JP2003069269A - Closed cooling apparatus - Google Patents
Closed cooling apparatusInfo
- Publication number
- JP2003069269A JP2003069269A JP2001253463A JP2001253463A JP2003069269A JP 2003069269 A JP2003069269 A JP 2003069269A JP 2001253463 A JP2001253463 A JP 2001253463A JP 2001253463 A JP2001253463 A JP 2001253463A JP 2003069269 A JP2003069269 A JP 2003069269A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- casing
- cooling device
- section
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、冷却効率に優れる
密閉型冷却装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hermetic cooling device having excellent cooling efficiency.
【０００２】[0002]
【従来の技術】従来の密閉型冷却装置は、図６に示すよ
うに、高温に発熱する電子部品或いは電気機器を収納し
た密閉筐体１と、密閉筐体１の外側の一部に内部と連通
して設けられたケーシング５と、ケーシング５の内部に
受熱部３が、密閉筐体１の外部に放熱部４がそれぞれ位
置するように仕切板１６により貫通支持された複数本の
ヒートパイプ２と、これらヒートパイプ２の各端の側方
にそれぞれ対向配置されたファン７、８を備えたもので
ある。この密閉型冷却装置では、密閉筐体１内の高温空
気がファン７により受熱部３に送風され、この熱はヒー
トパイプ２内の熱媒体により放熱部４に伝搬されて放熱
部４が温度上昇し、この放熱部４はファン８により外気
が送風されて熱放散される。2. Description of the Related Art As shown in FIG. 6, a conventional hermetic cooling device includes a hermetically sealed casing 1 containing electronic components or electric devices that generate heat at high temperature, and an internal portion at a part of the hermetically sealed casing 1 outside. A casing 5 provided in communication with each other and a plurality of heat pipes 2 penetratingly supported by a partition plate 16 so that the heat receiving portion 3 is located inside the casing 5 and the heat radiating portion 4 is located outside the closed casing 1. And the fans 7 and 8 which are arranged opposite to each other on the side of each end of the heat pipe 2. In this hermetic cooling device, the hot air in the hermetic casing 1 is blown to the heat receiving portion 3 by the fan 7, and this heat is propagated to the heat radiating portion 4 by the heat medium in the heat pipe 2 and the temperature of the heat radiating portion 4 rises. Then, the heat radiating portion 4 is ventilated by the fan 8 and the heat is dissipated.
【０００３】[0003]
【発明が解決しようとする課題】しかし、前記従来の密
閉型冷却装置では、ヒートパイプ２の受熱部３が、密閉
筐体１の外側に配されているため、受熱部３に送風され
る空気の温度は密閉筐体１内の平均的温度となり、受熱
効率が悪いという問題があった。このようなことから、
本発明者等は、密閉筐体内を効率良く冷却する方法につ
いて検討し、その結果、ヒートパイプの受熱部を密閉筐
体内の、特に高温発熱体近傍に配することにより、受熱
効率が向上し、装置全体の冷却効率が高まることを知見
し、さらに検討を進めて本発明を完成させるに至った。
本発明の目的は、冷却効率に優れる密閉型冷却装置を提
供することにある。However, in the conventional hermetic cooling device described above, since the heat receiving portion 3 of the heat pipe 2 is arranged outside the hermetically sealed casing 1, the air blown to the heat receiving portion 3 is provided. There is a problem that the temperature of is the average temperature in the closed casing 1 and the heat receiving efficiency is poor. From such a thing,
The present inventors have studied a method of efficiently cooling the inside of a closed casing, and as a result, by arranging the heat receiving portion of the heat pipe in the closed casing, particularly near the high-temperature heating element, the heat receiving efficiency is improved, The inventors have found that the cooling efficiency of the entire apparatus is increased, and further studies have been conducted to complete the present invention.
An object of the present invention is to provide a sealed cooling device having excellent cooling efficiency.
