JP2003008176A - Manufacturing method of multi-layer board - Google Patents
Manufacturing method of multi-layer boardInfo
- Publication number
- JP2003008176A JP2003008176A JP2001187582A JP2001187582A JP2003008176A JP 2003008176 A JP2003008176 A JP 2003008176A JP 2001187582 A JP2001187582 A JP 2001187582A JP 2001187582 A JP2001187582 A JP 2001187582A JP 2003008176 A JP2003008176 A JP 2003008176A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- inner layer
- board
- size
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、端部をテープ材を
貼着することによって作製した長尺シート状の連結基板
を内層材として用いる多層積層板の製造方法に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a multi-layer laminate using an elongated sheet-like connecting substrate, which is produced by adhering an end portion with a tape material, as an inner layer material.
【０００２】[0002]
【従来の技術】電子機器、電気部品として、多層のプリ
ント配線板が採用されている。この多層のプリント配線
板は、内層用の回路パターンを形成した内層用回路板に
プリプレグを介して金属箔等の外層材を積層し、この積
層体を成形した多層積層板を用いて作製される。上記内
層用回路板は、例えば、両面金属箔張積層板等の基板の
表面に、回路形成を行うなどして製造される。上記内層
用回路板の作製にあたっては、例えば、基板上に感光性
樹脂からなるドライフィルムを設け、露光処理、現像処
理を経て基板上にレジスト層を形成し、エッチング処理
を経て基板上のレジスト層を除去するものである。2. Description of the Related Art Multi-layer printed wiring boards are used as electronic devices and electric parts. This multilayer printed wiring board is produced using a multilayer laminate obtained by laminating an outer layer material such as a metal foil on a circuit board for an inner layer on which a circuit pattern for the inner layer is formed via a prepreg, and molding this laminate. . The circuit board for the inner layer is manufactured, for example, by forming a circuit on the surface of a substrate such as a double-sided metal foil-clad laminate. In the production of the circuit board for the inner layer, for example, a dry film made of a photosensitive resin is provided on the substrate, a resist layer is formed on the substrate through exposure processing and development processing, and a resist layer on the substrate is subjected through etching processing. Is to be removed.
【０００３】このような複数の工程を経て内層用回路板
を製造するにあたり、短尺に形成された基板を用いる場
合には、従来は基板一枚ずつに対して各種の加工処理を
施していたため、処理効率の悪いものであった。When manufacturing a circuit board for an inner layer through a plurality of steps as described above, when a short-sized board is used, conventionally, various kinds of processing are performed on each board. The processing efficiency was poor.
【０００４】[0004]
【発明が解決しようとする課題】一方、多層積層板は、
成形サイズが５００mm×５００mm以下で成形することが
汎用されていた。しかし、効率化のため、多層積層板
は、より大きいサイズ、例えば、１０００mm×５００mm
程度のサイズで成形することが提案されている。このよ
うな大きいサイズで多層積層板を成形するために、短尺
の内層用回路板を、成形する成形機のサイズに合わせて
複数並べ、これら内層用回路板が成形中に位置ずれを起
こさないように隣接する内層用回路板をテープで貼着し
たりして成形している。このため、多層積層板の成形
は、構成材料を組み合せするに多大の作業時間を要する
ため、より生産性が向上した多層積層板の製造方法が望
まれている。On the other hand, the multilayer laminate is
It has been widely used to mold with a molding size of 500 mm x 500 mm or less. However, for efficiency, the multilayer laminate has a larger size, for example, 1000 mm x 500 mm.
It has been proposed to mold it in a size of the order of magnitude. In order to form a multi-layer laminated board with such a large size, a plurality of short inner layer circuit boards are arranged according to the size of the molding machine to prevent misalignment of these inner layer circuit boards during molding. The inner-layer circuit board adjacent to is attached by tape or molded. For this reason, in the molding of a multilayer laminated plate, it takes a lot of work time to combine the constituent materials. Therefore, a method for manufacturing a multilayer laminated plate with improved productivity is desired.
