JP2002284849A - Liquid resin composition and semiconductor device - Google Patents
Liquid resin composition and semiconductor deviceInfo
- Publication number
- JP2002284849A JP2002284849A JP2001086925A JP2001086925A JP2002284849A JP 2002284849 A JP2002284849 A JP 2002284849A JP 2001086925 A JP2001086925 A JP 2001086925A JP 2001086925 A JP2001086925 A JP 2001086925A JP 2002284849 A JP2002284849 A JP 2002284849A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- epoxy resin
- underfill
- liquid resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はフリップチップ実装
方式の半導体装置の封止に用いられる液状樹脂組成物に
関するものであり、それを用いて封止した半導体装置で
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid resin composition used for sealing a flip-chip mounting type semiconductor device, and a semiconductor device sealed using the same.
【０００２】[0002]
【従来の技術】フリップチップ実装方式の半導体装置で
は半導体チップと回路基板の隙間にアンダーフィル材と
呼ばれる液状樹脂組成物を充填注入する封止方法が行わ
れている。アンダーフィル用液状樹脂組成物は一般に熱
硬化性樹脂と充填材から構成され、毛細管現象などを利
用して半導体チップ、回路基板、接続端子（以下バンプ
という）の間隙を充填する。2. Description of the Related Art In a flip-chip mounting type semiconductor device, a sealing method of filling and injecting a liquid resin composition called an underfill material into a gap between a semiconductor chip and a circuit board has been performed. The underfill liquid resin composition is generally composed of a thermosetting resin and a filler, and fills a gap between a semiconductor chip, a circuit board, and a connection terminal (hereinafter, referred to as a bump) by utilizing a capillary phenomenon or the like.
【０００３】アンダーフィル材を用いて充填注入する封
止方法は、半導体装置の生産工程においてアンダーフィ
ル材の充填に長時間を要する。生産工程の効率化にはア
ンダーフィル材の充填時間の短縮化が必要であり、充填
時間の短縮化にはアンダーフィル材の樹脂組成物の粘度
を低下させる手法がある。しかし、樹脂組成物の低粘度
化のために従来の低粘度有機化合物を用いると揮発成分
が増加し、フリップチップ実装方式の半導体装置では半
導体チップ、回路基板間に揮発成分由来の空隙が存在す
ると半導体装置の作動信頼性が著しく低下する。このた
め従来の生産工程においては揮発成分の少ない粘凋な樹
脂組成物を用いて充填時間を十分に取る必要があった。
このようにフリップチップ実装方式の半導体装置生産工
程は信頼性を得るために生産性を犠牲にしなければなら
ないという問題があった。In the sealing method of filling and injecting using an underfill material, it takes a long time to fill the underfill material in a semiconductor device production process. To improve the efficiency of the production process, it is necessary to shorten the filling time of the underfill material. To shorten the filling time, there is a method of reducing the viscosity of the resin composition of the underfill material. However, when a conventional low-viscosity organic compound is used to reduce the viscosity of the resin composition, the volatile component increases, and in a flip-chip mounting type semiconductor device, a semiconductor chip and a void derived from the volatile component exist between circuit boards. The operation reliability of the semiconductor device is significantly reduced. For this reason, in the conventional production process, it was necessary to use a viscous resin composition having a small amount of volatile components and take a sufficient filling time.
As described above, there is a problem that the productivity of the flip-chip mounting type semiconductor device must be sacrificed in order to obtain reliability.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、フリップチ
ップ実装方式による半導体装置の生産工程において、充
填時間の短縮化をはかりながら、半導体装置の空隙を抑
制することができ、高度の信頼性を有するアンダーフィ
ル用液状樹脂組成物を提供することにある。SUMMARY OF THE INVENTION According to the present invention, in the production process of a semiconductor device by the flip-chip mounting method, the gap of the semiconductor device can be suppressed while shortening the filling time, and high reliability can be achieved. To provide a liquid resin composition for underfill having the same.
【０００５】[0005]
【課題を解決するための手段】一般式（１）で表される
芳香族ジアミンとビスフェノール型エポキシ樹脂、ノボ
ラック型エポキシ樹脂、クレゾールエポキシ樹脂、環状
脂肪族エポキシ樹脂、グリシジルエステル系樹脂、グリ
シジルアミン系樹脂から選択されるエポキシ樹脂からな
る樹脂成分（Ａ）と無機フィラー（Ｂ）からなる低粘度
アンダーフィル用液状樹脂組成物である。Means for Solving the Problems Aromatic diamine represented by the general formula (1) and bisphenol type epoxy resin, novolak type epoxy resin, cresol epoxy resin, cycloaliphatic epoxy resin, glycidyl ester resin, glycidylamine resin A low-viscosity underfill liquid resin composition comprising a resin component (A) composed of an epoxy resin selected from resins and an inorganic filler (B).
