JP2004146540A - Connection type circuit substrate and manufacturing method therefor - Google Patents

Connection type circuit substrate and manufacturing method therefor Download PDF

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Publication number
JP2004146540A
JP2004146540A JP2002308979A JP2002308979A JP2004146540A JP 2004146540 A JP2004146540 A JP 2004146540A JP 2002308979 A JP2002308979 A JP 2002308979A JP 2002308979 A JP2002308979 A JP 2002308979A JP 2004146540 A JP2004146540 A JP 2004146540A
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circuit board
circuit
connection type
component
board
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JP2002308979A
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Japanese (ja)
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Kaoru Nomoto
野本　薫
Masayuki Takiguchi
瀧口　昌之
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Denso Corp
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Denso Corp
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection type circuit substrate and the manufacturing method thereof capable of improving the relative positional accuracy of two sheets of circuit substrates and rigidly fixing both of the circuit substrates. <P>SOLUTION: The first circuit substrate 1 and the second circuit substrate 2 are fixed to an auxiliary plate 3 by an adhesive agent 4 whereby an adhering area is remarkably enlarged, compared with a case wherein the circuit substrates are bonded at the side ends thereof. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、接続型回路基板とその製造方法に関する。
【０００２】
【従来の技術】
従来、２枚の回路基板を接続する方法として、例えば特許文献１に開示される方法が知られている。この方法によれば、主たる回路基板と従たる回路基板とを同一平面上に並べて、互いに隣接する側端に跨って接着剤を塗布して、両基板を仮接着する。そして、両基板の側端において互いに隣接するパッド上に導通用チップの電極が位置するように、導通用チップを両基板に跨ぐように配置する。この状態で、導通用チップの電極と両基板のパッドとをハンダ付けする事により、主たる回路基板と従たる回路基板とを電気的、機械的に接続する。
【０００３】
【特許文献１】特開平２−２１６８９１号公報
【０００４】
【発明が解決しようとする課題】
しかしながら、上記の接続方法では、主たる回路基板と従たる回路基板とは、その側端部に設けられた接着剤によって固定されるだけであるため、両基板の接着強度が弱くなる傾向にあり、その取り扱いが困難になる。また、両基板の位置関係も、接着剤の量によって決まるため、導通用チップの電極と基板のパッドの位置ズレが生じ易い。
【０００５】
さらに、導通用チップと接着剤との熱膨張係数に差があり、かつ接続型回路基板が温度変化の大きい環境にて使用された場合には、導通用チップの電極と基板のパッドとの接続部にストレスが加わる。この為、導通用チップにおける断線などの故障が生じやすくなってしまう。
【０００６】
本発明は、上記の点を鑑みてなされたものであり、２枚の回路基板の相対的位置精度を向上するとともに、両基板を強固に固定する事が可能な接続型回路基板およびその製造方法を提供する事を目的とする。
【０００７】
【課題を解決するための手段】
上記目的を達成する為に、請求項１に記載の接続型回路基板は、第一の回路基板と、第二の回路基板と、前記第一の回路基板と前記第二の回路基板とを所定位置に固定する補助板と、前記補助板上において所定位置に固定された前記第一の回路基板と前記第二の回路基板との間を跨ぐように、前記第一の回路基板と前記第二の回路基板とに実装された部品とを備える事を特徴とする。
【０００８】
請求項１に記載の接続型回路基板によれば、第一の回路基板と第二の回路基板とが、例えば接着剤によって補助板に固定される。この為、その接着面積は回路基板の側端部において接着する場合に比較して大幅に拡大する事が出来る。従って、第一の回路基板と第二の回路基板とは補助板を介して強固に固定される。また、補助板を利用する事によって、第一の回路基板と第二の回路基板との相対的な位置が所望の間隔を有するように高精度に配置する事が出来る。このため、部品を第一の回路基板と第二の回路基板とに跨るように実装する場合に、電極とパッドの位置ズレ等が生じる事を防止出来る。
【０００９】
請求項２に記載したように、第一の回路基板及び第二の回路基板と補助板とは、その間に、第一の回路基板及び第二の回路基板と同等の熱膨張係数を有する板を介在した状態で、接着により固定される事が好ましい。
【００１０】
第一の回路基板及び第二の回路基板と補助板との熱膨張係数に差がある場合には、温度変化に晒された場合に、第一の回路基板と第二の回路基板との間隔が大きく変化する事になる。この場合、第一の回路基板と第二の回路基板とを跨ぐように実装された部品の、両基板との接続部に大きなストレスが加わり、接続信頼性を低下させてしまう。
【００１１】
