CN220545389U - Radiating fin, thin film chip and display screen - Google Patents

Abstract

The application provides a radiating fin, a thin film chip and a display screen; the heat sink is applied to the thin film chip and comprises a heat conducting layer, an adhesive layer and a flexible insulating layer. The heat conducting layer is provided with a first surface and a second surface which are opposite; the adhesive layer is adhered to the first surface and used for fixing the radiating fin on the film chip; the flexible insulating layer is directly attached to the second surface. Through this application can effectively improve film chip's radiating effect.

Description

Radiating fin, thin film chip and display screen

Technical Field

The application relates to the technical field of chip heat dissipation, in particular to a heat radiating fin, a thin film chip and a display screen.

Background

In the related art, an external circuit board of an intelligent terminal product such as a display screen and the like is connected with a circuit of a display panel thereof through a thin film chip. Along with the continuous improvement of technical indexes such as resolution, refresh rate and the like of the display screen, the heating value of the film chip is also increased continuously.

At present, heat dissipation of the thin film chip is generally realized by attaching a heat sink to a thin film substrate of the thin film chip to conduct out heat generated by the thin film chip. However, the heat dissipation effect of the thin film chip is still not ideal enough, and needs to be further improved.

Disclosure of Invention

The application provides a fin, film chip and display screen, can effectively improve film chip's radiating effect.

In a first aspect, the present application provides a heat sink, applied to a thin film chip, including:

a thermally conductive layer having opposing first and second surfaces;

an adhesive layer adhered to the first surface for fixing the heat sink to the thin film chip; and

And a flexible insulating layer directly connected to the second surface.

In this embodiment of the present application, since the flexible insulating layer is directly formed on the second surface of the heat conducting layer, compared with the case where the heat conducting layer and the flexible insulating layer are bonded by using an adhesive in the related art, the adhesive between the heat conducting layer and the flexible insulating layer in the related art is omitted, so that the thickness of the formed heat sink is thinner and the heat sink is more prone to bending. The heat radiating fin is not easy to peel from the surface of the film chip under the action of bending stress and high temperature, so that the heat radiating fin can be well contacted with the surface of the film chip; in addition, the adhesive between the heat conducting layer and the flexible insulating layer is omitted, so that the heat conducting interface at two sides of the adhesive is eliminated, and the heat resistance generated by using the adhesive between the heat conducting layer and the flexible insulating layer in the related technology is avoided. Therefore, the heat dissipation effect of the film chip can be effectively improved through the scheme.

With reference to the first aspect, in some possible implementations, the flexible insulating layer is directly formed on the second surface of the heat conducting layer by coating, pressing or sputtering.

With reference to the first aspect and the foregoing implementation manner, in consideration of preventing the adhesive layer from overflowing the edge of the heat conducting layer, in some possible implementation manners, an outer contour of the adhesive layer is not greater than an outer contour of the heat conducting layer.

With reference to the first aspect and the foregoing implementation manner, in some possible implementation manners, the heat conducting layer adopts copper foil or aluminum foil; and/or

The flexible insulating layer is a polyimide layer or a polyester film layer.

In a second aspect, the present application further provides a thin film chip applied to a display screen, including:

the film substrate is used for connecting an external circuit board of the display screen with the display panel;

the driving chip is arranged on the upper surface of the film substrate;

the heat sink according to any one of the first aspect, wherein the heat sink is at least partially applied to a surface of the thin film substrate, so as to conduct out heat generated by the driving chip.

With reference to the second aspect, in some possible implementations, the heat sink is applied to a lower surface of the film substrate, and/or

The cooling fin is attached to the upper surface of the film substrate and covers the driving chip, and ventilation holes are formed in the cooling fin. By arranging the air holes, the heat conduction efficiency of the radiating fin can be prevented from being influenced by air bubbles generated between the radiating fin and the film substrate.

With reference to the second aspect and the foregoing implementation manner, in some possible implementation manners, a recess is formed at a junction between a side surface of the driving chip and an upper surface of the film substrate; in order to improve the heat dissipation efficiency of the heat dissipation plate and the connection firmness degree of the heat dissipation plate and the film chip, the air holes are formed in the positions, corresponding to the concave parts, of the heat dissipation plate.

With reference to the second aspect and the foregoing implementation manner, in some possible implementation manners, the air holes are disposed at two ends of the heat sink corresponding to the driving chip, and all or part of the ends of the driving chip are exposed, so that the recess is partially exposed.

