JP2002344095A - Composite circuit board - Google Patents
Composite circuit boardInfo
- Publication number
- JP2002344095A JP2002344095A JP2001146236A JP2001146236A JP2002344095A JP 2002344095 A JP2002344095 A JP 2002344095A JP 2001146236 A JP2001146236 A JP 2001146236A JP 2001146236 A JP2001146236 A JP 2001146236A JP 2002344095 A JP2002344095 A JP 2002344095A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit board
- composite circuit
- board according
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子機器の内部に実
装されて所定間隔を有し配置された回路間を接続する複
合回路基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite circuit board mounted inside an electronic device for connecting circuits arranged at a predetermined interval.
【０００２】[0002]
【従来の技術】図６は電子機器の内部に配置された回路
間をフレキシブル基板で接続した従来の電子機器の構造
図である。2. Description of the Related Art FIG. 6 is a structural view of a conventional electronic device in which circuits arranged inside the electronic device are connected by a flexible substrate.
【０００３】図６において、５１は電子機器であり、こ
の電子機器５１は本体ケース５２内に実装した回路基板
５３と蓋ケース５４に実装した回路部５５との間を樹脂
フィルムに導体を印刷したフレキシブル基板５６を用い
て接続し、前記蓋ケース５４と前記本体ケース５２の接
合部とした軸５７を支点として開閉する。In FIG. 6, reference numeral 51 denotes an electronic device. The electronic device 51 has a conductor printed on a resin film between a circuit board 53 mounted in a main body case 52 and a circuit portion 55 mounted on a lid case 54. The connection is made using a flexible substrate 56, and the connection is opened and closed using a shaft 57 serving as a joint between the lid case 54 and the main body case 52 as a fulcrum.
【０００４】前記回路基板５３の上面には発熱回路部品
５８を実装し、この発熱回路部品５８の上面に放熱板５
９の一端を接触させるとともに前記放熱板５９の他端を
前記本体ケース５２にネジ６０で接続し、前記発熱回路
部品５８から発生する熱を前記電子機器５１の外部に放
熱する構成としている。A heat generating circuit component 58 is mounted on the upper surface of the circuit board 53, and a heat radiating plate 5 is mounted on the upper surface of the heat generating circuit component 58.
9 is connected to the main body case 52 by screws 60, and the heat generated from the heat generating circuit component 58 is radiated to the outside of the electronic device 51.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前記従
来例によれば放熱板５９を介して前記発熱回路部品５８
から前記本体ケース５２に熱伝達するには、熱抵抗が大
きいため前記発熱回路部品５８から発生した熱の放熱効
果が十分でなく、前記回路基板５３に実装されたトラン
ジスタやダイオード等の電子部品の寿命を劣化させ易い
という問題点があった。However, according to the conventional example, the heat generating circuit component 58 is provided via the heat radiating plate 59.
In order to transfer heat to the main body case 52, the heat generated by the heat generating circuit components 58 is not sufficiently dissipated due to a large thermal resistance, and the electronic components such as transistors and diodes mounted on the circuit board 53 are not sufficiently radiated. There is a problem that the life is easily deteriorated.
【０００６】本発明は電子機器の内部に所定間隔を有し
配置された複数の回路間を接続して電気回路を接続する
とともにこの電気回路で発生した発熱を効率よく放熱で
きる複合回路基板を提供することを目的とするものであ
る。The present invention provides a composite circuit board which connects a plurality of circuits arranged at predetermined intervals inside an electronic device to connect an electric circuit and efficiently radiate heat generated in the electric circuit. It is intended to do so.
【０００７】[0007]
【課題を解決するための手段】前記問題を解決するため
に本発明は以下の構成を有するものである。SUMMARY OF THE INVENTION In order to solve the above problems, the present invention has the following arrangement.
