JP2002321227A - Method for manufacturing matrix for molding optical element, method for manufacturing optical element using matrix and optical element by the manufacturing method - Google Patents

Method for manufacturing matrix for molding optical element, method for manufacturing optical element using matrix and optical element by the manufacturing method

Info

Publication number
JP2002321227A
JP2002321227A JP2001128129A JP2001128129A JP2002321227A JP 2002321227 A JP2002321227 A JP 2002321227A JP 2001128129 A JP2001128129 A JP 2001128129A JP 2001128129 A JP2001128129 A JP 2001128129A JP 2002321227 A JP2002321227 A JP 2002321227A
Authority
JP
Japan
Prior art keywords
optical element
manufacturing
master
molding
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001128129A
Other languages
Japanese (ja)
Other versions
JP2002321227A5 (en
Inventor
Senichi Hayashi
専一 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2001128129A priority Critical patent/JP2002321227A/en
Publication of JP2002321227A publication Critical patent/JP2002321227A/en
Publication of JP2002321227A5 publication Critical patent/JP2002321227A5/en
Pending legal-status Critical Current

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Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a matrix for molding an optical element capable of manufacturing the matrix in a relatively inexpensive, easy and rapid manner and requiring no cost even if a new mold is used (maintenance free) when the washing of the mold begins to become difficult, a method for manufacturing the optical element using the matrix and the optical element due to the manufacturing method. SOLUTION: The method for manufacturing the matrix for molding the optical element used in the optical element manufacturing method has a process for obtaining a master to which a pattern is applied, a process for obtaining the mold for molding the optical element to which the pattern is transferred by dripping a resin on the master and putting a substrate on the master to cure the resin or a process for forming a protective layer or a layer, which reinforces the adhesion with the surface of the mold, to the surface of the mold for molding the optical element.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、マイクロレンズ等
の光学素子成形用母型の製造方法、及び該母型を用いた
光学素子の製造方法、該製造方法による光学素子に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a master for molding an optical element such as a microlens, a method for manufacturing an optical element using the master, and an optical element using the manufacturing method.

【0002】[0002]

【従来の技術】従来におけるマイクロレンズ用金型の製
造方法としては、特開平09−076245号公報に示
されているように、マイクロレンズを形成するために用
いる金型は通常、半球状のパターンを形成された原盤の
表面に、金属を電鋳することによって前記パターンを転
写するようにして製造されている。
2. Description of the Related Art As a conventional method of manufacturing a mold for a microlens, as described in Japanese Patent Application Laid-Open No. 09-076245, a mold used for forming a microlens usually has a hemispherical pattern. The pattern is transferred by electroforming a metal on the surface of the master on which is formed.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記製
造方法では、半球状のパターンを形成された原盤の表面
に金属を電鋳するので時間がかかり、その分、型作製コ
ストが高くなる。また高価な金型を用いるため、長期間
使用しなくてはコストに見合わないという点等に問題が
あった。
However, in the above-described manufacturing method, metal is electroformed on the surface of the master on which the hemispherical pattern is formed, so that it takes a long time, and the mold manufacturing cost increases accordingly. In addition, since an expensive mold is used, there is a problem in that it is not worth the cost unless it is used for a long time.

【0004】そこで、本発明は、上記課題を解決し、比
較的安価で、容易に早く作製することができること等に
よって、金型の洗浄が困難になり始めたら新しい金型を
使用(メンテンス・フリー)してもコストのかからない
光学素子成形用母型の製造方法、及び該母型を用いた光
学素子の製造方法、該製造方法による光学素子を提供す
ることを目的とするものである。
Accordingly, the present invention solves the above-mentioned problems, and is relatively inexpensive and can be easily and quickly manufactured. Therefore, when it becomes difficult to clean the mold, a new mold is used (a maintenance-free mold). It is an object of the present invention to provide a method of manufacturing a master for molding an optical element, which does not require cost even if the method is used, a method of manufacturing an optical element using the master, and an optical element by the manufacturing method.

