JP2002353572A - Multi-piece substrate and manufacturing method therefor - Google Patents
Multi-piece substrate and manufacturing method thereforInfo
- Publication number
- JP2002353572A JP2002353572A JP2001156333A JP2001156333A JP2002353572A JP 2002353572 A JP2002353572 A JP 2002353572A JP 2001156333 A JP2001156333 A JP 2001156333A JP 2001156333 A JP2001156333 A JP 2001156333A JP 2002353572 A JP2002353572 A JP 2002353572A
- Authority
- JP
- Japan
- Prior art keywords
- piece
- substrate
- frame portion
- adhesive sheet
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は，１枚の基板中に複
数のピース部が含まれる多ピース基板に関する。さらに
詳細には，１枚の基板が良品のピース部ばかりを含むよ
うに構成した多ピース基板（いわゆるジグソー基板）お
よびその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-piece substrate in which a single substrate includes a plurality of pieces. More specifically, the present invention relates to a multi-piece substrate (a so-called jigsaw substrate) in which one substrate includes only non-defective pieces, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】配線基板には，１枚の基板中に複数のピ
ース部が含まれる多ピース基板がある。多ピース基板に
ついては，後工程の要請上，例えば全ピース部が良品で
あることが求められる場合がある。しかしながら現実の
プロセス上では，不良品のピース部を含んだ多ピース基
板ができてしまうことを完全には排除し難い。しかし，
１つでも不良品のピース部が含まれているからといっ
て，その基板中の他の良品のピース部までスクラップに
してしまうのは，資源の有効利用上問題がある。2. Description of the Related Art As a wiring board, there is a multi-piece board in which a plurality of pieces are included in one board. Regarding a multi-piece substrate, there is a case where, for example, all pieces are required to be non-defective due to a request in a post-process. However, in an actual process, it is difficult to completely eliminate the formation of a multi-piece substrate including defective piece portions. However,
Even if at least one defective piece is included, scraping up another good piece in the substrate is problematic in terms of effective use of resources.
【０００３】このため，不良品のピース部と良品のピー
ス部とをともに含む基板（以下，「混載板」という）が
ある場合には，不良品のピース部を取り除き，その空き
地に他の混載板から取り外した良品のピース部を取り付
けていわゆるジグソー基板とすることが行われている。
これにより，資源を有効利用しつつ，全ピース部が良品
である多ピース基板を後工程に提供できるようにしてい
る。For this reason, when there is a substrate (hereinafter, referred to as a "mixing plate") including both a defective piece and a good piece, the defective piece is removed and another mixed loading is performed in the empty space. A so-called jigsaw substrate is provided by attaching a non-defective piece part removed from a plate.
This makes it possible to provide a multi-piece substrate in which all pieces are non-defective to a subsequent process while effectively utilizing resources.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら，従来の
ジグソー基板では，ピース部の取り外しおよび取り付け
を，最外層形成後にピース部とフレーム部とを繋ぐブリ
ッジの切断および接合により行っていた。このため，次
のような問題点があった。すなわち，フレーム部および
そのフレーム部にもともと付いているピース部と比べ，
切り貼りで取り付けたピース部は接合強度が弱くなって
いる。このため，後の工程で予期せぬ脱落を起こす場合
があった。However, in the conventional jigsaw substrate, the removal and attachment of the piece portion are performed by cutting and joining a bridge connecting the piece portion and the frame portion after the outermost layer is formed. For this reason, there were the following problems. That is, compared to the frame part and the piece part originally attached to the frame part,
The piece parts attached by cutting and pasting have low bonding strength. For this reason, there was a case where unexpected detachment occurred in a later step.
【０００５】そこで，本発明は上記した問題点を解決す
るためになされたものである。すなわちその課題とする
ところは，ピース部とフレーム部との継ぎ目部分の強度
の低下を防止することができる多ピース基板およびそれ
らの製造方法を提供することを課題とする。The present invention has been made to solve the above-mentioned problems. That is, an object of the present invention is to provide a multi-piece substrate capable of preventing a reduction in strength of a joint portion between a piece portion and a frame portion, and a method for manufacturing the same.
