 that has completed the mounting operation of the electronic component 5 rises from this state, as shown in FIG. 12C, due to the reaction force of the circuit board 1 itself and the elastic restoring force of the damping rubbers 10a and 10b. The circuit board 1 jumps up. In this case, the reaction force to the vibration damping rubbers 10a and 10b is less than that of normal rubber, but the vibration damping rubbers 10a and 10b move from the circuit board 1 to the circuit board 1.
Is easy to separate, and the force that suppresses the jumping up of the circuit board 1 does not work, so the effect of suppressing the vibration of the circuit board 1 cannot be expected.
【００１４】電子部品５を高速で装着する場合には、吸
着ノズル８も高速で上下動させることになるため、回路
基板１自身が有する固有振動数よりも早く上下動させる
ことになる。そのため、クリーム半田９上に一旦装着し
た電子部品５が、回路基板１自身の振動のために飛び跳
ねることがある。特に、電子部品のサイズが一層縮小化
されると、回路基板１上に印刷されるソルダーペースト
の面積がより小さくなるので、粘着強度が小さくなり、
電子部品５が飛び跳ねる傾向がますます顕著になる。そ
の結果、回路基板１の不良発生頻度が多くなり、歩留ま
りが低下する等の問題が生じることになる。When the electronic component 5 is mounted at high speed, the suction nozzle 8 is also moved up and down at high speed, so that it is moved up and down faster than the natural frequency of the circuit board 1 itself. Therefore, the electronic component 5 once mounted on the cream solder 9 may jump due to the vibration of the circuit board 1 itself. Particularly, when the size of the electronic component is further reduced, the area of the solder paste printed on the circuit board 1 becomes smaller, so that the adhesive strength becomes smaller,
The tendency of the electronic component 5 to jump around becomes more and more prominent. As a result, the frequency of occurrence of defects in the circuit board 1 increases, and problems such as a decrease in yield occur.
【００１５】ところで、上記基板支持装置では、基板支
持部材６ａ，６ｂの各上面に制振ゴム１０ａ，１０ｂを
それぞれ取り付けたが、制振ゴム１０ａ，１０ｂを取り
付けずに金属やセラミック等の剛性の高い材料だけで基
板支持部材６ａ，６ｂを構成することもできる。このよ
うに構成した場合、基板支持部材６ａ，６ｂ自身の変形
や撓みが無視できる程度に小さくなる。ここで、電子部
品装着時の押し込み量を一定とすると、回路基板１の変
位量も一定と考えられる。この場合には、図１３に示す
ように、回路基板１の撓み角度θが、制振ゴム１０ａ，
１０ｂを設けた場合に比べて大きくなり、回路基板１自
身のうねりや反力も大きくなる。その結果、吸着ノズル
８による押し込みから解放されたときの回路基板１の跳
ね上がりが大きくなって、回路基板１に振動が発生し易
くなる。By the way, in the above-mentioned substrate supporting device, the damping rubbers 10a and 10b are attached to the upper surfaces of the substrate supporting members 6a and 6b, respectively. However, the damping rubbers 10a and 10b are not attached, and the damping rubbers 10a and 10b are rigid. The substrate supporting members 6a and 6b can be made of only high materials. With this configuration, the deformation and bending of the substrate supporting members 6a and 6b themselves are small enough to be ignored. Here, if the pushing amount when mounting the electronic component is constant, the displacement amount of the circuit board 1 is also considered to be constant. In this case, as shown in FIG. 13, the bending angle θ of the circuit board 1 is equal to the damping rubber 10a,
It becomes larger than the case where 10b is provided, and the undulation and reaction force of the circuit board 1 itself also becomes large. As a result, the jump of the circuit board 1 when released from the pushing by the suction nozzle 8 becomes large, and the circuit board 1 is likely to vibrate.
【００１６】本発明はこのような従来の問題点に鑑みて
なされたもので、電子部品の実装時に回路基板等の基板
に発生する振動をより有効に抑えることができる基板支
持方法及び基板支持装置並びに部品実装装置を提供する
ことを目的としている。The present invention has been made in view of the above conventional problems, and a substrate supporting method and a substrate supporting apparatus capable of more effectively suppressing the vibration generated on a substrate such as a circuit substrate during mounting of electronic components. Another object is to provide a component mounting device.
【００１７】[0017]
【課題を解決するための手段】上記目的を達成するため
の本発明に係る請求項１に記載の基板支持方法は、基板
の両端部を狭持すると共に該基板をその下方から支持す
る基板支持方法であって、柔軟な弾性材料からなり上面
に凹部を有する支持部材を、前記基板の下面の一部に押
圧させることによって前記基板を吸着支持することを特
徴とする。According to a first aspect of the present invention, there is provided a substrate supporting method for supporting a substrate which holds both end portions of the substrate and supports the substrate from below. The method is characterized in that a supporting member made of a flexible elastic material and having a recess in the upper surface is pressed against a part of the lower surface of the substrate to adsorb and support the substrate.
【００１８】この基板支持方法では、電子部品等の部品
を基板の所定位置に押し付けた後、基板を解放する際に
生じる跳ね上がりを、押圧されて撓み基板下面を凹部で
吸着する柔軟な支持部材によって抑え、部品の実装時に
基板に発生する振動をより有効に抑制することができるIn this substrate supporting method, after a component such as an electronic component is pressed to a predetermined position on the substrate, the bounce generated when releasing the substrate is flexed by a flexible supporting member that is pressed to adsorb the lower surface of the substrate in the concave portion. It is possible to suppress more effectively the vibration generated on the board when mounting components.
【００１９】請求項２記載の基板支持方法は、基板の両
端部を狭持すると共に該基板をその下方から支持する基
板支持方法であって、粘弾性材料からなる支持部材を、
前記基板の下面の一部に押圧させることによって前記基
板を粘着支持することを特徴とする。According to a second aspect of the present invention, there is provided a substrate supporting method for holding both ends of a substrate and supporting the substrate from below, wherein the supporting member is made of a viscoelastic material.
The substrate is adhesively supported by pressing a part of the lower surface of the substrate.
【００２０】この基板支持方法では、電子部品等の部品
を基板の所定位置に押し付けた後、基板を解放する際に
生じる跳ね上がりを、基板下面を粘着支持する支持部材
によって抑え、部品の実装時に基板に発生する振動をよ
り有効に抑制することができる。In this board supporting method, the jumping that occurs when the board is released after the electronic part or the like is pressed against the board at a predetermined position is suppressed by the supporting member that adhesively supports the bottom surface of the board, and the board is mounted when the parts are mounted. It is possible to more effectively suppress the vibration that occurs in the.
【００２１】請求項３記載の基板支持方法は、基板の両
端部を狭持すると共に該基板をその下方から支持する基
板支持装置であって、柔軟な弾性材料からなり上面に凹
部を有する支持部材と、前記支持部材を前記基板の下方
から該基板の下面との接触位置に上昇させる昇降手段
と、を備えたことを特徴とする。A substrate supporting method according to a third aspect of the present invention is a substrate supporting device for holding both ends of a substrate and supporting the substrate from below, the supporting member being made of a flexible elastic material and having a concave portion on its upper surface. And elevating means for elevating the support member from below the substrate to a contact position with the lower surface of the substrate.
【００２２】この基板支持装置では、電子部品等の部品
を基板の所定位置に押し付けた後、基板を解放する際に
生じる跳ね上がりを、基板下面を凹部で吸着する柔軟な
支持部材によって抑え、部品の実装時に基板に発生する
振動をより有効に抑制することができる。In this substrate supporting device, the jumping that occurs when releasing the substrate after pressing the component such as an electronic component to a predetermined position on the substrate is suppressed by a flexible supporting member that attracts the lower surface of the substrate by the concave portion. The vibration generated on the substrate during mounting can be suppressed more effectively.
【００２３】請求項４記載の基板支持装置は、前記柔軟
な弾性材料が、エントロピ弾性を示す材料であることを
特徴とする。A substrate supporting apparatus according to a fourth aspect is characterized in that the flexible elastic material is a material exhibiting entropy elasticity.
【００２４】この基板支持装置では、エントロピ弾性を
示す材料を支持部材の上面に設けたことにより、電子部
品等の部品の実装時に基板に発生する振動をより有効に
抑えることができるIn this substrate supporting device, since the material exhibiting entropy elasticity is provided on the upper surface of the supporting member, it is possible to more effectively suppress the vibration generated on the substrate during mounting of components such as electronic components.
