JP2002371349A - Mask for vapor deposition - Google Patents
Mask for vapor depositionInfo
- Publication number
- JP2002371349A JP2002371349A JP2001184601A JP2001184601A JP2002371349A JP 2002371349 A JP2002371349 A JP 2002371349A JP 2001184601 A JP2001184601 A JP 2001184601A JP 2001184601 A JP2001184601 A JP 2001184601A JP 2002371349 A JP2002371349 A JP 2002371349A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- frame
- vapor deposition
- substrate
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板上に電極や発
光体を蒸着により形成する時に使用する蒸着用マスクに
関するものである。[0001] 1. Field of the Invention [0002] The present invention relates to an evaporation mask used for forming electrodes and luminous bodies on a substrate by evaporation.
【０００２】[0002]
【従来の技術】近来は、表示機の画品質の向上が望まれ
ており、これに伴って画素製造工程では、個々の画素寸
法精度の向上のために目標値±２．０μｍの精度が、全
画素位置の累積精度の向上のために目標値±２．０μｍ
の精度が要求されている。2. Description of the Related Art In recent years, there has been a demand for an improvement in image quality of a display device. Accordingly, in a pixel manufacturing process, an accuracy of a target value ± 2.0 μm has been required to improve individual pixel dimensional accuracy. Target value ± 2.0 μm to improve the cumulative accuracy of all pixel positions
Accuracy is required.
【０００３】例えば、有機エレクトロルミネッセンス表
示機を製造する工程においては、ガラス板上にエレクト
ロルミネッセンス用の電極及び有機発光物質を蒸着によ
り形成する治具として、蒸着用マスクを用いる。この蒸
着用マスクは、銅板やニッケル板若しくは圧延ステンレ
ス板をエッチング若しくはレーザ等による機械加工にに
より蒸着部となる箇所を溶解・除去したマスク本体を、
ステンレスで作成された枠体にビス等で取り付けたもの
である。For example, in a process of manufacturing an organic electroluminescence display, an evaporation mask is used as a jig for forming an electrode for electroluminescence and an organic luminescent material on a glass plate by evaporation. This mask for vapor deposition is a mask body in which a copper plate, a nickel plate, or a rolled stainless steel plate is dissolved or removed by etching or machining with a laser or the like to be a deposition portion.
It is attached to a frame made of stainless steel with screws or the like.
【０００４】この蒸着用マスクと表示機の基板となるガ
ラス基板とを定位置に整合させ、場合によってはガラス
基板の背面から磁石を取り付けてマスク本体をガラス基
板の蒸着面へ全面密着させる。この後、整合密着させた
ガラス基板および蒸着用マスクを共に蒸着窯に投入し、
目的とする物質の蒸着を行なう。なお、蒸着用マスクと
ガラス基板との整合も蒸着窯内で行うことで、全面密
着、減圧、蒸着を連続して行なう場合も有る。The mask for vapor deposition and the glass substrate serving as the substrate of the display are aligned at a fixed position, and a magnet is attached from the back of the glass substrate in some cases, and the mask body is brought into close contact with the vapor deposition surface of the glass substrate. After that, the glass substrate and the mask for vapor deposition that were brought into close contact with each other were put into the vapor deposition kiln,
The target substance is deposited. In some cases, the alignment between the mask for vapor deposition and the glass substrate is also performed in the vapor deposition furnace, so that the entire surface is closely contacted, depressurized, and vapor-deposited in some cases.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、蒸着に
際しては電極及び発光物質の蒸着に適合した加熱をする
為、ガラス基板および蒸着用マスクは夫々の熱線膨張係
数に基づいた寸法変化の挙動を示すこととなり、この寸
法変化に起因して、画素寸法精度や画素位置精度が低下
してしまい、要求される精度を達成することが困難とな
る。However, the glass substrate and the mask for vapor deposition exhibit a dimensional change behavior based on their respective linear thermal expansion coefficients in order to perform heating suitable for vapor deposition of the electrode and the luminescent material during vapor deposition. The pixel size accuracy and the pixel position accuracy are reduced due to the dimensional change, and it is difficult to achieve the required accuracy.
【０００６】例えば、ガラス基板上に電極を蒸着した
後、発光物質をガラス基板上の決められた電極位置に蒸
着する為、電極位置と発光物質蒸着用マスクを整合させ
た後、蒸着窯内に投入し、減圧、加熱し発光物質をガラ
ス基板上に着床させなければならないしカラー表示板の
場合は光の３原色を発光する物質を各々同位置へ蒸着し
なければならない。この時、ガラス基板では熱線膨張係
数が３〜５×１０-6／Ｋであるのに対し、ステンレス製
の蒸着用マスクでは熱線膨張係数が１２×１０-6／Ｋで
ある為に、蒸着時の高温による熱膨張率の違いから、常
温下で蒸着用マスクをガラス基板に整合させた際の蒸着
位置と、既にガラス基板上に蒸着されている蒸着物質の
位置とにズレが生じてしまい、蒸着工程毎に微妙に蒸着
位置がずれることで、表示機の画質向上を妨げることと
なる。For example, after an electrode is deposited on a glass substrate, a luminescent substance is deposited on a predetermined electrode position on the glass substrate. The light-emitting substance must be put on the substrate, decompressed and heated to be deposited on a glass substrate. In the case of a color display panel, substances emitting three primary colors of light must be deposited at the same position. At this time, the coefficient of linear thermal expansion of the glass substrate is 3 to 5 × 10 −6 / K, whereas the coefficient of linear thermal expansion of the stainless steel evaporation mask is 12 × 10 −6 / K. Due to the difference in the coefficient of thermal expansion due to the high temperature, a shift occurs between the deposition position when the deposition mask is aligned with the glass substrate at room temperature and the position of the deposition material already deposited on the glass substrate, A slight shift in the deposition position in each deposition step hinders improvement in the image quality of the display device.
