JP2003011913A - Method for tape packing of electronic part - Google Patents
Method for tape packing of electronic partInfo
- Publication number
- JP2003011913A JP2003011913A JP2001191925A JP2001191925A JP2003011913A JP 2003011913 A JP2003011913 A JP 2003011913A JP 2001191925 A JP2001191925 A JP 2001191925A JP 2001191925 A JP2001191925 A JP 2001191925A JP 2003011913 A JP2003011913 A JP 2003011913A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- packing
- electronic parts
- tape packing
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
【０００１】
【発明の賊する技術分野】
［発明の詳細な説明］
【０００２】
【発明の属する技術分野】本発明は、電子部品のテープ
梱包方法に関し、詳しくは、連続的に電子部品の電極加
工、マーキング、電気特性検査、外観検査、分類、梱包
などの各種処理を施す電子部品の自動ハンドリング装置
における電子部品のテープ梱包方法に関するものであ
る。
【０００３】
【従来の技術】ミニモールドトランジスタ、ＩＣ等の半
導体素子などを含む電子部品は、短冊状のリードフレー
ムを用いて数多くの電子部品が一括して製造される。そ
してリードフレームから個々の電子部品が分離、切断さ
れ、その後各種工程処理（マーキング、電気特性検査、
外観検査など）を経て、テープにマウントして梱包され
る（例えば、特許第２５３１００６号掲載公報参照）。
【０００４】ところで、電子部品梱包用のテープには、
電子部品搭載装置に装着する際の都合等により、テープ
の終端部分に電子部品を梱包できない非梱包部分が存在
する。この非梱包部分は梱包部分の１０％近くに達する
こともある。一方、テープ梱包機構において、このテー
プ非梱包部分を空送りする場合、自動ハンドリング装置
の処理を停止しているのが実情である。しかしながら、
このように処理を停止すると、装置の稼働率が低下し、
処理コストの増大を招いてしまう。また、装置の稼働率
の低下を防止するためには、非梱包部分を高速で空送り
すればよいが、その場合、別途高速空送り機構が必要と
なり、自動ハンドリング装置の構造が複雑化し、装置コ
ストの増大を招くとともに、稼働信頼性の低下の問題が
生じてしまう。
【０００５】
【発明が解決しようとする課題】そこで、本発明は、こ
のような従来技術の問題点を解消し、自動ハンドリング
装置の処理停止時間をなくし、装置可動率を向上させ、
生産効率を高めるとともに、装置構造を複雑化させず
に、生産コストを縮小させることのできる電子部品のテ
ープ梱包方法を提供することをその課題とする。
【０００６】
【課題を解決するための手段】かかる技術的課題は、本
発明によれば、連続的に電子部品の電極加工、マーキン
グ、電気適性検査、外観検査、分類等の各種処理を行っ
た後、電子部品をテープに梱包する電子部品の自動ハン
ドリングにおける電子部品のテープ梱包方法において、
複数のテープ梱包機構を設け、１又は複数のテープ梱包
機構による装着可能範囲全てにおける電子部品の梱包が
終了した後、別のテープ梱包機構による電子部品の梱包
を開始し、かつ、別のテープ梱包機構による電子部品の
梱包を開始した後、前のテープ梱包機構を空送りし、該
テープ梱包機構に残された装着可能範囲外のテープの巻
き取りを行うことを特徴とする電子部品のテープ梱包方
法により解決される。
【０００７】
【発明の実施の形態】以下、本発明の実施の形態を好ま
しい実施例に基づいて詳述する。本発明の方法が適用さ
れる実施例に係る電子部品の自動ハンドリング装置は、
リードフレーム供給ユニット、電子部品分離機構、リー
ド電極加工機構、電気特性測定機構、マーキング機構、
外観検査機構、分類機構、及びテープ梱包機構を有し、
さらに電子部品ピックアップ機構を有し、これによって
電子部品をこれらの機構間を順次搬送させる。なお、本
明細書において、電子部品とは、ミニモールドトランジ
スタ、ＩＣ等の半導体素子などの、リード電極を有し、
リードフレームを用いて一括して製造される各種部品を
意味する。
【０００８】図１に本発明の実施例の要部機構平面配置
図を模式的に示すとともに、図２にテープの梱包に関わ
る側面図を示し、さらに図３にテープ梱包ユニットの説
明図を示す。これらの図中、１はピックアップ搬送ユニ
ット、２は電子部品、３は梱包用テープ、４はテープ３
の梱包部分、５はテープ３の非梱包部分、７はテープ梱
包ユニット、８はリードフレーム、９は電子部品分離機
構、１０はテープ巻き取り機構である。本実施例が従来
技術と異なる構成上の点は、テープ梱包ユニットを２つ
設けて、下記のような動作を行わせたことである。
【０００９】即ち、例えばテープ梱包ユニット７ａに搭
載したテープ３の梱包可能部分４に電子部品２を梱包
し、全ての梱包可能部分４に電子部品２を梱包した後、
テープ梱包ユニット７ｂに搭載したテープ３の梱包可能
部分４への電子部品２の梱包を開始する。そしてテープ
梱包ユニット７ｂにて電子部品２の梱包を開始した後、
テープ梱包ユニット７ａに搭載したテープ３の非梱包部
分５を空送りさせる。テープ梱包ユニット７ａに搭載し
たテープ３の非梱包部分５を全て空送りさせることが完
了すると、テープ３をテープ梱包ユニット７ａから取外
す。その後、新たなテープ３をテープ梱包ユニット７ａ
に装着して、後の梱包に備える。また、２つのテープ梱
包ユニットを７ａと７ｂの梱包動作と空送り動作は交互
に行うようにする。
【００１０】上記のようにすると、梱包テープの非梱包
部分を空送りさせる間に自動ハンドリング装置を停止し
なくて済み、装置可動率を向上させ、生産効率を高める
ことができる。また、梱包テープの非梱包部分を高速で
空送りさせる必要がないので、新たな機構の設置が不要
となり、装置構造を複雑化させずに、生産コストを縮小
させることが可能となる。
【００１１】以上本発明を実施例に基づいて説明してき
たが、本発明は上記実施例に限定されるものではなく、
種々の変形、変更が可能である。例えば、上記ではテー
プ梱包ユニットを２台用意したが、３台以上使用しても
良い。また、３台以上のテープ梱包ユニットを用いた場
合、一度に複数台のテープ梱包ユニットに電子部品を同
時に梱包しても良い。また、３台以上のテープ梱包ユニ
ットを用いた場合、一度に複数台のテープ梱包ユニット
で同時に空送りしても良い。さらに、先に電子部品の搭
載を開始したテープ梱包ユニットの梱包が終了する前に
別のテープ梱包ユニットにおけるテープ梱包を開始して
も良い。
【００１２】
【発明の効果】本発明によれば、上記構成を採用したの
で、自動ハンドリング装置の処理停止時間をなくし、装
置可動率を向上させ、生産効率を高めるとともに、装置
構造を複雑化させずに、生産コストを縮小させることが
