JP2002298118A - Paper infiltering of contactless tag member - Google Patents
Paper infiltering of contactless tag memberInfo
- Publication number
- JP2002298118A JP2002298118A JP2001103024A JP2001103024A JP2002298118A JP 2002298118 A JP2002298118 A JP 2002298118A JP 2001103024 A JP2001103024 A JP 2001103024A JP 2001103024 A JP2001103024 A JP 2001103024A JP 2002298118 A JP2002298118 A JP 2002298118A
- Authority
- JP
- Japan
- Prior art keywords
- tag member
- paper
- contact type
- chip
- type tag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、共振タグ部材又は
ＩＣタグ部材などの非接触方式のタグ部材を有する用紙
に関する。The present invention relates to a sheet having a non-contact type tag member such as a resonance tag member or an IC tag member.
【０００２】従来、共振タグ部材又はＩＣタグ部材など
の非接触方式のタグ部材を用紙と一体化させる際には、
タグ部材を粘着剤層の有する粘着シールに加工して、用
紙の表面の一部にその粘着剤層により貼付させたり、ま
たはタグ部材をラミネート加工させて所定のサイズのカ
ード状に形成させて、これを用紙の一部に種々の方法で
添付させるなどして一体化させている。しかしながら、
用紙に貼付又は添付させることで一体化させたタグ部材
は、簡単に剥ぎ取ることができるので、不正行為を働く
目的でタグ部材を一旦剥ぎ取った後に、別のタグ部材と
交換され、偽造品を製造されるなどの危険性がある。Conventionally, when a non-contact type tag member such as a resonance tag member or an IC tag member is integrated with paper,
The tag member is processed into an adhesive seal having an adhesive layer, and is adhered to a part of the surface of the paper with the adhesive layer, or the tag member is laminated to form a card of a predetermined size, This is integrated with a part of the paper by attaching it by various methods. However,
The tag member integrated by sticking or attaching to paper can be easily peeled off, so once the tag member is peeled off for the purpose of misconduct, it is replaced with another tag member and counterfeit products There is a risk of being manufactured.
【０００３】また、用紙にタグ部材を貼付または添付さ
せるために、粘着シールに加工したり、ラミネート加工
したり、そしてこの加工されたタグ部材を用紙上に貼付
または添付するには、加工作業等の手間や加工費用もか
かるので、特に大量のタグを作製し、これらを用紙に貼
付または添付する場合には効率も悪く問題である。[0003] Further, in order to attach or attach the tag member to the sheet, it is processed into an adhesive seal or laminated, and in order to attach or attach the processed tag member to the sheet, a processing operation or the like is required. This is troublesome and requires high processing cost, so that it is inefficient when a large number of tags are produced and attached or attached to paper.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、用紙にタグ
部材を貼付又は添付させるための加工の手間を不要と
し、また用紙に貼付又は添付させたタグ部材が、悪意に
剥ぎ取られ、不正行為を働く目的で別のタグ部材と交換
されるなどの危険性を防止することができる非接触方式
のタグ部材が漉き込まれてなる用紙を提供する。SUMMARY OF THE INVENTION The present invention eliminates the need for processing for attaching or attaching a tag member to a sheet, and the tag member attached or attached to a sheet is maliciously peeled off, thereby making it illegal. Provided is a sheet in which a non-contact type tag member is embedded, which can prevent a risk of being replaced with another tag member for the purpose of performing an action.
【０００５】[0005]
【課題を解決するための手段】本発明の非接触方式のタ
グ部材が漉き込まれてなる用紙は、用紙基材の紙層間
に、非接触方式のタグ部材が漉き込まれた状態で内蔵さ
れてなることを特徴とする。The non-contact type tag member of the present invention is embedded in a state where the non-contact type tag member is embedded between the paper layers of the paper substrate. It is characterized by becoming.
【０００６】また、本発明は、前記非接触方式のタグ部
材が、共振タグ部材又はＩＣタグ部材であることを特徴
とする。更に、本発明は、前記非接触方式のタグ部材
が、前記非接触方式のタグ部材が、タグ基材にＩＣチッ
プと前記ＩＣチップに接続されたコイルが設けられて構
成されていることを特徴とする。Further, the present invention is characterized in that the non-contact type tag member is a resonance tag member or an IC tag member. Further, the present invention is characterized in that the non-contact type tag member is configured such that the non-contact type tag member is provided with an IC chip and a coil connected to the IC chip on a tag base material. And
【０００７】また、本発明は、ＩＣチップと、前記ＩＣ
チップに接続されたコイルからなることを特徴とする。
更に、本発明は、前記非接触方式のタグ部材が、ＩＣチ
ップと、前記ＩＣチップ上に形成されたコイルからなる
ことを特徴とする。また、本発明は、前記非接触方式の
タグ部材が、タグ基材にコイルが設けられて構成されて
いる共振タグ部材であることを特徴とする。Further, the present invention relates to an IC chip,
It is characterized by comprising a coil connected to the chip.