【０００８】本発明の請求項１に記載の発明は、弾性を
有する樹脂層に導電層を積層したフレキシブル基板の前
記樹脂層の表面に高分子フィルムをグラファイト化し熱
伝導性を発現したグラファイト層を積層した複合回路基
板であり、これにより、所定間隔を有して離れた複数の
回路間を接続して電気回路を接続するとともにこの電気
回路で発生した発熱を効率よく放熱できる複合回路基板
を得ることができるという作用効果を有する。According to a first aspect of the present invention, there is provided a flexible substrate in which a conductive layer is laminated on a resin layer having elasticity. A composite circuit board which is a laminated composite circuit board, thereby connecting a plurality of circuits separated by a predetermined distance to connect an electric circuit and efficiently radiating heat generated in the electric circuit. It has the effect of being able to do so.
【０００９】本発明の請求項２に記載の発明は、樹脂層
を介して導電層を形成した面と対向する表面にグラファ
イト層を積層した請求項１に記載の複合回路基板であ
り、これにより、樹脂層の表面積を効率よく活用でき電
気回路の形成と熱対策とを小スペースで実現できるとい
う作用を有する。According to a second aspect of the present invention, there is provided the composite circuit board according to the first aspect, wherein a graphite layer is laminated on the surface opposite to the surface on which the conductive layer is formed via the resin layer. In addition, there is an effect that the surface area of the resin layer can be efficiently utilized and the formation of the electric circuit and the measures against heat can be realized in a small space.
【００１０】本発明の請求項３に記載の発明は、樹脂層
の内部に導電層を積層して導電層の表面と裏面の両面に
樹脂層を形成し、この表面と裏面の樹脂層の少なくとも
何れか一方の表面にグラファイト層を形成した請求項１
に記載の複合回路基板であり、これにより、電気回路を
接続する導電層を外部雰囲気から遮蔽して損傷を低減で
き、更に樹脂層の表面と裏面のいずれにもグラファイト
層を形成することができ一層付加価値の高い複合回路基
板を得ることができるという作用効果を有する。According to a third aspect of the present invention, a resin layer is formed on both the front and back surfaces of a conductive layer by laminating a conductive layer inside the resin layer. 2. A graphite layer is formed on one of the surfaces.
Wherein the conductive layer connecting the electric circuit is shielded from an external atmosphere to reduce damage, and further, a graphite layer can be formed on both the front and back surfaces of the resin layer. There is an operational effect that a composite circuit board with higher added value can be obtained.
【００１１】本発明の請求項４に記載の発明は、樹脂層
の表面の端面にグラファイト層を積層し、このグラファ
イト層と間隙をあけて導電層を並設した請求項１に記載
の複合回路基板であり、これにより、発熱部品から導電
層への熱伝達を抑制しグラファイト層に熱伝達でき回路
部品の熱劣化を抑えることができるという作用効果を有
する。According to a fourth aspect of the present invention, there is provided the composite circuit according to the first aspect, wherein a graphite layer is laminated on the end face of the surface of the resin layer, and a conductive layer is juxtaposed with a gap between the graphite layer. This is a substrate, which has the effect of suppressing heat transfer from the heat-generating component to the conductive layer, transferring heat to the graphite layer, and suppressing thermal degradation of circuit components.
【００１２】本発明の請求項５に記載の発明は、樹脂層
とグラファイト層との間に粘着層を形成し、この粘着層
を介して前記樹脂層とグラファイト層とを粘着した請求
項１に記載の複合回路基板であり、これにより、弾力性
が優れグラファイト層や導電層の亀裂、折れなどの損傷
を防止できるという作用効果を有する。According to a fifth aspect of the present invention, the adhesive layer is formed between the resin layer and the graphite layer, and the resin layer and the graphite layer are adhered via the adhesive layer. The composite circuit board as described above, which has an effect of being excellent in elasticity and capable of preventing damages such as cracks and breaks in the graphite layer and the conductive layer.