可能となる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape packing method for electronic parts, and more particularly, to a method for packing electronic parts in a tape. The present invention relates to a tape packaging method for an electronic component in an automatic electronic component handling apparatus that continuously performs various processes such as electrode processing, marking, electrical property inspection, appearance inspection, classification, and packaging of the electronic component. 2. Description of the Related Art Many electronic components including semiconductor devices such as mini-mold transistors and ICs are manufactured at once using a strip-shaped lead frame. Then, individual electronic components are separated and cut from the lead frame, and then various process processes (marking, electrical property inspection,
After appearance inspection, etc., it is mounted on tape and packed (for example, see Japanese Patent No. 2531006). By the way, tapes for packing electronic parts include:
There is a non-packing portion where the electronic component cannot be packed at the end of the tape due to circumstances at the time of mounting on the electronic component mounting apparatus. This unpackaged portion can be close to 10% of the packaged portion. On the other hand, in the tape packing mechanism, when the tape non-packed portion is fed in an empty state, the processing of the automatic handling device is actually stopped. However,
When the processing is stopped in this way, the operation rate of the device decreases,
This leads to an increase in processing costs. Further, in order to prevent a decrease in the operation rate of the apparatus, the non-packed portion may be fed at high speed, but in this case, a separate high-speed feed mechanism is required, which complicates the structure of the automatic handling device, and This leads to an increase in cost and a problem of lowering operation reliability. SUMMARY OF THE INVENTION Accordingly, the present invention solves such problems of the prior art, eliminates the processing stop time of the automatic handling apparatus, improves the operation rate of the apparatus,
An object of the present invention is to provide a method of packing electronic components in a tape, which can reduce the production cost without increasing the production efficiency while increasing the production efficiency. According to the present invention, various processings such as electrode processing, marking, electrical suitability inspection, appearance inspection, classification and the like of an electronic component are continuously performed according to the present invention. Later, in the electronic component tape packing method in the automatic handling of electronic components to pack electronic components on tape,
A plurality of tape packing mechanisms are provided, and after packing of electronic parts in the entire mountable range by one or more tape packing mechanisms is completed, packing of electronic parts by another tape packing mechanism is started, and another tape packing is performed. After starting packing of electronic components by the mechanism, the previous tape packing mechanism is fed empty, and the tape outside the mountable range left in the tape packing mechanism is taken up. Solved by the method. Hereinafter, embodiments of the present invention will be described in detail based on preferred embodiments. An electronic component automatic handling apparatus according to an embodiment to which the method of the present invention is applied,
Lead frame supply unit, electronic component separation mechanism, lead electrode processing mechanism, electrical property measurement mechanism, marking mechanism,
Has a visual inspection mechanism, a classification mechanism, and a tape packing mechanism,