【０００５】また、回路形成にあっては、長尺に形成さ
れた基板を長手方向に搬送しながら基板に対して連続的
に回路パターンを形成するための加工処理を施す連続工
法が採用されるようになってきている。しかし、既に短
尺に形成された基板に対しては、このような連続工法を
行うことはできないものであった。そこで、本出願人
は、短尺に形成された基板に対しても、このような連続
方法を行うことを提案している（特願２０００−３６０
２３５等）。この基板の連続処理方法は、複数の基板の
端部同士をテープ材を貼着することによって接合して長
尺シート状の連結基板を作製し、連続的に加工処理を施
すものである。Further, in forming a circuit, a continuous method is adopted in which a long substrate is conveyed in the longitudinal direction and a processing for continuously forming a circuit pattern on the substrate is performed. Is starting to appear. However, such a continuous process cannot be performed on a substrate already formed in a short length. Therefore, the present applicant has proposed to carry out such a continuous method even on a substrate formed in a short length (Japanese Patent Application No. 2000-360).
235). In this continuous substrate processing method, end portions of a plurality of substrates are joined by adhering a tape material to each other to produce a continuous sheet-shaped connecting substrate, and the continuous processing is performed.
【０００６】本発明は上記の事情に鑑みてなされたもの
で、その目的とするところは、成形に際により生産性の
向上が実現できる多層積層板の製造方法を提供すること
にある。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a multilayer laminated board which can realize improvement in productivity during molding.
【０００７】[0007]
【課題を解決するための手段】本発明者は、上記目的を
達成するために、鋭意研究を重ねた結果、例えば、成形
のサイズが１０００ｍｍ×５００ｍｍ相応の成形機で多
層積層板を成形するときに、基板として両面金属箔張積
層板を１０００ｍｍ×５００ｍｍに切断し、この基板の
端部同士をテープ材を貼着した長尺シート状の連結基板
に加工処理を施して、一つの基板に回路パターンを複数
形成して、１０００ｍｍ×５００ｍｍサイズの内層材を
作製すると、この内層材が成形する成形機のサイズに相
応しているため、位置ずれを防止するためにテープで貼
着するなどの工程を必要としないので、作業時間が短縮
できて、生産性を向上することを見出し、本発明の完成
に至ったものである。Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventor has found that, for example, when a multi-layer laminate is molded by a molding machine having a molding size of 1000 mm × 500 mm. Then, a double-sided metal foil-clad laminate is cut into 1000 mm x 500 mm as a substrate, and the end portions of this substrate are processed into a long sheet-shaped connecting substrate to which a tape material is attached, and a circuit is formed on one substrate. When a plurality of patterns are formed and an inner layer material with a size of 1000 mm × 500 mm is manufactured, the inner layer material is suitable for the size of the molding machine, and therefore, a process such as attaching with tape to prevent misalignment. Therefore, the present invention has been completed and found that the working time can be shortened and the productivity can be improved.
【０００８】請求項１記載の多層積層板の製造方法は、
成形する成形機のサイズに相応したサイズに基板を切断
し、複数の隣合う基板の端部を接合材で接合することに
よって基板同士を接合して長尺シート状の連結基板を作
製した後に、この連結基板に加工処理を施して、一つの
基板に単体で内層用回路板となる回路パターンを複数形
成し、その後、接合材で接合した連結部で分離して成形
機のサイズに相応したサイズの内層材とし、次いで、こ
の得られた内層材にプリプレグを介して外層材を積層
し、成形することを特徴とする。上記によって、内層材
がより大きいサイズの成形機のサイズに相応したものを
採用するので、作業時間が短縮できて、生産性を向上す
ることができるものである。A method of manufacturing a multilayer laminate according to claim 1,
After cutting the substrate into a size corresponding to the size of the molding machine to be molded, after joining the substrates by joining the ends of a plurality of adjacent substrates with a bonding material, to produce a long sheet-like connected substrate, This connecting board is processed to form a plurality of circuit patterns that will become the inner layer circuit board on a single board, and then separated at the connecting part that is joined with the joining material to a size corresponding to the size of the molding machine. Of the inner layer material, and then the outer layer material is laminated on the obtained inner layer material via a prepreg, and molded. As described above, since the inner layer material corresponding to the size of the molding machine having a larger size is adopted, the working time can be shortened and the productivity can be improved.
【０００９】請求項２記載の多層積層板の製造方法は、
請求項１記載の多層積層板の製造方法において、上記内
層材の長手方向のサイズが、１０００ｍｍ以上、幅方向
のサイズが、５００ｍｍ以上であることを特徴とする。A method for manufacturing a multilayer laminate according to claim 2 is
In the method for producing a multilayer laminate according to claim 1, the size of the inner layer material in the longitudinal direction is 1000 mm or more, and the size in the width direction is 500 mm or more.