【００１３】本発明の請求項６に記載の発明は、樹脂層
の端からグラファイト層を分離してグラファイト層の延
長部を形成した請求項１に記載の複合回路基板であり、
これにより、グラファイト層の延長部を放熱部へ接続
し、導電層を電気回路に接続できて使い易い複合回路基
板を得ることができるという作用効果を有する。The invention according to claim 6 of the present invention is the composite circuit board according to claim 1, wherein the graphite layer is separated from an end of the resin layer to form an extension of the graphite layer.
This has the effect of connecting the extended portion of the graphite layer to the heat radiating portion and connecting the conductive layer to the electric circuit to obtain an easy-to-use composite circuit board.
【００１４】本発明の請求項７に記載の発明は、グラフ
ァイト層の延長部の端部を放熱体に接合した請求項６に
記載の複合回路基板であり、これにより、グラファイト
層の延長部の先端が放熱体に接続されているのでグラフ
ァイト層のしわや亀裂などの損傷を防止し電子機器に容
易に接続できるという作用効果を有する。According to a seventh aspect of the present invention, there is provided the composite circuit board according to the sixth aspect, wherein an end of the extended portion of the graphite layer is joined to a radiator. Since the tip is connected to the radiator, the graphite layer has an effect of preventing damage such as wrinkles and cracks in the graphite layer and being easily connected to an electronic device.
【００１５】本発明の請求項８に記載の発明は、グラフ
ァイト層の延長部の端部両面を放熱体で挟着した請求項
７に記載の複合回路基板であり、これにより、グラファ
イト層の端部からの亀裂を防止できるとともにグラファ
イト層と放熱体との熱抵抗が小さく一層放熱効果の優れ
た複合回路基板が得られるという作用効果を有する。According to an eighth aspect of the present invention, there is provided the composite circuit board according to the seventh aspect, wherein both ends of the extended portion of the graphite layer are sandwiched by heat sinks. This has the effect of preventing a crack from being formed in the portion, and providing a composite circuit board having a small heat resistance between the graphite layer and the heat radiator and having a more excellent heat radiation effect.
【００１６】本発明の請求項９に記載の発明は、グラフ
ァイト層の表面に発熱部品の筐体を接合し、この発熱部
品の回路を導電層に接続した請求項１に記載の複合回路
基板であり、これにより、発熱部品の発熱を効率よくグ
ラファイト層に伝熱して放熱できるという作用効果を有
する。According to a ninth aspect of the present invention, there is provided the composite circuit board according to the first aspect, wherein a casing of the heat generating component is joined to a surface of the graphite layer, and a circuit of the heat generating component is connected to the conductive layer. This has the effect that the heat generated by the heat-generating component can be efficiently transferred to the graphite layer and dissipated.
【００１７】本発明の請求項１０に記載の発明は、発熱
部品をグラファイト層の表面に搭載して接合した請求項
９に記載の複合回路基板であり、これにより、発熱部品
から回路部への熱伝達を抑制し電子機器に実装された回
路部品の熱劣化を防止できるという作用効果を有する。According to a tenth aspect of the present invention, there is provided the composite circuit board according to the ninth aspect, wherein the heat-generating component is mounted on the surface of the graphite layer and joined to the composite circuit board. This has the effect of suppressing heat transfer and preventing thermal deterioration of circuit components mounted on the electronic device.
【００１８】本発明の請求項１１に記載の発明は、樹脂
層に孔を形成し、この孔に発熱部品の筐体を嵌合した請
求項９に記載の複合回路基板であり、これにより、発熱
部品の上面又は下面にグラファイト層を設置できるので
放熱と発熱部品の実装とが容易にできるという作用効果
を有する。An eleventh aspect of the present invention is the composite circuit board according to the ninth aspect, wherein a hole is formed in the resin layer, and a housing of the heat-generating component is fitted into the hole. Since the graphite layer can be provided on the upper surface or the lower surface of the heat generating component, there is an operational effect that heat radiation and mounting of the heat generating component can be easily performed.
