JP2003089154A - Ultrasonic welding device and electronic part-mounted module - Google Patents

Ultrasonic welding device and electronic part-mounted module

Info

Publication number
JP2003089154A
JP2003089154A JP2001283603A JP2001283603A JP2003089154A JP 2003089154 A JP2003089154 A JP 2003089154A JP 2001283603 A JP2001283603 A JP 2001283603A JP 2001283603 A JP2001283603 A JP 2001283603A JP 2003089154 A JP2003089154 A JP 2003089154A
Authority
JP
Japan
Prior art keywords
substrate
electronic component
resin case
ultrasonic welding
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001283603A
Other languages
Japanese (ja)
Inventor
Masaki Hasegawa
正毅 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2001283603A priority Critical patent/JP2003089154A/en
Publication of JP2003089154A publication Critical patent/JP2003089154A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30223—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/542—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining hollow covers or hollow bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8141—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined
    • B29C66/81427—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined comprising a single ridge, e.g. for making a weakening line; comprising a single tooth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce friction heat energy and vibration energy to be applied to an electronic part at the time of ultrasonic welding to prevent the destruction of the electronic part. SOLUTION: In the ultrasonic welding device for bonding two resin cases 3, 4 holding a substrate 1, on which the electronic part 2 is mounted, by ultrasonic welding, a recessed part 5a is formed to a welding contact surface coming into contact with the upper resin case 3 from above and, at the time of ultrasonic welding, the welding contact surface is arranged so that the electronic part 2 of the substrate 1 held by two resin cases 3 and 4 and the recessed part 5a are mutually opposed through the upper resin case 3. Further, the electronic part-mounted module is constituted so that a lower recessed part 4b for housing the electronic part 2 is formed on the upper surface of the lower resin case 4, and an upper recessed part 3a having a shape smaller than the outer shape of the substrate 1 but larger than the shape of the mounted electronic part 2 is formed on the upper surface of the lower resin case 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、主に超音波振動お
よび熱ストレスの影響を受けやすい電子部品が実装され
た基板（例えば、ＦＰＣ（フレキシブルプリント回路基
板））を２個の樹脂ケースの間に挟み込み、超音波溶着
により接合する超音波溶着装置およびこの装置を用いて
形成された電子部品実装モジュールに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a board (for example, an FPC (flexible printed circuit board)) on which electronic parts that are susceptible to ultrasonic vibration and thermal stress are mounted between two resin cases. TECHNICAL FIELD The present invention relates to an ultrasonic welding device that is sandwiched between and bonded by ultrasonic welding, and an electronic component mounting module formed using this device.

【０００２】[0002]

【従来の技術】従来の電子部品実装モジュールは、一般
的に、ベース基板と、このベース基板に実装された電子
部品と、これらベース基板および電子部品を覆う樹脂部
とから構成されている。この樹脂部を形成する方法とし
て、電子部品が実装されたベース基板を２個の樹脂ケー
スで挟み込み、この状態で２個の樹脂ケースに超音波振
動エネルギーを与えて、これら樹脂ケースを互いに溶着
する、といった樹脂ケース溶着方法が用いられていた。2. Description of the Related Art A conventional electronic component mounting module generally comprises a base substrate, electronic components mounted on the base substrate, and a resin portion covering the base substrate and the electronic components. As a method of forming this resin portion, a base substrate on which electronic components are mounted is sandwiched between two resin cases, ultrasonic vibration energy is applied to the two resin cases in this state, and these resin cases are welded to each other. The resin case welding method such as, has been used.

【０００３】この従来の樹脂ケース溶着方法について図
面を参照しつつ説明する。This conventional method for welding a resin case will be described with reference to the drawings.

【０００４】図６は溶着直前の樹脂ケースの一例を示す
斜視図であり、図７は図６のＣ−Ｃ線断面図、図８は溶
着処理中の樹脂ケースの一例を示す断面図である。FIG. 6 is a perspective view showing an example of the resin case immediately before welding, FIG. 7 is a sectional view taken along the line CC of FIG. 6, and FIG. 8 is a sectional view showing an example of the resin case during the welding process. .

【０００５】従来の樹脂ケース溶着方法は、ＦＰＣ基板
等のようなベース基板（以下、単に「基板」という）１
０１の中央部に電子部品１０２を実装し、この基板１０
１を２個の樹脂ケース１０３，１０４の間に挟み込み、
この状態で超音波振動伝達ホーン（以下、単に「ホー
ン」という）１０５を用いてこれら樹脂ケース１０３，
１０４を互いに溶着して、電子部品実装モジュールを形
成するものである。The conventional resin case welding method uses a base substrate (hereinafter simply referred to as "substrate") 1 such as an FPC substrate.
The electronic component 102 is mounted on the central portion of 01, and the substrate 10
1 is sandwiched between two resin cases 103 and 104,
In this state, an ultrasonic vibration transmission horn (hereinafter simply referred to as “horn”) 105 is used to remove these resin cases 103,
The components 104 are welded to each other to form an electronic component mounting module.