【０００６】[0006]
【課題を解決するための手段】上記した課題を解決する
ためになされた本発明に係る多ピース基板によれば，フ
レーム部とピース部との継ぎ目を，フレーム部とピース
部に跨って覆う接着シートを有するものである。継ぎ目
としては，ピース部に突起部を有するものと，フレーム
部にピース部の突起部に対応する凹部を有するものとを
継ぎ合わせるもの等がある。According to the multi-piece substrate according to the present invention, which has been made to solve the above-mentioned problems, an adhesive covering a joint between a frame portion and a piece portion over the frame portion and the piece portion is provided. It has a sheet. As the seam, there is a seam in which a piece having a projection is joined to a frame in which a recess corresponding to the projection of the piece is joined.
【０００７】この多ピース基板では，各ピース部とフレ
ーム部との間の接合強度が高い。また，ピース部に突起
部を有し，フレーム部の凹部に組み合わせるものにこれ
を適用すると，当該突起部と対応する凹部とを接着シー
トで覆うことにより，ピース部の本体部分にシートを接
着することなく，より高い接合強度が得られる。In this multi-piece substrate, the bonding strength between each piece portion and the frame portion is high. Further, when this is applied to a combination having a projection on the piece portion and being combined with the recess of the frame portion, the sheet is adhered to the body portion of the piece by covering the projection and the corresponding recess with an adhesive sheet. A higher joining strength can be obtained without any problem.
【０００８】本発明に係る多ピース基板の製造方法によ
れば，フレーム部と，フレーム部に対して接続された複
数のピース部とを有する多ピース基板の製造方法におい
て，あらかじめ前記フレーム部と前記ピース部とを組み
合わせておき，後から当該継ぎ目を接着シートで覆うこ
ととする。かくして，前述の多ピース基板が製造され
る。According to the method for manufacturing a multi-piece board according to the present invention, in the method for manufacturing a multi-piece board having a frame portion and a plurality of piece portions connected to the frame portion, the frame portion and the A piece part is combined, and the seam is later covered with an adhesive sheet. Thus, the aforementioned multi-piece substrate is manufactured.
【０００９】さらに，各ピース部とフレーム部との間の
設けた接着シートに，金属箔を被せることとするとより
よい。これにより，多ピース基板の割れを軽減すること
ができる。また，樹脂フローを軽減することもできる。Further, it is better to cover the adhesive sheet provided between each piece portion and the frame portion with a metal foil. As a result, cracking of the multi-piece substrate can be reduced. Also, the resin flow can be reduced.
【００１０】また，ピース部として，位置決め目標パタ
ーンを有したものを用いた場合は，接着シートにより位
置決め目標パターン部分を覆い隠してしまうことがあ
る。そのため，位置決め目標パターンを隠さないように
該当部分の接着シートをあらかじめ切り取っておくこと
が望ましい。これにより，接着シートで覆われてしまう
ことなく，位置決め目標パターンを使用することができ
る。When a piece having a positioning target pattern is used as the piece portion, the positioning target pattern may be covered with an adhesive sheet. Therefore, it is desirable to cut out the adhesive sheet of the corresponding portion in advance so as not to hide the positioning target pattern. Thereby, the positioning target pattern can be used without being covered with the adhesive sheet.
【００１１】[0011]
【発明の実施の形態】本形態に係る多ピース基板４０１
は，図１に示すように，フレーム部４０２と，４つのピ
ース部４０３とを有している。各ピース部４０３とフレ
ーム部４０２との間には，スリット４０７が開けられて
いる。そして，各ピース部４０３をフレーム部４０２に
固定する接合部に接着シート４０４が随所に設けられて
いる。ピース部４０３は，互いに裏向きに配置されてお
り，製品としては同じものである。図１の多ピース基板
４０１の寸法は，１４ｃｍ×２４ｃｍ程度である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Multi-piece substrate 401 according to the present embodiment
Has a frame portion 402 and four piece portions 403 as shown in FIG. A slit 407 is provided between each piece 403 and the frame 402. Further, an adhesive sheet 404 is provided at a joint portion for fixing each piece portion 403 to the frame portion 402. The piece parts 403 are arranged facing each other, and are the same as a product. The dimensions of the multi-piece substrate 401 in FIG. 1 are approximately 14 cm × 24 cm.