【００１９】本発明の請求項１２に記載の発明は、放熱
体をアルミニウム合金で形成した請求項８に記載の複合
回路基板であり、これにより、グラファイト層と放熱体
との接合面の腐食を防止でき信頼性の高い放熱構造が得
られるという作用効果を有する。According to a twelfth aspect of the present invention, there is provided the composite circuit board according to the eighth aspect, wherein the heat radiator is formed of an aluminum alloy, whereby corrosion of a joint surface between the graphite layer and the heat radiator is prevented. This has the effect that a highly reliable heat dissipation structure can be obtained.
【００２０】本発明の請求項１３に記載の発明は、樹脂
層を耐熱ポリイミド樹脂で形成した請求項１に記載の複
合回路基板であり、これにより、樹脂層の耐熱性が優れ
この樹脂層上面に電子部品の半田付けが行えるという作
用効果を有する。According to a thirteenth aspect of the present invention, there is provided the composite circuit board according to the first aspect, wherein the resin layer is formed of a heat-resistant polyimide resin, whereby the resin layer has excellent heat resistance. This has the effect that the electronic component can be soldered.
【００２１】[0021]
【発明の実施の形態】（実施の形態１）以下、本発明の
特に請求項１，２，５，６，７，８，１２，１３に記載
の発明について本実施の形態１を用いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) Hereinafter, the present invention, particularly, the invention described in claims 1, 2, 5, 6, 7, 8, 12, and 13 will be described with reference to Embodiment 1. I do.
【００２２】図１は本発明の実施の形態１における複合
回路基板の外観斜視図、図２は同複合回路基板の側面図
である。FIG. 1 is an external perspective view of a composite circuit board according to Embodiment 1 of the present invention, and FIG. 2 is a side view of the composite circuit board.
【００２３】図１、図２において、１は複合回路基板で
あり、この複合回路基板１はポリイミド樹脂を主成分と
する樹脂層４の裏面に導電層３を印刷して形成したフレ
キシブル基板２の表面に粘着剤を塗布して粘着層（図示
せず）を形成し、この粘着層の上面に高分子フィルムを
グラファイト化し熱伝導性を発現したおよそ数十ミクロ
ンのグラファイト層５を貼り付けた構成とし、このグラ
ファイト層５の両端の延長部８，９は前記樹脂層４から
分離し端部の両面を放熱体６，７で挟着して接合し、前
記放熱体６，７に孔１０を形成し、この孔を用いて電子
機器の筐体とネジ止めが行える構成としている。1 and 2, reference numeral 1 denotes a composite circuit board. The composite circuit board 1 is a flexible circuit board 2 formed by printing a conductive layer 3 on the back surface of a resin layer 4 containing a polyimide resin as a main component. A structure in which an adhesive is applied to the surface to form an adhesive layer (not shown), and a graphite film 5 of about several tens of microns, which is obtained by graphitizing a polymer film and exhibiting thermal conductivity, is attached to the upper surface of the adhesive layer. The extended portions 8 and 9 at both ends of the graphite layer 5 are separated from the resin layer 4 and both ends are sandwiched and joined by heat radiators 6 and 7, and holes 10 are formed in the heat radiators 6 and 7. The electronic device is formed so that it can be screwed to the housing of the electronic device using the hole.
【００２４】前記粘着剤はアクリル系重合体を主成分と
し、固体状に硬化することなく前記フレキシブル基板３
に前記グラファイト層５を粘着して弾性を維持し、また
前記放熱体６，７はアルミニウム合金で形成し、前記グ
ラファイト層５の延長部８，９との接合面に腐食を生じ
ないように配慮されている。The pressure-sensitive adhesive is mainly composed of an acrylic polymer, and is not hardened to a solid state.