【００２５】請求項５記載の基板支持装置は、基板の両
端部を狭持すると共に該基板をその下方から支持する基
板支持装置であって、粘弾性材料からなる支持部材と、
前記支持部材を前記基板の下方から該基板の下面との接
触位置に上昇させる昇降手段と、を備えたことを特徴と
する。According to a fifth aspect of the present invention, there is provided a substrate supporting device which holds both end portions of the substrate and supports the substrate from below, the supporting member comprising a viscoelastic material.
Elevating means for raising the supporting member from below the substrate to a contact position with the lower surface of the substrate.
【００２６】この基板支持装置では、電子部品等の部品
を基板の所定位置に押し付けた後、基板を解放する際に
生じる跳ね上がりを、基板下面を粘着支持する支持部材
によって抑え、部品の実装時に基板に発生する振動をよ
り有効に抑制することができる。In this board supporting device, the jumping that occurs when the board is released after the electronic parts and the like are pressed against the board at predetermined positions is suppressed by the supporting member that adheres and supports the bottom surface of the board, and the board is mounted when the parts are mounted. It is possible to more effectively suppress the vibration that occurs in the.
【００２７】請求項６記載の基板支持装置は、前記粘弾
性材料が、エントロピ弾性を示す材料を発泡化した材料
又は発泡樹脂材料からなることを特徴とする。A substrate supporting apparatus according to a sixth aspect of the present invention is characterized in that the viscoelastic material is a material obtained by foaming a material exhibiting entropy elasticity or a foamed resin material.
【００２８】この基板支持装置では、エントロピ弾性を
示す材料を発泡化した材料又は発泡樹脂材料を支持部材
の上面に設けたことにより、電子部品等の部品の実装時
に基板に発生する振動をより有効に抑えることができるIn this substrate supporting device, by providing a material obtained by foaming a material exhibiting entropy elasticity or a foamed resin material on the upper surface of the supporting member, it is possible to more effectively generate the vibration generated on the substrate when mounting components such as electronic components. Can be suppressed to
【００２９】請求項７記載の基板支持装置は、前記支持
部材が、上面の面積が側面の面積の２倍以上となる形状
を有することを特徴とする。According to a seventh aspect of the present invention, there is provided the substrate supporting device, wherein the supporting member has a shape in which the area of the upper surface is at least twice the area of the side surface.
【００３０】この基板支持装置では、支持部材の上面の
面積が側面の面積の２倍以上であることにより、発泡性
材料内の微細な空間が連通した流路に対する流路抵抗が
小さくなって、吸盤効果が増大する。この条件を満たす
ように支持部材の形状を設定することにより、回路基板
の急激な復元動作をより有効に抑えることが可能にな
る。In this substrate supporting device, since the area of the upper surface of the supporting member is more than twice the area of the side surface, the flow path resistance to the flow path communicating with the minute spaces in the foamable material becomes small, The sucker effect increases. By setting the shape of the support member so as to satisfy this condition, it becomes possible to more effectively suppress the rapid restoration operation of the circuit board.
【００３１】請求項８記載の基板支持装置は、前記エン
トロピ弾性を示す材料が、クロロプレンゴム、ハイパロ
ン、ニトリルゴム、エチレンプロピレンゴム、ブチルゴ
ム、ウレタンゴム、シリコーンゴム、フッ素ゴム、天然
ゴム、又はこれらの混合物を主成分とする材料のいずれ
かであることを特徴とする。In the substrate supporting apparatus according to the eighth aspect, the material exhibiting entropy elasticity is chloroprene rubber, hypalon, nitrile rubber, ethylene propylene rubber, butyl rubber, urethane rubber, silicone rubber, fluororubber, natural rubber, or a material thereof. It is characterized in that it is one of the materials having a mixture as a main component.
【００３２】この基板支持装置では、エントロピ弾性を
示す材料を用途に応じて選択的に使用することにより、
材料の特性を活かした種々の支持部材を得ることができ
る。In this substrate supporting apparatus, a material exhibiting entropy elasticity is selectively used according to the purpose,
It is possible to obtain various support members that take advantage of the characteristics of the material.
【００３３】請求項９記載の部品実装装置は、部品を吸
着ノズルにより吸着保持して搬送し、基板上の所定位置
に前記部品を実装する部品実装装置であって、請求項３
〜請求項８のいずれか１項記載の基板支持装置を備え、
前記吸着ノズルにより吸着保持した部品を、前記基板支
持装置に支持された基板上に押し当てて該基板上へ実装
することを特徴とする。The component mounting apparatus according to a ninth aspect is a component mounting apparatus that suctions and holds a component by a suction nozzle to convey the component, and mounts the component at a predetermined position on a board.
To the substrate supporting device according to claim 8,
The component sucked and held by the suction nozzle is pressed against the substrate supported by the substrate supporting device to be mounted on the substrate.
【００３４】この部品実装装置では、吸着ノズルにより
吸着保持した部品を基板の所定位置に押し付けた後、基
板を解放する際に生じる跳ね上がりを支持部材によって
抑え、電子部品の実装時に基板に発生する振動をより有
効に抑制しつつ、実装工程を進めることができる。In this component mounting apparatus, after the component sucked and held by the suction nozzle is pressed to a predetermined position on the substrate, the support member suppresses the jumping that occurs when the substrate is released, and the vibration generated on the substrate during mounting of the electronic component is suppressed. It is possible to proceed with the mounting process while suppressing the above effectively.
【００３５】[0035]
【発明の実施の形態】以下、本発明に係る基板支持方法
及び基板支持装置並びに部品実装装置の実施の形態につ
いて図面を参照して詳細に説明する。図１に本発明に係
る基板支持装置を備えた部品実装装置の外観図を、図２
にこの部品実装装置の部品実装機構の概略構成を、図３
にロータリーヘッドの動作を説明するためのロータリー
ヘッドの概略上視図をそれぞれ示した。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a board supporting method, a board supporting apparatus, and a component mounting apparatus according to the present invention will be described in detail below with reference to the drawings. FIG. 1 is an external view of a component mounting apparatus equipped with a substrate supporting apparatus according to the present invention.
The schematic configuration of the component mounting mechanism of this component mounting apparatus is shown in FIG.
The schematic top view of the rotary head for explaining the operation of the rotary head is shown in FIG.
【００３６】図１に示すように、部品実装装置１００
は、主に、部品の一例である電子部品を連続的に供給す
る部品供給部１０と、部品供給部１０の所定の部品供給
位置で電子部品を保持してこの電子部品を回路基板１
（図２参照）に実装するロータリーヘッド１２と、回路
基板１を所定の位置に位置決めするＸＹテーブル（基板
支持装置）１４とを有している。さらに、部品実装装置
１００は、回路基板１を搬入する基板搬入部１６と、こ
の基板搬入部１６から供給された回路基板１を載置する
ＸＹテーブル１４と、このＸＹテーブル１４で所定の処
理を施された回路基板１を搬出する基板搬出部１８と、
所定の入力を行うための入力装置２０と、必要な表示を
行う表示部２２とを有している。As shown in FIG. 1, the component mounting apparatus 100
Is mainly a component supply unit 10 that continuously supplies an electronic component, which is an example of a component, and the electronic component is held at a predetermined component supply position of the component supply unit 10 and the electronic component is connected to the circuit board 1.
It has a rotary head 12 mounted (see FIG. 2) and an XY table (board support device) 14 for positioning the circuit board 1 at a predetermined position. Further, the component mounting apparatus 100 carries out a predetermined process on the board loading section 16 for loading the circuit board 1, the XY table 14 on which the circuit board 1 supplied from the board loading section 16 is placed, and the XY table 14. A board unloading section 18 for carrying out the applied circuit board 1;
It has an input device 20 for performing a predetermined input and a display unit 22 for performing a necessary display.
【００３７】部品供給部１０は、多数の電子部品５を収
容した複数の部品供給ユニット１１を並列して有し、そ
の並列方向に移動することで所望の電子部品５を部品供
給位置に供給する。The component supply unit 10 has a plurality of component supply units 11 that accommodate a large number of electronic components 5 in parallel, and moves in the parallel direction to supply the desired electronic component 5 to the component supply position. .
