JP2002270453A - Multilayer electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer electronic component in which electrical characteristics can be prevented from deteriorating by suppressing heat even when a high current is supplied. SOLUTION: The multilayer electronic component 1 comprises an inner electrode 5 formed in a function material layer 3, and another function material layer 3 laid thereon wherein heat dissipation layers 10 and 11 exposing the end to the surface of the component body 2 are formed on the same plane as the inner electrode 5 of the function material layer 3 on the outside thereof.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は発熱による電気的特
性の劣化を防止する放熱層を有した積層電子部品に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component having a heat radiation layer for preventing deterioration of electrical characteristics due to heat generation.

【０００２】[0002]

【従来の技術】従来の積層電子部品として、特開平１１
−１４４９９７号公報に記載された三端子コンデンサが
知られている。2. Description of the Related Art A conventional laminated electronic component is disclosed in
There is known a three-terminal capacitor described in JP-A-144997.

【０００３】図７は従来の積層電子部品の分解斜視図
で、図８は同積層電子部品の外観斜視図である。FIG. 7 is an exploded perspective view of a conventional laminated electronic component, and FIG. 8 is an external perspective view of the laminated electronic component.

【０００４】図７，図８において５０は積層電子部品で
あり、この積層電子部品５０は誘電体セラミックよりな
る直方体状の焼結した部品本体５１の左右両側面に信号
側外部電極５２と５３、前後両側面にグランド側外部電
極５４と５５とを形成し、前記信号側外部電極５２と５
３とを信号側内部電極層５６により導通し、前記グラン
ド側外部電極５４と５５とをグランド側内部電極層５７
により導通し、この焼結体の上面、下面に保護層５８を
積層したものであり、前記信号側外部電極５２と５３と
グランド側外部電極５４と５５との間にコンデンサを構
成している。In FIGS. 7 and 8, reference numeral 50 denotes a multilayer electronic component. The multilayer electronic component 50 has signal-side external electrodes 52 and 53 on both left and right sides of a rectangular parallelepiped sintered component body 51 made of dielectric ceramic. Ground-side external electrodes 54 and 55 are formed on both front and rear sides, and the signal-side external electrodes 52 and 5 are formed.
3 is conducted by the signal side internal electrode layer 56, and the ground side external electrodes 54 and 55 are connected to the ground side internal electrode layer 57.
And a protective layer 58 is laminated on the upper and lower surfaces of the sintered body, and constitutes a capacitor between the signal-side external electrodes 52 and 53 and the ground-side external electrodes 54 and 55.

【０００５】この積層電子部品５０は３端子コンデンサ
を構成しているものであり、グランド側外部電極５４お
よび５５の一方（又は双方）が機器のグランド回路に接
地する用に実装し、信号側外部電極５２および５３を入
出力電極として信号電流を信号側内部電極５６に通電す
ることにより、前記信号電流に重畳するノイズ成分をグ
ランド回路へ導くことが可能となる。The laminated electronic component 50 constitutes a three-terminal capacitor. One (or both) of the ground-side external electrodes 54 and 55 is mounted so as to be grounded to the ground circuit of the device, and the signal-side external electrode is mounted. By passing a signal current through the signal-side internal electrode 56 using the electrodes 52 and 53 as input / output electrodes, a noise component superimposed on the signal current can be guided to the ground circuit.

【０００６】[0006]

【発明が解決しようとする課題】この積層電子部品５０
において、信号側内部電極５６と信号側外部電極５２お
よび５３に大電流を通電する場合は、それら電極が保有
する抵抗により、電気エネルギーが消費されて発熱作用
が伴い、更にこの発熱で誘電体セラミックの誘電率が変
化して静電容量が変化するため、ノイズフィルタとして
使用した場合は、電気特性である挿入損失特性が劣化す
るという問題点を有していた。The laminated electronic component 50
In the case where a large current is applied to the signal-side internal electrode 56 and the signal-side external electrodes 52 and 53, electric resistance is consumed by the resistances of the electrodes and heat is generated. However, since the dielectric constant of the device changes and the capacitance changes, when the device is used as a noise filter, there is a problem that the insertion loss characteristics, which are the electrical characteristics, are deteriorated.

【０００７】本発明は前記従来の問題点を解決するもの
で、大電流を流した場合でも発熱を抑えて電気特性の劣
化を防止できる積層電子部品を提供することを目的とす
るものである。An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a laminated electronic component capable of suppressing heat generation even when a large current flows and preventing deterioration of electric characteristics.

【０００８】[0008]

【課題を解決するための手段】前記目的を達成するため
に、本発明は以下の構成を有するものである。In order to achieve the above object, the present invention has the following arrangement.