Further, the present invention is characterized in that the non-contact type tag member comprises an IC chip and a coil formed on the IC chip. Further, the present invention is characterized in that the non-contact type tag member is a resonance tag member in which a coil is provided on a tag base material.
【０００８】[0008]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて詳細に説明する。図１は、本発明の非接触方
式のタグ部材が漉き込まれてなる用紙を製造する方法を
説明するための概略図、図２は、本発明の非接触方式の
タグ部材が漉き込まれてなる用紙に係る第１実施形態の
断面図、図３は、本発明に係る第１実施形態の斜視図、
図４は、本発明の非接触方式のタグ部材が漉き込まれて
なる用紙に係る第２実施形態の断面図、図５は、本発明
に係る第２実施形態の斜視図、図６は、本発明の非接触
方式のタグ部材が漉き込まれてなる用紙に係る第３実施
形態の断面図、図７は、本発明の非接触方式のタグ部材
が漉き込まれてなる用紙に係る第４実施形態の断面図、
図８は、本発明の非接触方式のタグ部材が漉き込まれて
なる用紙に係る第４実施形態の断面図、図９は、本発明
の非接触方式のタグ部材が漉き込まれてなる用紙を製造
する際に使用するシリンダー２基を備えた円網抄紙機の
抄紙部分の模式図である。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic view for explaining a method of manufacturing a sheet formed by embedding the non-contact type tag member of the present invention, and FIG. 2 is a diagram illustrating the non-contact type tag member of the present invention embedded therein. FIG. 3 is a sectional view of a first embodiment according to the present invention, FIG. 3 is a perspective view of the first embodiment according to the present invention,
FIG. 4 is a cross-sectional view of a second embodiment of the paper into which the non-contact type tag member of the present invention is laid, FIG. 5 is a perspective view of the second embodiment of the present invention, and FIG. FIG. 7 is a cross-sectional view of a third embodiment of a sheet in which the non-contact type tag member of the present invention is laid, and FIG. Sectional view of the embodiment,
FIG. 8 is a cross-sectional view of a fourth embodiment relating to a sheet into which the non-contact type tag member of the present invention is embedded. FIG. 9 is a cross-sectional view of a sheet into which the non-contact type tag member of the present invention is embedded. FIG. 2 is a schematic view of a papermaking part of a round paper machine provided with two cylinders used in manufacturing the papermaking machine.
【０００９】本発明の非接触方式のタグ部材が漉き込ま
れてなる用紙１は、図１に示すように、１枚の用紙基材
２の紙層間３に、非接触方式のタグ部材が漉き込まれた
状態で内蔵された構造を有している。これらの非接触方
式のタグ部材とは、例えば、共振タグ部材又はＩＣタグ
部材などの、少なくとも非接触で外部装置と通信を行う
ことを可能とするコイルを有する部材を示すものであ
る。As shown in FIG. 1, a non-contact type tag member is formed between the paper layers 3 of one sheet substrate 2 as shown in FIG. It has a built-in structure when inserted. These non-contact type tag members are members having a coil that enables communication with an external device at least in a non-contact manner, such as a resonance tag member or an IC tag member.
【００１０】このような非接触方式のタグ部材の例とし
ては、図１に示すように、例えばタグ基材４の両面に螺
旋状パターンによりコイル５が形成された共振タグ部材
６、ワイヤ状の共振タグ部材１１、タグ基材７にＩＣチ
ップ８と前記ＩＣチップ８に接続されたコイル９が設け
られて構成されている基材を有するＩＣタグ部材１０、
タグ基材を設けないでＩＣチップ１８と前記ＩＣチップ
１８に接続されたコイル１９からなるＩＣタグ部材２
２、ＩＣチップ２０と前記ＩＣチップ２０上に形成され
たコイル２１からなるＩＣタグ部材１２などがある。As an example of such a non-contact type tag member, as shown in FIG. 1, for example, a resonance tag member 6 in which a coil 5 is formed in a spiral pattern on both surfaces of a tag base material 4, a wire-like tag member, An IC tag member 10 having a resonance tag member 11, a base member including a tag base member 7 provided with an IC chip 8 and a coil 9 connected to the IC chip 8,
An IC tag member 2 comprising an IC chip 18 and a coil 19 connected to the IC chip 18 without providing a tag base material
2. There is an IC tag member 12 including an IC chip 20 and a coil 21 formed on the IC chip 20.
【００１１】そして、上記の非接触方式のタグ部材は、
いずれもこの用紙を抄紙機などを使用して製造する抄紙
工程の際に、紙層間に漉き込むことで、用紙層内に内蔵
させて設けられたものである。したがって、用紙の表面
には、非接触方式のタグ部材がない状態で用紙内に一体
化して設けられた構造を有している。[0011] The above-mentioned non-contact type tag member comprises:
In any case, in the paper making step of manufacturing this paper using a paper machine or the like, the paper is embedded between the paper layers by being laid between the paper layers. Therefore, the surface of the sheet has a structure provided integrally with the sheet without a non-contact type tag member.
