JPH04206675A - Printed circuit board with heat sink - Google Patents
Printed circuit board with heat sinkInfo
- Publication number
- JPH04206675A JPH04206675A JP33016690A JP33016690A JPH04206675A JP H04206675 A JPH04206675 A JP H04206675A JP 33016690 A JP33016690 A JP 33016690A JP 33016690 A JP33016690 A JP 33016690A JP H04206675 A JPH04206675 A JP H04206675A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- hole
- clearance hole
- diameter
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 5
- 238000012993 chemical processing Methods 0.000 abstract description 2
- 238000003801 milling Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000007547 defect Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
本発明は、プリント配線基板に金属板からなるヒートシ
ンクを貼着したヒートシンク付きのプリント配線板に関
するものである。The present invention relates to a printed wiring board with a heat sink, in which a heat sink made of a metal plate is attached to a printed wiring board.
プリント配線板においては、発熱する部品からの熱を放
散するために金属板からなるヒートシンクを貼着して一
体としたものが公知である。ここにプリント配線基板に
スルーホールを有する場合には、このスルーホールとの
接触を避けるためにヒートシンクに小孔（クリヤランス
ホールという）を形成する必要がある。
図３はこの従来のヒートシンク付きプリント配線板の側
断面図である。ここに符号１０はプリント配線基板、１
２はこの基板１０に設けたスルーホールであり、このス
ルーホール１２の両端は基板１０の両面に載った円形の
ランド１４となっている。１６はステンレス板やアルミ
板などからなるヒートシンクであり、このヒートシンク
１６は接着剤１８によって基板１０に貼着される。ここ
にヒートシンク１６にはスルーホール１２のランド１４
との接触を防ぐためにクリヤランスホール２０が形成さ
れている。すなわちこのクリヤランスホール２０の内径
ａは、ランド１４の外径すよりも大きく設定され、両者
の中心が一致する場合には、両者の間隙Ｃは、ｃ＝（ａ
−ｂ）／２、となる。
ここで間隙Ｃを大きくすると、第４．５図に示すように
隣接するクリヤランスホール２ｏ同志が連続してしまう
という問題が生じた。例えば近年部品の実装密度を上げ
るためにスルーホール同志の間隙を小さくしているが、
２．５４ｍｍ規格の格子間隔で作られたプリント配線基
板１０において、ＤＩＰ型ＩＣあるいはＰＧＡ （ピン
・グリッド・アレイ）型ＩＣに対してスルーホール直径
を１．０ｍｍ、ランド直径を１．６ｍｍとした場合には
、クリヤランスホール２０の直径は約２．４ｍｍ必要に
なる。このためクリヤランスホール２０の直径が基板１
０の格子間隔２．５４ｍｍに接近し、スルーホール１２
とクリヤランスホール２０との僅かな芯の変化によりク
リヤランスホール同志が連続してしまうのである。
図４はＤＩＰ型ＩＣ用のものを、図５はＰＧＡ型ＩＣ用
のクリヤランスホール２ｏの連ながる様子を示す平面図
である。このようにクリヤランスホール２０が運なかっ
たりＣ図４）、ヒートシンクの一部が欠落した場合（図
５）には、ヒートシンク１６の有効放熱面積が減り、ヒ
ートシンクの機能が減るという不都合が生じる。
またこのような不都合を解決するために、クリヤランス
ホール２０の直径を小さ（することも考えられるが、こ
の場合には図６、図７に示すような不具合が生じ得る。
すなわち図６はスルーホール１２とクリヤランスホール
２０との芯のずれにより、ヒートシンク１６がランド１
４に接触したものを示す。図７はヒートシンク１６を基
板ｌＯに圧着した際に接着剤１８がクリヤランスホール
２０内に流出し、この流出した接着剤１８がランド１４
を覆ったものを示す。このランド１４を覆う接着剤工８
は後の半田付は工程において半田付は不良を起こす原因
となるものである。In printed wiring boards, it is known that a heat sink made of a metal plate is attached and integrated in order to dissipate heat from heat-generating components. If the printed wiring board has a through hole, it is necessary to form a small hole (referred to as a clearance hole) in the heat sink to avoid contact with the through hole. FIG. 3 is a side sectional view of this conventional printed wiring board with a heat sink. Here, numeral 10 is a printed wiring board, 1
2 is a through hole provided in this substrate 10, and both ends of this through hole 12 are circular lands 14 placed on both sides of the substrate 10. Reference numeral 16 denotes a heat sink made of a stainless steel plate, an aluminum plate, or the like, and this heat sink 16 is attached to the substrate 10 with an adhesive 18. Here, the land 14 of the through hole 12 is attached to the heat sink 16.
