JP2002255581A5 - - Google Patents
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- JP2002255581A5 JP2002255581A5 JP2001059049A JP2001059049A JP2002255581A5 JP 2002255581 A5 JP2002255581 A5 JP 2002255581A5 JP 2001059049 A JP2001059049 A JP 2001059049A JP 2001059049 A JP2001059049 A JP 2001059049A JP 2002255581 A5 JP2002255581 A5 JP 2002255581A5
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【0009】
【課題を解決するための手段】
前記課題を解決するために、本発明の基板割断方法は、貼り合わされた2枚の基板の両方の面にレーザ光を同時に照射して基板を割断する基板割断方法において、各基板に照射されるレーザ光の少なくとも一方を、基板の面と直交する垂線に対して所定の角度を成すように、基板の面に入射させることを特徴とする。また、本発明は、貼り合わされた2枚の基板の両方の面にレーザ光を同時に照射して基板を割断する基板割断装置において、各基板に照射されるレーザ光の少なくとも一方を、基板の面と直交する垂線に対して所定の角度を成すように、基板の面に入射させる光学系を備えていることを特徴とする。また、本発明は、互いに貼り合わされる2枚の基板間に液晶を封入して液晶パネルを製造する方法において、2つの母基板をシール材によって貼り合わて大判パネルを形成する工程と、前記大判パネルを割断して、短冊状のパネルを形成する1次ブレーク工程と、前記シール材に設けられた液晶注入口を通じて、前記短冊状パネルのセル内に液晶を注入した後、前記液晶注入口を封止する工程と、液晶が注入された前記短冊状パネルを割断して、所望の大きさのパネルを形成する2次ブレーク工程とを具備し、前記1次ブレーク工程および2次ブレーク工程の少なくとも一方の工程では、パネルを形成する2枚の貼り合わせ基板の両方の面にレーザ光を同時に照射して基板を割断するとともに、各基板に照射されるレーザ光の少なくとも一方を、基板の面と直交する垂線に対して所定の角度を成すように、基板の面に入射させることを特徴とする。[0009]
[Means for Solving the Problems]
In order to solve the above problems, according to the substrate cutting method of the present invention, each substrate is irradiated in the substrate cutting method in which the laser light is simultaneously applied to both surfaces of the two bonded substrates to cut the substrate. At least one of the laser beams is made to be incident on the surface of the substrate so as to form a predetermined angle with respect to a perpendicular perpendicular to the surface of the substrate. Further, according to the present invention, in a substrate cutting apparatus which simultaneously irradiates laser light to both surfaces of two bonded substrates to cut the substrate, at least one of the laser light irradiated to each substrate is the surface of the substrate. And an optical system for causing the light to be incident on the surface of the substrate so as to form a predetermined angle with respect to a perpendicular line perpendicular to the surface of the substrate. Further, in the method of manufacturing a liquid crystal panel by sealing liquid crystal between two substrates bonded to each other, the present invention includes the steps of bonding two mother substrates with a sealing material to form a large-sized panel; The liquid crystal is injected into the cells of the strip panel through a primary break process of cutting the panel to form a strip panel, and the liquid crystal injection port provided in the sealing material, and then the liquid crystal injection port is And sealing the strip-shaped panel having the liquid crystal injected thereinto to form a panel of a desired size, and forming at least one of the primary breaking step and the secondary breaking step. In one process, laser light is simultaneously applied to both surfaces of two bonded substrates forming a panel to cut the substrates, and at least one of the laser beams irradiated to each substrate , So as to form a predetermined angle with respect to a vertical line perpendicular to the plane of the substrate, and wherein the to be incident on the surface of the substrate.
【0010】
これらの発明によれば、各基板に照射されるレーザ光同士が干渉しないため、レーザ光が発振源と異なる他方側のレーザ発振器に到達して(表裏両方のレーザ光が干渉して、反対側の光学系に入射した光や反対側の光学系によって反射された光がレーザ発振器に到達して)しまうことがない。 そのため、レーザ発振器の故障を未然に防止することができる。[0010]
According to these inventions, since the laser beams irradiated to the respective substrates do not interfere with each other, the laser beam reaches the other side of the laser oscillator which is different from the oscillation source (the laser beam on both the front and back sides interferes The light incident on the optical system of (1) and the light reflected by the optical system on the opposite side do not reach the laser oscillator). Therefore, failure of the laser oscillator can be prevented in advance.