【0005】[0005]

【課題を解決するための手段】本発明は、上記課題を解
決するために、つぎの(1)〜(12)のように構成し
た光学素子成形用母型の製造方法、及び該母型を用いた
光学素子の製造方法、該製造方法による光学素子を提供
するものである。 (1)光学素子の製造方法に用いられる光学素子成形用
母型の製造方法であって、パターンを施した原盤を得る
工程と、前記原盤に樹脂を滴下し基板をのせて硬化させ
前記パターンを転写した光学素子成形用の型を得る工程
と、を有することを特徴とする光学素子成形用母型の製
造方法。 (2)前記光学素子成形用の型の表面に、保護層として
酸化膜を成膜する工程を有することを特徴とする上記
(1)に記載の光学素子成形用母型の製造方法。 (3)前記光学素子成形用の型の表面に、保護層として
金属膜を成膜する工程を有することを特徴とする上記
(1)に記載の光学素子成形用母型の製造方法。 (4)前記光学素子成形用の型の表面に、酸化膜を成膜
した後に該酸化膜の表面に金属膜を成膜し、前記型の表
面との密着力を強化させるようにした工程を有すること
を特徴とする上記(1)に記載の光学素子成形用母型の
製造方法。 (5)前記パターンを施した原盤を得る工程において、
該原盤が基板上にパターニングされたレジストを加熱に
よりリフローさせることによって形成されることを特徴
とする上記(1)〜(4)のいずれかに記載の光学素子
成形用母型の製造方法。 (6)前記パターンを施した原盤を得る工程において、
該原盤のパターンが電気メッキによって形成されること
を特徴とする上記(1)〜(4)のいずれかに記載の光
学素子成形用母型の製造方法。 (7)前記酸化膜が、SiO、SiO2、Al23のい
ずれかであることを特徴とする上記(2)〜(6)のい
ずれかに記載の光学素子成形用母型の製造方法。 (8)前記金属膜が、Cr、Niのいずれかであること
を特徴とする上記(3)〜(7)のいずれかに記載の光
学素子成形用母型の製造方法。 (9)前記光学素子が、マイクロレンズであることを特
徴とする上記(1)〜(8)のいずれかに記載の光学素
子成形用母型の製造方法。 (10)上記(1)〜(9)のいずれかに記載の製造方
法で作製された光学素子成形用母型を用い、該光学素子
成形用母型に光透過性の樹脂を滴下し基板をのせて硬化
させた後、該母型より該樹脂を剥離して光学素子を作製
することを特徴とする光学素子の製造方法。 (11)上記(10)に記載の方法で作製された基板の
素子形成表面に、光透過性の樹脂を滴下し基板をのせて
硬化させ、光学素子を作製することを特徴とする光学素
子の製造方法。 (12)上記(10)または上記(11)に記載の光学
素子の製造方法によって作製されたことを特徴とする光
学素子。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method of manufacturing an optical element molding die having the following constitutions (1) to (12), and a method of manufacturing the same. An object of the present invention is to provide a method for manufacturing an optical element used and an optical element by the manufacturing method. (1) A method for producing an optical element molding master used in a method for producing an optical element, comprising the steps of: obtaining a patterned master; dropping a resin onto the master; Obtaining a transferred mold for molding an optical element, the method comprising the steps of: (2) The method for producing an optical element molding master according to the above (1), further comprising a step of forming an oxide film as a protective layer on the surface of the optical element molding die. (3) The method of manufacturing an optical element molding die according to the above (1), further comprising a step of forming a metal film as a protective layer on the surface of the optical element molding die. (4) A process in which an oxide film is formed on the surface of the mold for molding an optical element, and then a metal film is formed on the surface of the oxide film so as to enhance the adhesion to the surface of the mold. The method for producing a master for molding an optical element according to the above (1), characterized by having: (5) In the step of obtaining a master on which the pattern is applied,
The method according to any one of (1) to (4), wherein the master is formed by reflowing a resist patterned on a substrate by heating. (6) In the step of obtaining a master on which the pattern is applied,
The method for producing a master for molding an optical element according to any one of the above (1) to (4), wherein the pattern of the master is formed by electroplating. (7) The method according to any one of the above (2) to (6), wherein the oxide film is any one of SiO, SiO 2 , and Al 2 O 3. . (8) The method according to any one of the above (3) to (7), wherein the metal film is made of one of Cr and Ni. (9) The method according to any one of the above (1) to (8), wherein the optical element is a microlens. (10) Using an optical element molding master prepared by the method according to any one of the above (1) to (9), dropping a light-transmissive resin onto the optical element molding master to form a substrate. A method for manufacturing an optical element, comprising: mounting and curing, followed by peeling the resin from the matrix to produce an optical element. (11) An optical element characterized in that an optical element is produced by dropping a light-transmissive resin on the element formation surface of the substrate produced by the method described in (10) above, placing the substrate thereon, and curing the resin. Production method. (12) An optical element manufactured by the method for manufacturing an optical element according to (10) or (11).