The graphite layer 5 is adhered to the graphite layer 5 to maintain elasticity, and the radiators 6 and 7 are formed of an aluminum alloy so that the surface of the graphite layer 5 joined to the extensions 8 and 9 is not corroded. Have been.
【００２５】以上の構成により、本発明の複合回路基板
１は電子機器の内部に実装されて所定間隔を有し配置さ
れた複数の回路間を接続し、電気回路を接続するととも
にこの電気回路で発生した発熱を効率よく放熱できる。With the above arrangement, the composite circuit board 1 of the present invention is mounted inside an electronic device, connects a plurality of circuits arranged at predetermined intervals, connects an electric circuit, and connects the electric circuit. The generated heat can be efficiently dissipated.
【００２６】（実施の形態２）以下、本発明の特に請求
項３に記載の発明について本実施の形態２を用いて説明
する。尚、本実施の形態２の基本的な構成は実施の形態
１と同じなので同一符号をつけて詳細な説明を省き、こ
こでは実施の形態２の特徴とする部分を以下に説明す
る。(Embodiment 2) Hereinafter, a second embodiment of the present invention will be described in particular with reference to Embodiment 2. Since the basic configuration of the second embodiment is the same as that of the first embodiment, the same reference numerals are used to omit a detailed description, and the features of the second embodiment will be described below.
【００２７】図３は本発明の実施の形態２における複合
回路基板の一部を示す外観斜視図である。FIG. 3 is an external perspective view showing a part of the composite circuit board according to Embodiment 2 of the present invention.
【００２８】図３において１２，１３，１４は導電層で
あり、樹脂層１１の内部に延長してインサート成形し、
前記樹脂層１１の表面にはグラファイト層５を貼り付け
た構成としている。このとき前記グラファイト層５は前
記樹脂層１１の裏面に貼り付けたり、また、この樹脂層
１１の周囲を包み込むように貼り付けたりすることで一
層放熱効果が優れた複合回路基板が得られる。In FIG. 3, reference numerals 12, 13, and 14 denote conductive layers, which are extended into the resin layer 11 and insert-molded.
The structure is such that the graphite layer 5 is attached to the surface of the resin layer 11. At this time, the graphite layer 5 is attached to the back surface of the resin layer 11 or attached so as to wrap around the resin layer 11, whereby a composite circuit board having a more excellent heat radiation effect can be obtained.
【００２９】以上の構成により、本発明の複合電気回路
基板は導電層１２，１３，１４が外部雰囲気から遮蔽さ
れるので損傷を低減でき、樹脂層１１の表面と裏面のい
ずれにもグラファイト層５を形成することができ一層付
加価値の高い複合回路基板を得ることができる。With the above structure, the composite electric circuit board of the present invention can reduce damage because the conductive layers 12, 13, and 14 are shielded from the external atmosphere, and the graphite layer 5 is formed on both the front and back surfaces of the resin layer 11. Can be formed, and a composite circuit board with higher added value can be obtained.
【００３０】（実施の形態３）以下、本発明の特に請求
項４に記載の発明について本実施の形態３を用いて説明
する。尚、本実施の形態３の基本的な構成は実施の形態
１と同じなので同一符号をつけて詳細な説明を省き、こ
こでは実施の形態３の特徴とする部分を以下に説明す
る。(Embodiment 3) Hereinafter, a third embodiment of the present invention will be described with reference to Embodiment 3. Since the basic configuration of the third embodiment is the same as that of the first embodiment, the same reference numerals are given and the detailed description is omitted. Here, the features of the third embodiment will be described below.
【００３１】図４は本発明の実施の形態３における複合
回路基板を示す外観斜視図である。図４において、１５
は樹脂層であり、この樹脂層１５の表面の端面にグラフ
ァイト層１９を積層し、前記グラファイト層１９と間隙
をあけて導電層１６〜１８を並設した構成としたもので
ある。FIG. 4 is an external perspective view showing a composite circuit board according to Embodiment 3 of the present invention. In FIG.
