JP2003136233A - Jet type automatic soldering device - Google Patents
Jet type automatic soldering deviceInfo
- Publication number
- JP2003136233A JP2003136233A JP2001337675A JP2001337675A JP2003136233A JP 2003136233 A JP2003136233 A JP 2003136233A JP 2001337675 A JP2001337675 A JP 2001337675A JP 2001337675 A JP2001337675 A JP 2001337675A JP 2003136233 A JP2003136233 A JP 2003136233A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- height
- jet
- molten
- measuring means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント基板に電
子部品を半田付けするときに利用する噴流式自動半田付
け装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet type automatic soldering device used when soldering electronic parts to a printed circuit board.
【０００２】[0002]
【従来の技術】従来、プリント基板に対する抵抗、コン
デンサ、ジャンパー線等の半田付けは、噴流式半田付け
装置を利用して自動的に行われている。噴流式半田付け
装置においては、半田噴流を利用して半田液面を作り、
その液面上を電子部品を実装したプリント基板を通すこ
とで、プリント基板に電子部品を半田付けする。2. Description of the Related Art Conventionally, soldering of resistors, capacitors, jumper wires and the like to a printed circuit board has been automatically performed by using a jet type soldering device. In a jet soldering device, a solder jet is used to create a solder liquid level,
The electronic component is soldered to the printed circuit board by passing the printed circuit board on which the electronic component is mounted on the liquid surface.
【０００３】従来、この種の噴流式自動半田付け装置
は、図６および図７に示すように構成していた。以下、
その構成について説明する。Conventionally, this type of jet-type automatic soldering apparatus has been constructed as shown in FIGS. 6 and 7. Less than,
The configuration will be described.
【０００４】図６に示すように、コンベア１は、抵抗や
コンデンサ等の電子部品を実装したプリント基板（図示
せず）を搬送するもので、半田槽２では溶融半田が噴流
しており、半田槽２でコンベア１により搬送されるプリ
ント基板に電子部品を半田付けする。プリヒータ３は、
半田槽２でプリント基板に電子部品を半田付けする前に
プリント基板を予熱し、半田付け性を向上するものであ
る。As shown in FIG. 6, the conveyor 1 conveys a printed circuit board (not shown) on which electronic components such as resistors and capacitors are mounted, and molten solder is jetted in the solder bath 2 Electronic components are soldered to the printed circuit board conveyed by the conveyor 1 in the tank 2. The preheater 3 is
The printed circuit board is preheated before the electronic component is soldered to the printed circuit board in the solder bath 2 to improve the solderability.
【０００５】半田槽２は、図７に示すように構成してお
り、半田槽２内の溶融半田４は、Ｖプーリー５を介して
モータ（図示せず）により駆動されるファン６が回転す
ることにより吸込部７より吸い込まれ、吸い込まれた溶
融半田４はダクト８を通り、ノズル９より矢印で示すよ
うに噴流される。その噴流された溶融半田４の表面をプ
リント基板が通り、部品を半田付けする。シーズヒータ
１０は半田槽２内の半田を加熱して溶融するものであ
る。The solder bath 2 is constructed as shown in FIG. 7, and the molten solder 4 in the solder bath 2 is rotated by a fan 6 driven by a motor (not shown) via a V pulley 5. As a result, the molten solder 4 sucked from the suction portion 7 passes through the duct 8 and is jetted from the nozzle 9 as shown by an arrow. The printed board passes through the surface of the jetted molten solder 4 to solder the components. The sheathed heater 10 heats and melts the solder in the solder bath 2.
【０００６】[0006]
【発明が解決しようとする課題】このような従来の噴流
式自動半田付け装置においては、半田槽２内の溶融半田
４の量の変化によって、ノズル９より噴流する溶融半田
４の液面の高さが変化し、半田付け性が劣化するといっ
た問題があった。In such a conventional jet type automatic soldering apparatus, the liquid level of the molten solder 4 jetted from the nozzle 9 is increased due to the change in the amount of the molten solder 4 in the solder bath 2. However, there is a problem that the solderability is deteriorated due to the change in the solderability.
【０００７】さらに、近年、環境重視の観点から、鉛を
０．５％以下しか含まない、いわゆる鉛フリー半田の使
用が検討されるようになってきているが、鉛フリー半田
は、従来の半田と比較すると半田付け性に劣るため、半
田槽２における半田液面の高さの変化が大きく影響して
半田付け性が劣化して半田付けができなくなり、鉛フリ
ー半田が使用できなくなるといった問題があった。Further, in recent years, from the viewpoint of environmental consideration, use of so-called lead-free solder, which contains only 0.5% or less of lead, has been studied, but lead-free solder is a conventional solder. Since the solderability is inferior to that of the above, there is a problem that the change in the height of the solder liquid surface in the solder bath 2 has a great influence and the solderability is deteriorated so that soldering cannot be performed and lead-free solder cannot be used. there were.