【0011】
なお、これらの構成においては、一方の基板の面上の所定のスポット位置にレーザ光を集光する第1の集光レンズと、他方の基板の面上の所定のスポット位置にレーザ光を集光する第2の集光レンズとを備え、レーザ光の前記スポット位置を通る法線からこの法線と直交するように延び且つ第1の集光レンズを通る線をLとし、また、前記法線と直交するように延び且つ第2の集光レンズを通る線をL'とすると、LとL'とが成す角度Φが0°〜90°の範囲内に設定されていることが望ましい。また、前記角度Φが0°であり、一方の基板に照射されるレーザ光の入射角と他方の基板に照射されるレーザ光の入射角とが共に等しい場合、基板と集光レンズとの間の距離をS、基板面上におけるレーザスポットの最大径をD、レーザ光が集光レンズに入射する時のレーザスポット径をd、集光レンズの直径をL、一方の基板面上のスポット位置と他方の基板面上のスポット位置との間の水平距離の最大値をyとすると、基板に照射されるレーザ光の入射角θ(°)は、θ>ビーム広がり角+集光レンズの角度+Y移動分の角度=180(D−d)/2Sπ+90L/Sπ+90y/Sπであることが望ましい。これにより、上記作用効果の達成を確実ならしめることができる。[0011]
In these configurations, the first condensing lens for condensing the laser beam to a predetermined spot position on the surface of one substrate, and the laser beam to a predetermined spot position on the surface of the other substrate And a second condensing lens that emits light, wherein a line extending orthogonal to the normal from the normal passing through the spot position of the laser light and passing through the first condensing lens is L, and the method Assuming that a line extending orthogonal to the line and passing through the second condenser lens is L ′, it is preferable that an angle 成 す formed by L and L ′ be set in a range of 0 ° to 90 °. Further, when the angle Φ is 0 ° and the incident angle of the laser beam irradiated to one of the substrates and the incident angle of the laser beam irradiated to the other substrate are both equal, the distance between the substrate and the condensing lens is The distance of S is the maximum diameter of the laser spot on the substrate surface D, the laser spot diameter when the laser beam is incident on the focusing lens d, the diameter of the focusing lens L, the spot position on one substrate surface The incident angle θ (°) of the laser beam irradiated to the substrate is θ> beam divergence angle + condenser lens angle, where y is the maximum value of the horizontal distance between the light source and the spot position on the other substrate surface. It is desirable that the angle for + Y movement = 180 (D−d) / 2Sπ + 90L / Sπ + 90y / Sπ. This can ensure the achievement of the above-described effects.
【0012】
また、本発明は、一方の基板に照射されるレーザ光の入射角と他方の基板に照射されるレーザ光の入射角とが共に等しいことを特徴とする。[0012]
Further, the present invention is characterized in that the incident angle of the laser beam irradiated to one substrate and the incident angle of the laser beam irradiated to the other substrate are both equal.
【0013】
この発明によれば、レーザスポットの形状が両方の基板で一致するため、基板に作用する熱応力を同一にして効率的に割断することが可能になるとともに、両方の基板にレーザ光を照射する2つの光学系を共用できる利点がある。[0013]
According to the present invention, since the shapes of the laser spots coincide with each other on both substrates, it becomes possible to make the thermal stress acting on the substrates identical and efficiently cut, and to irradiate the both substrates with laser light. There is an advantage that two optical systems can be shared.
【0014】
また、本発明は、レーザ光を基板の面に導く光学系を移動させることによって、基板の面に対するレーザ光のスポット位置を変化させることを特徴とする。また、本発明は、基板の面に形成されてレーザ光によって走査されるスクライブ溝の長手方向及びこの長手方向に対して直交する方向で前記光学系を移動することによって、レーザ光のスポット位置を変化させることを特徴とする。[0014]
Further, the present invention is characterized in that the spot position of the laser beam with respect to the surface of the substrate is changed by moving the optical system for guiding the laser beam to the surface of the substrate. Further, according to the present invention, the spot position of the laser beam is moved by moving the optical system in the longitudinal direction of the scribed groove formed on the surface of the substrate and scanned by the laser beam and the direction orthogonal to the longitudinal direction. It is characterized by changing.
【0015】
この発明によれば、両方の基板のスクライブ溝に対して各レーザ光のレーザスポットを正確に一致させるスポット調整を行なうことができるとともに、スクライブ溝の位置が両基板で一致する領域からスクライブ溝の位置が両基板でズレている領域への割断作業の移行時においてもスポット調整を容易且つ迅速に行なうことができる。[0015]
According to the present invention, it is possible to perform spot adjustment in which the laser spot of each laser beam accurately matches the scribe grooves of both substrates, and the position of the scribe grooves from the region where the two substrates coincide. The spot adjustment can be performed easily and quickly even at the time of the transition of the cutting work to the area where the positions are shifted on both substrates.
