JP2003152301A - Printed wiring board and its manufacturing method - Google Patents
Printed wiring board and its manufacturing methodInfo
- Publication number
- JP2003152301A JP2003152301A JP2001351653A JP2001351653A JP2003152301A JP 2003152301 A JP2003152301 A JP 2003152301A JP 2001351653 A JP2001351653 A JP 2001351653A JP 2001351653 A JP2001351653 A JP 2001351653A JP 2003152301 A JP2003152301 A JP 2003152301A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- wiring board
- printed wiring
- electrode
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、抵抗器を搭載した
プリント配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board equipped with a resistor.
【０００２】[0002]
【従来の技術】図６は、特開平７‐３０７５４２号公報
に開示されたプリント配線板の断面図で、図中７１はベ
ース基板、７２は絶縁層、７３は絶縁材からなるアンダ
ーコート、７４は導体、７５は銀または金ペーストから
なる電極、７６は印刷されて得られる抵抗体で、電極７
５と抵抗体７６により抵抗器を構成する。2. Description of the Related Art FIG. 6 is a sectional view of a printed wiring board disclosed in Japanese Patent Application Laid-Open No. 7-307542, in which 71 is a base substrate, 72 is an insulating layer, 73 is an undercoat made of an insulating material, and 74 is an undercoat. Is a conductor, 75 is an electrode made of silver or gold paste, and 76 is a resistor obtained by printing.
5 and the resistor 76 constitute a resistor.
【０００３】上記従来のプリント配線板の製造方法を以
下に示す。まず、ベース基板７１上の、抵抗体７６を設
ける領域の周囲に絶縁層７２を分離して設ける。次に、
絶縁層７２間に間隙を介して上記絶縁層７２と同じ膜厚
のアンダーコート７３と、絶縁層７２と上記間隙部とに
連続的に導体７４をメッキにより形成し、さらに上記間
隙部の導体７４上にアンダーコート７３と同じ高さにな
るように、銀または金ペーストにより電極７５を形成す
る。以上の工程により抵抗体７６を配設する領域を平坦
とすることができ、アンダーコート７３と電極７５の上
に絶縁層７２と同じ高さに抵抗体７６を形成する。A method of manufacturing the above conventional printed wiring board will be described below. First, the insulating layer 72 is separately provided around the region where the resistor 76 is provided on the base substrate 71. next,
An undercoat 73 having the same thickness as that of the insulating layer 72 is formed between the insulating layers 72 with a gap therebetween, and a conductor 74 is continuously formed on the insulating layer 72 and the gap portion by plating. An electrode 75 is formed of silver or gold paste so as to have the same height as the undercoat 73. Through the above steps, the region where the resistor 76 is provided can be made flat, and the resistor 76 is formed on the undercoat 73 and the electrode 75 at the same height as the insulating layer 72.
【０００４】図６に示されるように、上記プリント配線
板においては、抵抗体の印刷領域とその上層の形成面を
平坦にしているので、抵抗体７６の段差がなくなり、抵
抗体のダレ、ニジミが抑制されるとともに、抵抗体への
応力集中も防止され、安定した抵抗値を得ることができ
る。As shown in FIG. 6, in the above-mentioned printed wiring board, since the printing area of the resistor and the surface on which the upper layer is formed are flat, the step of the resistor 76 is eliminated, and the sagging and bleeding of the resistor occur. Is suppressed, stress concentration on the resistor is prevented, and a stable resistance value can be obtained.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、図６の
ように、抵抗体を段差のない場所に配設したプリント配
線板を製造するためには、上記従来の製造工程に示すよ
うに、アンダーコート７３、導体７４および銀または金
ペーストからなる電極７５を設けることが必要となり、
構造が複雑であるため、製造工程も多く、製造コストも
高価なものとなるという課題があった。また、上記効果
を得るためには、アンダーコート７３、導体７４および
銀または金ペーストからなる電極７５の各膜厚を十分制
御する必要があり、製造が困難であるという課題があっ
た。また、アンダーコート７３、導体７４および電極７
５等、複数材を集成した上に抵抗体７６を配設している
ので、応力が様々な異種材料間の界面で発生し、クラッ
クが発生し、そのクラックにより抵抗体が断線したり、
抵抗値が大幅に変化したりするという課題があった。However, as shown in FIG. 6, in order to manufacture a printed wiring board in which resistors are arranged in a step-free place, as shown in the above conventional manufacturing process, an undercoat is used. 73, a conductor 74 and an electrode 75 made of silver or gold paste need to be provided,
Since the structure is complicated, there are problems that the number of manufacturing steps is large and the manufacturing cost is high. Further, in order to obtain the above effect, it is necessary to sufficiently control the film thickness of each of the undercoat 73, the conductor 74, and the electrode 75 made of silver or gold paste, which causes a problem of difficulty in manufacturing. Also, the undercoat 73, the conductor 74, and the electrode 7
Since the resistor 76 is arranged on a plurality of materials such as No. 5, stress is generated at the interface between various dissimilar materials, a crack is generated, and the crack breaks the resistor,
There was a problem that the resistance value changed significantly.