【００３８】ＸＹテーブル１４は、詳細は後述するが、
基板搬入部１６と基板搬出部１８との間に移動可能に設
けられ、基板搬入部１６の基板搬送路に接続される位置
に移動して部品装着前の回路基板１を受け取り、回路基
板１を支持しつつロータリーヘッド１２の部品実装位置
に移動する。そして、ＸＹテーブル１４は、各電子部品
５の実装位置に応じた回路基板１の移動を繰り返し行
い、部品装着が完了すると基板搬出部１８に接続される
位置まで移動し、回路基板１を基板搬出部１８へ送り出
す。The XY table 14 will be described in detail later,
The circuit board 1 is movably provided between the board carry-in section 16 and the board carry-out section 18, and is moved to a position connected to the board carrying path of the board carry-in section 16 to receive the circuit board 1 before component mounting, It moves to the component mounting position of the rotary head 12 while supporting it. Then, the XY table 14 repeatedly moves the circuit board 1 according to the mounting position of each electronic component 5, and when the component mounting is completed, moves to the position where the circuit board 1 is connected to the circuit board unloading section 18 to unload the circuit board 1. Send to section 18.
【００３９】ロータリーヘッド１２は、図２に示すよう
に、電子部品５を保持する複数の吸着ノズル８と、各吸
着ノズル８を上下動可能に周面で支持して回転駆動され
る回転枠体２８と、回転枠体２８をインデックス回転駆
動するインデックス回転駆動装置３０とを備えている。As shown in FIG. 2, the rotary head 12 has a plurality of suction nozzles 8 for holding the electronic components 5, and a rotary frame body which is rotatably driven by vertically supporting the suction nozzles 8 on its peripheral surface. 28 and an index rotation drive device 30 that drives the rotation frame 28 to perform index rotation.
【００４０】装着ヘッド２６は、回転枠体２８の回転に
よって部品供給部１０の部品供給位置１０ａからその反
対側の部品装着位置を経て、元の部品供給位置１０ａま
でを回転移動する。各装着ヘッド２６には吸着ノズル８
がそれぞれ脱着可能に取り付けられており、これら吸着
ノズル８によって電子部品の吸着保持、及び回路基板１
への実装動作が行われる。このロータリーヘッド１２
は、インデックス回転駆動装置３０により装着ヘッド２
６を時計回りにインデックス回転させることで、各イン
デックス位置で所定の処理を高速で連続して行うことが
できる。The mounting head 26 rotationally moves from the component supply position 10a of the component supply unit 10 to the original component supply position 10a via the component mounting position on the opposite side by the rotation of the rotary frame 28. Each mounting head 26 has a suction nozzle 8
Are detachably attached to the circuit board 1.
Is implemented. This rotary head 12
Is mounted on the mounting head 2 by the index rotary drive device 30.
By index-rotating 6 in the clockwise direction, predetermined processing can be continuously performed at high speed at each index position.
【００４１】上記の部品実装装置１００は、図３に示す
ように、部品供給部１０は、それぞれに所定の電子部品
５（図２参照）を収容した複数のパーツカセット４０
と、このパーツカセット４０を部品供給位置に移動させ
る部品供給ステージ４１とを有している。また、部品実
装装置１００は、ロータリーヘッド１２により、複数の
吸着ノズル８を順次回転移動させて、部品供給部１０側
の部品供給位置で吸着ノズル８に電子部品５を吸着さ
せ、反対側の部品装着位置で回路基板１に電子部品５を
装着する。ＸＹテーブル１４は、搬入された回路基板１
を水平方向に移動自在に保持する。In the component mounting apparatus 100, as shown in FIG. 3, the component supply unit 10 has a plurality of parts cassettes 40 each containing a predetermined electronic component 5 (see FIG. 2).
And a parts supply stage 41 for moving the parts cassette 40 to the parts supply position. Also, the component mounting apparatus 100 causes the rotary head 12 to sequentially rotate and move the plurality of suction nozzles 8 to cause the suction nozzle 8 to suck the electronic component 5 at the component supply position on the component supply unit 10 side, and the components on the opposite side. The electronic component 5 is mounted on the circuit board 1 at the mounting position. The XY table 14 is the loaded circuit board 1
Holds movably in the horizontal direction.
【００４２】図３において、ＸＹテーブル１４及びこれ
に接続される回路基板１の搬送路には、それぞれ図示し
ない搬送ベルトが各レール１５に沿って配設されてい
る。また、ＸＹテーブル１４上には、図１２に示した固
定ガイド２がレール１５に沿って設けられ、図示を省略
した鍔部３及び可動ガイド４が固定ガイド２と共に設け
られている。ＸＹテーブル１４に備えられたサポートプ
レート７の上面には、回路基板１を下方から支持するた
めの基板支持部材６ａ，６ｂが取り付けられている。In FIG. 3, a conveyor belt (not shown) is arranged along each rail 15 in the conveyor path of the XY table 14 and the circuit board 1 connected thereto. Further, the fixed guide 2 shown in FIG. 12 is provided along the rail 15 on the XY table 14, and the collar portion 3 and the movable guide 4 (not shown) are provided together with the fixed guide 2. Substrate supporting members 6 a and 6 b for supporting the circuit board 1 from below are attached to the upper surface of the support plate 7 provided on the XY table 14.
【００４３】図４は、図３に示すＸＹテーブル１４のＡ
−Ａ断面図である。ここで、図４（ａ）及び（ｂ）にお
いては、図１２と共通する部材には同一の符号を付し、
その説明は省略するものとする。FIG. 4 shows A of the XY table 14 shown in FIG.
FIG. Here, in FIGS. 4A and 4B, members common to those in FIG.
The description will be omitted.
【００４４】基板支持装置を構成するＸＹテーブル１４
は、回路基板１の幅に応じて所定の間隔をあけて相互に
平行に延設された一対の固定ガイド２の一方が、固定プ
レート４６に下部を支持されている。また、各固定ガイ
ド２に備わる可動ガイド４は、それぞれ固定ガイド２に
対して所定量昇降可能に支持されており、回路基板１の
非固定状態では、図４（ａ）に示すように、可動ガイド
４に固定された当接部材４ａが、その下端が所定の高さ
位置でサポートプレート７と接触することのない位置に
配置されている。XY table 14 constituting the substrate supporting device
The lower portion of one of the pair of fixed guides 2 extending in parallel with each other at a predetermined interval according to the width of the circuit board 1 is supported by the fixed plate 46. Further, the movable guides 4 provided in the fixed guides 2 are respectively supported to be movable up and down by a predetermined amount with respect to the fixed guides 2, and when the circuit board 1 is not fixed, the movable guides 4 are movable as shown in FIG. The contact member 4a fixed to the guide 4 is arranged at a position where its lower end does not come into contact with the support plate 7 at a predetermined height position.
【００４５】一方、一対の可動ガイド４で両端を支持さ
れた回路基板１は、半田付けされた複数の電子部品５を
下面に有し、クリーム半田９上に単に載置しただけの電
子部品５を上面に有している。On the other hand, the circuit board 1 whose both ends are supported by the pair of movable guides 4 has a plurality of soldered electronic components 5 on its lower surface, and the electronic component 5 simply placed on the cream solder 9. On the upper surface.
【００４６】固定プレート４６は、その中央部に昇降手
段の一例としてのエアーシリンダ４８が固定され、エア
ーシリンダ４８と固定プレート４６の縁部との間には、
エアーシリンダ４８の昇降方向に平行に形成されたスラ
イド孔４６ａが穿設されている。サポートプレート７下
面のスライド孔４６ａの位置には、スライド孔４６ａに
挿入されるスライドピン４７が垂設されている。各スラ
イドピン４７は、サポートプレート７の昇降動作に伴い
固定プレート４６のスライド孔４６ａに摺動することで
位置決めされる。これにより、サポートプレート７は、
エアーシリンダ４８の上昇動作時に、図４（ｂ）に示す
ようにピストンロッド４８ａが上方に延出され、サポー
トプレート７の下面中央部を押し上げる。このとき、サ
ポートプレート７の両端部で当接部材４ａを押し上げ
て、可動ガイド４を固定ガイド２の鍔部３に接近させ、
回路基板１を鍔部３に押し当てる。これにより、回路基
板１は固定ガイド２の鍔部３と可動ガイド４の頂部との
間で狭持されて固定される。An air cylinder 48, which is an example of an elevating means, is fixed to the central portion of the fixed plate 46, and between the air cylinder 48 and the edge portion of the fixed plate 46,
A slide hole 46a is formed in parallel with the vertical direction of the air cylinder 48. At the position of the slide hole 46a on the lower surface of the support plate 7, a slide pin 47 inserted into the slide hole 46a is vertically provided. Each slide pin 47 is positioned by sliding in the slide hole 46a of the fixed plate 46 as the support plate 7 moves up and down. As a result, the support plate 7 is
When the air cylinder 48 moves up, the piston rod 48a is extended upward as shown in FIG. 4 (b) to push up the central portion of the lower surface of the support plate 7. At this time, the abutting members 4a are pushed up by the both ends of the support plate 7 to bring the movable guide 4 close to the flange portion 3 of the fixed guide 2,
The circuit board 1 is pressed against the collar 3. As a result, the circuit board 1 is sandwiched and fixed between the flange portion 3 of the fixed guide 2 and the top portion of the movable guide 4.
