JP2002243657A - Method for confirming defect of object - Google Patents

Method for confirming defect of object

Info

Publication number
JP2002243657A
JP2002243657A JP2001046051A JP2001046051A JP2002243657A JP 2002243657 A JP2002243657 A JP 2002243657A JP 2001046051 A JP2001046051 A JP 2001046051A JP 2001046051 A JP2001046051 A JP 2001046051A JP 2002243657 A JP2002243657 A JP 2002243657A
Authority
JP
Japan
Prior art keywords
defect
confirmation
camera
confirming
confirmation camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001046051A
Other languages
Japanese (ja)
Inventor
Koichi Wakitani
康一 脇谷
Noriaki Yugawa
典昭 湯川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001046051A priority Critical patent/JP2002243657A/en
Publication of JP2002243657A publication Critical patent/JP2002243657A/en
Pending legal-status Critical Current

Links

Landscapes

  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Input (AREA)
  • Image Processing (AREA)

Abstract

PROBLEM TO BE SOLVED: To solve the problem of the conventional methods for confirming defects that the inspection work is inefficient, because a confirmation camera has moved automatically to a defect position detected by an inspection equip ment and go/no-go test is performed manually one by one. SOLUTION: In the defect-confirming equipment, where a confirmation camera is moved to a defect position detected by an inspection equipment and a final go/no-go test is made, visual field is calculated automatically from the magnification of the confirmation camera, movement of the confirmation camera to a defect existing in the same visual view as a defect under confirmation is skipped and the confirmation camera is moved to the next defect deviated from the visual view thus performing review work efficiently.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体・プリント
基板・液晶・PDP等の配線パターン、印刷・捺印パタ
ーンなどの検査において検出された欠陥を、最終的に良
品か、不良品かを判定する対象物の欠陥確認方法に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention determines whether a defect detected in an inspection of a wiring pattern of a semiconductor, a printed circuit board, a liquid crystal, a PDP, or the like, or a printed or stamped pattern is finally a nondefective or defective product. The present invention relates to a method for confirming a defect of an object.

【0002】[0002]

【従来の技術】従来の欠陥確認方法は、検査装置によっ
て検出された欠陥位置に、確認用カメラを自動的に移動
させ、人が、一つ一つ、良品か不良品かを判定して行っ
ていた。
2. Description of the Related Art In a conventional defect confirmation method, a confirmation camera is automatically moved to a defect position detected by an inspection device, and a person judges each item as good or defective. I was

【0003】[0003]

【発明が解決しようとする課題】しかしながら、傷など
の欠陥は、狭い範囲に密集して発生する為、確認用カメ
ラの視野内に複数の欠陥が存在しても、図5の様に、一
つ一つの欠陥位置に、確認用カメラが移動させる為、効
率の悪い作業になっていた。そこで、検査工程自体のス
ループット向上の為には、確認作業を効率化することが
必要となっている。
However, since defects such as scratches are densely generated in a narrow area, even if there are a plurality of defects in the field of view of the confirmation camera, as shown in FIG. Since the confirmation camera was moved to each defect position, the operation was inefficient. Therefore, in order to improve the throughput of the inspection process itself, it is necessary to make the checking work more efficient.

【0004】[0004]

【課題を解決するための手段】この課題を解決するため
に本発明は、欠陥確認方法において、確認用カメラの同
一視野内に存在する欠陥への確認用カメラの移動をスキ
ップさせている。
In order to solve this problem, in the present invention, in the defect confirmation method, the movement of the confirmation camera to a defect existing in the same field of view of the confirmation camera is skipped.

【0005】これにより、確認作業を効率化することが
可能となる。
[0005] This makes it possible to increase the efficiency of the checking operation.

【0006】[0006]

【発明の実施の形態】本発明の請求項1に記載の発明
は、対象物の欠陥を確認する確認用カメラを欠陥位置に
移動させる工程と、この欠陥を確認する工程と、次の欠
陥位置に前記確認用カメラを移動させる工程とを有した
対象物の欠陥確認方法において、欠陥を確認した後、次
の欠陥が前記確認用カメラの同一視野内に存在する場合
は、確認用カメラの移動をスキップし、次の欠陥の確認
を行うものであり、対象物の欠陥確認方法を効率よく行
うことができる。
According to the first aspect of the present invention, a step of moving a confirmation camera for confirming a defect of an object to a defect position, a step of confirming the defect, and a next defect position Moving the confirmation camera to the defect confirmation method, wherein after confirming the defect, if the next defect exists in the same field of view of the confirmation camera, the confirmation camera is moved. Is skipped, and the next defect is confirmed, and the defect confirmation method of the object can be efficiently performed.