【０００６】本発明は、かかる課題を解決するためにな
されたものであり、抵抗器を搭載したプリント配線板
で、上記抵抗器の抵抗値が安定し信頼性に優れ、なおか
つ安価であるものを得ること、および上記プリント配線
板を容易に得ることのできる製造方法を提供することを
目的とする。The present invention has been made in order to solve the above problems, and it is a printed wiring board having a resistor mounted thereon, the resistance value of the resistor being stable, excellent in reliability, and inexpensive. It is an object of the present invention to provide a method for producing the printed wiring board and to obtain the printed wiring board easily.
【０００７】[0007]
【課題を解決するための手段】本発明に係る第１のプリ
ント配線板は、底面の平坦な凹部を有する基板本体と、
上記凹部を充填した抵抗体およびこの抵抗体と接続した
少なくとも２個の電極からなる抵抗器とを備えたもので
ある。A first printed wiring board according to the present invention comprises a substrate body having a flat concave portion on the bottom surface,
It is provided with a resistor filling the recess and a resistor having at least two electrodes connected to the resistor.
【０００８】本発明に係る第２のプリント配線板は、上
記第１のプリント配線板において、抵抗体が基板本体の
高さまで充填され、抵抗体が平行平板形状のものであ
る。A second printed wiring board according to the present invention is the first printed wiring board according to the first printed wiring board, wherein the resistors are filled to the height of the substrate body, and the resistors have a parallel plate shape.
【０００９】本発明に係る第３のプリント配線板は、上
記第１または第２のプリント配線板において、電極と抵
抗体との間に、Ｎｉ合金、ＺｎおよびＣｒの少なくとも
一種の材料からなる層を有するものである。A third printed wiring board according to the present invention is the above-mentioned first or second printed wiring board, wherein a layer made of at least one material of Ni alloy, Zn and Cr is provided between the electrode and the resistor. Is to have.
【００１０】本発明に係る第４のプリント配線板は、上
記第１ないし第３のいずれかのプリント配線板におい
て、抵抗体が防錆剤を含有するものである。A fourth printed wiring board according to the present invention is the printed wiring board according to any one of the first to third embodiments, wherein the resistor contains a rust preventive agent.
【００１１】本発明に係る第１のプリント配線板の製造
方法は、金属箔に抵抗体を設ける工程と、プリプレグ
に、上記抵抗体を設けた金属箔を、上記抵抗体を上記プ
リプレグ側にして押圧して積層する工程と、上記金属箔
をエッチングして、上記抵抗体に接続した電極を形成す
る工程とを備えた方法である。A first method for manufacturing a printed wiring board according to the present invention comprises a step of providing a resistor on a metal foil, a metal foil having the resistor provided on a prepreg, and the resistor being on the prepreg side. It is a method including a step of pressing and laminating and a step of etching the metal foil to form an electrode connected to the resistor.
【００１２】本発明に係る第２のプリント配線板の製造
方法は、上記第１のプリント配線板の製造方法おいて、
金属箔は支持体に設けられている方法である。A second printed wiring board manufacturing method according to the present invention is the same as the first printed wiring board manufacturing method,
The metal foil is a method provided on the support.
【００１３】[0013]
【発明の実施の形態】実施の形態１．図１は、本発明の
第１の実施の形態のプリント配線板の断面図であり、両
面基板の場合である。この図において、１は基板本体で
凹部を有し、２は導体層（回路パターン）、３は抵抗
体、４は導体層における抵抗体３と接続した電極で、抵
抗体３と電極４により抵抗器５を構成する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. FIG. 1 is a sectional view of a printed wiring board according to a first embodiment of the present invention, which is a double-sided board. In this figure, 1 is a substrate body having a concave portion, 2 is a conductor layer (circuit pattern), 3 is a resistor, 4 is an electrode connected to the resistor 3 in the conductor layer, and the resistor 3 and the electrode 4 are used for resistance. Configure the container 5.
【００１４】本実施の形態のプリント配線板において、
基板本体１は底面の平坦な凹部を有し、この凹部には抵
抗体３が充填され、電極４は互いに分離して上記抵抗体
３に接続されており、抵抗体３と電極４とで抵抗器５を
構成している。In the printed wiring board of the present embodiment,
The substrate body 1 has a flat bottom concave portion, and the concave portion is filled with a resistor 3, and the electrodes 4 are connected to the resistor 3 separately from each other. It constitutes the container 5.