【００１２】次に、非接触方式のタグ部材を紙層間に漉
き込む製造方法について、図９に示したシリンダー２基
を備えた円網抄紙機１３を用いて説明する。円網抄紙機
１３は、シリンダー２基を備えていて２層抄合わせ紙を
製造するための装置であり、２基のワイヤーシリンダー
１４ａ，１４ｂをそれぞれシリンダーパッド１５ａ，１
５ｂの中の紙料１６ａ，１６ｂに浸しながら回転させ、
ワイヤーシリンダー１４ａ，１４ｂ内外の水位差を利用
して、シリンダーの金網にそれぞれ紙層を形成させ、こ
れを毛布１７に移し取ることで２層抄合わせ紙を製造す
る。Next, a method of manufacturing a non-contact type tag member between paper layers will be described with reference to a circular paper machine 13 having two cylinders shown in FIG. The circular web paper machine 13 has two cylinders and is a device for producing double-layered paper. The two wire cylinders 14a and 14b are connected to cylinder pads 15a and 15a, respectively.
Rotate while immersing in stock materials 16a and 16b in 5b,
Utilizing the water level difference between the inside and outside of the wire cylinders 14a and 14b, a paper layer is formed on the wire mesh of the cylinder, and the paper layer is transferred to the blanket 17 to produce a two-layer laminated paper.
【００１３】そして、シリンダー２基の間におけるスペ
ースに、ワイヤーシリンダー１４ｂにより毛布１７に移
し取った紙層表面上に非接触方式のタグ部材を貼付する
装置を設けることで、２層抄合わせ紙の中間の位置に非
接触方式のタグ部材を挿入させることで、紙層間に漉き
込まれた状態で、用紙の内部に非接触方式のタグ部材を
一体化させた非接触方式のタグ部材が漉き込まれてなる
用紙が製造される。また、非接触方式のタグ部材が用紙
からはみ出さないようにするために、紙層間に漉き込む
非接触方式のタグ部材の厚みを考慮して、２層抄合わせ
紙の厚みを定めることが好ましいIn the space between the two cylinders, a device for attaching a non-contact type tag member to the surface of the paper layer transferred to the blanket 17 by the wire cylinder 14b is provided, so that the two-layer laminated paper is formed. By inserting the non-contact type tag member at the intermediate position, the non-contact type tag member which is integrated with the non-contact type tag member inside the paper is squeezed while being squeezed between the paper layers. Rare paper is produced. Further, in order to prevent the non-contact type tag member from protruding from the paper, it is preferable to determine the thickness of the two-layer laminated paper in consideration of the thickness of the non-contact type tag member to be cut between the paper layers.
【００１４】次に、本発明の非接触方式のタグ部材が漉
き込まれてなる用紙の各実施形態について説明する。本
発明に係る第１実施形態の非接触方式のタグ部材が漉き
込まれてなる用紙１Ａは、図２，図３に示すように、１
枚の用紙基材２の紙層間に、タグ基材７上にＩＣチップ
８と前記ＩＣチップ８に接続されたコイル９が設けられ
たＩＣタグ部材１０が、漉き込まれた状態で内蔵されて
いる。Next, each embodiment of the paper in which the non-contact type tag member of the present invention is embedded will be described. As shown in FIGS. 2 and 3, the non-contact type tag member 1A according to the first embodiment of the present invention,
An IC tag member 10 in which an IC chip 8 and a coil 9 connected to the IC chip 8 are provided on a tag base material 7 between the paper layers of the two paper base materials 2 is embedded in a laid state. I have.
【００１５】このＩＣタグ部材１０のコイル９は、外部
装置からの質問電波を受信して駆動用電力に変換するた
めの電源用受信アンテナと、質問電波を受信し応答電波
を送信する際の搬送波として利用するためのデータ送受
信用アンテナとしての機能を有している。また、ＩＣチ
ップ８には、データ送受信処理手段、情報書込読取手
段、データ記憶手段、制御手段などの各手段を有し、非
接触で外部装置とのデータの交信が可能になるように構
成されている。The coil 9 of the IC tag member 10 includes a power receiving antenna for receiving interrogation radio waves from an external device and converting the interrogation radio waves into driving power, and a carrier wave for receiving interrogation radio waves and transmitting response radio waves. It has a function as a data transmission / reception antenna to be used as. Further, the IC chip 8 has respective units such as a data transmission / reception processing unit, an information writing / reading unit, a data storage unit, and a control unit, and is configured to enable data communication with an external device without contact. Have been.