A clearance hole 20 is formed to prevent contact with. That is, the inner diameter a of the clearance hole 20 is set larger than the outer diameter a of the land 14, and when the centers of both coincide, the gap C between the two is c=(a
-b)/2. If the gap C is increased here, a problem arises in that adjacent clearance holes 2o become continuous, as shown in FIG. 4.5. For example, in recent years, the gaps between through holes have been reduced to increase the mounting density of components.
In the printed wiring board 10 made with a standard grid spacing of 2.54 mm, the through-hole diameter was 1.0 mm and the land diameter was 1.6 mm for a DIP type IC or PGA (pin grid array) type IC. In this case, the clearance hole 20 needs to have a diameter of about 2.4 mm. Therefore, the diameter of the clearance hole 20 is
0 grid spacing of 2.54 mm, through hole 12
Due to a slight change in the core of the clearance hole 20 and the clearance hole 20, the clearance holes become continuous. FIG. 4 is a plan view showing one for a DIP type IC, and FIG. 5 is a plan view showing how the clearance holes 2o for a PGA type IC are connected. In this way, if the clearance hole 20 does not work properly (Fig. 4) or if a part of the heat sink is missing (Fig. 5), the effective heat dissipation area of the heat sink 16 decreases, causing a problem that the function of the heat sink decreases. In order to solve this problem, it is also possible to reduce the diameter of the clearance hole 20, but in this case, problems as shown in FIGS. 6 and 7 may occur. In other words, FIG. Due to the misalignment between the hole 12 and the clearance hole 20, the heat sink 16
4 shows what came into contact with it. FIG. 7 shows that when the heat sink 16 is pressure-bonded to the substrate lO, the adhesive 18 flows out into the clearance hole 20, and the adhesive 18 that flows out flows into the land 14.
Shows what is covered. Adhesive work 8 covering this land 14
Soldering is a cause of defects during the subsequent soldering process.
本発明によればこの課題は、スルーホール付きのプリン
ト配線基板に、前記スルーホールに対応するクリヤラン
スホールを形成した金属板からなるヒートシンクを貼着
したヒートシンク付きプリント配線板において、
前記クリヤランスホールの前記プリント配線基板側の周
縁角部を環状に除去してここに環状凹部を形成したこと
を特徴とするスルーホール付きプリント配線板、により
達成される。According to the present invention, this problem is solved in a printed wiring board with a heat sink, in which a heat sink made of a metal plate in which a clearance hole corresponding to the through hole is formed is attached to a printed wiring board with a through hole. This is achieved by a printed wiring board with through holes, characterized in that a peripheral edge corner portion on the printed wiring board side is removed in an annular shape to form an annular recessed portion therein.