【０００４】[0004]
【課題を解決するための手段】請求項１記載の発明は、
電子部品或いは電気機器を収納した密閉型筐体内にヒー
トパイプの受熱部が配され、前記ヒートパイプの放熱部
が前記密閉筐体外に配された密閉型冷却装置であって、
前記ヒートパイプの放熱部は前記密閉筐体側壁に沿って
配され、放熱部側が受熱部側より上に位置することを特
徴とする密閉型冷却装置である。The invention according to claim 1 is
A sealed cooling device in which a heat receiving portion of a heat pipe is arranged in a sealed casing accommodating an electronic component or an electric device, and a heat dissipation portion of the heat pipe is arranged outside the sealed casing,
The heat radiating portion of the heat pipe is arranged along the side wall of the closed casing, and the heat radiating portion side is located above the heat receiving portion side.
【０００５】請求項２記載の発明は、前記放熱部が上下
方向に配され、その周囲が上下壁のないケーシングによ
り囲われていることを特徴とする請求項１記載の密閉型
冷却装置である。According to a second aspect of the present invention, there is provided the hermetic cooling device according to the first aspect, wherein the heat radiating portion is arranged in a vertical direction and the periphery thereof is surrounded by a casing having no upper and lower walls. .
【０００６】請求項３記載の発明は、前記受熱部または
／および放熱部にフィンが取り付けられていることを特
徴とする請求項１または２記載の密閉型冷却装置であ
る。The invention according to claim 3 is the sealed cooling device according to claim 1 or 2, wherein fins are attached to the heat receiving portion and / or the heat radiating portion.
【０００７】請求項４記載の発明は、前記受熱部または
／および放熱部の近傍にファンが配されていることを特
徴とする請求項１、２、３のいずれかに記載の密閉型冷
却装置である。The invention according to claim 4 is characterized in that a fan is arranged in the vicinity of the heat receiving portion and / or the heat radiating portion, and the hermetic cooling device according to any one of claims 1, 2 and 3. Is.
【０００８】[0008]
【発明の実施の形態】以下に、本発明を図を参照して具
体的に説明する。なお、実施例を説明するための全図に
おいて、同一機能を有するものは同一符号を付け、その
繰り返しの説明は省略する。図１は本発明の密閉型冷却
装置の第１の実施形態を示す縦断面説明図である。高温
に発熱する電子部品或いは電気機器を収納した密閉筐体
１内にヒートパイプ２の受熱部３が配され、ヒートパイ
プ２の放熱部４は密閉筐体１外側のケーシング５内に配
されている。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below with reference to the drawings. In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals, and repeated description thereof will be omitted. FIG. 1 is a vertical cross-sectional explanatory view showing a first embodiment of the hermetic cooling device of the present invention. The heat receiving portion 3 of the heat pipe 2 is arranged in the closed casing 1 that houses electronic components or electric devices that generate heat at high temperatures, and the heat radiation portion 4 of the heat pipe 2 is arranged in the casing 5 outside the closed casing 1. There is.
【０００９】ヒートパイプ２の放熱部４は、密閉筐体側
壁（鉛直）に沿って、受熱部３より上に配され、ヒート
パイプ２は受熱部３と放熱部４の間で角度θで曲げられ
ている。この角度θが９０度以上であれば、放熱部４側
は受熱部３側より全長に渡り上に位置し、ヒートパイプ
２中の熱媒体は適正に作動し、ヒートパイプ２は良好に
機能する。The heat radiating portion 4 of the heat pipe 2 is arranged above the heat receiving portion 3 along the side wall (vertical) of the closed casing, and the heat pipe 2 is bent at an angle θ between the heat receiving portion 3 and the heat radiating portion 4. Has been. If the angle θ is 90 degrees or more, the heat radiating portion 4 side is located above the heat receiving portion 3 side over the entire length, the heat medium in the heat pipe 2 operates properly, and the heat pipe 2 functions well. .
【００１０】受熱部３および放熱部４には板状フィン６
が、その面がヒートパイプ２の長さ方向に対して直角に
なるように取り付けられ、受熱部３および放熱部４の近
傍にはそれぞれファン７、８が配されており、このファ
ンにより送風することにより受熱効率或いは放熱効率が
向上する。Plate-shaped fins 6 are provided on the heat receiving portion 3 and the heat radiating portion 4.