【化２】 更に好ましい形態としては、エポキシ樹脂がビスフェノ
ール型エポキシ樹脂であり、樹脂成分（Ａ）と無機フィ
ラー（Ｂ）の合計に占める無機フィラー（Ｂ）の重量割
合が０．３〜０．７である低粘度アンダーフィル用液状
樹脂組成物である。更に上記の低粘度アンダーフィル用
液状樹脂組成物を用いて作製した半導体装置である。Embedded image In a more preferred embodiment, the epoxy resin is a bisphenol-type epoxy resin, and the weight ratio of the inorganic filler (B) to the total of the resin component (A) and the inorganic filler (B) is 0.3 to 0.7. It is a liquid resin composition for viscosity underfill. Furthermore, a semiconductor device manufactured using the above-mentioned low-viscosity underfill liquid resin composition.
【０００６】[0006]
【発明の実施の形態】本発明に用いられる芳香族ジアミ
ンは、エポキシ樹脂の硬化剤として用いられ一般式
（１）で示される。具体的な例としては、例えば、式
（２）で示された３，５−ジエチル−１，３−フェニレ
ンジアミンが挙げられ、これらを必要に応じて単独もし
くは複数用いることができる。BEST MODE FOR CARRYING OUT THE INVENTION The aromatic diamine used in the present invention is used as a curing agent for an epoxy resin and is represented by the general formula (1). Specific examples include, for example, 3,5-diethyl-1,3-phenylenediamine represented by the formula (2), and these can be used alone or in combination as needed.
【化３】 Embedded image
【０００７】本発明に用いられるエポキシ樹脂は、ビス
フェノール型エポキシ樹脂、ノボラック型エポキシ樹
脂、環状脂肪族エポキシ樹脂、グリシジルエステル系樹
脂、グリシジルアミン系樹脂から選択されるエポキシ樹
脂を１種又は複数種併用して用いることができる。これ
らの中でビスフェノール型エポキシ樹脂が耐熱性、耐吸
湿性に強いことから好ましい。The epoxy resin used in the present invention is one or more epoxy resins selected from bisphenol type epoxy resins, novolak type epoxy resins, cycloaliphatic epoxy resins, glycidyl ester resins and glycidylamine resins. Can be used. Of these, bisphenol-type epoxy resins are preferred because of their high heat resistance and moisture absorption resistance.
【０００８】（Ｂ）の無機フィラーとしては、樹脂の充
填に用いることができるものなら何れも使用できる。そ
の中でもシリカが供給安定性、コスト、純度等から好ん
で用いられる。形状は一般に球状、破砕状、フレーク状
などがあるが、良好な流動性を得るためには球状の無機
充填材がもっとも良い。As the inorganic filler (B), any inorganic filler that can be used for filling a resin can be used. Among them, silica is preferably used in view of supply stability, cost, purity and the like. The shape generally has a spherical shape, a crushed shape, a flake shape, and the like, but a spherical inorganic filler is best for obtaining good fluidity.
【０００９】無機フィラー（Ｂ）の添加量は、芳香族ジ
アミンとエポキシ樹脂からなる樹脂成分（Ａ）に対し、
下記の式 （Ｂ）／（（Ａ）＋（Ｂ））＝０．２〜０．７ を満足することが望ましく、更に好ましくは０．４〜
０．６である。０．２未満だと硬化物の線膨張係数が大
きくなり、硬化後のパッケージへの応力蓄積や温度サイ
クル試験（Ｔ／Ｃ試験）での樹脂クラックを起こす恐れ
がある。一方、０．７を越えると結果として得られる液
状樹脂組成物の粘度が高くなり過ぎ、アンダーフィル材
として用いることができないため好ましくない。The amount of the inorganic filler (B) added is based on the resin component (A) comprising an aromatic diamine and an epoxy resin.
It is desirable to satisfy the following expression (B) / ((A) + (B)) = 0.2 to 0.7, more preferably 0.4 to 0.7.