【００１６】つまり、ＩＣチップ８内のデータ記憶手段
に記憶されている各データを非接触で外部装置に送信し
たり、また外部装置からＩＣチップ８内のデータ記憶手
段に各データを送信し記憶させることができる。これに
より、用紙に記載された内容とデータ記憶手段に記憶さ
せたデータとの照合や、用紙の信頼性の確認など種々の
システムに活用することもできる。That is, each data stored in the data storage means in the IC chip 8 is transmitted to an external device without contact, or each data is transmitted from the external device to the data storage means in the IC chip 8 and stored. Can be done. Thus, the present invention can be utilized for various systems such as collation of the content described on the sheet with the data stored in the data storage unit and confirmation of the reliability of the sheet.
【００１７】例えば、システムの一例として、このＩＣ
タグ部材１０を用紙の紙層間内に漉き込ませておくこと
で、外部装置のアンテナから送信されている起動信号電
波の届く範囲に、その用紙を持った人間が来るとＩＣチ
ップ８内に起動力が発生し回路がスタートする。その
後、ＩＣタグ部材１０からの信号電波が発信され、信号
電波を外部装置の読取手段のアンテナが受信すること
で、外部装置との間でデータの交信を行うことが可能と
なる。For example, as an example of a system, this IC
The tag member 10 is embedded between the paper layers of the paper, so that when a person holding the paper comes within the range of the activation signal radio wave transmitted from the antenna of the external device, the tag member 10 is activated in the IC chip 8. A force is generated and the circuit starts. Thereafter, a signal radio wave is transmitted from the IC tag member 10, and the signal radio wave is received by the antenna of the reading means of the external device, so that data can be exchanged with the external device.
【００１８】したがって、ＩＣタグ部材１０を漉き込ん
だ用紙を重要な書類に用いて、このＩＣタグ部材１０の
ＩＣチップ８に認証用データを記憶させておくことで、
いつでもその用紙が本物であるかの確認を行うことがで
きる。しかも、悪意に偽造や変造を行った場合には、用
紙が破かれるなどの証拠が残り、用紙に漉き込まれたＩ
Ｃタグ部材１０を簡単に取り替えることができないの
で、高い信頼性を保有する用紙を提供することができ
る。Therefore, by using the paper into which the IC tag member 10 is laid as an important document and storing the authentication data in the IC chip 8 of the IC tag member 10,
You can always confirm that the paper is genuine. Moreover, when maliciously forged or falsified, evidence such as tearing of the paper remains, and the I
Since the C tag member 10 cannot be easily replaced, it is possible to provide a sheet having high reliability.
【００１９】次に、本発明の第２実施形態の非接触方式
のタグ部材が漉き込まれてなる用紙１Ｂは、図４，図５
に示すように、１枚の用紙基材２の紙層間に、ＩＣチッ
プ１８と前記ＩＣチップ１８に接続されたコイル１９と
を漉き込まれた状態で内蔵させたものである。この第２
実施形態は、第１実施形態の非接触方式のタグ部材が漉
き込まれてなる用紙から、タグ基材７を設けないで、Ｉ
Ｃチップ１８とコイル１９だけを備えた構造を有してい
る。ＩＣチップ１８と前記ＩＣチップ１８に接続された
コイル１９とにより、前記の第１実施形態と同様なシス
テムの機能を有する。Next, the paper 1B into which the non-contact type tag member according to the second embodiment of the present invention is laid is shown in FIGS.
As shown in FIG. 1, an IC chip 18 and a coil 19 connected to the IC chip 18 are embedded between the paper layers of a single paper base material 2 in a state of being cut. This second
The embodiment uses the non-contact type tag member of the first embodiment, which is made of paper, without providing the tag base material 7,
It has a structure including only the C chip 18 and the coil 19. The IC chip 18 and the coil 19 connected to the IC chip 18 have a system function similar to that of the first embodiment.
【００２０】次に、本発明の第３実施形態の非接触方式
のタグ部材が漉き込まれてなる用紙１Ｃは、図６に示す
ように、１枚の用紙基材２の紙層間に、例えばタグ基材
４の両面に螺旋状パターンによりコイル５が形成された
共振タグ部材６を漉き込まれた状態で内蔵させたもので
ある。タグ基材４は、例えば、誘電体として誘電率が小
さく、０．０３ｍｍ以下の厚さを有するポリエチレン等
のポリオレフィン系樹脂フィルムの両面に、アルミニウ
ム箔等の金属箔を押し出しまたは熱圧着等の方法により
貼り合わせた材料を基材材料として用いる。Next, as shown in FIG. 6, a non-contact type tag member 1C according to a third embodiment of the present invention is placed between the paper layers of one paper substrate 2 as shown in FIG. A resonance tag member 6 in which a coil 5 is formed in a spiral pattern on both sides of a tag base material 4 is embedded in a state of being buried. The tag base material 4 is, for example, a method of extruding a metal foil such as an aluminum foil or thermocompression bonding on both surfaces of a polyolefin resin film such as polyethylene having a small dielectric constant and a thickness of 0.03 mm or less, such as polyethylene. Is used as a base material.