Is mounted so that its surface is perpendicular to the length direction of the heat pipe 2, and fans 7 and 8 are arranged near the heat receiving portion 3 and the heat radiating portion 4, respectively, and blows air by this fan. As a result, the heat receiving efficiency or the heat radiation efficiency is improved.
【００１１】本発明では、受熱部３を密閉筐体１内に配
するので、受熱部３を高温の発熱体近傍に配することが
でき、従って受熱部３の受熱効率が向上する。放熱部４
は密閉筐体１の側壁に沿って配されているので殆ど邪魔
にならない。In the present invention, since the heat receiving portion 3 is arranged in the closed casing 1, the heat receiving portion 3 can be arranged in the vicinity of the high-temperature heating element, and therefore the heat receiving efficiency of the heat receiving portion 3 is improved. Heat sink 4
Is arranged along the side wall of the closed casing 1, so that it hardly interferes.
【００１２】図２は本発明の密閉型冷却装置のヒートパ
イプ部分の実施形態を示す分解斜視図である。ヒートパ
イプ部分はヒートパイプ２、フィン６、ファン７を組付
けてユニット化されており、ここでは２ユニットを組み
合わせた場合が示されているが、１ユニットでも製品と
して使用できる。FIG. 2 is an exploded perspective view showing an embodiment of the heat pipe portion of the hermetic cooling device of the present invention. The heat pipe portion is assembled into a unit by assembling the heat pipe 2, the fins 6 and the fan 7. Here, a case where two units are combined is shown, but even one unit can be used as a product.
【００１３】本発明において、受熱部３または放熱部４
に取り付けるフィンには、前記板状フィン６の他、図３
（イ）に示す放射状フィン１１、図３（ロ）に示す両端
傾斜フィン１２、図３（ハ）に示すコルゲートフィン１
３、図３（ニ）に示すヒートパイプ挿通孔１５付きフィ
ン１４など任意の形状のフィンが適用できる。In the present invention, the heat receiving portion 3 or the heat radiating portion 4 is used.
In addition to the plate-like fins 6 shown in FIG.
The radial fin 11 shown in (a), the both-end inclined fins 12 shown in FIG. 3 (b), and the corrugated fin 1 shown in FIG. 3 (c).
3, a fin 14 having an arbitrary shape such as the fin 14 with the heat pipe insertion hole 15 shown in FIG.
【００１４】請求項２記載の発明は、図４（イ）に示す
ように、放熱部４の長さ方向の向きを上下方向とし、こ
れを上下壁を除去したケーシング５で囲ったものであ
り、放熱部４が温度上昇するとケーシング５内に上昇気
流が生じて外気が通り易くなり放熱効率が向上する。こ
の上昇気流効果はフィンに放射状フィン１１を用いるこ
とでさらに高まる。このものはファンを用いず自然空冷
とすることができ、低コスト、低騒音、省スペースが図
れる。図４（ロ）に示すように、ファン８を用いた場合
でも、ファン８の圧力損失が小さいので電気代が節約で
きる。またファン８を小型化したり、台数を減らすこと
もできる。前記ヒートパイプ２の放熱部４の長さ方向の
向きは上下方向（鉛直）から多少傾斜していても良く、
またケーシング５の上下壁は部分的に除去されていても
同様の効果が得られる。According to a second aspect of the present invention, as shown in FIG. 4 (a), the lengthwise direction of the heat radiating portion 4 is the vertical direction, and the heat radiating portion 4 is surrounded by a casing 5 having upper and lower walls removed. When the temperature of the heat radiating portion 4 rises, an ascending air current is generated in the casing 5 so that the outside air can easily pass through and the heat radiation efficiency is improved. This updraft effect is further enhanced by using the radial fins 11 as the fins. This product can be naturally air-cooled without using a fan, so that low cost, low noise, and space saving can be achieved. As shown in FIG. 4B, even when the fan 8 is used, the electricity loss can be saved because the pressure loss of the fan 8 is small. Further, the fan 8 can be downsized and the number of fans can be reduced. The lengthwise direction of the heat dissipation portion 4 of the heat pipe 2 may be slightly inclined from the vertical direction (vertical),
Even if the upper and lower walls of the casing 5 are partially removed, the same effect can be obtained.
