JP2002299694A - Led light-source device for illumination and illuminator - Google Patents

Led light-source device for illumination and illuminator

Info

Publication number
JP2002299694A
JP2002299694A JP2001096197A JP2001096197A JP2002299694A JP 2002299694 A JP2002299694 A JP 2002299694A JP 2001096197 A JP2001096197 A JP 2001096197A JP 2001096197 A JP2001096197 A JP 2001096197A JP 2002299694 A JP2002299694 A JP 2002299694A
Authority
JP
Japan
Prior art keywords
led
metal substrate
source device
light source
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001096197A
Other languages
Japanese (ja)
Inventor
Kenichi Yamada
健一 山田
Kenichi Ishii
健一 石井
Yasuo Imai
康雄 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Lighting Corp
Original Assignee
Mitsubishi Electric Lighting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Lighting Corp filed Critical Mitsubishi Electric Lighting Corp
Priority to JP2001096197A priority Critical patent/JP2002299694A/en
Publication of JP2002299694A publication Critical patent/JP2002299694A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain an LED light-source device for illumination in which a temperature rise is suppressed even if integration at high density is performed, and from which high optical output power and efficient as well as uniform surface emission of light are obtained, and an illuminator using the same. SOLUTION: This LED light-source device comprises a metal substrate 1 having a reflector function, a plurality of LED chips 2, each die-bonded on the metal substrate 1 via an electrical insulator, a transparent resin layer 5 that covers the LED chips 2 and the metal substrate 1, and fluorescent material mixed in the transparent resin layer 5.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は、照明用ＬＥＤ光
源デバイス及び照明器具に係り、特に、高出力の照明用
ＬＥＤ光源デバイス及び照明器具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting LED light source device and a lighting fixture, and more particularly to a high-output lighting LED light source device and a lighting fixture.

【０００２】[0002]

【従来の技術】図８は例えば特登２７７７２１６６号公
報に示された従来のＬＥＤ光源装置（従来例１）の斜視
図、９は断面図である。図８、９において２１は基板、
２２は基板２１上に形成された反射率の高い２本の白色
樹脂部、２３は透明樹脂部、２４はＬＥＤチップであ
り、ＬＥＤチップ２４は、基板２１のパターン部２５、
２６にワイヤーボンディングされている。白色樹脂部２
２は、透明樹脂に白色の染料を合成したものである。２
本の白色樹脂部２２は、ＬＥＤチップ２４の両側に近接
して、断面が半楕円状に形成されている。2. Description of the Related Art FIG. 8 is a perspective view of a conventional LED light source device (conventional example 1) disclosed in Japanese Patent Publication No. 27772166, for example, and FIG. 9 is a sectional view. 8 and 9, 21 is a substrate,
Reference numeral 22 denotes two white resin portions having high reflectivity formed on the substrate 21, 23 denotes a transparent resin portion, 24 denotes an LED chip, and the LED chip 24 includes a pattern portion 25 of the substrate 21.
26 is wire-bonded. White resin part 2
No. 2 is obtained by synthesizing a white dye on a transparent resin. 2
The white resin part 22 of the book is formed in a semi-elliptical cross section near both sides of the LED chip 24.

【０００３】このような構成により、ＬＥＤチップ２４
に電流を流すと発光し発した光は、透明樹脂部２３を介
して上方へ照射するとともに、白色樹脂部２２で反射し
た光もまた透明樹脂部２３を介して上方へ照射する。そ
して、ＬＥＤチップ２４近傍に白色樹脂部２を設けたの
で光反射距離が小さくなり、光反射効率が向上する。With such a configuration, the LED chip 24
The light emitted and emitted when an electric current flows through the transparent resin portion 23 irradiates upward through the transparent resin portion 23, and the light reflected by the white resin portion 22 also irradiates upward through the transparent resin portion 23. Since the white resin portion 2 is provided near the LED chip 24, the light reflection distance is reduced, and the light reflection efficiency is improved.

【０００４】また、図１０は実開昭６１−５６７１２号
公報に示された従来のＬＥＤ灯具（従来例２）である。
図において３１は金属基板であり、底部３１ａに回路パ
ターンを設け、ＬＥＤランプ３２のリードフレームの先
端折曲部３２ａが電気的に接続され、両側璧３１ｂを反
射面としている。３６はレンズである。このような構成
により、金属基板３１がリフレクタを兼ねており、ま
た、放熱効果が大きいため、明るさの減少を未然に防止
することができる。FIG. 10 shows a conventional LED lamp (conventional example 2) disclosed in Japanese Utility Model Laid-Open No. 61-56712.
In the figure, reference numeral 31 denotes a metal substrate, a circuit pattern is provided on a bottom portion 31a, a bent end portion 32a of a lead frame of the LED lamp 32 is electrically connected, and both side walls 31b are reflection surfaces. 36 is a lens. With such a configuration, since the metal substrate 31 also functions as a reflector and has a large heat radiation effect, it is possible to prevent a decrease in brightness.