【００２１】共振タグ部材６は、タグ基材４上に螺旋状
パターンによりコイル５を形成し、螺旋状パターン略全
体でコンデンサ電極板部を構成し、かつ一端部に回路端
子部を有する回路を設け、共振周波数回路を構成してい
る。これにより、外部の検知装置から発信される特定の
周波数の電波に共振する共振回路を構成する共振タグ部
材６が漉き込まれている用紙を構成する。The resonance tag member 6 has a coil 5 formed in a spiral pattern on the tag base 4, a capacitor electrode plate portion is formed substantially entirely in the spiral pattern, and a circuit having a circuit terminal portion at one end. To form a resonance frequency circuit. As a result, a sheet in which the resonance tag member 6 forming a resonance circuit that resonates with a radio wave of a specific frequency transmitted from an external detection device is formed.
【００２２】次に、本発明の第４実施形態の非接触方式
のタグ部材が漉き込まれてなる用紙１Ｄは、図７に示す
ように、１枚の用紙基材２の紙層間に、ＩＣチップ２０
と前記ＩＣチップ２０上に形成されたコイル２１からな
るＩＣタグ部材１２を漉き込まれた状態で内蔵されてい
る。Next, as shown in FIG. 7, a sheet 1D in which a non-contact type tag member according to the fourth embodiment of the present invention is embedded is provided between the paper layers of one sheet substrate 2 as an IC. Chip 20
And an IC tag member 12 composed of a coil 21 formed on the IC chip 20 is embedded therein.
【００２３】このＩＣタグ部材１２の作製方法を説明す
ると、ＩＣチップの端子パッド部分をマスクし、ポリイ
ミド等でチップ表面に厚さ１０μ程度の絶縁皮膜を電着
技術で形成し、その後にマスクを剥離する。熱処理によ
り完全絶縁体となり、その後、金属層の密着性向上のた
めに表面を粗面化処理するのが望ましい。そして、無電
解Ｎｉメッキにより給電層を形成し、次にフォトレジス
トでマスクを形成し、電解メッキにより微細コイル配線
を行い、最後にレジストと無電解Ｎｉメッキを剥離し、
チップ表面上に非接触端子パッドと接続されたアンテナ
が加工される。尚、ＮｉだけでなくＣｕでも可能であ
る。The method of manufacturing the IC tag member 12 will be described. A terminal pad portion of an IC chip is masked, an insulating film having a thickness of about 10 .mu.m is formed on the chip surface with polyimide or the like by an electrodeposition technique. Peel off. It is desirable to form a complete insulator by the heat treatment, and then to perform a surface roughening treatment to improve the adhesion of the metal layer. Then, a power supply layer is formed by electroless Ni plating, a mask is formed by photoresist, fine coil wiring is performed by electrolytic plating, and finally the resist and the electroless Ni plating are peeled off.
An antenna connected to the non-contact terminal pad is processed on the chip surface. Incidentally, not only Ni but also Cu can be used.
【００２４】上記のようにして、例えば、縦横４ｍｍの
四角形のＩＣチップ上に、幅が２０μで、線間が２０
μ、金属厚が２０μ、の線で約４５ターンのコイルアン
テナが得られる。そして、ポリイミド等のオーバーコー
トによりこれらの微細コイル配線を保護することで、コ
イルオンチップのＩＣタグ部材１２が得られる。As described above, for example, on a square IC chip having a length of 4 mm and a width of 20 mm, a width of 20 .mu.
A coil antenna of about 45 turns is obtained with a line of μ and a metal thickness of 20 μ. Then, by protecting these fine coil wirings with an overcoat of polyimide or the like, the coil-on-chip IC tag member 12 is obtained.
【００２５】そして、１枚の用紙基材２の紙層間に、こ
のＩＣチップ２０と前記ＩＣチップ２０上に形成された
コイル２１からなるＩＣタグ部材１２を漉き込ませるこ
とで、無線によりデータの交信が可能なＩＣタグ部材１
２を有する用紙が作製できる。Then, the IC tag member 12 composed of the IC chip 20 and the coil 21 formed on the IC chip 20 is embedded between the paper layers of the single paper base 2 to wirelessly transmit data. IC tag member 1 capable of communication
2 can be produced.
【００２６】次に、本発明の第５実施形態の非接触方式
のタグ部材が漉き込まれてなる用紙１Ｅは、図８に示す
ように、１枚の用紙基材２の紙層間に、ワイヤ状の共振
タグ部材１１を漉き込まれた状態で内蔵されている。Next, as shown in FIG. 8, a paper 1E in which a non-contact type tag member according to the fifth embodiment of the present invention is squeezed is provided with a wire between the paper layers of one paper base material 2. It is built in a state where a resonance tag member 11 in a shape of a triangle is embedded.