【0006】[0006]

【発明の実施の形態】本発明の実施の形態においては、
上記構成を適用することによって、比較的安価で、容易
に早く作製することができること等によって、金型の洗
浄が困難になり始めたら新しい金型を使用(メンテンス
・フリー)してもコストのかからない光学素子成形用母
型の製造方法、及び該母型を用いた光学素子の製造方
法、該製造方法による光学素子を提供することができ
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS In an embodiment of the present invention,
By applying the above configuration, it is relatively inexpensive and can be easily and quickly manufactured. If it becomes difficult to clean the mold, it does not cost much to use a new mold (maintenance-free). It is possible to provide a method of manufacturing a master for molding an optical element, a method of manufacturing an optical element using the master, and an optical element by the manufacturing method.

【0007】[0007]

【実施例】以下に、本発明の実施例について説明する
が、本発明はこれらの実施例によって何ら限定されるも
のではない。 [実施例1]図1に、本発明の実施例1におけるマイク
ロレンズ用金型の製造工程の断面図を示す。図1を用い
て本実施例のマイクロレンズ用母型の製造方法を説明す
る。まず、図1の(a)はガラス基板102上に半球状
のレジストパターン101を形成された原盤である。こ
の原盤はレジストを円筒状にパターニングした後加熱し
リフローさせて半球状マイクロ構造体アレイを形成し
た。前記原盤のレジストと樹脂の剥離を促進する為にレ
ジストの表面にCr膜を50nmほど蒸着法で成膜して
おく。
EXAMPLES Examples of the present invention will be described below, but the present invention is not limited to these examples. [Embodiment 1] FIG. 1 is a sectional view showing a manufacturing process of a microlens mold according to Embodiment 1 of the present invention. A method for manufacturing the microlens matrix of this embodiment will be described with reference to FIG. First, FIG. 1A shows a master having a hemispherical resist pattern 101 formed on a glass substrate 102. The master was patterned into a cylindrical shape, and then heated and reflowed to form a hemispherical microstructure array. A Cr film is formed on the surface of the resist by a vapor deposition method to a thickness of about 50 nm in order to promote the separation of the resist and the resin from the master.

【0008】次に(b)では、光硬化樹脂104をディ
スペンサーを用いて原盤に塗布する。光硬化樹脂104
との密着性を強化するためにシランカップリング処理を
施してあるガラス基板103を片側からゆっくり接液さ
せる。ロードセルにて前記ガラス基板103全体を均一
に荷重をかけ高さ20μmに位置制御を行う。前記ガラ
ス基板103にUV照射装置により照度10mW/cm
の光を70s照射し前記光硬化樹脂104を硬化させ
る。
Next, in (b), the photocurable resin 104 is applied to the master using a dispenser. Photocurable resin 104
The glass substrate 103 which has been subjected to the silane coupling treatment in order to enhance the adhesion with the glass substrate is slowly brought into contact with the liquid from one side. A load is applied uniformly to the entire glass substrate 103 by a load cell to control the position to a height of 20 μm. Illuminance of 10 mW / cm on the glass substrate 103 by a UV irradiation device
Is irradiated for 70 s to cure the photocurable resin 104.

