JP2002289442A - Electronic component with dummy terminal and adhesive sheet with dummy terminal - Google Patents

Electronic component with dummy terminal and adhesive sheet with dummy terminal

Info

Publication number
JP2002289442A
JP2002289442A JP2001084583A JP2001084583A JP2002289442A JP 2002289442 A JP2002289442 A JP 2002289442A JP 2001084583 A JP2001084583 A JP 2001084583A JP 2001084583 A JP2001084583 A JP 2001084583A JP 2002289442 A JP2002289442 A JP 2002289442A
Authority
JP
Japan
Prior art keywords
lead wire
core member
wire portion
dummy terminal
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001084583A
Other languages
Japanese (ja)
Inventor
Takeo Kawashima
武夫 川嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mostec Inc
CTU of Delaware Inc
Original Assignee
Mostec Inc
Mostek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mostec Inc, Mostek Corp filed Critical Mostec Inc
Priority to JP2001084583A priority Critical patent/JP2002289442A/en
Publication of JP2002289442A publication Critical patent/JP2002289442A/en
Pending legal-status Critical Current

Links

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  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component with a dummy terminal which can provide a pattern line on a surface mounting substrate in a portion facing a surface mounting portion and can be mounted on the surface of the surface mounting substrate without using bond and lowering surface mounting strength, and an adhesive sheet with a dummy terminal comprising the electronic component with the dummy terminal. SOLUTION: This electronic component is provided with a coil having a coil body 2 and a practically planar lead wire 3, a core member 4 for holding the coil body 2 and a sheet member 5 located on the base of the core member 4, having an electric insulating property and adhesion. The lead wire 3, drawn out of the core member to the base side of the core member 4 is fixed on the base of the core member 4. The lead wire 3 on the base of the core member 4 is not located across the base, and the sheet member 5 has the dummy terminal 5b at a position which is not overlapped with the lead wire part 3 opposite to the side, where the core member 4 is provided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、表面実装基板への
表面実装に用いられる電子部品とその電子部品を構成す
る接着シートとに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component used for surface mounting on a surface mounting board and an adhesive sheet constituting the electronic component.

【0002】[0002]

【従来の技術】表面実装基板へ表面実装するための従来
のコイル部品11は、図7に示すように、コイル本体部
12及びリード線部13を有するコイルと、コイル本体
部12を保持するコア部材14と、そのコア部材14の
底面に配置され、コア部材14の内部からコア部材14
の底面側に引き出されたリード線部13をコア部材14
の底面に固定するためのシート部材15とで構成されて
いる。
2. Description of the Related Art As shown in FIG. 7, a conventional coil component 11 for surface mounting on a surface mounting board includes a coil having a coil body 12 and a lead wire section 13 and a core holding the coil body 12. A member 14 and a core member 14 disposed on the bottom surface of the core member
The lead wire portion 13 drawn out to the bottom side of the
And a sheet member 15 for fixing to the bottom surface of the sheet.

【0003】このようなコイル部品11は、表面実装基
板に表面実装されるさい、コア部材14の底面と表面実
装基板とが対向するように表面実装基板に表面実装され
る。
When such a coil component 11 is surface-mounted on a surface-mount substrate, the coil component 11 is surface-mounted on the surface-mount substrate such that the bottom surface of the core member 14 faces the surface-mount substrate.

【0004】図8に、図7において矢印A方向から見た
コイル部品の側面を示す。
FIG. 8 shows a side view of the coil component as viewed from the direction of arrow A in FIG.

【0005】[0005]

【発明が解決しようとする課題】図7、図8に示すよう
に、従来のコイル部品11においては、表面実装基板に
コイル部品11が表面実装されたときの実装強度を確保
するために、コア部材14の底面に配置されるリード線
部13を長くする必要があった。ここで、図9に、従来
のコイル部品11をコア部材14の底面側から見たとき
の様子を示す。図9に示すように、従来のコイル部品1
1においては、コア部材14の底面に配置されるリード
線部13は、その底面を横切るように配置されている。
As shown in FIGS. 7 and 8, in the conventional coil component 11, in order to secure a mounting strength when the coil component 11 is surface-mounted on a surface mounting board, a core is required. It was necessary to lengthen the lead wire portion 13 disposed on the bottom surface of the member 14. Here, FIG. 9 shows a state where the conventional coil component 11 is viewed from the bottom surface side of the core member 14. As shown in FIG.
In 1, the lead wire portion 13 disposed on the bottom surface of the core member 14 is disposed so as to cross the bottom surface.