【０００６】２個の樹脂ケース１０３，１０４のうち、
下側に配置された樹脂ケース１０４は、その上面中央部
に基板１０１を嵌め込むための第１凹部１０４ａが形成
されており、この第１凹部１０４ａの底面の中央部に、
電子部品１０２を樹脂ケース１０４に接触させないため
の第２凹部１０４ｂが形成されている。一方、上側に配
置された樹脂ケース１０３の下面には、第１凹部１０４
ａの周辺部（即ち、超音波溶着部１０４ｃ）に対向する
部分に、凸部１０３ａが形成されている。Of the two resin cases 103 and 104,
The resin case 104 arranged on the lower side is formed with a first recess 104a for fitting the substrate 101 in the center of the upper surface thereof, and in the center of the bottom surface of the first recess 104a,
A second recess 104b for preventing the electronic component 102 from contacting the resin case 104 is formed. On the other hand, the first recess 104 is formed on the lower surface of the resin case 103 arranged on the upper side.
A convex portion 103a is formed in a portion facing the peripheral portion of a (that is, the ultrasonic welding portion 104c).

【０００７】一般に、ベース基板として腰がある基板１
０１を用いた場合には、基板１０１にそりが生じること
がある。この場合、例えば基板１０１の中央部が上方に
盛り上がるようにそりが生じた場合には、上側の樹脂ケ
ース１０３の上方に配置されたホーン１０５を下方に移
動して、樹脂ケース１０３を下側の樹脂ケース１０４に
押し付けたとき、樹脂ケース１０３の凸部１０３ａが樹
脂ケース１０４の超音波溶着部１０４ｃに接触すると同
時に、基板１０１の電子部品１０２実装領域が樹脂ケー
ス１０３の下面に接触することになる。Generally, a flexible substrate 1 as a base substrate
When 01 is used, the substrate 101 may be warped. In this case, for example, when a warp occurs so that the central portion of the substrate 101 rises upward, the horn 105 arranged above the upper resin case 103 is moved downward to move the resin case 103 to the lower side. When pressed against the resin case 104, the convex portion 103a of the resin case 103 comes into contact with the ultrasonic welding portion 104c of the resin case 104, and at the same time, the electronic component 102 mounting area of the substrate 101 comes into contact with the lower surface of the resin case 103. .

【０００８】その結果、ホーン１０５から発生する超音
波振動エネルギー（矢印Ｅ１０１で示す）が、樹脂ケー
ス１０３に伝わった後、樹脂ケース１０３の凸部１０３
ａと樹脂ケース１０４の超音波溶着部１０４ｃとの接触
部位ａ，ｂと、樹脂ケース１０３と基板１０１の電子部
品実装領域との接触部位ｃとに集中してしまうことにな
る。As a result, the ultrasonic vibration energy (indicated by arrow E101) generated from the horn 105 is transmitted to the resin case 103, and then the convex portion 103 of the resin case 103 is formed.
The contact points a and b between the a and the ultrasonic welding portion 104c of the resin case 104 and the contact point c between the resin case 103 and the electronic component mounting area of the substrate 101 are concentrated.

【０００９】このように、接触部位ｃに超音波振動エネ
ルギーが集中すると、樹脂ケース１０３と電子部品１０
２との間で摩擦熱が発生し、この熱エネルギーの影響で
電子部品１０２が熱破壊されるといった問題があった。As described above, when the ultrasonic vibration energy is concentrated on the contact portion c, the resin case 103 and the electronic component 10 are
There is a problem that frictional heat is generated between the electronic component 102 and the electronic component 102 and the electronic component 102 is thermally destroyed by the influence of this thermal energy.

【００１０】また、電子部品１０２として半導体チップ
等を用いた場合は、電子部品１０２を基板１０１に実装
するときに、電子部品１０２と基板１０１上の配線とを
ワイヤボンディングによって電気的に接続しているが、
この場合には、超音波振動エネルギーの影響でワイヤが
断線するといった問題があった。When a semiconductor chip or the like is used as the electronic component 102, when the electronic component 102 is mounted on the substrate 101, the electronic component 102 and the wiring on the substrate 101 are electrically connected by wire bonding. But
In this case, there is a problem that the wire is broken due to the influence of ultrasonic vibration energy.

【００１１】さらに、超音波振動エネルギーは、ホーン
１０５を備えている超音波溶着装置の特性上、超音波振
動エネルギーが中央部（接触部位ｃ）に集中する傾向が
あり、前述したような形状のホーン１０５を用いて超音
波溶着を行なった場合には、電子部品１０２へかかるダ
メージも非常に大きいといった問題があった。Furthermore, due to the characteristics of the ultrasonic welding device equipped with the horn 105, the ultrasonic vibration energy tends to concentrate at the central portion (contact portion c), and the ultrasonic vibration energy having the above-mentioned shape is used. When ultrasonic welding is performed using the horn 105, there is a problem that damage to the electronic component 102 is also extremely large.