【０００７】つまり、蒸着時に使用する基板と蒸着用マ
スクが有する熱線膨張係数に差がある為に、目標とする
精度の良い蒸着が困難となる。この結果、発光物質境界
面で物質の混合状況が発生し、表示機の色発光特性が低
下する。しかも、熱膨張によるサイズ変化の誤差は、面
積が大きくなればなるほど顕著となり、到底無視し得な
い蒸着位置のズレとなる危険性があることから、大面積
の蒸着が出来ない状況である。よって、ガラス基板と熱
線膨張係数が大きく異なる銅製、ニッケル製、ステンレ
ス製のマスク本体を用いて蒸着工程を行う場合、寸法精
度良く蒸着出来る大きさに限界があるため、近来望まれ
ている表示機の大型化に対応できないという問題点もあ
る。In other words, since there is a difference between the coefficient of linear thermal expansion of the substrate used for vapor deposition and the coefficient of linear thermal expansion of the vapor deposition mask, it is difficult to perform the vapor deposition with the desired accuracy. As a result, a mixed state of the substances occurs at the light emitting substance boundary surface, and the color light emission characteristics of the display device deteriorate. In addition, the error in size change due to thermal expansion becomes more pronounced as the area becomes larger, and there is a risk that the deposition position may be displaced which cannot be neglected, so that a large area cannot be deposited. Therefore, when performing the deposition process using a mask body made of copper, nickel, or stainless steel having a coefficient of linear thermal expansion that is significantly different from that of a glass substrate, there is a limit to the size that can be deposited with high dimensional accuracy. There is also a problem that it is not possible to cope with the increase in size.
【０００８】上述したような熱線膨張係数の違いに起因
した問題点の解決手法として、被蒸着基板と同一の熱線
膨張係数を有する物質でマスク本体を作成するか若しく
は低熱線膨張係数を有する物質でマスク本体を作成する
事である。このようなマスク本体の製造方法としては、
被蒸着基板と同一の熱線膨張係数又は低熱線膨張係数を
有する合金電鋳によりマスク本体を作成するか、あるい
は被蒸着基板と同一の熱線膨張係数又は低熱線膨張係数
を有する合金板をエッチングしてマスク本体を作成する
手法が考えられる。As a method of solving the above-mentioned problem caused by the difference in the coefficient of linear thermal expansion, the mask body is made of a material having the same coefficient of linear thermal expansion as the substrate to be deposited or a material having a low coefficient of linear thermal expansion. Create the mask body. As a method of manufacturing such a mask body,
Either create the mask body by alloy electroforming having the same coefficient of thermal expansion or low coefficient of thermal expansion as the substrate to be deposited, or etch the alloy plate having the same coefficient of thermal expansion or low coefficient of thermal expansion as the substrate to be deposited. A method of creating a mask body is conceivable.
【０００９】しかし、合金電鋳でマスク本体を作成し、
全面に均一な熱線膨張係数を確保する為には、電鋳生成
膜の組成が膜全体に精度良く制御されていなければなら
ないが、現在の合金電鋳技術では析出膜全体の組成比を
一定且つ均一に制御する事は困難である。また、合金板
をエッチングする事によりマスク本体を作成する場合に
は、エッチング法では避けられないサイドエッチ現象が
生じ、蒸着パターンの精度を±１０μｍ以下で作成する
事は至難の技であり、しかも、直角を保持しなければな
らない隅角度は端面部がＲ形状となって、蒸着時に被蒸
着基板上に目的とする蒸着範囲外へ蒸着物質の滲み現象
が生じ、画素品質低下の要因となり不適切なマスク本体
となる。さらに、合金板をマスク本体に用いる場合、合
金板の製造ロットや圧延方向による溶解速度差があるこ
とに起因して、蒸着部となる孔の浸食が不均一となるた
め、エッチング法では電鋳法に比べ画素寸法精度が低く
±８〜１０μｍしか確保できていない。However, the mask body is made by electroforming alloy,
In order to ensure a uniform coefficient of linear thermal expansion over the entire surface, the composition of the electroformed film must be accurately controlled over the entire film, but with the current alloy electroforming technology, the composition ratio of the entire deposited film is constant and constant. It is difficult to control uniformly. In addition, when the mask body is made by etching the alloy plate, a side etch phenomenon that cannot be avoided by the etching method occurs, and it is extremely difficult to make the accuracy of the deposition pattern within ± 10 μm or less. The corner angle at which the right angle must be maintained is such that the end face becomes an R-shape, and the deposition material bleeds out of the intended deposition range on the deposition target substrate during the deposition, which causes a deterioration in pixel quality and is inappropriate. The mask body. Furthermore, when an alloy plate is used for the mask body, the erosion of the hole serving as the deposition portion becomes non-uniform due to the difference in the dissolution rate depending on the production lot and the rolling direction of the alloy plate. The pixel dimensional accuracy is lower than that of the method, and only ± 8 to 10 μm can be secured.
