JP2003163423A - Electronic circuit board - Google Patents

Electronic circuit board

Info

Publication number
JP2003163423A
JP2003163423A JP2001360365A JP2001360365A JP2003163423A JP 2003163423 A JP2003163423 A JP 2003163423A JP 2001360365 A JP2001360365 A JP 2001360365A JP 2001360365 A JP2001360365 A JP 2001360365A JP 2003163423 A JP2003163423 A JP 2003163423A
Authority
JP
Japan
Prior art keywords
component
circuit board
electronic circuit
destination
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001360365A
Other languages
Japanese (ja)
Other versions
JP3893272B2 (en
Inventor
Yutaka Kurita
豊 栗田
Hiromasa Hino
浩正 日野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kenwood KK
Original Assignee
Kenwood KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kenwood KK filed Critical Kenwood KK
Priority to JP2001360365A priority Critical patent/JP3893272B2/en
Publication of JP2003163423A publication Critical patent/JP2003163423A/en
Application granted granted Critical
Publication of JP3893272B2 publication Critical patent/JP3893272B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit board in which whether a component is mounted correctly so as to correspond to each destination can be inspected at a glance by observing only an electronic circuit component single body. <P>SOLUTION: Directions of component discrimination numbers 2a, 2b, 2d, 3a, 4c printed near places in which respective components 2, 3, 4 are mounted are made different according to the destination of each component. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は電子回路基板に係
わり、特に、各仕向けについての部品の検査が簡単に行
える電子回路基板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board, and more particularly to an electronic circuit board that allows easy inspection of parts for each destination.

【0002】[0002]

【従来の技術】共通の基板基体を複数の仕向けに用い、
各仕向けを識別するための識別部品を実装する電子回路
基板が特許第2670379号に提案されている。この
電子回路基板ではその仕向けは識別部品を見て判別する
ことができるが、各々の部品がその仕向け通りに正しく
実装されているか否かを検査するときは部品表と電子回
路基板の各部品とを対応させて検査しなければならず検
査に膨大な工数が掛かる上に、部品表との対応に見間違
いも発生しやすいという問題があった。
2. Description of the Related Art A common substrate substrate is used for a plurality of purposes,
An electronic circuit board on which an identification component for identifying each destination is mounted is proposed in Japanese Patent No. 2670379. In this electronic circuit board, the destination can be identified by looking at the identification component, but when inspecting whether each component is correctly mounted according to the destination, it is necessary to check the component table and each component of the electronic circuit substrate. There is a problem in that the inspection must be performed in correspondence with each other, which requires an enormous number of man-hours for the inspection, and mistakes are likely to occur in correspondence with the parts list.

【0003】[0003]

【発明が解決しようとする課題】この発明は上記した点
に鑑みてなされたものであって、その目的とするところ
は、電子回路部品単体を見るだけで、各仕向けに対応し
て正しく部品が実装されているか否かの検査が一目で行
える電子回路基板を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned points, and an object of the present invention is to just look at an electronic circuit component unit to find a correct component for each destination. An object of the present invention is to provide an electronic circuit board that can be checked at a glance whether it is mounted or not.

【0004】[0004]

【課題を解決するための手段】この発明の電子回路基板
は、各部品が実装される場所の近傍に印字される部品識
別番号の向きを各部品の仕向け別に異ならせたものであ
る。
In the electronic circuit board of the present invention, the orientation of the component identification number printed near the location where each component is mounted is made different depending on the destination of each component.

【0005】また、この発明の電子回路基板は、各部品
が実装される場所の近傍に印刷される向きを有する記号
の向きを仕向け別に異ならせたものである。
Further, in the electronic circuit board of the present invention, the orientation of the symbol having the orientation printed near the place where each component is mounted is different for each destination.

【0006】また、前記電子回路基板において、全仕向
けの部品については前記記号を印刷しないものである。
Further, in the electronic circuit board, the symbols are not printed for parts for all purposes.

【0007】また、この発明の電子回路基板は、各部品
が実装される場所の近傍に中心部から放射状に複数の表
示部を有する導体パターンを設け、前記表示部を各部品
の仕向けに対応させ、仕向けに対応しない表示部をレジ
ストで覆い、レジストで覆われていない表示部に半田を
盛ったものである。
Further, the electronic circuit board of the present invention is provided with a conductor pattern having a plurality of display portions radially from the center in the vicinity of the place where each component is mounted, and the display portion is adapted to the destination of each component. The display part which does not correspond to the destination is covered with a resist, and the display part which is not covered with the resist is filled with solder.