【０００５】また、図１１は特開平１０−２６９８２２
号公報に示された従来の面状光源（従来例３）である。
図において、４１は面状光源はアクリル板の裏面に拡散
パターンを印刷した導光板、４２は白色ポリカーボネー
ト支持体４３に支持された複数の青色ＬＥＤ（ラン
プ）、４４はＬＥＤ４２の発光により励起されて蛍光を
発する蛍光物質が設けられた波長変換体であり、青色Ｌ
ＥＤランプ４２と波長変換体４４は光源部を構成する。
このような構成により、光源部からＬＥＤ４２と波長変
換体４４からの合成光が導光板４１の端部から入光し、
導光板４１の表面において面状光源が得られる。なお、
ＬＥＤ４２からの発光が蛍光物質により効率的に波長変
換されるため、蛍光物質の種類（や含有量）に応じて白
色を含めた任意の発光色が可能となる。[0005] FIG. 11 is a Japanese Patent Application Laid-Open No. 10-269822.
This is a conventional planar light source (conventional example 3) disclosed in Japanese Patent Application Laid-Open No. H10-209,837.
In the figure, reference numeral 41 denotes a planar light source, a light guide plate having a diffusion pattern printed on the back surface of an acrylic plate, reference numeral 42 denotes a plurality of blue LEDs (lamps) supported by a white polycarbonate support 43, and reference numeral 44 denotes a light source which is excited by light emission of the LEDs 42. It is a wavelength converter provided with a fluorescent substance that emits fluorescence.
The ED lamp 42 and the wavelength converter 44 constitute a light source unit.
With such a configuration, combined light from the LED 42 and the wavelength converter 44 from the light source unit enters from the end of the light guide plate 41,
A planar light source is obtained on the surface of the light guide plate 41. In addition,
Since the wavelength of the light emitted from the LED 42 is efficiently converted by the fluorescent substance, an arbitrary luminescent color including white can be obtained according to the type (or content) of the fluorescent substance.

【０００６】[0006]

【発明が解決しようとする課題】しかしながら、上述の
従来例１〜３に示した従来のＬＥＤ光源装置、灯具、面
状光源では、ＬＥＤチップ２４やＬＥＤランプ３２、４
２の１個あたりの光出力が弱いため、照明用ＬＥＤ光源
を目的とした場合、集積度を高めて高光出力化を図る必
要があるが、ＬＥＤチップ２４やＬＥＤランプ３２、４
２を構造上を集積しにくいという問題があった。However, in the conventional LED light source devices, lamps, and planar light sources shown in the above-mentioned conventional examples 1 to 3, the LED chip 24, the LED lamps 32,
Since the light output per LED is weak, it is necessary to increase the degree of integration to increase the light output when the LED light source for illumination is used.
2 has a problem that it is difficult to accumulate it on the structure.

【０００７】また、従来例２に示した従来のＬＥＤ光源
装置では、リードフレームを設けたＬＥＤランプ（砲弾
型ＬＥＤ）３２を放熱特性の優れた金属基板３１に装着
しても、リードフレーム部からの熱移動のみであり、Ｌ
ＥＤチップ自身の大きな放熱効果は得られなく、また、
組立時にＬＥＤランプ３２を各々接続しなければならな
いという問題があった。In the conventional LED light source device shown in Conventional Example 2, even if an LED lamp (cannonball-type LED) 32 provided with a lead frame is mounted on a metal substrate 31 having excellent heat dissipation characteristics, the lead frame portion can be used. Heat transfer only, L
The large heat dissipation effect of the ED chip itself cannot be obtained.
There is a problem that the LED lamps 32 must be connected at the time of assembly.

【０００８】また、従来例３に示した従来の面状光源で
は、波長変換体４４の蛍光物質に到達した光は波長変換
されて蛍光物質から発光するが、到達した光の一部は蛍
光物質表面でＬＥＤランプ４２側に反射され、総合的な
効率を低下させる。また、組立時にＬＥＤランプ４２を
各々接続しなければならないという問題があった。In the conventional planar light source shown in Conventional Example 3, light reaching the fluorescent substance of the wavelength converter 44 is wavelength-converted and emitted from the fluorescent substance. The light is reflected by the surface toward the LED lamp 42, thereby lowering the overall efficiency. There is also a problem that the LED lamps 42 must be connected at the time of assembly.

【０００９】この発明は上記のような問題点を解消する
ためになされたもので、高密度で、集積させても温度上
昇が抑えられ、高光出力化を図り、また、発光面から効
率よく、均一な面発光得ることができ、さらに、紫外線
の放出を防止できる照明用ＬＥＤ光源デバイス及び照明
器具を得ることを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has a high density, suppresses a temperature rise even when integrated, achieves a high light output, and efficiently emits light from a light emitting surface. It is an object of the present invention to provide an LED light source device for lighting and a lighting fixture capable of obtaining uniform surface light emission and preventing emission of ultraviolet rays.