【０００８】本発明は上記従来の課題を解決するもの
で、噴流された溶融半田の液面の高さを一定にし、半田
付け性の劣化を防ぎ、鉛フリー半田を使用可能にするこ
とを目的としている。The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to make the height of the liquid surface of jetted molten solder constant, prevent deterioration of solderability, and enable use of lead-free solder. I am trying.
【０００９】[0009]
【課題を解決するための手段】本発明は上記目的を達成
するために、溶融半田が入った半田槽に溶融半田を噴流
する噴流部を設け、噴流部から半田を噴流させる噴流発
生手段を駆動手段により駆動し、噴流された溶融半田の
液面の高さを高さ計測手段により計測し、制御手段によ
り駆動手段を制御して噴流の強さを制御するよう構成
し、制御手段は、高さ計測手段からの入力信号に基づい
て駆動手段を制御し、半田液面の高さが一定になるよう
にしたものである。In order to achieve the above-mentioned object, the present invention provides a jet flow generating means for jetting the solder from the jet portion by providing a jet portion for jetting the molten solder in a solder bath containing the molten solder. The height of the liquid surface of the molten solder jetted by the driving means is measured by the height measuring means, and the control means controls the driving means to control the strength of the jet flow. The driving means is controlled based on the input signal from the height measuring means so that the height of the solder liquid surface becomes constant.
【００１０】これにより、噴流された溶融半田の液面の
高さを一定にできて、半田付け性の劣化を防ぐことがで
き、鉛フリー半田を使用可能にすることができる。As a result, the height of the liquid surface of the jetted molten solder can be made constant, deterioration of solderability can be prevented, and lead-free solder can be used.
【００１１】[0011]
【発明の実施の形態】本発明の請求項１に記載の発明
は、溶融半田が入った半田槽と、前記半田槽に設け溶融
半田を噴流する噴流部と、前記噴流部から半田を噴流さ
せる噴流発生手段と、前記噴流発生手段を駆動する駆動
手段と、噴流された溶融半田の液面の高さを計測する高
さ計測手段と、前記駆動手段を制御して噴流の強さを制
御する制御手段とを備え、前記制御手段は、前記高さ計
測手段からの入力信号に基づいて前記駆動手段を制御
し、半田液面の高さが一定になるようにしたものであ
り、噴流発生手段を駆動することにより噴流部より噴流
させた溶融半田の液面の高さを高さ計測手段により計測
し、この高さ計測手段が計測した値を基に、制御手段に
より駆動手段を制御して噴流の強さを調整することで、
半田液面の高さを常に一定になるようにでき、半田付け
性の劣化を防ぎ、それにより従来の半田よりも半田付け
性に劣る鉛フリー半田も使用可能にすることができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is such that a solder bath containing molten solder, a jet portion for jetting the molten solder provided in the solder bath, and a jet of solder from the jet portion. Jet generating means, driving means for driving the jet generating means, height measuring means for measuring the height of the liquid surface of the jetted molten solder, and the driving means for controlling the strength of the jet. Control means, the control means controls the drive means based on an input signal from the height measuring means so that the height of the solder liquid surface becomes constant, and the jet flow generating means is provided. The height of the liquid surface of the molten solder jetted from the jet part is measured by driving the height measuring means, and the driving means is controlled by the control means based on the value measured by the height measuring means. By adjusting the strength of the jet,
The height of the solder liquid surface can be made constant at all times to prevent deterioration of solderability, and thereby lead-free solder, which is inferior to conventional solder in solderability, can be used.
【００１２】請求項２に記載の発明は、上記請求項１に
記載の発明において、高さ計測手段に代えて、半田槽内
の溶融半田の重量を計測する重量計測手段を備え、制御
手段は、前記重量計測手段からの入力信号に基づいて駆
動手段を制御し、半田液面の高さが一定になるようにし
たものであり、半田槽内の溶融半田の重量を重量計測手
段により計測し、この重量計測手段が計測した値を基
に、制御手段により駆動手段を制御して噴流の強さを調
整することで、溶融半田量の変化による半田液面の変化
を防ぎ、半田液面の高さが常に一定になるようにでき、
半田槽内の半田の重量変化による半田付け性のばらつき
を防ぎ、それにより従来の半田よりも半田付け性に劣る
鉛フリー半田も使用可能にすることができる。According to a second aspect of the invention, in the first aspect of the invention, instead of the height measuring means, a weight measuring means for measuring the weight of the molten solder in the solder bath is provided, and the control means is The drive means is controlled based on the input signal from the weight measuring means so that the height of the solder liquid surface becomes constant, and the weight of the molten solder in the solder bath is measured by the weight measuring means. , Based on the value measured by this weight measuring means, by controlling the driving means by the control means to adjust the jet strength, the change of the solder liquid level due to the change of the molten solder amount is prevented, You can make the height always constant,
It is possible to prevent the solderability from varying due to the weight change of the solder in the solder bath, and to use lead-free solder, which is inferior in solderability to the conventional solder.