【0007】本発明の請求項2に記載の発明は、対象物
の欠陥を確認する確認用カメラを欠陥位置に移動させる
工程と、この欠陥を確認する工程と、次の欠陥位置に前
記確認用カメラを移動させる工程とを有した対象物の欠
陥確認方法において、欠陥を確認した後、確認用カメラ
の倍率から次の欠陥が同一視野に存在するかどうかの判
断工程と、この判断工程により同一視野に存在する場合
は、確認用カメラの移動をスキップし、次の欠陥の確認
を行うものであり、対象物の欠陥確認方法を効率よく行
うことができる。
According to a second aspect of the present invention, there is provided a step of moving a confirmation camera for confirming a defect of an object to a defect position, a step of confirming the defect, and a step of moving the confirmation camera to the next defect position. In the method for checking a defect of an object having a step of moving the camera, the step of determining whether or not the next defect exists in the same field of view from the magnification of the checking camera after checking the defect. If it exists in the field of view, the movement of the confirmation camera is skipped, and the next defect is confirmed, and the defect confirmation method for the object can be performed efficiently.

【0008】以下、本発明の実施の形態について、図1
から図4を用いて説明する。
Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG.

【0009】図1は、本発明の欠陥確認方法の実施のフ
ローを示し、まず、ステップ1で確認カメラを欠陥nの
位置に移動をさせる。そして、ステップ2でこの欠陥n
の確認を行っている。ステップ3では次の欠陥の確認の
ための準備作業で、mにnを代入している。そして、ス
テップ4でmにm+1を代入し、ステップ5で欠陥nと
欠陥mが同一視野内にあるかどうかの判断をしている。
そして、同一視野内にあれば、欠陥mの確認を行った
後、ステップ4に戻り、作業を続行し、同一視野内にな
ければ、ステップ6でnにmを代入している。
FIG. 1 shows a flow of an embodiment of the defect checking method according to the present invention. First, in step 1, the checking camera is moved to the position of the defect n. Then, in step 2, this defect n
Is being verified. In step 3, n is substituted for m in the preparation work for confirming the next defect. In step 4, m + 1 is substituted for m, and in step 5, it is determined whether the defect n and the defect m are in the same field of view.
If it is within the same field of view, after confirming the defect m, the process returns to step 4 to continue the operation. If it is not within the same field of view, m is substituted for n in step 6.

【0010】具体的な確認方法は、図2〜4で説明す
る。
A specific confirmation method will be described with reference to FIGS.

【0011】図2のように、対象物に欠陥1〜4まで存
在したとする。まずステップ1で、欠陥1に確認用カメ
ラを移動させる。このときのnの値は1である。そし
て、ステップ2で欠陥1の確認を行い、ステップ3で、
mにnの値である1を代入する。ステップ4で、mにm
+1の値である2を代入し、欠陥mである欠陥2と、欠
陥nである欠陥1が、同一視野内にあるかどうかの判断
を、ステップ5で行っている。この場合、図3に示すよ
うに同一視野内にあるので、欠陥2の確認を行った後、
ステップ4に戻り、mにm+1の値である3を代入す
る。そしてステップ5で、欠陥3と欠陥1が同一視野内
にあるかどうかの判断をして、この場合、再びステップ
4に戻る。mにm+1の値である4を代入し、欠陥4と
欠陥1が同一視野内にあるかどうかの判断をする。この
場合、同一視野内にはないので、ステップ6で、nにm
の値である4を代入し、ステップ1に戻っている。それ
を現したものが図4である。
It is assumed that defects 1 to 4 exist in the object as shown in FIG. First, in step 1, the confirmation camera is moved to defect 1. The value of n at this time is 1. Then, in step 2, defect 1 is confirmed, and in step 3,
The value 1 of n is substituted for m. In step 4, m to m
The value 2 of +1 is substituted, and it is determined in step 5 whether the defect 2 which is the defect m and the defect 1 which is the defect n are in the same visual field. In this case, since it is within the same field of view as shown in FIG.
Returning to step 4, 3 which is the value of m + 1 is substituted for m. Then, in step 5, it is determined whether or not the defect 3 and the defect 1 are in the same field of view. In this case, the process returns to step 4 again. Substituting 4 which is the value of m + 1 into m, it is determined whether the defect 4 and the defect 1 are in the same field of view. In this case, since they are not within the same field of view, in step 6, m is set to n.
Is substituted, and the process returns to step 1. FIG. 4 shows this.

【0012】以上の作業を順次行うことで、確認用カメ
ラの移動するための時間を省き、作業を効率的に行うこ
とができる。
By sequentially performing the above operations, time for moving the confirmation camera can be saved, and the operations can be performed efficiently.

【0013】なお欠陥が同一視野にあるかどうかの判断
は、確認用カメラの倍率から視野を計算して、判断する
ことができる。
The determination as to whether or not the defect exists in the same visual field can be made by calculating the visual field from the magnification of the confirmation camera.

【0014】[0014]

【発明の効果】以上のように本発明によれば、欠陥確認
方法において、確認用カメラの同一視野内に存在する欠
陥への確認用カメラの移動をスキップさせることで、確
認作業を効率化することが可能となる。
As described above, according to the present invention, in the defect checking method, the checking operation is efficiently performed by skipping the movement of the checking camera to a defect existing in the same field of view of the checking camera. It becomes possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態に係る欠陥確認方法のフロ
ー図
FIG. 1 is a flowchart of a defect confirmation method according to an embodiment of the present invention.