【００１０】[0010]

【課題を解決するための手段】この発明に係わる照明用
ＬＥＤ光源デバイスは、反射機能を有する金属基板と、
この金属基板に電気絶縁物を介してダイボンデイングさ
れた複数個のＬＥＤチップと、このＬＥＤチップと前記
金属基板を覆う透明樹脂層と、この透明樹脂層に混入さ
れた蛍光体とを備える。An LED light source device for illumination according to the present invention comprises: a metal substrate having a reflection function;
A plurality of LED chips die-bonded to the metal substrate via an electrical insulator, a transparent resin layer covering the LED chips and the metal substrate, and a phosphor mixed in the transparent resin layer.

【００１１】また、反射機能を有する金属基板と、この
金属基板に電気絶縁物を介してダイボンデイングされた
複数個のＬＥＤチップと、このＬＥＤチップと前記金属
基板を覆う透明樹脂層と、この透明樹脂層を覆う蛍光体
膜とを備える。A metal substrate having a reflecting function, a plurality of LED chips die-bonded to the metal substrate via an electrical insulator, a transparent resin layer covering the LED chip and the metal substrate, A phosphor film covering the resin layer.

【００１２】また、金属基板はＬＥＤチップが挿入され
る凹部を有し、前記ＬＥＤチップの表面と前記金属基板
の表面とが同一になるようにしたものである。Further, the metal substrate has a concave portion into which the LED chip is inserted, and the surface of the LED chip and the surface of the metal substrate are the same.

【００１３】また、透明樹脂層の表面を平面にしたもの
である。Further, the surface of the transparent resin layer is made flat.

【００１４】また、透明樹脂層の表面を、各々のＬＥＤ
チップを中心とする略半球形状にしたものである。In addition, the surface of the transparent resin layer is
It has a substantially hemispherical shape with the chip at the center.

【００１５】また、紫外線をカットする紫外線カット透
明部材を備える。[0015] Further, an ultraviolet cut transparent member for cutting ultraviolet light is provided.

【００１６】また、ＬＥＤチップをフリップ型としたも
のである。Further, the LED chip is of a flip type.

【００１７】また、この発明に係る照明器具は、請求項
１〜７記載のいずれかに記載の照明用ＬＥＤ光源デバイ
スを使用したものである。A lighting fixture according to the present invention uses the LED light source device for lighting according to any one of claims 1 to 7.

【００１８】[0018]

【発明の実施の形態】実施の形態１．図１はこの発明に
係る実施の形態１を示す照明用ＬＥＤ光源デバイスの斜
視図、図２は図１の断面図である。図において、１は反
射機能を有する金属基板であり、絶縁層を兼ねた放熱特
性の良好な金属を基材とする基板に白色等の高反射材料
が塗布されているか、あるいは、鏡面仕上げが行われて
いる。金属基板１には複数個のＬＥＤチップ２がダイボ
ンデイングされ、金線３でワイヤーボンデイングして実
装されており、その周囲に蛍光体４を含有した透明樹脂
層５が一体的にモールドされており、表面は平面であ
る。６は透明樹脂層５の表面に設けられ、ＬＥＤ２から
発光した紫外線を遮断する紫外線カット透光部材、６ａ
は発光面、１０は照明用ＬＥＤ光源デバイスである。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a perspective view of an LED light source device for illumination showing a first embodiment according to the present invention, and FIG. 2 is a sectional view of FIG. In the figure, reference numeral 1 denotes a metal substrate having a reflection function, and a highly reflective material such as white is applied to a substrate made of a metal having good heat dissipation properties also serving as an insulating layer, or mirror-finished. Have been done. A plurality of LED chips 2 are die-bonded on a metal substrate 1 and mounted by wire bonding with gold wires 3, and a transparent resin layer 5 containing a phosphor 4 is integrally molded therearound. , The surface is plane. Reference numeral 6 denotes an ultraviolet-cut light-transmitting member provided on the surface of the transparent resin layer 5 to block ultraviolet light emitted from the LED 2;
Denotes a light emitting surface, and 10 denotes an LED light source device for illumination.

