JP2002311303A - Package for optical communication - Google Patents
Package for optical communicationInfo
- Publication number
- JP2002311303A JP2002311303A JP2001112661A JP2001112661A JP2002311303A JP 2002311303 A JP2002311303 A JP 2002311303A JP 2001112661 A JP2001112661 A JP 2001112661A JP 2001112661 A JP2001112661 A JP 2001112661A JP 2002311303 A JP2002311303 A JP 2002311303A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- optical communication
- translucent member
- brazing material
- communication package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光通信用の半導体
素子を収容するための光通信用パッケージに係り、より
詳細には光ファイバーの先端と対向させる透光性部材を
備える光通信用パッケージに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical communication package for accommodating a semiconductor device for optical communication, and more particularly, to an optical communication package having a light-transmitting member opposed to the tip of an optical fiber. .
【０００２】[0002]
【従来の技術】光通信用の半導体素子を収容するための
光通信用パッケージには、本体がセラミック製や金属製
のもの、外部接続端子の接合形状がデュアルインライン
（Ｄｕａｌ ｉｎ Ｌｉｎｅ）型やバタフライ（Ｂｕｔ
ｔｅｒｆｌｙ）型等のものがある。例えば、金属製でバ
タフライ型の光通信用パッケージ５０は、図５に示すよ
うに、底部が放熱性に優れたＣｕ−Ｗ（銅タングステ
ン）やＣｕ−Ｍｏ−Ｃｕ（銅モリブデン銅の接合板）
等、側面部がセラミックと熱膨張係数が近似するＫＶ
（Ｆｅ−Ｎｉ−Ｃｏ系合金、商品名「Ｋｏｖｅｒ（コバ
ール）」）や４２アロイ（Ｆｅ−Ｎｉ系合金）等の金属
部材からなり、内部に半導体素子を搭載するためのキャ
ビティ部５１を備える基体５２を有する。また、光通信
用パッケージ５０は、この基体５２の一側壁部に穿孔さ
れ、キャビティ部５１に連通する貫通孔５３と、この貫
通孔５３の外側周辺部にろう付け接合され、キャビティ
部５１に光信号を通すための挿通孔６１を有するＫＶや
４２アロイ等の金属材からなる金属製固定部材５４を有
する。更に、光通信用パッケージ５０は、この金属製固
定部材５４の挿通孔６１を接合により塞ぎ、キャビティ
部５１内の気密性を保持すると同時に、光ファイバーの
先端と対向させるための透光性部材５５を有する。そし
て、光通信用パッケージ５０は、基体５２の一側壁部に
隣接する相対向する壁部にそれぞれ穿設された窓枠部に
接合され、アルミナ（Ａｌ2 Ｏ3 ）等のセラミック材
に、基体５２のキャビティ部５１側から基体５２の外側
にかけて導通して形成される導体配線パターン５６を備
えるフィードスルー基板５７を有し、フィードスルー基
板５７の基体５２の外側部分の導体配線パターン５６に
バタフライ型にろう付け接合され、外部からの電気的接
続をするためのＫＶや４２アロイ等の金属部材からなる
外部接続端子５８を有している。2. Description of the Related Art An optical communication package for accommodating a semiconductor element for optical communication has a main body made of ceramic or metal, and a connection shape of an external connection terminal is a dual in line type or a butterfly. (But
terly) type and the like. For example, as shown in FIG. 5, a metallic butterfly-type optical communication package 50 is made of a Cu-W (copper tungsten) or Cu-Mo-Cu (copper-molybdenum-copper bonding plate) having a bottom with excellent heat dissipation.
KV whose thermal expansion coefficient is similar to that of the ceramic side
(Fe—Ni—Co alloy, trade name “Kover”) or a metal member such as 42 alloy (Fe—Ni alloy) and having a cavity 51 for mounting a semiconductor element therein. 52. The optical communication package 50 is formed by perforating one side wall of the base 52 and brazing to the through hole 53 communicating with the cavity 51 and the outer peripheral portion of the through hole 53. A metal fixing member 54 made of a metal material such as KV or 42 alloy having an insertion hole 61 for passing a signal is provided. Further, the optical communication package 50 closes the insertion hole 61 of the metal fixing member 54 by bonding, and maintains the airtightness in the cavity portion 51, and at the same time, the light transmitting member 55 for facing the tip of the optical fiber. Have. The optical communication package 50 is joined to window frames formed on opposing walls adjacent to one side wall of the base 52, and is bonded to a ceramic material such as alumina (Al 2 O 3 ). 52, a feed-through board 57 having a conductive wiring pattern 56 formed so as to conduct from the cavity portion 51 side of the base 52 to the outside of the base 52; And an external connection terminal 58 made of a metal member such as KV or 42 alloy for electrical connection from the outside.
【０００３】この光通信用パッケージ５０は、基体５２
のキャビティ部５１に半導体素子を搭載し、半導体素子
とフィードスルー基板５７の基体５２のキャビティ部５
１側部分の導体配線パターン５６とをボンディングワイ
ヤ等で接続することで、外部接続端子５８と半導体素子
とを導通状態とする。また、光ファイバー部材を金属製
固定部材５４に、ＹＡＧ等のレーザーを使用して溶接し
た後、基体５２の上面に金属やセラミック等からなる蓋
体５９を、ガラス、ろう材、又は樹脂等からなる封止材
で接合することで光半導体装置が形成され、この半導体
装置は、取付け孔６０を介してねじでボード等にねじ止
め固定される。This optical communication package 50 is composed of a base 52
The semiconductor element is mounted in the cavity part 51 of the semiconductor device, and the semiconductor element and the cavity part 5 of the base 52 of the feedthrough substrate 57
By connecting the conductor wiring pattern 56 on the first side with a bonding wire or the like, the external connection terminal 58 and the semiconductor element are brought into a conductive state. After welding the optical fiber member to the metal fixing member 54 using a laser such as YAG, a lid 59 made of metal, ceramic, or the like is formed on the upper surface of the base 52 by glass, brazing material, resin, or the like. An optical semiconductor device is formed by joining with a sealing material, and the semiconductor device is fixed to a board or the like with screws via a mounting hole 60.
【０００４】光通信用パッケージ５０のキャビティ部５
１内の気密性を保つため、例えば、図６に示すように、
金属製固定部材５４は、基体５２の一側壁部に穿孔され
キャビティ部５１に連通する貫通孔５３の外側周辺部
に、Ａｇ−Ｃｕろう等の高温ろう材６３で接合し、次い
で、平板や半球面等の形状を有したレンズからなる透光
性部材５５の外周部の端面部６５から接合表面にかけて
スパッタ等で薄膜の環状メタライズパターン６４を形成
し、金属製固定部材５４の挿通孔６１に形成した段差部
６２、及び金属製固定部材５４と透光性部材５５の端面
部６５とをＡｕ−ＳｎろうやＡｕ−Ｇｅろう等の低温ろ
う材６６を用いて接合している。The cavity 5 of the optical communication package 50
For example, as shown in FIG.