【００１５】本発明の密閉型冷却装置では、図５に示す
ように、密閉筐体１に凹み部９を設け、この凹み部９に
放熱部４を配することにより、ヒートパイプ２を含む冷
却装置全体の形状をコンパクトにできる。密閉筐体１に
凹み部９がある場合は、そこに放熱部４を配するのが良
い。In the hermetic cooling device of the present invention, as shown in FIG. 5, the hermetically sealed casing 1 is provided with the recessed portion 9, and the heat dissipating portion 4 is arranged in the recessed portion 9 to cool the heat pipe 2. The overall shape of the device can be made compact. When the closed casing 1 has a recessed portion 9, it is preferable to dispose the heat dissipation portion 4 therein.
【００１６】[0016]
【実施例】以下に、本発明を実施例により詳細に説明す
る。
（実施例１）図１または図４（ロ）に示した密閉型冷却
装置（密閉筐体は立方体形状）を稼働させ、熱的に定常
状態になったところで、受熱部３の入側ａと出側ｂの温
度および放熱部４の入側ｃと出側ｄの温度を測定し、こ
れらを基に受熱部３および放熱部４における管外熱伝達
率を算出し、さらに密閉型冷却装置の交換熱量を求め
た。図４（ロ）に示した密閉型冷却装置は、放熱部４に
放射型フィン１１を取り付け、ケーシング５は上下壁を
全部除去し、ファン８は小型のものを用いた。EXAMPLES The present invention will be described in detail below with reference to examples. (Embodiment 1) When the hermetic cooling device (the hermetically sealed casing has a cubic shape) shown in FIG. 1 or FIG. The temperature of the outlet side b and the temperatures of the inlet side c and the outlet side d of the heat radiating portion 4 are measured, and the external heat transfer coefficients of the heat receiving portion 3 and the heat radiating portion 4 are calculated based on these, and further the sealed cooling device The heat exchange amount was calculated. In the hermetic cooling device shown in FIG. 4B, radiating fins 11 are attached to the heat radiating portion 4, the casing 5 has all upper and lower walls removed, and the fan 8 has a small size.
【００１７】（比較例１）図６に示した従来の密閉型冷
却装置について、実施例１と同じ測定を行い、受熱部３
および放熱部４の管外熱伝達率を算出し、さらに密閉型
冷却装置の交換熱量を求めた。なお、ヒートパイプ数は
いずれも８本とした。また前記受熱部３の入側ａと出側
ｂの温度および放熱部４の入側ｃと出側ｄの温度の測定
位置はそれぞれ図１、図４（ロ）、図６に示した。結果
を表１に示す。(Comparative Example 1) The same measurement as in Example 1 was performed on the conventional hermetic cooling device shown in FIG.
Then, the heat transfer coefficient outside the tube of the heat radiating section 4 was calculated, and the heat exchange amount of the hermetic cooling device was obtained. The number of heat pipes was 8 in all cases. The measurement positions of the temperature of the inlet side a and the outlet side b of the heat receiving portion 3 and the temperature of the inlet side c and the outlet side d of the heat radiating portion 4 are shown in FIGS. 1, 4 (b) and 6, respectively. The results are shown in Table 1.