【００１５】図１に示すように、抵抗体３は、基板本体
１の、底面の平坦な凹部に形成されているので、プリン
ト配線板をさらに多層化するための工程や、上記プリン
ト配線板を使用する時に応力がかかった場合に、電極の
端面に応力が集中しにくく、抵抗体の断線といった不具
合が発生しにくい。さらに、基板本体１が、従来のよう
に複数材の集成からなるのではなく、図１に示すように
一体材からなるので、熱応力が発生する場所が従来より
減少し、製造時や使用時の応力に対するひずみが小さく
安定した抵抗値が得られる。As shown in FIG. 1, since the resistor 3 is formed in the flat concave portion of the bottom surface of the substrate body 1, the step for further multilayering the printed wiring board and the above-mentioned printed wiring board are performed. When stress is applied during use, stress is less likely to concentrate on the end faces of the electrodes, and problems such as breakage of the resistor are less likely to occur. Further, since the substrate body 1 is made of an integrated material as shown in FIG. 1 instead of being composed of a plurality of materials as in the prior art, the places where thermal stress is generated are reduced compared to the prior art, and during manufacturing or use. Strain is small with respect to the stress of and stable resistance value can be obtained.
【００１６】また、抵抗体３が電極４と基板本体１の界
面の高さまで充填され、平行平板の形状となっている
と、抵抗器の抵抗値を左右する抵抗体の膜厚のバラツキ
が小さくなり、安定した抵抗値が得られる。また、本実
施の形態においては、図１に示すように、抵抗体３が電
極４よりも基板本体１側に配置されているので、外部か
ら侵入しようとする水分は電極４が排除するため、抵抗
体３と電極の界面に水分が侵入しにくくなり、銀電極や
金電極を使用しなくても、電極腐食、マイグレーション
による抵抗値の経持変化を抑制することができる。Further, when the resistor 3 is filled up to the height of the interface between the electrode 4 and the substrate body 1 and has a parallel plate shape, the variation in the film thickness of the resistor which influences the resistance value of the resistor is small. Therefore, a stable resistance value can be obtained. Further, in the present embodiment, as shown in FIG. 1, since the resistor 3 is arranged closer to the substrate body 1 side than the electrode 4, the electrode 4 removes the water that tries to enter from the outside. It becomes difficult for moisture to enter the interface between the resistor 3 and the electrode, and it is possible to suppress a change in resistance value over time due to electrode corrosion and migration without using a silver electrode or a gold electrode.
【００１７】実施の形態２．図２は、本発明の第２の実
施の形態のプリント配線板の製造方法を工程順に示す工
程図であり、図中、１１は例えば銅箔等の金属箔、１２
は金属箔１１における基準となる位置、１３は抵抗体、
１４は基板本体となる例えば未硬化のガラスエポキシ樹
脂であるプリプレグ、１５は例えば銅箔等の金属箔であ
る。即ち、銅箔１１（厚さ１８μｍ）に基準となる穴を
マークし、その基準穴を基準として、所定の位置１２に
抵抗体ペーストを印刷し、乾燥させて抵抗体１３とする
｛図２（ａ）｝。次に、抵抗体１３が形成された銅箔１
１の抵抗体１３を、プリプレグ１４側にして、さらにも
う一つの銅箔１５と共に押圧して積層する｛図２
（ｂ）｝。次に、写真製版技術により、銅箔１１をパタ
ーニングし、抵抗器用の電極４を含有する導体層（回路
パターン）２を形成する｛図２（ｃ）｝。Embodiment 2. 2A to 2C are process diagrams showing a method of manufacturing a printed wiring board according to a second embodiment of the present invention in the order of processes, in which 11 is a metal foil such as copper foil, and 12 is a metal foil.
Is a reference position on the metal foil 11, 13 is a resistor,
Reference numeral 14 is a prepreg which is an uncured glass epoxy resin and which serves as a substrate body, and 15 is a metal foil such as a copper foil. That is, a reference hole is marked on the copper foil 11 (thickness 18 μm), the resistor paste is printed at a predetermined position 12 with the reference hole as a reference, and the resistor paste is dried to form the resistor 13 (FIG. a)}. Next, the copper foil 1 on which the resistor 13 is formed
The resistor 13 of No. 1 is placed on the prepreg 14 side, and is pressed and laminated together with another copper foil 15 (FIG. 2).
(B)}. Next, the copper foil 11 is patterned by photolithography to form the conductor layer (circuit pattern) 2 containing the electrode 4 for the resistor {FIG. 2 (c)}.