【0006】このように、従来のコイル部品11では、
コア部材14の底面に配置されるリード線部13が長か
ったので、図10に示すように、表面実装基板16上に
リード線部13と直交するパターン線17を設けること
ができなかった。パターン線17を設けるために、コア
部材14の底面に配置されるリード線部13を短くする
ことも考えられるが、そうすると、コイル部品を表面実
装基板へ実装するさい、リード線部13の厚みにより、
安定してコイル部品を表面実装基板へ実装することがで
きないという問題がでてくる。つまり実装強度が低下し
てしまう。その実装強度の低下を防止するためには、コ
イル部品の一部をボンドを用いて表面実装基板に接着す
る必要が生じる。なお、図10は、表面実装基板16上
にコイル部品11を表面実装し、かつ、表面実装基板1
6上に、コイル部品11のリード線部13と直交するパ
ターン線17を仮に設けた状態を、表面実装基板16底
面側から見たときの図である。
Thus, in the conventional coil component 11,
Since the lead wire portion 13 disposed on the bottom surface of the core member 14 was long, a pattern wire 17 orthogonal to the lead wire portion 13 could not be provided on the surface mount board 16 as shown in FIG. In order to provide the pattern wire 17, it is conceivable to shorten the lead wire portion 13 disposed on the bottom surface of the core member 14. However, when the coil component is mounted on the surface mounting board, the thickness of the lead wire portion 13 may vary. ,
There is a problem that the coil component cannot be stably mounted on the surface mounting board. That is, the mounting strength is reduced. In order to prevent the mounting strength from lowering, it is necessary to bond a part of the coil component to the surface mounting substrate using a bond. FIG. 10 shows that the coil component 11 is surface-mounted on the surface-mount substrate 16 and the surface-mount substrate 1
FIG. 6 is a diagram when a pattern wire 17 orthogonal to the lead wire portion 13 of the coil component 11 is provisionally provided on 6, as viewed from the bottom surface side of the surface mounting board 16.

【0007】ここまでは、従来の電子部品の課題につい
て、コイル部品を例にとって説明してきたが、コイル部
品に限らず、本体部及びリード線部を有する電子部材と
その電子部材の本体部を保持するコア部材とを備えた電
子部品においては、上記のコイル部品と同様に、表面実
装基板に表面実装されたときの実装強度を確保するため
に、底面に配置されるリード線部を長くする必要があ
り、そのため、表面実装基板上にリード線部と直交する
パターン線を設けることができなかった。底面に配置さ
れるリード線部を短くすると、電子部品の表面実装基板
への実装強度が低下してしまい、それを防ぐには電子部
品の一部をボンドを用いて表面実装基板に接着しなけれ
ばならなかった。
Heretofore, the problem of the conventional electronic component has been described by taking a coil component as an example. However, the present invention is not limited to the coil component, and an electronic member having a main body and a lead wire and a main body of the electronic member are held. In the electronic component provided with the core member, the lead wire portion disposed on the bottom surface needs to be lengthened in order to secure the mounting strength when the electronic component is surface-mounted on the surface mounting board, similarly to the coil component described above. For this reason, it has not been possible to provide a pattern line perpendicular to the lead wire portion on the surface mount substrate. If the lead wires on the bottom are shortened, the mounting strength of the electronic components on the surface-mount board will decrease.To prevent this, some of the electronic components must be bonded to the surface-mount board using bonds. I had to.

【0008】そこで、本発明は、上記従来の課題を考慮
し、表面実装基板へ表面実装された場合に、表面実装さ
れた部分と対向する部分の表面実装基板にパターン線を
設けることを可能とし、かつボンドを用いることなく表
面実装強度を低下させないで表面実装基板へ表面実装可
能なダミー端子付き電子部品と、そのダミー端子付き電
子部品を構成するダミー端子付き接着シートとを提供す
ることを目的とする。
In view of the above-mentioned problems, the present invention makes it possible to provide a pattern line on a portion of a surface-mounting substrate facing a surface-mounted portion when the surface-mounting is performed on the surface-mounting substrate. To provide an electronic component with dummy terminals that can be surface-mounted on a surface-mount substrate without reducing the surface-mounting strength without using a bond, and an adhesive sheet with dummy terminals that constitutes the electronic component with dummy terminals. And

【0009】[0009]