【００１２】このような問題を解決するために、電子部
品１０２が樹脂ケース１０３に接触することを防止する
ことを目的として、図９に示すように、樹脂ケース１０
４の第１凹部１０４ａの底面に接着テープ１０６を貼り
付けるかまたは接着剤を塗布することにより、ホーン１
０５を直接接触させない側の樹脂ケース１０４（即ち、
下側に配置されたホーン１０４）に基板１０１を固定
し、超音波振動エネルギーが電子部品１０２に直接影響
しないようにしていた。In order to solve such a problem, in order to prevent the electronic component 102 from contacting the resin case 103, as shown in FIG.
4 is attached to the bottom surface of the first recess 104a of No. 4 or the adhesive is applied to the horn 1.
05 does not come into direct contact with the resin case 104 (that is,
The substrate 101 was fixed to the horn 104) arranged on the lower side so that the ultrasonic vibration energy did not directly affect the electronic component 102.

【００１３】図１０は図９に示す樹脂ケースを用いて溶
着処理を実施する工程の一例を示す断面図、図１１は図
９に示す樹脂ケースを用いて形成された電子部品実装モ
ジュールの一例を示す斜視図、図１２は図１１のＤ−Ｄ
線断面図である。FIG. 10 is a cross-sectional view showing an example of a process for carrying out a welding process using the resin case shown in FIG. 9, and FIG. 11 is an example of an electronic component mounting module formed using the resin case shown in FIG. FIG. 12 is a perspective view shown in FIG.
It is a line sectional view.

【００１４】前述したように、接着テープ１０６を貼り
付けた樹脂ケース１０４を用いることにより、基板１０
１の端部付近を第１凹部１０４ａの底面に沿わせること
ができる。従って、基板１０１の中央部と上側に配置さ
れた樹脂ケース１０３とが接触し、接触により発生した
熱エネルギーの影響で電子部品１０２が熱破壊されると
いった問題を防止することができる。As described above, by using the resin case 104 to which the adhesive tape 106 is attached, the substrate 10
The vicinity of one end can be along the bottom surface of the first recess 104a. Therefore, it is possible to prevent the problem that the central part of the substrate 101 and the resin case 103 arranged on the upper side are brought into contact with each other and the electronic component 102 is thermally destroyed due to the influence of the thermal energy generated by the contact.

【００１５】また、特開２０００−６２０２９号公報に
開示されている超音波溶着ホーンでは、前述のような問
題を解決するために、超音波溶着ホーンの下面のうち、
溶着物（例えば樹脂ケース）に接触させる部位以外の部
位に、超音波溶着ホーンの超音波振動エネルギーを吸収
するための弾性部材を取り付けていた。In the ultrasonic welding horn disclosed in Japanese Unexamined Patent Publication No. 2000-62029, in order to solve the above-mentioned problems, among the lower surfaces of the ultrasonic welding horn,
An elastic member for absorbing the ultrasonic vibration energy of the ultrasonic welding horn was attached to a portion other than the portion to be brought into contact with the welded material (for example, resin case).

【００１６】[0016]

【発明が解決しようとする課題】しかしながら、従来の
超音波溶着装置においては、超音波溶着時の振動エネル
ギーが直接電子部品に伝わらないように、接着テープ等
を用いて基板を樹脂ケースに固定していたため、接着テ
ープを樹脂ケースに貼り付けるために作業工程数が増
え、また、接着テープを用いるための材料費用が発生す
るため、生産コストが高くなるといった問題があった。However, in the conventional ultrasonic welding apparatus, the substrate is fixed to the resin case with an adhesive tape or the like so that the vibration energy during ultrasonic welding is not directly transmitted to the electronic parts. Therefore, there is a problem that the number of working steps is increased in order to attach the adhesive tape to the resin case, and the material cost for using the adhesive tape is generated, so that the production cost is increased.

【００１７】さらに、接着テープと基板との間の接着状
態が良くない等といった理由で、基板が樹脂ケースに密
着されなかった場合には、電子部品が上側に配置された
樹脂ケースに接触するため、振動エネルギーが直接電子
部品に伝わることを確実に防止できないといった問題も
あった。Further, when the substrate is not adhered to the resin case because the adhesive state between the adhesive tape and the substrate is not good, the electronic parts come into contact with the resin case arranged on the upper side. However, there is also a problem that it is impossible to reliably prevent the vibration energy from being directly transmitted to the electronic component.

【００１８】また、超音波溶着ホーンに弾性部材を取り
付けた場合においては、弾性部材により振動エネルギー
は吸収できるが、振動エネルギーは直接ケース中央部に
伝わるため、確実に防止できないといった問題があっ
た。Further, when the elastic member is attached to the ultrasonic welding horn, there is a problem that the elastic member can absorb the vibration energy, but the vibration energy is directly transmitted to the central portion of the case, so that it cannot be reliably prevented.