【０００９】本発明の請求項１に記載の発明は、機能材
料層の内方に内部電極を形成し、これに別の機能材料層
を積層した積層電子部品において、前記機能材料層の内
部電極と同一面上で内部電極の外方に部品本体の表面に
端部を露出する放熱層を形成した積層電子部品であり、
これにより内部電極に信号を通電した時に、内部電極が
保有する抵抗により電気エネルギーが消費されて発生す
る熱を放熱層が吸熱し、部品本体の表面に露出した端部
を通じて部品本体の外へ放熱するため、積層電子部品の
発熱を抑え電気特性の劣化を防止することができるとい
う作用効果が得られる。According to a first aspect of the present invention, there is provided a laminated electronic component in which an internal electrode is formed inside a functional material layer and another functional material layer is laminated on the internal electrode. It is a laminated electronic component having a heat radiation layer that exposes an end on the surface of the component body on the same surface and outside the internal electrode,
As a result, when a signal is applied to the internal electrode, the heat dissipation layer absorbs the heat generated by the consumption of electric energy by the resistance of the internal electrode, and radiates heat to the outside of the component body through the end exposed on the surface of the component body. Therefore, an operational effect is obtained in that heat generation of the laminated electronic component can be suppressed and deterioration of electrical characteristics can be prevented.

【００１０】本発明の請求項２に記載の発明は、放熱層
を金属層で形成した請求項１に記載の積層電子部品であ
り、これにより内部電極に信号を通電した時に発生する
熱を金属層からなる放熱層が効果的に吸熱し、部品本体
の外へ放熱するため、積層電子部品の発熱を抑え電気特
性の劣化を防止することができるという作用効果が得ら
れる。According to a second aspect of the present invention, there is provided the laminated electronic component according to the first aspect, wherein the heat radiation layer is formed of a metal layer. Since the heat dissipation layer composed of the layers effectively absorbs heat and dissipates heat to the outside of the component body, the effect of suppressing heat generation of the laminated electronic component and preventing deterioration of electrical characteristics can be obtained.

【００１１】本発明の請求項３に記載の発明は、内部電
極を挟んで両側の外方に放熱層を形成した請求項１に記
載の積層電子部品であり、これにより内部電極で発生す
る熱を内部電極の両側外方の放熱層が吸熱して部品本体
の外へ放熱されるので、積層電子部品全体にわたって均
一に発熱を抑えることができ、電気特性の劣化を防止す
ることができるという作用効果が得られる。According to a third aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein heat radiation layers are formed on both sides of the internal electrode with the heat radiation layers formed therebetween. Since the heat dissipation layers on both sides of the internal electrode absorb heat and dissipate heat to the outside of the component body, the heat generation can be uniformly suppressed over the entire multilayer electronic component, and the deterioration of electrical characteristics can be prevented. The effect is obtained.

【００１２】本発明の請求項４に記載の発明は、内部電
極の延長方向に並設して放熱層を形成した請求項１に記
載の積層電子部品であり、これにより内部電極の何れの
位置でもこの内部電極から発生する熱を均一に吸熱し、
放熱層を通じて部品本体の外へ放熱できるので、積層電
子部品の発熱を抑え電気特性の劣化を防止することがで
きるという作用効果が得られる。According to a fourth aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein a heat radiation layer is formed in parallel with the extension direction of the internal electrode. However, it uniformly absorbs the heat generated from this internal electrode,
Since heat can be radiated to the outside of the component main body through the heat radiation layer, the function and effect of suppressing heat generation of the multilayer electronic component and preventing deterioration of electrical characteristics can be obtained.

【００１３】本発明の請求項５に記載の発明は、放熱層
の厚みを内部電極の厚みより厚く形成した請求項１に記
載の積層電子部品であり、これにより内部電極で発生す
る熱を効果的に放熱層が吸熱して、部品本体の外へ効率
良く放熱でき、積層電子部品の発熱を抑え電気特性の変
化を防止することができるという作用効果が得られる。According to a fifth aspect of the present invention, there is provided the laminated electronic component according to the first aspect, wherein the thickness of the heat radiation layer is formed larger than the thickness of the internal electrode. The heat radiation layer absorbs heat, and the heat can be efficiently radiated to the outside of the component body, and the effect of suppressing heat generation of the multilayer electronic component and preventing a change in electrical characteristics can be obtained.

【００１４】本発明の請求項６に記載の発明は、放熱層
をＣｕ又はＮｉを主成分とする金属層とした請求項１に
記載の積層電子部品であり、これによりＣｕ又はＮｉ金
属を主成分とすることで放熱層の熱伝導性を向上するこ
とができ、内部電極に信号を通電した時に発生する熱を
効果的に吸熱し、部品本体の外へ放熱するため積層電子
部品の発熱を抑え電気特性の劣化を防止することができ
るという作用効果が得られる。According to a sixth aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the heat radiation layer is a metal layer containing Cu or Ni as a main component. As a component, the thermal conductivity of the heat radiation layer can be improved, and the heat generated when a signal is applied to the internal electrode is effectively absorbed, and the heat generated by the laminated electronic component is radiated outside the component body. The effect that the suppression of the deterioration of the electric characteristics can be prevented can be obtained.