【００１８】図１および、図２（ａ）の工程でわかるよ
うに、抵抗体３が印刷される時の下地の印刷面１２は平
坦である。そのため、抵抗体ペーストの印刷性は良好で
あり、抵抗体３の膜厚制御が容易で、さらに抵抗器の抵
抗値を作用する膜厚のバラツキが小さくなり平行平板の
抵抗体を形成しやすく、抵抗器の抵抗値が安定する。ま
た、段差部がないため、抵抗体３のダレ、ニジミが生じ
ず、図２（ｂ）における積層工程や、ハンダ付け工程に
おける応力も、抵抗体に応力が集中するといった問題が
生じないといった効果がある。また、構成される部材が
少なく、工程数も減少するため、製造コストが小さいと
いう利点も有る。As can be seen from the steps of FIGS. 1 and 2A, the underlying printing surface 12 when the resistor 3 is printed is flat. Therefore, the printability of the resistor paste is good, the film thickness of the resistor 3 can be easily controlled, and the variation in the film thickness that affects the resistance value of the resistor is reduced, so that the parallel plate resistor can be easily formed. The resistance value of the resistor is stable. Further, since there is no stepped portion, sagging and bleeding of the resistor 3 do not occur, and the stress in the stacking process and the soldering process in FIG. 2B does not cause the problem that stress concentrates on the resistor. There is. In addition, there are advantages that the manufacturing cost is low because the number of components is small and the number of steps is reduced.
【００１９】実施の形態３．図３は本発明の第３の実施
の形態のプリント配線板の断面図であり、実施の形態１
のプリント配線板を多層プリント配線板に適用した場合
である。Embodiment 3. FIG. 3 is a sectional view of a printed wiring board according to a third embodiment of the present invention.
This is a case where the printed wiring board of 1 is applied to a multilayer printed wiring board.
【００２０】図４は、本発明の第３の実施の形態のプリ
ント配線板の製造方法を工程順に示す工程図であり、実
施の形態１で得られたプリント配線板を利用して、多層
化している。まず、実施の形態１で得られたプリント配
線板２１をベース基板とする｛図４（ａ）｝。FIG. 4 is a process diagram showing a method of manufacturing a printed wiring board according to the third embodiment of the present invention in the order of steps. The printed wiring board obtained in Embodiment 1 is used to form a multilayer structure. ing. First, the printed wiring board 21 obtained in Embodiment 1 is used as a base substrate {FIG. 4 (a)}.
【００２１】次に、実施の形態２と同様に、抵抗体１３
が形成された銅箔１１を２枚作製する。一方、未硬化の
ガラスエポキシ樹脂であるプリプレグ１４を、上記プリ
ント配線板２１の上下面に設け、抵抗体１３が形成され
た銅箔１１の、抵抗体１３をプリプレグ側にして、上記
プリント配線板２１の上下面に設けられたプリプレグに
押圧する｛図４（ｂ）｝。次に、写真製版技術により、
銅箔１１をパターニングし、抵抗器用の電極４が形成さ
れた導体層（回路パターン）２を形成し、多層の抵抗内
蔵のプリント配線板を形成する｛図４（ｃ）｝。実施の
形態２で述べたのと同様の理由により、多層となっても
安定した膜厚の抵抗体３を得ることができ、段差部がな
いため、図４（ｂ）における積層工程や、ハンダ付け工
程における応力も、抵抗体に応力が集中するといった問
題が生じないといった効果がある。Next, as in the second embodiment, the resistor 13
Two copper foils 11 on which are formed are produced. On the other hand, the prepreg 14 which is an uncured glass epoxy resin is provided on the upper and lower surfaces of the printed wiring board 21, and the resistor 13 of the copper foil 11 on which the resistor 13 is formed is the prepreg side. 21 is pressed against the prepregs provided on the upper and lower surfaces 21 (FIG. 4 (b)). Next, by photoengraving technology,
The copper foil 11 is patterned to form a conductor layer (circuit pattern) 2 having a resistor electrode 4 formed thereon to form a multilayer printed wiring board with built-in resistors {FIG. 4 (c)}. For the same reason as described in the second embodiment, the resistor 3 having a stable film thickness can be obtained even if it has a multi-layer structure, and since there is no step portion, the laminating step in FIG. The stress in the attaching step is also effective in that the problem of stress concentration on the resistor does not occur.
【００２２】実施の形態４．あらかじめ、抵抗体を印刷
する面をＮｉ−Ｐ合金等Ｎｉ合金、ＺｎまたはＣｒで被
覆した銅箔を用意しておき、この銅箔を使用して、実施
の形態１で述べた図１に示すプリント配線板を製造し
た。電極の表面をＮｉ−Ｐ合金、ＺｎまたはＣｒからな
る層で被覆し、その層と抵抗体を接触するようにすれ
ば、抵抗体と電極の密着力が向上するため、積層工程や
ハンダ付け工程時の熱衝撃や、装置への実装時の物理的
な衝撃が加わったときに、抵抗値の変動が抑制される。
また、抵抗体と電極の界面を強固にすることにより、当
該界面への水分の侵入を抑制し、電極腐食による抵抗値
の経時変化を抑制することができる。Fourth Embodiment A copper foil whose surface on which the resistor is to be printed is coated with a Ni alloy such as a Ni-P alloy, Zn or Cr is prepared in advance, and this copper foil is used to form the copper foil shown in FIG. 1 described in the first embodiment. A printed wiring board was manufactured. If the surface of the electrode is covered with a layer made of Ni-P alloy, Zn or Cr and the layer and the resistor are brought into contact with each other, the adhesion between the resistor and the electrode is improved. Variation in resistance value is suppressed when a thermal shock at the time or a physical shock at the time of mounting on the device is applied.