このような問題に対して請求項２に記載したように、第一の回路基板及び第二の回路基板と補助板との間に第一の回路基板及び第二の回路基板と同等の熱膨張係数を有する板を設ける事により、温度変化に晒された場合であっても第一及び第二の回路基板間の間隔の変動を低減する事が可能になる。
【００１２】
請求項３に記載したように、第一の回路及び第二の回路基板と補助板の間に介在される板は、第一の回路基板と第二の回路基板との基板材料と同じ材料から形成される事が好ましい。これにより介在板と第一及び第二の回路基板の熱膨張係数を同一にする事が出来る為である。
【００１３】
請求項４に記載したように、両基板間を跨ぐように実装される部品と、補助板とは同等の熱膨張係数を有する事がより好ましい。これにより温度変化に晒された際、部品と基板側との膨張とが同等になるので、部品と両基板との接続部にストレスが掛かる事を最小限に抑える事が出来るとともに、前述の介在板が不要となる。
【００１４】
請求項５に記載されるように、部品は、保護樹脂によって封止される事が好ましい。これにより、万一、部品と両基板との接続部にストレスが加わるような状況が生じた場合であっても、そのストレスを緩和する事が出来る。更に、防湿、絶縁性確保の点からも部品を保護樹脂によって封止する事が好ましい。
【００１５】
請求項６に記載したように、回路部品は半導体（ＩＣ）、受動素子（抵抗、コンデンサ、コイル）、コネクタ、ジャンパ、熱可塑性樹脂若しくは熱硬化性樹脂からなる基板に接続線としての導体パターンが形成されたフレキシブルプリント基板のいずれかである事が好ましい。このような回路部品によって第一の回路基板と第二の回路基板とを接続する事により、第一の回路基板と第二の回路基板とを電気的な一体性を高めた状態で扱う事が出来るようになる。
【００１６】
請求項７には、請求項１に記載した接続型回路基板を製造する為の方法が記載されている。この製造方法による作用効果は、上述した作用効果と共通するため説明を省略する。
【００１７】
請求項８に記載した接続型回路基板の製造方法では、回路部品は、ハンダ付けによって第一の回路基板と第二の回路基板とに接続されるのであり、当該ハンダ付けは第一の回路基板上に実装される回路部品のハンダ付け、および第二の回路基板上に実装される回路部品のハンダ付けと同時に行われる事を特徴とする。
【００１８】
ハンダ付け方法として、例えばリフローハンダ付け方法を採用し、第一の回路基板及び第二の回路基板にそれぞれ必要な回路部品を配置し、かつ両基板を跨ぐように回路部品を配置した状態で、一括してハンダ付けを行う事により、その製造工程を簡略化する事が出来る。
【００１９】
請求項９に記載した接続型回路基板の製造方法では、第一、第二の両回路基板の間を跨ぐように実装される回路部品のハンダ付けは、第一、第二の両回路基板上に実装される回路部品のハンダ付けの後で行われる事を特徴とする。
【００２０】
この製造方法により、第一、第二回路基板上の回路部品と、両回路基板間を跨ぐように実装する回路部品とを同時にハンダ付けする事が精度的に困難な場合、先に第一、第二回路基板上の回路部品をハンダ付けし、その後両回路基板間を跨ぐ回路部品をハンダ付けする事で、両回路基板の相対的な位置決めを行う際、その精度を所定以上に高めなくても良くなるので、その製造工程を簡易化する事が出来る。
【００２１】
請求項１０に記載したように第一、第二回路基板間を跨ぐように実装される回路部品の接合温度は、両回路基板上に実装される回路部品の接合温度よりも低くする。例えば両回路基板上の回路部品をリフロー方法によりハンダ付けし、その後、両回路基板間を跨ぐ回路部品の電極が接触するランド部にハンダより接合温度が低いＡｇまたはＣｕペースト等を塗布し、当該ペーストに適合した温度にて再度リフロー処理を行う。これにより全製造工程を通してリフロー処理を２度行っても、ＡｇまたはＣｕペーストの接合温度の方がハンダの接合温度よりも低いため、両回路基板上に実装される回路部品のハンダ付け部が再び融解する温度に達する事なく、両回路基板間を跨ぐ回路部品を実装する事が出来る。
【００２２】
【発明の実施の形態】
以下、本発明の実施の形態における接続型回路基板１０の構成に関して図１を用いて説明する。
【００２３】
図１は、接続型回路基板１０の概略構成を示す構成図である。図１において、第一の回路基板１及び第二の回路基板２上には、回路部品５ａが実装されている。これら第一の回路基板１及び第二の回路基板２には、接着剤４を介して例えばセラミックからなる補助板３に固定されている。
【００２４】
補助板３上に固定された第一の回路基板１及び第二の回路基板２の、互いに隣接する端部にはランドが形成されている。そして、回路部品５ｂが、第一の回路基板１と第二の回路基板２とを跨ぐように配置され、当該回路部品５ｂの電極がそれぞれの回路基板１、２のランドとハンダ付けによって接続されている。
【００２５】
第一回路基板１と第二回路基板２とは、ともに電気的絶縁性が高く、かつ曲がり等の変形が少ないガラスエポキシ樹脂やセラミックなどによって形成される。
【００２６】
補助板３は、接着剤４を介して、第一の回路基板１と第二の回路基板２とを固定する。この為、第一の回路基板１及び第二の回路基板２と補助板３との接着面積が、両回路基板１、２の側端部同士を接着する場合に比較して大幅に拡大する事が出来る。従って、第一の回路基板１と第二の回路基板２とは補助板３を介して強固に接続されるので、その取り扱いを容易にする事が出来る。更に、第一の回路基板１と第二の回路基板２とをそれぞれ補助板３の所定位置に固定する事により第一の回路基板１と第二の回路基板２との間隔を任意の間隔に高精度に設定出来る。このため、上述した回路部品５ｂを第一の回路基板１と第二の回路基板２とを跨ぐように配置する際に、回路部品５ｂの電極と、両基板１、２上のランドとの位置合わせを容易に行う事が可能になる。
【００２７】
なお補助板３としては、各回路基板１、２との短絡防止の為、絶縁性材料であり、かつ強度の高いセラミック板を用いる事が好ましいが、それ以外に例えば金属板や樹脂板を用いる事も可能である。
【００２８】
接着剤４は、エポキシ系接着剤、エマルジョン系接着剤、あるいは変形アクリレート系接着剤などを用いる事が出来る。ただし、第一の回路基板１及び第二回路基板２と補助板３とは、接着剤４以外の固定手段を用いて固定しても良い。例えば、両面テープを用いて固定したり、ネジ締めや第一の回路基板１及び第二の回路基板２と補助板３とを重ねた状態でかしめを行ったり、機械的な固定法を採用する事も可能である。
【００２９】
次に上述した構成を備える接続型回路基板１０の製造方法（請求項８に示す接続型回路基板１０の製造方法）を図２を用いて説明する。図２は、本実施形態による接続型回路基板１０の製造方法を説明する為の工程別断面図である。
【００３０】
まず、図２（ａ）に示すように、補助板３の所定位置に接着剤４を塗布する。そして、図２（ｂ）に示すように、部品実装面にランドなどのパターンが形成された第一の回路基板１、及び第二の回路基板２を接着剤４を介して補助板３に搭載する。この際、第一の回路基板１と第二の回路基板２との間隔が、所定の間隔を有するように位置合わせされて補助板３に搭載される。