【００４７】また、サポートプレート７には、図示しな
い複数の固定孔１３がプレート面に対して垂直に穿設さ
れており、金属等の比較的剛性の高い材料からなるピン
型の基板支持部材６ａ、及びブロック型の基板支持部材
６ｂの固定用ピンがこの固定孔に挿入されることで固定
される。基板支持部材６ａ，６ｂは、回路基板１下面の
電子部品５が実装されていない位置に選択的に配置され
る。基板支持部材６ａ，６ｂの各上面には、柔軟な弾性
材料からなり且つ表面にディンプル（凹部）を有する支
持部材４９Ａ，４９Ｂが設けられている。ディンプル
は、基板支持部材６ａ，６ｂのサイズに対応して１個又
は複数個が形成される。Further, a plurality of fixing holes 13 (not shown) are formed in the support plate 7 perpendicularly to the plate surface, and the pin type substrate supporting member 6a made of a material having a relatively high rigidity such as metal. , And the fixing pin of the block-type substrate support member 6b is inserted into the fixing hole to be fixed. The board supporting members 6a and 6b are selectively arranged on the lower surface of the circuit board 1 at positions where the electronic components 5 are not mounted. Support members 49A and 49B made of a flexible elastic material and having dimples (recesses) on the surfaces are provided on the respective upper surfaces of the substrate support members 6a and 6b. One or more dimples are formed corresponding to the size of the substrate supporting members 6a and 6b.
【００４８】図５はピン型の基板支持部材６ａの上部拡
大図で、（ａ）は基板支持部材６ａの上面に設けられた
支持部材４９Ａの平面図、（ｂ）は（ａ）のＢ−Ｂ断面
図である。支持部材４９Ａは、頂部がリング状に形成さ
れ、このリング状の中心部分が最も深くなる半球面状の
ディンプル５０を有している。FIG. 5 is an enlarged top view of the pin-type substrate support member 6a. (A) is a plan view of the support member 49A provided on the upper surface of the substrate support member 6a, (b) is B- of (a). It is a B sectional view. The support member 49A has a hemispherical dimple 50 whose top is formed in a ring shape and whose ring-shaped central portion is deepest.
【００４９】図６はブロック型の基板支持部材６ｂの上
面に設けられた支持部材４９Ｂを示す斜視図、図７は図
６のＣ−Ｃ断面図である。支持部材４９Ｂは、平板状の
支持部材に縦横方向に延びる溝５１によりマトリクス状
に区画配列された多数の凸状体に、それぞれディンプル
５０が形成されている。このように、多数個が形成され
て支持面積を広くした各ディンプル５０の周りに溝５１
が形成されているので、支持部材の変形を容易にし、デ
ィンプル５０による吸着効果をより向上させている。FIG. 6 is a perspective view showing a support member 49B provided on the upper surface of the block-type substrate support member 6b, and FIG. 7 is a sectional view taken along line CC of FIG. In the supporting member 49B, dimples 50 are formed on a large number of convex bodies that are arranged in a matrix on a flat supporting member by grooves 51 extending in the vertical and horizontal directions. As described above, a groove 51 is formed around each dimple 50 having a large supporting area by forming a large number of grooves.
As a result, the support member is easily deformed, and the suction effect of the dimples 50 is further improved.
【００５０】以上の構成の基板支持装置の動作につい
て、図４及び図８を参照しつつ説明する。なお、図８に
は、固定プレート４６、エアーシリンダ４８、及びスラ
イドピン４７については図示を省略している。The operation of the substrate supporting apparatus having the above structure will be described with reference to FIGS. 4 and 8. Note that the fixed plate 46, the air cylinder 48, and the slide pin 47 are not shown in FIG. 8.
【００５１】まず、図４（ａ）に示すように、エアーシ
リンダ４８のピストンロッド４８ａが後退して固定プレ
ート４６が最下位置に退避した初期状態において、回路
基板１が基板搬入部側から搬送されて所定の位置（図３
のストッパ１９に当接する位置）に到達すると、回路基
板１の搬送が停止される。このとき、回路基板１の両端
部が左右の可動ガイド４上に載置される。これにタイミ
ングを合わせてエアーシリンダ４８が動作してピストン
ロッド４８ａが上昇すると、サポートプレート７が水平
状態を維持しつつ上昇し、サポートプレート７の両端部
で当接部材４ａの下端を押し上げる。First, as shown in FIG. 4A, in the initial state in which the piston rod 48a of the air cylinder 48 is retracted and the fixed plate 46 is retracted to the lowermost position, the circuit board 1 is conveyed from the board loading portion side. In place (Fig. 3
When it reaches the position (abutting the stopper 19), the conveyance of the circuit board 1 is stopped. At this time, both ends of the circuit board 1 are placed on the left and right movable guides 4. When the air cylinder 48 operates and the piston rod 48a rises in synchronism with this, the support plate 7 rises while maintaining the horizontal state, and the lower ends of the contact members 4a are pushed up by both ends of the support plate 7.
【００５２】このサポートプレート７の上昇により、当
接部材４ａを介して左右の可動ガイド４が上昇し、回路
基板１を固定ガイド２の鍔部３に押し付ける。これによ
り、回路基板１の両端部が鍔部３と可動ガイド４とで挟
持されて支持される。また、図４（ｂ）に示すように、
サポートプレート７と共に基板支持部材６ａ，６ｂが上
昇し、支持部材４９Ａ，４９Ｂを、回路基板１の下面の
電子部品５の非実装域に当接させて回路基板１を下方か
ら支持する。As the support plate 7 is raised, the left and right movable guides 4 are raised via the contact members 4a, and the circuit board 1 is pressed against the flange portion 3 of the fixed guide 2. As a result, both ends of the circuit board 1 are sandwiched and supported by the collar portion 3 and the movable guide 4. In addition, as shown in FIG.
The board supporting members 6a and 6b rise together with the support plate 7, and the supporting members 49A and 49B are brought into contact with the non-mounting area of the electronic component 5 on the lower surface of the circuit board 1 to support the circuit board 1 from below.
【００５３】以上の状態において、回路基板１の上面の
所定位置に電子部品５を吸着ノズル８により実装する。
この場合、電子部品５を回路基板１上に確実に装着する
ため、電子部品５の厚みのバラツキや反り等を考慮し、
回路基板１上のクリーム半田９に対して０．０３ｍｍ以
上押し込む。In the above state, the electronic component 5 is mounted on the upper surface of the circuit board 1 at a predetermined position by the suction nozzle 8.
In this case, in order to mount the electronic component 5 on the circuit board 1 with certainty, in consideration of variations in thickness and warpage of the electronic component 5,
It is pressed into the cream solder 9 on the circuit board 1 by 0.03 mm or more.
【００５４】その結果、基板支持部材６ａ，６ｂで下面
を支持されない部位に電子部品５を実装する際には、図
８（ａ）に示すように、回路基板１が下方へ若干撓むこ
とになる。この際、上下方向だけでなく、矢印６０で示
すように横方向の力も作用する。ここで、基板支持部材
６ａ，６ｂの剛性が弱い場合には、横方向にも変形して
基板位置精度が悪くなるので、支持部材４９Ａ、４９Ｂ
は、必要最小限の弾力性を有するための厚さを残して、
可能な限り薄い方が好ましい。As a result, when the electronic component 5 is mounted on a portion whose lower surface is not supported by the board supporting members 6a and 6b, the circuit board 1 is slightly bent downward as shown in FIG. 8A. Become. At this time, not only the vertical force but also the lateral force acts as indicated by an arrow 60. Here, when the substrate support members 6a and 6b have a low rigidity, they are also deformed in the lateral direction and the substrate position accuracy is deteriorated.
Leaves the thickness to have the minimum required elasticity,
It is preferably as thin as possible.