【００１３】請求項３に記載の発明は、上記請求項１に
記載の発明において、高さ計測手段に代えて、半田槽内
の溶融半田の温度を計測する温度計測手段を備え、制御
手段は、前記温度計測手段からの入力信号に基づいて駆
動手段を制御し、半田液面の高さが一定になるようにし
たものであり、半田槽内の溶融半田の温度を温度計測手
段により計測し、温度計測手段が計測した値を基に、制
御手段により駆動手段を制御して噴流の強さを調整する
ことで、溶融半田の温度による半田粘度変化による半田
液面の変化を防ぎ、半田液面の高さが常に一定になるよ
うにでき、半田槽内の半田の温度変化による半田付け性
のばらつきを防ぎ、それにより従来の半田よりも半田付
け性に劣る鉛フリー半田も使用可能にすることができ
る。According to a third aspect of the present invention, in the above first aspect of the invention, the height measuring means is replaced by a temperature measuring means for measuring the temperature of the molten solder in the solder bath, and the control means is The driving means is controlled based on the input signal from the temperature measuring means so that the height of the solder liquid surface becomes constant, and the temperature of the molten solder in the solder bath is measured by the temperature measuring means. Based on the value measured by the temperature measuring means, the control means controls the driving means to adjust the strength of the jet flow to prevent the change of the solder liquid level due to the change of the solder viscosity due to the temperature of the molten solder, The height of the surface can be made constant at all times to prevent variations in solderability due to changes in the temperature of the solder in the solder bath, and lead-free solder, which is inferior to conventional solder in solderability, can also be used. be able to.
【００１４】請求項４に記載の発明は、上記請求項１に
記載の発明において、高さ計測手段に代えて、半田槽内
の溶融半田の材質を入力する入力手段を備え、制御手段
は、前記入力手段より入力された半田の材質に基づいて
駆動手段を制御し、半田液面の高さを半田の材質に応じ
た適度な高さになるようにしたものである。半田は材質
によって溶融時の粘度等が異なり、噴流式半田付け装置
における噴流部の半田の高さも材質によって異なる場合
がある。そのため半田槽内の溶融半田の材質を入力手段
により入力し、半田の材質によって制御手段により駆動
手段を制御して噴流の強さを調整することで、半田材質
に応じた半田液面の高さを実現して、それにより従来の
半田よりも半田付け性に劣る鉛フリー半田も使用可能に
することができる。According to a fourth aspect of the present invention, in the above first aspect of the present invention, the height measuring means is replaced by an input means for inputting the material of the molten solder in the solder bath, and the control means is The drive means is controlled on the basis of the material of the solder input from the input means so that the height of the solder liquid surface becomes an appropriate height according to the material of the solder. The viscosity of the solder when melted varies depending on the material, and the height of the solder in the jet portion of the jet soldering device may also vary depending on the material. Therefore, by inputting the material of the molten solder in the solder bath with the input means and controlling the driving means with the control means according to the material of the solder to adjust the jet strength, the height of the solder liquid level according to the solder material can be adjusted. Therefore, lead-free solder, which is inferior to conventional solder in solderability, can be used.
【００１５】[0015]
【実施例】以下、本発明の実施例について、図面を参照
しながら説明する。なお、半田槽の全体の構成は従来例
と同じであり、従来例と同じ構成のものは同一符号を付
して説明を省略する。Embodiments of the present invention will be described below with reference to the drawings. The entire structure of the solder bath is the same as that of the conventional example, and those having the same structures as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted.
【００１６】（実施例１）図１に示すように、半田槽２
は、内部にモータ（駆動手段）１１により駆動されるフ
ァン（噴流発生手段）６と、溶融半田を噴流させるノズ
ル（噴流部）９とを有し、ノズル９より噴流された溶融
半田によって、図２に示すように、半田液面１２を形成
しており、この半田液面１２の上をプリント基板１３が
通ることによって、部品を半田付けする。(Embodiment 1) As shown in FIG.
Has a fan (jet generating means) 6 driven by a motor (driving means) 11 and a nozzle (jet portion) 9 for jetting the molten solder, and the molten solder jetted from the nozzle 9 As shown in FIG. 2, the solder liquid surface 12 is formed, and the printed circuit board 13 passes over the solder liquid surface 12 to solder the components.
【００１７】半田面センサ（高さ計測手段）１４は、ノ
ズル９から噴出する半田噴流の高さを計測するもので、
図２に示すように、半田液面１２に対して設置してお
り、この半田面センサ１４により、半田面センサ１４か
ら半田面１２までの距離を計測し、その出力を制御手段
１５に入力している。制御手段１５は、半田面センサ１
４からの入力信号に基づいてモータ１１を制御し、半田
液面１２の高さが一定になるようにしている。The solder surface sensor (height measuring means) 14 measures the height of the solder jet ejected from the nozzle 9.