【００２７】以上のように、本発明は、種々の仕様から
なる非接触方式のタグ部材が用紙の紙層間に漉き込まれ
て構成されているが、用紙の紙層間に漉き込む非接触方
式のタグ部材は、１つに限定されるものではなく、複数
個の非接触方式のタグ部材を１枚の用紙に漉き込んでも
よいし、また種類の異なる非接触方式のタグ部材を同一
の用紙に漉き込んで設けるようにしてもよい。As described above, according to the present invention, the non-contact type tag member having various specifications is formed between the paper layers of the paper, but the non-contact type tag member is formed between the paper layers of the paper. The number of tag members is not limited to one. A plurality of non-contact type tag members may be formed on one sheet, or different types of non-contact type tag members may be formed on the same sheet. You may make it provide by making.
【００２８】[0028]
【発明の効果】以上説明したように、本発明の非接触方
式のタグ部材が漉き込まれてなる用紙は、用紙にタグ部
材を貼付又は添付させるための加工作業や手間を不要と
し、また用紙に貼付又は添付させたタグ部材を剥ぎ取ろ
うとしても、用紙の紙層間の中に非接触方式のタグ部材
が漉き込まれた状態で設けられているので、タグ部材を
剥ぎ取ることが不可能となり、したがって不正行為を働
く目的で別のタグ部材と交換される危険性がないという
効果を有する。As described above, the paper in which the non-contact type tag member of the present invention is sewn does not require any processing work or labor for attaching or attaching the tag member to the paper. Even if you try to peel off the tag member attached or attached to the paper, it is impossible to peel off the tag member because the non-contact type tag member is provided in the paper layer between the paper layers Therefore, there is an effect that there is no danger of being exchanged with another tag member for the purpose of performing an illegal act.
【００２９】また、用紙の紙層間に漉き込む接触方式の
タグ部材を、共振タグ部材又はＩＣタグ部材とすること
で、用紙の使用目的や用途に応じた機能を設けることが
でき各種システムに幅広く活用することができる。ま
た、非接触方式のタグ部材を、タグ基材にＩＣチップと
前記ＩＣチップに接続されたコイルが設けられた構成と
することで、用紙の紙層間に漉き込む際に安定した状態
で漉き込むことが可能となる。また、非接触方式のタグ
部材を、ＩＣチップとこのＩＣチップに接続されたコイ
ルからなる構成とすることで、非接触方式のタグ部材が
タグ基材を設けない部分だけ薄くなり、比較的薄い用紙
の紙層内に漉き込む場合に挿入しやすく適している。Also, by using a resonance tag member or an IC tag member as a contact type tag member that is laid between paper layers of a sheet, a function corresponding to the purpose and use of the sheet can be provided, and the system can be widely used in various systems. Can be used. In addition, the non-contact type tag member has a structure in which an IC chip and a coil connected to the IC chip are provided on the tag base material, so that the tag member is stably cut when the sheet is cut between the paper layers. It becomes possible. In addition, by making the non-contact type tag member a configuration including an IC chip and a coil connected to the IC chip, the non-contact type tag member becomes thinner only at a portion where no tag base material is provided, and is relatively thin. It is suitable for easy insertion into the paper layer of paper.
【００３０】また、非接触方式のタグ部材を、ＩＣチッ
プとこのＩＣチップ上に形成されたコイルからなる構成
とすることで、紙層内に漉き込むタグ部材が小さくてす
むので、サイズの小さい用紙に適している。また、非接
触方式のタグ部材を、タグ基材にコイルが設けられて構
成されている共振タグ部材とすることで、商品包装用紙
などにあらかじめ共振タグ部材を漉き込ませ、万引き防
止用紙として活用することができるなどの効果がある。In addition, since the non-contact type tag member is composed of an IC chip and a coil formed on the IC chip, the tag member to be embedded in the paper layer can be small, so that the size is small. Suitable for paper. In addition, by using a non-contact type tag member as a resonance tag member in which a coil is provided on the tag base material, the resonance tag member is pre-fabricated on product packaging paper and used as anti-shoplifting paper. There are effects such as being able to do.
【図１】本発明の非接触方式のタグ部材が漉き込まれて
なる用紙を製造する方法を説明するための概略図であ
る。FIG. 1 is a schematic diagram for explaining a method of manufacturing a paper sheet in which a non-contact type tag member of the present invention is laid.
【図２】本発明の非接触方式のタグ部材が漉き込まれて
なる用紙に係る第１実施形態の断面図である。FIG. 2 is a cross-sectional view of a first embodiment of a sheet into which a non-contact type tag member of the present invention is laid.
【図３】本発明に係る第１実施形態の斜視図である。FIG. 3 is a perspective view of the first embodiment according to the present invention.
【図４】本発明の非接触方式のタグ部材が漉き込まれて
なる用紙に係る第２実施形態の断面図である。FIG. 4 is a cross-sectional view of a second embodiment of a sheet into which a non-contact type tag member of the present invention is laid.
【図５】本発明に係る第２実施形態の斜視図である。FIG. 5 is a perspective view of a second embodiment according to the present invention.