0.6. If it is less than 0.2, the coefficient of linear expansion of the cured product becomes large, which may cause stress accumulation in the package after curing and resin cracks in a temperature cycle test (T / C test). On the other hand, if it exceeds 0.7, the viscosity of the resulting liquid resin composition becomes too high and cannot be used as an underfill material, which is not preferable.
【００１０】本発明の液状樹脂組成物の粘度は、後述の
粘度の測定方法において、０．５ｒｐｍで１２Ｐａ・ｓ
以下であり、２．５ｒｐｍで１４Ｐａ・ｓ以下である。
それぞれの粘度が、１２Ｐａｓ・ｓ、１４Ｐａ・ｓを越
えると粘度が高くなりすぎ、アンダーフィル用として用
いることができない可能性がある。[0010] The viscosity of the liquid resin composition of the present invention is determined by the method for measuring viscosity described below at 0.5 rpm and 12 Pa · s.
Or less, and 14 Pa · s or less at 2.5 rpm.
If the respective viscosities exceed 12 Pas · s and 14 Pa · s, the viscosities become too high and may not be used for underfill.
【００１１】本発明のアンダーフィル用液状樹脂組成物
には、前記の必須成分の他に必要に応じて、その他のエ
ポキシ樹脂、エポキシ樹脂硬化剤、硬化促進剤、希釈
材、顔料、カップリング剤、難燃剤、レベリング剤、消
泡剤等の添加物を加えても差し支えない。アンダーフィ
ル用液状樹脂組成物は、各成分、添加物などを３本ロー
ルにて分散混練し、真空下で脱泡処理して製造する。半
導体装置の製造方法は公知の方法を用いることができ
る。The liquid resin composition for underfill of the present invention may further comprise, if necessary, other epoxy resin, epoxy resin curing agent, curing accelerator, diluent, pigment, coupling agent in addition to the above-mentioned essential components. Additives such as a flame retardant, a leveling agent and an antifoaming agent may be added. The underfill liquid resin composition is manufactured by dispersing and kneading each component, additive, and the like with a three-roll mill, and performing a defoaming treatment under vacuum. A known method can be used as a method for manufacturing a semiconductor device.
【００１２】[0012]
【実施例】本発明を実施例及び比較例で説明する。 ＜実施例１＞式（２）で示される芳香族ジアミン（当量
４４．６）２６．９重量部とビスフェノールＦ型エポキ
シ樹脂（エポキシ当量１６６）１００重量部を充填材と
して平均粒径６μｍ、最大粒径５０μｍの球状シリカ１
８０重量部、カーボンブラック０．１重量部を秤量し、
これらの原材料を３本ロールにて分散混練し、真空脱泡
処理をしてアンダーフィル用液状樹脂組成物を得た。次
に、得られたアンダーフィル用液状樹脂組成物を用いて
下記の試験方法に記載した試験片を作製し評価を行っ
た。EXAMPLES The present invention will be described with reference to Examples and Comparative Examples. <Example 1> 26.9 parts by weight of an aromatic diamine represented by the formula (2) (equivalent 44.6) and 100 parts by weight of a bisphenol F type epoxy resin (epoxy equivalent 166) were used as fillers, and the average particle diameter was 6 µm and the maximum Spherical silica 1 with a particle size of 50 μm
80 parts by weight, 0.1 parts by weight of carbon black are weighed,
These raw materials were dispersed and kneaded with three rolls and subjected to vacuum defoaming treatment to obtain a liquid resin composition for underfill. Next, using the obtained liquid resin composition for underfill, test pieces described in the following test method were prepared and evaluated.
【００１３】＜実施例２＞式（２）で示される芳香族ジ
アミン（当量４４．６）４５．７重量部とビスフェノー
ルＦ型エポキシ（エポキシ当量９７．５）１００重量部
を充填材として平均粒径６μｍ、最大粒径５０μｍの球
状シリカ１６０重量部、カーボンブラック０．１重量部
を秤量し、これらの原材料を３本ロールにて分散混練
し、真空脱泡処理をしてアンダーフィル用液状樹脂組成
物を得た。次に、実施例１と同様にして評価を行った。<Example 2> 45.7 parts by weight of an aromatic diamine represented by the formula (2) (equivalent weight 44.6) and 100 parts by weight of a bisphenol F type epoxy (epoxy equivalent weight 97.5) were used as fillers to obtain an average particle size. 160 parts by weight of spherical silica having a diameter of 6 μm and a maximum particle diameter of 50 μm, and 0.1 parts by weight of carbon black are weighed, and these raw materials are dispersed and kneaded with three rolls, subjected to vacuum defoaming treatment, and subjected to a liquid resin for underfill. A composition was obtained. Next, evaluation was performed in the same manner as in Example 1.