Is a resin layer, which has a structure in which a graphite layer 19 is laminated on the end face of the surface of the resin layer 15 and conductive layers 16 to 18 are juxtaposed with a gap from the graphite layer 19.
【００３２】以上の構成により、本発明の複合回路基板
は、発熱部品から導電層１６〜１８への熱伝達を抑制し
てグラファイト層１９に効率よく熱伝達でき回路部品の
熱劣化を抑えることができる。With the above structure, the composite circuit board of the present invention can suppress the heat transfer from the heat-generating component to the conductive layers 16 to 18 and efficiently transfer the heat to the graphite layer 19, thereby suppressing the thermal deterioration of the circuit component. it can.
【００３３】（実施の形態４）以下、本発明の特に請求
項９〜１１に記載の発明について本実施の形態４を用い
て説明する。尚、本実施の形態４の基本的な構成は実施
の形態１と同じなので同一符号をつけて詳細な説明を省
き、ここでは実施の形態４の特徴とする部分を以下に説
明する。(Embodiment 4) Hereinafter, the invention according to claims 9 to 11 will be described with reference to Embodiment 4. Since the basic configuration of the fourth embodiment is the same as that of the first embodiment, the same reference numerals are given and detailed description is omitted. Here, the features of the fourth embodiment will be described below.
【００３４】図５は本発明の実施の形態４における複合
回路基板を示す外観斜視図である。図５において、２は
フレキシブル基板であり、このフレキシブル基板２の裏
面にグラファイト層２０を貼り付け、樹脂層２２に孔２
９を形成し、この孔２９の下に前記グラファイト層２０
が露出した構成とし、発熱部品２１の筐体を前記樹脂層
２２の孔２９に嵌合して前記樹脂層２２の裏面に貼り付
けたグラファイト層２０の表面に粘着剤で接合し、この
発熱部品２１の端子２６〜２８と樹脂層２２の表面に形
成した導電層２３〜２５とを半田付けや導電性樹脂等で
接続している。FIG. 5 is an external perspective view showing a composite circuit board according to Embodiment 4 of the present invention. In FIG. 5, reference numeral 2 denotes a flexible substrate. A graphite layer 20 is attached to the back surface of the flexible substrate 2 and holes 2 are formed in the resin layer 22.
9 is formed, and the graphite layer 20 is formed under the holes 29.
Is exposed, and the housing of the heat-generating component 21 is fitted into the hole 29 of the resin layer 22 and bonded to the surface of the graphite layer 20 attached to the back surface of the resin layer 22 with an adhesive. The terminals 26 to 28 of 21 are connected to the conductive layers 23 to 25 formed on the surface of the resin layer 22 by soldering or conductive resin.
【００３５】以上の構成により、本発明の複合回路基板
は発熱部品から他の回路部品への熱伝達を抑制し熱劣化
を防止できる。With the above configuration, the composite circuit board of the present invention can suppress heat transfer from the heat-generating component to other circuit components and prevent thermal deterioration.
【００３６】[0036]
【発明の効果】以上のように本発明の複合回路基板は、
弾性を有する樹脂層に導電層を積層したフレキシブル基
板の前記樹脂層の表面に高分子フィルムをグラファイト
化し熱伝導性を発現したグラファイト層を積層した複合
回路基板であり、これにより、所定間隔を有して離れた
複数の回路間を接続し電気回路を接続するとともにこの
電気回路で発生した発熱を効率よく放熱できる。As described above, the composite circuit board of the present invention is
A composite circuit board in which a polymer film is graphitized on a surface of the resin layer of a flexible substrate in which a conductive layer is laminated on a resin layer having elasticity and a graphite layer exhibiting thermal conductivity is laminated. In addition, a plurality of separated circuits can be connected to connect an electric circuit, and heat generated in the electric circuit can be efficiently radiated.