【0008】[0008]

【発明の実施の形態】この発明の実施例である電子回路
基を図面に基づいて説明する。図1はこの発明の第1の
実施例である電子回路基板を示す平面図である。この例
ではプリント基板基体1がA、B、CおよびDの仕向け
に用いられる。
BEST MODE FOR CARRYING OUT THE INVENTION An electronic circuit board which is an embodiment of the present invention will be described with reference to the drawings. 1 is a plan view showing an electronic circuit board according to a first embodiment of the present invention. In this example, the printed circuit board substrate 1 is used for A, B, C and D finishes.

【0009】そして、A仕向けには部品識別番号2a
(R10)および部品識別番号3a(R150)が右向
き(頭が右向き)に印字されている。またB仕向けには
部品識別番号2b(R10)が上向きに印字されてい
る。また、C仕向けには部品識別番号2c(R10)お
よび4cが左向きに印字されている。さらに、D仕向け
には部品識別番号2d(R10)が下向きに印字されて
いる。
Then, for the A destination, the part identification number 2a
(R10) and component identification number 3a (R150) are printed rightward (head facing right). Further, for the B destination, the component identification number 2b (R10) is printed upward. Further, for the C destination, the component identification numbers 2c (R10) and 4c are printed leftward. Further, the part identification number 2d (R10) is printed downward for the D destination.

【0010】このように印字された部品識別番号の向き
を見るだけでその場所に実装された部品と仕向けの対応
が分かる。すなわち、部品3はA仕向けであり、部品2
は全仕向けであり、部品4はC仕向けである。
By looking at the direction of the component identification number printed in this way, the correspondence between the component mounted at that location and the destination can be known. That is, the part 3 is for the A destination, and the part 2 is
Is for all products and part 4 is for C products.

【0011】図2はこの発明の第2の実施例である電子
回路基板を示す平面図である。この例ではプリント基板
基体5が日本仕向け、米国仕向け等4つの仕向けに用い
られる。そして、日本仕向けには部品識別番号6a(R
123)が印字され、さらに上向きの記号6b(三角形
の底辺が下向き)が印刷されている。また、米国仕向け
には部品識別番号7a(R124)が印字され、さらに
記号7b(三角形の底辺が右向き)が印刷されている。
また、全仕向けに部品識別番号8a(R125)が印字
され、さらに4方向の三角形の記号8b印刷されてい
る。
FIG. 2 is a plan view showing an electronic circuit board according to a second embodiment of the present invention. In this example, the printed circuit board substrate 5 is used for four purposes such as Japan and US. And for Japan, the part identification number 6a (R
123) is printed, and the upward facing symbol 6b (the bottom of the triangle faces downward) is printed. Further, for the US destination, the part identification number 7a (R124) is printed, and further, the symbol 7b (the bottom of the triangle faces right) is printed.
A component identification number 8a (R125) is printed for all products, and a four-direction triangular symbol 8b is printed.

【0012】この例では部品識別番号は各部品に同方向
のものが1つだけ印字されているが記号の向きを見るだ
けでその場所に実装された部品と仕向けの対応が分か
る。すなわち、部品6は日本仕向けであり、部品7は米
国仕向けであり、部品8は全仕向けである。このように
部品識別番号を1つだけ印字するだけでよく配置の自由
度が増し、また省スペース化が達成できる。
In this example, only one component identification number is printed for each component in the same direction, but the correspondence between the component mounted at that location and the destination can be known only by looking at the direction of the symbol. That is, part 6 is for Japan, part 7 is for US, and part 8 is for all. In this way, it is sufficient to print only one part identification number, the degree of freedom in arrangement is increased, and space saving can be achieved.