As shown in FIG. 2, the solder surface sensor 14 is installed on the solder liquid surface 12, the distance from the solder surface sensor 14 to the solder surface 12 is measured, and the output is input to the control means 15. ing. The control means 15 is the solder surface sensor 1
The motor 11 is controlled on the basis of the input signal from No. 4 so that the height of the solder liquid surface 12 becomes constant.
【００１８】上記構成において動作を説明する。半田槽
２内の溶融半田は、モータ１１により駆動されるファン
６が回転することによりノズル９より噴流され、その噴
流された溶融半田の表面をプリント基板１３が通り、部
品を半田付けする。The operation of the above configuration will be described. The molten solder in the solder bath 2 is jetted from the nozzle 9 by the rotation of the fan 6 driven by the motor 11, and the printed board 13 passes through the surface of the jetted molten solder to solder the components.
【００１９】このとき、半田面センサ１４により、半田
面センサ１４から半田液面１２までの距離Ａを計測し、
距離Ａが規定値よりも長い場合は半田液面１２が低くな
っているので、制御手段１５は、モータ１１の回転数を
上げてファン６の回転数を上昇し、ノズル９からの半田
の噴流を強くして半田液面１２を高くし、逆に、距離Ａ
が規定値よりも短い場合は半田液面１２が高くなってい
るので、半田の噴流を弱くして半田液面１２を低くする
ことにより、半田液面１２の高さが一定になるように制
御する。At this time, the solder surface sensor 14 measures the distance A from the solder surface sensor 14 to the solder liquid surface 12,
When the distance A is longer than the specified value, the solder liquid surface 12 is low, so the control means 15 increases the rotation speed of the motor 11 to increase the rotation speed of the fan 6, and the jet flow of the solder from the nozzle 9 is generated. To increase the solder liquid level 12 and vice versa.
Is shorter than the specified value, the solder liquid level 12 is high, and therefore, the height of the solder liquid level 12 is controlled to be constant by weakening the solder jet and lowering the solder liquid level 12. To do.
【００２０】これにより、プリント基板１３に電子部品
に半田付けを行うのに適度な半田噴流を実現し、半田噴
流の高さの変化による半田付け性のばらつきの影響をな
くして、常に半田付け性を一定に保つことができ、それ
により従来の半田よりも半田付け性に劣る鉛フリー半田
も使用可能にすることができる。As a result, a solder jet suitable for soldering electronic components to the printed circuit board 13 is realized, and the influence of variations in solderability due to changes in the height of the solder jet is eliminated, and solderability is always maintained. Of the lead-free solder, which is inferior in solderability to the conventional solder, can be used.
【００２１】（実施例２）図３に示すように、重量計測
手段１６は、半田槽２内の溶融半田の重量を計測するも
ので、その出力を制御手段１７に入力し、制御手段１７
は、重量計測手段１６からの入力信号に基づいてモータ
１１を制御し、半田液面１２の高さが一定になるように
している。他の構成は上記実施例１と同じである。(Embodiment 2) As shown in FIG. 3, the weight measuring means 16 measures the weight of the molten solder in the solder bath 2. The output of the weight measuring means 16 is input to the control means 17, and the control means 17 is used.
Controls the motor 11 based on the input signal from the weight measuring means 16 so that the height of the solder liquid surface 12 becomes constant. The other structure is the same as that of the first embodiment.
【００２２】上記構成において動作を説明する。半田槽
２内の溶融半田は、モータ１１により駆動されるファン
６が回転することによりノズル９より噴流され、その噴
流された溶融半田の表面をプリント基板１３が通り、部
品を半田付けする。The operation of the above configuration will be described. The molten solder in the solder bath 2 is jetted from the nozzle 9 by the rotation of the fan 6 driven by the motor 11, and the printed board 13 passes through the surface of the jetted molten solder to solder the components.
【００２３】このとき、重量計測手段１６により半田槽
２内の溶融半田の重量を計測し、溶融半田量が少ない場
合は半田液面の高さが低くなるので、制御手段１７は、
モータ１１の回転数を上げてファン６の回転数を上昇
し、ノズル９からの半田の噴流を強くして半田液面を高
くし、逆に、溶融半田量が多い場合は半田液面の高さが
高くなるので、ファン６の回転数を下げて、ノズル９か
らの半田の噴流を弱くして半田液面を低くすることによ
り、半田液面の高さが一定になるように制御する。At this time, the weight measuring means 16 measures the weight of the molten solder in the solder bath 2, and when the amount of the molten solder is small, the height of the solder liquid surface becomes low.
The number of rotations of the motor 11 is increased to increase the number of rotations of the fan 6, the flow of solder from the nozzle 9 is strengthened to raise the solder liquid level, and conversely, when the amount of molten solder is large, the solder liquid level is increased. Therefore, the rotation speed of the fan 6 is lowered to weaken the jet flow of the solder from the nozzles 9 to lower the solder liquid level, thereby controlling the height of the solder liquid surface to be constant.