【００１０】また、上記の電鋳によるマスク本体の製造
方法、合金板のエッチングによるマスク本体の製造方法
の何れにおいても、大型の蒸着用マスクを作成するに際
しては、フォトリソグラフィーや電鋳時の加温による影
響で累積寸法精度を確保する事が困難である。In any of the above-described method of manufacturing a mask body by electroforming and the method of manufacturing a mask body by etching an alloy plate, a large mask for vapor deposition is prepared by photolithography or electroforming. It is difficult to secure the cumulative dimensional accuracy due to the influence of temperature.
【００１１】このように、蒸着による色ずれ不具合の発
生や蒸着法による寸法上の加工限界の存在は、マスク本
体の構造とマスク本体の製造方法とに因るものであり、
被蒸着基板とマスク本体及び蒸着用マスクの材質による
熱線膨張係数の差異に起因している。また、従来の方法
では蒸着用マスクの大型化も困難であり、コストダウン
の妨げともなっている。As described above, the occurrence of the color misregistration problem due to the vapor deposition and the existence of the dimensional processing limit due to the vapor deposition method are caused by the structure of the mask body and the method of manufacturing the mask body.
This is due to the difference in the coefficient of linear thermal expansion depending on the material of the substrate to be deposited, the mask body and the mask for deposition. In addition, it is difficult to increase the size of the evaporation mask by the conventional method, which hinders cost reduction.
【００１２】そこで、本発明は、被蒸着基板と熱線膨張
係数が異なる素材からなるマスク本体を用いて蒸着を行
っても、蒸着部の寸法精度および蒸着位置の累積精度を
向上させることができると共に、大型化も容易な構造の
蒸着用マスクの提供と目的とする。Therefore, the present invention can improve the dimensional accuracy of the deposition section and the cumulative accuracy of the deposition position even when deposition is performed using a mask body made of a material having a different coefficient of linear thermal expansion from the substrate to be deposited. Another object of the present invention is to provide a vapor deposition mask having a structure that can be easily enlarged.
【００１３】[0013]
【課題を解決するための手段】上記課題を解決するため
に、請求項１に係る発明は、被蒸着基板への蒸着用パタ
ーンがパターン形成領域内に通過孔として形成された薄
板状のマスク本体と、上記マスク本体におけるパターン
形成領域の外周縁である接着領域に応じた形状の枠部
を、被蒸着基板と同等の熱線膨張係数の素材によって上
記マスク本体よりも十分な厚みを有するように形成した
枠体と、からなり、上記マスク本体と枠体とを温度変化
に対して安定した接着方法により密着状に一体化してな
る。According to a first aspect of the present invention, there is provided a thin plate-shaped mask body in which a pattern for vapor deposition on a substrate to be vapor deposited is formed as a through hole in a pattern forming region. And a frame portion having a shape corresponding to the bonding region which is the outer peripheral edge of the pattern forming region in the mask body is formed by a material having a thermal expansion coefficient equivalent to that of the substrate to be deposited so as to have a sufficient thickness than the mask body. And the mask body and the frame body are tightly integrated by a bonding method that is stable against temperature change.
【００１４】また、請求項２に係る発明は、上記請求項
１において、複数のマスク本体を一つの枠体に密着状に
一体化したことを特徴とする。According to a second aspect of the present invention, in the first aspect, a plurality of mask bodies are integrated into one frame body in a tightly contacting manner.
【００１５】また、請求項３に係る発明は、被蒸着基板
への蒸着用パターンがパターン形成領域内に通過孔とし
て形成された薄板状のマスク本体と、上記マスク本体に
おけるパターン形成領域の外周縁である接着領域に応じ
た形状の枠部を、低熱線膨張係数の素材によって上記マ
スク本体よりも十分な厚みを有するように形成した枠体
と、からなり、上記マスク本体と枠体とを温度変化に対
して安定した接着方法により密着状に一体化してなる。According to a third aspect of the present invention, there is provided a thin plate-shaped mask main body in which a pattern for vapor deposition on a substrate to be vapor-deposited is formed as a through hole in a pattern forming region, and an outer peripheral edge of the pattern forming region in the mask main body. A frame having a shape corresponding to the bonding region, which is formed of a material having a low coefficient of linear thermal expansion so as to have a sufficient thickness than the mask main body. It is integrated in close contact with a stable bonding method against changes.