【0009】更に(c)では、前記原盤からガラス基板
103と光硬化樹脂104を外した(離型)。樹脂と金
属膜の密着性を強化させるために成形した光硬化樹脂1
04の表面に1層目としてSiO2膜を30nm蒸着法
により成膜した後、2層目としてCr膜を100nm蒸
着法により成膜した。このように樹脂をベースに用いる
ことにより比較的安価で、容易に早くマイクロレンズ用
の母型が作製できた。
Further, in (c), the glass substrate 103 and the photocurable resin 104 are removed from the master (mold release). Photocurable resin 1 molded to enhance adhesion between resin and metal film
On the surface of the substrate 04, a SiO 2 film was formed as a first layer by a 30 nm evaporation method, and then a Cr film was formed as a second layer by a 100 nm evaporation method. By using the resin as the base in this way, a relatively inexpensive, easily and quickly fabricated master for a microlens could be manufactured.

【0010】[実施例2]図2に、本発明の実施例2に
おけるマイクロレンズ用金型の製造工程の断面図を示
す。図2を用いて本実施例のマイクロレンズ用金型の製
造方法及びマイクロレンズ素子の製造方法を説明する。
まず、図2の(a)はSiウェハーにレジストで円の開
口部をアレイ状にパターニングし、Niのメッキ液に浸
し、開口部に電気メッキないし電着を行い半球状にNi
を成長させてマイクロ構造体アレイを作製する。これを
原盤として用いる。光硬化樹脂201をディスペンサー
を用いて原盤に塗布する。光硬化樹脂201との密着性
を強化するためにシランカップリング処理を施してある
ガラス基板202を片側からゆっくり接液させる。ロー
ドセルにて前記ガラス基板202全体を均一に荷重をか
け高さ30μmに位置制御を行う。前記ガラス基板20
2にUV照射装置により照度30mW/cmの光を40
0s照射し前記光硬化樹脂201を硬化させる。次に前
記原盤からガラス基板202と光硬化樹脂201を外し
た(離型)。樹脂と金属膜の密着性を強化させるために
成形した光硬化樹脂201の表面に1層目としてSiO
2膜を30nm蒸着法により成膜した後、2層目として
Ni膜を100nm蒸着法により成膜した。このように
樹脂をベースに用いることにより比較的安価で、容易に
早くマイクロレンズ用の金型が作製できた。
[Embodiment 2] FIG. 2 is a sectional view showing a manufacturing process of a microlens mold according to Embodiment 2 of the present invention. With reference to FIG. 2, a method for manufacturing a microlens mold and a method for manufacturing a microlens element according to the present embodiment will be described.
First, FIG. 2 (a) shows a pattern in which circular openings are patterned in an array on a Si wafer with a resist, immersed in a plating solution of Ni, and electroplated or electrodeposited on the openings to form a hemispherical Ni.
Is grown to produce a microstructure array. This is used as a master. The photocurable resin 201 is applied to the master using a dispenser. A glass substrate 202 that has been subjected to a silane coupling treatment to enhance the adhesion to the photocurable resin 201 is slowly contacted from one side. A load is uniformly applied to the entire glass substrate 202 by a load cell to control the position to a height of 30 μm. The glass substrate 20
2. Light with an illuminance of 30 mW / cm was applied to the UV irradiation device for 40
Irradiate for 0 s to cure the photocurable resin 201. Next, the glass substrate 202 and the photocurable resin 201 were removed from the master (release). A first layer of SiO2 is formed on the surface of the photocurable resin 201 formed to enhance the adhesion between the resin and the metal film.
After forming the second film by a 30 nm evaporation method, a Ni film was formed as a second layer by a 100 nm evaporation method. By using a resin as a base in this way, a mold for a microlens could be produced relatively inexpensively, easily and quickly.