【００５５】しかし、支持部材４９Ａ，４９Ｂが薄くな
り過ぎると、回路基板１表面の凹凸を吸収するだけの変
形量を確保できなくなる。そこで、使用する材料によっ
ても異なるが、経験的には支持部材４９Ａ，４９Ｂは、
０．１ｍｍ〜５ｍｍ程度の厚さが好適である。さらに、
回路基板１はその両端を固定ガイド２の鍔部３と可動ガ
イド４とにより挟持されることで、上下動だけでなく、
水平方向のズレも抑制される。However, if the supporting members 49A and 49B become too thin, it becomes impossible to secure a sufficient amount of deformation to absorb the irregularities on the surface of the circuit board 1. Therefore, empirically, the support members 49A and 49B are different depending on the material used.
A thickness of about 0.1 mm to 5 mm is suitable. further,
Since both ends of the circuit board 1 are sandwiched by the flange portion 3 of the fixed guide 2 and the movable guide 4, not only the vertical movement,
Horizontal displacement is also suppressed.
【００５６】次いで、図８（ｂ）に示すように、吸着ノ
ズル８が電子部品５を回路基板１に印刷されたクリーム
半田９上に押し付けた後、矢印６１で示す方向に離間す
ると、押し付けられていた回路基板１が一気に解放され
るので、特に、クリーム半田９上に電子部品５を載置し
たばかりの実装面を中心に急激に跳ね上がろうとする力
が発生する。Then, as shown in FIG. 8B, after the suction nozzle 8 presses the electronic component 5 onto the cream solder 9 printed on the circuit board 1, when it is separated in the direction indicated by the arrow 61, it is pressed. Since the circuit board 1 that has been used is released all at once, a force is generated that causes the circuit board 1 to jump rapidly around the mounting surface where the electronic component 5 has just been placed on the cream solder 9.
【００５７】しかし、本実施形態の基板支持装置におい
ては、基板支持部材６ａ，６ｂの各上部にディンプルの
形成された支持部材４９Ａ，４９Ｂが設けられているの
で、支持部材４９Ａ，４９Ｂの頂部のディンプル５０
が、吸着ノズル８で押し付けた際の変形により吸盤効果
を発揮する。このため、下面を吸着された状態の回路基
板１が跳ね上がろうとしても、支持部材４９Ａ，４９Ｂ
の吸着効果によって回路基板１の急激な跳ね上がりが抑
えられる。However, in the substrate supporting apparatus of this embodiment, since the supporting members 49A and 49B having the dimples are provided on the upper portions of the substrate supporting members 6a and 6b, respectively, the supporting members 49A and 49B are provided at the tops thereof. Dimple 50
However, the suction cup effect is exerted by the deformation when pressed by the suction nozzle 8. Therefore, even if the circuit board 1 having the lower surface sucked up tries to bounce, the supporting members 49A, 49B
The sudden effect of the circuit board 1 can be prevented from suddenly jumping up.
【００５８】このように、本実施形態によれば、電子部
品５を回路基板１の所定位置に押し付けた後、回路基板
１を解放する際に生じる跳ね上がりを、支持部材４９
Ａ，４９Ｂのディンプル５０によって回路基板１下面を
吸着することで抑え、電子部品５の実装時に回路基板１
に発生する振動を有効に抑制することができる。As described above, according to the present embodiment, after the electronic component 5 is pressed to a predetermined position on the circuit board 1, the spring-up that occurs when the circuit board 1 is released is prevented from rising.
The dimples 50 of A and 49B attract the lower surface of the circuit board 1 to suppress it, and when mounting the electronic component 5, the circuit board 1
It is possible to effectively suppress the vibration generated in the.
【００５９】本実施形態では、支持部材４９Ａ，４９Ｂ
が弾性材料からなるので、変形状態から復元する際の時
間依存性を持たないが、例えば支持部材４９Ａ、４９Ｂ
を粘弾性材料で構成すれば、粘弾性材料が時間依存性を
持ち、ダンパーの如く徐々に復元しようと抵抗するの
で、回路基板１の跳ね上がり抑止効果が一層向上する。
つまり、支持部材４９Ａ，４９Ｂに粘弾性材料を使用す
れば、より緩やかな復元効果を実現し、クリーム半田９
上に一旦装着した電子部品５が飛散するような不具合を
より確実に防ぐことができる。In this embodiment, the support members 49A and 49B are used.
Since it is made of an elastic material, it does not have time dependency when restoring from a deformed state.
If it is made of a viscoelastic material, the viscoelastic material has time dependency and resists the gradual restoration like a damper, so that the jumping-up prevention effect of the circuit board 1 is further improved.
In other words, if a viscoelastic material is used for the support members 49A and 49B, a more gradual restoration effect can be realized, and the cream solder 9
It is possible to more reliably prevent such a problem that the electronic component 5 once mounted on the top is scattered.
【００６０】なお、上記のディンプル５０の形状では、
空気の漏れ等により回路基板１を長時間連続吸着するこ
とはできないが、装着タクトが０．１秒程度の実装装置
であれば、実質的に０．１秒間吸着できれば十分であ
り、実用上問題にはならない。In the shape of the dimple 50 described above,
The circuit board 1 cannot be adsorbed continuously for a long time due to air leakage or the like, but if the mounting device has a mounting tact of about 0.1 seconds, it is sufficient if it can be adsorbed for substantially 0.1 seconds. It doesn't.
【００６１】本実施形態の支持部材４９Ａ，４９Ｂの材
料としては、エントロピ弾性を示す弾性材料が用いられ
る。エントロピ弾性とは、例えばゴム紐のような鎖状高
分子からなる紐に対し、引張り力を一定にして温度を上
昇させると、鎖状高分子の折り畳みが増加して、換言す
るとエントロピが増大して、紐が縮むようになる。この
ように温度上昇と共に張力が増大するといった、エント
ロピの増減に起因する弾性をエントロピ弾性という。As the material of the support members 49A and 49B of this embodiment, an elastic material exhibiting entropy elasticity is used. Entropy elasticity is, for example, when a string made of a chain polymer such as a rubber string is heated at a constant tensile force, folding of the chain polymer increases, that is, entropy increases. Then, the string will shrink. The elasticity resulting from the increase or decrease in entropy such that the tension increases as the temperature rises is called entropy elasticity.
【００６２】エントロピ弾性を示す材料として、クロロ
プレンゴム、ハイパロン、ニトリルゴム、エチレンプロ
ピレンゴム、ブチルゴム、ウレタンゴム、シリコーンゴ
ム、フッ素ゴム、天然ゴム、又はこれらの混合物を主成
分とする材料を挙げることができる。Examples of the material exhibiting entropy elasticity include materials containing chloroprene rubber, hypalon, nitrile rubber, ethylene propylene rubber, butyl rubber, urethane rubber, silicone rubber, fluororubber, natural rubber, or a mixture thereof as a main component. it can.
【００６３】ここで、上記各材料の特性について説明す
る。例えば、クロロプレンゴムは、中程度の耐油性、耐
熱性があり、耐候、耐オゾン性が良好で一般物理的性質
も良いので、耐油、耐候性を必要とする一般工業用ゴム
製品に広く用いられる。また、ハイパロンは、優れた耐
光、耐オゾン性、耐化学薬品性を有し、良好な耐熱性、
耐油性、電気絶縁性を有する。ニトリルゴムは、良好な
耐油性を有する。エチレンプロピレンゴムは、耐オゾン
性、耐化学薬品性、耐熱性、電気絶縁性に優れている。Here, the characteristics of the above materials will be described. For example, chloroprene rubber has moderate oil resistance, heat resistance, good weather resistance, ozone resistance, and good general physical properties, so it is widely used for general industrial rubber products that require oil resistance and weather resistance. . In addition, Hypalon has excellent light resistance, ozone resistance, chemical resistance, good heat resistance,
Has oil resistance and electrical insulation. Nitrile rubber has good oil resistance. Ethylene propylene rubber has excellent ozone resistance, chemical resistance, heat resistance, and electrical insulation.
【００６４】さらに、ブチルゴムは、耐候性、耐オゾン
性、耐化学薬品性、耐熱性、電気絶縁性に優れ、ガス透
過性が少ない。また、反発弾性が低く、衝撃に対するエ
ネルギーの吸収が大きいので、衝撃吸収材として好適で
ある。ウレタンゴムは、耐摩耗性、耐油性、耐オゾン性
に優れ、引張り強さが大きい。シリコーンゴムは、耐熱
性が良好。耐寒性が良好。引張り強さが大きい。フッ素
ゴムは、耐熱性、耐油性、耐溶剤、耐化学薬品性に優れ
ている。天然ゴムは、良好な耐摩耗性を有し、引張り強
さ及び反発弾性が大きい。Further, butyl rubber is excellent in weather resistance, ozone resistance, chemical resistance, heat resistance, electric insulation and has little gas permeability. Further, since it has a low impact resilience and absorbs a large amount of energy against impact, it is suitable as a shock absorbing material. Urethane rubber has excellent wear resistance, oil resistance, ozone resistance, and high tensile strength. Silicone rubber has good heat resistance. Good cold resistance. High tensile strength. Fluorine rubber has excellent heat resistance, oil resistance, solvent resistance, and chemical resistance. Natural rubber has good wear resistance and high tensile strength and impact resilience.