Claims (15)
各基板に照射されるレーザ光の少なくとも一方を、基板の面と直交する垂線に対して所定の角度を成すように、基板の面に入射させることを特徴とする基板割断方法。In a substrate cutting method in which laser light is simultaneously applied to both surfaces of two bonded substrates to cut the substrate,
A substrate cutting method characterized in that at least one of laser beams irradiated to each substrate is incident on the surface of the substrate so as to form a predetermined angle with respect to a perpendicular perpendicular to the surface of the substrate.
レーザ光の前記スポット位置を通る法線からこの法線と直交するように延び且つ第1の集光レンズを通る線をLとし、また、前記法線と直交するように延び且つ第2の集光レンズを通る線をL'とすると、LとL'とが成す角度Φが0°〜90°の範囲内に設定されていることを特徴とする請求項1ないし請求項4のいずれか1項に記載の基板割断方法。A first focusing lens for focusing laser light at a predetermined spot position on the surface of one substrate, and a second focusing lens for collecting laser light at a predetermined spot position on the surface of the other substrate Equipped with
A line extending from the normal passing through the spot position of the laser light to be perpendicular to the normal and passing through the first condenser lens is L, and it is extended to be perpendicular to the normal and the second collection The angle Φ formed by L and L 'is set in the range of 0 ° to 90 °, where L' is a line passing through the light lens. The board | substrate cutting method as described in a term.
θ>ビーム広がり角+集光レンズの角度+Y移動分の角度
=180(D−d)/2Sπ+90L/Sπ+90y/Sπ
であることを特徴とする請求項5に記載の基板割断方法。When the angle Φ is 0 ° and the incident angle of the laser beam irradiated to one substrate and the incident angle of the laser beam irradiated to the other substrate are both equal, the distance between the substrate and the condensing lens S, the maximum diameter of the laser spot on the substrate surface D, the laser spot diameter d when the laser light is incident on the focusing lens, the diameter of the focusing lens L, the spot position on the other substrate surface and the other The incident angle θ (°) of the laser beam irradiated to the substrate is y, where y is the maximum value of the horizontal distance between the substrate and the spot position on the substrate surface.
θ> beam divergence angle + angle of condensing lens + angle of Y movement = 180 (D−d) / 2Sπ + 90L / Sπ + 90y / Sπ
The substrate cutting method according to claim 5, characterized in that:
各基板に照射されるレーザ光の少なくとも一方を、基板の面と直交する垂線に対して所定の角度を成すように、基板の面に入射させる光学系を備えていることを特徴とする基板割断装置。In a substrate cutting apparatus that simultaneously irradiates laser light to both surfaces of two bonded substrates to cut the substrate,
There is provided an optical system for causing at least one of the laser beams irradiated to each substrate to be incident on the surface of the substrate so as to form a predetermined angle with respect to a perpendicular perpendicular to the surface of the substrate. apparatus.
レーザ光の前記スポット位置を通る法線からこの法線と直交するように延び且つ第1の集光レンズを通る線をLとし、また、前記法線と直交するように延び且つ第2の集光レンズを通る線をL'とすると、LとL'とが成す角度Φが0°〜90°の範囲内に設定されていることを特徴とする請求項7に記載の基板割断装置。A first focusing lens for focusing laser light at a predetermined spot position on the surface of one substrate, and a second focusing lens for collecting laser light at a predetermined spot position on the surface of the other substrate Equipped with
A line extending from the normal passing through the spot position of the laser light to be perpendicular to the normal and passing through the first condenser lens is L, and it is extended to be perpendicular to the normal and the second collection The substrate cutting apparatus according to claim 7, wherein an angle 成 す formed by L and L 'is set within a range of 0 ° to 90 °, where L' is a line passing through the light lens.
θ>ビーム広がり角+集光レンズの角度+Y移動分の角度
=180(D−d)/2Sπ+90L/Sπ+90y/Sπ
であることを特徴とする請求項8に記載の基板割断装置。When the angle Φ is 0 ° and the incident angle of the laser beam irradiated to one substrate and the incident angle of the laser beam irradiated to the other substrate are both equal, the distance between the substrate and the condensing lens S, the maximum diameter of the laser spot on the substrate surface D, the laser spot diameter d when the laser light is incident on the focusing lens, the diameter of the focusing lens L, the spot position on the other substrate surface and the other The incident angle θ (°) of the laser beam irradiated to the substrate is y, where y is the maximum value of the horizontal distance between the substrate and the spot position on the substrate surface.