【0013】図3はこの発明の第3の実施例である電子
回路基板を示す平面図である。この例ではプリント基板
基体9が日本仕向け、米国仕向け等4つの仕向けに用い
られる。そして、日本仕向けには部品識別番10a(R
123)および部品識別番14a(R127)が印字さ
れ、さらに上向きの記号10b(三角形の黒塗りの底辺
が下向き)および14bが印刷されている。記号14b
は部品識別番14aの横のスペースがないので部品識別
番14aから離れた場所に印刷され線で対応が表示され
ている。
FIG. 3 is a plan view showing an electronic circuit board according to a third embodiment of the present invention. In this example, the printed circuit board substrate 9 is used for four purposes such as Japan and US. And for Japan, the part identification number 10a (R
123) and the part identification number 14a (R127) are printed, and the upward symbols 10b (the bottom of the black triangle is downward) and 14b are printed. Symbol 14b
Since there is no space beside the component identification number 14a, is printed at a place away from the component identification number 14a and the correspondence is displayed by lines.

【0014】また、米国仕向けおよび日本仕向けは部品
識別番号11aが印字され、さらに記号11b(三角形
の黒塗りの底辺が右向きのものと下向きのものを含む)
が印刷されている。
The parts identification number 11a is printed for the US and Japan shipments, and the symbol 11b (including the ones with the black base of the triangle facing right and the bottom).
Is printed.

【0015】この右向きの三角形は米国仕向けを表し、
下向きの三角形は日本仕向けを表している。また、全仕
向けに部品識別番号12aおよび部品識別番号13aが
印字され、さらに部品識別番号12aの横には4方向の
三角形の記号12bが印刷されている。部品識別番号1
3aは全仕向けのものであり、この場合は記号を印刷し
なくても全仕向けと判断できる。
This right-pointing triangle represents the United States destination,
The downward triangle represents Japan. Further, a part identification number 12a and a part identification number 13a are printed for all products, and a four-direction triangular symbol 12b is printed next to the part identification number 12a. Part identification number 1
3a is for all purposes, and in this case, it can be determined that it is for all purposes without printing the symbol.

【0016】この例では部品識別番号は各部品に同方向
のものが1つだけ印字されているが記号の向きを見るだ
けでその場所に実装された部品と仕向けの対応が分か
る。すなわち、部品10および14は日本仕向けであ
り、部品11は米国仕向けおよび日本仕向けであり、部
品12および13は全仕向けである。このように部品識
別番号を1つだけ印字するだけでよく配置の自由度が増
し、また省スペース化が達成できる。この例では三角形
の底辺が黒塗りされているので見分けやすい。
In this example, only one component identification number is printed for each component in the same direction, but the correspondence between the component mounted at that location and the destination can be known only by looking at the direction of the symbol. That is, parts 10 and 14 are for Japan, part 11 is for US and Japan, and parts 12 and 13 are for all. In this way, it is sufficient to print only one part identification number, the degree of freedom in arrangement is increased, and space saving can be achieved. In this example, since the base of the triangle is painted black, it is easy to identify.

【0017】図4はこの発明の第4の実施例である電子
回路基板を示す平面図である。この例ではプリント基板
基体15が日本仕向け、米国仕向け、中国仕向け、およ
び欧州仕向けの4つの仕向けに用いられる。そして、第
4の実施例と同様に黒塗りの底辺の三角形の記号で仕向
けを表示している。すなわち、黒塗りの三角形の下向き
記号16bは日本仕向けであり、黒塗りの三角形の右向
きの記号17bは米国仕向けである。また、黒塗りの三
角形の上向き記号は欧州向けであり、黒塗りの三角形の
左向きの記号は中国向けである。全仕向けの記号18b
は4方向の三角形が印刷されている。
FIG. 4 is a plan view showing an electronic circuit board according to a fourth embodiment of the present invention. In this example, the printed circuit board substrate 15 is used for four destinations, one for Japan, one for the United States, one for China, and one for Europe. Then, as in the case of the fourth embodiment, the destination is indicated by a black triangular base symbol. That is, the black-painted triangle downward symbol 16b is for Japan, and the black-painted triangle downward symbol 16b is for United States. The black triangle pointing up is for Europe, and the black triangle pointing left is for China. Symbol 18b for all products
Is printed with four-sided triangles.

【0018】そして、部品識別番16a、17aおよび
18aは同一の向きに1つだけ印字されている。この例
ではミシン目により欧州、中国、日本および米国と印字
された捨て基板が設けられている。そして、各仕向けの
捨て基板が残され他の捨て基板が除去される。この例で
は捨て基板により各仕向けが容易に断され、各部品1
6、17および18の仕向けは夫々記号16b、17b
および18bで区別できる。
Only one of the component identification numbers 16a, 17a and 18a is printed in the same direction. In this example, perforations are provided with waste substrates printed as Europe, China, Japan and the United States. Then, the discarded substrates for each destination are left and the other discarded substrates are removed. In this example, each destination is easily cut off by the discarded board, and each component 1
Destinations 6, 17 and 18 are symbols 16b and 17b, respectively.
And 18b.