【００１４】＜比較例１＞硬化剤としてジアミノジエチ
ルジフェニルメタン（当量６３）３８．０重量部とビス
フェノールＦ型エポキシ（エポキシ当量１６６）１００
重量部を充填材として平均粒径６μｍ、最大粒径５０μ
ｍの球状シリカ１５０重量部、カーボンブラック０．１
重量部を秤量し、これらの原材料を３本ロールにて分散
混練し、真空脱泡処理をしてアンダーフィル用液状樹脂
組成物を得た。次に、実施例１と同様にして評価を行っ
た。<Comparative Example 1> 38.0 parts by weight of diaminodiethyldiphenylmethane (equivalent 63) as a curing agent and bisphenol F type epoxy (epoxy equivalent 166) 100
The average particle diameter is 6 μm and the maximum particle diameter is 50 μ with the parts by weight as filler.
m spherical silica 150 parts by weight, carbon black 0.1
A weight part was weighed, these raw materials were dispersed and kneaded with three rolls, and subjected to a vacuum defoaming treatment to obtain a liquid resin composition for underfill. Next, evaluation was performed in the same manner as in Example 1.
【００１５】＜比較例２＞硬化剤としてジアミノジエチ
ルジフェニルメタン（当量６３）６４．６重量部とビス
フェノールＦ型エポキシ（エポキシ当量９７．５）１０
０重量部を充填材として平均粒径６μｍ、最大粒径５０
μｍの球状シリカ１８０重量部、カーボンブラック１重
量部を秤量し、これらの原材料を３本ロールにて分散混
練し、真空脱泡処理をしてアンダーフィル用液状樹脂組
成物を得た。次に、実施例１と同様にして評価を行っ
た。Comparative Example 2 64.6 parts by weight of diaminodiethyldiphenylmethane (equivalent 63) as a curing agent and bisphenol F type epoxy (epoxy equivalent 97.5) 10
0 parts by weight as filler, average particle size 6 μm, maximum particle size 50
180 parts by weight of μm spherical silica and 1 part by weight of carbon black were weighed, and these raw materials were dispersed and kneaded with three rolls, followed by vacuum defoaming treatment to obtain a liquid resin composition for underfill. Next, evaluation was performed in the same manner as in Example 1.
【００１６】各試験方法は次のとおりである。 ＜樹脂特性＞ １）粘度：東機産業（株）製Ｅ型粘度計を用い２５℃
で、０．５及び２．５ｒｐｍにおける粘度を測定した。
チキソトロピー比は（０．５ｒｐｍでの粘度／２．５ｒ
ｐｍでの粘度）によって算出した。 ２）充填時間：１００℃の熱板上で封止前の半導体装置
を加熱し、フリップチップの一辺にアンダーフィル材を
ディスペンスし、充填時間測定を行った。フィレット部
分を観察しながら、チップ四辺が完全に充填されるまで
の時間を計測した。測定に用いたフリップチップ方式の
半導体装置に用いたチップはサイズが１０ｍｍ×１０ｍ
ｍ×０．３ｍｍ、回路基板はガラスエポキシ基板、半田
バンプの高さ（半導体チップ−回路基板間隔）は０．５
ｍｍであり、半導体チップと回路基板はバンプによりペ
リフェラルに接合されている。用いたサンプルは１０個
である。Each test method is as follows. <Resin Properties> 1) Viscosity: 25 ° C. using an E-type viscometer manufactured by Toki Sangyo Co., Ltd.
The viscosity at 0.5 and 2.5 rpm was measured.
The thixotropic ratio is (viscosity at 0.5 rpm / 2.5 r
(viscosity in pm). 2) Filling time: The semiconductor device before sealing was heated on a hot plate at 100 ° C., an underfill material was dispensed on one side of the flip chip, and the filling time was measured. While observing the fillet portion, the time until the four sides of the chip were completely filled was measured. The chip used for the flip-chip type semiconductor device used for the measurement has a size of 10 mm × 10 m.
mx 0.3 mm, circuit board is glass epoxy board, solder bump height (semiconductor chip-circuit board spacing) is 0.5
mm, and the semiconductor chip and the circuit board are joined to the peripheral by bumps. Ten samples were used.