The metal fixing member 54 is joined to the outer peripheral portion of the through-hole 53 communicating with the cavity portion 51 by a high-temperature brazing material 63 such as Ag-Cu brazing. An annular metallized pattern 64 of a thin film is formed by sputtering or the like from the end surface 65 on the outer peripheral portion of the light transmitting member 55 having a shape such as a surface to the joining surface, and formed in the insertion hole 61 of the metal fixing member 54. The stepped portion 62, the metal fixing member 54, and the end surface 65 of the translucent member 55 are joined using a low-temperature brazing material 66 such as Au-Sn brazing or Au-Ge brazing.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前述し
たような従来の光通信用パッケージは、次のような問題
がある。 （１）透光性部材と金属製固定部材とを、ろう材、例え
ばＡｕ−ＳｎろうやＡｕ−Ｇｅろう等の低温ろう材を介
して加熱接合した後、冷却過程で冷却勾配を急にして冷
却した場合、基体と金属製固定部材とを接合しているＡ
ｇ−Ｃｕろう等の高温ろう材と、透光性部材と金属製固
定部材とを接合している低温ろう材との集合された熱収
縮によって、ガラスからなる透光性部材の端面部近傍
に、大きな引張り応力が生じるため、透光性部材にクラ
ックが発生したり、低温ろう材と透光性部材の端面部近
傍の界面に亀裂や剥がれ等が発生して、キャビティ部の
気密性を保てなくなる場合がある。 （２）光通信用パッケージには、地球環境を想定した様
々な信頼性試験が課せられる。例えば、その中の−６５
℃と１５０℃間の温度サイクル試験において、基体と金
属製固定部材の接合部の高温ろう材、例えば、Ａｇ−Ｃ
ｕろうの熱膨張係数は１７．６×１０-6／℃、及び金属
製固定部材と透光性部材の接合部の低温ろう材、例え
ば、Ａｕ−Ｓｎろうの熱膨張係数は１６．０×１０-6／
℃であり、ガラスからなる透光性部材の熱膨張係数の
５．１×１０-6／℃に比較して大きいため、熱膨張と収
縮の繰り返し、特に熱収縮によって、透光性部材に大き
な引張り応力が発生し、透光性部材にクラックが発生し
たり、低温ろう材と透光性部材との界面に亀裂や剥がれ
等が発生してキャビティ部の気密性を保てなくなる場合
がある。 （３）金属製固定部材と透光性部材の接合部を、基体と
金属製固定部材の接合部からできるだけ遠い位置にする
ことで、金属製固定部材と透光性部材の接合部への高温
ろう材の熱膨張、収縮の影響を軽減することが考えられ
るが、この場合は、金属製固定部材の筒長さが長くな
り、パッケージが大型になる。本発明は、かかる事情に
鑑みてなされたものであって、透光性部材への応力集中
を緩和させ、クラックや亀裂、剥がれ等の発生のない、
気密信頼性を備える光通信用パッケージを提供すること
を目的とする。However, the conventional optical communication package as described above has the following problems. (1) The light-transmitting member and the metal fixing member are heated and joined via a brazing material, for example, a low-temperature brazing material such as Au-Sn brazing or Au-Ge brazing. When cooled, A joining the base and the metal fixing member
Due to the heat shrinkage of the high-temperature brazing material such as g-Cu brazing material and the low-temperature brazing material joining the translucent member and the metal fixing member, the vicinity of the end face of the translucent member made of glass is generated. Since a large tensile stress is generated, cracks occur in the translucent member, and cracks or peeling occur at the interface near the end face of the low-temperature brazing material and the translucent member, thereby maintaining the airtightness of the cavity. May disappear. (2) Various reliability tests assuming the global environment are imposed on optical communication packages. For example, -65 therein
In a temperature cycle test between 150 ° C. and 150 ° C., a high-temperature brazing filler metal such as Ag-C
The thermal expansion coefficient of u-wax is 17.6 × 10 −6 / ° C., and the thermal expansion coefficient of the low-temperature brazing material at the joint between the metal fixing member and the translucent member, for example, Au-Sn braze is 16.0 ×. 10 -6 /
° C, which is larger than the thermal expansion coefficient of a glass translucent member of 5.1 × 10 -6 / ° C. In some cases, a tensile stress is generated to cause cracks in the translucent member, cracks or peeling to occur at the interface between the low-temperature brazing material and the translucent member, and the airtightness of the cavity cannot be maintained. (3) By setting the joining portion between the metal fixing member and the light transmitting member as far as possible from the joining portion between the base and the metal fixing member, high temperature to the joining portion between the metal fixing member and the light transmitting member can be obtained. Although it is conceivable to reduce the effects of thermal expansion and contraction of the brazing material, in this case, the cylindrical length of the metal fixing member becomes longer, and the package becomes larger. The present invention has been made in view of such circumstances, and alleviates stress concentration on a light-transmitting member, and does not cause cracks, cracks, peeling, or the like.
An object of the present invention is to provide an optical communication package having airtight reliability.
【０００６】[0006]
【課題を解決するための手段】前記目的に沿う本発明に
係る光通信用パッケージは、内部に光通信用の半導体素
子を搭載するためのキャビティ部を形成する基体の一側
壁部に穿孔され、しかもキャビティ部に連通する貫通孔
に挿入し、高温ろう材で固着された金属製固定部材の挿
通孔中に、光ファイバーの先端と対向させるための透光
性部材が設けられた光通信用パッケージにおいて、透光
性部材の外周部の端面は非メタライズ部となって、接合
表面に環状メタライズパターンを有し、しかも金属製固
定部材は挿通孔が貫通孔の孔径より小さい大径孔から中
径孔になる第１の段差部を有し、更に中径孔から小径孔
になる第２の段差部を有すると共に、第２の段差部と透
光性部材の環状メタライズパターンが低温ろう材を介し
て接合されている。これにより、低温ろう材の接合時に
透光性部材の外周部端面での接合は行なわれなく、更
に、第２の段差部に溶融前の低温ろう材を落とし込んで
セットすることができ、溶融した低温ろう材を第２の段
差部に溜めることができるので、高温ろう材や低温ろう
材に熱膨張、収縮が発生したとしても透光性部材の引張
り応力を緩和でき、透光性部材のクラックの発生や、透
光性部材と低温ろう材の界面での亀裂や剥がれ等の発生
を防止することができる。According to the present invention, there is provided an optical communication package according to the present invention, wherein a hole is formed in one side wall of a base forming a cavity for mounting a semiconductor element for optical communication therein. Moreover, the optical communication package is provided with a light-transmitting member that is inserted into a through-hole communicating with the cavity portion and is provided in the through-hole of the metal fixing member fixed with the high-temperature brazing material so as to face the tip of the optical fiber. The end face of the outer peripheral portion of the translucent member is a non-metallized portion, has an annular metallized pattern on the joining surface, and the metal fixing member has a large through medium-diameter hole in which the insertion hole is smaller than the diameter of the through hole. And a second step from the medium hole to the small hole, and the annular metallized pattern of the second step and the light transmitting member is interposed through the low-temperature brazing material. Joined As a result, at the time of joining the low-temperature brazing material, the joining at the outer peripheral end face of the translucent member is not performed, and the low-temperature brazing material before melting can be dropped and set in the second step portion, and the molten material can be melted. Since the low-temperature brazing material can be stored in the second step portion, even if the high-temperature brazing material or the low-temperature brazing material undergoes thermal expansion and contraction, the tensile stress of the translucent member can be reduced, and the crack of the translucent member can be reduced. And the occurrence of cracks or peeling at the interface between the translucent member and the low-temperature brazing material can be prevented.