【００１０】請求項３記載の多層積層板の製造方法は、
請求項１又は請求項２記載の多層積層板の製造方法にお
いて、上記連結基板に加工処理を施した後に、ロール状
に巻き取る工程があると共に、この巻き取る際にクッシ
ョン材を挿入して、このクッション材を基板の表面に当
てながら巻き取ることを特徴とする。上記によって、連
結基板は、加工処理を施した後に、ロール状に巻き取る
とテープ材を貼着した連結部で座屈を生じてこれと重な
り合う回路面に圧痕が生じる恐れがあるが、クッション
材を介することで良好な回路面を保持することができる
ものである。A method for manufacturing a multilayer laminate according to claim 3 is
The method for manufacturing a multilayer laminate according to claim 1 or 2, wherein after the connecting substrate is processed, there is a step of winding in a roll shape, and a cushioning material is inserted at the time of winding. It is characterized in that the cushion material is wound while being applied to the surface of the substrate. Due to the above, when the connection board is rolled into a roll after being processed, there is a risk that buckling may occur at the connection part to which the tape material is attached and an indentation may occur on the circuit surface overlapping with this, but the cushioning material It is possible to maintain a good circuit surface by using the.
【００１１】請求項４記載の多層積層板の製造方法は、
請求項１乃至請求項３いずれか記載の多層積層板の製造
方法において、上記接合材の接合が、基板の端部をテー
プ材を貼着したものであることを特徴とする。A method for manufacturing a multilayer laminate according to claim 4 is
The method for manufacturing a multilayer laminated board according to any one of claims 1 to 3, wherein the joining material is joined by attaching a tape material to an end portion of the substrate.
【００１２】[0012]
【発明の実施の形態】本発明を図に基づいて説明する。
図１（ａ）は、本発明の対象となる回路を形成した連結
基板の一例を示す斜視図、（ｂ）は内層材の一例を示す
斜視図、図２（ａ）、（ｂ）は、基板にテープ材を貼着
するステップを示した要部の断面図である。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described with reference to the drawings.
FIG. 1A is a perspective view showing an example of a connection board on which a circuit to which the present invention is applied is formed, FIG. 1B is a perspective view showing an example of an inner layer material, and FIGS. 2A and 2B are shown. It is sectional drawing of the principal part which showed the step of sticking a tape material on a board | substrate.
【００１３】本発明で用いられる連結基板１は、加工処
理を施すことで、多層積層板を成形する際に、内層材４
として用いることができるものである。この連結基板１
は、複数の隣合う基板２、２の端部を連結部３ａで連結
した長尺シート状のものである。上記基板２、２の端部
の連結は、テープ材３を貼着する等の接合材で接合する
ことによって形成することができる。この連結基板１の
作製は、先ず多層積層板を成形する成形機のサイズに相
応したサイズに基板２を切断する。この成形機のサイズ
に相応したサイズとは、成形機で有効な成形ができる最
大のサイズから、最小は少なくとも長手方向及び幅方向
のサイズが上記最大のサイズの１／２以上をいう。The connecting board 1 used in the present invention is subjected to a processing treatment so that the inner layer material 4 can be formed when a multilayer laminated board is formed.
It can be used as. This connection board 1
Is a long sheet shape in which the ends of a plurality of adjacent substrates 2 and 2 are connected by a connecting portion 3a. The connection of the ends of the substrates 2 and 2 can be formed by joining with a joining material such as affixing the tape material 3. In the production of this connection board 1, first, the board 2 is cut into a size corresponding to the size of a molding machine for molding a multilayer laminated plate. The size corresponding to the size of the molding machine refers to the maximum size that can be effectively molded by the molding machine, and the minimum size is at least ½ or more of the maximum size in the longitudinal direction and the width direction.