【図６】本発明の非接触方式のタグ部材が漉き込まれて
なる用紙に係る第３実施形態の断面図である。FIG. 6 is a cross-sectional view of a third embodiment relating to a sheet into which a non-contact type tag member of the present invention is laid.
【図７】本発明の非接触方式のタグ部材が漉き込まれて
なる用紙に係る第４実施形態の断面図である。FIG. 7 is a cross-sectional view of a fourth embodiment of a sheet in which a non-contact type tag member according to the present invention is embedded.
【図８】本発明の非接触方式のタグ部材が漉き込まれて
なる用紙に係る第４実施形態の断面図である。FIG. 8 is a cross-sectional view of a fourth embodiment of a sheet in which a non-contact type tag member according to the present invention is embedded.
【図９】本発明の非接触方式のタグ部材が漉き込まれて
なる用紙を製造する際に使用するシリンダー２基を備え
た円網抄紙機の抄紙部分の模式図である。FIG. 9 is a schematic view of a papermaking portion of a mesh paper machine provided with two cylinders used for producing a paper in which the non-contact type tag member of the present invention is laid.
１，１Ａ，１Ｂ，１Ｃ，１Ｄ，１Ｅ 本発明の非接触方
式のタグ部材が漉き込まれてなる用紙 ２ 用紙基材 ３ 紙層間 ５，９，２１ コイル ６ 共振タグ部材 ４，７ タグ基材 ８，１２，１８ ＩＣチップ １０，２２ ＩＣタグ部材 １１ ワイヤ状の共振タグ部材 １２ ＩＣチップ上に形成されたコイルからなるＩＣタ
グ部材 １３ 円網抄紙機 １４ａ，１４ｂ ワイヤーシリンダー １５ａ，１５ｂ シリンダーパッド １６ａ，１６ｂ 紙料 １７ 毛布1, 1A, 1B, 1C, 1D, 1E Paper on which the non-contact type tag member of the present invention is sunk 2 Paper base 3 Paper interlayer 5, 9, 21 Coil 6 Resonant tag member 4, 7 Tag base 8, 12, 18 IC chip 10, 22 IC tag member 11 Resonant tag member in the form of wire 12 IC tag member composed of coil formed on IC chip 13 Mesh paper machine 14a, 14b Wire cylinder 15a, 15b Cylinder pad 16a , 16b Stock 17 Blanket
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2C005 MA02 MA04 MA05 MB10 NB03 NB04 NB20 QC09 RA03 RA14 RA21 SA03 SA06 SA08 SA30 5B035 AA13 BA03 BB09 CA01 CA23 5C084 AA03 AA09 AA13 AA19 BB12 BB40 CC35 DD26 EE07 FF02 FF27 GG07 GG09 GG52 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MA02 MA04 MA05 MB10 NB03 NB04 NB20 QC09 RA03 RA14 RA21 SA03 SA06 SA08 SA30 5B035 AA13 BA03 BB09 CA01 CA23 5C084 AA03 AA09 AA13 AA19 BB12 BB40 CC35 DD26 EE07GG02
Claims (6)
部材が漉き込まれた状態で内蔵されてなることを特徴と
する非接触方式のタグ部材が漉き込まれてなる用紙。1. A sheet comprising a non-contact type tag member embedded therein in a state where the non-contact type tag member is embedded between paper layers of a paper substrate.
部材又はＩＣタグ部材であることを特徴とする請求項１
記載の非接触方式のタグ部材が漉き込まれてなる用紙。2. The non-contact type tag member is a resonance tag member or an IC tag member.
Paper with the non-contact type tag member described therein.
にＩＣチップと前記ＩＣチップに接続されたコイルが設
けられて構成されていることを特徴とする請求項１記載
の非接触方式のタグ部材が漉き込まれてなる用紙。3. The non-contact type tag member according to claim 1, wherein the non-contact type tag member is configured by providing an IC chip and a coil connected to the IC chip on a tag base material. Paper made with the above tag material.
プと、前記ＩＣチップに接続されたコイルからなること
を特徴とする請求項１記載の非接触方式のタグ部材が漉
き込まれてなる用紙。4. The non-contact type tag member according to claim 1, wherein the non-contact type tag member comprises an IC chip and a coil connected to the IC chip. Paper.
プと、前記ＩＣチップ上に形成されたコイルからなるこ
とを特徴とする請求項１記載の非接触方式のタグ部材が
漉き込まれてなる用紙。5. The non-contact type tag member according to claim 1, wherein the non-contact type tag member comprises an IC chip and a coil formed on the IC chip. Paper.