【００６５】これらの材料は、比較的成形性が良好で量
産性に優れ、ディンプルの形成が容易となり、本発明に
係る基板支持装置の支持部材４９Ａ，４９Ｂに好適に使
用できる材料である。また、一般的に、エントロピ弾性
を示す材料は粘弾性を有するので、良好な制振効果を得
ることができる。従って、上記した以外の材料でも、エ
ントロピ弾性を示す材料であれば本発明に利用可能であ
る。These materials have relatively good moldability and excellent mass productivity, facilitate the formation of dimples, and can be suitably used for the supporting members 49A and 49B of the substrate supporting apparatus according to the present invention. Further, in general, a material exhibiting entropy elasticity has viscoelasticity, so that a good vibration damping effect can be obtained. Therefore, materials other than those mentioned above can be used in the present invention as long as they exhibit entropy elasticity.
【００６６】次に、本実施形態の基板支持装置の変形例
を説明する。図９は本実施形態の基板支持装置の変形例
による支持部材を示す斜視図、図１０は図９のＤ−Ｄ断
面図である。この基板支持部材６ｂでは、基板支持部材
６ｂの上面５９に、弾性材料からなるリング状の支持部
材５５が複数設けられている。この支持部材５５は、マ
トリクス状に配列され、実質的に中央部に凹部５６ｂが
形成されている。具体的には、例えば多数のＯリング５
６、或いは弾性材料からなる平ワッシャ等を利用するこ
とができる。このようなリング状の支持部材５５を備え
ることにより、簡単で低コストな構成でありながらディ
ンプルを設けた場合と同様の効果を得ることができる。Next, a modified example of the substrate supporting apparatus of this embodiment will be described. 9 is a perspective view showing a supporting member according to a modified example of the substrate supporting apparatus of the present embodiment, and FIG. 10 is a sectional view taken along line D-D of FIG. 9. In this substrate support member 6b, a plurality of ring-shaped support members 55 made of an elastic material are provided on the upper surface 59 of the substrate support member 6b. The support members 55 are arranged in a matrix, and a recess 56b is formed substantially in the center. Specifically, for example, a large number of O-rings 5
6, or a flat washer made of an elastic material or the like can be used. By providing such a ring-shaped support member 55, it is possible to obtain the same effect as when the dimples are provided, although the structure is simple and low in cost.
【００６７】次に、本発明に係る基板支持装置の第２実
施形態を説明する。図１１（ａ），（ｂ）は、本発明に
係る第２実施形態の基板支持装置における基板支持部材
６ａ，６ｂをそれぞれ示す斜視図である。同図におい
て、前述の第１実施形態における支持部材（図５及び図
６、７参照）と相違する点は、基板支持部材６ａ，６ｂ
の上部に設けられた支持部材６１Ａ，６１Ｂが、それぞ
れエントロピ弾性を呈する前述した弾性材料を発泡化し
た材料、或いは発泡樹脂材料等の発泡化材料からなる点
である。なお、この発泡樹脂材料としては、発泡ポリエ
チレン、発泡ポリスチレン、フェノール発泡樹脂等が挙
げられる。Next, a second embodiment of the substrate supporting device according to the present invention will be described. 11A and 11B are perspective views showing the substrate support members 6a and 6b in the substrate support device according to the second embodiment of the present invention, respectively. In the figure, the difference from the support member (see FIGS. 5 and 6 and 7) in the first embodiment is that the substrate support members 6a and 6b are different.
The support members 61A and 61B provided on the upper part of the above are each made of a foamed material such as a foamed resin material or a foamed material of the above elastic material exhibiting entropy elasticity. Examples of the foam resin material include foam polyethylene, foam polystyrene, and phenol foam resin.
【００６８】発泡化材料は、材料内部に発泡のための微
細な空間が存在し、これらの微細空間が互いに連通し合
って、微細な連通孔を形成するようになる。従って、発
泡化材料を押し潰した際には、材料内部に存在する微細
空間内の気体が連通孔を通じて材料の外へ押し出されて
縮むようになる。反対に、縮んだ状態から押し潰し力を
開放すると、連通孔を通じて材料内部の微細空間に気体
が導入され、元の形状に膨らみながら弾性復元する。The foamed material has fine spaces for foaming inside the material, and these fine spaces communicate with each other to form fine communication holes. Therefore, when the foamed material is crushed, the gas in the fine space existing inside the material is pushed out of the material through the communication hole and shrinks. On the contrary, when the crushing force is released from the contracted state, the gas is introduced into the fine space inside the material through the communication hole, and elastically restores while expanding to the original shape.
【００６９】このような発泡化材料からなる支持部材６
１Ａ、６１Ｂを備えた基板支持装置によれば、次のよう
な作用効果を奏する。図８（ｂ）に示すように、電子部
品５の実装後に吸着ノズル８を上方に離間すると、押し
付けられていた力から解放された回路基板１が自身の弾
性によって復元しようとし、電子部品５が載置された実
装面及びその近傍に、急激に跳ね上がろうとする力が働
く。このとき、本実施形態の支持部材６１Ａ，６１Ｂが
発泡性材料からなり通気性を有するため、吸着ノズル８
により押下されて発泡性材料内部から空気を吐出して変
形していた状態から、解放によって一気に空気を吸引し
て形状を復元しようとする。この吸引が吸盤効果となっ
て、回路基板１の下面を吸着するので、回路基板１が急
激に跳ね上がろうとする力が抑止される。Support member 6 made of such a foamed material
According to the substrate support device including 1A and 61B, the following operational effects are obtained. As shown in FIG. 8B, when the suction nozzle 8 is separated upward after the electronic component 5 is mounted, the circuit board 1 released from the pressing force tries to restore by its own elasticity, and the electronic component 5 is released. A force that suddenly jumps up acts on the mounted surface and its vicinity. At this time, since the support members 61A and 61B of the present embodiment are made of a foam material and have air permeability, the suction nozzle 8
From the state in which the foamed material is pressed and deformed by ejecting air from inside, it tries to restore the shape by suddenly sucking air by releasing. This suction serves as a suction cup effect and sucks the lower surface of the circuit board 1, so that the force with which the circuit board 1 suddenly jumps up is suppressed.
【００７０】上記のように、支持部材６１Ａ，６１Ｂの
弾性復元には、空気流が必要であり、その速さは流路抵
抗の大きさによって決まる。発泡性材料は、回路基板１
に接触した上面が閉塞された状態となるので、図１１
（ａ）及び（ｂ）に示すように、支持部材６１Ａ，６１
Ｂの側面積Ｓ2が小さいほど流路抵抗が大きくなる。つ
まり、支持部材６１Ａ、６１Ｂの形状が、側面積Ｓ2が
上面積Ｓ1に比べて小さくなるほど流路抵抗が大きくな
り、復元に要する時間が長くなる。As described above, the air flow is required for elastic restoration of the support members 61A and 61B, and the speed thereof is determined by the magnitude of the flow path resistance. Foamable material is circuit board 1
Since the upper surface in contact with is closed, as shown in FIG.
As shown in (a) and (b), the supporting members 61A, 61
The smaller the side area S 2 of B, the larger the flow path resistance. That is, in the shapes of the supporting members 61A and 61B, the flow path resistance increases as the side area S 2 becomes smaller than the upper area S 1 , and the time required for restoration becomes longer.
【００７１】本出願人らは、上面積Ｓ1が側面積Ｓ2の２
倍以上になると、流路抵抗が小さくなって吸盤効果が増
大することを実験で確かめ、Ｓ1≧２Ｓ2が必要な条件で
あると確認した。この条件を満たすように支持部材６１
Ａ，６１Ｂの形状を設定することにより、回路基板１の
急激な復元動作をより有効に抑えることが可能になる。
なお、この方式でも、回路基板１を長時間吸着し続ける
ことはできないが、上述したように、装着タクトが０．
１秒程度の部品実装装置の場合に０．１秒間吸着できれ
ば良く、従って、実用上問題になることはない。The Applicants have found that the upper area S 1 has a side area S 2 of 2
It was confirmed by an experiment that the flow path resistance becomes smaller and the suction cup effect increases when it becomes more than twice, and it was confirmed that S 1 ≧ 2S 2 is a necessary condition. Support member 61 so as to satisfy this condition
By setting the shapes of A and 61B, it becomes possible to more effectively suppress the rapid restoration operation of the circuit board 1.