図１と図２は、それぞれ本発明の実施例を示す側断面図
である。図１の実施例はヒートシンク１６Ａに設けるク
リヤランスホール２０Ａの基板１０側の内周縁を断面四
角形に除去してここに環状凹部２２を形成したものであ
る。この環状凹部２２は例えばドリルなどの機械切削加
工、ケミカルミリング法などの化学的加工により加工可
能である。
図２の実施例は、ヒートシンク１６Ｂに設けるクリヤラ
ンスホール２０Ｂの基板１０側の内周縁を断面円弧状に
除去してここに環状凹部２４を形成したものである。
これらの実施例によれば、ランド１４に接近するクリヤ
ランスホール２ＯＡ、２０Ｂの下周縁、すなわち環状凹
部２２．２４の直径りをランド■４の直径Ｂよりも十分
に大きく確保しつつ、クリヤランスホール２ＯＡ、２０
Ｂの直径Ａを小さ（することができる。このため環状凹
部２２．２４の内周縁とランド１４との間隙Ｃ，＝ （
Ｄ−、Ｂ）／２を大きくして両者間のショートを防ぐこ
とができる。またヒートシンク１６Ａ、１６Ｂの接着時
にクリヤランスホール２０ａ、２０．Ｂ側へ流出する接
着材１８Ａ、１８Ｂは環状凹部２２．２４内に溜る。こ
のためランド１４が接着剤１８Ａ、１８Ｂで覆われるこ
ともない。
以上の実施例では、ヒートシンク１６Ａ、１６Ｂは基板
１０の一方の面にのみ貼着しているが、本発明は両面に
これを貼着したものであってもよい。またクリヤランス
ホール２ＯＡ、２０Ｂに形成する環状凹部２２．２４の
断面形状は、四角、円弧状に限られるものではなく、面
取り処理によって断面三角形に切り欠くものであっても
よく、ランド１４との間に間隙を形成するものであれば
よい。1 and 2 are side sectional views showing embodiments of the present invention, respectively. In the embodiment shown in FIG. 1, the inner peripheral edge of the clearance hole 20A provided in the heat sink 16A on the substrate 10 side is removed to have a rectangular cross section to form an annular recess 22 there. This annular recess 22 can be formed by, for example, mechanical cutting using a drill or chemical processing such as chemical milling. In the embodiment shown in FIG. 2, the inner circumferential edge of the clearance hole 20B provided in the heat sink 16B on the substrate 10 side is removed to have an arcuate cross section to form an annular recess 24 there. According to these embodiments, the lower periphery of the clearance holes 2OA and 20B approaching the land 14, that is, the diameter of the annular recess 22.24, is ensured to be sufficiently larger than the diameter B of the land 4, and the clearance Hall 2OA, 20
The diameter A of B can be made smaller. Therefore, the gap C, = (
D-, B)/2 can be increased to prevent short circuits between the two. Also, when bonding the heat sinks 16A, 16B, the clearance holes 20a, 20. The adhesive 18A, 18B flowing out to the B side collects in the annular recess 22.24. Therefore, the land 14 is not covered with adhesives 18A and 18B. In the above embodiment, the heat sinks 16A and 16B are attached only to one side of the substrate 10, but the present invention may be applied to both sides. Further, the cross-sectional shape of the annular recesses 22 and 24 formed in the clearance holes 2OA and 20B is not limited to square or arcuate shapes, but may be cut out to have a triangular cross-section by chamfering. Any material that forms a gap between them may be used.
本発明は以上のように、ヒートシンクのクリヤランスホ
ールのプリント配線基板側の周縁角部を環状に除去して
ここに環状凹部を形成したものであるから、スルーホー
ルのランドとの間に十分な間隙を確保しつつスルーホー
ル直径を小さ（して、隣接するスルーホールが連続した
り、スルーホールで囲まれる領域でヒートシンクの一部
が欠落することを防ぐことができる。このため、ヒート
シンクの熱放散性能が低下することを防止できる。また
、ランドがヒートシンクにショートしに（くなり、また
接着剤がランドを覆って半田付は不良の原因を発生させ
るといった問題も生じなくなる。As described above, in the present invention, the peripheral corner of the clearance hole of the heat sink on the printed wiring board side is removed in an annular manner to form an annular recess here, so that there is sufficient space between the through hole and the land. It is possible to reduce the diameter of the through-hole while ensuring a gap (by doing so, it is possible to prevent adjacent through-holes from continuing or from missing a part of the heat sink in the area surrounded by the through-hole. It is possible to prevent the dissipation performance from deteriorating. Also, problems such as the land shorting to the heat sink and the adhesive covering the land, which causes soldering defects, do not occur.
【図１］ 本発明の一実施例の側断面図である。 【図２】 本発明の他の実施例の側断面図である。[Figure 1] FIG. 1 is a side sectional view of an embodiment of the present invention. [Figure 2] FIG. 3 is a side sectional view of another embodiment of the invention.