【0011】続いて、ディスペンサーを用いて高屈折率
のUV硬化樹脂203を前記金型に塗布し、前記UV硬
化樹脂203との密着性を強化するためにシランカップ
リング処理を施してあるガラス基板204を片側からゆ
っくり接液させる。ロードセルにて前記ガラス基板20
4全体を均一に荷重をかけ高さ20μmに位置制御を行
う。前記ガラス基板204に背面からUV照射装置によ
り照度10mW/cmの光を70s照射し前記UV硬化
樹脂203を硬化させる。更に(b)では、前記金型か
ら前記ガラス基板204と前記UV硬化樹脂203を離
型した。
Subsequently, a UV curable resin 203 having a high refractive index is applied to the mold using a dispenser, and a glass substrate on which a silane coupling treatment has been performed in order to enhance the adhesion to the UV curable resin 203. 204 is slowly contacted from one side. Load the glass substrate 20 with a load cell.
(4) A uniform load is applied to the whole, and the position is controlled to a height of 20 μm. The glass substrate 204 is irradiated with light having an illuminance of 10 mW / cm for 70 s from a back surface by a UV irradiation device to cure the UV curing resin 203. Further, in (b), the glass substrate 204 and the UV curable resin 203 were released from the mold.

【0012】次に(c)では、接合するために低屈折率
のUV硬化樹脂205を成形した前記UV硬化樹脂20
3の表面に塗布し、前記UV硬化樹脂205との密着性
を強化するためにシランカップリング処理を施してある
ガラス基板206を片側からゆっくり接液させる。ロー
ドセルにて前記ガラス基板206全体を均一に荷重をか
け膜厚50μmに位置制御を行う。前記ガラス基板20
6に背面からUV照射装置により照度20mW/cmの
光を100s照射し前記UV硬化樹脂205を硬化させ
る。2枚のガラスに挟まれたこの基板をマイクロレンズ
を含む適当な大きさに切断し、所望の焦点距離が得られ
るようガラス基板206を研磨する。このようにして前
記マイクロレンズ用の金型を用いて、マイクロレンズ素
子を製造することができる。
Next, in (c), the UV-curable resin 20 having a low-refractive-index UV-curable resin 205 molded for bonding is used.
The glass substrate 206 which has been applied to the surface of No. 3 and which has been subjected to a silane coupling treatment in order to enhance the adhesion to the UV curable resin 205 is slowly brought into contact from one side. A load is uniformly applied to the entire glass substrate 206 by a load cell to perform position control to a film thickness of 50 μm. The glass substrate 20
6 is irradiated from the back side with light having an illuminance of 20 mW / cm for 100 s by a UV irradiator to cure the UV curable resin 205. This substrate sandwiched between two pieces of glass is cut into an appropriate size including a microlens, and the glass substrate 206 is polished so as to obtain a desired focal length. Thus, a microlens element can be manufactured using the microlens mold.

【0013】[0013]

【発明の効果】以上に説明したように、本発明によれ
ば、比較的安価で、容易に早く作製することができるこ
と等によって、金型の洗浄が困難になり始めたら新しい
金型を使用(メンテンス・フリー)してもコストのかか
らない光学素子成形用母型の製造方法、及び該母型を用
いた光学素子の製造方法、該製造方法による光学素子を
実現することができる。
As described above, according to the present invention, a relatively inexpensive, easily and quickly manufactured product can be used. If it becomes difficult to clean the mold, a new mold is used. It is possible to realize a method of manufacturing a mold for molding an optical element, which does not require cost even if it is maintenance-free, a method of manufacturing an optical element using the mold, and an optical element by the manufacturing method.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例1におけるマイクロレンズ用金
型の製造工程を示す断面図である。
FIG. 1 is a cross-sectional view illustrating a manufacturing process of a microlens mold according to Embodiment 1 of the present invention.