【００１５】本発明の請求項７に記載の発明は、放熱層
の金属成分を内部電極に含む充電充填量より多く含有し
た請求項１に記載の積層電子部品であり、これにより放
熱層は内部電極より多くの金属成分を含むため、内部電
極で発生する熱を確実に放熱層が吸熱し部品本体の外へ
放熱するため、積層電子部品の発熱を抑え電気特性の劣
化を防止することができるという作用効果が得られる。According to a seventh aspect of the present invention, there is provided the laminated electronic component according to the first aspect, wherein the metal component of the heat radiation layer is contained in an amount larger than the charged filling amount contained in the internal electrode. Since it contains more metal components than the electrodes, the heat generated by the internal electrodes is reliably absorbed by the heat dissipation layer and radiated to the outside of the component body, so that heat generation of the laminated electronic component can be suppressed and deterioration of the electrical characteristics can be prevented. The operation and effect are obtained.

【００１６】本発明の請求項８に記載の発明は、積層体
の表面に外部放熱電極を形成し、積層体の内部の放熱層
と接続した請求項１に記載の積層電子部品であり、これ
により放熱層が吸収する熱は積層体の表面に設けた外部
放熱電極へ伝導し、部品本体の外へ放熱されるため積層
電子部品の発熱を抑え電気特性の劣化を防止することが
できるという作用効果が得られる。The invention according to claim 8 of the present invention is the multilayer electronic component according to claim 1, wherein an external heat radiation electrode is formed on the surface of the laminate and connected to a heat radiation layer inside the laminate. As a result, the heat absorbed by the heat radiation layer is conducted to the external heat radiation electrode provided on the surface of the laminate, and is radiated to the outside of the component body, thereby suppressing the heat generation of the multilayer electronic component and preventing the deterioration of the electrical characteristics. The effect is obtained.

【００１７】本発明の請求項９に記載の発明は、外部放
熱電極を金属で形成した請求項８に記載の積層電子部品
であり、これにより放熱層が吸収する熱は積層体の表面
に設けた金属からなる外部放熱電極へ伝導し、部品本体
の外へ放熱することが可能となる。更に外部放熱電極を
基板に半田付け実装することが可能となり、確実に部品
本体の外へ放熱できるため積層電子部品の発熱を抑え電
気特性の劣化を防止することができるという作用効果が
得られる。According to a ninth aspect of the present invention, there is provided the multilayer electronic component according to the eighth aspect, wherein the external heat radiation electrode is formed of a metal, whereby heat absorbed by the heat radiation layer is provided on the surface of the laminate. It is possible to conduct the heat to the external heat radiation electrode made of the metal and radiate the heat to the outside of the component body. Further, the external heat radiation electrode can be soldered and mounted on the substrate, and the heat can be reliably radiated to the outside of the component main body. Therefore, the effect of suppressing the heat generation of the laminated electronic component and preventing the deterioration of the electric characteristics can be obtained.

【００１８】本発明の請求項１０に記載の発明は、外部
放熱電極を積層体を囲むように形成した請求項８に記載
の積層電子部品であり、これにより外部放熱電極の表面
積が大きくなり、効果的に部品本体の外へ放熱できるた
め、積層電子部品の発熱を抑え電気特性の劣化を防止す
ることができるという作用効果が得られる。According to a tenth aspect of the present invention, there is provided the multilayer electronic component according to the eighth aspect, wherein the external heat radiation electrode is formed so as to surround the laminate, whereby the surface area of the external heat radiation electrode is increased. Since the heat can be effectively radiated to the outside of the component main body, it is possible to obtain an operational effect that heat generation of the multilayer electronic component can be suppressed and deterioration of electrical characteristics can be prevented.

【００１９】本発明の請求項１１に記載の発明は、外部
放熱電極の表面に複数の凹凸部を形成した請求項９に記
載の積層電子部品であり、これにより外部放熱電極の表
面は凹凸部によって表面積が更に大きくなり、効果的に
部品本体の外へ放熱できるため、積層電子部品の発熱を
抑え電気特性の劣化を防止することができるという作用
効果が得られる。An eleventh aspect of the present invention is the multilayer electronic component according to the ninth aspect, wherein a plurality of irregularities are formed on the surface of the external heat radiation electrode. As a result, the surface area is further increased, and heat can be effectively radiated to the outside of the component main body. Therefore, the operation and effect of suppressing heat generation of the multilayer electronic component and preventing deterioration of electrical characteristics can be obtained.