【００１８】[0018]
【表１】 [Table 1]
【００１９】表１から明らかなように、本発明例のＮ
ｏ．１、２はいずれも受熱部における入側温度が高いた
め受熱部での管外熱伝達率が大きくなり、装置全体の交
換熱量が増大した。Ｎｏ．２は交換熱量がＮｏ．１より
小さくなったが、ファンが小型のため、低コスト、低騒
音、省スペースなどが図れた。一方、比較例のＮｏ．３
は受熱部の入側温度が低いため受熱部における管外熱伝
達率が小さくなり、装置全体の交換熱量が減少した。な
お、別途実験を行い、図４（イ）に示した放熱部４にフ
ァンを用いない密閉型冷却装置でも実用上差し支えない
程度の交換熱量が得られることを確認した。As is clear from Table 1, N of the present invention example
o. In Nos. 1 and 2, since the inlet side temperature in the heat receiving section was high, the heat transfer coefficient outside the tube in the heat receiving section was large, and the heat exchange amount of the entire device was increased. No. No. 2 has a heat quantity of exchange. Although it was smaller than 1, it was possible to achieve low cost, low noise, and space saving due to the small size of the fan. On the other hand, in Comparative Example No. Three
Since the inlet temperature of the heat receiving part was low, the heat transfer coefficient outside the pipe in the heat receiving part was small, and the heat exchange amount of the entire device was reduced. In addition, a separate experiment was conducted to confirm that even a closed type cooling device that does not use a fan for the heat radiating portion 4 shown in FIG.
【００２０】[0020]
【発明の効果】以上に説明したように、本発明の密閉型
冷却装置は、ヒートパイプの受熱部を密閉筐体内に配す
るので、受熱部を高温発熱体近傍に位置させることが可
能となり、受熱効率の向上並びに装置全体の交換熱量の
増大が実現する。本発明では放熱部を密閉筐体の側壁に
沿わせて配するのでヒートパイプが邪魔にならない。本
発明では放熱部側が受熱部側より上に位置するのでヒー
トパイプは良好に機能する。またヒートパイプの放熱部
の長さ方向の向きを上下方向とし、前記放熱部を上下壁
のないケーシングで囲うことによりケーシング内に上昇
気流が生じて放熱効率が向上する。さらに放熱部のフィ
ンを放射型フィンとすることにより前記上昇気流効果は
さらに促進する。これによりファンを不要または小型化
するすることも可能となり、そうなれば、低コスト、低
騒音、省スペースなどが図れる。依って、工業上顕著な
効果を奏する。As described above, in the hermetic cooling device of the present invention, the heat receiving portion of the heat pipe is arranged in the hermetically sealed case, so that the heat receiving portion can be located near the high temperature heating element, It is possible to improve the heat receiving efficiency and increase the exchange heat amount of the entire device. In the present invention, the heat radiating portion is arranged along the side wall of the hermetically sealed casing, so that the heat pipe does not interfere. In the present invention, the heat radiating portion side is located above the heat receiving portion side, so that the heat pipe functions well. Further, by setting the lengthwise direction of the heat radiating portion of the heat pipe to be the vertical direction and enclosing the heat radiating portion in a casing without upper and lower walls, an ascending airflow is generated in the casing, and the heat radiation efficiency is improved. Further, by making the fin of the heat radiating section a radiation type fin, the ascending air current effect is further promoted. As a result, it is possible to make the fan unnecessary or downsize, which leads to low cost, low noise, and space saving. Therefore, it has a remarkable industrial effect.
【図１】本発明の密閉型冷却装置の第１の実施形態を示
す縦断面説明図である。FIG. 1 is a vertical cross-sectional explanatory view showing a first embodiment of a hermetic cooling device of the present invention.
【図２】本発明の密閉型冷却装置のヒートパイプ部分の
実施形態を示す分解斜視説明図である。FIG. 2 is an exploded perspective view showing an embodiment of a heat pipe portion of the hermetic cooling device according to the present invention.
【図３】（イ）〜（ニ）は本発明の密閉型冷却装置のヒ
ートパイプに取り付けられるフィンの例を示す説明図で
ある。3A to 3D are explanatory views showing an example of fins attached to the heat pipe of the hermetic cooling device of the present invention.
【図４】（イ）、（ロ）は本発明の密閉型冷却装置の第
２、第３の実施形態を示す縦断面説明図である。4 (a) and 4 (b) are vertical cross-sectional explanatory views showing second and third embodiments of the hermetic cooling device of the present invention.
【図５】本発明の密閉型冷却装置の第４の実施形態を示
す説明図である。FIG. 5 is an explanatory view showing a fourth embodiment of the hermetic cooling device of the present invention.