【００１４】上記連結基板１は、図２に示すように、基
板２、２の端部をテープ材３を貼着して作製することが
できる。上記基板２は、絶縁層７と導体層６とが積層一
体化された積層板が挙げられる。上記積層板は、具体的
には、ガラス織布、ガラス不織布等の基材に、エポキシ
樹脂等の樹脂を含浸させ、加熱乾燥等で半硬化したプリ
プレグを形成し、このプリプレグを所要枚数積層してそ
の両面に銅箔等の金属箔を積層した積層体を加熱加圧す
ることによって一体化した両面金属箔張積層板等を例示
することができる。この場合は、プリプレグの硬化物で
絶縁層７が形成され、金属箔にて導体層６が形成され
る。As shown in FIG. 2, the connection board 1 can be manufactured by attaching the tape material 3 to the ends of the boards 2 and 2. The substrate 2 may be a laminated plate in which the insulating layer 7 and the conductor layer 6 are laminated and integrated. Specifically, the laminated plate is formed by impregnating a base material such as a glass woven cloth or a glass non-woven cloth with a resin such as an epoxy resin to form a prepreg which is semi-cured by heating and drying, and laminating a required number of the prepreg. An example is a double-sided metal foil-clad laminate, which is integrated by heating and pressing a laminate in which metal foils such as copper foils are laminated on both sides. In this case, the insulating layer 7 is formed of the cured product of the prepreg and the conductor layer 6 is formed of the metal foil.
【００１５】上記テープ材３としては、基材層１１と、
基材層１１の一面側に配置される接着層１２とからなる
ものを用いることができる。上記基材層１１は、ポリエ
チレンテレフタレートフィルムやポリイミドフィルムで
形成することができる。上記接着層１２は、適宜の接着
剤にて形成することもできるが、ポリエステル系樹脂等
の熱可塑性樹脂や、エポキシ系樹脂等の熱硬化性樹脂に
て形成することができる。The tape material 3 includes a base material layer 11 and
It is possible to use a material including an adhesive layer 12 arranged on one surface side of the base material layer 11. The base material layer 11 can be formed of a polyethylene terephthalate film or a polyimide film. The adhesive layer 12 may be formed of an appropriate adhesive, but may be formed of a thermoplastic resin such as a polyester resin or a thermosetting resin such as an epoxy resin.
【００１６】上記テープ材３による基板２の接合は、接
合される基板２、２同士を端面同士を対向させて配置す
る。このとき対向する基板２の端面は、若干の隙間２０
をあけて離間させることが好ましい。この状態で、基板
２の一面側と他面側のそれぞれにおいて、テープ材３を
基板２間の継ぎ目（隙間）に沿って配置し、一方の基板
２の端部表面から他方の基板２の端部表面に亘って接着
層１２を配置すると共に、この接着層１２の外面に基材
層１１を配置する。In the joining of the substrates 2 with the tape material 3, the substrates 2 and 2 to be joined are arranged with their end faces facing each other. At this time, the end surface of the substrate 2 facing each other has a slight gap 20.
It is preferable to separate them with a gap. In this state, the tape material 3 is arranged along the seam (gap) between the substrates 2 on each of the one surface side and the other surface side of the substrate 2, and the end surface of one substrate 2 to the end of the other substrate 2 is arranged. The adhesive layer 12 is arranged over the surface of the part, and the base material layer 11 is arranged on the outer surface of the adhesive layer 12.
【００１７】次いで、このテープ材３を加熱することに
より、接着層１２を溶融させる。基板２の端面間に隙間
２０をあけている場合は接着層１２の流動により接着層
１２の一部が基板２間の隙間に流入する。このとき基板
２の継ぎ目の両面側それぞれにテープ材３を配置してい
る場合は、各テープ材３の接着層１２は基板２の端面間
の隙間において一体化される。この状態で、接着層１２
として熱硬化性樹脂からなるものを用いている場合は更
に加熱を行い、また熱可塑性樹脂からなるものを用いて
いる場合は冷却して、接着層１２を硬化させる。このよ
うにすると、図２（ｂ）に示すように、一方の基板２の
端部表面と他方の基板２の端部表面とは接着層１２を介
して基材層１１と接着され、また接着層１２が基板２の
端面間にも充填されることにより、基板２の端部同士も
接着層１２を介して接着される。これにより基板２の端
部同士が接合される。Next, by heating the tape material 3, the adhesive layer 12 is melted. When the gap 20 is provided between the end faces of the substrates 2, part of the adhesive layer 12 flows into the gap between the substrates 2 due to the flow of the adhesive layer 12. At this time, when the tape materials 3 are arranged on both sides of the seam of the substrate 2, the adhesive layers 12 of the tape materials 3 are integrated in the gap between the end faces of the substrate 2. In this state, the adhesive layer 12
If a material made of a thermosetting resin is used, heating is further performed, and if a material made of a thermoplastic resin is used, the adhesive layer 12 is hardened by cooling. By doing so, as shown in FIG. 2B, the end surface of one substrate 2 and the end surface of the other substrate 2 are adhered to the base material layer 11 via the adhesive layer 12, and are also adhered. By filling the space between the end faces of the substrate 2 with the layer 12, the ends of the substrate 2 are also bonded to each other via the adhesive layer 12. As a result, the ends of the substrate 2 are joined together.