【００１９】次に、動作を説明する。ＬＥＤチップ２に
電流を流すと、ＬＥＤチップ２は可視光あるいは紫外線
を発光する。この光のうち直接透明樹脂層５の方向に放
射された光により、透明樹脂層５に含有する蛍光体４が
励起されて可視光を発光する。このとき、可視光は蛍光
体４により拡散され紫外線カット透光部材６の発光面６
ａから均一に照射される。そして、この可視光は紫外線
カット透光部材６から放射される。紫外線は紫外線カッ
ト透光部材６により遮断されるため、外部には漏れな
い。また、蛍光体４に到達した光の一部は蛍光体４の表
面で反射され、反射材塗布金属基板１に到達するが、こ
の反射光を金属基板１で前方に反射させ、発光面６ａか
ら効率よく外部に光を放射する。Next, the operation will be described. When a current is applied to the LED chip 2, the LED chip 2 emits visible light or ultraviolet light. Of the light, the phosphor 4 contained in the transparent resin layer 5 is excited by the light directly emitted in the direction of the transparent resin layer 5 to emit visible light. At this time, the visible light is diffused by the phosphor 4 and the light emitting surface 6
Irradiated uniformly from a. Then, this visible light is radiated from the ultraviolet cut light transmitting member 6. The ultraviolet rays are blocked by the ultraviolet ray cut translucent member 6 and do not leak to the outside. A part of the light that has reached the phosphor 4 is reflected on the surface of the phosphor 4 and reaches the reflective material-coated metal substrate 1. Emit light efficiently to the outside.

【００２０】ＬＥＤチップ２は電流が流れると、発熱し
温度が上昇するが、放熱特性の良好な金属基板１に直接
ＬＥＤチップ２がダイボンデイングされているため温度
上昇が少ない。When a current flows, the LED chip 2 generates heat and its temperature rises. However, the temperature rise is small because the LED chip 2 is die-bonded directly to the metal substrate 1 having good heat radiation characteristics.

【００２１】以上のように、放熱特性が良好な金属基板
１にＬＥＤチップを実装したので、高密度で集積させて
も温度上昇が抑えられ、実用照明に資する高光出力を得
ることができ、また、蛍光体４から反射した光を金属基
板１の表面で反射させることにより、発光面６ａら効率
よく光を取り出すことができる。さらに、蛍光体４の光
拡散効果により、発光面６ａからは実用照明に必要な均
一な面発光を得ることができる。また、前面に紫外線カ
ット透光部材６を設けているため、紫外線を外部に放出
されるのを防ぐことができる。さらにまた、複数のＬＥ
Ｄチップ２を金属基板１に直接実装し、全体をモールド
加工して光源デバイス化しているため、ＬＥＤランプ
（砲弾型ＬＥＤあるいはチップ型ＬＥＤ）を複数個装着
する場合に比べて製造コストを削減できる。As described above, since the LED chip is mounted on the metal substrate 1 having good heat radiation characteristics, the temperature rise can be suppressed even when integrated at a high density, and a high light output contributing to practical lighting can be obtained. By reflecting light reflected from the phosphor 4 on the surface of the metal substrate 1, light can be efficiently extracted from the light emitting surface 6a. Further, due to the light diffusion effect of the phosphor 4, uniform surface light emission required for practical illumination can be obtained from the light emitting surface 6a. In addition, since the ultraviolet cut light transmitting member 6 is provided on the front surface, it is possible to prevent ultraviolet rays from being emitted to the outside. Furthermore, several LEs
Since the D chip 2 is directly mounted on the metal substrate 1 and the whole is molded to form a light source device, the manufacturing cost can be reduced as compared with the case where a plurality of LED lamps (bombshell type LED or chip type LED) are mounted. .

【００２２】実施の形態２．図３はこの発明に係る実施
の形態２を示す照明用ＬＥＤ光源デバイスの断面図であ
る。図において実施の形態１の図２と同一部分には同一
の符号を付し説明を省略する。８は蛍光体膜である。こ
の構成において、ＬＥＤチップ２に電流を流すと、ＬＥ
Ｄチップ２は可視光あるいは紫外線を発光する。この光
のうち直接透明樹脂層５の方向に放射された光により、
蛍光体膜８が励起されて可視光を発光する。このとき、
可視光は蛍光体膜８により拡散され紫外線カット透光部
材６の発光面６ａから均一に照射される。紫外線は紫外
線カット透光部材６により遮断されるため、外部には漏
れない。また、蛍光体膜８に到達した光の一部は蛍光体
膜８の表面で反射され、反射材塗布金属基板１に到達す
るが、この反射光を金属基板１で前方に反射させ、発光
面６ａから効率よく外部に光を放射する。Embodiment 2 FIG. FIG. 3 is a sectional view of an LED light source device for illumination showing a second embodiment according to the present invention. In the figure, the same parts as those in FIG. 2 of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. 8 is a phosphor film. In this configuration, when a current flows through the LED chip 2, LE
The D chip 2 emits visible light or ultraviolet light. Of the light, the light emitted directly in the direction of the transparent resin layer 5 causes
The phosphor film 8 is excited to emit visible light. At this time,
The visible light is diffused by the phosphor film 8 and is uniformly radiated from the light emitting surface 6a of the ultraviolet ray cut light transmitting member 6. The ultraviolet rays are blocked by the ultraviolet ray cut translucent member 6 and do not leak to the outside. A part of the light that has reached the phosphor film 8 is reflected on the surface of the phosphor film 8 and reaches the metal substrate 1 coated with the reflector. 6a efficiently emits light to the outside.