【０００７】ここで、透光性部材の接合部の位置は、平
面視して基体の内側壁面から内側に透光性部材の２倍厚
み位置から、基体の貫通孔の部分を含み、基体の外側壁
面から外側に透光性部材の２倍厚み位置までの間にある
のがよい。これにより、金属製固定部材に接合する透光
性部材の接合部を、平面視して基体の壁面近くに位置さ
せることができ、金属製固定部材を大きくする必要がな
いので、光通信用パッケージの大型化を防止できる。Here, the position of the joint portion of the light-transmitting member includes the through-hole portion of the base from the position twice as thick as the light-transmitting member inside the inner wall surface of the base in plan view. It is preferable that the space be provided between the outer wall surface and the outer side up to a position twice as thick as the translucent member. Accordingly, the joining portion of the translucent member to be joined to the metal fixing member can be located near the wall surface of the base in plan view, and it is not necessary to increase the size of the metal fixing member. Can be prevented from becoming larger.
【０００８】また、透光性部材に設けられている環状メ
タライズパターンの外径は、透光性部材の外径に一致し
ているのがよい。これにより、透光性部材の端面には低
温ろう材の接合部を形成することなく、余剰のろう材の
回りこみを防止することができるので、透光性部材のク
ラックの発生や、透光性部材と低温ろう材の界面での亀
裂や剥がれ等の発生を防止することができる。[0008] The outer diameter of the annular metallized pattern provided on the translucent member is preferably equal to the outer diameter of the translucent member. As a result, it is possible to prevent surplus brazing material from entering the end surface of the translucent member without forming a joining portion of the low-temperature brazing material. Cracks and peeling at the interface between the conductive member and the low-temperature brazing material can be prevented.
【０００９】更に、透光性部材に設けられている環状メ
タライズパターンの外径は、透光性部材の外径より小さ
く、透光性部材の接合表面に非メタライズの引き下がり
部を有するのがよい。これにより、透光性部材の端面に
は低温ろう材の接合部を形成することなく、第２の段差
部からはみ出す低温ろう材を少なくして溜めることがで
き、余剰のろう材の回りこみを防止することができるの
で、透光性部材へのクラックの発生や、透光性部材と低
温ろう材の界面での亀裂や剥がれ等の発生を防止するこ
とができる。Further, the outer diameter of the annular metallized pattern provided on the translucent member is smaller than the outer diameter of the translucent member, and it is preferable that the joining surface of the translucent member has a non-metallized lowered portion. . Thereby, it is possible to reduce the amount of the low-temperature brazing material protruding from the second stepped portion without forming a joining portion of the low-temperature brazing material on the end face of the translucent member, and to prevent the surplus brazing material from entering. This can prevent the occurrence of cracks in the translucent member and the occurrence of cracks and peeling at the interface between the translucent member and the low-temperature brazing material.
【００１０】[0010]
【発明の実施の形態】続いて、添付した図面を参照しつ
つ、本発明を具体化した実施の形態について説明し、本
発明の理解に供する。ここに、図１（Ａ）、（Ｂ）はそ
れぞれ本発明の一実施の形態に係る光通信用パッケージ
の平面図、断面図、図２は同光通信用パッケージの金属
製固定部材の拡大断面図、図３（Ａ）、（Ｂ）はそれぞ
れ同光通信用パッケージの透光性部材の接合部の位置の
説明図、図４（Ａ）〜（Ｃ）はそれぞれ同光通信用パッ
ケージの透光性部材の環状メタライズパターンの説明図
である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. 1A and 1B are a plan view and a cross-sectional view of an optical communication package according to an embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view of a metal fixing member of the optical communication package. FIGS. 3 (A) and 3 (B) are explanatory views of the positions of the joining portions of the translucent members of the optical communication package, respectively, and FIGS. 4 (A) to 4 (C) are respectively the transparent diagrams of the optical communication package. It is explanatory drawing of the annular metallization pattern of an optical member.
【００１１】図１（Ａ）、（Ｂ）に示すように、本発明
の一実施の形態に係る光通信用パッケージ１０は、金属
製の枠体１１と、ボード等に取付けるための固定用孔１
２を備えた金属製の底板１３とをろう付け接合して、内
部に光通信用の半導体素子を搭載するためのキャビティ
部１４を形成する基体１５を有し、この基体１５の枠体
１１の一側壁部の両側に位置し、対向する壁部には、そ
れぞれキャビティ部１４に連通する窓枠状孔１６が設け
られている。各窓枠状孔１６には、導体パターン１８を
備えたセラミックからなるフィードスルー基板１９が嵌
入、ろう付け接合され、導体パターン１８は、枠体１１
の外側で外部接続端子１７とバタフライ型にろう付け接
合され、キャビティ部１４側で半導体素子とワイヤボン
ディング等を介して接続される。また、フィードスルー
基板１９が接合されていない枠体１１の一側壁部には、
キャビティ部１４に連通する貫通孔２０が穿孔され設け
られている。As shown in FIGS. 1A and 1B, an optical communication package 10 according to an embodiment of the present invention includes a metal frame 11 and a fixing hole for mounting on a board or the like. 1
And a metal bottom plate 13 having a base 2 for forming a cavity 14 for mounting a semiconductor element for optical communication therein. Window frame-like holes 16 communicating with the cavities 14 are provided in the opposing walls located on both sides of the one side wall. A feed-through board 19 made of ceramic having a conductor pattern 18 is fitted into each window frame-shaped hole 16 and brazed, and the conductor pattern 18 is attached to the frame 11.
Outside and the outside connection terminal 17 is joined in a butterfly shape to the external connection terminal 17 and connected to the semiconductor element on the cavity portion 14 side by wire bonding or the like. Further, on one side wall of the frame body 11 to which the feedthrough board 19 is not joined,
A through hole 20 communicating with the cavity portion 14 is provided by being perforated.
【００１２】図２に示すように、金属製固定部材２１
は、挿通孔２２の径が枠体１１に形成された貫通孔２０
の孔径より小さい大径孔２３から中径孔２４になる第１
の段差部２５を有し、更に、中径孔２４から小径孔２６
になる第２の段差部２７を有する。そして、この金属製
固定部材２１は、基体１５の枠体１１に形成された貫通
孔２０にＡｇ−Ｃｕろう等からなる高温ろう材３０で接
合固着される。なお、第２の段差部２７の深さは０．０
２ｍｍ以上を有する。As shown in FIG. 2, a metal fixing member 21 is provided.
Is a through hole 20 formed in the frame 11 with a diameter of the insertion hole 22.
From the large diameter hole 23 smaller than the hole diameter
And the small-diameter hole 26
Having a second step 27. The metal fixing member 21 is bonded and fixed to a through hole 20 formed in the frame 11 of the base 15 with a high-temperature brazing material 30 made of Ag-Cu brazing or the like. The depth of the second step 27 is 0.0
2 mm or more.