Further, by strengthening the interface between the resistor and the electrode, it is possible to suppress the entry of moisture into the interface and suppress the change in resistance value over time due to electrode corrosion.
【００２３】実施の形態５．実施の形態２において、銅
箔は実施の形態２で述べたものを使用するが、防錆剤と
して銅に対する防錆効果を有するベンゾトリアゾール、
ベンズイミダゾールまたはビニルトリアジンを添加した
抵抗体ペーストを用いて抵抗体を形成する他は実施の形
態２と同様にしてプリント配線板を製造した。抵抗体ペ
ーストに防錆剤を添加しておくと、抵抗体と電極の界面
に水分が侵入しても、電極腐食による抵抗値の経時変化
をさらに抑制することができる。Embodiment 5. In the second embodiment, the copper foil described in the second embodiment is used, but a benzotriazole having a rust preventive effect on copper is used as a rust preventive agent.
A printed wiring board was manufactured in the same manner as in Embodiment 2 except that the resistor was formed using the resistor paste to which benzimidazole or vinyltriazine was added. If a rust preventive agent is added to the resistor paste, even if water enters the interface between the resistor and the electrode, it is possible to further suppress the change in resistance value over time due to electrode corrosion.
【００２４】上記実施の形態４，５において、表１に具
体的に示す材料を用いて製造したプリント配線板と、図
６に示した上記従来のプリント配線板とを、３０℃、７
０％Ｒ．Ｈ．の恒温恒湿環境下に１０００時間放置し
て、放置前後の抵抗値の変化率を測定することにより、
耐湿性を評価した。その結果を表１に示す。In the fourth and fifth embodiments, the printed wiring board manufactured by using the material specifically shown in Table 1 and the conventional printed wiring board shown in FIG.
0% R. H. By leaving it for 1000 hours in a constant temperature and humidity environment and measuring the rate of change in resistance before and after leaving it,
The moisture resistance was evaluated. The results are shown in Table 1.
【００２５】[0025]
【表１】 [Table 1]
【００２６】表中、変化率が２％以下の場合◎、２〜５
％の場合○、１０％を超えた場合×とする。また、上記
プリント配線板に、（２８０℃のオイル槽に３０秒間浸
漬―室温放置１０分間）を１サイクルとして、このサイ
クルを繰り返して熱衝撃を与え、初期の抵抗値と比較し
て抵抗値の変化率が１０％以上となったときの繰り返し
回数を測定することにより、耐衝撃性を評価した。その
結果を表１に示す。変化率が１０％以上となったときの
繰り返し回数が１０回以上の場合◎、９〜５回の場合
○、２〜１回の場合×とする。In the table, when the rate of change is 2% or less, ⊚, 2 to 5
When%, it is ○. When it exceeds 10%, it is ×. In addition, the above-mentioned printed wiring board was soaked in an oil bath at 280 ° C. for 30 seconds and left at room temperature for 10 minutes as one cycle, and this cycle was repeated to give a thermal shock, and the resistance value was compared with the initial resistance value. Impact resistance was evaluated by measuring the number of repetitions when the rate of change was 10% or more. The results are shown in Table 1. When the change rate is 10% or more, the number of repetitions is 10 or more, ⊚, 9 to 5 times, ∘, and 2 to 1 times, x.
【００２７】表１の結果から、本実施の形態のプリント
配線板は、比較例に比べて耐湿性に優れ、特に、抵抗体
を印刷する面をＮｉ−Ｐ合金、ＺｎまたはＣｒで被覆し
た銅箔を用いた場合（実施の形態４）は耐衝撃性と耐湿
性にさらに優れ、防錆剤を含有した抵抗体を用いた場合
は（実施の形態５）耐湿性にさらに優れることが解る。From the results shown in Table 1, the printed wiring board of the present embodiment is superior in moisture resistance as compared with the comparative example, and in particular, the surface on which the resistor is printed is coated with Ni--P alloy, Zn or Cr. It can be seen that when a foil is used (Embodiment 4), impact resistance and moisture resistance are further excellent, and when a resistor containing a rust preventive is used (Embodiment 5), moisture resistance is further excellent.
【００２８】実施の形態６．図５は、本発明の第６の実
施の形態のプリント配線板の製造方法を工程順に示す工
程図で、４１は支持体である。つまり、支持体４１とし
て、３２μｍの厚さの銅箔を用い、支持体４１に銅箔を
付着したものを使用して、実施の形態２と同様にしてプ
リント配線板を製造した。Sixth Embodiment FIG. 5 is a process chart showing a method of manufacturing a printed wiring board according to a sixth embodiment of the present invention in the order of steps, and 41 is a support. That is, a printed wiring board was manufactured in the same manner as in the second embodiment, using a copper foil having a thickness of 32 μm as the support 41 and using the support 41 with the copper foil attached.