【００１２】図２は，本形態に係る多ピース基板４０１
において接着シート４０４付近の拡大図である。多ピー
ス基板４０１は，ピース部４０３，フレーム部４０２，
ブリッジ４０８を覆うように，当該基板の表面に接着シ
ート４０４を設けている。FIG. 2 shows a multi-piece substrate 401 according to this embodiment.
3 is an enlarged view near the adhesive sheet 404. The multi-piece substrate 401 includes a piece portion 403, a frame portion 402,
An adhesive sheet 404 is provided on the surface of the substrate so as to cover the bridge 408.
【００１３】次に，図３として接着シート４０４を貼り
付けた多ピース基板４０１の断面図を示す。図３中，フ
レーム部４０２とピース部４０３との一部が接着シート
４０４に覆われている。接着シート４０４としては，例
えば三井金属社製のＭＲ５００が使用可能である。これ
によりフレーム部４０２とピース部４０３との接合部の
両面は，接着シート４０４により接着され，しっかりと
固定されている。Next, FIG. 3 shows a cross-sectional view of the multi-piece substrate 401 to which the adhesive sheet 404 is attached. In FIG. 3, a part of the frame part 402 and the piece part 403 is covered with the adhesive sheet 404. As the adhesive sheet 404, for example, MR500 manufactured by Mitsui Kinzoku can be used. As a result, both surfaces of the joint portion between the frame portion 402 and the piece portion 403 are adhered and firmly fixed by the adhesive sheet 404.
【００１４】多ピース基板４０１の接合部は，フレーム
部４０２に凹部を設け，ピース部４０３の突起部と合わ
せる構造となっている。本形態では，接着シート４０４
を当該接合部およびその接合箇所近傍を覆い隠すように
貼り付けている。これにより，多ピース基板４０１にお
ける接合部は，フレーム部４０２の凹部とピース部４０
３の突起部との継ぎ目を接着剤等により接着したものと
比較して，接合強度がより強い。また，本形態では接着
剤は必須ではない。しかし，接着剤を接合部に使用して
もよい。その場合は，接着シート４０４の存在により，
接合部からの接着剤の漏れによる基板同士の接着が防止
される。接着シート４０４が接合部を覆っているからで
ある。The joint portion of the multi-piece substrate 401 has a structure in which a concave portion is provided in the frame portion 402 so as to be aligned with the projecting portion of the piece portion 403. In this embodiment, the adhesive sheet 404
Is attached so as to cover the joint and the vicinity of the joint. As a result, the joint portion of the multi-piece substrate 401 is formed by the concave portion of the frame portion 402 and the piece portion 40.
The joint strength is stronger than that obtained by bonding the joint with the protrusion of No. 3 with an adhesive or the like. In this embodiment, the adhesive is not essential. However, an adhesive may be used for the joint. In that case, due to the presence of the adhesive sheet 404,
Adhesion between the substrates due to leakage of the adhesive from the joint is prevented. This is because the adhesive sheet 404 covers the joint.
【００１５】また，図４の多ピース基板４０１の断面図
に示すように，接着シート４０４の表面を銅箔４０５で
覆ってもよい。これにより，多ピース基板４０１の割れ
を軽減することができる。また，樹脂フローを軽減する
こともできる。Further, as shown in the cross-sectional view of the multi-piece substrate 401 in FIG. 4, the surface of the adhesive sheet 404 may be covered with a copper foil 405. Thereby, the crack of the multi-piece substrate 401 can be reduced. Also, the resin flow can be reduced.