【００１６】また、請求項４に係る発明は、上記請求項
３において、複数のマスク本体を一つの枠体に密着状に
一体化したことを特徴とする。According to a fourth aspect of the present invention, in the above third aspect, a plurality of mask bodies are integrated into one frame body in a tightly contacting manner.
【００１７】[0017]
【発明の実施の形態】次に、添付図面に基づいて、本発
明に係る蒸着用マスクの一実施形態を説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a deposition mask according to the present invention will be described with reference to the accompanying drawings.
【００１８】図１および図２に示すのは、第１実施形態
に係る蒸着用マスク１であり、薄板状のマスク本体２と
枠体３とからなる。上記マスク本体２は、例えば正方形
のもので、内部のほぼ正方形のパターン形成領域２ａ内
に多数の通過孔４…が開設され、ガラス板などの被蒸着
基板へ電極もしくは発光体を蒸着するためのパターンを
形成する。なお、パターン形成領域２ａは矩形のものに
限らず、種々の任意形状に形成すれば良い。一方、枠体
３は、上記マスク本体２における接着領域２ｂに応じた
形状（四角枠状）を上下左右４辺に連続する第１辺３
ａ，第２辺３ｂ，第３辺３ｃ，第４辺３ｄからなる枠部
を被蒸着基板と同等の熱線膨張係数の素材によって形成
したものである。FIGS. 1 and 2 show a vapor deposition mask 1 according to a first embodiment, which comprises a thin plate-shaped mask body 2 and a frame 3. The mask body 2 is, for example, a square, and has a large number of through holes 4 in a substantially square pattern forming area 2a inside, for depositing an electrode or a luminous body on a deposition target substrate such as a glass plate. Form a pattern. The pattern forming region 2a is not limited to a rectangular shape, and may be formed in various arbitrary shapes. On the other hand, the frame 3 has a shape (square frame shape) corresponding to the bonding area 2b in the mask main body 2 and a first side 3 which is continuous with four sides of the upper, lower, left and right sides.
a, a frame portion including the second side 3b, the third side 3c, and the fourth side 3d is formed of a material having a thermal expansion coefficient equivalent to that of the substrate to be deposited.
【００１９】上記の様に構成した枠体３は、温度変化に
対して安定した接着剤５（例えば、耐熱セラミックス系
接着剤と耐熱エポキシ樹脂接着剤など）を用いて、マス
ク本体２の接着領域２ｂに接着する。この時、マスク本
体２に設けた取付孔６…と枠体３に設けた取付孔６…と
が合致するように位置合わせする。なお、取付孔６…
は、蒸着用マスク１を蒸着窯内の取付枠へビス止めする
ための孔である。The frame 3 constructed as described above uses an adhesive 5 (for example, a heat-resistant ceramic-based adhesive and a heat-resistant epoxy resin adhesive) that is stable against temperature changes, and 2b. At this time, the positioning is performed so that the mounting holes 6 provided in the mask body 2 and the mounting holes 6 provided in the frame body 3 match. In addition, mounting holes 6 ...
Are holes for screwing the evaporation mask 1 to a mounting frame in the evaporation furnace.
【００２０】これに加えて、重要なポイントは、マスク
本体２に弛みが生じないように均一な張力で枠体３の全
面を接着領域２ｂへ均一に接着する事である。また、五
角形や六角形のマスク本体２とした場合には、五辺，六
辺の全てに対応する枠形状の枠体３を用い、円形のマス
ク本体２とした場合には、円環状の枠体３を用いること
で、マスク本体３の全周囲（熱膨張による変化が生ずる
全ての側縁部）に枠体３が密着している状態としておく
ことである。In addition, an important point is that the entire surface of the frame 3 is uniformly bonded to the bonding area 2b with a uniform tension so that the mask body 2 does not become loose. When the pentagonal or hexagonal mask body 2 is used, a frame body 3 having a frame shape corresponding to all five sides and six sides is used. When the mask body 2 is circular, an annular frame is used. By using the body 3, the frame 3 is kept in close contact with the entire periphery of the mask body 3 (all side edges where changes due to thermal expansion occur).
【００２１】上記マスク本体２の作製法としては、従来
と同様な種々の方法が利用できるが、本実施形態では、
電気鋳造により厚さ２０μｍ程度に形成したものを用
い、枠体３としては、鉄―ニッケル合金，インバー等の
１ｍｍ程度の板厚のものを枠状に加工して用いる。すな
わち、枠体３は、マスク本体２よりも十分な厚みを有す
るものである。なお、図１（ｂ）の縦断面図は、実際の
縮尺関係を保持して描いたものではなく、マスク本体２
と枠体３との接着状態を分かりやすくするために、厚み
を強調した模式図としてある。As a method for manufacturing the mask main body 2, various methods similar to those of the related art can be used.