【課題を解決するための手段】第1の本発明(請求項1
に対応)は、本体部及び実質上平面形状のリード線部を
有する電子部材と、前記本体部を保持するコア部材と、
そのコア部材の底面に配置され、前記コア部材の内部か
ら前記底面側に引き出された前記リード線部を前記底面
に固定している、電気絶縁性及び粘着性を有するシート
部材とを備え、前記底面における前記リード線部は、前
記底面を横切るようには配置されておらず、前記シート
部材が、前記コア部材が設けられている側と反対側の前
記リード線部と重ならない位置にダミー端子を有してい
るダミー端子付き電子部品である。
Means for Solving the Problems The first invention (claim 1)
An electronic member having a main body portion and a substantially planar shape lead wire portion, a core member holding the main body portion,
A sheet member having electrical insulation and adhesiveness, which is disposed on the bottom surface of the core member and fixes the lead wire portion drawn out from the inside of the core member to the bottom surface side to the bottom surface, The lead wire portion on the bottom surface is not arranged so as to cross the bottom surface, and the dummy terminal is located at a position where the sheet member does not overlap with the lead wire portion on the side opposite to the side on which the core member is provided. Is an electronic component with a dummy terminal.

【0010】第2の本発明(請求項2に対応)は、前記
底面における前記リード線部の厚さと、前記ダミー端子
の厚さとが実質上同一である第1の本発明に記載のダミ
ー端子付き電子部品である。
A second invention (corresponding to claim 2) is the dummy terminal according to the first invention, wherein the thickness of the lead wire portion on the bottom surface is substantially the same as the thickness of the dummy terminal. Electronic parts with.

【0011】第3の本発明(請求項3に対応)は、前記
電子部材がコイルである第1または第2の本発明に記載
のダミー端子付き電子部品である。
A third invention (corresponding to claim 3) is the electronic component with dummy terminals according to the first or second invention, wherein the electronic member is a coil.

【0012】第4の本発明(請求項4に対応)は、本体
部がコア部材に保持された、実質上平面形状のリード線
部を有する電子部材の、前記リード線部を前記コア部材
の底面に固定するためのものであって、前記コア部材の
底面に配置され、電気絶縁性及び粘着性を有する接着シ
ートと、その接着シートに固定されているダミー端子と
を備え、前記底面における前記リード線部が、前記底面
を横切るようには配置されず、前記ダミー端子が、前記
底面において前記リード線部と重ならない位置に、前記
接着シートに固定されているダミー端子付き接着シート
である。
A fourth aspect of the present invention (corresponding to claim 4) is an electronic member having a substantially planar shape lead wire portion whose main body portion is held by a core member. For fixing to the bottom surface, disposed on the bottom surface of the core member, comprising an adhesive sheet having electrical insulation and adhesiveness, and a dummy terminal fixed to the adhesive sheet, the said in the bottom surface An adhesive sheet with dummy terminals, wherein a lead wire portion is not arranged to cross the bottom surface and the dummy terminal is fixed to the adhesive sheet at a position on the bottom surface that does not overlap with the lead wire portion.

【0013】第5の本発明(請求項5に対応)は、前記
ダミー端子の厚さが、前記底面における前記リード線部
の厚さと実質上同一である第4の本発明に記載のダミー
端子付き接着シートである。
A fifth invention (corresponding to claim 5) is the dummy terminal according to the fourth invention, wherein the thickness of the dummy terminal is substantially the same as the thickness of the lead wire portion on the bottom surface. It is an adhesive sheet attached.

【0014】[0014]

【発明の実施の形態】以下に、本発明の実施の形態を図
面を参照して説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0015】本実施の形態では、説明の便宜上、コイル
部品を例にとって、本発明のダミー端子付き電子部品
と、そのダミー端子付き電子部品を構成するダミー端子
付き接着シートとを説明する。
In this embodiment, for convenience of explanation, an electronic component with a dummy terminal of the present invention and an adhesive sheet with a dummy terminal constituting the electronic component with a dummy terminal will be described taking a coil component as an example.

【0016】先ず、図1に、本実施の形態のコイル部品
の側面を示す。図1に示すように、本実施の形態のコイ
ル部品1は、コイル本体部2及びリード線部3を有する
コイルと、コイル本体部2を保持するコア部材4と、そ
のコア部材4の底面に配置され、コア部材4の内部から
コア部材4の底面側に引き出されたリード線部3をコア
部材4の底面に固定するためのシート部材5とで構成さ
れている。
First, FIG. 1 shows a side view of the coil component of the present embodiment. As shown in FIG. 1, a coil component 1 according to the present embodiment includes a coil having a coil body 2 and a lead wire 3, a core member 4 holding the coil body 2, and a bottom surface of the core member 4. And a sheet member 5 for fixing the lead wire portion 3 drawn out from the inside of the core member 4 to the bottom surface side of the core member 4 to the bottom surface of the core member 4.