【００１８】上記連結基板１に施される加工処理として
は、例えば、研磨、ドライフィルムのラミネート、露
光、現像、エッチング、剥離、乾燥、表面処理等が挙げ
られる。上記連結基板１は、上記加工処理が施されるこ
とによって、内層回路となる回路パターン５が形成され
る。本発明にあっては、上記連結基板１の一つの基板２
に単体で内層用回路板８となる回路パターン５が複数形
成されている。その後、上記連結基板１は、テープ材３
を貼着した連結部３で分離して、内層材４を得る。上記
連結基板１として、一つの基板２から作製された内層材
４に、回路パターン５を３個形成したものを、図１に示
す。上記内層材４は、表面に所定の間隔で回路パターン
５ａ、５ｂ、５ｃが３個並列に形成されている。上記内
層材４は、隣合う回路パターン５ａ、５ｂ、５ｃの間を
切断したら（図１（ｂ）の点線個所）、プリント配線板
を作製した際に、各々が内層用回路板８ａ、８ｂ、８ｃ
として使用できるものである。Examples of the processing applied to the connecting substrate 1 include polishing, dry film laminating, exposure, development, etching, peeling, drying, surface treatment and the like. The connection substrate 1 is subjected to the above-mentioned processing, so that the circuit pattern 5 to be an inner layer circuit is formed. In the present invention, one substrate 2 of the connection substrate 1 is used.
On the other hand, a plurality of circuit patterns 5 which are to be the inner layer circuit board 8 alone are formed. Then, the connection substrate 1 is a tape material 3
The inner layer material 4 is obtained by separating at the connecting portion 3 to which is adhered. FIG. 1 shows the connection board 1 in which three circuit patterns 5 are formed on an inner layer material 4 produced from one board 2. The inner layer material 4 has three circuit patterns 5a, 5b, and 5c arranged in parallel on the surface at predetermined intervals. When the inner layer material 4 is cut between the adjacent circuit patterns 5a, 5b, 5c (dotted line portions in FIG. 1B), when the printed wiring board is manufactured, the inner layer circuit boards 8a, 8b, 8c
It can be used as.
【００１９】また、上記連結基板１は、加工処理を施し
た後に連続して切断及び分離作業が行われるとは限らな
い。実用的には、上記連結基板１は、加工処理を施した
後に、ロール状に巻き取って次工程に搬送することがあ
る。そこで、上記連結基板１は、巻き取る際にクッショ
ン材２１を挿入して、このクッション材２１を基板の表
面に当てながら巻き取ることが望ましい。上記クッショ
ン材２１としては、厚み１５０〜３００μｍ程度のポリ
エチレンテレフタレート（ＰＥＴ）フィルムが例示され
る。上記連結基板１は、クッション材２１を挿入せずに
巻き取ると、テープ材３を貼着した連結部３ａで座屈を
生じてこれと重なり合う回路面に圧痕が生じる恐れがあ
る。上記連結基板１は、クッション材２１を挿入するこ
とによって、良好な回路面を保持することができるもの
である。Further, the connection board 1 is not always subjected to continuous cutting and separating work after being subjected to processing. Practically, the connection substrate 1 may be processed into a roll, wound into a roll, and conveyed to the next step. Therefore, it is desirable that the connection board 1 be wound while the cushion material 21 is inserted at the time of winding and the cushion material 21 is applied to the surface of the board. An example of the cushion material 21 is a polyethylene terephthalate (PET) film having a thickness of about 150 to 300 μm. If the connecting board 1 is wound without inserting the cushion material 21, the connecting board 3 may be buckled at the connecting portion 3a to which the tape material 3 is adhered, and an indentation may be formed on the circuit surface overlapping with this. The connection board 1 can hold a good circuit surface by inserting the cushion material 21.