【００１９】本発明はこのような問題を解決すべく創案
されたものであり、超音波溶着時に電子部品にかかる摩
擦熱エネルギーおよび振動エネルギーを軽減し、電子部
品の破壊を防止するとともに、接着シード等の貼り付け
による作業工程数の増加や生産コストの増加を防止する
ことができる超音波溶着装置およびこの装置を用いて形
成された電子部品実装モジュールを提供することを目的
としている。The present invention was devised to solve such a problem, and reduces frictional heat energy and vibration energy applied to electronic parts during ultrasonic welding to prevent the electronic parts from being destroyed and to bond the seeds. It is an object of the present invention to provide an ultrasonic welding device capable of preventing an increase in the number of working steps and an increase in production cost due to the sticking of the like and an electronic component mounting module formed using this device.

【００２０】[0020]

【課題を解決するための手段】本発明の超音波溶着装置
は、電子部品が実装された基板とこの基板を上下方向か
ら挟み込む２個の樹脂ケースとからなる電子部品実装モ
ジュールを製造する工程において用いられ、前記基板を
挟み込んだ２個の樹脂ケースを超音波溶着により接合す
る超音波溶着装置であって、上側の樹脂ケースに上方か
ら接触する溶着接触面に凹部が形成され、超音波溶着接
合時には、前記２個の樹脂ケースにより挟み込まれた基
板の電子部品と前記凹部とが上側の樹脂ケースを介して
対向するように溶着接触面が配置されるといったもので
ある。The ultrasonic welding apparatus of the present invention is used in a process of manufacturing an electronic component mounting module including a substrate on which electronic components are mounted and two resin cases sandwiching the substrate from above and below. An ultrasonic welding device used for joining two resin cases sandwiching the substrate by ultrasonic welding, wherein a concave portion is formed on a welding contact surface which comes into contact with an upper resin case from above, and the ultrasonic welding is performed. In some cases, the welding contact surface is arranged so that the electronic component of the substrate sandwiched by the two resin cases and the recess face each other via the upper resin case.

【００２１】この発明によれば、超音波振動エネルギー
が電子部品に直接かかることを防止できる。According to the present invention, it is possible to prevent the ultrasonic vibration energy from being directly applied to the electronic component.

【００２２】本発明の電子部品実装モジュールは、電子
部品が実装された基板と、この基板を上下方向から挟み
込む２個の樹脂ケースとからなり、これら２個の樹脂ケ
ースがその周囲を超音波溶着により接合された構造の電
子部品実装モジュールであって、下側の樹脂ケースの上
面に前記電子部品を収納する下側凹部が形成され、上側
の樹脂ケースの下面の電子部品対向部位に、前記基板の
外形形状よりも小さく、かつ実装された電子部品の形状
よりも大きな形状の上側凹部が形成されてなるものであ
る。The electronic component mounting module of the present invention comprises a substrate on which electronic components are mounted, and two resin cases sandwiching the substrate from above and below, and these two resin cases are ultrasonically welded around them. In the electronic component mounting module, the lower recess for accommodating the electronic component is formed on the upper surface of the lower resin case, and the substrate is provided on the lower surface of the upper resin case facing the electronic component. The upper concave portion having a shape smaller than the outer shape and larger than the shape of the mounted electronic component is formed.

【００２３】この発明によれば、接着テープ等といった
特別な部材を用いることなく、電子部品が樹脂ケースに
接触することを防止できる。According to the present invention, it is possible to prevent the electronic component from coming into contact with the resin case without using a special member such as an adhesive tape.

【００２４】また、前記基板に上方へのそりが生じてい
る場合には、前記上側凹部の角縁部によって前記基板が
押さえ込まれることにより、そりが矯正されるようにな
っていてもよい。When the substrate is warped upward, the warp may be corrected by pressing the substrate by the corner edge of the upper recess.

【００２５】この場合には、接着テープ等といった特別
な部材を用いることなく、電子部品が樹脂ケースに接触
することを防止できる。In this case, it is possible to prevent the electronic component from coming into contact with the resin case without using a special member such as an adhesive tape.

【００２６】[0026]

【発明の実施の形態】次に、本発明の超音波溶着装置お
よびこの装置を用いて形成された電子部品実装モジュー
ルの一実施の形態について図面を参照しつつ説明する。BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of an ultrasonic welding apparatus of the present invention and an electronic component mounting module formed using this apparatus will be described with reference to the drawings.

【００２７】図１は本発明の超音波溶着装置の一実施の
形態とこの装置を用いて形成される電子部品実装モジュ
ールの一実施の形態とを示す斜視図であり、図２は図１
のＡ−Ａ線断面図、図３は溶着処理中の超音波溶着装置
および電子部品実装モジュールを示す断面図である。な
お、図１および図２には、溶着処理を施す直前の超音波
溶着装置および電子部品実装モジュールを示している。
また、図４は溶着処理後の電子部品実装モジュールの一
例を示す斜視図であり、図５は図４のＢ−Ｂ線断面図で
ある。FIG. 1 is a perspective view showing an embodiment of an ultrasonic welding apparatus of the present invention and an embodiment of an electronic component mounting module formed using this apparatus, and FIG.
3 is a sectional view taken along line AA of FIG. 3, and FIG. 3 is a sectional view showing an ultrasonic welding apparatus and an electronic component mounting module during a welding process. 1 and 2 show an ultrasonic welding apparatus and an electronic component mounting module immediately before performing a welding process.
4 is a perspective view showing an example of the electronic component mounting module after the welding process, and FIG. 5 is a sectional view taken along line BB of FIG.