The one formed to a thickness of about 20 μm by electroforming is used, and the frame body 3 is made of a sheet having a thickness of about 1 mm such as an iron-nickel alloy or invar and processed into a frame shape. That is, the frame 3 has a sufficient thickness than the mask main body 2. Note that the vertical cross-sectional view of FIG. 1B is not drawn while maintaining the actual scale relationship, and the mask body 2 is not drawn.
In order to make the state of adhesion between the frame 3 and the frame 3 easy to understand, it is a schematic diagram in which the thickness is emphasized.
【００２２】上記のように構成した蒸着用マスク１は、
マスク本体２の形成素材が有する熱線膨張係数が被蒸着
基板の有する熱線膨張係数と異なっていても、蒸着窯内
で加熱された際には、被蒸着基板と同等の熱線膨張係数
を有する枠体３の膨張状態に追随して形状変化すること
となる。すなわち、マスク本体２と枠体３とを一体化し
てなる蒸着用マスク１は実質的に被蒸着基板と近似の熱
線膨張係数を保有する事となり、常温時の整合精度が蒸
着時の昇温時にも保持されるので、マスク本体３のパタ
ーン形成領域２ａ内に形成した通過孔４の精度（寸法精
度および一の累積精度）が損なわれることを防ぐことが
できる。これにより、蒸着マスク１を用いた電極や発光
物質の蒸着加工においては、画素の寸法精度および画素
位置の累積精度を従来になく高めることが可能となる。The evaporation mask 1 configured as described above is
Even if the coefficient of linear expansion of the material forming the mask body 2 is different from the coefficient of linear expansion of the substrate to be deposited, when heated in the evaporation furnace, the frame has the same coefficient of linear expansion as the substrate to be deposited. The shape changes following the expansion state of No. 3. That is, the evaporation mask 1 formed by integrating the mask body 2 and the frame body 3 has a coefficient of linear thermal expansion substantially similar to that of the substrate to be evaporated. Therefore, the accuracy (dimensional accuracy and one cumulative accuracy) of the through holes 4 formed in the pattern formation region 2a of the mask main body 3 can be prevented from being impaired. This makes it possible to increase the dimensional accuracy of the pixels and the cumulative accuracy of the pixel positions in the deposition processing of the electrode and the luminescent substance using the deposition mask 1 than ever before.
【００２３】なお、蒸着用マスク１を形成する枠体３の
素材として選定できるのは、被蒸着基板の有する熱膨張
係数と同等の素材に限定されない。例えば、蒸着窯内の
温度領域で熱膨張を生じ難い素材、すなわち、低熱線膨
張係数を有する素材（例えば、セラミックス）で枠体３
を形成してなる蒸着用マスク１においては、マスク本体
２の形成素材が有する熱線膨張係数が被蒸着基板の有す
る熱線膨張係数と異なっていても、蒸着窯内で加熱され
た際には、低熱線膨張係数を有する枠体３に抑制され
て、マスク本体２が形状変化することを抑止できる。す
なわち、マスク本体２と枠体３とを一体化してなる蒸着
用マスク１は実質的に低熱線膨張係数を保有する事とな
り、常温時の整合精度が蒸着時の昇温時にも保持される
ので、マスク本体２のパターン形成領域２ａ内に形成し
た通過孔４の精度が損なわれることを防ぐことができ
る。これにより、蒸着マスク１を用いた電極や発光物質
の蒸着加工においては、画素の寸法精度および画素位置
の累積精度を従来になく高めることが可能となる。The material that can be selected as the material of the frame 3 forming the evaporation mask 1 is not limited to a material having the same thermal expansion coefficient as that of the substrate to be evaporated. For example, the frame 3 is made of a material that does not easily undergo thermal expansion in the temperature range of the deposition furnace, that is, a material (for example, ceramics) having a low coefficient of linear thermal expansion.
In the mask for vapor deposition 1 formed by forming a mask, even if the coefficient of linear thermal expansion of the material for forming the mask main body 2 is different from the coefficient of linear thermal expansion of the substrate to be vapor-deposited, when heated in the vapor deposition kiln, The shape change of the mask main body 2 can be suppressed by being suppressed by the frame 3 having a coefficient of linear thermal expansion. That is, the deposition mask 1 formed by integrating the mask body 2 and the frame 3 has a substantially low coefficient of linear thermal expansion, and the matching accuracy at room temperature is maintained even when the temperature is raised during deposition. In addition, it is possible to prevent the accuracy of the passage hole 4 formed in the pattern formation region 2a of the mask main body 2 from being impaired. This makes it possible to increase the dimensional accuracy of the pixels and the cumulative accuracy of the pixel positions in the deposition processing of the electrode and the luminescent substance using the deposition mask 1 than ever before.