【図３】 従来の配線板の側断面図である。[Figure 3] FIG. 2 is a side sectional view of a conventional wiring board.
【図４】 従来の配線板の不具合を示す平面図。[Figure 4] FIG. 3 is a plan view showing defects in a conventional wiring board.
【図５】 従来の配線板の不具合を示す平面図。[Figure 5] FIG. 3 is a plan view showing defects in a conventional wiring board.
【図６】 従来の配線板の不具合を示す側断面図。[Figure 6] A side sectional view showing a defect in a conventional wiring board.
【図７１
従来の配線板の不具合を示す側断面図。
【符号の説明】
１０ プリント配線基板
１２ スルーホール
１４ ランド
１６ ヒートシンク
２ＯＡ ２０Ｂ クリヤランスホール２２２４ 環
状凹部
特許出願人 日本アビオニクス株式会社代 理 人
弁理士 山 １） 文 雌伏 理 人
弁理士 山 １） 洋 資図面の浄書（内容に
変更なし）FIG. 71 is a side sectional view showing defects in a conventional wiring board. [Explanation of symbols] 10 Printed wiring board 12 Through hole 14 Land 16 Heat sink 2OA 20B Clearance hole 2224 Annular recess Patent applicant Nippon Avionics Co., Ltd. Agent Patent attorney Yama 1) Written by Rihito Mebushi
Patent Attorney Yama 1) Hiroshi Engraving of capital drawings (no changes in content)
【図 １１ 【図２】 手続ネ南正書（方式） 平成３年１月１６[Figure 11 [Figure 2] Procedure Nenanshosho (Method) January 16, 1991
Claims (1)
ルーホールに対応するクリヤランスホールを形成した金
属板からなるヒートシンクを貼着したヒートシンク付き
プリント配線板において、前記クリヤランスホールの前
記プリント配線基板側の周縁角部を環状に除去してここ
に環状凹部を形成したことを特徴とするスルーホール付
きプリント配線板。(1) In a printed wiring board with a heat sink, in which a heat sink made of a metal plate in which a clearance hole corresponding to the through hole is formed is attached to a printed wiring board with a through hole, the printed wiring board side of the clearance hole is attached. 1. A printed wiring board with a through hole, characterized in that a peripheral corner of the board is annularly removed to form an annular recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33016690A JPH04206675A (en) | 1990-11-30 | 1990-11-30 | Printed circuit board with heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33016690A JPH04206675A (en) | 1990-11-30 | 1990-11-30 | Printed circuit board with heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04206675A true JPH04206675A (en) | 1992-07-28 |
| JPH0512877B2 JPH0512877B2 (en) | 1993-02-19 |
Family
ID=18229558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33016690A Granted JPH04206675A (en) | 1990-11-30 | 1990-11-30 | Printed circuit board with heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04206675A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06291426A (en) * | 1993-03-31 | 1994-10-18 | Rohm Co Ltd | Printed board assembly and electronic equipment having printed board assembly |
| EP0792092A3 (en) * | 1996-02-24 | 1998-07-29 | Robert Bosch Gmbh | Process for manufacturing a composite arrangement |
| CN108770238A (en) * | 2018-07-13 | 2018-11-06 | 深圳崇达多层线路板有限公司 | A kind of inner figure design method for improving drilling and pulling copper |
-
1990
- 1990-11-30 JP JP33016690A patent/JPH04206675A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06291426A (en) * | 1993-03-31 | 1994-10-18 | Rohm Co Ltd | Printed board assembly and electronic equipment having printed board assembly |
| EP0792092A3 (en) * | 1996-02-24 | 1998-07-29 | Robert Bosch Gmbh | Process for manufacturing a composite arrangement |
| US5925210A (en) * | 1996-02-24 | 1999-07-20 | Robert Bosch Gmbh | Method for manufacturing a composite arrangement |
| CN108770238A (en) * | 2018-07-13 | 2018-11-06 | 深圳崇达多层线路板有限公司 | A kind of inner figure design method for improving drilling and pulling copper |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0512877B2 (en) | 1993-02-19 |
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