Even with this method, the circuit board 1 cannot be adsorbed continuously for a long time, but as described above, the mounting takt time is 0.
In the case of a component mounting apparatus for about 1 second, it is sufficient if it can be adsorbed for 0.1 second, so that there is no practical problem.
【００７２】次に、支持部材６１Ａ、６１Ｂの材料とし
て、粘弾性材料を用いた変形例について説明する。この
変形例では、基板支持部材６ａ，６ｂ上の支持部材が、
上面に凹部５６ｂを持たず、また発泡化処理等が施され
ない粘弾性材料からなる。つまり、粘着性（密着性）と
弾性とを自身に兼ね備えた材料を、比較的剛性の高い材
料からなる基板支持部材６ａ，６ｂの上に設けると、凹
部５６ｂを形成したり発泡化させたりしなくても、十分
な粘着保持力が働くようになる。従って、電子部品装着
時に撓む回路基板１を弾性により支持する効果と、回路
基板１の跳ね上がりを抑えて振動を抑制する粘着効果が
同時に得られることになる。なお、粘着性の強さは、回
路基板１が自重で撓む量に加えて０．０１ｍｍから０．
０５ｍｍ程度撓んだ時に外れる程度の強さで良く、密着
性については、０．１秒程度の密着時間があれば良い。Next, a modified example using a viscoelastic material as the material of the support members 61A and 61B will be described. In this modification, the support members on the substrate support members 6a and 6b are
It is made of a viscoelastic material that has no recess 56b on its upper surface and is not subjected to foaming treatment or the like. That is, when a material having both adhesiveness (adhesion) and elasticity is provided on the substrate supporting members 6a and 6b made of a material having relatively high rigidity, the recess 56b is formed or foamed. Even without it, a sufficient adhesive holding force comes to work. Therefore, the effect of elastically supporting the circuit board 1 which is bent when the electronic component is mounted and the adhesive effect of suppressing the jump of the circuit board 1 and suppressing the vibration can be obtained at the same time. The adhesive strength is 0.01 mm to 0. 0 in addition to the amount by which the circuit board 1 bends under its own weight.
The strength is such that it will come off when it is bent by about 05 mm, and the adhesion may be about 0.1 seconds.
【００７３】また、基板支持部材６ａ，６ｂ上の支持部
材として、シリコーン変性ポリマーを主成分とした材
料、ヒアルロン酸又はその変性ポリマーを主成分とした
材料、コラーゲン又はその変性ポリマーを主成分とした
材料、コラーゲンを含んだ代表的材料である動物の皮
革、ビニル樹脂を主成分とした材料やその他の軟質樹脂
材料等を使用することもできる。特に動物の皮革には、
ウレタン塗料を塗布した厚さ１ｍｍ以下のものが好まし
い。これら各材料を用いる場合には、支持部材に、粘着
性（密着性）と弾性とを合わせ持たせることができるの
で、上面に凹部を形成したり材料を発泡化したりしなく
ても、基板支持部材６ａ，６ｂ上に貼り合わせるだけ
で、上述した各支持部材と同様の効果を得ることができ
る。なお、ビニル樹脂を主成分とした材料やその他の軟
質樹脂材料は、繰り返し荷重や磨耗に対して寿命が短く
なる傾向があるが、その部分を張り替えることで、常
時、新しい表面を使用する構成にできる。As the supporting members on the substrate supporting members 6a and 6b, a material containing silicone modified polymer as a main component, a material containing hyaluronic acid or its modified polymer as a main component, and collagen or its modified polymer as a main component. Materials, animal leather, which is a typical material containing collagen, materials containing vinyl resin as a main component, and other soft resin materials can also be used. Especially for animal leather,
A urethane coating having a thickness of 1 mm or less is preferable. When each of these materials is used, the support member can have both adhesiveness (adhesion) and elasticity, so that it is possible to support the substrate without forming a recess in the upper surface or foaming the material. The same effect as that of each of the above-mentioned supporting members can be obtained simply by bonding the members on the members 6a and 6b. It should be noted that vinyl resin-based materials and other soft resin materials tend to have a shorter life with repeated loads and wear, but by replacing that part, a new surface is always used. You can
【００７４】以上説明した種々の材料を支持部材に使用
した基板支持装置では、エントロピ弾性を示す弾性材
料、発泡性材料、粘弾性材料、そして、ディンプルやリ
ング状の凹部形状等を用途に応じて選択的に適用するこ
とにより、材料や形状の特性を活かした種々の支持部材
を得ることができる。In the substrate supporting device using the various materials described above as the supporting member, an elastic material exhibiting entropy elasticity, a foamable material, a viscoelastic material, and a dimple or ring-shaped recessed shape or the like are used depending on the application. By selectively applying it, various supporting members that take advantage of the characteristics of materials and shapes can be obtained.
【００７５】[0075]
【発明の効果】以上のように本発明に係る基板支持方法
及び装置によれば、電子部品の実装時に回路基板等の基
板に発生する振動をより有効に抑えることができる。ま
た、本発明に係る部品実装装置によれば、吸着ノズルに
より吸着保持した部品を基板の所定位置に押し付けた
後、基板を解放する際に生じる跳ね上がりを支持部材に
よって抑え、電子部品の実装時に基板に発生する振動を
より有効に抑制しつつ、実装工程を確実に進めることが
できる。As described above, according to the board supporting method and apparatus of the present invention, it is possible to more effectively suppress the vibration generated on the board such as the circuit board when the electronic component is mounted. Further, according to the component mounting apparatus of the present invention, after pushing the component sucked and held by the suction nozzle to a predetermined position on the substrate, the support member suppresses the jumping up that occurs when the substrate is released, and the substrate is mounted when the electronic component is mounted. It is possible to reliably proceed with the mounting process while more effectively suppressing the vibration that occurs in the.
【図１】本発明に係る基板支持装置を備えた部品実装装
置を示す外観図である。FIG. 1 is an external view showing a component mounting apparatus including a substrate supporting device according to the present invention.
【図２】部品実装装置の部品実装機構の概略構成を示す
断面図である。FIG. 2 is a sectional view showing a schematic configuration of a component mounting mechanism of the component mounting apparatus.
【図３】ロータリーヘッドの動作を説明するためのロー
タリーヘッドの概略上視図である。FIG. 3 is a schematic top view of the rotary head for explaining the operation of the rotary head.
【図４】図３に示すＸＹテーブルのＡ−Ａ断面図であ
る。4 is a cross-sectional view taken along the line AA of the XY table shown in FIG.
【図５】ピン型の基板支持部材の上部拡大図で、（ａ）
は基板支持部材の上面に設けられた支持部材の平面図、
（ｂ）は（ａ）のＢ−Ｂ断面図である。FIG. 5 is an enlarged view of the upper part of the pin-type substrate supporting member, (a)
Is a plan view of the support member provided on the upper surface of the substrate support member,
(B) is a BB sectional view of (a).
【図６】ブロック型の基板支持部材の上面に設けられた
支持部材を示す斜視図である。FIG. 6 is a perspective view showing a support member provided on the upper surface of a block-type substrate support member.
【図７】図６のＣ−Ｃ断面図である。FIG. 7 is a sectional view taken along line CC of FIG.
【図８】本発明に係る第１実施形態の基板支持装置の動
作を示す説明図である。FIG. 8 is an explanatory diagram showing an operation of the substrate supporting apparatus according to the first embodiment of the present invention.
【図９】第１実施形態の基板支持装置の変形例による支
持部材を示す斜視図である。FIG. 9 is a perspective view showing a support member according to a modified example of the substrate support device of the first embodiment.
【図１０】図９のＤ−Ｄ断面図である。10 is a cross-sectional view taken along the line DD of FIG.
【図１１】本発明に係る第２実施形態の基板支持装置に
おける基板支持部材をそれぞれ示す斜視図である。FIG. 11 is a perspective view showing a substrate support member in a substrate support device according to a second embodiment of the present invention.