【図2】本発明の実施例2におけるマイクロレンズ用金
型及びマイクロレンズ素子の製造工程を示す断面図であ
る。
FIG. 2 is a cross-sectional view illustrating a manufacturing process of a microlens mold and a microlens element according to a second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

101:レジスト 102:ガラス基板 103:ガラス基板 104:光硬化樹脂 201:光硬化樹脂 202:ガラス基板 203:UV硬化樹脂 204:ガラス基板 205:UV硬化樹脂 206:ガラス基板 101: Resist 102: Glass substrate 103: Glass substrate 104: Photocurable resin 201: Photocurable resin 202: Glass substrate 203: UV curable resin 204: Glass substrate 205: UV curable resin 206: Glass substrate

フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C25D 5/54 C25D 5/54 7/00 7/00 Z G02B 3/00 G02B 3/00 A Z // B29L 11:00 B29L 11:00 Fターム(参考) 4F202 AA44 AH75 AJ03 AJ09 CA01 CB01 CD02 CD22 CK11 4F204 AA44 AD04 AD08 AH75 AJ03 EA03 EB12 EK18 4K024 AA03 AB01 AB08 BA15 BB12 FA07 4K044 AA13 AB10 BA02 BA06 BA14 BB03 BB10 BC14 CA13 CA18Continuation of the front page (51) Int.Cl. 7 Identification code FI Theme coat II (reference) C25D 5/54 C25D 5/54 7/00 7/00 Z G02B 3/00 G02B 3/00 AZ // B29L 11: 00 B29L 11:00 F-term (reference) 4F202 AA44 AH75 AJ03 AJ09 CA01 CB01 CD02 CD22 CK11 4F204 AA44 AD04 AD08 AH75 AJ03 EA03 EB12 EK18 4K024 AA03 AB01 AB08 BA15 BB12 FA07 4K044 AA13 AB10 BA02 BA06 BA14 BA10

Claims (12)

【特許請求の範囲】[Claims] 【請求項1】光学素子の製造方法に用いられる光学素子
成形用母型の製造方法であって、 パターンを施した原盤を得る工程と、前記原盤に樹脂を
滴下し基板をのせて硬化させ前記パターンを転写した光
学素子成形用の型を得る工程と、 を有することを特徴とする光学素子成形用母型の製造方
法。
1. A method for producing a master for forming an optical element, which is used in a method for producing an optical element, comprising the steps of: obtaining a patterned master; dropping a resin onto the master; Obtaining a mold for molding an optical element onto which a pattern has been transferred, and a method for producing a master for molding an optical element, comprising:
【請求項2】前記光学素子成形用の型の表面に、保護層
として酸化膜を成膜する工程を有することを特徴とする
請求項1に記載の光学素子成形用母型の製造方法。
2. The method according to claim 1, further comprising the step of forming an oxide film as a protective layer on the surface of the optical element molding die.
【請求項3】前記光学素子成形用の型の表面に、保護層
として金属膜を成膜する工程を有することを特徴とする
請求項1に記載の光学素子成形用母型の製造方法。
3. The method according to claim 1, further comprising the step of forming a metal film as a protective layer on the surface of the optical element molding die.
【請求項4】前記光学素子成形用の型の表面に、酸化膜
を成膜した後に該酸化膜の表面に金属膜を成膜し、前記
型の表面との密着力を強化させるようにした工程を有す
ることを特徴とする請求項1に記載の光学素子成形用母
型の製造方法。
4. An oxide film is formed on the surface of the mold for molding an optical element, and then a metal film is formed on the surface of the oxide film to enhance the adhesion to the surface of the mold. The method according to claim 1, further comprising a step.
【請求項5】前記パターンを施した原盤を得る工程にお
いて、該原盤が基板上にパターニングされたレジストを
加熱によりリフローさせることによって形成されること
を特徴とする請求項1〜4のいずれか1項に記載の光学
素子成形用母型の製造方法。
5. The method according to claim 1, wherein in the step of obtaining the patterned master, the master is formed by reflowing a resist patterned on a substrate by heating. 13. The method for producing a master for molding an optical element according to item 10.
【請求項6】前記パターンを施した原盤を得る工程にお
いて、該原盤のパターンが電気メッキによって形成され
ることを特徴とする請求項1〜4のいずれか1項に記載
の光学素子成形用母型の製造方法。
6. The optical element molding mother according to claim 1, wherein in the step of obtaining the patterned master, the pattern of the master is formed by electroplating. Mold manufacturing method.
【請求項7】前記酸化膜が、SiO、SiO2、Al2
3のいずれかであることを特徴とする請求項2〜6のい
ずれか1項に記載の光学素子成形用母型の製造方法。
7. The method according to claim 1, wherein the oxide film is made of SiO, SiO 2 , Al 2 O.
The method for producing an optical element molding die according to any one of claims 2 to 6, wherein the method is any of (3).
【請求項8】前記金属膜が、Cr、Niのいずれかであ
ることを特徴とする請求項3〜7のいずれか1項に記載
の光学素子成形用母型の製造方法。
8. The method according to claim 3, wherein the metal film is made of one of Cr and Ni.
【請求項9】前記光学素子が、マイクロレンズであるこ
とを特徴とする請求項1〜8のいずれか1項に記載の光
学素子成形用母型の製造方法。
9. The method according to claim 1, wherein the optical element is a microlens.
【請求項10】請求項1〜9のいずれか1項に記載の製
造方法で作製された光学素子成形用母型を用い、該光学
素子成形用母型に光透過性の樹脂を滴下し基板をのせて
硬化させた後、該母型より該樹脂を剥離して光学素子を
作製することを特徴とする光学素子の製造方法。
10. An optical element molding master prepared by the method according to any one of claims 1 to 9, wherein a light-transmissive resin is dropped on the optical element molding master to form a substrate. And then curing the resin to form an optical element by peeling the resin from the matrix.
【請求項11】請求項10に記載の方法で作製された基
板の素子形成表面に、光透過性の樹脂を滴下し基板をの
せて硬化させ、光学素子を作製することを特徴とする光
学素子の製造方法。
11. An optical element characterized in that an optical element is produced by dropping a light-transmissive resin on the element forming surface of the substrate produced by the method according to claim 10, placing the substrate on the element, and curing the resin. Manufacturing method.
【請求項12】請求項10または請求項11に記載の光
学素子の製造方法によって作製されたことを特徴とする
光学素子。
12. An optical element manufactured by the method for manufacturing an optical element according to claim 10.
JP2001128129A 2001-04-25 2001-04-25 Method for manufacturing matrix for molding optical element, method for manufacturing optical element using matrix and optical element by the manufacturing method Pending JP2002321227A (en)