It further has an electronic component pick-up mechanism, by which electronic components are sequentially conveyed between these mechanisms. Note that, in this specification, an electronic component has a lead electrode such as a miniature transistor or a semiconductor element such as an IC.
It refers to various components manufactured collectively using a lead frame. FIG. 1 schematically shows a plan view of a main mechanism of an embodiment of the present invention, FIG. 2 shows a side view relating to tape packing, and FIG. 3 shows an explanatory view of a tape packing unit. . In these figures, 1 is a pickup transport unit, 2 is an electronic component, 3 is a packing tape, 4 is a tape 3
5 is a non-packing portion of the tape 3, 7 is a tape packing unit, 8 is a lead frame, 9 is an electronic component separation mechanism, and 10 is a tape winding mechanism. The difference of this embodiment from the prior art is that two tape packing units are provided and the following operation is performed. That is, for example, after the electronic components 2 are packed in the packable portion 4 of the tape 3 mounted on the tape packing unit 7a, and the electronic components 2 are packed in all the packable portions 4,
The packing of the electronic component 2 into the packable portion 4 of the tape 3 mounted on the tape packing unit 7b is started. After the packing of the electronic component 2 is started by the tape packing unit 7b,
The non-packed portion 5 of the tape 3 mounted on the tape packing unit 7a is fed in an empty state. When all the non-packed portions 5 of the tape 3 mounted on the tape packing unit 7a are completed to be fed in an empty manner, the tape 3 is removed from the tape packing unit 7a. Then, a new tape 3 is placed in the tape packing unit 7a.
And prepare for later packing. In addition, the two tape packing units perform the packing operation of 7a and 7b and the empty feeding operation alternately. [0010] According to the above, the automatic handling device does not need to be stopped while the non-packed portion of the packing tape is fed in an empty state, so that the operation rate of the device can be improved and the production efficiency can be improved. Further, since it is not necessary to feed the non-packed portion of the packing tape at high speed, no new mechanism is required, and the production cost can be reduced without complicating the device structure. Although the present invention has been described based on the embodiments, the present invention is not limited to the above embodiments.
Various modifications and changes are possible. For example, in the above description, two tape packing units are prepared, but three or more tape packing units may be used. When three or more tape packing units are used, electronic components may be packed in a plurality of tape packing units at a time. Further, when three or more tape packing units are used, a plurality of tape packing units may be simultaneously fed at the same time. Further, tape packing in another tape packing unit may be started before packing of the tape packing unit in which the mounting of the electronic component has started is completed. According to the present invention, since the above-mentioned structure is adopted, the processing stop time of the automatic handling apparatus is eliminated, the operation rate of the apparatus is improved, the production efficiency is increased, and the structure of the apparatus is complicated. Instead, the production cost can be reduced.