【００２４】これにより、プリント基板１３に電子部品
に半田付けを行うのに適度な半田噴流を実現し、半田噴
流の高さの変化による半田付け性のばらつきの影響をな
くして、常に半田付け性を一定に保つことができ、それ
により従来の半田よりも半田付け性に劣る鉛フリー半田
も使用可能にすることができる。As a result, a solder jet suitable for soldering electronic components to the printed circuit board 13 is realized, and the influence of variations in solderability due to changes in the height of the solder jet is eliminated, and solderability is always maintained. Of the lead-free solder, which is inferior in solderability to the conventional solder, can be used.
【００２５】（実施例３）図４に示すように、温度計測
手段１８は、半田槽２内の溶融半田の温度を計測するも
ので、その出力を制御手段１９に入力し、制御手段１９
は、温度計測手段１８からの入力信号に基づいてモータ
１１を制御し、半田液面１２の高さが一定になるように
している。他の構成は上記実施例１と同じである。(Embodiment 3) As shown in FIG. 4, the temperature measuring means 18 measures the temperature of the molten solder in the solder bath 2. The output of the temperature measuring means 18 is input to the control means 19, and the control means 19 is used.
Controls the motor 11 based on the input signal from the temperature measuring means 18 so that the height of the solder liquid surface 12 becomes constant. The other structure is the same as that of the first embodiment.
【００２６】上記構成において動作を説明する。半田槽
２内の溶融半田は、モータ１１により駆動されるファン
６が回転することによりノズル９より噴流され、その噴
流された溶融半田の表面をプリント基板１３が通り、部
品を半田付けする。The operation of the above configuration will be described. The molten solder in the solder bath 2 is jetted from the nozzle 9 by the rotation of the fan 6 driven by the motor 11, and the printed board 13 passes through the surface of the jetted molten solder to solder the components.
【００２７】このとき、温度計測手段１８により半田槽
２内の溶融半田の温度を計測し、溶融半田の温度が低い
場合は溶融半田の粘性が大きいので、制御手段１９は、
モータ１１の回転数を上げてファン６の回転数を上昇
し、ノズル９からの半田の噴流を強くして半田液面を高
くし、逆に、溶融半田の温度が高い場合は溶融半田の粘
性が小さいので、ファン６の回転数を下げて、ノズル９
からの半田の噴流を弱くして半田液面を低くすることに
より、半田液面の高さが一定になるように制御する。At this time, the temperature of the molten solder in the solder bath 2 is measured by the temperature measuring means 18, and when the temperature of the molten solder is low, the viscosity of the molten solder is high.
The rotation speed of the motor 11 is increased to increase the rotation speed of the fan 6, the jet flow of the solder from the nozzle 9 is strengthened to raise the solder liquid level, and conversely, when the temperature of the molten solder is high, the viscosity of the molten solder is high. Is small, lower the rotation speed of the fan 6
The height of the solder liquid level is controlled to be constant by weakening the solder jet flow from the to lower the solder liquid level.
【００２８】これにより、プリント基板１３に電子部品
に半田付けを行うのに適度な半田噴流を実現し、半田噴
流の高さの変化による半田付け性のばらつきの影響をな
くして、常に半田付け性を一定に保つことができ、それ
により従来の半田よりも半田付け性に劣る鉛フリー半田
も使用可能にすることができる。As a result, a solder jet suitable for soldering electronic components to the printed circuit board 13 is realized, and the influence of the variation in the solderability due to the change in the height of the solder jet is eliminated, and the solderability is always maintained. Of the lead-free solder, which is inferior in solderability to the conventional solder, can be used.
【００２９】（実施例４）図５に示すように、入力手段
２０は、半田槽２内の溶融半田の材質を入力するもの
で、制御手段２１に入力し、制御手段２１は、入力手段
２０より入力された半田の材質に基づいてモータ１１を
制御し、半田液面の高さを半田の材質に応じた適度な高
さになるようにしている。他の構成は上記実施例１と同
じである。(Embodiment 4) As shown in FIG. 5, the input means 20 is for inputting the material of the molten solder in the solder bath 2, which is input to the control means 21, and the control means 21 inputs the input means 20. The motor 11 is controlled on the basis of the material of the solder inputted further so that the height of the liquid surface of the solder becomes an appropriate height according to the material of the solder. The other structure is the same as that of the first embodiment.
【００３０】上記構成において動作を説明する。半田槽
２内の溶融半田は、モータ１１により駆動されるファン
６が回転することによりノズル９より噴流され、その噴
流された溶融半田の表面をプリント基板１３が通り、部
品を半田付けする。The operation of the above configuration will be described. The molten solder in the solder bath 2 is jetted from the nozzle 9 by the rotation of the fan 6 driven by the motor 11, and the printed board 13 passes through the surface of the jetted molten solder to solder the components.