【００２３】以上のように、金属基板１にＬＥＤチップ
２を直接実装したので、温度上昇が抑えられ、高光出力
を得ることができ、また、蛍光体膜８としたので、光拡
散性が高くなり、発光面６ａからはより、均一な面発光
を得ることができる。As described above, since the LED chip 2 is directly mounted on the metal substrate 1, a rise in temperature can be suppressed, a high light output can be obtained, and since the phosphor film 8 is used, the light diffusion property is high. Thus, more uniform surface light emission can be obtained from the light emitting surface 6a.

【００２４】実施の形態３．図４はこの発明に係る実施
の形態３を示す照明用ＬＥＤ光源デバイスの断面図であ
る。図において実施の形態１の図２と同一部分には同一
の符号を付し説明を省略する。９はＬＥＤチップ２が装
着される凹部９ａを設け、ＬＥＤチップ２の表面と金属
基板９の表面９ｂの表面を同一面とした金属基板であ
る。Embodiment 3 FIG. FIG. 4 is a sectional view of an LED light source device for illumination showing a third embodiment according to the present invention. In the figure, the same parts as those in FIG. 2 of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 9 denotes a metal substrate provided with a concave portion 9a in which the LED chip 2 is mounted, and the surface of the LED chip 2 and the surface 9b of the metal substrate 9 are flush with each other.

【００２５】このような構成において、ＬＥＤチップ２
の可視光は直接透明樹脂層５の方向に放射された光によ
り、透明樹脂層５に含有する蛍光体４が励起されて可視
光を発光し、蛍光体４により拡散され発光面６ａから照
射されるが、蛍光体４に到達した光の一部は蛍光体４の
表面で反射され、金属基板９の表面９ｂに到達し、さら
に、前方に反射して、発光面６ａから外部に光を放射す
る。In such a configuration, the LED chip 2
Is excited by the light emitted directly in the direction of the transparent resin layer 5 to excite the phosphor 4 contained in the transparent resin layer 5 to emit visible light, diffused by the phosphor 4, and emitted from the light emitting surface 6a. However, part of the light that has reached the phosphor 4 is reflected on the surface of the phosphor 4, reaches the surface 9b of the metal substrate 9, further reflects forward, and emits light from the light emitting surface 6a to the outside. I do.

【００２６】以上のように、ＬＥＤチップ２の表面と金
属基板９の表面９ｂの表面を同一面としたので、蛍光体
４により拡散され発光面６ａから照射される光と、蛍光
体４の表面で反射され、金属基板９の表面９ｂに到達
し、さらに、前方に反射して、発光面６ａから照射され
る光の光路差が少なくなり照明用ＬＥＤ光源デバイスか
ら放射される光の明暗の差を少なくすることができる。
また、透光性樹脂５を充填するとき、段差がないので気
泡が生じなく作業をし易くすることができる。さらに、
ＬＥＤチップ２の底面と側面が金属基板９の凹部９ａの
底面と側面に接触しているので放熱を向上させることが
できる。As described above, since the surface of the LED chip 2 and the surface 9b of the metal substrate 9 are made the same, the light diffused by the phosphor 4 and emitted from the light emitting surface 6a and the surface of the phosphor 4 And reaches the surface 9b of the metal substrate 9 and further reflects forward, so that the optical path difference of the light emitted from the light emitting surface 6a is reduced, and the difference in brightness of the light emitted from the LED light source device for illumination is reduced. Can be reduced.
Further, when the translucent resin 5 is filled, since there is no step, no air bubbles are generated and the work can be easily performed. further,
Since the bottom surface and the side surface of the LED chip 2 are in contact with the bottom surface and the side surface of the concave portion 9a of the metal substrate 9, heat radiation can be improved.

【００２７】実施の形態４．図５はこの発明に係る実施
の形態４を示す照明用ＬＥＤ光源デバイスの断面図であ
る。図において実施の形態１の図２と同一部分には同一
の符号を付し説明を省略する。本実施の形態は実施の形
態１に示した板状の透明樹脂層５を各々のＬＥＤチップ
２を中心とする略半球形状にした透明樹脂層１１とした
ものである。動作は実施の形態１と同様であるが、略半
球形状にした透明樹脂層１１はレンズ機能があるので指
向性の光を放射することができる。Embodiment 4 FIG. 5 is a sectional view of an LED light source device for illumination according to a fourth embodiment of the present invention. In the figure, the same parts as those in FIG. 2 of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. In the present embodiment, the plate-shaped transparent resin layer 5 shown in the first embodiment is formed into a substantially hemispherical transparent resin layer 11 centering on each LED chip 2. The operation is the same as that of the first embodiment, but since the substantially hemispherical transparent resin layer 11 has a lens function, it can emit directional light.