【0017】ここで、コイル本体部2は従来のコイル部
品11のコイル本体部12と同一であり、コア部材4も
従来のコイル部品11のコア部材14と同一である。し
かしながら、リード線部3は従来のコイル部品11のリ
ード線部13と異なり、シート部材5も従来のコイル部
品11のシート部材15と異なる。それら相違について
は後述する。
The coil body 2 is the same as the coil body 12 of the conventional coil component 11, and the core member 4 is the same as the core member 14 of the conventional coil component 11. However, the lead wire portion 3 is different from the lead wire portion 13 of the conventional coil component 11, and the sheet member 5 is also different from the sheet member 15 of the conventional coil component 11. These differences will be described later.

【0018】次に、図2に、本実施の形態のコイル部品
1を、コア部材4の底面側から見たときの様子を示す。
Next, FIG. 2 shows a state of the coil component 1 according to the present embodiment when viewed from the bottom surface side of the core member 4.

【0019】次に、本実施の形態のコイル部品1を構成
するシート部材5の概略構成を説明する。そのシート部
材5は、図3に示すように、電気絶縁性及び粘着性を有
する接着シート5aと、その接着シート5aに固定され
ている銅板のダミー端子5bとで構成されている。本実
施の形態おけるシート部材5は、ダミー端子5bが設け
られている点で従来のコイル部品11のシート部材15
と異なる。そのダミー端子5bの厚さは、コア部材4の
底面に固定されているリード線部3の厚さと実質上同一
である。なお、図3(a)はダミー端子5bが設けられ
ている側から見たときのシート部材5の平面図であり、
図3(b)はシート部材5の側面図である。また、本実
施の形態のシート部材5には、説明の便宜上、ダミー端
子5bは2個設けられているものとする。しかしなが
ら、ダミー端子5bは、シート部材5に2個設けられて
いるものと限定することはない。個数は限定されない
し、配置位置も限定されない。要するに、ダミー端子5
bは、コア部材4の底面においてリード線部3と重なら
ない位置に、接着シート5aに固定されておりさえすれ
ばよい。
Next, a schematic configuration of the sheet member 5 constituting the coil component 1 of the present embodiment will be described. As shown in FIG. 3, the sheet member 5 includes an adhesive sheet 5a having electrical insulation and adhesiveness, and a dummy terminal 5b of a copper plate fixed to the adhesive sheet 5a. The sheet member 5 in the present embodiment is different from the sheet member 15 of the conventional coil component 11 in that the dummy terminal 5b is provided.
And different. The thickness of the dummy terminal 5b is substantially the same as the thickness of the lead wire portion 3 fixed to the bottom surface of the core member 4. FIG. 3A is a plan view of the sheet member 5 as viewed from the side where the dummy terminals 5b are provided.
FIG. 3B is a side view of the sheet member 5. Further, it is assumed that two dummy terminals 5b are provided on the sheet member 5 of the present embodiment for convenience of description. However, the number of the dummy terminals 5 b is not limited to two provided on the sheet member 5. The number is not limited, and the arrangement position is not limited. In short, dummy terminal 5
It is sufficient that b is fixed to the adhesive sheet 5a at a position on the bottom surface of the core member 4 which does not overlap the lead wire portion 3.

【0020】上述したコイル部品1を表面実装基板に表
面実装するさいは、従来と同様に、コア部材4の底面と
表面実装基板とが対向するように、コイル部品1を表面
実装基板に表面実装する。具体的には、図4に示すよう
に、表面実装基板6に設けられているパターン線7に印
刷技術を用いてクリーム半田8を塗布し、その上にコイ
ル部品1の底面のリード線部3およびダミー端子5bを
配置することによって、コイル部品1を表面実装基板6
に表面実装するのである。
When the above-described coil component 1 is surface-mounted on a surface-mounting substrate, the coil component 1 is surface-mounted on the surface-mounting substrate such that the bottom surface of the core member 4 and the surface-mounting substrate face each other, as in the related art. I do. Specifically, as shown in FIG. 4, cream solder 8 is applied to pattern lines 7 provided on surface mounting substrate 6 by using a printing technique, and lead wires 3 on the bottom surface of coil component 1 are further applied thereon. And the dummy terminals 5b, the coil component 1 is
Surface mounting.

【0021】次に、本実施の形態のコイル部品1と、従
来のコイル部品11との相違点を説明しながら、本実施
の形態のコイル部品1の特徴を述べる。
Next, the features of the coil component 1 of the present embodiment will be described while explaining the differences between the coil component 1 of the present embodiment and the conventional coil component 11.