【００３１】このとき、入力手段２０より入力した半田
の材質が溶融時の粘性が大きいものならば、制御手段２
１は、モータ１１の回転数を上げてファン６の回転数を
上昇し、ノズル９からの半田の噴流を強くして半田液面
を高くし、半田の材質が溶融時の粘性が小さいものなら
ば、ファン６の回転数を下げて、ノズル９からの半田の
噴流を弱くして半田液面を低くすることにより、半田液
面の高さを半田の材質に応じた適度な高さになるように
制御する。At this time, if the material of the solder inputted from the input means 20 has a large viscosity when melted, the control means 2
In No. 1, if the rotation speed of the motor 11 is increased to increase the rotation speed of the fan 6, the jet flow of the solder from the nozzle 9 is strengthened to raise the solder liquid level, and the viscosity of the solder material is small when melted For example, by lowering the rotation speed of the fan 6 and weakening the jet of solder from the nozzle 9 to lower the solder liquid surface, the height of the solder liquid surface becomes an appropriate height according to the material of the solder. To control.
【００３２】また、半田の材質が半田付け性が弱い材質
ならば、制御手段２１は、モータ１１の回転数を上げて
ファン６の回転数を上昇し、ノズル９からの半田の噴流
を強くして半田液面を高くし、半田の材質が半田付け性
が強い材質ならば、ファン６の回転数を下げて、ノズル
９からの半田の噴流を弱くして半田液面を低くすること
により、半田液面の高さを半田の材質に応じた適度な高
さになるように制御する。If the solder material has a poor solderability, the control means 21 increases the rotation speed of the motor 11 to increase the rotation speed of the fan 6 to strengthen the jet flow of the solder from the nozzle 9. If the solder liquid level is high and the solder material has a strong solderability, the rotation speed of the fan 6 is reduced to weaken the jet flow of the solder from the nozzle 9 to lower the solder liquid level. The height of the solder liquid surface is controlled to an appropriate height according to the material of the solder.
【００３３】[0033]
【発明の効果】以上のように本発明の請求項１に記載の
発明によれば、溶融半田が入った半田槽と、前記半田槽
に設け溶融半田を噴流する噴流部と、前記噴流部から半
田を噴流させる噴流発生手段と、前記噴流発生手段を駆
動する駆動手段と、噴流された溶融半田の液面の高さを
計測する高さ計測手段と、前記駆動手段を制御して噴流
の強さを制御する制御手段とを備え、前記制御手段は、
前記高さ計測手段からの入力信号に基づいて前記駆動手
段を制御し、半田液面の高さが一定になるようにしたか
ら、噴流発生手段を駆動することにより噴流部より噴流
させた溶融半田の液面の高さを高さ計測手段により計測
し、この高さ計測手段が計測した値を基に、制御手段に
より駆動手段を制御して噴流の強さを調整することで、
半田液面の高さを常に一定になるようにでき、半田付け
性の劣化を防ぎ、それにより従来の半田よりも半田付け
性に劣る鉛フリー半田も使用可能にすることができる。As described above, according to the first aspect of the present invention, the solder bath containing the molten solder, the jet portion for jetting the molten solder in the solder bath, and the jet portion Jet generating means for jetting solder, driving means for driving the jet generating means, height measuring means for measuring the height of the liquid surface of the jetted molten solder, and the driving means for controlling the jet strength. And a control means for controlling the
Since the driving means is controlled based on the input signal from the height measuring means so that the height of the solder liquid surface is constant, the molten solder is jetted from the jet portion by driving the jet flow generating means. By measuring the height of the liquid surface of the by the height measuring means, based on the value measured by this height measuring means, by controlling the drive means by the control means to adjust the strength of the jet,
The height of the solder liquid surface can be made constant at all times to prevent deterioration of solderability, and thereby lead-free solder, which is inferior to conventional solder in solderability, can be used.
【００３４】請求項２に記載の発明によれば、高さ計測
手段に代えて、半田槽内の溶融半田の重量を計測する重
量計測手段を備え、制御手段は、前記重量計測手段から
の入力信号に基づいて駆動手段を制御し、半田液面の高
さが一定になるようにしたから、半田槽内の溶融半田の
重量を重量計測手段により計測し、この重量計測手段が
計測した値を基に、制御手段により駆動手段を制御して
噴流の強さを調整することで、溶融半田量の変化による
半田液面の変化を防ぎ、半田液面の高さが常に一定にな
るようにでき、半田槽内の半田の重量変化による半田付
け性のばらつきを防ぎ、それにより従来の半田よりも半
田付け性に劣る鉛フリー半田も使用可能にすることがで
きる。According to the invention of claim 2, instead of the height measuring means, a weight measuring means for measuring the weight of the molten solder in the solder bath is provided, and the control means receives the input from the weight measuring means. Since the driving means is controlled based on the signal so that the height of the solder liquid surface is constant, the weight of the molten solder in the solder bath is measured by the weight measuring means, and the value measured by this weight measuring means is calculated. Based on this, by controlling the drive means by the control means to adjust the strength of the jet flow, it is possible to prevent the change in the solder liquid level due to the change in the amount of molten solder and to keep the height of the solder liquid surface constant. It is possible to prevent the solderability from varying due to the weight change of the solder in the solder bath, and thereby to use the lead-free solder, which is inferior to the conventional solder in solderability.