【００２８】この電子部品実装モジュールは、基板１
と、この基板１の下面中央部に実装された電子部品２
と、基板１を上下方向から挟み込む、板状の２個の樹脂
ケース３，４とから構成されている。This electronic component mounting module has a substrate 1
And the electronic component 2 mounted on the center of the lower surface of the substrate 1.
And two plate-shaped resin cases 3 and 4 sandwiching the substrate 1 from above and below.

【００２９】２個の樹脂ケース３，４のうち、上側に配
置された樹脂ケース３の下面中央部（即ち、電子部品２
に対向する位置）には上側凹部３ａが形成されている。
また、下側に配置された樹脂ケース４の上面中央部（即
ち、基板１に対向する位置）には基板１を嵌め込むため
の第１凹部４ａが形成されており、この第１凹部４ａの
中央部（即ち、電子部品２に対向する位置）には電子部
品２を樹脂ケース４に接触させないための第２凹部４ｂ
が形成されている。一方、上側に配置された樹脂ケース
３の下面には、第１凹部４ａの周辺部（即ち、超音波溶
着部４ｃ）に対向する部分に、凸部３ｂが形成されてい
る。Of the two resin cases 3 and 4, the central portion of the lower surface of the resin case 3 arranged on the upper side (that is, the electronic component 2)
An upper concave portion 3a is formed at a position (opposite to).
Further, a first recess 4a for fitting the substrate 1 is formed in the central portion of the upper surface of the resin case 4 arranged on the lower side (that is, at a position facing the substrate 1). A second recess 4b for preventing the electronic component 2 from contacting the resin case 4 at the central portion (that is, the position facing the electronic component 2).
Are formed. On the other hand, on the lower surface of the resin case 3 arranged on the upper side, a convex portion 3b is formed in a portion facing the peripheral portion of the first concave portion 4a (that is, the ultrasonic welding portion 4c).

【００３０】このような樹脂ケース３，４を用いている
ので、樹脂ケース３，４に基板１を嵌め込んだとき、樹
脂ケース３の上側凹部３ａと樹脂ケース４の第２凹部４
ｂとによって形成された中空部に電子部品２を配置する
ことができるとともに、基板１に上方へのそりが生じて
いる場合には、樹脂ケース３の上側凹部３ａの角縁部３
１ａと樹脂ケース４の第１凹部４ａとで基板１を挟み込
むことにより、そりを矯正することができる。Since such resin cases 3 and 4 are used, when the substrate 1 is fitted into the resin cases 3 and 4, the upper recess 3a of the resin case 3 and the second recess 4 of the resin case 4 are inserted.
The electronic component 2 can be arranged in the hollow portion formed by b and when the substrate 1 is warped upward, the corner edge portion 3 of the upper concave portion 3a of the resin case 3 is formed.
The warp can be corrected by sandwiching the substrate 1 between the 1a and the first recess 4a of the resin case 4.

【００３１】これにより、基板１にそりが生じている場
合においても、基板１の電子部品２実装部位が樹脂ケー
ス３に接触することを防止できるので、後述の超音波振
動伝達ホーン５から発生する超音波振動エネルギー（矢
印Ｅ１で示す）を、凸部３ｂと超音波溶着部４ｃとの接
触部位ａ，ｂと、樹脂ケース１０３の上側凹部３ａの角
縁部３１ａと基板１との接触部位ｄ，ｅとに集中させる
ことができる。その結果、超音波溶着接合を確実に実施
することができるとともに、摩擦熱エネルギーの影響で
電子部品２が熱破壊されることを防止できる。As a result, even when the substrate 1 is warped, it is possible to prevent the electronic component 2 mounting portion of the substrate 1 from coming into contact with the resin case 3, so that the ultrasonic vibration transmitting horn 5 described later generates the vibration. Ultrasonic vibration energy (indicated by arrow E1) is applied to the contact portions a and b between the convex portion 3b and the ultrasonic welding portion 4c, and the contact portion d between the corner edge portion 31a of the upper concave portion 3a of the resin case 103 and the substrate 1. , E can be concentrated. As a result, it is possible to reliably carry out ultrasonic welding and to prevent the electronic component 2 from being thermally destroyed due to the influence of frictional heat energy.

【００３２】なお、ここでは基板にその中央部が膨らん
だ状態になるようなそりが生じている場合について説明
しているが、例えば、基板の中央部が凹んだ状態になる
ようなそりが生じている場合においても、樹脂ケース３
の下面と樹脂ケース４の第２凹部４ｂの角縁部とで基板
１を挟み込みそりを矯正することができる。The case where the substrate is warped so that the central portion thereof is inflated has been described here. For example, the warp is such that the central portion of the substrate is recessed. Even when the resin case 3
The substrate 1 can be sandwiched between the lower surface of the substrate 1 and the corner edge of the second recess 4b of the resin case 4 to correct the warp.