【００２０】本発明の請求項１２に記載の発明は、Ｃｕ
を主成分とする金属で外部放熱電極を形成した請求項８
に記載の積層電子部品であり、これにより積層体の内部
の放熱層と外部放熱電極は確実に接続し、積層体の内部
の放熱層が吸収した熱は外部放熱電極へ伝導して放熱さ
れるため、積層電子部品の発熱を抑え電気特性の劣化を
防止することができるという作用効果が得られる。The invention according to claim 12 of the present invention is characterized in that Cu
9. The external heat radiation electrode is formed of a metal mainly composed of:
Wherein the heat dissipation layer inside the laminate and the external heat dissipation electrode are securely connected, and the heat absorbed by the heat dissipation layer inside the laminate is conducted to the external heat dissipation electrode and dissipated. Therefore, an operational effect is obtained in that heat generation of the laminated electronic component can be suppressed and deterioration of electrical characteristics can be prevented.

【００２１】本発明の請求項１３に記載の発明は、機能
材料層が誘電体材料でありコンデンサ機能を構成した請
求項１に記載の積層電子部品であり、これにより積層型
コンデンサとしての電気特性の劣化を防止することがで
きるという作用効果が得られる。According to a thirteenth aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the functional material layer is a dielectric material and constitutes a capacitor function. This has the effect of preventing deterioration of the device.

【００２２】[0022]

【発明の実施の形態】以下、積層電子部品として３端子
コンデンサを用いて本発明の請求項１〜１３の実施の形
態を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described using a three-terminal capacitor as a laminated electronic component.

【００２３】図１は本発明の３端子コンデンサの分解斜
視図、図２は同３端子コンデンサの外観斜視図、図３は
同３端子コンデンサの外部電極を形成する前のグリーン
チップの斜視図である。FIG. 1 is an exploded perspective view of a three-terminal capacitor of the present invention, FIG. 2 is an external perspective view of the three-terminal capacitor, and FIG. 3 is a perspective view of a green chip before forming external electrodes of the three-terminal capacitor. is there.

【００２４】図１から図３において、１は積層電子部品
の一例としての３端子コンデンサであり、直方体状の部
品本体２の内部に機能材料層としてセラミック誘電体層
３を介して積層したグランド側内部電極４と信号側内部
電極５とを有し、前記部品本体２の正面と背面と上面と
下面に連続し、前記グランド側内部電極４に接続した外
部放熱電極６と、前記部品本体２の両側面上に前記信号
側内部電極５に接続した信号側外部電極７，８とを形成
しており、前記信号側内部電極５と同一平面上で信号側
内部電極５を挟む両側にこの信号側内部電極５と絶縁す
る間隔９をもって形成した放熱層１０，１１を形成して
前記外部放熱電極６と接続し、前記部品本体２の上段と
下段には無効層１２，１３を重ねた構成としたものであ
り、前記信号側外部電極７，８と前記外部放熱電極６と
の間にコンデンサ機能を発現する。In FIG. 1 to FIG. 3, reference numeral 1 denotes a three-terminal capacitor as an example of a laminated electronic component, which is laminated on the ground side via a ceramic dielectric layer 3 as a functional material layer inside a rectangular parallelepiped component body 2. An external heat radiation electrode 6 having an internal electrode 4 and a signal side internal electrode 5, connected to the ground side internal electrode 4, connected to the front, back, upper and lower surfaces of the component main body 2; Signal-side external electrodes 7, 8 connected to the signal-side internal electrode 5 are formed on both side surfaces, and the signal-side internal electrodes 5 are provided on both sides of the signal-side internal electrode 5 on the same plane as the signal-side internal electrode 5. Heat radiation layers 10 and 11 formed with an interval 9 to insulate the internal electrode 5 are formed and connected to the external heat radiation electrode 6, and the upper and lower layers of the component body 2 are overlapped with ineffective layers 12 and 13. And outside the signal side Expressing capacitor function between the electrodes 7 and 8 and the outer heat-dissipating electrode 6.

【００２５】また、前記放熱層１０，１１は部品本体２
の内部に長方形状で信号側内部電極５の延長方向で両側
に並設して配置し、この放熱層１０，１１はＣｕ又はＮ
ｉ金属を主成分とし、その金属成分の充填量は、グラン
ド側内部電極４および信号側内部電極５での金属充填量
より多くしている。The heat radiation layers 10 and 11 are provided on the component body 2.
The heat radiation layers 10 and 11 are made of Cu or N
The main component is i metal, and the filling amount of the metal component is larger than the metal filling amount in the ground side internal electrode 4 and the signal side internal electrode 5.

【００２６】更に、前記放熱層１０，１１は厚さを前記
信号側内部電極５より厚く形成して、この放熱層１０，
１１と前記外部放熱電極６とをそれぞれ接続している。Further, the heat radiation layers 10 and 11 are formed to be thicker than the signal side internal electrodes 5 so that
11 and the external heat radiation electrode 6 are connected to each other.

【００２７】また、前記外部放熱電極６はＣｕを主成分
とし、部品本体２を囲むように、更にその表面に複数の
凹凸部１６を設けて構成している。The external heat radiation electrode 6 is mainly composed of Cu, and is provided with a plurality of uneven portions 16 on its surface so as to surround the component body 2.