θ> beam divergence angle + angle of condensing lens + angle of Y movement = 180 (D−d) / 2Sπ + 90L / Sπ + 90y / Sπ
The substrate cutting apparatus according to claim 8, characterized in that:
2つの母基板をシール材によって貼り合わせて大判パネルを形成する工程と、 前記大判パネルを割断して、短冊状のパネルを形成する1次ブレーク工程と、 前記シール材に設けられた液晶注入口を通じて、前記短冊状パネルのセル内に液晶を注入した後、前記液晶注入口を封止する工程と、
液晶が注入された前記短冊状パネルを割断して、所望の大きさのパネルを形成する2次ブレーク工程と、
を具備し、
前記1次ブレーク工程および2次ブレーク工程の少なくとも一方の工程では、パネルを形成する2枚の貼り合わせ基板の両方の面にレーザ光を同時に照射して基板を割断するとともに、各基板に照射されるレーザ光の少なくとも一方を、基板の面と直交する垂線に対して所定の角度を成すように、基板の面に入射させることを特徴とする液晶パネルの製造方法。In a method of manufacturing a liquid crystal panel by sealing liquid crystal between two substrates bonded to each other,
A step of bonding two mother substrates with a seal material to form a large-sized panel, a primary break step of cutting the large-size panel to form a strip-like panel, a liquid crystal injection port provided in the seal material Sealing liquid crystal inlets after injecting liquid crystal into the cells of the strip panel through the
A secondary break process of cutting the strip-like panel into which liquid crystal is injected to form a panel of a desired size;
Equipped with
In at least one of the primary break process and the secondary break process, both surfaces of two bonded substrates forming a panel are simultaneously irradiated with a laser beam to cut the substrates, and each substrate is irradiated. A method of manufacturing a liquid crystal panel, comprising causing at least one of laser beams to be incident on the surface of a substrate so as to form a predetermined angle with respect to a perpendicular perpendicular to the surface of the substrate.
レーザ光を基板の面に導く光学系を移動させることによって、基板の面に対するレーザ光のスポット位置を変化させることを特徴とする基板割断方法。In a substrate cutting method in which laser light is simultaneously applied to both surfaces of two bonded substrates to cut the substrate,
A substrate cutting method comprising changing a spot position of laser light with respect to a surface of the substrate by moving an optical system for guiding the laser light to the surface of the substrate.
レーザ光を基板の面に導く光学系を、基板の面に形成されてレーザ光によって走査されるスクライブ溝の長手方向及びこの長手方向に対して直交する方向で移動することによって、基板の面に対するレーザ光のスポット位置を変化させることを特徴とする基板割断方法。In a substrate cutting method in which laser light is simultaneously applied to both surfaces of two bonded substrates to cut the substrate,
The optical system for guiding the laser beam to the surface of the substrate is moved in the direction perpendicular to the longitudinal direction and the longitudinal direction of the scribed groove formed on the surface of the substrate and scanned by the laser beam. A substrate cutting method comprising changing a spot position of a laser beam.
Priority Applications (1)
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JP2001059049A JP3925092B2 (en) | 2001-03-02 | 2001-03-02 | Substrate cleaving method, substrate cleaving apparatus, and liquid crystal panel manufacturing method |
Applications Claiming Priority (1)
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JP2001059049A JP3925092B2 (en) | 2001-03-02 | 2001-03-02 | Substrate cleaving method, substrate cleaving apparatus, and liquid crystal panel manufacturing method |
Publications (3)
Publication Number | Publication Date |
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JP2002255581A JP2002255581A (en) | 2002-09-11 |
JP2002255581A5 true JP2002255581A5 (en) | 2005-02-24 |
JP3925092B2 JP3925092B2 (en) | 2007-06-06 |
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JP2001059049A Expired - Fee Related JP3925092B2 (en) | 2001-03-02 | 2001-03-02 | Substrate cleaving method, substrate cleaving apparatus, and liquid crystal panel manufacturing method |
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JP4912933B2 (en) * | 2007-03-27 | 2012-04-11 | シチズンホールディングス株式会社 | Manufacturing method of liquid crystal panel |
US9636776B2 (en) * | 2011-05-02 | 2017-05-02 | Ipg Photonics Corporation | Laser-based marking method and apparatus |
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