【００３３】一方、超音波溶着装置は、超音波振動伝達
ホーン５と、この超音波振動伝達ホーン５を上下方向に
移動させる機構（図示せず）と、超音波振動伝達ホーン
５において超音波振動を発生させる機構（図示せず）と
から構成されている。On the other hand, the ultrasonic welding device includes an ultrasonic vibration transmitting horn 5, a mechanism (not shown) for moving the ultrasonic vibration transmitting horn 5 in the vertical direction, and ultrasonic vibration in the ultrasonic vibration transmitting horn 5. And a mechanism (not shown) for generating

【００３４】この超音波振動伝達ホーン５の下面（溶着
接触面）には、基板１に対向する位置に凹部５ａが形成
されており、凹部５ａの周辺部５ｂのみが樹脂ケース３
の上面に当接するような形状になっている。On the lower surface (welding contact surface) of the ultrasonic vibration transmitting horn 5, a concave portion 5a is formed at a position facing the substrate 1, and only the peripheral portion 5b of the concave portion 5a is formed into the resin case 3.
Is shaped so as to abut the upper surface of the.

【００３５】このような超音波溶着装置を用いているの
で、上側に配置された樹脂ケース３の上面中央部には超
音波振動伝達ホーン５が接触しないため、樹脂ケース３
の凸部３ｂに超音波振動エネルギー（図３中において矢
印Ｅ１で示す）を集中させることができる。その結果、
超音波振動エネルギーが原因で電子部品２に発生してい
たストレスが軽減される。Since the ultrasonic welding apparatus as described above is used, the ultrasonic vibration transmitting horn 5 does not come into contact with the central portion of the upper surface of the resin case 3 arranged on the upper side.
The ultrasonic vibration energy (indicated by arrow E1 in FIG. 3) can be concentrated on the convex portion 3b. as a result,
The stress generated in the electronic component 2 due to the ultrasonic vibration energy is reduced.

【００３６】最後に、前述のような超音波溶着装置を用
いて電子部品実装モジュールに溶着処理を施す工程の一
例について説明する。Finally, an example of a process of performing a welding process on the electronic component mounting module using the ultrasonic welding device as described above will be described.

【００３７】まず、樹脂ケース４内に電子部品２を実装
した基板１を配置する。First, the substrate 1 on which the electronic component 2 is mounted is placed in the resin case 4.

【００３８】そして、この樹脂ケース４上に樹脂ケース
３を載せる。このとき、基板１に上方へのそりが生じて
いた場合には、樹脂ケース３の上側凹部３ａの角縁部３
１ａによって基板１が押さえ込まれる結果、そりを矯正
することができる。従って、基板１の中央部は樹脂ケー
ス３に接触しないので、電子部品２に超音波振動エネル
ギーが直接影響しない。Then, the resin case 3 is placed on the resin case 4. At this time, if the substrate 1 is warped upward, the corner edge 3 of the upper recess 3 a of the resin case 3
As a result of the substrate 1 being pressed by the 1a, the warp can be corrected. Therefore, since the central portion of the substrate 1 does not contact the resin case 3, the ultrasonic vibration energy does not directly affect the electronic component 2.

【００３９】その後、超音波振動伝達ホーン５を樹脂ケ
ース３の上方から下げていき、樹脂ケース３上面に密着
させる。このとき、超音波振動伝達ホーン５下面の周辺
部５ｂのみが樹脂ケース３の上面に接触する。この状態
で、超音波振動伝達ホーン５から樹脂ケース３へ超音波
振動エネルギーを供給する。After that, the ultrasonic vibration transmitting horn 5 is lowered from above the resin case 3 and brought into close contact with the upper surface of the resin case 3. At this time, only the peripheral portion 5b on the lower surface of the ultrasonic vibration transmitting horn 5 contacts the upper surface of the resin case 3. In this state, ultrasonic vibration energy is supplied from the ultrasonic vibration transmission horn 5 to the resin case 3.

【００４０】このような手順を実施することにより、樹
脂ケース３と樹脂ケース４とを超音波溶着接合すること
ができ、電子部品実装モジュールを形成することができ
る。By carrying out such a procedure, the resin case 3 and the resin case 4 can be ultrasonically welded to each other, and an electronic component mounting module can be formed.

【００４１】本発明の超音波溶着装置およびこの装置を
用いて形成された電子部品実装モジュールによれば、超
音波溶着時に電子部品にかかる摩擦熱エネルギーおよび
振動エネルギーを軽減し、電子部品の破壊を防止すると
ともに、接着シード等の貼り付けによる作業工数の増加
や生産コスト増加を防止することができるAccording to the ultrasonic welding device of the present invention and the electronic component mounting module formed using this device, frictional heat energy and vibration energy applied to the electronic component during ultrasonic welding are reduced, and destruction of the electronic component is prevented. In addition to the prevention, it is possible to prevent an increase in the number of work steps and an increase in production cost due to the attachment of the adhesive seed or the like.