【００３１】
次に熱等を加える事により接着剤４を硬化させ、複数の基板（第一の回路基板１と第二の回路基板２）を１枚の基板として扱える状態にする。その後、第一及び第二の回路基板１、２上に形成したランド上にハンダペーストを印刷してから、各回路基板１、２に実装すべき回路部品５ａを、それぞれの回路基板１、２の所定の位置に載置する。更に、第一の回路基板１と第二の回路基板２とを接続する回路部品５ｂも同時に載置する。この状態で、補助板３に固定された第一及び第二の回路基板１、２をリフロー炉に通す事によって、各ランドに印刷されたハンダペーストをリフローさせる。これにより、第一及び第二の回路基板１、２の回路部品５ａ、さらには、両回路基板１、２を接続する回路基板５ｂが実装され、この結果、第一及び第二の回路基板１、２が回路部品５ｂを介して電気的にも接続される。
【００３２】
以上説明したように、本実施形態による接続型回路基板１０によれば、第一の回路基板１と第二の回路基板２とが補助板３を介して強固に接続されるので、機械的強度が高く、その取り扱いが容易になる。また、第一及び第二回路基板１、２間の間隔、すなわち相対的な位置関係を高精度に設定する事ができるので、特に両基板１、２を接続する回路部品５ｂを容易に配置する事が出来る。
【００３３】
また、上述した製造方法によれば、第一及び第二の回路基板１、２に接続される回路部品５ｂは、それぞれの回路基板１、２に実装される回路部品５ａと同時にリフローハンダ付けによって実装される。従って、回路部品５ａならびに５ｂを一括してハンダ付けを行う事が可能となり、その製造工程を簡略化する事が出来る。
（変形例）
また、上述の製造方法の変形例（請求項９に示す当該接続型回路基板の製造方法）を図３を用いて説明する。図３は、上述した実施形態での製造方法の変形例を説明する為の工程別断面図である。
【００３４】
図３（ａ）に示すように、第一、第二回路基板に回路部品５ａを各々ハンダ付けする。この時のハンダ付け方法は特に問わないが、リフロー炉によるハンダ付けが好ましい。
【００３５】
次に図３（ｂ）に示すように補助板３の所定位置に接着剤４を塗布する。この工程は前述の実施形態の最初の工程と同じである。そして図３（ｃ）に示すように、既に回路部品５ａを各々ハンダ実装した第一、第二の回路基板１、２を接着剤４を介して補助板３に搭載する。この時も第一の回路基板１と第二の回路基板２との間隔が、所定の間隔を有するように位置合わせされて補助板３に搭載される。
【００３６】
最後に、第一の回路基板１と第二の回路基板２との間を跨ぐように回路部品５ｂを載置し、ハンダ付けする。この時のハンダ付け方法はレーザーハンダ付け方法を初めとするピンポイント型のハンダ付け方法である事が望ましい。その理由としては、回路部品５ｂをハンダ付けする為に再度リフロー炉処理を行えば、実装する回路部品５ａのハンダが融解する可能性がある為である。
【００３７】
しかし、請求項１０に示す通り、回路部品５ｂの電気的接合方法がハンダの接合温度（２００℃〜２４０℃）より低い温度にて電気的接合出来うるもの、例えばＡｇ、またはＣｕペースト（接合温度：１５０℃前後）などを採用しているのであるならば、回路部品５ｂの電気的接合には、その接合材料に適した温度にてリフロー炉処理を行う事も出来る。
【００３８】
第一の回路基板１及び第二の回路基板２と補助板３との熱膨張係数に差がある場合に、温度変化に晒されると、第一の回路基板１と第二の回路基板２との間隔が大きく変化する事になる。この場合、第一の回路基板１と第二の回路基板２とを跨ぐように実装された回路部品５ｂの両基板１、２との接続部に大きなストレスが加わり、接続信頼性が低下する。
【００３９】
このような問題に対して、請求項２に示すように、上述したような第一及び第二の回路基板１、２と同等の熱膨張係数を有する板６を介在させる事により、温度変化に晒された場合であっても、第一及び第二の回路基板１、２の間隔の変動を低減する事が可能になる。
【００４０】
この場合、請求項３に示すとおり、第一及び第二の回路基板１、２の基板材料と同じ材料から介在板６を形成する事が好ましい。これにより、介在板６と第一及び第二の回路基板１、２の熱膨張係数を同一にする事が出来る。
【００４１】
若しくは、請求項４に示すように、回路部品５ｂと同等の熱膨張係数を備える補助板３を用いる事でも、回路部品５ｂと両基板１、２との接続部に加わるストレスを低減する事が出来る。この方法だと前述の介在板６が不要となり、当該接続型回路基板１０をコンパクトに製造する必要がある場合には有効である。
【００４２】
更に請求項５に示すように（図５参照）接続型回路基板１０の各回路基板１、２に実装された回路部品５ａ並びに５ｂを保護樹脂７によって封止しても良い。これにより、万一回路部品５ｂと両基板１、２との接続部にストレスが加わるような状況が生じた場合であっても、そのストレスを緩和する事が出来る。更に防湿、絶縁性確保の点からも各回路部品５ａ、５ｂを保護樹脂７によって封止する事が好ましい。なお、保護樹脂としては、エポキシ、ウレタン、シリコン、ナイロンなど所定の強度を持つ樹脂材料であれば使用する事が出来る。
【図面の簡単な説明】
【図１】は両回路基板１、２の間を回路部品５ｂが跨いで実装された構成を示した構成図である。
【図２】は接続型回路基板１０の製造方法を説明する為の工程別断面図である。
【図３】は接続型回路基板１０の製造方法の変形例を説明する為の工程別断面図である。
【図４】は介在板６を挟み込んだ接続型回路基板１０の構成を示した構成図である。
【図５】は実装面に保護樹脂７を封止した接続型回路基板１０の構成を示した構成図である。
【符号の説明】
１　　　第一回路基板
２　　　第二回路基板
３　　　補助板
４　　　接着剤
５ａ、５ｂ　回路部品
６　　　介在板
７　　　保護樹脂
１０　　接続型回路基板[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a connection type circuit board and a method for manufacturing the same.
[0002]
[Prior art]