【００２８】なお、実施の形態２、３に示した板状の透
明樹脂層５の代わりに略半球形状にした透明樹脂層１１
としてもよい。In place of the plate-shaped transparent resin layer 5 shown in the second and third embodiments, a substantially hemispherical transparent resin layer 11 is used.
It may be.

【００２９】実施の形態５．図６はこの発明に係る実施
の形態５を示す照明用ＬＥＤ光源デバイスの断面図であ
る。図において実施の形態１の図２と同一部分には同一
の符号を付し説明を省略する。本実施の形態は実施の形
態１に示したＬＥＤチップ２をフリップ型ＬＥＤチップ
１２に代えたものであり、１３は電極である。動作は実
施の形態１と同じなので説明を省略する。Embodiment 5 FIG. 6 is a sectional view of an LED light source device for illumination showing a fifth embodiment according to the present invention. In the figure, the same parts as those in FIG. 2 of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, the LED chip 2 shown in the first embodiment is replaced with a flip-type LED chip 12, and 13 is an electrode. The operation is the same as that of the first embodiment, and the description is omitted.

【００３０】フリップ型ＬＥＤチップ１２は実施の形態
１の図１で示したＬＥＤチップ２を裏返しにした構成で
あり、前面に金線３や電極１３がないため、放射効率を
よくすることができる。The flip-type LED chip 12 has a structure in which the LED chip 2 shown in FIG. 1 of the first embodiment is turned upside down, and since there are no gold wires 3 and electrodes 13 on the front surface, radiation efficiency can be improved. .

【００３１】なお、実施の形態２〜４に示したＬＥＤチ
ップ２の代わりにフリップ型ＬＥＤチップ１２を使用し
てもよい。また、実施の形態１〜５では紫外線カット透
光部材６を設けたが、ＬＥＤチップによって紫外線の影
響がないものは設けなくてもよい。Note that a flip-type LED chip 12 may be used instead of the LED chip 2 shown in the second to fourth embodiments. Further, in the first to fifth embodiments, the ultraviolet ray cut translucent member 6 is provided. However, an LED chip which is not affected by ultraviolet rays may not be provided.

【００３２】実施の形態６．図７はこの発明に係る実施
の形態６を示す照明用ＬＥＤ光源デバイス１０使用し照
明器具の断面図である。図において１４は照明用ＬＥＤ
光源デバイス１０を使用し照明器具であり、複数の照明
用ＬＥＤ光源デバイス１０と照明用ＬＥＤ光源デバイス
１０を支持する枠体１５、電源コード１６と照明用ＬＥ
Ｄ光源デバイス１０を接続するコネクタ１７から構成さ
れ、天井１８に取付けられる。このような構成の照明器
具は、照明用ＬＥＤ光源デバイスを使用したので、高光
出力で、均一な面発光とすることができ、また、紫外線
の放出を防止することができる。Embodiment 6 FIG. FIG. 7 is a cross-sectional view of a lighting fixture using an LED light source device for lighting 10 according to a sixth embodiment of the present invention. In the figure, 14 is a lighting LED
A lighting fixture using the light source device 10, a plurality of LED light source devices 10 for illumination, a frame 15 supporting the LED light source devices 10 for illumination, a power cord 16, and an LE for illumination
It comprises a connector 17 for connecting the D light source device 10 and is attached to a ceiling 18. Since the lighting fixture having such a configuration uses the LED light source device for lighting, it is possible to achieve high light output, uniform surface light emission, and prevent emission of ultraviolet rays.

【００３３】[0033]

【発明の効果】以上のように、この発明によれば、反射
機能を有する金属基板と、この金属基板に電気絶縁物を
介してダイボンデイングされた複数個のＬＥＤチップ
と、このＬＥＤチップと前記金属基板を覆う透明樹脂層
と、この透明樹脂層に混入された蛍光体とを備えたの
で、高密度で集積させても温度上昇が抑えられ、高光出
力化を図ることができ、また、発光面から効率よく、均
一な面発光得ることができる。As described above, according to the present invention, a metal substrate having a reflecting function, a plurality of LED chips die-bonded to the metal substrate via an electrical insulator, A transparent resin layer covering the metal substrate and a phosphor mixed in the transparent resin layer are provided, so that even when integrated at a high density, a rise in temperature is suppressed, high light output can be achieved, and light emission can be achieved. Efficient and uniform surface light emission can be obtained from the surface.