【図１２】従来の制振ゴムを用いた基板支持方法の一例
を説明するための断面図である。FIG. 12 is a cross-sectional view for explaining an example of a substrate supporting method using a conventional damping rubber.
【図１３】従来の基板支持方法による問題点を説明する
ための断面図である。FIG. 13 is a cross-sectional view illustrating a problem with a conventional substrate supporting method.
１ 回路基板 ２ 固定ガイド ３ 鍔部 ４ 可動ガイド ５ 電子部品 ６ａ，６ｂ 基板支持部材 ７ サポートプレート ８ 吸着ノズル １０ 部品供給部 １４ ＸＹテーブル（基板支持装置） ２６ 装着ヘッド ４６ 固定プレート ４８ エアーシリンダ ４８ａ ピストンロッド ４９Ａ，４９Ｂ 支持部材 ５０ ディンプル（凹部） ５５ 支持部材 ５６ Ｏリング ５６ｂ 凹部 ６１Ａ，６１Ｂ 支持部材 １００ 電子部品実装装置 Ｓ1 上面積 Ｓ2 側面積1 Circuit Board 2 Fixed Guide 3 Collar 4 Movable Guide 5 Electronic Components 6a, 6b Board Support Member 7 Support Plate 8 Suction Nozzle 10 Component Supply Section 14 XY Table (Board Support Device) 26 Mounting Head 46 Fixed Plate 48 Air Cylinder 48a Piston Rod 49A, 49B Support member 50 Dimple (recess) 55 Support member 56 O-ring 56b Recess 61A, 61B Support member 100 Electronic component mounting device S 1 Upper area S 2 Side area
フロントページの続き (72)発明者 酒井 一信 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5E313 AA02 AA11 AA15 CC03 DD13 EE24 EE25 FF24 FF29 FG05 5F044 KK02 LL01 PP15 Continued front page (72) Inventor Kazunobu Sakai 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd. F term (reference) 5E313 AA02 AA11 AA15 CC03 DD13 EE24 EE25 FF24 FF29 FG05 5F044 KK02 LL01 PP15
Claims (9)
その下方から支持する基板支持方法であって、 柔軟な弾性材料からなり上面に凹部を有する支持部材
を、前記基板の下面の一部に押圧させることによって前
記基板を吸着支持することを特徴とする基板支持方法。1. A substrate supporting method for holding both ends of a substrate and supporting the substrate from below, wherein a supporting member made of a flexible elastic material and having a recess on the upper surface is provided on one side of the lower surface of the substrate. A substrate supporting method, wherein the substrate is sucked and supported by being pressed against a portion.
その下方から支持する基板支持方法であって、 粘弾性材料からなる支持部材を、前記基板の下面の一部
に押圧させることによって前記基板を粘着支持すること
を特徴とする基板支持方法。2. A substrate supporting method for sandwiching both ends of a substrate and supporting the substrate from below, wherein a supporting member made of a viscoelastic material is pressed against a part of the lower surface of the substrate. A method of supporting a substrate, which comprises adhesively supporting the substrate.
その下方から支持する基板支持装置であって、 柔軟な弾性材料からなり上面に凹部を有する支持部材
と、 前記支持部材を前記基板の下方から該基板の下面との接
触位置に上昇させる昇降手段と、を備えたことを特徴と
する基板支持装置。3. A substrate supporting device for sandwiching both ends of a substrate and supporting the substrate from below, comprising: a supporting member made of a flexible elastic material and having a concave portion on its upper surface; And a means for raising and lowering the substrate from below to a contact position with the lower surface of the substrate.
を示す材料であることを特徴とする請求項３記載の基板
支持装置。4. The substrate supporting apparatus according to claim 3, wherein the flexible elastic material is a material exhibiting entropy elasticity.
その下方から支持する基板支持装置であって、 粘弾性材料からなる支持部材と、 前記支持部材を前記基板の下方から該基板の下面との接
触位置に上昇させる昇降手段と、を備えたことを特徴と
する基板支持装置5. A substrate supporting device for sandwiching both ends of a substrate and supporting the substrate from below, comprising: a supporting member made of a viscoelastic material; and the supporting member from below the substrate. A substrate supporting device comprising: an elevating means for elevating to a contact position with the lower surface.
す材料を発泡化した材料又は発泡樹脂材料からなること
を特徴とする請求項５記載の基板支持装置。6. The substrate supporting apparatus according to claim 5, wherein the viscoelastic material is a material obtained by foaming a material exhibiting entropy elasticity or a foamed resin material.
積の２倍以上となる形状を有することを特徴とする請求
項６記載の基板支持装置。7. The substrate supporting apparatus according to claim 6, wherein the supporting member has a shape in which the area of the upper surface is twice or more the area of the side surface.
ロプレンゴム、ハイパロン、ニトリルゴム、エチレンプ
ロピレンゴム、ブチルゴム、ウレタンゴム、シリコーン
ゴム、フッ素ゴム、天然ゴム、又はこれらの混合物を主
成分とする材料のいずれかであることを特徴とする請求
項４又は請求項６記載の基板支持装置。8. The material exhibiting entropy elasticity is a material containing chloroprene rubber, hypalon, nitrile rubber, ethylene propylene rubber, butyl rubber, urethane rubber, silicone rubber, fluororubber, natural rubber, or a mixture thereof as a main component. 7. The substrate support device according to claim 4, wherein the substrate support device is any one of the above.
送し、基板上の所定位置に前記部品を実装する部品実装
装置であって、 請求項３〜請求項８のいずれか１項記載の基板支持装置
を備え、 前記吸着ノズルにより吸着保持した部品を、前記基板支
持装置に支持された基板上に押し当てて該基板上へ実装
することを特徴とする部品実装装置。9. A board according to claim 3, wherein the board is mounted on a board by suction and holding the board by a suction nozzle, and the board is mounted at a predetermined position on the board. A component mounting apparatus comprising: a supporting device, wherein a component suction-held by the suction nozzle is pressed against a substrate supported by the substrate supporting device to be mounted on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001375963A JP4037097B2 (en) | 2001-12-10 | 2001-12-10 | Substrate support device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001375963A JP4037097B2 (en) | 2001-12-10 | 2001-12-10 | Substrate support device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003179396A true JP2003179396A (en) | 2003-06-27 |
| JP4037097B2 JP4037097B2 (en) | 2008-01-23 |
Family
ID=19184249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001375963A Expired - Fee Related JP4037097B2 (en) | 2001-12-10 | 2001-12-10 | Substrate support device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4037097B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245429A (en) * | 2005-03-04 | 2006-09-14 | Inoac Corp | Mounting jig of printed wiring substrate and adhesive used for it |
| KR101164593B1 (en) * | 2006-10-13 | 2012-07-11 | 주식회사 휘닉스 디지탈테크 | Fixing apparatus for printed circuit board and printing method of PCB |
| JP2017069312A (en) * | 2015-09-29 | 2017-04-06 | 富士機械製造株式会社 | Substrate support device |
| KR101843839B1 (en) * | 2017-11-23 | 2018-03-30 | 주식회사 큐엠텍 | Apparatus for supporting a pcb |
| CN108788376A (en) * | 2018-09-05 | 2018-11-13 | 贵州新蒲几米电子科技有限公司 | A kind of circuit board clamp |
| CN117693181A (en) * | 2023-12-07 | 2024-03-12 | 联测优特半导体(东莞)有限公司 | Self-calibration SMT chip mounter and chip mounting process |
-
2001
- 2001-12-10 JP JP2001375963A patent/JP4037097B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245429A (en) * | 2005-03-04 | 2006-09-14 | Inoac Corp | Mounting jig of printed wiring substrate and adhesive used for it |
| KR101164593B1 (en) * | 2006-10-13 | 2012-07-11 | 주식회사 휘닉스 디지탈테크 | Fixing apparatus for printed circuit board and printing method of PCB |
| JP2017069312A (en) * | 2015-09-29 | 2017-04-06 | 富士機械製造株式会社 | Substrate support device |
| KR101843839B1 (en) * | 2017-11-23 | 2018-03-30 | 주식회사 큐엠텍 | Apparatus for supporting a pcb |
| CN108788376A (en) * | 2018-09-05 | 2018-11-13 | 贵州新蒲几米电子科技有限公司 | A kind of circuit board clamp |
| CN117693181A (en) * | 2023-12-07 | 2024-03-12 | 联测优特半导体(东莞)有限公司 | Self-calibration SMT chip mounter and chip mounting process |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4037097B2 (en) | 2008-01-23 |
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