にコイルが設けられて構成されている共振タグ部材であ
ることを特徴とする請求項１記載の非接触方式のタグ部
材が漉き込まれてなる用紙。6. The non-contact type tag member according to claim 1, wherein the non-contact type tag member is a resonance tag member in which a coil is provided on a tag base material. Paper that will be embedded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001103024A JP2002298118A (en) | 2001-04-02 | 2001-04-02 | Paper infiltering of contactless tag member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001103024A JP2002298118A (en) | 2001-04-02 | 2001-04-02 | Paper infiltering of contactless tag member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002298118A true JP2002298118A (en) | 2002-10-11 |
Family
ID=18956143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001103024A Pending JP2002298118A (en) | 2001-04-02 | 2001-04-02 | Paper infiltering of contactless tag member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002298118A (en) |
Cited By (11)
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|---|---|---|---|---|
| WO2005057479A1 (en) * | 2003-12-10 | 2005-06-23 | Oji Paper Co., Ltd. | Tape with embedded ic chip and sheet with embedded ic chip |
| JP2005222299A (en) * | 2004-02-05 | 2005-08-18 | Hitachi Ltd | Paper-like rfid tag and manufacturing method thereof |
| JP2005350823A (en) * | 2004-06-11 | 2005-12-22 | Hokuetsu Paper Mills Ltd | Paper watermarked with noncontact-type ic tag and method for producing the paper |
| JP2006082328A (en) * | 2004-09-15 | 2006-03-30 | Fuji Xerox Co Ltd | Sheet with ic tag |
| JP2006161175A (en) * | 2004-12-02 | 2006-06-22 | Daio Paper Corp | Paper for ic tip card and the ic tip card using the same |
| JP2006270317A (en) * | 2005-03-23 | 2006-10-05 | Ricoh Co Ltd | Information input/output apparatus and storage medium |
| WO2008001703A1 (en) | 2006-06-26 | 2008-01-03 | Semiconductor Energy Laboratory Co., Ltd. | Paper including semiconductor device and manufacturing method thereof |
| JPWO2007049669A1 (en) * | 2005-10-26 | 2009-04-30 | 日本製紙株式会社 | IC tag paper |
| JP2009532594A (en) * | 2006-04-07 | 2009-09-10 | グルッポ コルデノンス エッセ ピー アー | Security paper materials, particularly for labeling and packaging, and methods of manufacturing the same |
| JP2010185149A (en) * | 2009-02-10 | 2010-08-26 | Oji Tokushushi Kk | Method for producing ic-inlet-included paper |
| US7851886B2 (en) | 2006-06-26 | 2010-12-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005057479A1 (en) * | 2003-12-10 | 2005-06-23 | Oji Paper Co., Ltd. | Tape with embedded ic chip and sheet with embedded ic chip |
| JP2005222299A (en) * | 2004-02-05 | 2005-08-18 | Hitachi Ltd | Paper-like rfid tag and manufacturing method thereof |
| JP4567988B2 (en) * | 2004-02-05 | 2010-10-27 | 株式会社日立製作所 | Paper-like RFID tag and manufacturing method thereof |
| JP2005350823A (en) * | 2004-06-11 | 2005-12-22 | Hokuetsu Paper Mills Ltd | Paper watermarked with noncontact-type ic tag and method for producing the paper |
| JP4579586B2 (en) * | 2004-06-11 | 2010-11-10 | 北越紀州製紙株式会社 | Manufacturing method of paper in which non-contact type IC tag is inserted |
| JP2006082328A (en) * | 2004-09-15 | 2006-03-30 | Fuji Xerox Co Ltd | Sheet with ic tag |
| JP2006161175A (en) * | 2004-12-02 | 2006-06-22 | Daio Paper Corp | Paper for ic tip card and the ic tip card using the same |
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| JP2006270317A (en) * | 2005-03-23 | 2006-10-05 | Ricoh Co Ltd | Information input/output apparatus and storage medium |
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| JP2009532594A (en) * | 2006-04-07 | 2009-09-10 | グルッポ コルデノンス エッセ ピー アー | Security paper materials, particularly for labeling and packaging, and methods of manufacturing the same |
| US8278663B2 (en) | 2006-06-26 | 2012-10-02 | Semiconductor Energy Laboratory Co., Ltd. | Paper including semiconductor device and manufacturing method thereof |
| WO2008001703A1 (en) | 2006-06-26 | 2008-01-03 | Semiconductor Energy Laboratory Co., Ltd. | Paper including semiconductor device and manufacturing method thereof |
| US7851886B2 (en) | 2006-06-26 | 2010-12-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
| US7879654B2 (en) | 2006-06-26 | 2011-02-01 | Semiconductor Energy Laboratory Co., Ltd. | Paper including semiconductor device and manufacturing method thereof |
| US8039353B2 (en) | 2006-06-26 | 2011-10-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
| US8432018B2 (en) | 2006-06-26 | 2013-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
| US8648439B2 (en) | 2006-06-26 | 2014-02-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
| US7667310B2 (en) | 2006-06-26 | 2010-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Paper including semiconductor device and manufacturing method thereof |
| JP2010185149A (en) * | 2009-02-10 | 2010-08-26 | Oji Tokushushi Kk | Method for producing ic-inlet-included paper |
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Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110413 |