【００３４】また、反射機能を有する金属基板と、この
金属基板に電気絶縁物を介してダイボンデイングされた
複数個のＬＥＤチップと、このＬＥＤチップと前記金属
基板を覆う透明樹脂層と、この透明樹脂層を覆う蛍光体
膜とを備えたので、光拡散性が高くなり、より均一な面
発光を得ることができる。Also, a metal substrate having a reflecting function, a plurality of LED chips die-bonded to the metal substrate via an electrical insulator, a transparent resin layer covering the LED chip and the metal substrate, Since a phosphor film covering the resin layer is provided, light diffusivity is enhanced, and more uniform surface light emission can be obtained.

【００３５】また、金属基板はＬＥＤチップが挿入され
る凹部を有し、前記ＬＥＤチップの表面と前記金属基板
の表面とが同一になるようにしたで、放射される光の明
暗の差を少なくすることができる。また、透光性樹脂を
充填するとき、段差がないので気泡が生じなく作業をし
易くすることができ、さらに、放熱を向上させることが
できる。Further, the metal substrate has a concave portion into which the LED chip is inserted, and the surface of the LED chip and the surface of the metal substrate are made to be the same. can do. In addition, when the translucent resin is filled, since there is no step, air bubbles are not generated, the work can be easily performed, and the heat radiation can be further improved.

【００３６】また、透明樹脂層の表面を平面にしたもの
で、均一な面発光得ることができる。Further, since the surface of the transparent resin layer is made flat, uniform surface light emission can be obtained.

【００３７】また、透明樹脂層の表面を、各々のＬＥＤ
チップを中心とする略半球形状にしたので、指向性の光
を放射することができる。In addition, the surface of the transparent resin layer is
Since it has a substantially hemispherical shape centered on the chip, it is possible to emit directional light.

【００３８】また、紫外線をカットする紫外線カット透
明部材を備えたので、紫外線の放出を防止できる。In addition, since an ultraviolet-cut transparent member for cutting ultraviolet light is provided, emission of ultraviolet light can be prevented.

【００３９】また、ＬＥＤチップをフリップ型としたの
で、発光面からより効率がよく、均一な面発光得ること
ができる。Further, since the LED chip is of a flip type, it is possible to obtain more efficient and uniform surface light emission from the light emitting surface.

【００４０】また、この発明に係る照明器具は、請求項
１〜７記載のいずれかに記載の照明用ＬＥＤ光源デバイ
スを使用したので、高密度で集積させても温度上昇が抑
えられ、高光出力化を図ることができ、また、発光面か
ら効率よく、均一な面発光を得ることができる。Further, since the lighting apparatus according to the present invention uses the LED light source device for lighting according to any one of claims 1 to 7, the temperature rise can be suppressed even when integrated at a high density, and a high light output can be achieved. In addition, uniform surface light emission can be efficiently obtained from the light emitting surface.

【図面の簡単な説明】[Brief description of the drawings]

【図１】 この発明の実施の形態１を示す照明用ＬＥＤ
光源デバイスの斜視図である。FIG. 1 shows a lighting LED according to Embodiment 1 of the present invention.
It is a perspective view of a light source device.

【図２】 図１の断面図である。FIG. 2 is a sectional view of FIG.

【図３】 この発明の実施の形態２を示す照明用ＬＥＤ
光源デバイスの断面図である。FIG. 3 shows a lighting LED according to Embodiment 2 of the present invention.
It is sectional drawing of a light source device.

【図４】 この発明の実施の形態３を示す照明用ＬＥＤ
光源デバイスの断面図である。FIG. 4 shows a lighting LED according to Embodiment 3 of the present invention.
It is sectional drawing of a light source device.

【図５】 この発明の実施の形態４を示す照明用ＬＥＤ
光源デバイスの断面図である。FIG. 5 shows a lighting LED according to a fourth embodiment of the present invention.
It is sectional drawing of a light source device.

【図６】 この発明の実施の形態５を示す照明用ＬＥＤ
光源デバイスの断面図である。FIG. 6 shows a lighting LED according to Embodiment 5 of the present invention.
It is sectional drawing of a light source device.

【図７】 この発明の実施の形態６を示す照明用ＬＥＤ
光源デバイスの断面図である。FIG. 7 shows a lighting LED according to Embodiment 6 of the present invention.
It is sectional drawing of a light source device.

【図８】 従来のＬＥＤ光源の斜視図である。FIG. 8 is a perspective view of a conventional LED light source.

【図９】 図８の断面図である。FIG. 9 is a sectional view of FIG.

【図１０】 従来のＬＥＤ灯具の部分斜視図である。FIG. 10 is a partial perspective view of a conventional LED lamp.

【図１１】 従来の面状光源の斜視図である。FIG. 11 is a perspective view of a conventional planar light source.