【0022】従来のコイル部品11では、図9に示すよ
うに、コア部材14における底面のリード線部13は、
その底面を横切るように配置されている。それに対し、
本実施の形態のコイル部品1では、図2に示すように、
コア部材4の底面におけるリード線部3は、コア部材4
の底面を横切るようには配置されていない。つまり、コ
ア部材4の底面に配置されているリード線部3の長さ
が、従来のリード線部13の長さより短くなっていて、
コア部材4の実質上四角形の底面の一辺からそれと対向
する一辺まではリード線部3は伸びていないということ
である。これが第1の相違である。
In the conventional coil component 11, as shown in FIG. 9, the lead wire portion 13 on the bottom surface of the core member 14 is
It is arranged to cross the bottom surface. For it,
In the coil component 1 of the present embodiment, as shown in FIG.
The lead wire portion 3 on the bottom surface of the core member 4
It is not arranged to cross the bottom of. That is, the length of the lead wire portion 3 disposed on the bottom surface of the core member 4 is shorter than the length of the conventional lead wire portion 13,
That is, the lead wire portion 3 does not extend from one side of the substantially rectangular bottom surface of the core member 4 to one side opposite thereto. This is the first difference.

【0023】従来では図10を用いて説明したように、
表面実装基板のコイル部品11が実装される部分には、
リード線部13が配置されている方向と直交する方向に
パターン線を設けることはできなかったが、上述した第
1の相違により、本実施の形態のコイル部品1を用いる
と、コア部材4の底面においてリード線部3がコア部材
4の底面を横切るようには配置されていないので、表面
実装基板のコイル部品1が実装される部分には、リード
線部3が配置される方向と直交する方向にパターン線を
設けることができるようになる。したがって、表面実装
基板を大きくすることなく、多数の電子部品を表面実装
することが可能となり、またパターン線をある程度自由
度を高めて表面実装基板に設けることができるようにな
る。つまり、表面実装基板を有効利用することができる
ようになるということである。
Conventionally, as described with reference to FIG.
In the part where the coil component 11 of the surface mount board is mounted,
The pattern wire could not be provided in a direction orthogonal to the direction in which the lead wire portions 13 were arranged. However, due to the first difference described above, the use of the coil component 1 of the present embodiment Since the lead wire portion 3 is not arranged so as to cross the bottom surface of the core member 4 on the bottom surface, the portion where the coil component 1 of the surface mount board is mounted is orthogonal to the direction in which the lead wire portion 3 is arranged. It becomes possible to provide a pattern line in the direction. Therefore, it is possible to mount a large number of electronic components on the surface without increasing the size of the surface mount substrate, and it is possible to provide the pattern lines on the surface mount substrate with a certain degree of freedom. That is, the surface mount substrate can be used effectively.

【0024】第2の相違は、上述したように、本実施の
形態のコイル部品1を構成するシート部材5が、リード
線部3の厚さと実質上同一の厚さを有する銅のダミー端
子5bを有しているという点である。
The second difference is that, as described above, the sheet member 5 constituting the coil component 1 of the present embodiment is formed of a copper dummy terminal 5 b having substantially the same thickness as the thickness of the lead wire portion 3. Is that it has

【0025】図2を用いて説明したように、本実施の形
態のコイル部品1のコア部材4の底面におけるリード線
部3は、コア部材4の底面を横切るようには配置されて
いない。しかしながら、図1および図2に示すように、
リード線部3の厚さと実質上同一の厚さを有する銅板の
ダミー端子5bが、接着シート5aのコイル本体部2が
設けられている側と反対側のリード線部3と重ならない
位置に設けられているので、コイル部品1を表面実装基
板に安定して表面実装することが可能となる。リード線
部3の厚さとダミー端子5bの厚さとが実質上同一であ
るからである。
As described with reference to FIG. 2, the lead wire portion 3 on the bottom surface of the core member 4 of the coil component 1 of the present embodiment is not arranged so as to cross the bottom surface of the core member 4. However, as shown in FIGS. 1 and 2,
A dummy terminal 5b of a copper plate having substantially the same thickness as that of the lead wire portion 3 is provided at a position not overlapping the lead wire portion 3 of the adhesive sheet 5a on the side opposite to the side on which the coil body portion 2 is provided. Therefore, the coil component 1 can be stably mounted on the surface mounting board. This is because the thickness of the lead wire portion 3 and the thickness of the dummy terminal 5b are substantially the same.