【００２９】支持体４１に銅箔１１（厚さ１８μｍ）を
付着させたものの銅箔１１に、基準となる穴をマーク
し、その基準穴を基準として、所定の位置１２に抵抗体
ペーストを印刷し、乾燥させて抵抗体１３とする｛図５
（ａ）｝。抵抗体１３が形成された銅箔１１と、未硬化
のガラスエポキシ樹脂からなるプリプレグ１４と、さら
にもう一つの銅箔１５を付着させたた支持体４１を図５
（ｂ）に示すように積層して押圧する。次に、支持体４
１を除去し｛図５（ｃ）｝、写真製版技術により、銅箔
１１をパターニングし、抵抗器用の電極４を含有する導
体層（回路パターン）２を形成する。A copper foil 11 (thickness 18 μm) is adhered to the support 41, and a reference hole is marked on the copper foil 11, and a resistor paste is printed at a predetermined position 12 with reference to the reference hole. And dry to form the resistor 13 {Fig. 5
(A)}. The support 41 having the copper foil 11 on which the resistor 13 is formed, the prepreg 14 made of an uncured glass epoxy resin, and another copper foil 15 attached thereto is shown in FIG.
As shown in (b), they are laminated and pressed. Next, the support 4
1 is removed {FIG. 5C}, and the copper foil 11 is patterned by a photolithography technique to form a conductor layer (circuit pattern) 2 containing a resistor electrode 4.
【００３０】図５（ａ）および（ｂ）の工程において、
銅箔が、印刷時に印刷方向への応力や、印刷工程から積
層工程へ製造装置間を運搬するときの曲げ応力や引っ張
り応力を受けないようにするには、細心の注意が必要と
なる。そこで、あらかじめ、本実施の形態のように、支
持体４１に銅箔１１を付着させておくことにより、銅箔
の曲げ強度、伸び強度を補強することにより、銅箔にし
わが発生したり、折れたりすることを防ぐことができ、
その結果、抵抗体の配置位置の位置ずれを起こしにく
く、所定の位置に抵抗体を配置しやすくなるという効果
がある。In the steps of FIGS. 5A and 5B,
Care must be taken to prevent the copper foil from being subjected to the stress in the printing direction during printing, and the bending stress and tensile stress during transportation between the manufacturing devices from the printing process to the laminating process. Therefore, as in the present embodiment, the copper foil 11 is adhered to the support 41 in advance to reinforce the bending strength and the elongation strength of the copper foil, thereby causing wrinkles and creases in the copper foil. Can be prevented,
As a result, there is an effect that the position of the resistor is less likely to be displaced and the resistor can be easily arranged at a predetermined position.
【００３１】[0031]
【発明の効果】本発明の第１のプリント配線板は、底面
の平坦な凹部を有する基板本体と、上記凹部を充填した
抵抗体およびこの抵抗体と接続した少なくとも２個の電
極からなる抵抗器とを備えたもので、安定した抵抗値が
得られ、多層化するための工程や、当該プリント配線板
を使用する時に応力がかかった場合に、電極の端面に応
力が集中しにくく、抵抗体の断線といった不具合が発生
しにくいという効果がある。According to the first printed wiring board of the present invention, a resistor having a substrate body having a flat concave portion on the bottom surface, a resistor filling the concave portion, and at least two electrodes connected to the resistor. With a stable resistance value, it is difficult for stress to concentrate on the end face of the electrode when stress is applied during the process of multilayering or when using the printed wiring board, This has the effect that problems such as wire breakage are unlikely to occur.
【００３２】本発明の第２のプリント配線板は、上記第
１のプリント配線板において、抵抗体が基板本体の高さ
まで充填され、抵抗体が平行平板形状のもので、特に安
定した抵抗値が得られるという効果がある。A second printed wiring board according to the present invention is the same as the above-mentioned first printed wiring board, in which the resistor is filled up to the height of the substrate body, and the resistor has a parallel plate shape, and has a particularly stable resistance value. It has the effect of being obtained.
【００３３】本発明の第３のプリント配線板は、上記第
１または第２のプリント配線板において、電極と抵抗体
との間に、Ｎｉ合金、ＺｎおよびＣｒの少なくとも一種
の材料からなる層を有するもので、特に、耐衝撃性に優
れるという効果がある。A third printed wiring board of the present invention is the above-mentioned first or second printed wiring board, wherein a layer made of at least one material of Ni alloy, Zn and Cr is provided between the electrode and the resistor. It has the effect of being particularly excellent in impact resistance.
【００３４】本発明の第４のプリント配線板は、第１な
いし第３のいずれかのプリント配線板において、抵抗体
が防錆剤を含有するもので、特に、耐衝撃性と耐湿性に
優れるという効果がある。The fourth printed wiring board of the present invention is the printed wiring board according to any one of the first to third embodiments, in which the resistor contains a rust preventive agent, and is particularly excellent in impact resistance and moisture resistance. There is an effect.