【0019】図5(a)はこの発明の第5の実施例に用
いられる記号を示している。この例では記号は導体パタ
ーン20の三角形の底辺に盛られた半田20aで仕向け
が判断される。すなわち、各仕向けで半田の盛られる部
分をマスクして導体パターン20がレジストで覆われマ
スクされた部分に半田が盛られる。そして、半田の部分
で仕向けが判断できる。この例ではメタルマスクによる
レジスト加工の他に仕向けの記号のためのシルク印刷が
不要であり、製造工程が簡略化され、また、半田は顕著
に見えて区別しやすい。
FIG. 5A shows the symbols used in the fifth embodiment of the present invention. In this example, the symbol is determined by the solder 20a placed on the bottom side of the triangle of the conductor pattern 20. That is, the conductor pattern 20 is covered with a resist by masking the portion on which solder is deposited for each destination, and solder is deposited on the masked portion. Then, the destination can be determined by the solder portion. In this example, in addition to resist processing with a metal mask, silk printing for a symbol for a destination is not required, the manufacturing process is simplified, and the solder is visible and easy to distinguish.

【0020】図5(b)はこの発明の第6の実施例に用
いられる記号を示している。この例では記号は放射状の
導体パターン21の各先端部に第5の実施例と同様に盛
られた半田21aで仕向けが判断される。
FIG. 5B shows the symbols used in the sixth embodiment of the present invention. In this example, the symbol is used to determine the destination by the solder 21a placed on each tip of the radial conductor pattern 21 in the same manner as in the fifth embodiment.

【0021】図5(c)はこの発明の第7の実施例に用
いられる記号を示している。この例では記号は正多角形
の導体パターン22の各先端部に第5の実施例と同様に
盛られた半田22aで仕向けが判断される。
FIG. 5 (c) shows the symbols used in the seventh embodiment of the present invention. In this example, the symbol is determined by the solder 22a placed on each tip of the regular polygonal conductor pattern 22 in the same manner as in the fifth embodiment.

【0022】実施例は以上のように構成されているが発
明はこれに限られず、例えば、記号は三角形、多角形、
放射形に限られず向きが区別できる形状あればよい。
Although the embodiment is configured as described above, the invention is not limited to this. For example, symbols are triangles, polygons,
The shape is not limited to the radial shape, and any shape can be used as long as the directions can be distinguished.

【0023】[0023]

【発明の効果】この発明の電子回路基板によれば、部品
表と照らし合わせなくても各仕向けの部品が正しく実装
されていることを一目で判断でき、検査の工程が大幅に
削減される。
According to the electronic circuit board of the present invention, it is possible to judge at a glance that the components for each destination are correctly mounted without checking the parts table, and the inspection process is greatly reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の第1の実施例である電子回路基板を
示す平面図である。
FIG. 1 is a plan view showing an electronic circuit board that is a first embodiment of the present invention.

【図2】この発明の第2の実施例である電子回路基板を
示す平面図である。
FIG. 2 is a plan view showing an electronic circuit board that is a second embodiment of the present invention.

【図3】この発明の第3の実施例である電子回路基板を
示す平面図である。
FIG. 3 is a plan view showing an electronic circuit board that is a third embodiment of the present invention.

【図4】この発明の第4の実施例である電子回路基板を
示す平面図である。
FIG. 4 is a plan view showing an electronic circuit board that is a fourth embodiment of the present invention.

【図5】図5(a)はこの発明の第5の実施例の電子回
路基板に用いられる導体パターンを示す平面図、図5
(b)はこの発明の第6の実施例の電子回路基板に用い
られる導体パターンを示す平面図、図5(c)はこの発
明の第7の実施例の電子回路基板に用いられる導体パタ
ーンを示す平面図である。
5A is a plan view showing a conductor pattern used in an electronic circuit board according to a fifth embodiment of the present invention, FIG.
FIG. 5B is a plan view showing a conductor pattern used in the electronic circuit board of the sixth embodiment of the present invention, and FIG. 5C shows a conductor pattern used in the electronic circuit board of the seventh embodiment of the present invention. It is a top view shown.