【００２８】以上のように構成された３端子コンデンサ
１は、信号側外部電極７及び８間に大電流の信号電流を
通電する場合、信号側内部電極５と信号側外部電極７及
び８が保有する抵抗により電気エネルギーが消費され、
それにより発熱作用が伴うが、この熱は放熱層１０，１
１が吸熱し、外部放熱電極６を介して３端子コンデンサ
１の外へ放熱される。更に信号電流に重畳するノイズ成
分は、信号側内部電極５とグランド側内部電極４で構成
されるコンデンサ成分により外部放熱電極６を介して除
去される。When a large signal current flows between the signal-side external electrodes 7 and 8, the three-terminal capacitor 1 configured as described above is held by the signal-side internal electrodes 5 and the signal-side external electrodes 7 and 8. Electrical energy is consumed by the
As a result, a heat is generated.
1 absorbs heat and radiates heat to the outside of the three-terminal capacitor 1 via the external heat radiation electrode 6. Further, a noise component superimposed on the signal current is removed via the external heat radiation electrode 6 by a capacitor component composed of the signal side internal electrode 5 and the ground side internal electrode 4.

【００２９】以上のように構成された３端子コンデンサ
１について、以下にその製造方法を説明する。A method of manufacturing the three-terminal capacitor 1 configured as described above will be described below.

【００３０】先ず、公知の３端子のコンデンサの製造方
法を用い、セラミック誘電体層３のグリーンシートを作
製する。First, a green sheet of the ceramic dielectric layer 3 is manufactured by using a known method of manufacturing a three-terminal capacitor.

【００３１】次に作製したセラミック誘電体層３グリー
ンシートを複数枚積層し上部無効層１２、下部無効層１
３を作製する。Next, a plurality of green sheets made of the ceramic dielectric layer 3 are laminated to form an upper invalid layer 12 and a lower invalid layer 1.
3 is manufactured.

【００３２】次いで、前記下部無効層１３の面上にセラ
ミック誘電体層３の第１層目のグリーンシートを積層
し、その上に第１層目の信号側内部電極５と放熱層１
０，１１を印刷する。Next, the first green sheet of the ceramic dielectric layer 3 is laminated on the surface of the lower inactive layer 13, and the first signal side internal electrode 5 and the heat radiation layer 1
Print 0,11.

【００３３】次に、その上に第２層目のセラミック誘電
体層３のグリーンシートを積層し、この上に第２層目の
グランド側内部電極４を印刷する。Next, a green sheet of the second-layer ceramic dielectric layer 3 is laminated thereon, and the second-layer ground-side internal electrode 4 is printed thereon.

【００３４】更にこの上に第３層目のセラミック誘電体
層３のグリーンシートを積層し第１層目と同じように信
号側内部電極５と放熱層１０，１１を印刷し、この上に
第４層目のセラミック誘電体層３のグリーンシートを積
層し、第二層目と同様にグランド側内部電極４を印刷す
る。Further, a green sheet of the third ceramic dielectric layer 3 is laminated thereon, and the signal side internal electrodes 5 and the heat radiation layers 10 and 11 are printed in the same manner as in the first layer. Green sheets of the fourth ceramic dielectric layer 3 are laminated, and the ground-side internal electrodes 4 are printed in the same manner as the second layer.

【００３５】このようにして順次、セラミック誘電体層
３のグリーンシートに信号側内部電極５、放熱層１０，
１１、グランド側内部電極４を印刷して所定数積層した
後に上段に無効層１２を重ね加圧積層して積層体グリー
ンシートブロック（図示せず）を作製する。In this way, the signal side internal electrode 5, the heat radiation layer 10, and the
11. After printing and laminating a predetermined number of ground-side internal electrodes 4, an ineffective layer 12 is overlaid and laminated under pressure to produce a laminated green sheet block (not shown).

【００３６】その後、積層体グリーンブロックを図３に
示すグリーンチップ１４の形状に切断し、このグリーン
チップ１４を所定温度で焼成して焼結体とし（図示せ
ず）、得られた焼結体をバレル研磨で面取り１５を行
い、部品本体２の内部に形成した信号側内部電極５と放
熱層１０，１１とグランド側内部電極４の各端部を、こ
の部品本体２の焼結体の表面にそれぞれ露出させる。Thereafter, the laminated green block is cut into the shape of a green chip 14 shown in FIG. 3, and the green chip 14 is fired at a predetermined temperature to form a sintered body (not shown). Is chamfered 15 by barrel polishing, and each end of the signal-side internal electrode 5, the heat radiation layers 10, 11 and the ground-side internal electrode 4 formed inside the component body 2 is placed on the surface of the sintered body of the component body 2. To each other.