【００３５】本発明の第１のプリント配線板の製造方法
は、金属箔に抵抗体を設ける工程と、プリプレグに、上
記抵抗体を設けた金属箔を、上記抵抗体を上記プリプレ
グ側にして押圧して積層する工程と、上記金属箔をエッ
チングして、上記抵抗体に接続した電極を形成する工程
とを備えた方法で、特性の優れたプリント配線板が、容
易に得られるという効果がある。The first method for manufacturing a printed wiring board according to the present invention comprises a step of providing a resistor on a metal foil, and pressing a metal foil having the resistor on a prepreg with the resistor on the prepreg side. And a step of laminating the metal foil and etching the metal foil to form an electrode connected to the resistor, a printed wiring board having excellent characteristics can be easily obtained. .
【００３６】本発明の第２のプリント配線板の製造方法
は、上記第１のプリント配線板の製造方法おいて、金属
箔は支持体に設けられている方法で、さらに製造が確実
で容易になるという効果がある。A second method for producing a printed wiring board according to the present invention is the same as the method for producing a first printed wiring board, in which the metal foil is provided on the support, and the production is more reliable and easier. There is an effect that.
【図１】 本発明の第１の実施の形態のプリント配線板
の断面図である。FIG. 1 is a cross-sectional view of a printed wiring board according to a first embodiment of the present invention.
【図２】 本発明の第２の実施の形態のプリント配線板
の製造方法を工程順に示す工程図である。FIG. 2 is a process drawing showing a method of manufacturing a printed wiring board according to a second embodiment of the present invention in process order.
【図３】 本発明の第３の実施の形態のプリント配線板
の断面図である。FIG. 3 is a sectional view of a printed wiring board according to a third embodiment of the present invention.
【図４】 本発明の第３の実施の形態のプリント配線板
の製造方法を工程順に示す工程図である。FIG. 4 is a process chart showing a method of manufacturing a printed wiring board according to a third embodiment of the present invention in the order of steps.
【図５】 本発明の第６の実施の形態のプリント配線板
の製造方法を工程順に示す工程図である。FIG. 5 is a process chart showing a method of manufacturing a printed wiring board according to a sixth embodiment of the present invention in the order of steps.
【図６】 従来のプリント配線板の断面図である。FIG. 6 is a cross-sectional view of a conventional printed wiring board.
１ 基板本体、３ 抵抗体、４ 金属電極、５ 抵抗
器、１１ 金属箔、１３抵抗体、１４ プリプレグ、２
１ プリント配線板、４１ 支持体。1 substrate body, 3 resistor, 4 metal electrode, 5 resistor, 11 metal foil, 13 resistor, 14 prepreg, 2
1 printed wiring board, 41 support.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 柳浦 聡 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 (72)発明者 小林 利夫 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 (72)発明者 岡 誠次 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 Ｆターム(参考） 4E351 AA01 BB05 BB24 BB26 BB31 BB35 CC11 DD01 DD17 DD19 DD23 GG01 GG09 5E033 AA11 BB09 BC01 BD01 BG02 5E339 AB02 AD05 BC02 BD03 BD06 BE11 CF15 EE10 GG10 5E346 AA05 AA06 AA12 AA14 AA15 BB01 BB20 CC02 CC08 CC31 CC32 CC37 DD02 DD09 DD32 EE02 EE06 EE07 FF45 GG22 GG28 GG40 HH01 HH33 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Satoshi Yanaura 2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo Inside Ryo Electric Co., Ltd. (72) Inventor Toshio Kobayashi 2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo Inside Ryo Electric Co., Ltd. (72) Inventor Seiji Oka 2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo Inside Ryo Electric Co., Ltd. F-term (reference) 4E351 AA01 BB05 BB24 BB26 BB31 BB35 CC11 DD01 DD17 DD19 DD23 GG01 GG09 5E033 AA11 BB09 BC01 BD01 BG02 5E339 AB02 AD05 BC02 BD03 BD06 BE11 CF15 EE10 GG10 5E346 AA05 AA06 AA12 AA14 AA15 BB01 BB20 CC02 CC08 CC31 CC32 CC37 DD02 DD09 DD32 EE02 EE06 EE07 FF45 GG22 GG28 GG40 HH01 HH33
Claims (6)
上記凹部を充填した抵抗体およびこの抵抗体と接続した
少なくとも２個の電極からなる抵抗器とを備えたプリン
ト配線板。1. A substrate body having a flat concave portion on the bottom surface,
A printed wiring board comprising a resistor filled with the recess and a resistor having at least two electrodes connected to the resistor.
抵抗体が平行平板形状であることを特徴とする請求項１
に記載のプリント配線板。2. The resistor is filled up to the height of the substrate body,
The resistor has a parallel plate shape.
The printed wiring board described in.