【００２４】また、マスク本体２と枠体３との接着方法
も、上述した種類の接着剤を用いる場合に限らず、温度
変化に対して安定した接着方法であれば、公知既存の如
何様な接着方法を適用できる。例えば、レーザ溶接や電
気抵抗溶接などの接着法で、マスク本体２の全外周であ
る接着領域２ｂに枠体３の全面を接着し、マスク本体２
を枠体３へ密着状に一体化しても良い。The method of bonding the mask body 2 and the frame body 3 is not limited to the case of using the above-mentioned type of adhesive. A bonding method can be applied. For example, the entire surface of the frame body 3 is bonded to the bonding area 2b, which is the entire outer periphery of the mask body 2, by a bonding method such as laser welding or electric resistance welding.
May be integrated with the frame 3 in close contact.
【００２５】上述した第１実施形態においては、一枚の
マスク本体２と一つの枠体３とを一体化して蒸着用マス
ク１を形成したが、次に、複数のマスク本体を一つの枠
体で保持することにより大型の蒸着用マスクとした第２
実施形態を図３に基づいて説明する。なお、同一の構成
には同一符号を付して説明を省略した。In the first embodiment described above, one mask main body 2 and one frame 3 are integrated to form the evaporation mask 1, but next, a plurality of mask main bodies are connected to one frame. The second is a large mask for vapor deposition by holding
An embodiment will be described with reference to FIG. The same components have the same reference characters allotted, and description thereof will not be repeated.
【００２６】第２実施形態に係る蒸着用マスク１０は、
４枚のマスク本体２１，２２，２３，２４を一つの枠体
３０によって保持するものである。すなわち、マスクパ
ターン形成用の通過孔４…が設けられたマスク本体２１
〜２４の各パターン形成領域２１ａ，２２ａ，２３ａ，
２４ａを除く接着領域２１ｂ，２２ｂ，２３ｂ，２４ｂ
を、枠体３０の第１外側辺３１，第２外側辺３２，第３
外側辺３３，第４外側辺３４，第１内側辺３５，第２内
側辺３６，第３内側辺３７，第４内側辺３８によって全
て接着するのである。The mask 10 for vapor deposition according to the second embodiment comprises:
The four mask bodies 21, 22, 23 and 24 are held by one frame 30. That is, the mask main body 21 provided with the through holes 4 for forming the mask pattern.
To 24 pattern forming regions 21a, 22a, 23a,
Adhesion areas 21b, 22b, 23b, 24b excluding 24a
To the first outer side 31, the second outer side 32, the third
The outer side 33, the fourth outer side 34, the first inner side 35, the second inner side 36, the third inner side 37, and the fourth inner side 38 are all bonded.
【００２７】このように、複数枚のマスク本体２１〜２
４を束ねて蒸着用マスク１０とした場合にも、蒸着窯内
での挙動は枠体３０の素材が有する熱線膨張係数に依存
することとなる。すなわち、被蒸着基板と同等の熱線膨
張係数を有する素材を枠体３０に用いた場合には、枠体
３０の膨張状態に追随してマスク本体２１〜２４も形状
変化することとなり、低熱線膨張係数を有する素材を枠
体３０に用いた場合には、低熱線膨張係数を有する枠体
３０に抑制されてマスク本体２１〜２４が形状変化する
ことを抑止できる。As described above, a plurality of mask bodies 21 to 2
Even when the masks 4 are bundled to form the mask 10 for vapor deposition, the behavior in the vapor deposition furnace depends on the coefficient of linear thermal expansion of the material of the frame 30. In other words, when a material having a thermal expansion coefficient equivalent to that of the substrate to be deposited is used for the frame 30, the mask bodies 21 to 24 also change shape following the expansion state of the frame 30, resulting in low thermal expansion. When a material having a coefficient is used for the frame 30, the shape change of the mask main bodies 21 to 24 can be suppressed by being suppressed by the frame 30 having the low linear thermal expansion coefficient.
【００２８】加えて、複数のマスク本体２１〜２４を一
つの枠体３０に密着状に一体化して蒸着用マスク１０を
構成するものとすれば、マスク本体２１〜２４を連設し
た大型の蒸着用マスク１０を容易に形成することが可能
となるので、例えば、大型の被蒸着基板に複数組のパタ
ーン蒸着を施せば、携帯電話用の小さな表示機を効率よ
く製造するようなケースに好適である。また、細分化し
たマスク本体を組み合わせて一つの蒸着パターンを形成
することができるので、表示機の大型化に容易に対応す
ることが出来る。しかも、一部のマスク本体に欠陥が生
じても、欠陥のあるマスク本体のみの交換で完全な蒸着
用マスクとして使用できる。よって、大型の蒸着用マス
ク製造の歩留まり向上と蒸着用マスクのコストダウンが
図れるという利点がある。In addition, if a plurality of mask bodies 21 to 24 are integrally formed on one frame 30 so as to be in close contact with each other to form the mask 10 for vapor deposition, a large-scale vapor deposition system in which the mask bodies 21 to 24 are continuously provided. For example, if a plurality of sets of pattern deposition are performed on a large-sized substrate to be vapor-deposited, it is suitable for a case in which a small display device for a mobile phone is efficiently manufactured, for example. is there. In addition, since one evaporation pattern can be formed by combining the divided mask bodies, it is possible to easily cope with an increase in the size of the display device. Moreover, even if a defect occurs in a part of the mask main body, it can be used as a complete evaporation mask by replacing only the defective mask main body. Therefore, there is an advantage that the yield of manufacturing a large-sized evaporation mask can be improved and the cost of the evaporation mask can be reduced.