With reference to the second aspect and the foregoing implementation manner, in some possible implementation manners, the air holes are disposed corresponding to a top surface of the driving chip, and the air holes extend to two sides of the driving chip, so that the concave portion is partially exposed.

In a third aspect, the present application further provides a display screen, including:

a display panel;

the external circuit board is arranged on the back surface of the display panel;

a plurality of thin film chips as described in any one of the second aspect, wherein the thin film chips are respectively connected to the circuit of the display panel and the external circuit board.

Drawings

Fig. 1 is a schematic structural diagram of a display screen according to an embodiment of the present application;

FIG. 2 is a schematic diagram of the structure of the thin film chip in the display of FIG. 1;

FIG. 3 is a cross-sectional view of the thin film chip of FIG. 2 taken along line B-B;

FIG. 4 is a schematic structural view of another thin film chip provided in the present application;

FIG. 5 is a cross-sectional view of the thin film chip of FIG. 4 taken along line A-A;

fig. 6 is a schematic structural diagram of another thin film chip provided in the present application.

The reference numerals in the drawings are explained as follows:

1-a display screen;

10-a display panel;

11-an external circuit board;

12-a thin film chip; 121—a thin film substrate; 122—a driver chip;

13-heat sink; 131—a flexible insulating layer; 132—a thermally conductive layer; 133-an adhesive layer; 134-ventilation holes;

14-concave.

Detailed Description

The technical solutions in the present application will be clearly and thoroughly described below with reference to the accompanying drawings. Wherein, in the description of the embodiments of the present application, "/" means or is meant unless otherwise indicated, for example, a/B may represent a or B: the text "and/or" is merely an association relation describing the associated object, and indicates that three relations may exist, for example, a and/or B may indicate: the three cases where a exists alone, a and B exist together, and B exists alone, and in addition, in the description of the embodiments of the present application, "plural" means two or more than two.

The terms "first," "second," and the like, are used below for descriptive purposes only and are not to be construed as implying or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

The embodiment of the application provides a radiating fin, a thin film chip and a display screen. The specific structure of the heat sink, the thin film chip, and the display screen will be described below with reference to fig. 1 to 6.

Referring to fig. 1, the present application proposes a display 1, the display 1 includes a display panel 10, an external circuit board 11, and a plurality of thin film chips 12; the external circuit board 11 is arranged on the back surface of the display panel 10; the thin film chip 12 is connected to the circuit of the display panel 10 and the external circuit board 11, respectively.

Fig. 2, 4 and 6 are schematic structural views of the thin film chip 12 when it is unfolded. Referring to fig. 2 to 6, the thin film chip 12 specifically includes a thin film substrate 121, a driving chip 122, and a heat sink 13; the film substrate 121 is used for connecting the external circuit board 11 of the display screen 1 and the display panel 10; the driving chip 122 is disposed on the upper surface of the film substrate 121; the heat sink 13 is at least partially attached to the surface of the thin film substrate 121 to conduct out the heat generated by the driving chip 122.

Since the external circuit board 11 is disposed on the back surface of the display panel 10, when the display screen 1 is assembled, referring to fig. 1, the thin film chip 12 connecting the circuit of the display panel 10 and the external circuit board 11 can bend and maintain approximately 360 degrees, and the applicant finds that the heat sink 13 attached to the surface of the thin film chip 12 is easily peeled off from the surface of the thin film chip 12 under the action of bending stress and high temperature, resulting in poor contact, thereby affecting the heat dissipation effect of the thin film chip 12.

In view of this problem, referring to fig. 3 and 5, the heat sink 13 included in the display screen 1 and the display panel 10 provided in the present application includes not only the heat conductive layer 132 having the first surface and the second surface opposite to each other, and the adhesive layer 133 adhered to the first surface for fixing the heat sink 13 on the thin film chip 12, but also specifically includes the flexible insulating layer 131, where the flexible insulating layer 131 is directly connected to the second surface, so that an adhesive-free connection between the flexible insulating layer 131 and the second surface can be formed.

Specifically, the heat conducting layer 132 is configured to conduct heat generated by the thin film chip 12 to an external environment, and has a first surface and a second surface opposite to each other. The heat conductive layer 132 may be a copper foil or an aluminum foil with high heat conductivity. The first surface may be a bottom surface of a copper foil or an aluminum foil, and the second surface may be a top surface of a copper foil or an aluminum foil. It is understood that, to further improve the heat conducting performance of the heat sink 13, the heat conducting layer 132 may be coated with carbon aluminum foil or carbon copper foil, wherein carbon may be graphite.