Conventionally, as a method of connecting two circuit boards, for example, a method disclosed in Patent Document 1 is known. According to this method, the main circuit board and the sub circuit board are arranged on the same plane, and an adhesive is applied across the adjacent side edges to temporarily bond the two boards. Then, the conductive chips are arranged so as to straddle the two substrates so that the electrodes of the conductive chips are located on pads adjacent to each other at the side ends of the two substrates. In this state, the main circuit board and the subordinate circuit board are electrically and mechanically connected by soldering the electrodes of the conductive chip and the pads of both boards.
[0003]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2-216991
[Problems to be solved by the invention]
However, in the above connection method, since the main circuit board and the sub circuit board are only fixed by the adhesive provided at the side end thereof, the adhesive strength between the two boards tends to be weak, Its handling becomes difficult. In addition, since the positional relationship between the two substrates is also determined by the amount of the adhesive, the positional deviation between the electrodes of the conductive chip and the pads of the substrate is likely to occur.
[0005]
Furthermore, when there is a difference in the coefficient of thermal expansion between the conductive chip and the adhesive and the connection type circuit board is used in an environment where the temperature changes greatly, the connection between the electrode of the conductive chip and the pad of the board is performed. Stress is applied to the part. For this reason, a failure such as disconnection in the conductive chip is likely to occur.
[0006]
SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and a connection type circuit board capable of improving the relative positional accuracy of two circuit boards and firmly fixing the two boards, and a method of manufacturing the same. The purpose is to provide.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the connection-type circuit board according to claim 1 includes a first circuit board, a second circuit board, the first circuit board, and the second circuit board. An auxiliary plate fixed at a position, and the first circuit board and the second circuit board so as to straddle between the first circuit board and the second circuit board fixed at a predetermined position on the auxiliary plate. And a component mounted on the circuit board.
[0008]
According to the connection type circuit board of the first aspect, the first circuit board and the second circuit board are fixed to the auxiliary plate by, for example, an adhesive. For this reason, the bonding area can be greatly expanded as compared with the case where the bonding is performed at the side end of the circuit board. Therefore, the first circuit board and the second circuit board are firmly fixed via the auxiliary plate. Further, by using the auxiliary plate, it is possible to arrange the first circuit board and the second circuit board with high accuracy so that the relative positions have a desired interval. For this reason, when components are mounted so as to straddle the first circuit board and the second circuit board, it is possible to prevent the electrodes and pads from being displaced.