【００２０】また、上記連結基板１は、巻き取るために
基材２の厚みが０．０４〜０．２ｍｍ程度の薄物を用い
ることが、好適である。特に、基材２の厚みが０．０４
〜０．０６ｍｍ程度と極薄物は、従来の単板で処理をし
ようとすると、搬送中に先端が欠けたり、破れたりする
恐れがあるので、上記連結基板１を形成して処理する
と、このようなトラブルが防止できるので、好ましい。In addition, it is preferable that the connection board 1 is a thin material having a thickness of the base material 2 of about 0.04 to 0.2 mm for winding. In particular, the thickness of the base material 2 is 0.04
An ultra-thin material having a thickness of about 0.06 mm may be chipped or torn during transportation when a conventional single plate is used for processing. It is preferable because it can prevent various troubles.
【００２１】次に、得られた内層材４を用いた多層積層
板の成形について説明する。図３は、多層積層板の成形
前の組み合せを模式的に示した概略断面図、図４（ａ）
は、多層積層板の成形後の状態を示した概略断面図、図
４（ｂ）は、得られるプリント配線板の概略断面図であ
る。本発明の多層積層板は、内層材４を１枚用いたもの
でも、複数用いたものでもよい。なお、図は、内層材４
を１枚用いた多層積層板、及び、回路が４層の多層のプ
リント配線板を示している。Next, the molding of a multilayer laminate using the obtained inner layer material 4 will be described. FIG. 3 is a schematic cross-sectional view schematically showing the combination of the multilayer laminated plate before molding, and FIG.
[Fig. 4] is a schematic cross-sectional view showing a state after molding of the multilayer laminated board, and Fig. 4 (b) is a schematic cross-sectional view of the obtained printed wiring board. The multilayer laminate of the present invention may use one inner layer material 4 or a plurality of inner layer materials 4. The figure shows the inner layer material 4
Shows a multilayer laminated board using one sheet and a multilayer printed wiring board having four layers of circuits.
【００２２】上記多層積層板の製造方法は、図３に示す
ように、上記内層材４の両外側にプリプレグ９を重ね、
さらにその外側に金属箔１０の外層材を積層して積層体
を形成し、この積層体をステンレス等からなる成形用プ
レート１３に挟み、成形する。上記プリプレグ９は、上
述の内層材４の絶縁層７を形成するのに用いたと同様の
ものを用いることができる。上記金属箔１０は、銅箔等
が挙げられる。上記多層積層板の成形は、上記積層体と
成形用プレート１３とを交互に複数重ね、成形機に投入
し、加熱加圧する。上記製造方法によって、プリプレグ
９の樹脂が硬化して絶縁層９ａが形成され、図４（ａ）
に示すような多層積層板が得られる。As shown in FIG. 3, the method for manufacturing the above-mentioned multi-layer laminated board is such that prepregs 9 are laminated on both outer sides of the inner layer material 4,
Further, the outer layer material of the metal foil 10 is laminated on the outer side thereof to form a laminated body, and the laminated body is sandwiched between molding plates 13 made of stainless steel or the like for molding. The prepreg 9 may be the same as that used to form the insulating layer 7 of the inner layer material 4 described above. Examples of the metal foil 10 include copper foil. In the molding of the above-mentioned multilayer laminate, a plurality of the laminates and the molding plate 13 are alternately stacked, placed in a molding machine, and heated and pressed. By the manufacturing method described above, the resin of the prepreg 9 is cured to form the insulating layer 9a.
A multilayer laminated board as shown in is obtained.
【００２３】上記製造方法は、内層材４が成形する成形
機のサイズに相応しているため、従来のように内層用回
路板が位置ずれを起こさないようにテープで貼着するな
どの工程を必要としない。そのため、上記製造方法は、
作業時間が短縮できて、生産性を向上することができ
る。上記製造方法は、内層材４に長手方向のサイズが１
０００ｍｍ以上、幅方向のサイズが５００ｍｍ以上のも
のを採用する場合、効果を顕著に発現できる。上記製造
方法は、例えば、１３００〜１０００×６００〜５００
ｍｍ程度の大きいサイズの成形を行うときに、好適であ
る。また、上記多層積層板は、総厚みが０．３ｍｍ以下
のものを成形する場合に、より好適である。Since the above-mentioned manufacturing method corresponds to the size of the molding machine for molding the inner layer material 4, there is a conventional step of sticking the inner layer circuit board with tape so as not to cause a positional deviation. do not need. Therefore, the manufacturing method,
Working time can be shortened and productivity can be improved. In the above manufacturing method, the inner layer material 4 has a longitudinal size of 1
The effect can be remarkably exhibited when a sheet having a width of 000 mm or more and a size in the width direction of 500 mm or more is adopted. The manufacturing method is, for example, 1300 to 1000 × 600 to 500.