【００３７】次いで、部品本体２の表面に露出した前記
信号側内部電極５と放熱層１０，１１とグランド側内部
電極４のそれぞれの端部全体を覆うようにして導電性Ｃ
ｕペーストを塗布して所定の温度で酸化雰囲気中で焼き
付けし外部放熱電極６と信号側外部電極７，８を形成す
る。このとき前記外部放熱電極６の上面と底面には、凹
凸溝１６が形成されるように塗布厚みを変えて前記導電
性Ｃｕペーストを塗布する。この凹凸溝１６は前記外部
放熱電極６の一端から他端まで開口して形成し、機器の
回路基板に半田付けをされない面となる両面に形成する
のが好ましい。Next, the conductive C is applied so as to cover the entire ends of the signal-side internal electrode 5, the heat radiation layers 10, 11 and the ground-side internal electrode 4 exposed on the surface of the component body 2.
The u paste is applied and baked in an oxidizing atmosphere at a predetermined temperature to form the external heat radiation electrode 6 and the signal side external electrodes 7 and 8. At this time, the conductive Cu paste is applied to the upper and lower surfaces of the external heat radiation electrode 6 while changing the application thickness so that the concave and convex grooves 16 are formed. It is preferable that the concave / convex groove 16 is formed so as to open from one end to the other end of the external heat radiation electrode 6 and is formed on both surfaces which are not to be soldered to a circuit board of the device.

【００３８】次いで、前記外部放熱電極６と信号側外部
電極７，８の表面に半田付け性や耐食性を得るためにメ
ッキ処理を施し３端子コンデンサ１を完成する。Next, the surfaces of the external heat radiation electrode 6 and the signal side external electrodes 7 and 8 are plated to obtain solderability and corrosion resistance, thereby completing the three-terminal capacitor 1.

【００３９】以上のように構成して製造した３端子コン
デンサ１について、以下にその特性を説明する。The characteristics of the three-terminal capacitor 1 manufactured as described above will be described below.

【００４０】ここでは３端子コンデンサの静電容量値を
２２ｎＦに設計したものを使用して説明する。Here, description will be made using a three-terminal capacitor designed to have a capacitance value of 22 nF.

【００４１】本実施の形態で説明した３端子コンデンサ
１と従来の技術で説明した３端子コンデンサ５０につい
て、電流を流した時の発熱特性の比較を図４に示し、温
度変化における挿入損失特性の比較を図５と図６に示
す。FIG. 4 shows a comparison of the heat generation characteristics when a current flows between the three-terminal capacitor 1 described in the present embodiment and the three-terminal capacitor 50 described in the prior art, and shows the insertion loss characteristics with temperature change. A comparison is shown in FIGS.

【００４２】発熱特性は所定の基板に３端子コンデンサ
を半田付けし、直流電流を信号側外部電極７，８及び５
２，５３間に通電した時の発熱温度を、赤外線放射温度
計（キーエンス社製 測定部ＩＴ２−０２・コントロー
ラＩＴ２−５０）で測定したものである。The heat generation characteristics are as follows. A three-terminal capacitor is soldered to a predetermined substrate, and direct current is applied to the signal side external electrodes 7, 8, and 5.
The exothermic temperature measured when an electric current was passed between the terminals 2 and 53 was measured with an infrared radiation thermometer (measurement unit IT2-02, controller IT2-50 manufactured by Keyence Corporation).

【００４３】挿入損失特性の比較は、３端子コンデンサ
１，５０を所定の基板に半田付けし、測定環境の温度を
図４の結果をもとに変化させて、Ｓパラメーター・ネッ
トワークアナライザー（ＨＥＷＬＥＴＴ ＰＡＣＫＡＲ
Ｄ社製 ８７５３ＥＳ）で測定したものである。The comparison of the insertion loss characteristics was performed by soldering the three-terminal capacitors 1 and 50 to a predetermined substrate, changing the temperature of the measurement environment based on the results shown in FIG. 4, and using an S-parameter network analyzer (HEWLETT PACKAR).
D, 8753ES).

【００４４】図４に示すように、直流電流を１Ａと３Ａ
で通電したときの発熱温度を測定した。それによると６
０秒後の発熱温度ΔＴは、本発明品は１Ａで２．２℃、
３Ａで１９．３℃であるのに対して、従来品は１Ａで
７．５℃、３Ａで６８．２℃であった。この結果より発
熱温度は通電する電流の約２乗に比例し、本発明品は発
熱温度を従来品に比べて小さく抑えることが可能である
ことがわかる。As shown in FIG. 4, the DC current is 1A and 3A.
The exothermic temperature when electricity was supplied was measured. According to it 6
The exothermic temperature ΔT after 0 seconds is 2.2 ° C. at 1 A for the product of the present invention.
The temperature was 19.3 ° C at 3A, whereas the conventional product was 7.5 ° C at 1A and 68.2 ° C at 3A. From this result, it can be seen that the heat generation temperature is proportional to the square of the current flowing, and that the heat generation temperature of the present invention can be suppressed to be lower than that of the conventional product.