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JP2006305800A (en) * 2005-04-27 2006-11-09 Nikon Corp Mold and manufacturing method of resin molded product
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JP2009226634A (en) * 2008-03-19 2009-10-08 Konica Minolta Opto Inc Method for producing submaster molding mold
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WO2011024700A1 (en) * 2009-08-31 2011-03-03 コニカミノルタオプト株式会社 Forming die, optical element, and forming die production method
CN102313927A (en) * 2010-07-05 2012-01-11 日东电工株式会社 Optical waveguide manufacturing method
CN102313926A (en) * 2010-07-05 2012-01-11 日东电工株式会社 Optical waveguide manufacturing method
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JP2005153223A (en) * 2003-11-21 2005-06-16 Toppan Printing Co Ltd Mold for optical part and its manufacturing method
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WO2009101883A1 (en) * 2008-02-13 2009-08-20 Konica Minolta Opto, Inc. Process for producing hybrid optical-element grouping
JP2009226634A (en) * 2008-03-19 2009-10-08 Konica Minolta Opto Inc Method for producing submaster molding mold
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CN102574309A (en) * 2009-08-31 2012-07-11 柯尼卡美能达精密光学株式会社 Forming die, optical element, and forming die production method
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CN102313927A (en) * 2010-07-05 2012-01-11 日东电工株式会社 Optical waveguide manufacturing method
CN102313926A (en) * 2010-07-05 2012-01-11 日东电工株式会社 Optical waveguide manufacturing method
JP2012014123A (en) * 2010-07-05 2012-01-19 Nitto Denko Corp Method for manufacturing optical waveguide
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US8778451B2 (en) 2010-07-05 2014-07-15 Nitto Denko Corporation Method of manufacturing optical waveguide
US8652569B2 (en) 2010-10-27 2014-02-18 Nitto Denko Corporation Optical waveguide production method

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