【００４２】[0042]

【発明の効果】本発明の超音波溶着装置は、電子部品が
実装された基板とこの基板を上下方向から挟み込む２個
の樹脂ケースとからなる電子部品実装モジュールを製造
する工程において用いられ、基板を挟み込んだ２個の樹
脂ケースを超音波溶着により接合する超音波溶着装置で
あって、上側の樹脂ケースに上方から接触する溶着接触
面に凹部が形成され、超音波溶着接合時には、２個の樹
脂ケースにより挟み込まれた基板の電子部品と凹部とが
上側の樹脂ケースを介して対向するように溶着接触面が
配置されるといったものであり、この発明によれば、超
音波振動エネルギーが原因で電子部品２において発生し
ていたストレスが軽減される。The ultrasonic welding apparatus of the present invention is used in a process of manufacturing an electronic component mounting module including a substrate on which electronic components are mounted and two resin cases sandwiching the substrate from above and below. An ultrasonic welding device for joining two resin cases sandwiching a sheet by ultrasonic welding, in which a recess is formed in a welding contact surface which comes into contact with an upper resin case from above, and at the time of ultrasonic welding, The welding contact surface is arranged so that the electronic component and the recess of the substrate sandwiched by the resin case face each other through the upper resin case. According to the present invention, the ultrasonic vibration energy causes The stress generated in the electronic component 2 is reduced.

【００４３】本発明の電子部品実装モジュールは、電子
部品が実装された基板と、この基板を上下方向から挟み
込む２個の樹脂ケースとからなり、これら２個の樹脂ケ
ースがその周囲を超音波溶着により接合された構造の電
子部品実装モジュールであって、下側の樹脂ケースの上
面に前記電子部品を収納する下側凹部が形成され、上側
の樹脂ケースの下面の電子部品対向部位に、前記基板の
外形形状よりも小さく、かつ実装された電子部品の形状
よりも大きな形状の上側凹部が形成されているものであ
り、この発明によれば、電子部品にかかる摩擦熱エネル
ギーおよび振動エネルギーを軽減して電子部品の破壊を
防止することができるとともに、作業工数の増加や生産
コスト増加を防止することができる。The electronic component mounting module of the present invention comprises a substrate on which electronic components are mounted, and two resin cases sandwiching the substrate from above and below, and these two resin cases are ultrasonically welded around the periphery. In the electronic component mounting module, the lower recess for accommodating the electronic component is formed on the upper surface of the lower resin case, and the substrate is provided on the lower surface of the upper resin case facing the electronic component. According to the present invention, the frictional heat energy and the vibration energy applied to the electronic component are reduced, and the upper recess has a shape smaller than the outer shape of the electronic component and larger than the shape of the mounted electronic component. As a result, it is possible to prevent the electronic parts from being destroyed, and it is possible to prevent an increase in the number of work steps and an increase in production cost.

【００４４】また、基板に上方へのそりが生じている場
合には、上側凹部の角縁部によって基板が押さえ込まれ
ることにより、そりが矯正されるといったものであって
もよく、この場合には、電子部品にかかる摩擦熱エネル
ギーおよび振動エネルギーを軽減して電子部品の破壊を
防止することができるとともに、歩留まりの低下や生産
コスト増加を防止することができる。When the substrate has an upward warp, the warp may be corrected by pressing the substrate by the corner edge of the upper concave portion. In this case, In addition, it is possible to reduce the frictional heat energy and the vibration energy applied to the electronic component to prevent the electronic component from being destroyed, and it is possible to prevent the yield from decreasing and the production cost from increasing.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の超音波溶着装置の一実施の形態とこの
装置を用いて形成される電子部品実装モジュールの一実
施の形態とを示す斜視図である。FIG. 1 is a perspective view showing an embodiment of an ultrasonic welding apparatus of the present invention and an embodiment of an electronic component mounting module formed using this apparatus.

【図２】図１のＡ−Ａ線断面説明図である。FIG. 2 is a cross-sectional explanatory view taken along the line AA of FIG.

【図３】溶着処理中の超音波溶着装置および電子部品実
装モジュールを示す断面説明図である。FIG. 3 is an explanatory cross-sectional view showing an ultrasonic welding apparatus and an electronic component mounting module during a welding process.

【図４】溶着処理後の電子部品実装モジュールの一例を
示す斜視図である。FIG. 4 is a perspective view showing an example of an electronic component mounting module after a welding process.

【図５】図４のＢ−Ｂ線断面説明図である。5 is a cross-sectional view taken along the line BB of FIG.

【図６】従来の、溶着直前の樹脂ケースの一例を示す斜
視図である。FIG. 6 is a perspective view showing an example of a conventional resin case immediately before welding.

【図７】図６のＣ−Ｃ線断面説明図である。FIG. 7 is a cross-sectional view taken along the line CC of FIG.

【図８】溶着処理中の樹脂ケースの一例を示す断面説明
図である。FIG. 8 is an explanatory cross-sectional view showing an example of a resin case during the welding process.

【図９】従来の、溶着直前の樹脂ケースの他の例を示す
斜視図である。FIG. 9 is a perspective view showing another example of a conventional resin case immediately before welding.