【００２９】[0029]
【発明の効果】以上説明したように、請求項１に係る蒸
着用マスクによれば、マスク本体の形成素材が有する熱
線膨張係数が被蒸着基板の有する熱線膨張係数と異なっ
ていても、蒸着窯内で加熱された際には、被蒸着基板と
同等の熱線膨張係数を有する枠体の膨張状態に追随して
形状変化することとなる。すなわち、マスク本体と枠体
とを一体化してなる蒸着用マスクは実質的に被蒸着基板
と近似の熱線膨張係数を保有する事となり、常温時の整
合精度が蒸着時の昇温時にも保持されるので、マスク本
体のパターン形成領域内に形成した通過孔の精度が損な
われることを防ぐことができる。これにより、電極や発
光物質の蒸着加工においては、画素の寸法精度および画
素位置の累積精度を極めて良好ならしめ得る。As described above, according to the mask for vapor deposition according to the first aspect, even if the coefficient of linear thermal expansion of the material forming the mask body is different from the coefficient of linear thermal expansion of the substrate to be vapor-deposited, When heated inside, the shape changes following the expansion state of the frame having the same linear thermal expansion coefficient as the substrate to be deposited. In other words, the evaporation mask formed by integrating the mask body and the frame body has a coefficient of linear thermal expansion substantially similar to that of the substrate to be evaporated, and the matching accuracy at room temperature is maintained even when the temperature rises during evaporation. Therefore, it is possible to prevent the accuracy of the passage hole formed in the pattern formation region of the mask body from being impaired. This makes it possible to extremely improve the dimensional accuracy of the pixel and the cumulative accuracy of the pixel position in the deposition process of the electrode and the luminescent material.
【００３０】また、請求項２に係る蒸着用マスクによれ
ば、複数のマスク本体を一つの枠体に密着状に一体化す
るので、マスク本体を連設した大型の蒸着用マスクを容
易に形成することが可能となり、被蒸着基板の大型化に
容易に対応することが出来るし、マスクパターンの一部
に欠陥が生じても、欠陥のあるマスク本体のみの交換で
完全な蒸着用マスクとして使用できる。従って、大型の
蒸着用マスク製造の歩留まり向上と蒸着用マスクのコス
トダウンが図れるという利点がある。According to the vapor deposition mask of the present invention, since a plurality of mask bodies are integrated into one frame in close contact with each other, a large vapor deposition mask having a series of mask bodies can be easily formed. It can easily cope with the enlargement of the substrate to be deposited, and even if a defect occurs in a part of the mask pattern, it can be used as a complete evaporation mask by replacing only the defective mask body it can. Therefore, there is an advantage that the yield of manufacturing a large-sized evaporation mask can be improved and the cost of the evaporation mask can be reduced.
【００３１】また、請求項３に係る蒸着用マスクによれ
ば、マスク本体の形成素材が有する熱線膨張係数が被蒸
着基板の有する熱線膨張係数と異なっていても、蒸着窯
内で加熱された際には、低熱線膨張係数を有する枠体に
抑制されて、マスク本体が形状変化することを抑止でき
る。すなわち、マスク本体と枠体とを一体化してなる蒸
着用マスクは実質的に低熱線膨張係数を保有する事とな
り、常温時の整合精度が蒸着時の昇温時にも保持される
ので、マスク本体のパターン形成領域内に形成した通過
孔の精度が損なわれることを防ぐことができる。これに
より、電極や発光物質の蒸着加工においては、画素の寸
法精度および画素位置の累積精度を極めて良好ならしめ
得る。According to the vapor deposition mask of the present invention, even if the linear expansion coefficient of the material forming the mask body is different from the linear thermal expansion coefficient of the substrate to be vaporized, Thus, the shape of the mask body can be prevented from being changed by being suppressed by the frame having a low coefficient of linear thermal expansion. That is, the evaporation mask formed by integrating the mask body and the frame body has a substantially low coefficient of linear thermal expansion, and the matching accuracy at room temperature is maintained even when the temperature is raised during evaporation. The accuracy of the passage holes formed in the pattern formation region can be prevented from being impaired. This makes it possible to extremely improve the dimensional accuracy of the pixel and the cumulative accuracy of the pixel position in the deposition process of the electrode and the luminescent material.