It is suitable when molding a large size of about mm. Further, the above-mentioned multi-layer laminate is more suitable for molding a laminate having a total thickness of 0.3 mm or less.
【００２４】このようにして得られた多層積層板は、切
断され、外側の金属箔１０に外層用回路１５が形成され
て、図４（ｂ）に示すような多層のプリント配線板を得
ることができる。The multilayer laminated board thus obtained is cut and the outer layer circuit 15 is formed on the outer metal foil 10 to obtain a multilayer printed wiring board as shown in FIG. 4 (b). You can
【００２５】なお、上記実施の形態は、外層材に金属箔
１０を用いたが、この金属箔１０に代わり、回路を形成
した外層用回路板を用いることもできる。Although the metal foil 10 is used as the outer layer material in the above embodiment, an outer layer circuit board having a circuit formed thereon may be used instead of the metal foil 10.
【００２６】[0026]
【発明の効果】本発明の多層積層板の製造方法は、内層
材が成形する成形機のサイズに相応しているため、従来
のように内層用回路板が位置ずれを起こさないようにテ
ープで貼着するなどの工程を必要としない。その結果、
上記多層積層板の製造方法は、作業時間が短縮できて、
生産性が向上する。Since the method for producing a multilayer laminated board of the present invention corresponds to the size of the molding machine for molding the inner layer material, the inner layer circuit board is taped so as not to cause a positional shift as in the conventional case. It does not require a process such as sticking. as a result,
The manufacturing method of the above-mentioned multilayer laminated board can shorten the working time,
Productivity is improved.
【図１】本発明の実施の形態の一例を示し、（ａ）は回
路を形成した連結基板の一例を示す斜視図であり、
（ｂ）は内層材の一例を示す斜視図である。FIG. 1 is a perspective view showing an example of an embodiment of the present invention, and FIG. 1 (a) is a perspective view showing an example of a connecting substrate on which a circuit is formed.
(B) is a perspective view showing an example of an inner layer material.
【図２】（ａ）、（ｂ）は、基板にテープ材を貼着する
ステップを示した要部の断面図である。2 (a) and 2 (b) are cross-sectional views of a main part showing a step of attaching a tape material to a substrate.
【図３】本発明の実施の形態の一例を示し、多層積層板
の成形前の組み合せを模式的に示した概略断面図であ
る。FIG. 3 is a schematic cross-sectional view showing an example of an embodiment of the present invention and schematically showing a combination of a multilayer laminated plate before molding.
【図４】（ａ）は多層積層板の成形後の状態を示した概
略断面図、（ｂ）は得られるプリント配線板の概略断面
図である。FIG. 4A is a schematic cross-sectional view showing a state after molding of a multilayer laminated board, and FIG. 4B is a schematic cross-sectional view of the obtained printed wiring board.
１ 連結基板 ２ 基板 ３ テープ材 ３ａ 連結部 ４ 内層材 ５、５ａ、５ｂ、５ｃ 回路パターン ８ 内層用回路板 ２１ クッション材 1 connection board 2 substrates 3 tape materials 3a connection part 4 Inner layer material 5, 5a, 5b, 5c Circuit pattern 8 Inner layer circuit board 21 Cushion material
フロントページの続き (72)発明者 江崎 義昭 大阪府門真市大字門真1048番地松下電工株 式会社内 Ｆターム(参考） 5E346 AA05 AA06 AA12 AA15 BB01 CC02 CC08 CC32 DD02 DD12 EE02 EE06 EE09 EE13 GG01 GG26 GG28 HH33 Continued front page (72) Inventor Yoshiaki Ezaki 1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd. Inside the company F-term (reference) 5E346 AA05 AA06 AA12 AA15 BB01 CC02 CC08 CC32 DD02 DD12 EE02 EE06 EE09 EE13 GG01 GG26 GG28 HH33
Claims (4)
ズに基板を切断し、複数の隣合う基板の端部を接合材で
接合することによって基板同士を接合して長尺シート状
の連結基板を作製した後に、この連結基板に加工処理を
施して、一つの基板に単体で内層用回路板となる回路パ
ターンを複数形成し、その後、接合材で接合した連結部
で分離して成形機のサイズに相応したサイズの内層材と
し、次いで、この得られた内層材にプリプレグを介して
外層材を積層し、成形することを特徴とする多層積層板
の製造方法。1. A continuous sheet-shaped connecting substrate in which the substrates are cut by cutting the substrates into a size corresponding to the size of a molding machine to be molded, and joining the ends of a plurality of adjacent substrates with a bonding material. After manufacturing, the connecting substrate is processed to form a plurality of circuit patterns to be the inner layer circuit board by itself on one substrate, and then separated at the connecting portion joined by the joining material to form a molding machine. A method for producing a multi-layer laminate, which comprises forming an inner layer material having a size corresponding to a size, and then laminating an outer layer material on the obtained inner layer material via a prepreg and molding the inner layer material.