[0009]
As described in claim 2, the first circuit board and the second circuit board and the auxiliary plate, between them, a plate having the same thermal expansion coefficient as the first circuit board and the second circuit board It is preferable to be fixed by bonding in the state of being interposed.
[0010]
If there is a difference in the coefficient of thermal expansion between the first circuit board and the second circuit board and the auxiliary board, the gap between the first circuit board and the second circuit board when exposed to a temperature change. Will change greatly. In this case, a large stress is applied to a connection portion between the first circuit board and the second circuit board, which is mounted on the two circuit boards, and the connection reliability is reduced.
[0011]
In order to solve such a problem, as described in claim 2, thermal expansion equivalent to that of the first circuit board and the second circuit board is provided between the first circuit board and the second circuit board and the auxiliary plate. By providing the plate having the coefficient, it is possible to reduce the variation in the distance between the first and second circuit boards even when the board is exposed to a temperature change.
[0012]
As described in claim 3, the board interposed between the first circuit and the second circuit board and the auxiliary board is formed of the same material as the board material of the first circuit board and the second circuit board. Is preferred. Thereby, the thermal expansion coefficients of the intervening plate and the first and second circuit boards can be made the same.
[0013]
As described in claim 4, it is more preferable that the component mounted so as to straddle the two substrates and the auxiliary plate have the same thermal expansion coefficient. As a result, when exposed to a temperature change, the expansion of the component and the substrate side becomes equal, so that stress applied to the connection between the component and the two substrates can be minimized, and the above-described interposition can be achieved. No boards are required.
[0014]
As described in claim 5, the component is preferably sealed with a protective resin. Thus, even in the event that a stress is applied to the connection between the component and the two substrates, the stress can be reduced. Further, it is preferable to seal the component with a protective resin also from the viewpoint of ensuring moisture proof and insulating properties.
[0015]
As described in claim 6, the circuit component is a semiconductor (IC), a passive element (resistance, capacitor, coil), a connector, a jumper, a substrate made of a thermoplastic resin or a thermosetting resin, and a conductor pattern as a connection line. It is preferably one of the formed flexible printed circuit boards. By connecting the first circuit board and the second circuit board with such circuit components, it is possible to handle the first circuit board and the second circuit board in a state where electrical integrity is enhanced. become able to do.
[0016]
Claim 7 describes a method for manufacturing the connection type circuit board according to claim 1. The operation and effect of this manufacturing method are the same as the operation and effect described above, and thus description thereof is omitted.
[0017]
In the method for manufacturing a connection type circuit board according to claim 8, the circuit component is connected to the first circuit board and the second circuit board by soldering, and the soldering is performed on the first circuit board. It is characterized in that it is performed simultaneously with the soldering of the circuit components mounted thereon and the soldering of the circuit components mounted on the second circuit board.
[0018]
As a soldering method, for example, a reflow soldering method is adopted, the necessary circuit components are arranged on the first circuit board and the second circuit board, and the circuit components are arranged so as to straddle both boards, By performing the soldering collectively, the manufacturing process can be simplified.
[0019]
In the method for manufacturing a connection type circuit board according to claim 9, the soldering of the circuit component mounted so as to straddle between the first and second circuit boards is performed on both the first and second circuit boards. It is performed after the soldering of the circuit components mounted on the device.
[0020]
According to this manufacturing method, when it is difficult to solder the circuit components on the first and second circuit boards and the circuit components to be mounted so as to straddle the two circuit boards at the same time, if the first, first, By soldering the circuit components on the second circuit board, and then soldering the circuit components that straddle both circuit boards, when positioning the two circuit boards relative to each other, it is not necessary to increase the accuracy to a predetermined level or more. Therefore, the manufacturing process can be simplified.
[0021]
The bonding temperature of the circuit components mounted so as to straddle between the first and second circuit boards is lower than the bonding temperature of the circuit components mounted on both circuit boards. For example, the circuit components on both circuit boards are soldered by a reflow method, and thereafter, Ag or Cu paste or the like having a lower joining temperature than solder is applied to a land portion where electrodes of the circuit components straddling between the two circuit boards are in contact. Perform the reflow process again at a temperature suitable for the paste. As a result, even if the reflow process is performed twice throughout the entire manufacturing process, the bonding temperature of the Ag or Cu paste is lower than the bonding temperature of the solder. It is possible to mount circuit components across both circuit boards without reaching the melting temperature.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the configuration of the connection type circuit board 10 according to the embodiment of the present invention will be described with reference to FIG.
[0023]
FIG. 1 is a configuration diagram showing a schematic configuration of the connection type circuit board 10. In FIG. 1, a circuit component 5a is mounted on a first circuit board 1 and a second circuit board 2. The first circuit board 1 and the second circuit board 2 are fixed to an auxiliary plate 3 made of, for example, ceramic via an adhesive 4.