【００３２】また、請求項４に係る蒸着用マスクによれ
ば、複数のマスク本体を一つの枠体に密着状に一体化す
るので、マスク本体を連設した大型の蒸着用マスクを容
易に形成することが可能となり、被蒸着基板の大型化に
容易に対応することが出来るし、一部のマスク本体に欠
陥が生じても、欠陥のあるマスク本体のみの交換で完全
な蒸着用マスクとして使用できる。従って、大型の蒸着
用マスク製造の歩留まり向上と蒸着用マスクのコストダ
ウンが図れるという利点がある。According to the vapor deposition mask of the present invention, since a plurality of mask bodies are integrated into one frame in close contact with each other, a large vapor deposition mask having a series of mask bodies can be easily formed. It is possible to easily cope with the enlargement of the substrate to be deposited, and even if a defect occurs in a part of the mask body, it can be used as a complete evaporation mask by replacing only the defective mask body. it can. Therefore, there is an advantage that the yield of manufacturing a large-sized evaporation mask can be improved and the cost of the evaporation mask can be reduced.
【図１】（ａ）本発明に係る蒸着用マスクの平面図であ
る。 （ｂ）図１（ａ）のｂ−ｂ線矢視方向の縦断面図であ
る。FIG. 1 (a) is a plan view of a deposition mask according to the present invention. (B) It is a longitudinal cross-sectional view in the direction of arrow bb in FIG. 1 (a).
【図２】蒸着用マスクの分解斜視図である。FIG. 2 is an exploded perspective view of a deposition mask.
【図３】他の実施形態に係る蒸着用マスクの斜視図であ
る。FIG. 3 is a perspective view of a deposition mask according to another embodiment.
１ 第１実施形態に係る蒸着用マスク ２ マスク本体 ２ａ パターン形成領域 ２ｂ 接着領域 ３ 枠体 ４ 通過孔 ５ 接着剤 ６ 取付孔 １０ 第２実施形態に係る蒸着用マスク ２１〜２４ マスク本体 ３０ 枠体 REFERENCE SIGNS LIST 1 evaporation mask according to first embodiment 2 mask body 2a pattern formation area 2b adhesion area 3 frame 4 passing hole 5 adhesive 6 mounting hole 10 evaporation mask 21 to 24 mask body 30 frame according to second embodiment
Claims (4)
ン形成領域内に通過孔として形成された薄板状のマスク
本体と、 上記マスク本体におけるパターン形成領域の外周縁であ
る接着領域に応じた形状の枠部を、被蒸着基板と同等の
熱線膨張係数の素材によって上記マスク本体よりも十分
な厚みを有するように形成した枠体と、 からなり、上記マスク本体と枠体とを温度変化に対して
安定した接着方法により密着状に一体化してなる蒸着用
マスク。1. A thin plate-shaped mask main body in which a pattern for vapor deposition on a substrate to be vapor-deposited is formed as a through hole in a pattern forming region, and a shape corresponding to an adhesion region which is an outer peripheral edge of the pattern forming region in the mask main body. A frame formed of a material having a coefficient of linear thermal expansion equivalent to that of the substrate to be deposited so as to have a sufficient thickness than the mask main body. A mask for vapor deposition that is integrated into a close contact by a stable and stable bonding method.
に一体化したことを特徴とする請求項１に記載の蒸着用
マスク。2. The vapor deposition mask according to claim 1, wherein a plurality of mask bodies are integrated into one frame body in close contact.
ン形成領域内に通過孔として形成された薄板状のマスク
本体と、 上記マスク本体におけるパターン形成領域の外周縁であ
る接着領域に応じた形状の枠部を、低熱線膨張係数の素
材によって上記マスク本体よりも十分な厚みを有するよ
うに形成した枠体と、 からなり、上記マスク本体と枠体とを温度変化に対して
安定した接着方法により密着状に一体化してなる蒸着用
マスク。3. A thin plate-shaped mask main body in which a pattern for vapor deposition on a substrate to be vapor-deposited is formed as a through hole in a pattern formation region, and a shape corresponding to an adhesion region which is an outer peripheral edge of the pattern formation region in the mask main body. And a frame formed by using a material having a low coefficient of linear thermal expansion so as to have a sufficient thickness than the mask main body. The method for bonding the mask main body and the frame to a stable temperature change A mask for vapor deposition that is integrated in a tightly contacted state.
に一体化したことを特徴とする請求項３に記載の蒸着用
マスク。4. The mask for vapor deposition according to claim 3, wherein a plurality of mask bodies are integrated into a single frame so as to be in close contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001184601A JP4401040B2 (en) | 2001-06-19 | 2001-06-19 | Evaporation mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001184601A JP4401040B2 (en) | 2001-06-19 | 2001-06-19 | Evaporation mask |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002371349A true JP2002371349A (en) | 2002-12-26 |
| JP4401040B2 JP4401040B2 (en) | 2010-01-20 |
Family
ID=19024336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001184601A Expired - Fee Related JP4401040B2 (en) | 2001-06-19 | 2001-06-19 | Evaporation mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4401040B2 (en) |
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| JP2005339858A (en) * | 2004-05-25 | 2005-12-08 | Canon Inc | Mask structure and its manufacturing method |
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| CN100461494C (en) * | 2003-07-25 | 2009-02-11 | 大日本网目版制造株式会社 | Mask for vapour-deposition use and producing method thereof |
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| JP2005339861A (en) * | 2004-05-25 | 2005-12-08 | Canon Inc | Mask structure and its manufacturing method |
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