【符号の説明】[Explanation of symbols]

１、９ 金属基板、２ ＬＥＤチップ、４ 蛍光体、
５、１１ 透明樹脂層、６ 紫外線カット透光部材、８
蛍光体膜, ９ａ 凹部,９ｂ 表面、１０ 照明用ＬＥ
Ｄ光源デバイス、１２ フリップ型ＬＥＤチップ、１４
照明器具。1, 9 metal substrate, 2 LED chips, 4 phosphors,
5, 11 transparent resin layer, 6 UV cut translucent member, 8
Phosphor film, 9a recess, 9b surface, 10 lighting LE
D light source device, 12 flip type LED chip, 14
lighting equipment.

フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 23/29 Ｆ２１Ｓ 1/02 Ｇ 23/31 Ｈ０１Ｌ 23/30 Ｂ // Ｆ２１Ｙ 101:02 (72)発明者 今井 康雄 神奈川県鎌倉市大船二丁目14番40号 三菱 電機照明株式会社内 Ｆターム(参考） 4M109 AA00 EC11 EE12 GA01 5F041 AA05 AA33 DA07 DA09 DA13 DA20 DA43 DA56 EE25 FF11Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) H01L 23/29 F21S 1/02 G 23/31 H01L 23/30 B // F21Y 101: 02 (72) Inventor Yasuo Imai Mitsubishi Electric Lighting Co., Ltd. F term (reference) 4M109 AA00 EC11 EE12 GA01 5F041 AA05 AA33 DA07 DA09 DA13 DA20 DA43 DA56 EE25 FF11

Claims (8)

【特許請求の範囲】[Claims] 【請求項１】 反射機能を有する金属基板と、 この金属基板に電気絶縁物を介してダイボンデイングさ
れた複数個のＬＥＤチップと、 このＬＥＤチップと前記金属基板を覆う透明樹脂層と、 この透明樹脂層に混入された蛍光体とを備えたことを特
徴とする照明用ＬＥＤ光源デバイス。1. A metal substrate having a reflecting function, a plurality of LED chips die-bonded to the metal substrate via an electrical insulator, a transparent resin layer covering the LED chips and the metal substrate, An LED light source device for lighting, comprising: a phosphor mixed in a resin layer. 【請求項２】 反射機能を有する金属基板と、 この金属基板に電気絶縁物を介してダイボンデイングさ
れた複数個のＬＥＤチップと、 このＬＥＤチップと前記金属基板を覆う透明樹脂層と、 この透明樹脂層を覆う蛍光体膜とを備えたことを特徴と
する照明用ＬＥＤ光源デバイス。2. A metal substrate having a reflective function, a plurality of LED chips die-bonded to the metal substrate via an electrical insulator, a transparent resin layer covering the LED chips and the metal substrate, An illumination LED light source device comprising: a phosphor film covering a resin layer. 【請求項３】 金属基板はＬＥＤチップが挿入される凹
部を有し、前記ＬＥＤチップの表面と前記金属基板の表
面とが同一になるようにしたことを特徴とする請求項１
または請求項２記載の照明用ＬＥＤ光源デバイス。3. The metal substrate has a recess into which the LED chip is inserted, and the surface of the LED chip and the surface of the metal substrate are the same.
Or the LED light source device for illumination of Claim 2. 【請求項４】 透明樹脂層の表面を平面にしたことを特
徴とする請求項１〜請求項３のいずれかに記載の照明用
ＬＥＤ光源デバイス。4. The LED light source device for illumination according to claim 1, wherein the surface of the transparent resin layer is flat. 【請求項５】 透明樹脂層の表面を、各々のＬＥＤチッ
プを中心とする略半球形状にしたことを特徴とする請求
項１〜請求項３のいずれかに記載の照明用ＬＥＤ光源デ
バイス。5. The LED light source device for illumination according to claim 1, wherein the surface of the transparent resin layer has a substantially hemispherical shape centered on each LED chip. 【請求項６】 紫外線をカットする紫外線カット透明部
材を備えたことを特徴とする請求項１〜請求項３のいず
れかに記載の照明用ＬＥＤ光源デバイス。6. The LED light source device for illumination according to claim 1, further comprising an ultraviolet cut transparent member for cutting ultraviolet light. 【請求項７】 ＬＥＤチップをフリップ型としたことを
特徴とする請求項１〜請求項３のいずれかに記載の照明
用ＬＥＤ光源デバイス。7. The LED light source device for illumination according to claim 1, wherein the LED chip is of a flip type. 【請求項８】 請求項１〜７記載のいずれかに記載の照
明用ＬＥＤ光源デバイスを使用した照明器具。8. A lighting fixture using the LED light source device for lighting according to any one of claims 1 to 7.
JP2001096197A 2001-03-29 2001-03-29 Led light-source device for illumination and illuminator Pending JP2002299694A (en)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
JP2002299694A true JP2002299694A (en) 2002-10-11

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Family Applications (1)

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Country Link
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