およびＣｒの少なくとも一種の材料からなる層を有する
ことを特徴とする請求項１または請求項２に記載のプリ
ント配線板。3. A Ni alloy, Zn is provided between the electrode and the resistor.
The printed wiring board according to claim 1 or 2, wherein the printed wiring board has a layer made of at least one material of Cr and Cr.
する請求項１ないし請求項３のいずれかに記載のプリン
ト配線板。4. The printed wiring board according to claim 1, wherein the resistor contains a rust preventive agent.
レグに、上記抵抗体を設けた金属箔を、上記抵抗体を上
記プリプレグ側にして押圧して積層する工程と、上記金
属箔をエッチングして、上記抵抗体に接続した電極を形
成する工程とを備えたプリント配線板の製造方法。5. A step of providing a resistor on a metal foil, a step of laminating a metal foil provided with the resistor on a prepreg so that the resistor is on the prepreg side and laminating, and etching the metal foil. And a step of forming an electrode connected to the resistor, the method for manufacturing a printed wiring board.
特徴とする請求項５に記載のプリント配線板の製造方
法。6. The method for manufacturing a printed wiring board according to claim 5, wherein a metal foil is provided on the support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001351653A JP3852573B2 (en) | 2001-11-16 | 2001-11-16 | Method for manufacturing printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001351653A JP3852573B2 (en) | 2001-11-16 | 2001-11-16 | Method for manufacturing printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003152301A true JP2003152301A (en) | 2003-05-23 |
| JP3852573B2 JP3852573B2 (en) | 2006-11-29 |
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ID=19163935
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001351653A Expired - Fee Related JP3852573B2 (en) | 2001-11-16 | 2001-11-16 | Method for manufacturing printed wiring board |
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| JP (1) | JP3852573B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006128538A (en) * | 2004-11-01 | 2006-05-18 | Toppan Printing Co Ltd | Method for manufacturing wiring board |
| JP2006261661A (en) * | 2005-02-18 | 2006-09-28 | Mitsubishi Materials Corp | Temperature sensor and its manufacturing method |
| JPWO2005002303A1 (en) * | 2003-06-30 | 2006-11-24 | イビデン株式会社 | Printed wiring board |
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| WO2008096464A1 (en) * | 2007-02-06 | 2008-08-14 | Ibiden Co., Ltd. | Printed circuit board and method for manufacturing the printed circuit board |
| JP2008544551A (en) * | 2005-06-21 | 2008-12-04 | スリーエム イノベイティブ プロパティズ カンパニー | Passive electrical goods |
| KR100932535B1 (en) * | 2007-11-28 | 2009-12-17 | 주식회사 심텍 | Printed circuit board with embedded resistor and manufacturing method |
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2001
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|---|---|---|---|---|
| JPWO2005002303A1 (en) * | 2003-06-30 | 2006-11-24 | イビデン株式会社 | Printed wiring board |
| JP4606329B2 (en) * | 2003-06-30 | 2011-01-05 | イビデン株式会社 | Printed wiring board |
| JP2006128538A (en) * | 2004-11-01 | 2006-05-18 | Toppan Printing Co Ltd | Method for manufacturing wiring board |
| JP4687072B2 (en) * | 2004-11-01 | 2011-05-25 | 凸版印刷株式会社 | Wiring board manufacturing method and wiring board |
| JP2006261661A (en) * | 2005-02-18 | 2006-09-28 | Mitsubishi Materials Corp | Temperature sensor and its manufacturing method |
| JP2008544551A (en) * | 2005-06-21 | 2008-12-04 | スリーエム イノベイティブ プロパティズ カンパニー | Passive electrical goods |
| CN101467501B (en) * | 2007-02-06 | 2011-07-20 | 揖斐电株式会社 | Printed wiring board and method for manufacturing the same |
| WO2008096464A1 (en) * | 2007-02-06 | 2008-08-14 | Ibiden Co., Ltd. | Printed circuit board and method for manufacturing the printed circuit board |
| US8621748B2 (en) | 2007-02-06 | 2014-01-07 | Ibiden Co., Ltd. | Manufacturing method for a printed wiring board |
| JPWO2008096464A1 (en) * | 2007-02-06 | 2010-05-20 | イビデン株式会社 | Printed wiring board and method for manufacturing the printed wiring board |
| US7902463B2 (en) | 2007-02-06 | 2011-03-08 | Ibiden, Co. Ltd. | Printed wiring board and method of manufacturing the same |
| JP4702904B2 (en) * | 2007-02-06 | 2011-06-15 | イビデン株式会社 | Printed wiring board and method for manufacturing the printed wiring board |
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| KR100932535B1 (en) * | 2007-11-28 | 2009-12-17 | 주식회사 심텍 | Printed circuit board with embedded resistor and manufacturing method |
| JP2011119758A (en) * | 2011-02-16 | 2011-06-16 | Sharp Corp | Semiconductor device |
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