[0024]
Lands are formed at ends of the first circuit board 1 and the second circuit board 2 fixed on the auxiliary plate 3 adjacent to each other. The circuit component 5b is disposed so as to straddle the first circuit board 1 and the second circuit board 2, and the electrodes of the circuit component 5b are connected to the lands of the circuit boards 1 and 2 by soldering. ing.
[0025]
The first circuit board 1 and the second circuit board 2 are both formed of glass epoxy resin, ceramic, or the like, which has high electrical insulation and less deformation such as bending.
[0026]
The auxiliary plate 3 fixes the first circuit board 1 and the second circuit board 2 via the adhesive 4. For this reason, the bonding area between the first circuit board 1 and the second circuit board 2 and the auxiliary plate 3 is significantly increased as compared with the case where the side ends of the circuit boards 1 and 2 are bonded together. Can be done. Therefore, since the first circuit board 1 and the second circuit board 2 are firmly connected via the auxiliary plate 3, the handling thereof can be facilitated. Further, by fixing the first circuit board 1 and the second circuit board 2 at predetermined positions of the auxiliary plate 3, respectively, the distance between the first circuit board 1 and the second circuit board 2 can be set to an arbitrary distance. Can be set with high accuracy. For this reason, when the above-mentioned circuit component 5b is arranged so as to straddle the first circuit board 1 and the second circuit board 2, the positions of the electrodes of the circuit component 5b and the lands on both boards 1, 2 The alignment can be easily performed.
[0027]
As the auxiliary plate 3, it is preferable to use a ceramic plate that is an insulating material and has high strength in order to prevent a short circuit with each of the circuit boards 1 and 2. However, for example, a metal plate or a resin plate is used. Things are also possible.
[0028]
As the adhesive 4, an epoxy-based adhesive, an emulsion-based adhesive, a modified acrylate-based adhesive, or the like can be used. However, the first and second circuit boards 1 and 2 and the auxiliary plate 3 may be fixed using fixing means other than the adhesive 4. For example, it is fixed using a double-sided tape, screwed, caulked in a state where the first circuit board 1 and the second circuit board 2 and the auxiliary plate 3 are overlapped, or a mechanical fixing method is adopted. Things are also possible.
[0029]
Next, a method of manufacturing the connection type circuit board 10 having the above-described configuration (a method of manufacturing the connection type circuit board 10 according to claim 8) will be described with reference to FIG. FIG. 2 is a sectional view for explaining the method of manufacturing the connection type circuit board 10 according to the present embodiment.
[0030]
First, as shown in FIG. 2A, an adhesive 4 is applied to a predetermined position of the auxiliary plate 3. Then, as shown in FIG. 2B, the first circuit board 1 and the second circuit board 2 having the pattern such as lands formed on the component mounting surface are mounted on the auxiliary plate 3 via the adhesive 4. I do. At this time, the first circuit board 1 and the second circuit board 2 are mounted on the auxiliary plate 3 while being aligned so as to have a predetermined space.
[0031]
Next, the adhesive 4 is cured by applying heat or the like, so that the plurality of boards (the first circuit board 1 and the second circuit board 2) can be handled as one board. Then, after solder paste is printed on the lands formed on the first and second circuit boards 1 and 2, the circuit components 5a to be mounted on the circuit boards 1 and 2 are respectively attached to the circuit boards 1 and 2. To a predetermined position. Further, a circuit component 5b for connecting the first circuit board 1 and the second circuit board 2 is also placed at the same time. In this state, the first and second circuit boards 1 and 2 fixed to the auxiliary plate 3 are passed through a reflow furnace to reflow the solder paste printed on each land. As a result, the circuit components 5a of the first and second circuit boards 1 and 2 and the circuit board 5b connecting the two circuit boards 1 and 2 are mounted. As a result, the first and second circuit boards 1 and 2 are mounted. , 2 are also electrically connected via the circuit component 5b.
[0032]
As described above, according to the connection type circuit board 10 according to the present embodiment, the first circuit board 1 and the second circuit board 2 are firmly connected via the auxiliary plate 3, so that the mechanical strength is improved. And its handling becomes easy. Further, since the interval between the first and second circuit boards 1 and 2, that is, the relative positional relationship can be set with high accuracy, the circuit components 5b connecting the two boards 1 and 2 are particularly easily arranged. Can do things.
[0033]
According to the above-described manufacturing method, the circuit components 5b connected to the first and second circuit boards 1 and 2 are simultaneously reflow soldered together with the circuit components 5a mounted on the respective circuit boards 1 and 2. Implemented. Therefore, the circuit components 5a and 5b can be collectively soldered, and the manufacturing process can be simplified.
(Modification)
Further, a modified example of the above-described manufacturing method (the method for manufacturing the connection type circuit board according to claim 9) will be described with reference to FIG. FIG. 3 is a cross-sectional view for each process for describing a modification of the manufacturing method in the above-described embodiment.
[0034]
As shown in FIG. 3A, the circuit components 5a are soldered to the first and second circuit boards, respectively. The soldering method at this time is not particularly limited, but soldering with a reflow furnace is preferable.