【００１３】一方、ガラスやサファイア等からなる透光
性部材２８は、外周部の端面が非メタライズ部となって
おり、接合表面（金属製固定部材２１にろう付けされる
側の面）にスパッタ等によって形成される環状メタライ
ズパターン２９を有する。そして、第２の段差部２７
と、透光性部材２８の接合表面に形成された環状メタラ
イズパターン２９とをＡｕ−ＳｎろうやＡｕ−Ｇｅろう
等からなる低温ろう材３１を介して接合する。この接合
において、溶融した低温ろう材３１を第２の段差部２７
に溜めることができ、透光性部材２８の端面と金属製固
定部材２１の大径孔２３の内側との間に空隙部３２を形
成することができる。この空隙部３２によって、枠体１
１と金属製固定部材２１を接合している高温ろう材３
０、及び低温ろう材３１に熱膨張、収縮による応力の集
中があっても、透光性部材２８のクラックの発生や、低
温ろう材３１と透光性部材２８との界面の亀裂や剥がれ
等の発生を防止することができる。On the other hand, the translucent member 28 made of glass, sapphire, or the like has a non-metallized portion at the outer peripheral end surface, and has a sputtered surface on the bonding surface (the surface brazed to the metal fixing member 21). And the like. Then, the second step portion 27
And the annular metallized pattern 29 formed on the bonding surface of the translucent member 28 are bonded via a low-temperature brazing material 31 made of Au-Sn brazing or Au-Ge brazing. In this joining, the molten low-temperature brazing material 31 is
The gap 32 can be formed between the end face of the light transmitting member 28 and the inside of the large-diameter hole 23 of the metal fixing member 21. The gap 32 allows the frame 1
High-temperature brazing material 3 joining metal fixing member 21 and metal fixing member 21
0, and even if stress occurs due to thermal expansion and contraction in the low-temperature brazing material 31, cracks in the translucent member 28, cracks and peeling at the interface between the low-temperature brazing material 31 and the translucent member 28, etc. Can be prevented from occurring.
【００１４】透光性部材２８の環状メタライズパターン
２９と金属製固定部材２１の第２の段差部２７との低温
ろう材３１による接合部の位置は、図３（Ａ）に示すよ
うに、平面視して基体１５の枠体１１のキャビティ部１
４側である内側壁面３３から内側に、金属製固定部材２
１ａに載置接合する透光性部材２８の厚みＡの２倍の距
離Ｂの位置、すなわち２倍厚み位置から、基体１５の枠
体１１の貫通孔２０の部分を含み、図３（Ｂ）に示すよ
うに、平面視して基体１５の枠体１１の外側壁面３４か
ら外側に、金属製固定部材２１ｂに載置接合する透光性
部材２８の厚みＡの２倍の距離Ｂの位置、すなわち２倍
厚み位置までの間にあることが好ましい。枠体１１と透
光性部材２８の位置関係がこの範囲内にあることで、透
光性部材２８の端面にメタライズパターンを形成するこ
となく、第２の段差部２７に低温ろう材３１を溜めるこ
とができ、空隙部３２を形成して透光性部材２８の端面
と金属製固定部材２１ａ、２１ｂとの間に低温ろう材３
１の接合部を形成しない効果が発揮でき、高温ろう材３
０及び低温ろう材３１に熱膨張、収縮が発生したとして
も透光性部材２８のクラックの発生や、透光性部材２８
と低温ろう材３１の界面での亀裂や剥がれ等の発生を防
止することができる。なお、金属製固定部材２１ａ、２
１ｂへの透光性部材２８の接合は、キャビティ部１４の
方向から、又は外側の方向から接合することができる。As shown in FIG. 3A, the position of the joint between the annular metallized pattern 29 of the translucent member 28 and the second step portion 27 of the metal fixing member 21 by the low-temperature brazing material 31 is plane. The cavity 1 of the frame 11 of the base 15
Inward from the inner wall surface 33 which is the fourth side,
FIG. 3 (B) includes the portion of the through hole 20 of the frame 11 of the base 15 from a position at a distance B that is twice the thickness A of the translucent member 28 to be placed and joined to 1a, that is, from the double thickness position. As shown in FIG. 5, a position at a distance B which is twice the thickness A of the translucent member 28 placed and joined to the metal fixing member 21b from the outer wall surface 34 of the frame 11 of the base 15 in a plan view, That is, it is preferable to be between the double thickness position. Since the positional relationship between the frame 11 and the translucent member 28 is within this range, the low-temperature brazing material 31 is stored in the second step 27 without forming a metallized pattern on the end surface of the translucent member 28. A low-temperature brazing material 3 is formed between the end face of the translucent member 28 and the metal fixing members 21a and 21b by forming a gap 32.
The effect of not forming the joint 1 can be exhibited, and the high-temperature brazing material 3
Even when thermal expansion and contraction occur in the low-temperature brazing material 31 and the low-temperature brazing material 31, cracks in the light-transmitting member 28 occur and the light-transmitting member 28
Cracks and peeling at the interface between the low-temperature brazing material 31 and the low-temperature brazing material 31 can be prevented. In addition, the metal fixing members 21a, 2
The joining of the translucent member 28 to 1b can be done from the direction of the cavity 14 or from the outside.
【００１５】図４（Ａ）に示す透光性部材２８ａのよう
に、外径が透光性部材２８ａの外径と実質的に一致し、
外径端面角部から表面部にかけて環状メタライズパター
ン２９ａを形成してもよい。また、図４（Ｂ）に示す透
光性部材２８ｂのように、外径が透光性部材２８ｂの外
径より小さく、外径端面角部から表面部にかけて非メタ
ライズの引き下がり部３５を設けて環状メタライズパタ
ーン２９ｂを形成することもできる。更に、図４（Ｃ）
に示すように、形状が半球面の透光性部材２８ｃの平面
側に環状メタライズパターン２９ｃを形成する場合もあ
る。As shown in FIG. 4A, the outer diameter substantially matches the outer diameter of the translucent member 28a.
An annular metallized pattern 29a may be formed from the outer diameter end face corner to the surface. Also, as in a light-transmitting member 28b shown in FIG. 4B, an outer diameter is smaller than the outer diameter of the light-transmitting member 28b, and a non-metallized pull-down portion 35 is provided from the outer diameter end face corner to the surface. An annular metallized pattern 29b can also be formed. Further, FIG.
As shown in FIG. 7, an annular metallized pattern 29c may be formed on the plane side of the translucent member 28c having a hemispherical shape.
【００１６】なお、Ａｇ−Ｃｕ等の高温ろう材３０の接
合面となる金属製の基体１５の表面には、通常Ｎｉめっ
きが、また、Ａｕ−ＳｎろうやＡｕ−Ｇｅろう等の低温
ろう材３１の接合面となる金属製固定部材２１の表面に
は、通常Ｎｉめっき及びＡｕめっきがそれぞれ施されて
いる。金属製固定部材２１に接合される透光性部材２８
の形状は、平板レンズ、半球面レンズ等のいずれでもよ
い。また、材質は、ホウケイ酸ガラス、サファイアガラ
ス等のいずれでも適用できる。Incidentally, the surface of the metallic base 15 which is the joining surface of the high-temperature brazing material 30 such as Ag-Cu is usually plated with Ni, and a low-temperature brazing material such as Au-Sn brazing or Au-Ge brazing. The surface of the metal fixing member 21 serving as the bonding surface of the base member 31 is usually plated with Ni and Au, respectively. Translucent member 28 bonded to metal fixing member 21
May be a flat lens, a hemispherical lens, or the like. The material may be any of borosilicate glass, sapphire glass and the like.