【図１】本発明の実施の形態１における複合回路基板の
外観斜視図FIG. 1 is an external perspective view of a composite circuit board according to Embodiment 1 of the present invention.
【図２】同本発明の実施の形態１における複合回路基板
の側面図FIG. 2 is a side view of the composite circuit board according to the first embodiment of the present invention.
【図３】本発明の実施の形態２における回路基板の一部
を示す外観斜視図FIG. 3 is an external perspective view showing a part of a circuit board according to Embodiment 2 of the present invention.
【図４】本発明の実施の形態３における複合回路基板の
外観斜視図FIG. 4 is an external perspective view of a composite circuit board according to Embodiment 3 of the present invention.
【図５】本発明の実施の形態４における複合回路基板の
外観斜視図FIG. 5 is an external perspective view of a composite circuit board according to Embodiment 4 of the present invention.
【図６】電子機器の内部に配置された回路間をフレキシ
ブル基板で接続した従来の電子機器の構造図FIG. 6 is a structural diagram of a conventional electronic device in which circuits arranged inside the electronic device are connected by a flexible substrate.
１ 複合回路基板 ２ フレキシブル基板 ３、１２〜１４、１６〜１８、２３〜２５ 導電層 ４，１１，１５，２２ 樹脂層 ５，１９，２０ グラファイト層 ６，７ 放熱体 ８，９ 延長部 １０ 孔 ２９ 孔 DESCRIPTION OF SYMBOLS 1 Composite circuit board 2 Flexible board 3, 12-14, 16-18, 23-25 Conductive layer 4,11,15,22 Resin layer 5,19,20 Graphite layer 6,7 Radiator 8,9 Extension part 10 hole 29 holes
───────────────────────────────────────────────────── フロントページの続き (72)発明者 久保 和彦 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 渡辺 正之 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5E322 AA03 AA11 FA04 5E338 AA01 AA03 AA12 AA16 BB71 BB75 CC01 CD40 EE02 5E346 AA11 AA12 AA15 BB01 CC02 CC08 CC16 CC31 EE42 HH17 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuhiko Kubo 1006 Kazuma Kadoma, Osaka Pref.Matsushita Electric Industrial Co., Ltd. Terms (reference) 5E322 AA03 AA11 FA04 5E338 AA01 AA03 AA12 AA16 BB71 BB75 CC01 CD40 EE02 5E346 AA11 AA12 AA15 BB01 CC02 CC08 CC16 CC31 EE42 HH17
Claims (13)
フレキシブル基板の前記樹脂層の表面に高分子フィルム
をグラファイト化し熱伝導性を発現したグラファイト層
を積層した複合回路基板。1. A composite circuit board comprising: a flexible substrate in which a conductive layer is laminated on a resin layer having elasticity; and a polymer layer formed by graphitizing a polymer film on the surface of the resin layer.
向する表面にグラファイト層を積層した請求項１に記載
の複合回路基板。2. The composite circuit board according to claim 1, wherein a graphite layer is laminated on a surface facing the surface on which the conductive layer is formed via the resin layer.
の表面と裏面の両面に樹脂層を形成し、この表面と裏面
の樹脂層の少なくともいずれか一方の表面にグラファイ
ト層を形成した請求項１に記載の複合回路基板。3. A conductive layer is laminated inside the resin layer to form a resin layer on both the front and back surfaces of the conductive layer, and a graphite layer is formed on at least one of the front and back resin layers. The composite circuit board according to claim 1.
積層し、このグラファイト層と間隙をあけて導電層を並
設した請求項１に記載の複合回路基板。4. The composite circuit board according to claim 1, wherein a graphite layer is laminated on an end surface of the surface of the resin layer, and a conductive layer is juxtaposed with a gap from the graphite layer.
を形成し、この粘着層を介して前記樹脂層とグラファイ
ト層とを粘着した請求項１に記載の複合回路基板。5. The composite circuit board according to claim 1, wherein an adhesive layer is formed between the resin layer and the graphite layer, and the resin layer and the graphite layer are adhered via the adhesive layer.