[0035]
Next, as shown in FIG. 3B, an adhesive 4 is applied to a predetermined position of the auxiliary plate 3. This step is the same as the first step of the above-described embodiment. Then, as shown in FIG. 3C, the first and second circuit boards 1 and 2 on which the circuit components 5a are already soldered are mounted on the auxiliary plate 3 via the adhesive 4. Also at this time, the first circuit board 1 and the second circuit board 2 are mounted on the auxiliary plate 3 while being aligned so as to have a predetermined space.
[0036]
Finally, the circuit component 5b is placed so as to straddle between the first circuit board 1 and the second circuit board 2, and soldered. The soldering method at this time is desirably a pinpoint soldering method such as a laser soldering method. The reason is that if the reflow furnace process is performed again to solder the circuit component 5b, the solder of the circuit component 5a to be mounted may be melted.
[0037]
However, as described in claim 10, the method for electrically joining the circuit components 5b can be performed at a temperature lower than the solder joining temperature (200 ° C. to 240 ° C.), for example, Ag or Cu paste (joining temperature). (Approximately 150 ° C.) or the like, the electrical joining of the circuit components 5b can be performed by a reflow furnace treatment at a temperature suitable for the joining material.
[0038]
When there is a difference in the coefficient of thermal expansion between the first circuit board 1 and the second circuit board 2 and the auxiliary plate 3, when exposed to a temperature change, the first circuit board 1 and the second circuit board 2 Will change greatly. In this case, a large stress is applied to a connection portion between the first and second substrates 1 and 2 of the circuit component 5b mounted so as to straddle the first circuit substrate 1 and the second circuit substrate 2, thereby reducing connection reliability.
[0039]
To solve such a problem, as described in claim 2, by interposing the plate 6 having the same thermal expansion coefficient as the first and second circuit boards 1 and 2 as described above, Even when exposed, it is possible to reduce the variation in the distance between the first and second circuit boards 1 and 2.
[0040]
In this case, as described in claim 3, it is preferable to form the interposition plate 6 from the same material as the substrate material of the first and second circuit boards 1 and 2. Thereby, the thermal expansion coefficients of the intervening plate 6 and the first and second circuit boards 1 and 2 can be made equal.
[0041]
Alternatively, the stress applied to the connection between the circuit component 5b and the substrates 1 and 2 can be reduced by using the auxiliary plate 3 having the same thermal expansion coefficient as that of the circuit component 5b. I can do it. This method eliminates the need for the intervening plate 6 and is effective when the connection-type circuit board 10 needs to be manufactured compactly.
[0042]
Further, as shown in claim 5 (see FIG. 5), the circuit components 5a and 5b mounted on each of the circuit boards 1 and 2 of the connection type circuit board 10 may be sealed with a protective resin 7. Thus, even if a situation occurs in which a stress is applied to the connection between the circuit component 5b and the two substrates 1 and 2, the stress can be reduced. Further, it is preferable to seal the circuit components 5a and 5b with the protective resin 7 from the viewpoint of securing moisture proof and insulating properties. As the protective resin, any resin material having a predetermined strength, such as epoxy, urethane, silicon, and nylon, can be used.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing a configuration in which a circuit component 5b is mounted across both circuit boards 1 and 2;
FIG. 2 is a cross-sectional view for explaining a method of manufacturing the connection type circuit board 10 according to a process.
FIG. 3 is a cross-sectional view for each step for explaining a modification of the method of manufacturing the connection type circuit board 10;
FIG. 4 is a configuration diagram showing a configuration of a connection type circuit board 10 with an intervening plate 6 interposed therebetween.
FIG. 5 is a configuration diagram showing a configuration of a connection type circuit board 10 in which a protective resin 7 is sealed on a mounting surface.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 1st circuit board 2 2nd circuit board 3 Auxiliary board 4 Adhesive 5a, 5b Circuit component 6 Intermediate board 7 Protective resin 10 Connection type circuit board

Claims (10)

第一の回路基板と、
第二の回路基板と、
前記第一の回路基板と前記第二の回路基板とを所定位置に固定する補助板と、
前記補助板上において所定位置に固定された前記第一の回路基板と前記第二の回路基板との間を跨ぐように、前記第一の回路基板と前記第二の回路基板とに実装された部品とを備える事を特徴とする接続型回路基板。A first circuit board,
A second circuit board,
An auxiliary plate for fixing the first circuit board and the second circuit board in a predetermined position,