【００１７】また、基体は、アルミナ、ガラスセラミッ
ク、窒化アルミニウム等のセラミックグリーンシートを
用い、通常のセラミック積層パッケージ形成技術を用い
た方法により製造されたメタライズ印刷、積層、焼成を
行って所望の導体パターンを有する積層体を用いること
もできる。この場合、外部接続端子は、バタフライ型や
デュアルインライン型にろう付け接合される。また、基
体と金属製固定部材２１との接合は、基体にメタライズ
パターンを形成し、Ｎｉめっきを施した後、Ａｇ−Ｃｕ
ろう等の高温ろう材を用いてろう付け接合することで行
う。The substrate is made of a ceramic green sheet of alumina, glass ceramic, aluminum nitride, or the like, and is subjected to metallization printing, lamination, and sintering, which are manufactured by a method using an ordinary ceramic laminated package forming technique, to obtain a desired conductor. A laminate having a pattern can also be used. In this case, the external connection terminals are brazed to a butterfly type or a dual in-line type. The joining of the base and the metal fixing member 21 is performed by forming a metallized pattern on the base, applying Ni plating, and then performing Ag-Cu bonding.
This is performed by brazing using a high-temperature brazing material such as brazing.
【００１８】上述の光通信用パッケージ１０には、キャ
ビティ部１４内に光通信用の半導体素子が実装され、金
属製固定部材２１に光ファイバー３６がＹＡＧ等のレー
ザーを使用し溶接して取付けられた後、さらに、コバー
ル、４２アロイ等の金属やセラミック等で形成されるキ
ャップ（蓋体）をろう材、樹脂、ガラス等を用いて接合
し、キャビティ部１４を封止することで光通信用の半導
体デバイスとして使用する。In the above-mentioned optical communication package 10, a semiconductor element for optical communication is mounted in the cavity portion 14, and an optical fiber 36 is attached to the metal fixing member 21 by welding using a laser such as YAG. Thereafter, a cap (lid) formed of metal, ceramic, or the like such as Kovar or 42 alloy is further joined by using a brazing material, resin, glass, or the like, and the cavity portion 14 is sealed to thereby provide a cavity for optical communication. Used as a semiconductor device.
【００１９】次いで、本発明の一実施の形態に係る光通
信用パッケージ１０の製造工程を説明する。セラミック
と熱膨張係数が近似するコバール、４２アロイ等の金属
塊を切削したり、パイプ状となったコバール、４２アロ
イ等を輪切りにしてから押し曲げ、平面視して矩形状に
形成する枠体１１には、更に、この枠体１１の一側壁部
と隣接する位置に対向する壁部にそれぞれキャビティ部
１４に連通する実質的に矩形状からなる窓枠状孔１６
と、窓枠状孔１６が形成されていない枠体１１の一側壁
部にもキャビティ部１４に連通する実質的に円形からな
る貫通孔２０を形成する。一方、半導体素子からの発熱
を放熱するのに優れる銅タングステン等の金属板から形
成され、ボード等の取付け部材にねじで取付けるための
固定用孔１２を備えた底板１３を形成する。Next, the manufacturing process of the optical communication package 10 according to one embodiment of the present invention will be described. A frame body formed by cutting a metal lump such as Kovar or 42 alloy having a thermal expansion coefficient similar to that of ceramic, or by cutting a pipe-shaped Kovar or 42 alloy and cutting it into a circle, and then forming a rectangular shape in plan view. In addition, a window frame-like hole 16 having a substantially rectangular shape communicating with the cavity portion 14 is formed on a wall portion facing a position adjacent to one side wall portion of the frame body 11.
Then, a substantially circular through hole 20 communicating with the cavity portion 14 is also formed on one side wall portion of the frame body 11 where the window frame-shaped hole 16 is not formed. On the other hand, a bottom plate 13 formed of a metal plate such as copper tungsten which is excellent in radiating heat generated from the semiconductor element and having a fixing hole 12 for mounting to a mounting member such as a board with screws is formed.
【００２０】枠体１１と底板１３には、Ｎｉめっきを施
した後、接合部に例えば、Ａｇ−Ｃｕろう等の高温ろう
材を挟んで加熱し、ろう付け接合することで、内部に光
通信用のレーザーダイオード、発光ダイオード等の半導
体素子を搭載するためのキャビティ部１４を有する基体
１５を形成する。また、窓枠状孔１６にはセラミックか
らなるフィードスルー基板１９の導体パターン１８にＮ
ｉめっきを施した後、Ａｇ−Ｃｕろう等の高温ろう材を
接合部に挟んで加熱し、ろう付け接合する。After the Ni plating is applied to the frame 11 and the bottom plate 13, a high-temperature brazing material such as Ag-Cu brazing is sandwiched between the joints, and the joint is heated and brazed. A base 15 having a cavity portion 14 for mounting a semiconductor element such as a laser diode, a light emitting diode, or the like is formed. The window frame-shaped hole 16 has a conductor pattern 18 of a feedthrough substrate 19 made of ceramic.
After performing the i-plating, a high-temperature brazing material such as Ag-Cu brazing is sandwiched between the joints and heated to perform brazing.
【００２１】ここで、窓枠状孔１６に接合されるアルミ
ナ等のセラミックからなるフィードスルー基板１９は、
例えば、アルミナ粉末にマグネシア、シリカ、カルシア
等の焼結助剤を適当量加えた粉末に、ジオキシルフタレ
ート等の可塑剤と、アクリル樹脂等のバインダー及び、
トルエン、キシレン、アルコール類等の溶剤を加え、十
分に混練し、脱泡して粘度２０００〜４００００ｃｐｓ
のスラリーを作製し、ドクターブレード法等によって例
えば、厚み０．２５ｍｍのロール状のシートを形成し、
適当なサイズにカットした矩形状のシートから作製す
る。このセラミックグリーンシートにタングステンやモ
リブデン等の高融点金属で導体パターン１８を形成し、
各セラミックグリーンシートを積層した積層体を約１５
５０℃の還元雰囲気中でセラミックと高融点金属を同時
焼成して形成する。このフィードスルー基板１９には、
上述した窓枠状孔１６にフィードスルー基板１９を嵌め
込んでＡｇ−Ｃｕろう等の高温ろう材でろう付け接合す
るために、フィードスルー基板１９の窓枠状孔１６と当
接する外周部にメタライズパターンを形成し、また、枠
体１１の内側と外側の導通用となる導体パターン１８を
形成する。Here, the feed-through board 19 made of ceramic such as alumina bonded to the window frame-shaped hole 16 is
For example, magnesia, silica, a powder obtained by adding an appropriate amount of a sintering aid such as calcia, a plasticizer such as dioxyl phthalate, and a binder such as an acrylic resin,
Solvents such as toluene, xylene and alcohols are added, kneaded well, and defoamed to a viscosity of 2000 to 40000 cps.
Is prepared, and a roll-shaped sheet having a thickness of, for example, 0.25 mm is formed by a doctor blade method or the like.