【図面の簡単な説明】
【図１】本発明の実施例の要部機構平面配置を模式的に
示す図である。
【図２】テープの梱包に関わる部分の側面図である。
【図３】テープ梱包ユニットの説明図である。
【符号の説明】
１ ピックアップ搬送ユニット
２ 電子部品
３ 梱包用テープ
４ テープの梱包部分
５ テープの非梱包部分
７ テープ梱包ユニット
８ リードフレーム
９ 電子部品分離機構
１０テープ巻き取り機構BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram schematically showing a planar arrangement of a main mechanism of an embodiment of the present invention. FIG. 2 is a side view of a part related to packing of the tape. FIG. 3 is an explanatory diagram of a tape packing unit. [Description of Signs] 1 Pickup transport unit 2 Electronic component 3 Packing tape 4 Tape packing part 5 Non-packing part of tape 7 Tape packing unit 8 Lead frame 9 Electronic component separation mechanism 10 Tape take-up mechanism
Claims (1)
グ、電気適性検査、外観検査、分類等の各種処理を行っ
た後、電子部品をテープに梱包する電子部品の自動ハン
ドリングにおける電子部品のテープ梱包方法において、
複数のテープ梱包機構を設け、１又は複数のテープ梱包
機構による装着可能範囲全てにおける電子部品の梱包が
終了した後、別のテープ梱包機構による電子部品の梱包
を開始し、かつ、別のテープ梱包機構による電子部品の
梱包を開始した後、前のテープ梱包機構を空送りし、該
テープ梱包機構に残された装着可能範囲外のテープの巻
き取りを行うことを特徴とする電子部品のテープ梱包方
法。[Claim 1] Automatic processing of electronic components for packaging electronic components on tape after continuously performing various processes such as electrode processing, marking, electrical suitability inspection, appearance inspection, and classification of the electronic components. In the tape packing method of electronic parts in handling,
A plurality of tape packing mechanisms are provided, and after packing of electronic parts in the entire mountable range by one or more tape packing mechanisms is completed, packing of electronic parts by another tape packing mechanism is started, and another tape packing is performed. After starting packing of electronic components by the mechanism, the previous tape packing mechanism is fed empty, and the tape outside the mountable range left in the tape packing mechanism is taken up. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001191925A JP4600963B2 (en) | 2001-06-25 | 2001-06-25 | Electronic parts tape packing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001191925A JP4600963B2 (en) | 2001-06-25 | 2001-06-25 | Electronic parts tape packing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003011913A true JP2003011913A (en) | 2003-01-15 |
| JP4600963B2 JP4600963B2 (en) | 2010-12-22 |
Family
ID=19030464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001191925A Expired - Fee Related JP4600963B2 (en) | 2001-06-25 | 2001-06-25 | Electronic parts tape packing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4600963B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9077025B2 (en) | 2007-05-24 | 2015-07-07 | Nitto Denko Corporation | Method for production of porous film, porous film, separator for non-aqueous electrolyte battery, and non-aqueous electrolyte battery using the separator |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61217317A (en) * | 1985-03-18 | 1986-09-26 | 株式会社村田製作所 | Manufacture of taping electronic part |
| JPH05229510A (en) * | 1992-02-25 | 1993-09-07 | Matsushita Electric Ind Co Ltd | Taping device |
| JP2000289708A (en) * | 1999-04-02 | 2000-10-17 | Yamaha Motor Co Ltd | Connector for electronic component tape |
| JP2002205706A (en) * | 2000-12-28 | 2002-07-23 | Ueno Seiki Kk | Electronic component processing and tape packaging system |
-
2001
- 2001-06-25 JP JP2001191925A patent/JP4600963B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61217317A (en) * | 1985-03-18 | 1986-09-26 | 株式会社村田製作所 | Manufacture of taping electronic part |
| JPH05229510A (en) * | 1992-02-25 | 1993-09-07 | Matsushita Electric Ind Co Ltd | Taping device |
| JP2000289708A (en) * | 1999-04-02 | 2000-10-17 | Yamaha Motor Co Ltd | Connector for electronic component tape |
| JP2002205706A (en) * | 2000-12-28 | 2002-07-23 | Ueno Seiki Kk | Electronic component processing and tape packaging system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9077025B2 (en) | 2007-05-24 | 2015-07-07 | Nitto Denko Corporation | Method for production of porous film, porous film, separator for non-aqueous electrolyte battery, and non-aqueous electrolyte battery using the separator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4600963B2 (en) | 2010-12-22 |
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