てグラファイト層の延長部を形成した請求項１に記載の
複合回路基板。6. The composite circuit board according to claim 1, wherein the graphite layer is separated from an end of the resin layer to form an extension of the graphite layer.
と接合した請求項６に記載の複合回路基板。7. The composite circuit board according to claim 6, wherein an end of the extended portion of the graphite layer is joined to a radiator.
熱体で挟着した請求項７に記載の複合回路基板。8. The composite circuit board according to claim 7, wherein both ends of the extended portion of the graphite layer are sandwiched between heat radiators.
を接合し、この発熱部品の回路を導電層に接続した請求
項１に記載の複合回路基板。9. The composite circuit board according to claim 1, wherein a housing of the heat generating component is joined to a surface of the graphite layer, and a circuit of the heat generating component is connected to the conductive layer.
載して接合した請求項９に記載の複合回路基板。10. The composite circuit board according to claim 9, wherein the heat generating component is mounted on and bonded to the surface of the graphite layer.
品の筐体を嵌合した請求項９に記載の複合回路基板。11. The composite circuit board according to claim 9, wherein a hole is formed in the resin layer, and a housing of the heat generating component is fitted into the hole.
請求項８に記載の複合回路基板。12. The composite circuit board according to claim 8, wherein the radiator is formed of an aluminum alloy.
た請求項１に記載の複合回路基板。13. The composite circuit board according to claim 1, wherein the resin layer is formed of a heat-resistant polyimide resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001146236A JP2002344095A (en) | 2001-05-16 | 2001-05-16 | Composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001146236A JP2002344095A (en) | 2001-05-16 | 2001-05-16 | Composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002344095A true JP2002344095A (en) | 2002-11-29 |
Family
ID=18991924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001146236A Pending JP2002344095A (en) | 2001-05-16 | 2001-05-16 | Composite circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002344095A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7708450B2 (en) * | 2004-11-08 | 2010-05-04 | Nec Lcd Technologies, Ltd. | Liquid crystal display device |
| JP2011100959A (en) * | 2009-10-05 | 2011-05-19 | Sumitomo Electric Ind Ltd | Flexible board, flexible board module, and method for manufacturing both |
| US9232197B2 (en) | 2010-09-29 | 2016-01-05 | Fujifilm Corporation | Endoscope apparatus and method for releasing heat generated by imaging element of the endoscope apparatus |
| CN111587210A (en) * | 2017-12-29 | 2020-08-25 | 空中客车防务和空间公司 | High conductivity heat connector |
-
2001
- 2001-05-16 JP JP2001146236A patent/JP2002344095A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7708450B2 (en) * | 2004-11-08 | 2010-05-04 | Nec Lcd Technologies, Ltd. | Liquid crystal display device |
| JP2011100959A (en) * | 2009-10-05 | 2011-05-19 | Sumitomo Electric Ind Ltd | Flexible board, flexible board module, and method for manufacturing both |
| US9232197B2 (en) | 2010-09-29 | 2016-01-05 | Fujifilm Corporation | Endoscope apparatus and method for releasing heat generated by imaging element of the endoscope apparatus |
| CN105353505A (en) * | 2010-09-29 | 2016-02-24 | 富士胶片株式会社 | Endoscope apparatus and method for releasing heat generated by imaging element of the endoscope apparatus |
| CN111587210A (en) * | 2017-12-29 | 2020-08-25 | 空中客车防务和空间公司 | High conductivity heat connector |
| JP2021515978A (en) * | 2017-12-29 | 2021-06-24 | エアバス ディフェンス アンド スペース，エス．エー． | High conductance thermal link |
| JP7133020B2 (en) | 2017-12-29 | 2022-09-07 | エアバス ディフェンス アンド スペース，エス．エー． | High conductance thermal link |
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