It is made from a rectangular sheet cut to an appropriate size. A conductor pattern 18 is formed on this ceramic green sheet with a refractory metal such as tungsten or molybdenum,
Approximately 15 layers of laminated ceramic green sheets
A ceramic and a high melting point metal are simultaneously fired in a reducing atmosphere at 50 ° C. to form a film. This feed-through board 19 includes
In order to fit the feed-through board 19 into the above-described window frame-shaped hole 16 and braze and join it with a high-temperature brazing material such as Ag-Cu braze, a metallized outer peripheral portion of the feed-through board 19 that comes into contact with the window frame-shaped hole 16. A pattern is formed, and a conductive pattern 18 for conduction between the inside and the outside of the frame 11 is formed.
【００２２】枠体１１の外側での導体パターン１８に
は、外部接続端子１７をバタフライ型に当接し、Ａｇ−
Ｃｕろう等の高温ろう材を用いてろう付け接合する。ま
た、キャビティ部１４側での導体パターン１８は、半導
体素子とボンディングワイヤ等で接続するために用いら
れる。なお、上述のＡｇ−Ｃｕろう等の高温ろう材を用
いたろう付け接合は、各接合部分を一度に合わせて加熱
し接合する場合と、接合する部分を複数回に分けて加熱
し接合する場合がある。An external connection terminal 17 is abutted on the conductor pattern 18 outside the frame body 11 in a butterfly shape.
The brazing is performed using a high-temperature brazing material such as Cu brazing. The conductor pattern 18 on the side of the cavity 14 is used to connect to the semiconductor element by a bonding wire or the like. In addition, the brazing joining using a high-temperature brazing material such as the above-described Ag-Cu brazing includes a case where each joining portion is heated and joined together at a time, and a case where the joining portion is heated and joined in a plurality of times. is there.
【００２３】一方、フィードスルー基板１９が接合され
ていない枠体１１の一側壁部の貫通孔２０に接合するた
めの金属製固定部材２１は、先ず、コバール、４２アロ
イ等の金属塊から、外周部を枠体１１の一側壁部に形成
した貫通孔２０に挿入及び貫通孔２０周縁の枠体１１の
一側壁部に当接可能となるように切削加工等によって成
形する。併せて、大径孔２３から中径孔２４になる第１
の段差部２５、及び中径孔２４から小径孔２６になる第
２の段差部２７を有する挿通孔２２を形成する。なお、
透光性部材２８の接合部となる第１の段差部２５及び第
２の段差部２７の位置は、平面視して枠体１１の貫通孔
２０の部分を含み、枠体１１の内側壁面から内側に透光
性部材２８の２倍厚み位置から、枠体１１の外側壁面か
ら外側に透光性部材２８の２倍厚み位置までの間に接合
できるように切削加工等で形成するのがよい。次いで、
金属製固定部材２１は、枠体１１にＡｇ−Ｃｕろう等の
高温ろう材３０を用いてろう付け接合する。その後、フ
ィードスルー基板１９、外部接続端子１７及び金属製固
定部材２１が接合された基体１５の金属部分には、Ｎｉ
めっき及びＡｕめっきを施す。On the other hand, the metal fixing member 21 to be joined to the through hole 20 in one side wall of the frame body 11 to which the feed-through board 19 is not joined is first formed from a metal lump such as Kovar or 42 alloy. The portion is inserted into the through hole 20 formed in one side wall of the frame body 11 and formed by cutting or the like so as to be able to contact the one side wall of the frame body 11 around the through hole 20. At the same time, the first hole 23 is changed from the large hole 23 to the medium hole 24.
Is formed, and the insertion hole 22 having the second step portion 27 which becomes the small diameter hole 26 from the medium diameter hole 24 is formed. In addition,
The positions of the first stepped portion 25 and the second stepped portion 27 which are the joining portions of the translucent member 28 include the through hole 20 of the frame 11 in plan view and It is preferable to form by cutting or the like so that it can be joined from the double-thickness position of the light-transmitting member 28 on the inside to the double-thickness position of the light-transmitting member 28 from the outer wall surface of the frame 11 to the outside. . Then
The metal fixing member 21 is brazed to the frame 11 using a high-temperature brazing material 30 such as Ag-Cu brazing. Thereafter, the metal portion of the base 15 to which the feed-through substrate 19, the external connection terminal 17, and the metal fixing member 21 are bonded is Ni
Plating and Au plating are performed.
【００２４】次いで、金属製固定部材２１に接合する透
光性部材２８は、ホウケイ酸ガラスやサファイア等のガ
ラス板や、半球面形状のレンズ等からなり、金属製固定
部材２１との接合面に、例えば、チタン−ニッケル−金
の３層の積層体からなるメタライズパターンをスパッタ
リング法や蒸着法やイオンプレーティング法等の方法で
形成する。この形成においては、透光性部材２８の外周
部端面にはメタライズパターンを形成することなく、透
光性部材２８の接合表面に環状メタライズパターン２９
を形成する。なお、環状メタライズパターン２９の外径
は、透光性部材２８の外径より小さく、透光性部材２８
の接合表面に非メタライズの引き下がり部３５を備えて
形成するのがよい。Next, the translucent member 28 to be joined to the metal fixing member 21 is made of a glass plate such as borosilicate glass or sapphire, a hemispherical lens, or the like. For example, a metallized pattern composed of a laminate of three layers of titanium-nickel-gold is formed by a method such as a sputtering method, a vapor deposition method, or an ion plating method. In this formation, the metallized pattern is not formed on the outer peripheral end face of the translucent member 28, and the annular metallized pattern 29 is formed on the joining surface of the translucent member 28.
To form The outer diameter of the annular metallized pattern 29 is smaller than the outer diameter of the translucent member 28,
Is preferably provided with a non-metallized pull-down portion 35 on the bonding surface.
【００２５】次に、金属製固定部材２１の第２の段差部
２７に、Ａｕ−ＳｎろうやＡｕ−Ｇｅろう等からなるリ
ング状の低温ろう材３１を載置し、透光性部材２８の環
状メタライズパターン２９と当接させ、適当な圧力を加
えながら加熱することで低温ろう材３１を溶融させ、第
２の段差部２７に透光性部材２８を低温ろう材３１を介
して接合する。この接合においては、第１の段差部２５
及び第２の段差部２７によって透光性部材２８が安定し
て載置でき、例え低温ろう材３１が加熱溶融によって流
れ出したとしても、第２の段差部２７に適正なろう溜ま
りを作ることができるので、透光性部材２８の端面と金
属製固定部材２１との間に低温ろう材３１が流れ出すこ
となく、空隙部３２を作ることができる。Next, a ring-shaped low-temperature brazing material 31 made of Au-Sn brazing or Au-Ge brazing is placed on the second step 27 of the metal fixing member 21, The low-temperature brazing material 31 is melted by being brought into contact with the annular metallized pattern 29 and heated while applying an appropriate pressure, and the translucent member 28 is joined to the second step 27 via the low-temperature brazing material 31. In this bonding, the first step 25
Also, the translucent member 28 can be stably placed by the second step portion 27, and even if the low-temperature brazing material 31 flows out by heating and melting, it is possible to form an appropriate solder pool in the second step portion 27. As a result, the gap 32 can be formed without the low-temperature brazing material 31 flowing out between the end face of the translucent member 28 and the metal fixing member 21.