【００４５】図５，図６に示すように、測定温度は図４
の結果をもとに、本発明品は２２℃（常温ΔＴ＝０℃）
・２４℃（ΔＴ＝２℃）・４１℃（ΔＴ＝１９℃）で、
従来品は２２℃（常温ΔＴ＝０℃）・３０℃（ΔＴ＝８
℃）・９０℃（ΔＴ＝６８℃）に変化させて、挿入損失
特性を測定した。それによると、本発明品は、ΔＴが１
９℃までは挿入損失特性がほとんど変化しないのに比べ
て、従来品はΔＴが６８℃になると挿入損失特性の帯域
幅および共振周波数が大きく変化するのがわかる。すな
わち発熱温度を小さく抑えることにより挿入損失の変化
を小さく抑えることができる。As shown in FIGS. 5 and 6, the measured temperature is shown in FIG.
Based on the results, the product of the present invention is 22 ° C (normal temperature ΔT = 0 ° C)
・ 24 ℃ (ΔT = 2 ℃) ・ 41 ℃ (ΔT = 19 ℃)
Conventional products are 22 ° C (normal temperature ΔT = 0 ° C) and 30 ° C (ΔT = 8
° C) · 90 ° C (ΔT = 68 ° C) and the insertion loss characteristics were measured. According to this, the product of the present invention has ΔT of 1
It can be seen that the insertion loss characteristic hardly changes up to 9 ° C., whereas the bandwidth and the resonance frequency of the insertion loss characteristic of the conventional product greatly change when ΔT reaches 68 ° C. That is, by suppressing the heat generation temperature, the change in insertion loss can be suppressed to a small value.

【００４６】以上のように本実施の形態における３端子
コンデンサは、放熱用の電極を設けることにより、信号
側内部電極５で発生する熱は、放熱層１０，１１が吸熱
し、外部放熱電極６を通じて部品本体２の外へ放熱され
るので、部品本体２の発熱を抑え挿入損失特性の変化を
防止することが可能となる。As described above, in the three-terminal capacitor according to the present embodiment, the heat generated in the signal side internal electrode 5 is absorbed by the heat radiation layers 10 and 11 and the external heat radiation electrode 6 Thus, the heat is radiated to the outside of the component body 2, so that the heat generation of the component body 2 can be suppressed and the change of the insertion loss characteristic can be prevented.

【００４７】前記の実施の形態においては、機能材料層
としてセラミック誘電体層を用いたが、これに代わりチ
タン酸ストロンチウムや酸化亜鉛を主成分とするバリス
タ層を用いることによりバリスタ部品を構成し、このバ
リスタ部品の自己発熱を抑えサージ電圧の吸収に優れた
特性を得ることができる。In the above-described embodiment, the ceramic dielectric layer is used as the functional material layer, but a varistor component is constituted by using a varistor layer containing strontium titanate or zinc oxide as a main component instead. It is possible to suppress the self-heating of the varistor component and obtain characteristics excellent in absorbing surge voltage.

【００４８】[0048]

【発明の効果】以上のように本発明の積層電子部品は、
信号側内部電極と同一平面上に放熱層を形成することに
より、信号側外部電極および信号側内部電極に大電流を
通電する場合でも、信号側内部電極で発生する熱を放熱
層が吸熱して外部放熱層電極を通じて部品の外へ放熱す
るので、積層電子部品の発熱を抑え電気特性の劣化を防
止することが可能となる。As described above, the laminated electronic component of the present invention is
By forming a heat dissipation layer on the same plane as the signal side internal electrode, even when a large current is applied to the signal side external electrode and the signal side internal electrode, the heat dissipation layer absorbs heat generated at the signal side internal electrode. Since heat is radiated to the outside of the component through the external heat radiation layer electrode, heat generation of the multilayer electronic component can be suppressed, and deterioration of electrical characteristics can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の実施の形態の３端子コンデンサの分解
斜視図FIG. 1 is an exploded perspective view of a three-terminal capacitor according to an embodiment of the present invention.

【図２】同実施の形態の３端子コンデンサの外観斜視図FIG. 2 is an external perspective view of the three-terminal capacitor of the embodiment.

【図３】同実施の形態の３端子コンデンサのグリーンチ
ップの斜視図FIG. 3 is a perspective view of a green chip of the three-terminal capacitor of the embodiment.

【図４】本実施の形態の３端子コンデンサと従来の３端
子コンデンサの発熱特性の比較図FIG. 4 is a comparison diagram of heat generation characteristics of the three-terminal capacitor of the present embodiment and a conventional three-terminal capacitor.

【図５】本発明の実施の形態における３端子コンデンサ
の温度変化における挿入損失特性図FIG. 5 is a graph showing an insertion loss characteristic of the three-terminal capacitor according to the embodiment of the present invention with a temperature change.