Mounted on the first circuit board and the second circuit board so as to straddle between the first circuit board and the second circuit board fixed at a predetermined position on the auxiliary plate. A connection type circuit board comprising components. 前記第一の回路基板および前記第二の回路基板と前記補助板とは、その間に、前記第一の回路基板および前記第二の回路基板と同等の熱膨張係数を有する板を介在した状態で、接着により固定される事を特徴とする請求項１に記載の接続型回路基板。The first circuit board and the second circuit board and the auxiliary plate, in a state where a plate having a thermal expansion coefficient equivalent to that of the first circuit board and the second circuit board is interposed therebetween The connection type circuit board according to claim 1, wherein the connection type circuit board is fixed by bonding. 前記第一の回路基板および前記第二の回路基板と前記補助板との間に介在される板は、前記第一の回路基板と前記第二の回路基板との基板材料と同じ材料から形成される事を特徴とする請求項２に記載の接続型回路基板。The board interposed between the first circuit board and the second circuit board and the auxiliary board is formed from the same material as the board material of the first circuit board and the second circuit board. 3. The connection type circuit board according to claim 2, wherein 前記第一の回路基板および前記第二の回路基板との間を跨ぐように、前記第一の回路基板と前記第二の回路基板とに実装される部品の熱膨張係数は、前記補助板の熱膨張係数と同等である事を特徴とする請求項１に記載の接続型回路基板。The components mounted on the first circuit board and the second circuit board have a coefficient of thermal expansion of the auxiliary plate so as to straddle between the first circuit board and the second circuit board. 2. The connection type circuit board according to claim 1, wherein the connection type circuit board has a coefficient of thermal expansion equal to that of the circuit board. 前記部品は、保護樹脂によって封止される事を特徴とする請求項１乃至請求項４のいずれかに記載の接続型回路基板。The connection type circuit board according to claim 1, wherein the component is sealed with a protective resin. 前記部品は、回路部品、例えば半導体（ＩＣ）、受動素子（抵抗、コンデンサ、コイル）、コネクタ、ジャンパ、熱可塑性樹脂若しくは熱硬化性樹脂からなる基板に接続線としての導体パターンが形成されたフレキシブルプリント基板のいずれかである事を特徴とする請求項１乃至請求項５のいずれかに記載の接続型回路基板。The component is a circuit component, for example, a semiconductor (IC), a passive element (resistance, capacitor, coil), a connector, a jumper, a flexible board in which a conductor pattern as a connection line is formed on a substrate made of thermoplastic resin or thermosetting resin. The connection type circuit board according to any one of claims 1 to 5, wherein the connection type circuit board is any one of a printed board. 第一の回路基板を用意する工程と、
第二の回路基板を用意する工程と、
前記第一の回路基板と前記第二の回路基板とを、補助板上の所定位置に固定する工程と、
前記第一の回路基板と前記第二の回路基板との間を跨ぐように、前記第一の回路基板と前記第二の回路基板とに部品を実装する工程とを備える事を特徴とする接続型回路基板の製造方法。Preparing a first circuit board;
Preparing a second circuit board;
A step of fixing the first circuit board and the second circuit board at a predetermined position on an auxiliary plate,
Mounting a component on the first circuit board and the second circuit board so as to straddle between the first circuit board and the second circuit board. Method of manufacturing a molded circuit board. 前記部品を実装する工程は、はんだ付けによって前記第一の回路基板と前記第二の回路基板とに接続されるものであり、前記第一の回路基板上に実装される回路部品、及び第二の回路基板上に実装される回路部品の実装工程と同時に行われる事を特徴とする請求項７に記載の接続型回路基板の製造方法。The step of mounting the component is connected to the first circuit board and the second circuit board by soldering, a circuit component mounted on the first circuit board, and a second 8. The method for manufacturing a connection-type circuit board according to claim 7, wherein the method is performed simultaneously with the step of mounting circuit components mounted on the circuit board. 前記部品を実装する工程は、はんだ付けによって前記第一の回路基板と前記第二の回路基板とに接続されるものであり、前記第一の回路基板上に実装される回路部品、及び第二の回路基板上に実装される回路部品の実装工程の後に行われる事を特徴とする請求項７に記載の接続型回路基板の製造方法。The step of mounting the component is connected to the first circuit board and the second circuit board by soldering, a circuit component mounted on the first circuit board, and a second 8. The method for manufacturing a connection-type circuit board according to claim 7, wherein the method is performed after the step of mounting circuit components mounted on the circuit board. 前記部品を実装する工程の前記第一の回路基板と前記第二の回路基板とに接続する際の接合温度は、前記第一、第二の両回路基板上に回路部品を実装する工程の接合温度より低い温度で接合される事を特徴とする請求項９に記載の接続型回路基板の製造方法。The bonding temperature when connecting the first circuit board and the second circuit board in the step of mounting the components is the bonding temperature in the step of mounting the circuit components on both the first and second circuit boards. The method according to claim 9, wherein the bonding is performed at a temperature lower than the temperature.
JP2002308979A 2002-10-23 2002-10-23 Connection type circuit substrate and manufacturing method therefor Pending JP2004146540A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007101825A1 (en) * 2006-03-07 2007-09-13 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Optoelectronic module
JP2007335575A (en) * 2006-06-14 2007-12-27 Teikoku Tsushin Kogyo Co Ltd Lead-out unit of circuit board
WO2012165520A1 (en) * 2011-06-03 2012-12-06 住友電気工業株式会社 Wiring body connecting structure, wiring body, electronic device, illumination device, and method for producing electronic device
JP7109619B1 (en) * 2021-04-16 2022-07-29 三菱電機株式会社 power converter

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007101825A1 (en) * 2006-03-07 2007-09-13 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Optoelectronic module
JP2007335575A (en) * 2006-06-14 2007-12-27 Teikoku Tsushin Kogyo Co Ltd Lead-out unit of circuit board
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