【００２６】なお、基体をセラミックで形成する場合に
は、上述のセラミックグリーンシートの製造方法で製作
したセラミックグリーンシートにタングステンやモリブ
デン等の高融点金属でワイヤボンドパッド等のメタライ
ズパターンをスクリーン印刷で形成し、キャビティ部や
貫通孔が得られるように所望箇所を穿設して各セラミッ
クグリーンシートを積層し、外形部を切断して積層体と
し、更に、キャビティ部に連通する貫通孔の形成された
側壁や、外部接続端子を接合する部分にメタライズパタ
ーンをスクリーン印刷で形成し、約１５５０℃の還元雰
囲気中でセラミックと高融点金属を同時焼成して形成す
る。そして、基体のメタライズパターンにＮｉめっきを
施した後、外部接続端子をＡｇ−Ｃｕろう等の高温ろう
材を用いてデュアルインライン型やバタフライ型に接合
する。また、併せて金属製固定部材２１をＡｇ−Ｃｕろ
う等の高温ろう材で貫通孔に接合する。When the substrate is formed of ceramic, a metallized pattern such as a wire bond pad is screen-printed on a ceramic green sheet manufactured by the above-described method for manufacturing a ceramic green sheet using a refractory metal such as tungsten or molybdenum. The ceramic green sheets are formed by laminating desired portions so as to obtain a cavity portion and a through hole, and the outer portion is cut into a laminated body, and further, a through hole communicating with the cavity portion is formed. A metallized pattern is formed by screen printing on the side wall and the portion where the external connection terminals are to be joined, and is formed by simultaneously firing ceramic and a high melting point metal in a reducing atmosphere at about 1550 ° C. Then, after Ni plating is applied to the metallized pattern of the base, the external connection terminals are joined in a dual in-line type or a butterfly type using a high-temperature brazing material such as Ag-Cu brazing. At the same time, the metal fixing member 21 is joined to the through hole with a high-temperature brazing material such as Ag-Cu brazing.
【００２７】[0027]
【発明の効果】請求項１〜４記載の光通信用パッケージ
は、透光性部材の外周部の端面が非メタライズ部となっ
て、接合表面に環状メタライズパターンを有し、しかも
金属製固定部材は挿通孔が貫通孔の孔径より小さい大径
孔から中径孔になる第１の段差部を有し、更に中径孔か
ら小径孔になる第２の段差部を有すると共に、第２の段
差部と透光性部材の環状メタライズパターンが低温ろう
材を介して接合されているので、低温ろう材の外周部端
面での接合はなく、第２の段差部に溶融前の低温ろう材
を落とし込んでセットすることができ、溶融した低温ろ
う材を第２の段差部に溜めることができ、高温ろう材や
低温ろう材に熱膨張、収縮が発生したとしても透光性部
材の引張り応力を緩和でき、透光性部材のクラックの発
生や、透光性部材と低温ろう材の界面での亀裂や剥がれ
等の発生を防止することができ、気密信頼性を備える。According to the optical communication package of the present invention, the end face of the outer peripheral portion of the light-transmitting member has a non-metallized portion, has an annular metallized pattern on the joining surface, and has a metal fixing member. Has a first step portion in which the insertion hole is smaller in diameter from a large hole to a medium hole, and further has a second step portion in which the insertion hole is smaller in diameter from the medium hole, and has a second step portion. Since the low-temperature brazing material and the annular metallized pattern of the translucent member are joined via the low-temperature brazing material, there is no joining at the outer peripheral end face of the low-temperature brazing material, and the low-temperature brazing material before melting is dropped into the second step portion. The molten low-temperature brazing material can be stored in the second step, and even if thermal expansion or contraction occurs in the high-temperature brazing material or low-temperature brazing material, the tensile stress of the translucent member is reduced. Cracks in the light-transmitting member It is possible to prevent the occurrence of cracks or peeling at the interface between the low-temperature brazing material, comprising an airtight reliability.
【００２８】特に、請求項２記載の光通信用パッケージ
は、透光性部材の接合部の位置は、平面視して基体の内
側壁面から内側に透光性部材の２倍厚み位置から、基体
の貫通孔の部分を含み、基体の外側壁面から外側に透光
性部材の２倍厚み位置までの間にあるので、金属製固定
部材に接合する透光性部材の接合部を、平面視して基体
の壁面近傍にすることができ、金属製固定部材を大きく
する必要がなく、光通信用パッケージの大型化を防止で
きる。[0028] In particular, in the optical communication package according to the second aspect, the position of the joining portion of the translucent member may be from the inner wall surface of the substrate in a plan view and inward from the position twice as thick as the translucent member. The through-hole portion is located between the outer wall surface of the base and the outside to the position twice as thick as the translucent member, so that the joint portion of the translucent member to be joined to the metal fixing member is viewed in plan. As a result, it is not necessary to increase the size of the metal fixing member, and it is possible to prevent the optical communication package from increasing in size.
【００２９】また、請求項３記載の光通信用パッケージ
は、透光性部材に設けられている環状メタライズパター
ンの外径が、透光性部材の外径に一致しているので、透
光性部材の端面には低温ろう材の接合部を形成すること
なく、余剰のろう材の回りこみを防止することができ、
透光性部材のクラックの発生や、透光性部材と低温ろう
材の界面での亀裂や剥がれ等の発生を防止することがで
きる。In the optical communication package according to the third aspect, the outer diameter of the annular metallized pattern provided on the translucent member matches the outer diameter of the translucent member. Without forming a joint of low-temperature brazing material on the end face of the member, surplus brazing material can be prevented from wrapping around,
It is possible to prevent the occurrence of cracks in the light-transmitting member and the occurrence of cracks or peeling at the interface between the light-transmitting member and the low-temperature brazing material.
【００３０】更に、請求項４記載の光通信用パッケージ
は、透光性部材に設けられている環状メタライズパター
ンの外径が、透光性部材の外径より小さく、透光性部材
の接合表面に非メタライズの引き下がり部を有するの
で、透光性部材の端面には低温ろう材の接合部を形成す
ることなく、第２の段差部からはみ出す低温ろう材を少
なくして溜めることができ、余剰のろう材の回りこみを
防止することができることで、透光性部材へのクラック
の発生や、透光性部材と低温ろう材の界面での亀裂や剥
がれ等の発生を防止することができる。Further, in the optical communication package according to the fourth aspect, the outer diameter of the annular metallized pattern provided on the translucent member is smaller than the outer diameter of the translucent member, and the bonding surface of the translucent member is formed. Since the low-temperature brazing material protruding from the second step portion can be reduced and accumulated without forming a joining portion of the low-temperature brazing material on the end surface of the light-transmitting member, By preventing the brazing material from wrapping around, it is possible to prevent cracks in the translucent member and cracks and peeling at the interface between the translucent member and the low-temperature brazing material.
【図１】（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形
態に係る光通信用パッケージの平面図、断面図である。FIGS. 1A and 1B are a plan view and a cross-sectional view, respectively, of an optical communication package according to an embodiment of the present invention.
【図２】同光通信用パッケージの金属製固定部材の拡大
断面図である。FIG. 2 is an enlarged sectional view of a metal fixing member of the optical communication package.