The adhesion layer 133 is used for adhering the heat conduction layer 132 to the film substrate 121 of the film chip 12; the adhesive layer 133 is adhered to the first surface, i.e., the adhesive layer 133 is adhered to the bottom surface of the copper foil or aluminum foil. In view of preventing the adhesive layer 133 from overflowing the edge of the heat conductive layer 132, the outer contour of the adhesive layer 133 may be set to be not greater than the outer contour of the heat conductive layer 132. For example, when the heat conductive layer 132 is rectangular, the length and width of the adhesive layer 133 are not greater than the length and width of the heat conductive layer 132.

The flexible insulating layer 131 is made of an insulating material, for example, a polyimide layer, a mylar layer, or the like, and protects the heat conductive layer 132. In this application, the flexible insulating layer 131 is directly connected to the second surface, so that an adhesive-free connection between the flexible insulating layer 131 and the second surface can be formed. The flexible insulating layer 131 may be directly connected to the second surface of the heat conducting layer 132 by coating, cladding or sputtering.

In this embodiment, since the flexible insulating layer 131 is directly connected to the second surface of the heat conducting layer 132, compared with the case where the heat conducting layer 132 and the flexible insulating layer 131 are bonded by using an adhesive in the related art, the adhesive between the heat conducting layer 132 and the flexible insulating layer 131 is omitted, so that the thickness of the formed heat sink 13 is thinner and the heat sink is more likely to bend. The heat sink 13 is not easily peeled off from the surface of the thin film chip 12 by the bending stress and the high temperature, and can be kept in good contact with the surface of the thin film chip 12. And, since the adhesive between the heat conductive layer 132 and the flexible insulating layer 131 is omitted, the heat conductive interface at both sides of the adhesive is eliminated, and the present solution also avoids the thermal resistance generated by using the adhesive between the heat conductive layer 132 and the flexible insulating layer 131 in the related art. Therefore, the heat dissipation effect of the thin film chip 12 can be effectively improved through the scheme.

In addition, in the embodiment of the present application, referring to fig. 3, the heat sink 13 may be applied to the lower surface of the film substrate 121, referring to fig. 5, or may be applied to the upper surface of the film substrate 121 and cover the driving chip 122, or may be applied to both the lower surface of the film substrate 121 and the upper surface of the film substrate 121 and cover the driving chip 122. Considering that when the heat sink 13 is applied to the thin film substrate 121, air between the heat sink 13 and the thin film substrate 121 cannot be completely discharged to affect the heat conduction efficiency of the heat sink 13, referring to fig. 4 and 6, when the heat sink 13 is applied to the upper surface of the thin film substrate 121 and covers the driving chip 122, the air holes 134 are formed in the heat sink 13, and the air holes 134 can prevent the heat conduction efficiency of the heat sink 13 from being affected by air remaining between the heat sink 13 and the thin film substrate 121, thereby further improving the heat dissipation efficiency of the heat sink 13. The shape of the ventilation holes 134 may be rectangular, circular, elliptical, etc.

It should be noted that, referring to fig. 5, considering that the driving chip 122 is located on the upper surface of the film substrate 121, where there is a height difference between the top surface of the driving chip 122 and the upper surface of the film substrate 121, when the heat sink 13 is applied to the upper surface of the film substrate 121 and covers the driving chip 122, the concave portion 14 where the side surface of the driving chip 122 meets the upper surface of the film substrate 121 will form a cavity due to the covering of the heat sink 13, the heat dissipation efficiency of the heat sink 13 will be affected by the air in the cavity, and the connection firmness degree between the heat sink 13 and the film chip 12 will be reduced due to the expansion of the air in the cavity under the high temperature generated by the operation of the film chip 12, so, referring to fig. 4 to fig. 6, in the embodiment of the present application, the ventilation holes 134 are also provided at the position of the heat sink 13 corresponding to the concave portion 14 where the side surface of the driving chip 122 meets the upper surface of the film substrate 121. By this arrangement, the air in the recess 14 can be discharged, thereby improving the heat dissipation efficiency of the heat sink 13 and the connection firmness of the heat sink 13 and the thin film chip 12.

It is understood that the designer can flexibly design the position of the ventilation holes 134 corresponding to the concave portions 14 of the heat sink 13.