【図６】従来の密閉型冷却装置の縦断面説明図である。FIG. 6 is a vertical cross-sectional explanatory view of a conventional hermetic cooling device.
１ 密閉筐体 ２ ヒートパイプ ３ ヒートパイプの受熱部 ４ ヒートパイプの放熱部 ５ ケーシング ６ 板状フィン ７ 受熱部用ファン ８ 放熱部用ファン ９ 密閉筐体の凹み部 １１ 放射状フィン １２ 両端傾斜フィン １３ コルゲートフィン １４ ヒートパイプ挿通孔付きフィン １５ ヒートパイプ挿通孔付きフィンの挿通孔 １６ ケーシングの仕切板 1 sealed enclosure 2 heat pipe 3 Heat receiving part of heat pipe 4 Heat dissipation part of heat pipe 5 casing 6 plate fins 7 Heat receiving fan 8 Fan for radiator 9 Recessed part of closed housing 11 radial fins 12 Inclined fins on both ends 13 corrugated fins 14 Fins with heat pipe insertion holes 15 Insertion holes for fins with heat pipe insertion holes 16 Casing dividers
Claims (4)
型筐体内にヒートパイプの受熱部が配され、前記ヒート
パイプの放熱部が前記密閉筐体外に配された密閉型冷却
装置であって、前記ヒートパイプの放熱部は前記密閉筐
体側壁に沿って配され、放熱部側が受熱部側より上に位
置することを特徴とする密閉型冷却装置。1. A hermetically-sealed cooling device in which a heat-receiving portion of a heat pipe is arranged in a hermetically-sealed housing accommodating an electronic component or an electric device, and a heat-radiating portion of the heat-pipe is arranged outside the hermetically-sealed housing. The heat dissipation part of the heat pipe is arranged along the side wall of the closed casing, and the heat dissipation part side is located above the heat receiving part side.
が上下壁のないケーシングにより囲われていることを特
徴とする請求項１記載の密閉型冷却装置。2. The hermetic cooling device according to claim 1, wherein the heat radiating portion is arranged in a vertical direction and is surrounded by a casing having no upper and lower walls.
が取り付けられていることを特徴とする請求項１または
２記載の密閉型冷却装置。3. The hermetic cooling device according to claim 1, wherein fins are attached to the heat receiving portion and / or the heat radiating portion.
ファンが配されていることを特徴とする請求項１、２、
３のいずれかに記載の密閉型冷却装置。4. A fan is arranged in the vicinity of the heat receiving portion and / or the heat radiating portion.
The sealed cooling device according to any one of 3 above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001253463A JP2003069269A (en) | 2001-08-23 | 2001-08-23 | Closed cooling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001253463A JP2003069269A (en) | 2001-08-23 | 2001-08-23 | Closed cooling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003069269A true JP2003069269A (en) | 2003-03-07 |
Family
ID=19081786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001253463A Pending JP2003069269A (en) | 2001-08-23 | 2001-08-23 | Closed cooling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003069269A (en) |
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| CN104302152A (en) * | 2013-07-16 | 2015-01-21 | Ls产电株式会社 | Cabinet for power electronic apparatus |
| WO2020066185A1 (en) * | 2018-09-27 | 2020-04-02 | Ｎｅｃプラットフォームズ株式会社 | Heat dissipation structure |
| JP2021506123A (en) * | 2017-12-08 | 2021-02-18 | ケーエムダブリュ・インコーポレーテッド | Heat dissipation device for electrical elements |
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| JP2021506123A (en) * | 2017-12-08 | 2021-02-18 | ケーエムダブリュ・インコーポレーテッド | Heat dissipation device for electrical elements |
| JP7045457B2 (en) | 2017-12-08 | 2022-03-31 | ケーエムダブリュ・インコーポレーテッド | Heat dissipation device for electrical elements |
| WO2020066185A1 (en) * | 2018-09-27 | 2020-04-02 | Ｎｅｃプラットフォームズ株式会社 | Heat dissipation structure |
| JP2020053570A (en) * | 2018-09-27 | 2020-04-02 | Ｎｅｃプラットフォームズ株式会社 | Heat dissipation structure |
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