【図１０】図９に示す樹脂ケースを用いて溶着処理を実
施する工程の一例を示す断面説明図である。FIG. 10 is a cross-sectional explanatory view showing an example of a step of carrying out a welding process using the resin case shown in FIG.

【図１１】図９に示す樹脂ケースを用いて形成された電
子部品実装モジュールの一例を示す斜視図である。11 is a perspective view showing an example of an electronic component mounting module formed using the resin case shown in FIG.

【図１２】図１１のＤ−Ｄ線断面説明図である。12 is a cross-sectional view taken along the line DD of FIG.

【符号の説明】[Explanation of symbols]

１ 基板 ２ 電子部品 ３ 樹脂ケース ３ａ 上側凹部 ４ 樹脂ケース ４ａ 第１凹部（下側凹部） ４ｂ 第２凹部（下側凹部） ４ｃ 超音波溶着部 ５ 超音波振動伝達ホーン 1 substrate 2 electronic components 3 resin case 3a Upper recess 4 resin case 4a First recess (lower recess) 4b Second recess (lower recess) 4c Ultrasonic welding part 5 Ultrasonic vibration transmission horn

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 電子部品が実装された基板とこの基板を
上下方向から挟み込む２個の樹脂ケースとからなる電子
部品実装モジュールを製造する工程において用いられ、
前記基板を挟み込んだ２個の樹脂ケースを超音波溶着に
より接合する超音波溶着装置であって、 上側の樹脂ケースに上方から接触する溶着接触面に凹部
が形成され、超音波溶着接合時には、前記２個の樹脂ケ
ースにより挟み込まれた基板の電子部品と前記凹部とが
上側の樹脂ケースを介して対向するように溶着接触面が
配置されることを特徴とする超音波溶着装置。1. Used in a process of manufacturing an electronic component mounting module comprising a substrate on which electronic components are mounted and two resin cases sandwiching the substrate from above and below,
An ultrasonic welding device for joining two resin cases sandwiching the substrate by ultrasonic welding, wherein a recess is formed in a welding contact surface that contacts the upper resin case from above, An ultrasonic welding apparatus, wherein a welding contact surface is arranged so that an electronic component of a substrate sandwiched by two resin cases and the recess face each other via an upper resin case. 【請求項２】 電子部品が実装された基板と、この基板
を上下方向から挟み込む２個の樹脂ケースとからなり、
これら２個の樹脂ケースがその周囲を超音波溶着により
接合された構造の電子部品実装モジュールであって、 下側の樹脂ケースの上面に前記電子部品を収納する下側
凹部が形成され、 上側の樹脂ケースの下面の電子部品対向部位に、前記基
板の外形形状よりも小さく、かつ実装された電子部品の
形状よりも大きな形状の上側凹部が形成されていること
を特徴とする電子部品実装モジュール。2. A substrate on which electronic components are mounted, and two resin cases sandwiching the substrate from above and below,
An electronic component mounting module having a structure in which these two resin cases are joined together by ultrasonic welding, and a lower recess for accommodating the electronic component is formed on the upper surface of the lower resin case, and An electronic component mounting module, wherein an upper recess having a shape smaller than the outer shape of the substrate and larger than the shape of the mounted electronic component is formed in a portion of the lower surface of the resin case facing the electronic component. 【請求項３】 前記基板に上方へのそりが生じている場
合には、前記上側凹部の角縁部によって前記基板が押さ
え込まれることにより、そりが矯正されることを特徴と
する請求項２に記載の電子部品実装モジュール。3. The warp is corrected by pressing the substrate by a corner edge of the upper recess when the substrate has an upward warp. The electronic component mounting module described.
JP2001283603A 2001-09-18 2001-09-18 Ultrasonic welding device and electronic part-mounted module Pending JP2003089154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001283603A JP2003089154A (en) 2001-09-18 2001-09-18 Ultrasonic welding device and electronic part-mounted module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001283603A JP2003089154A (en) 2001-09-18 2001-09-18 Ultrasonic welding device and electronic part-mounted module

Publications (1)

Publication Number Publication Date
JP2003089154A true JP2003089154A (en) 2003-03-25

Family

ID=19107063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001283603A Pending JP2003089154A (en) 2001-09-18 2001-09-18 Ultrasonic welding device and electronic part-mounted module

Country Status (1)

Country Link
JP (1) JP2003089154A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014050499A1 (en) * 2012-09-28 2014-04-03 日本精機株式会社 Liquid level detection device, and manufacturing method of liquid level detection device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014050499A1 (en) * 2012-09-28 2014-04-03 日本精機株式会社 Liquid level detection device, and manufacturing method of liquid level detection device
JP2014071042A (en) * 2012-09-28 2014-04-21 Nippon Seiki Co Ltd Liquid level detector, and method of manufacturing the same
CN104704330A (en) * 2012-09-28 2015-06-10 日本精机株式会社 Liquid level detection device, and manufacturing method of liquid level detection device
US9506799B2 (en) 2012-09-28 2016-11-29 Nippon Seiki Co., Ltd. Liquid level detection device and method of manufacturing the same

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