【図６】従来の３端子コンデンサの温度変化における挿
入損失特性図FIG. 6 is a graph showing an insertion loss characteristic of a conventional three-terminal capacitor with a change in temperature.

【図７】従来の積層電子部品の分解斜視図FIG. 7 is an exploded perspective view of a conventional multilayer electronic component.

【図８】同従来の３端子コンデンサの外観斜視図FIG. 8 is an external perspective view of the conventional three-terminal capacitor.

【符号の説明】[Explanation of symbols]

１ ３端子コンデンサ（積層電子部品） ２ 部品本体 ３ セラミック誘電体層 ４ グランド側内部電極 ５ 信号側内部電極 ６ 外部放熱電極 ７，８ 信号側外部電極 ９ 間隔 １０，１１ 放熱層 １２，１３ 無効層 １４ グリーンチップ １５ 面取り １６ 凹凸部 REFERENCE SIGNS LIST 1 3-terminal capacitor (multilayer electronic component) 2 component body 3 ceramic dielectric layer 4 ground-side internal electrode 5 signal-side internal electrode 6 external heat-dissipating electrode 7,8 signal-side external electrode 9 interval 10,11 heat-dissipating layer 12,13 ineffective layer 14 Green chip 15 Chamfer 16 Roughness

Claims (13)

【特許請求の範囲】[Claims] 【請求項１】 機能材料層の内方に内部電極を形成し、
これに別の機能材料層を積層した積層電子部品におい
て、前記機能材料層の内部電極と同一面上で内部電極の
外方に部品本体の表面に端部を露出する放熱層を形成し
た積層電子部品。1. An internal electrode is formed inside a functional material layer,
A laminated electronic component having another functional material layer laminated thereon, wherein a laminated heat dissipating layer is formed on the same surface as the internal electrode of the functional material layer and outside the internal electrode, the heat radiation layer exposing an end portion on the surface of the component body. parts. 【請求項２】 放熱層を金属層で形成した請求項１に記
載の積層電子部品。2. The multilayer electronic component according to claim 1, wherein the heat radiation layer is formed of a metal layer. 【請求項３】 内部電極を挟んで両側の外方に放熱層を
形成した請求項１に記載の積層電子部品。3. The multilayer electronic component according to claim 1, wherein heat radiation layers are formed on both sides of the internal electrode with the heat radiation layers formed therebetween. 【請求項４】 内部電極の延長方向に並設して放熱層を
形成した請求項１に記載の積層電子部品。4. The multilayer electronic component according to claim 1, wherein a heat radiation layer is formed in parallel with the extension direction of the internal electrode. 【請求項５】 放熱層の厚みを内部電極の厚みより厚く
形成した請求項１に記載の積層電子部品。5. The multilayer electronic component according to claim 1, wherein the thickness of the heat radiation layer is formed larger than the thickness of the internal electrode. 【請求項６】 放熱層をＣｕ又はＮｉを主成分とする金
属層とした請求項１に記載の積層電子部品。6. The multilayer electronic component according to claim 1, wherein the heat radiation layer is a metal layer containing Cu or Ni as a main component. 【請求項７】 放熱層の金属成分を内部電極に含む金属
充填量より多く含有した請求項１に記載の積層電子部
品。7. The multilayer electronic component according to claim 1, wherein a metal component of the heat radiation layer is contained in an amount larger than a metal filling amount contained in the internal electrode. 【請求項８】 積層体の表面に外部放熱電極を形成し、
積層体の内部の放熱層と接続した請求項１に記載の積層
電子部品。8. An external heat radiation electrode is formed on a surface of the laminate,
The multilayer electronic component according to claim 1, wherein the multilayer electronic component is connected to a heat dissipation layer inside the multilayer body. 【請求項９】 外部放熱電極を金属で形成した請求項８
に記載の積層電子部品。9. The external heat radiation electrode is formed of a metal.
3. The laminated electronic component according to item 1. 【請求項１０】 外部放熱電極を積層体を囲むように形
成した請求項９に記載の積層電子部品。10. The multilayer electronic component according to claim 9, wherein the external heat radiation electrode is formed so as to surround the multilayer body. 【請求項１１】 外部放熱電極の表面に複数の凹凸部を
形成した請求項８に記載の積層電子部品。11. The multilayer electronic component according to claim 8, wherein a plurality of uneven portions are formed on the surface of the external heat radiation electrode. 【請求項１２】 Ｃｕを主成分とする金属で外部放熱電
極を形成した請求項８に記載の積層電子部品。12. The multilayer electronic component according to claim 8, wherein the external heat radiation electrode is formed of a metal containing Cu as a main component. 【請求項１３】 機能材料層が誘電体材料でありコンデ
ンサ機能を構成した請求項１に記載の積層電子部品。13. The multilayer electronic component according to claim 1, wherein the functional material layer is a dielectric material and has a capacitor function.