【００３５】請求項３に記載の発明によれば、高さ計測
手段に代えて、半田槽内の溶融半田の温度を計測する温
度計測手段を備え、制御手段は、前記温度計測手段から
の入力信号に基づいて駆動手段を制御し、半田液面の高
さが一定になるようにしたから、半田槽内の溶融半田の
温度を温度計測手段により計測し、温度計測手段が計測
した値を基に、制御手段により駆動手段を制御して噴流
の強さを調整することで、溶融半田の温度による半田粘
度変化による半田液面の変化を防ぎ、半田液面の高さが
常に一定になるようにでき、半田槽内の半田の温度変化
による半田付け性のばらつきを防ぎ、それにより従来の
半田よりも半田付け性に劣る鉛フリー半田も使用可能に
することができる。According to the third aspect of the present invention, the height measuring means is replaced by a temperature measuring means for measuring the temperature of the molten solder in the solder bath, and the control means receives the input from the temperature measuring means. Since the driving means is controlled based on the signal so that the height of the solder liquid surface becomes constant, the temperature of the molten solder in the solder bath is measured by the temperature measuring means, and the value measured by the temperature measuring means is used as the basis. Further, by controlling the driving means by the control means to adjust the strength of the jet flow, the change of the solder liquid level due to the change of the solder viscosity due to the temperature of the molten solder is prevented, and the height of the solder liquid surface is always constant. Therefore, it is possible to prevent the solderability from varying due to the temperature change of the solder in the solder bath, and to use the lead-free solder, which is inferior to the conventional solder in solderability.
【００３６】請求項４に記載の発明によれば、高さ計測
手段に代えて、半田槽内の溶融半田の材質を入力する入
力手段を備え、制御手段は、前記入力手段より入力され
た半田の材質に基づいて駆動手段を制御し、半田液面の
高さを半田の材質に応じた適度な高さになるようにした
から、半田材質に応じた半田液面の高さを実現できて、
それにより従来の半田よりも半田付け性に劣る鉛フリー
半田も使用可能にすることができる。According to the fourth aspect of the present invention, the height measuring means is replaced by an input means for inputting the material of the molten solder in the solder bath, and the control means is the solder input from the input means. The drive means is controlled based on the material of the solder, and the height of the solder liquid surface is set to an appropriate height according to the material of the solder, so that the height of the solder liquid surface according to the solder material can be realized. ,
As a result, lead-free solder, which is inferior to conventional solder in solderability, can be used.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の第１の実施例の噴流式自動半田付け装
置のブロック図FIG. 1 is a block diagram of a jet-type automatic soldering device according to a first embodiment of the present invention.
【図２】同噴流式自動半田付け装置の要部側面図FIG. 2 is a side view of a main part of the jet-type automatic soldering device.
【図３】本発明の第２の実施例の噴流式自動半田付け装
置のブロック図FIG. 3 is a block diagram of a jet-type automatic soldering device according to a second embodiment of the present invention.
【図４】本発明の第３の実施例の噴流式自動半田付け装
置のブロック図FIG. 4 is a block diagram of a jet type automatic soldering device according to a third embodiment of the present invention.
【図５】本発明の第４の実施例の噴流式自動半田付け装
置のブロック図FIG. 5 is a block diagram of a jet-type automatic soldering device according to a fourth embodiment of the present invention.
【図６】従来の噴流式自動半田付け装置の斜視図FIG. 6 is a perspective view of a conventional jet-type automatic soldering device.
【図７】同噴流式自動半田付け装置の一部切欠した側面
図FIG. 7 is a partially cutaway side view of the same jet type automatic soldering device.
２ 半田槽 ６ ファン（噴流発生手段） ９ ノズル（噴流部） １１ モータ（駆動手段） １４ 半田面センサ（高さ計測手段） １５ 制御手段 2 Solder bath 6 fans (jet generation means) 9 nozzles (jet part) 11 Motor (drive means) 14 Solder surface sensor (height measuring means) 15 Control means
───────────────────────────────────────────────────── フロントページの続き (72)発明者 増本 悟一 大阪府大阪市北区梅田１丁目３番１−400 号 株式会社エクセルテクノ内 (72)発明者 坂口 政美 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 4E080 AA01 AB03 CA11 CB02 CB04 5E319 AA01 AA07 AC01 CC24 CD51 GG03 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Goichi Masumoto 1-3-3 Umeda, Kita-ku, Osaka City, Osaka Prefecture No. Excel Techno Co., Ltd. (72) Inventor Masami Sakaguchi 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd. F-term (reference) 4E080 AA01 AB03 CA11 CB02 CB04 5E319 AA01 AA07 AC01 CC24 CD51 GG03
Claims (4)
に設け溶融半田を噴流する噴流部と、前記噴流部から半
田を噴流させる噴流発生手段と、前記噴流発生手段を駆
動する駆動手段と、噴流された溶融半田の液面の高さを
計測する高さ計測手段と、前記駆動手段を制御して噴流
の強さを制御する制御手段とを備え、前記制御手段は、
前記高さ計測手段からの入力信号に基づいて前記駆動手
段を制御し、半田液面の高さが一定になるようにした噴
流式自動はんだ付け装置。1. A solder bath containing molten solder, a jet portion for jetting the molten solder, provided in the solder bath, a jet flow generating means for jetting the solder from the jet flow portion, and a driving means for driving the jet flow generating means. And a height measuring means for measuring the height of the liquid surface of the jetted molten solder, and a control means for controlling the driving means to control the strength of the jet flow.