In some embodiments of the present application, the ventilation holes 134 may be disposed at two ends of the heat sink 13 corresponding to the driving chip 122, so that the ends of the driving chip 122 may be fully or partially exposed, thereby partially exposing the recess 14. For example, referring to fig. 4, for the elongated driving chip 122, one ventilation hole 134 may be provided at each end of the heat sink 13 corresponding to the driving chip 122, and the ends of the driving chip 122 may be completely exposed through the two ventilation holes 134. For another example, for the driving chip 122 with a cuboid structure, two ventilation holes 134 may be respectively formed at two ends of the cooling fin 13 corresponding to the driving chip 122, that is, two ventilation holes 134 are formed at one end of the driving chip 122, four ventilation holes 134 are formed at two ends, one vertex angle of each ventilation hole 134 extends to one vertex angle of the top surface of the driving chip 122, and the end of the driving chip 122 is partially exposed.

In other embodiments of the present application, referring to fig. 6, the ventilation holes 134 may be disposed corresponding to the top surface of the driving chip 122, and the ventilation holes 134 extend to both sides of the driving chip 122, so that the recess 14 is partially exposed. The design can reduce the number of the ventilation holes 134 to one under the premise of ensuring the air discharge at the concave portion 14. Compared with the two or four ventilation holes 134 in the embodiment, the number of ventilation holes 134 can be reduced, and the processing and manufacturing of the radiating fin 13 are facilitated.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it should be understood that, if there is an azimuth or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the azimuth or positional relationship shown in the drawings, this is for convenience of description and simplification of the description, but does not indicate or imply that the apparatus or element to be referred must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely used for illustration and are not to be construed as limitations of the present patent, and that the specific meaning of the terms described above may be understood by those of ordinary skill in the art according to the specific circumstances.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A heat sink (13) for a thin film chip (12), comprising:

a thermally conductive layer (132), the thermally conductive layer (132) having opposing first and second surfaces;

an adhesive layer (133), the adhesive layer (133) being adhered to the first surface for fixing a heat sink (13) to the film chip (12); and

-a flexible insulating layer (131), said flexible insulating layer (131) being directly connected to said second surface.

2. The heat sink (13) according to claim 1, characterized in that the flexible insulating layer (131) is directly connected to the second surface of the heat conducting layer (132) by means of coating, lamination or sputtering.

3. The heat sink (13) according to claim 1, characterized in that the outer contour of the adhesive layer (133) is not larger than the outer contour of the heat conducting layer (132).

4. A heat sink (13) according to any of the claims 1 to 3, characterized in that the heat conducting layer (132) is copper foil or aluminum foil; and/or

The flexible insulating layer is a polyimide layer or a polyester film layer.

5. A thin-film chip (12) for use in a display screen, comprising:

the film substrate (121) is used for connecting an external circuit board (11) of the display screen and the display panel (10);

a driving chip (122) provided on the upper surface of the thin film substrate (121);

the heat sink (13) according to any of claims 1 to 4, wherein the heat sink (13) is at least partially applied to the surface of the film substrate (121) to conduct out the heat generated by the driving chip (122).

6. The film chip (12) as claimed in claim 5, wherein the heat sink (13) is applied to the lower surface of the film substrate (121), and/or

The cooling fin (13) is attached to the upper surface of the film substrate (121) and covers the driving chip (122), and ventilation holes (134) are formed in the cooling fin (13).

7. The thin-film chip (12) according to claim 6, wherein a recess (14) is formed at a junction between a side surface of the driving chip (122) and an upper surface of the thin-film substrate (121);

the ventilation holes (134) are formed in positions of the cooling fins (13) corresponding to the concave portions (14).

8. The thin film chip (12) according to claim 7, wherein the ventilation holes (134) are provided at both ends of the heat sink (13) corresponding to the driving chip (122), and ends of the driving chip (122) are fully or partially exposed, thereby partially exposing the recess (14).

9. The thin film chip (12) according to claim 7, wherein the vent holes (134) are provided corresponding to the top surface of the driving chip (122), and the vent holes (134) extend to both sides of the driving chip (122) so as to partially expose the recess (14).

10. A display screen (1), characterized by comprising:

a display panel (10);

an external circuit board (11) arranged on the back surface of the display panel (10);

a plurality of thin film chips (12) as claimed in any one of claims 5 to 9, the thin film chips (12) being connected to the circuitry of the display panel (10) and the external circuit board (11), respectively.