【0026】したがって、コア部材4の底面におけるリ
ード線部3の長さを短くしても、ボンドを用いることな
くコイル部品1を表面実装基板に安定して、つまり実装
強度を確保して表面実装することが可能となる。
Therefore, even if the length of the lead wire portion 3 on the bottom surface of the core member 4 is shortened, the coil component 1 is stably mounted on the surface mounting substrate without using a bond, that is, the mounting strength is secured and the surface mounting is performed. It is possible to do.

【0027】次に、本実施の形態のコイル部品1を構成
するシート部材5をさらに説明する。シート部材5の概
略構成は図3に示したとおりであるが、シート部材5を
構成する接着シート5aは、図5に示すように、シート
基材51と、そのシート基材51の両面に設けられる接
着ボンド層52a、52bとで構成されている。
Next, the sheet member 5 constituting the coil component 1 of the present embodiment will be further described. Although the schematic configuration of the sheet member 5 is as shown in FIG. 3, the adhesive sheet 5a constituting the sheet member 5 is provided on both sides of the sheet substrate 51 and the sheet substrate 51 as shown in FIG. Adhesive bond layers 52a and 52b.

【0028】図4を用いて説明したように、コイル部品
1の表面実装基板6への表面実装は、先ず、表面実装基
板6に設けられているパターン線7に印刷技術を用いて
クリーム半田8を塗布し、その上にコイル部品1の底面
のリード線部3およびダミー端子5bを配置することに
よって行う。ところで、半田フロー温度が230℃を超
える場合がある。その場合、耐熱特性に優れないシート
基材51を用いると、シート部材5は、コア部材4の底
面側に引き出されたリード線部3をコア部材4の底面に
固定する機能を発揮することができなくなる。そこで、
半田フロー温度が230℃を超える場合には、シート基
材51として耐熱特性に優れたものを用いることとす
る。さらに、高い耐電圧性能を必要とする場合には、シ
ート基材51としてノーメックスシート等を使用する必
要がある。
As described with reference to FIG. 4, the surface mounting of the coil component 1 on the surface mounting substrate 6 is performed by first applying a cream solder 8 to the pattern lines 7 provided on the surface mounting substrate 6 by using a printing technique. Is applied, and the lead wires 3 on the bottom surface of the coil component 1 and the dummy terminals 5b are arranged thereon. Incidentally, the solder flow temperature may exceed 230 ° C. in some cases. In this case, when the sheet base material 51 having no excellent heat resistance is used, the sheet member 5 can exhibit a function of fixing the lead wire portion 3 drawn to the bottom surface side of the core member 4 to the bottom surface of the core member 4. become unable. Therefore,
When the solder flow temperature exceeds 230 ° C., a sheet base material 51 having excellent heat resistance is used. Furthermore, when high withstand voltage performance is required, it is necessary to use a Nomex sheet or the like as the sheet base material 51.

【0029】なお、耐熱特性および高い耐電圧性能を必
要とせず接着ボンド層52a、52bを固定することの
みを目的とする場合には、シート基材51として綿糸生
地やフエルト等を使用してもよい。この場合は、接着ボ
ンド層52a、52bが絶縁性能を有していることが必
要である。
If the purpose is only to fix the adhesive bond layers 52a and 52b without requiring heat resistance and high withstand voltage performance, even if a cotton yarn cloth or felt is used as the sheet base material 51, Good. In this case, it is necessary that the adhesive bond layers 52a and 52b have insulating performance.

【0030】また、シート部材5が低電圧性能を有して
おりさえすればよい場合は、シート基材51を用いずに
接着ボンド層のみでシート部材5が構成されているとし
てもよい。
When the sheet member 5 only needs to have low voltage performance, the sheet member 5 may be constituted only by the adhesive bond layer without using the sheet substrate 51.

【0031】なお、上述した実施の形態では、コア部材
4の底面におけるリード線部3は、コア部材4の底面を
横切るようには配置されていないが、リード線部3の厚
さと実質上同一の厚さを有する銅板のダミー端子5bが
接着シート5aに設けられているので、コイル部品1を
表面実装基板に安定して表面実装することができるとし
た。しかしながら、コア部材4の底面におけるリード線
部3の長さを、図6(a)、(b)に示すように調整す
ると、ダミー端子5bが設けられていない接着シート5
aを利用しても、コイル部品1a、1bを表面実装基板
に安定して表面実装することができる。また、コア部材
4の底面におけるリード線部3がコア部材4の底面を横
切っていないので、コイル部品が実装される部分の表面
実装基板には、リード線部3が配置される方向と直交す
る方向にパターン線を設けることができる。
In the above-described embodiment, the lead wire portion 3 on the bottom surface of the core member 4 is not disposed so as to cross the bottom surface of the core member 4, but has substantially the same thickness as the lead wire portion 3. Since the dummy terminal 5b made of a copper plate having a thickness of 5 mm is provided on the adhesive sheet 5a, the coil component 1 can be stably mounted on the surface mounting board. However, when the length of the lead wire portion 3 on the bottom surface of the core member 4 is adjusted as shown in FIGS. 6A and 6B, the adhesive sheet 5 having no dummy terminal 5b is provided.
Even if a is used, the coil components 1a and 1b can be stably mounted on the surface mounting board. In addition, since the lead wire portion 3 on the bottom surface of the core member 4 does not cross the bottom surface of the core member 4, the direction in which the lead wire portion 3 is arranged is perpendicular to the surface mounting board where the coil component is mounted. Pattern lines can be provided in the direction.