A jet type automatic soldering device in which the driving means is controlled based on an input signal from the height measuring means so that the height of the solder liquid surface becomes constant.
半田の重量を計測する重量計測手段を備え、制御手段
は、前記重量計測手段からの入力信号に基づいて駆動手
段を制御し、半田液面の高さが一定になるようにした請
求項１記載の噴流式自動はんだ付け装置。2. A weight measuring means for measuring the weight of the molten solder in the solder bath is provided instead of the height measuring means, and the control means controls the drive means based on an input signal from the weight measuring means. The jet-type automatic soldering device according to claim 1, wherein the height of the solder liquid surface is constant.
半田の温度を計測する温度計測手段を備え、制御手段
は、前記温度計測手段からの入力信号に基づいて駆動手
段を制御し、半田液面の高さが一定になるようにした請
求項１記載の噴流式自動はんだ付け装置。3. A temperature measuring means for measuring the temperature of the molten solder in the solder bath is provided instead of the height measuring means, and the control means controls the driving means based on an input signal from the temperature measuring means. The jet-type automatic soldering device according to claim 1, wherein the height of the solder liquid surface is constant.
半田の材質を入力する入力手段を備え、制御手段は、前
記入力手段より入力された半田の材質に基づいて駆動手
段を制御し、半田液面の高さを半田の材質に応じた適度
な高さになるようにした請求項１記載の噴流式自動はん
だ付け装置。4. The height measuring means is replaced by an input means for inputting the material of the molten solder in the solder bath, and the control means controls the driving means based on the material of the solder input from the input means. The jet-type automatic soldering device according to claim 1, wherein the height of the solder liquid surface is set to an appropriate height according to the material of the solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001337675A JP2003136233A (en) | 2001-11-02 | 2001-11-02 | Jet type automatic soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001337675A JP2003136233A (en) | 2001-11-02 | 2001-11-02 | Jet type automatic soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003136233A true JP2003136233A (en) | 2003-05-14 |
Family
ID=19152274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001337675A Pending JP2003136233A (en) | 2001-11-02 | 2001-11-02 | Jet type automatic soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003136233A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005035176A1 (en) | 2003-10-10 | 2005-04-21 | Senju Metal Industry Co., Ltd. | Jet solder vessel |
| EP2202022A1 (en) | 2008-12-27 | 2010-06-30 | Senju Metal Industry Co., Ltd | Solder bath and method of heating solder contained in a solder bath |
| JP2012256954A (en) * | 2012-10-02 | 2012-12-27 | Mitsubishi Electric Corp | Electronic control system |
| JP2016219736A (en) * | 2015-05-26 | 2016-12-22 | 三菱電機株式会社 | Soldering device and soldering method |
| DE102022117209A1 (en) | 2022-07-11 | 2024-01-11 | Ersa Gmbh | Method for operating a soldering system, in particular a wave soldering or selective soldering system, and associated soldering system |
-
2001
- 2001-11-02 JP JP2001337675A patent/JP2003136233A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005035176A1 (en) | 2003-10-10 | 2005-04-21 | Senju Metal Industry Co., Ltd. | Jet solder vessel |
| US8215534B2 (en) | 2003-10-10 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Wave soldering tank |
| US9956633B2 (en) | 2003-10-10 | 2018-05-01 | Senju Metal Industry Co., Ltd. | Wave soldering tank |
| EP2202022A1 (en) | 2008-12-27 | 2010-06-30 | Senju Metal Industry Co., Ltd | Solder bath and method of heating solder contained in a solder bath |
| JP2012256954A (en) * | 2012-10-02 | 2012-12-27 | Mitsubishi Electric Corp | Electronic control system |
| JP2016219736A (en) * | 2015-05-26 | 2016-12-22 | 三菱電機株式会社 | Soldering device and soldering method |
| DE102022117209A1 (en) | 2022-07-11 | 2024-01-11 | Ersa Gmbh | Method for operating a soldering system, in particular a wave soldering or selective soldering system, and associated soldering system |
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