【図３】（Ａ）、（Ｂ）はそれぞれ同光通信用パッケー
ジの透光性部材の接合部の位置の説明図である。FIGS. 3A and 3B are explanatory diagrams each showing a position of a bonding portion of a translucent member of the optical communication package. FIGS.
【図４】（Ａ）〜（Ｃ）はそれぞれ同光通信用パッケー
ジの透光性部材の環状メタライズパターンの説明図であ
る。FIGS. 4A to 4C are explanatory views of an annular metallized pattern of a translucent member of the optical communication package.
【図５】従来の光通信用パッケージの斜視図である。FIG. 5 is a perspective view of a conventional optical communication package.
【図６】従来の光通信用パッケージの透光性部材の断面
図である。FIG. 6 is a cross-sectional view of a light transmitting member of a conventional optical communication package.
１０：光通信用パッケージ、１１：枠体、１２：固定用
孔、１３：底板、１４：キャビティ部、１５：基体、１
６：窓枠状孔、１７：外部接続端子、１８：導体パター
ン、１９：フィードスルー基板、２０：貫通孔、２１、
２１ａ、２１ｂ：金属製固定部材、２２：挿通孔、２
３：大径孔、２４：中径孔、２５：第１の段差部、２
６：小径孔、２７：第２の段差部、２８、２８ａ、２８
ｂ、２８ｃ：透光性部材、２９、２９ａ、２９ｂ、２９
ｃ：環状メタライズパターン、３０：高温ろう材、３
１：低温ろう材、３２：空隙部、３３：内側壁面、３
４：外側壁面、３５引き下がり部、３６：光ファイバー10: package for optical communication, 11: frame, 12: fixing hole, 13: bottom plate, 14: cavity, 15: base, 1
6: window frame-shaped hole, 17: external connection terminal, 18: conductor pattern, 19: feed-through board, 20: through hole, 21,
21a, 21b: metal fixing member, 22: insertion hole, 2
3: large diameter hole, 24: medium diameter hole, 25: first step portion, 2
6: small-diameter hole, 27: second step portion, 28, 28a, 28
b, 28c: translucent member, 29, 29a, 29b, 29
c: annular metallized pattern, 30: high-temperature brazing material, 3
1: low temperature brazing material, 32: void, 33: inner wall surface, 3
4: Outer wall surface, 35 lowered portion, 36: Optical fiber
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2H037 BA02 BA11 DA03 DA04 DA06 DA36 DA39 5F073 AB28 FA07 ────────────────────────────────────────────────── ─── Continued on the front page F-term (reference) 2H037 BA02 BA11 DA03 DA04 DA06 DA36 DA39 5F073 AB28 FA07
Claims (4)
ためのキャビティ部を形成する基体の一側壁部に穿孔さ
れ、しかも該キャビティ部に連通する貫通孔に挿入し、
高温ろう材で固着された金属製固定部材の挿通孔中に、
光ファイバーの先端と対向させるための透光性部材が設
けられた光通信用パッケージにおいて、前記透光性部材
の外周部の端面は非メタライズ部となって、接合表面に
環状メタライズパターンを有し、しかも前記金属製固定
部材は前記挿通孔が前記貫通孔の孔径より小さい大径孔
から中径孔になる第１の段差部を有し、更に前記中径孔
から小径孔になる第２の段差部を有すると共に、該第２
の段差部と前記透光性部材の環状メタライズパターンが
低温ろう材を介して接合されていることを特徴とする光
通信用パッケージ。1. A hole formed in a side wall of a base forming a cavity for mounting a semiconductor element for optical communication therein, and inserted into a through hole communicating with the cavity.
In the insertion hole of the metal fixing member fixed with high-temperature brazing material,
In an optical communication package provided with a translucent member for facing the tip of the optical fiber, an end surface of an outer peripheral portion of the translucent member is a non-metallized portion, and has an annular metallized pattern on a bonding surface, Moreover, the metal fixing member has a first step portion in which the insertion hole is changed from a large diameter hole to a medium diameter hole smaller than the hole diameter of the through hole, and further, a second step portion is formed from the medium diameter hole to a small diameter hole. And the second
An optical communication package characterized in that the stepped portion of (1) and the annular metallized pattern of the translucent member are joined via a low-temperature brazing material.
いて、前記透光性部材の接合部の位置は、平面視して前
記基体の内側壁面から内側に前記透光性部材の２倍厚み
位置から、前記基体の前記貫通孔の部分を含み、前記基
体の外側壁面から外側に前記透光性部材の２倍厚み位置
までの間にあることを特徴とする光通信用パッケージ。2. The optical communication package according to claim 1, wherein a position of the joining portion of the light-transmitting member is twice as thick as that of the light-transmitting member inward from an inner wall surface of the base in plan view. And an optical communication package including a portion of the through hole of the base and extending from an outer wall surface of the base to a position twice as thick as the translucent member.
ジにおいて、前記透光性部材に設けられている前記環状
メタライズパターンの外径は、前記透光性部材の外径に
一致していることを特徴とする光通信用パッケージ。3. The optical communication package according to claim 1, wherein an outer diameter of the annular metallized pattern provided on the translucent member matches an outer diameter of the translucent member. An optical communication package, characterized in that:
ジにおいて、前記透光性部材に設けられている前記環状
メタライズパターンの外径は、前記透光性部材の外径よ
り小さく、前記透光性部材の接合表面に非メタライズの
引き下がり部を有することを特徴とする光通信用パッケ
ージ。4. The optical communication package according to claim 1, wherein an outer diameter of the annular metallized pattern provided on the translucent member is smaller than an outer diameter of the translucent member. An optical communication package having a non-metallized pull-down portion on a bonding surface of an optical member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001112661A JP2002311303A (en) | 2001-04-11 | 2001-04-11 | Package for optical communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001112661A JP2002311303A (en) | 2001-04-11 | 2001-04-11 | Package for optical communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002311303A true JP2002311303A (en) | 2002-10-23 |
Family
ID=18964036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001112661A Pending JP2002311303A (en) | 2001-04-11 | 2001-04-11 | Package for optical communication |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002311303A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010135767A (en) * | 2008-10-30 | 2010-06-17 | Kyocera Corp | Optical semiconductor element-storing package and optical semiconductor device |
| JP2019145762A (en) * | 2017-07-27 | 2019-08-29 | 京セラ株式会社 | Lid body for optical device and optical device |
| JP2020150184A (en) * | 2019-03-14 | 2020-09-17 | 日亜化学工業株式会社 | Laser device and lid used therefor |
-
2001
- 2001-04-11 JP JP2001112661A patent/JP2002311303A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010135767A (en) * | 2008-10-30 | 2010-06-17 | Kyocera Corp | Optical semiconductor element-storing package and optical semiconductor device |
| JP2019145762A (en) * | 2017-07-27 | 2019-08-29 | 京セラ株式会社 | Lid body for optical device and optical device |
| JP7023809B2 (en) | 2017-07-27 | 2022-02-22 | 京セラ株式会社 | Optical device lid and optical device |
| JP2020150184A (en) * | 2019-03-14 | 2020-09-17 | 日亜化学工業株式会社 | Laser device and lid used therefor |
| JP7271243B2 (en) | 2019-03-14 | 2023-05-11 | 日亜化学工業株式会社 | Laser device and lid used therefor |
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