【0032】最後に、上述した実施の形態では、コイル
部品を例にとって本発明のダミー端子付き電子部品とそ
のダミー端子付き電子部品を構成するダミー端子付き接
着シートとを説明したが、電子部品を構成する電子部材
はコイルに限定されない。要するに、本発明におけるダ
ミー端子付き電子部品は、本体部及び実質上平面形状の
リード線部を有する電子部材と、その電子部材の本体部
を保持するコア部材と、そのコア部材の底面に配置さ
れ、コア部材の内部からコア部材の底面側に引き出され
たリード線部をコア部材の底面に固定している、電気絶
縁性及び粘着性を有するシート部材とを備えている電子
部品であって、コア部材の底面におけるリード線部が、
その底面を横切るようには配置されておらず、シート部
材が、コア部材が設けられている側と反対側のリード線
部と重ならない位置にダミー端子を有しているものであ
る。
Finally, in the above-described embodiment, the electronic component with the dummy terminal of the present invention and the adhesive sheet with the dummy terminal constituting the electronic component with the dummy terminal have been described by taking the coil component as an example. The constituent electronic members are not limited to coils. In short, the electronic component with a dummy terminal according to the present invention includes an electronic member having a main body and a substantially flat-shaped lead wire, a core member holding the main body of the electronic member, and a bottom surface of the core member. An electronic component comprising a sheet member having electrical insulation and adhesiveness, fixing a lead wire portion drawn out from the inside of the core member to the bottom surface side of the core member on the bottom surface of the core member, The lead wire on the bottom of the core member is
It is not arranged so as to cross the bottom surface, and the sheet member has a dummy terminal at a position that does not overlap the lead wire portion on the side opposite to the side on which the core member is provided.

【0033】[0033]

【発明の効果】以上説明したところから明らかなよう
に、本発明は、表面実装基板へ表面実装された場合に、
表面実装された部分と対向する部分の表面実装基板にパ
ターン線を設けることを可能とし、かつボンドを用いる
ことなく表面実装強度を低下させないで表面実装基板へ
表面実装可能なダミー端子付き電子部品と、そのダミー
端子付き電子部品を構成するダミー端子付き接着シート
とを提供することができる。
As is apparent from the above description, the present invention is applicable to a case where
An electronic component with dummy terminals that allows pattern lines to be provided on the surface mounting substrate in the part opposite to the surface mounted part and that can be surface mounted on the surface mounting substrate without using a bond and reducing the surface mounting strength And an adhesive sheet with dummy terminals constituting the electronic component with dummy terminals.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態のコイル部品の側面図FIG. 1 is a side view of a coil component according to an embodiment of the present invention.

【図2】本発明の実施の形態のコイル部品の底面図FIG. 2 is a bottom view of the coil component according to the embodiment of the present invention.

【図3】本発明の実施の形態のコイル部品を構成するシ
ート部材の概略構成図
FIG. 3 is a schematic configuration diagram of a sheet member constituting the coil component according to the embodiment of the present invention.

【図4】本発明の実施の形態のコイル部品を表面実装基
板に表面実装するさいの表面実装工程を説明する図
FIG. 4 is a view for explaining a surface mounting process when the coil component according to the embodiment of the present invention is surface-mounted on a surface-mount substrate.

【図5】本発明の実施の形態のコイル部品を構成するシ
ート部材の詳細な構成図
FIG. 5 is a detailed configuration diagram of a sheet member constituting the coil component according to the embodiment of the present invention.

【図6】ダミー端子を有しないコイル部品の側面図FIG. 6 is a side view of a coil component having no dummy terminal.

【図7】従来のコイル部品の斜視図FIG. 7 is a perspective view of a conventional coil component.

【図8】従来のコイル部品の側面図FIG. 8 is a side view of a conventional coil component.

【図9】従来のコイル部品の底面図FIG. 9 is a bottom view of a conventional coil component.