００ｍｍ以上、幅方向のサイズが、５００ｍｍ以上であ
ることを特徴とする請求項１記載の多層積層板の製造方
法。2. The size of the inner layer material in the longitudinal direction is 10
The method for producing a multilayer laminate according to claim 1, wherein the size in the width direction is 00 mm or more and the size in the width direction is 500 mm or more.
ロール状に巻き取る工程があると共に、この巻き取る際
にクッション材を挿入して、このクッション材を基板の
表面に当てながら巻き取ることを特徴とする請求項１又
は請求項２記載の多層積層板の製造方法。3. After processing the connection substrate,
The multi-layer lamination according to claim 1 or 2, wherein there is a step of winding in a roll shape, and a cushion material is inserted at the time of winding, and the cushion material is wound while being applied to the surface of the substrate. Method of manufacturing a plate.
プ材を貼着したものであることを特徴とする請求項１乃
至請求項３いずれか記載の多層積層板の製造方法。4. The method for manufacturing a multilayer laminate according to claim 1, wherein the joining material is joined by attaching a tape material to the end portion of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001187582A JP3829657B2 (en) | 2001-06-21 | 2001-06-21 | Multilayer laminate manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001187582A JP3829657B2 (en) | 2001-06-21 | 2001-06-21 | Multilayer laminate manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003008176A true JP2003008176A (en) | 2003-01-10 |
| JP3829657B2 JP3829657B2 (en) | 2006-10-04 |
Family
ID=19026852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001187582A Expired - Fee Related JP3829657B2 (en) | 2001-06-21 | 2001-06-21 | Multilayer laminate manufacturing method |
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| Country | Link |
|---|---|
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006222172A (en) * | 2005-02-09 | 2006-08-24 | Fujikura Ltd | Method of manufacturing printed circuit board, device for connecting member and tape pasting apparatus |
| KR100823743B1 (en) * | 2007-02-05 | 2008-04-21 | (주)플렉스라인 | Manufacture method of double side type flexible printed circuits board |
| JP2008177302A (en) * | 2007-01-17 | 2008-07-31 | Fujikura Ltd | Manufacturing method for printed circuit board |
| JP2015079801A (en) * | 2013-10-15 | 2015-04-23 | 日本メクトロン株式会社 | Manufacturing method for flexible printed circuit board and intermediate product used for manufacturing flexible printed circuit board |
-
2001
- 2001-06-21 JP JP2001187582A patent/JP3829657B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006222172A (en) * | 2005-02-09 | 2006-08-24 | Fujikura Ltd | Method of manufacturing printed circuit board, device for connecting member and tape pasting apparatus |
| JP4676776B2 (en) * | 2005-02-09 | 2011-04-27 | 株式会社フジクラ | Method for manufacturing printed wiring board |
| JP2008177302A (en) * | 2007-01-17 | 2008-07-31 | Fujikura Ltd | Manufacturing method for printed circuit board |
| KR100823743B1 (en) * | 2007-02-05 | 2008-04-21 | (주)플렉스라인 | Manufacture method of double side type flexible printed circuits board |
| JP2015079801A (en) * | 2013-10-15 | 2015-04-23 | 日本メクトロン株式会社 | Manufacturing method for flexible printed circuit board and intermediate product used for manufacturing flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3829657B2 (en) | 2006-10-04 |
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