【００１６】また，図５の多ピース基板４０１の接合部
の拡大図に示すように，ピース部４０３には，フレーム
４０２に対するピース４０３の位置や，ピース４０３に
対する実装部品の位置を決定するためのフィデューシャ
ルパッド４０６が印刷されていることがある。このよう
なピース部４０３を使用する場合には，フィデューシャ
ルパッド４０６を覆わない形状の接着シート４０４を用
いるとよい。接着シート４０４が接合箇所全体を覆う
と，フィデューシャルパッド４０６が隠れてしまい，位
置決めに支障を来たすためである。As shown in the enlarged view of the joint portion of the multi-piece substrate 401 in FIG. 5, the piece portion 403 has a position for determining the position of the piece 403 with respect to the frame 402 and the position of the mounted component with respect to the piece 403. The fiducial pad 406 may be printed. When such a piece portion 403 is used, an adhesive sheet 404 that does not cover the fiducial pad 406 may be used. This is because if the adhesive sheet 404 covers the entire joint, the fiducial pad 406 is hidden, which hinders positioning.
【００１７】以上詳細に説明したように本形態では，多
ピース基板４０１において，あらかじめ突起部を有した
ピース部４０３とその突起部に対応する凹部を有したフ
レーム部４０２とを製造し，組み合わせておく。次に，
フレーム部４０２とピース部４０３との接合部および該
当箇所近傍を，接着シート４０４で覆うこととしてい
る。これにより，多ピース基板４０１全体としての強度
が高い多ピース基板が製造されている。As described in detail above, in the present embodiment, a piece portion 403 having a projection and a frame portion 402 having a concave portion corresponding to the projection are manufactured and combined on the multi-piece substrate 401 in advance. deep. next,
The bonding portion between the frame portion 402 and the piece portion 403 and the vicinity of the corresponding portion are covered with an adhesive sheet 404. As a result, a multi-piece substrate having high strength as a whole of the multi-piece substrate 401 is manufactured.
【００１８】なお，本形態は単なる例示にすぎず，本発
明を何ら限定するものではない。したがって本発明は当
然に，その要旨を逸脱しない範囲内で種々の改良，変形
が可能である。図２に示したものでは，接着シート４０
４が，ピース部４０３と，フレーム部４０２と，ブリッ
ジ４０８とを覆うこととしたが，ピース部４０３の突起
部およびフレーム部４０２のみを覆うこととしてもよ
い。これにより，ピース部４０３の本体部は，接着シー
ト４０４に覆われることなく，接着シート４０４がピー
ス部４０３に残ってしまう不備が回避される。Note that the present embodiment is merely an example and does not limit the present invention in any way. Therefore, naturally, the present invention can be variously modified and modified without departing from the gist thereof. In the example shown in FIG.
4 covers the piece portion 403, the frame portion 402, and the bridge 408, but may cover only the protrusion of the piece portion 403 and the frame portion 402. This avoids the defect that the adhesive sheet 404 remains in the piece portion 403 without the main body of the piece portion 403 being covered by the adhesive sheet 404.
【００１９】[0019]
【発明の効果】以上の説明から明らかなように本発明に
よれば，ピース部とフレーム部との継ぎ目部分の強度の
低下を防止することができる多ピース基板およびそれら
の製造方法が提供されている。As is apparent from the above description, according to the present invention, there are provided a multi-piece substrate capable of preventing a decrease in strength of a joint portion between a piece portion and a frame portion, and a method for manufacturing the same. I have.
【図１】実施の形態における多ピース基板の平面図であ
る。FIG. 1 is a plan view of a multi-piece substrate according to an embodiment.
【図２】多ピース基板におけるブリッジ付近の拡大図で
ある。FIG. 2 is an enlarged view near a bridge in a multi-piece substrate.
【図３】接着シートを用いた多ピース基板の断面図であ
る。FIG. 3 is a cross-sectional view of a multi-piece substrate using an adhesive sheet.
【図４】接着シートおよび銅箔を用いた多ピース基板の
断面図である。FIG. 4 is a cross-sectional view of a multi-piece substrate using an adhesive sheet and a copper foil.
【図５】多ピース基板における接合部にフィデューシャ
ルパッドがあるブリッジ付近の拡大図である。FIG. 5 is an enlarged view of the vicinity of a bridge having a fiducial pad at a bonding portion in a multi-piece substrate.