【図10】従来のコイル部品の課題を説明するための図FIG. 10 is a diagram for explaining a problem of a conventional coil component.

【符号の説明】 1 コイル部品 2 コイル本体部 3 リード線部 4 コア部材 5 シート部材 5a 接着シート 51 シート基材 52a、52b 接着ボンド層 5b ダミー端子 6 表面実装基板 7 パターン線 8 クリーム半田 11 コイル部品 12 コイル本体部 13 リード線部 14 コア部材 15 シート部材 16 表面実装基板 17 パターン線[Description of Signs] 1 Coil component 2 Coil body 3 Lead wire 4 Core member 5 Sheet member 5a Adhesive sheet 51 Sheet base material 52a, 52b Adhesive bond layer 5b Dummy terminal 6 Surface mounting board 7 Pattern wire 8 Cream solder 11 Coil Components 12 Coil body 13 Lead wire 14 Core member 15 Sheet member 16 Surface mount board 17 Pattern wire

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 本体部及び実質上平面形状のリード線部
を有する電子部材と、前記本体部を保持するコア部材
と、そのコア部材の底面に配置され、前記コア部材の内
部から前記底面側に引き出された前記リード線部を前記
底面に固定している、電気絶縁性及び粘着性を有するシ
ート部材とを備え、 前記底面における前記リード線部は、前記底面を横切る
ようには配置されておらず、 前記シート部材が、前記コア部材が設けられている側と
反対側の前記リード線部と重ならない位置にダミー端子
を有しているダミー端子付き電子部品。
An electronic member having a main body portion and a lead wire portion having a substantially planar shape, a core member holding the main body portion, and a bottom surface of the core member. A sheet member having electrical insulation and adhesiveness, fixing the lead wire portion pulled out to the bottom surface, wherein the lead wire portion on the bottom surface is arranged to cross the bottom surface. An electronic component with a dummy terminal, wherein the sheet member has a dummy terminal at a position where the sheet member does not overlap the lead wire portion on a side opposite to a side on which the core member is provided.
【請求項2】 前記底面における前記リード線部の厚さ
と、前記ダミー端子の厚さとが実質上同一である請求項
1に記載のダミー端子付き電子部品。
2. The electronic component with dummy terminals according to claim 1, wherein the thickness of the lead wire portion on the bottom surface is substantially the same as the thickness of the dummy terminal.
【請求項3】 前記電子部材がコイルである請求項1ま
たは2に記載のダミー端子付き電子部品。
3. The electronic component with dummy terminals according to claim 1, wherein the electronic member is a coil.
【請求項4】 本体部がコア部材に保持された、実質上
平面形状のリード線部を有する電子部材の、前記リード
線部を前記コア部材の底面に固定するためのものであっ
て、前記コア部材の底面に配置され、電気絶縁性及び粘
着性を有する接着シートと、その接着シートに固定され
ているダミー端子とを備え、 前記底面における前記リード線部が、前記底面を横切る
ようには配置されず、 前記ダミー端子が、前記底面において前記リード線部と
重ならない位置に、前記接着シートに固定されているダ
ミー端子付き接着シート。
4. An electronic member having a substantially planar lead wire portion, the main body portion being held by a core member, for fixing the lead wire portion to a bottom surface of the core member. An adhesive sheet having electrical insulation and tackiness, disposed on the bottom surface of the core member, and a dummy terminal fixed to the adhesive sheet, wherein the lead wire portion on the bottom surface crosses the bottom surface. An adhesive sheet with a dummy terminal, wherein the adhesive terminal is not arranged, and the dummy terminal is fixed to the adhesive sheet at a position on the bottom surface that does not overlap with the lead wire portion.
【請求項5】 前記ダミー端子の厚さが、前記底面にお
ける前記リード線部の厚さと実質上同一である請求項4
に記載のダミー端子付き接着シート。
5. The thickness of the dummy terminal is substantially the same as the thickness of the lead wire portion on the bottom surface.
3. The adhesive sheet with dummy terminals according to 1.
JP2001084583A 2001-03-23 2001-03-23 Electronic component with dummy terminal and adhesive sheet with dummy terminal Pending JP2002289442A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001084583A JP2002289442A (en) 2001-03-23 2001-03-23 Electronic component with dummy terminal and adhesive sheet with dummy terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001084583A JP2002289442A (en) 2001-03-23 2001-03-23 Electronic component with dummy terminal and adhesive sheet with dummy terminal

Publications (1)

Publication Number Publication Date
JP2002289442A true JP2002289442A (en) 2002-10-04

Family

ID=18940225

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2002289442A (en)

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