【００１７】＜信頼性＞上記の充填時間測定で使用した
試験片を用いた。次に、Ｔ／Ｃ処理（−６５℃／３０分
←→１５０℃／３０分、１０００サイクル）を施した
後、超音波探傷機（ＳＡＴ）にて半導体チップと回路基
板界面との剥離、クラックの有無を確認した。試験に用
いたサンプル数は１０個である。<Reliability> The test piece used in the above filling time measurement was used. Next, after performing T / C treatment (−65 ° C./30 minutes →→ 150 ° C./30 minutes, 1000 cycles), peeling and cracking of the interface between the semiconductor chip and the circuit board are performed by an ultrasonic flaw detector (SAT). Was checked. The number of samples used for the test is 10.
【００１８】樹脂特性を表１に信頼性試験不良個数の結
果を表２示す。Table 1 shows the resin characteristics and Table 2 shows the results of the number of failures in the reliability test.
【表１】 [Table 1]
【００１９】[0019]
【表２】 [Table 2]
【００２０】[0020]
【発明の効果】本発明のアンダーフィル用液状樹脂組成
物は、低粘度であるため短時間での充填封止が可能であ
り、従来の半導体装置作成工程より生産性に優れたもの
である。また、本発明のアンダーフィル用液状樹脂組成
物を用いて作成された半導体装置は空隙が非常に少な
く、信頼性が高い半導体装置である。The liquid resin composition for underfill of the present invention has a low viscosity and can be filled and sealed in a short time, and is superior in productivity to the conventional semiconductor device manufacturing process. In addition, a semiconductor device manufactured using the liquid resin composition for underfill of the present invention has very few voids and is a highly reliable semiconductor device.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4J002 CD021 CD051 CD061 CD081 CD131 DJ016 EN077 FD016 FD147 GQ05 4J036 AA01 AD08 AD21 AF06 AF08 AG01 AG03 AG13 AH01 AH04 AH15 AJ08 DC04 DC10 FA01 FA05 JA07 KA01 4M109 AA01 BA03 BA07 CA05 EA03 EB02 EB12 EC20 GA10 ──────────────────────────────────────────────────続 き Continued on front page F-term (reference) 4J002 CD021 CD051 CD061 CD081 CD131 DJ016 EN077 FD016 FD147 GQ05 4J036 AA01 AD08 AD21 AF06 AF08 AG01 AG03 AG13 AH01 AH04 AH15 AJ08 DC04 DC10 FA01 FA05 JA07 KA01 4M109 AAEBEA03BA03 EC20 GA10
Claims (4)
とビスフェノール型エポキシ樹脂、ノボラック型エポキ
シ樹脂、クレゾールエポキシ樹脂、環状脂肪族エポキシ
樹脂、グリシジルエステル系樹脂、グリシジルアミン系
樹脂から選択されるエポキシ樹脂からなる樹脂成分
（Ａ）及び無機フィラー（Ｂ）からなることを特徴とす
る低粘度アンダーフィル用液状樹脂組成物。 【化１】 1. An aromatic diamine represented by the general formula (1) and a bisphenol epoxy resin, a novolak epoxy resin, a cresol epoxy resin, a cyclic aliphatic epoxy resin, a glycidyl ester resin, or a glycidylamine resin. A low-viscosity underfill liquid resin composition comprising a resin component (A) comprising an epoxy resin and an inorganic filler (B). Embedded image
シ樹脂である請求項１記載の低粘度アンダーフィル用液
状樹脂組成物。2. The low-viscosity underfill liquid resin composition according to claim 1, wherein the epoxy resin is a bisphenol-type epoxy resin.
合計に占める無機フィラー（Ｂ）の重量割合が０．２〜
０．７である請求項１記載の低粘度アンダーフィル用液
状樹脂組成物。3. The weight ratio of the inorganic filler (B) to the total of the resin component (A) and the inorganic filler (B) is from 0.2 to 0.2.
The low viscosity underfill liquid resin composition according to claim 1, which is 0.7.
アンダーフィル用液状樹脂組成物を用いて作製した半導
体装置。4. A semiconductor device manufactured by using the liquid resin composition for underfill underfill according to claim 1.
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| JP2001086925A JP2002284849A (en) | 2001-03-26 | 2001-03-26 | Liquid resin composition and semiconductor device |
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| JP2001086925A JP2002284849A (en) | 2001-03-26 | 2001-03-26 | Liquid resin composition and semiconductor device |
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| JP2002284849A true JP2002284849A (en) | 2002-10-03 |
Family
ID=18942233
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