４０１ 多ピース基板 ４０２ フレーム部 ４０３ ピース部 ４０４ 接着シート ４０５ 銅箔 ４０６ フィデューシャルパッド ４０７ スリット ４０８ ブリッジ 401 Multi-piece substrate 402 Frame section 403 Piece section 404 Adhesive sheet 405 Copper foil 406 Fiducial pad 407 Slit 408 Bridge
Claims (4)
接続された複数のピース部とを有する多ピース基板にお
いて，前記フレーム部と前記ピース部との継ぎ目を，前
記フレーム部と前記ピース部とに跨って覆う接着シート
を有することを特徴とする多ピース基板。1. A multi-piece substrate having a frame portion and a plurality of piece portions connected to the frame portion, wherein a joint between the frame portion and the piece portion is formed by connecting the frame portion and the piece portion to each other. A multi-piece substrate, comprising an adhesive sheet covering over the substrate.
て，前記接着シートの表面に金属箔を有することを特徴
とする多ピース基板。2. The multi-piece substrate according to claim 1, wherein a metal foil is provided on a surface of said adhesive sheet.
て，前記ピース部が，突起部と，その中に設けられた位
置決め目標パターンとを有し，前記フレーム部が，前記
突起部に対応する凹部を有し，前記位置決め目標パター
ンは，前記接着シートに覆われずに露出していることを
特徴とする多ピース基板。3. The multi-piece substrate according to claim 1, wherein the piece portion has a projection and a positioning target pattern provided therein, and the frame portion corresponds to the projection. A multi-piece substrate having a concave portion, wherein the positioning target pattern is exposed without being covered by the adhesive sheet.
接続された複数のピース部とを有する多ピース基板の製
造方法において，前記フレーム部と前記ピース部との継
ぎ目を，前記フレーム部と前記ピース部ちに跨って接着
シートで覆うことを特徴とする多ピース基板の製造方
法。4. A method of manufacturing a multi-piece substrate having a frame portion and a plurality of piece portions connected to the frame portion, wherein a joint between the frame portion and the piece portion is formed by connecting the frame portion to the frame portion. A method for manufacturing a multi-piece substrate, comprising covering the piece portion with an adhesive sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001156333A JP2002353572A (en) | 2001-05-25 | 2001-05-25 | Multi-piece substrate and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001156333A JP2002353572A (en) | 2001-05-25 | 2001-05-25 | Multi-piece substrate and manufacturing method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002353572A true JP2002353572A (en) | 2002-12-06 |
Family
ID=19000355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001156333A Pending JP2002353572A (en) | 2001-05-25 | 2001-05-25 | Multi-piece substrate and manufacturing method therefor |
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| Country | Link |
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| WO2010053046A1 (en) * | 2008-11-07 | 2010-05-14 | イビデン株式会社 | Multi-piece board manufacturing method |
| KR101167617B1 (en) | 2012-02-24 | 2012-08-23 | 주식회사 엘제이텍 | Method for replacing bad array board in the PCB |
| KR101237287B1 (en) | 2012-10-08 | 2013-02-27 | 주식회사 엘제이텍 | Printed circuit board panel |
| JP2013045890A (en) * | 2011-08-24 | 2013-03-04 | Nippon Mektron Ltd | Replacement method of circuit board unit wiring board, and product sheet of circuit board |
| US8592686B2 (en) | 2004-04-09 | 2013-11-26 | Dai Nippon Printing Co., Ltd. | Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same |
| KR101432390B1 (en) | 2012-12-21 | 2014-08-20 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
-
2001
- 2001-05-25 JP JP2001156333A patent/JP2002353572A/en active Pending
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| US8592686B2 (en) | 2004-04-09 | 2013-11-26 | Dai Nippon Printing Co., Ltd. | Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same |
| WO2010053046A1 (en) * | 2008-11-07 | 2010-05-14 | イビデン株式会社 | Multi-piece board manufacturing method |
| JP5079099B2 (en) * | 2008-11-07 | 2012-11-21 | イビデン株式会社 | Multi-piece manufacturing method |
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| JP2013045890A (en) * | 2011-08-24 | 2013-03-04 | Nippon Mektron Ltd | Replacement method of circuit board unit wiring board, and product sheet of circuit board |
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