【符号の説明】[Explanation of symbols]

1 プリント基板基体 2 部品、2a、2b、2c、2d 部品識別番号 3 部品、3a 部品識別番号 4 部品、4c 部品識別番号 5 プリント基板基体 6 部品、6a 部品識別番号、6b 記号 7 部品、7a 部品識別番号、7b 記号 8 部品、8a 部品識別番号、8b 記号 9 プリント基板基体 10 部品、10a 部品識別番号、10b 記号 11 部品、11a 部品識別番号、11b 記号 12 部品、12a 部品識別番号、12b 記号 13 部品、13a 部品識別番号 14 部品、14a 部品識別番号、14b 記号 15 プリント基板基体 16 部品、16a 部品識別番号、16b 記号 17 部品、17a 部品識別番号、17b 記号 18 部品、18a 部品識別番号、18b 記号 20 導体パターン、20a 半田 21 導体パターン、21a 半田 22 導体パターン、22a 半田 1 printed circuit board substrate 2 parts, 2a, 2b, 2c, 2d parts identification numbers 3 parts, 3a Part identification number 4 parts, 4c part identification number 5 Printed circuit board substrate 6 parts, 6a part identification number, 6b symbol 7 parts, 7a Part identification number, 7b symbol 8 parts, 8a part identification number, 8b symbol 9 Printed circuit board substrate 10 parts, 10a part identification number, 10b symbol 11 parts, 11a part identification number, 11b symbol 12 parts, 12a part identification number, 12b symbol 13 parts, 13a Part identification number 14 parts, 14a part identification number, 14b symbol 15 Printed circuit board substrate 16 parts, 16a part identification number, 16b symbol 17 parts, 17a Part identification number, 17b symbol 18 parts, 18a part identification number, 18b symbol 20 conductor pattern, 20a solder 21 conductor pattern, 21a solder 22 conductor pattern, 22a solder

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 各部品が実装される場所の近傍に印字さ
れる部品識別番号の向きを各部品の仕向け別に異ならせ
たことを特徴とする電子回路基板。
1. An electronic circuit board, characterized in that the direction of a component identification number printed in the vicinity of the location where each component is mounted is made different depending on the destination of each component.
【請求項2】 各部品が実装される場所の近傍に印刷さ
れる向きを有する記号の向きを仕向け別に異ならせたこ
とを特徴とする電子回路基板。
2. An electronic circuit board, characterized in that the direction of a symbol having a direction printed near the place where each component is mounted is different for each destination.
【請求項3】 全仕向けの部品については前記記号を印
刷しないことを特徴とする請求項2の電子回路基板。
3. The electronic circuit board according to claim 2, wherein the symbol is not printed on all-purpose parts.
【請求項4】 各部品が実装される場所の近傍に中心部
から放射状に複数の表示部を有する導体パターンを設
け、前記表示部を各部品の仕向けに対応させ、仕向けに
対応しない表示部をレジストで覆い、レジストで覆われ
ていない表示部に半田を盛ったことを特徴とする電子回
路基板。
4. A conductor pattern having a plurality of display portions radially from a central portion is provided in the vicinity of a place where each component is mounted, the display portion is adapted to the destination of each component, and the display portion not corresponding to the destination is provided. An electronic circuit board which is covered with a resist and solder is applied to a display portion which is not covered with the resist.
JP2001360365A 2001-11-27 2001-11-27 Electronic circuit board Expired - Fee Related JP3893272B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071413A (en) * 2009-09-28 2011-04-07 Mitsubishi Electric Corp Printed board and air conditioner
JP2021087854A (en) * 2021-03-05 2021-06-10 株式会社三共 Game machine
JP2021087855A (en) * 2021-03-05 2021-06-10 株式会社三共 Game machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071413A (en) * 2009-09-28 2011-04-07 Mitsubishi Electric Corp Printed board and air conditioner
JP2021087854A (en) * 2021-03-05 2021-06-10 株式会社三共 Game machine
JP2021087855A (en) * 2021-03-05 2021-06-10 株式会社三共 Game machine
JP7057848B2 (en) 2021-03-05 2022-04-20 株式会社三共 Pachinko machine
JP7150919B2 (en) 2021-03-05 2022-10-11 株式会社三共 game machine

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