【図2】本発明の実施の形態に係る欠陥確認方法を説明
する図
FIG. 2 is a diagram for explaining a defect confirmation method according to the embodiment of the present invention.

【図3】本発明の実施の形態に係る欠陥確認方法を説明
する図
FIG. 3 is a diagram for explaining a defect confirmation method according to the embodiment of the present invention.

【図4】本発明の実施の形態に係る欠陥確認方法を説明
する図
FIG. 4 is a diagram for explaining a defect confirmation method according to the embodiment of the present invention.

【図5】従来の欠陥確認方法を説明する図FIG. 5 is a diagram illustrating a conventional defect confirmation method.

【符号の説明】[Explanation of symbols]

1 確認用カメラ移動 5 同一視野内存在判断 1 Camera movement for confirmation 5 Existence judgment in the same field of view

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2G051 AA51 AA65 AB07 AC04 AC15 CA04 EB05 5B047 AA12 BA02 BB06 BC14 CB09 CB13 5B057 AA03 BA02 CA12 CA16 DA03 DB02  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G051 AA51 AA65 AB07 AC04 AC15 CA04 EB05 5B047 AA12 BA02 BB06 BC14 CB09 CB13 5B057 AA03 BA02 CA12 CA16 DA03 DB02

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 対象物の欠陥を確認する確認用カメラを
欠陥位置に移動させる工程と、この欠陥を確認する工程
と、次の欠陥位置に前記確認用カメラを移動させる工程
とを有した対象物の欠陥確認方法において、欠陥を確認
した後、次の欠陥が前記確認用カメラの同一視野内に存
在する場合は、確認用カメラの移動をスキップし、次の
欠陥の確認を行うことを特徴とする対象物の欠陥確認方
法。
1. An object comprising: a step of moving a confirmation camera for confirming a defect of an object to a defect position; a step of confirming the defect; and a step of moving the confirmation camera to a next defect position. In the defect checking method for an object, after checking the defect, if the next defect exists in the same field of view of the checking camera, the movement of the checking camera is skipped and the next defect is checked. The method of confirming the defect of the target.
【請求項2】 対象物の欠陥を確認する確認用カメラを
欠陥位置に移動させる工程と、この欠陥を確認する工程
と、次の欠陥位置に前記確認用カメラを移動させる工程
とを有した対象物の欠陥確認方法において、欠陥を確認
した後、確認用カメラの倍率から次の欠陥が同一視野に
存在するかどうかの判断工程と、この判断工程により同
一視野に存在する場合は、確認用カメラの移動をスキッ
プし、次の欠陥の確認を行うことを特徴とする対象物の
欠陥確認方法。
2. An object comprising: a step of moving a confirmation camera for confirming a defect of an object to a defect position; a step of confirming the defect; and a step of moving the confirmation camera to a next defect position. In the method of confirming a defect of an object, a step of judging whether or not the next defect exists in the same field of view from the magnification of the camera for confirmation after confirming the defect. A defect confirmation method for an object, wherein the movement of the object is skipped and the next defect is confirmed.
JP2001046051A 2001-02-22 2001-02-22 Method for confirming defect of object Pending JP2002243657A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001046051A JP2002243657A (en) 2001-02-22 2001-02-22 Method for confirming defect of object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001046051A JP2002243657A (en) 2001-02-22 2001-02-22 Method for confirming defect of object

Publications (1)

Publication Number Publication Date
JP2002243657A true JP2002243657A (en) 2002-08-28

Family

ID=18907745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001046051A Pending JP2002243657A (en) 2001-02-22 2001-02-22 Method for confirming defect of object

Country Status (1)

Country Link
JP (1) JP2002243657A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940527B2 (en) 2002-11-15 2005-09-06 Nippon Avionics Co., Ltd. Inspection status display method
JP2009180578A (en) * 2008-01-30 2009-08-13 Olympus Corp Inspection system
JP2009180627A (en) * 2008-01-31 2009-08-13 Fuji Electric Holdings Co Ltd Defect inspection apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940527B2 (en) 2002-11-15 2005-09-06 Nippon Avionics Co., Ltd. Inspection status display method
JP2009180578A (en) * 2008-01-30 2009-08-13 Olympus Corp Inspection system
JP2009180627A (en) * 2008-01-31 2009-08-13 Fuji Electric Holdings Co Ltd Defect inspection apparatus

Similar Documents

Publication Publication Date Title
US8976348B2 (en) Wafer inspection system
CN110579479A (en) PCB maintenance system and maintenance method based on false point defect detection
JP3818308B2 (en) Printed circuit board quality control system
JP4014379B2 (en) Defect review apparatus and method
JP2006515112A (en) Automatic optical inspection system and method
CN101300473B (en) Verification of non-recurring defects in pattern inspection
JP2002243657A (en) Method for confirming defect of object
CN110006903A (en) Printed circuit board rechecks system, marker method and reinspection method
JP2006251561A (en) Defective pixel repairing method
JP2018091771A (en) Method for inspection, preliminary image selection device, and inspection system
Malge et al. A survey: Automated visual pcb inspection algorithm
JP2004355521A (en) Inspection method and device of circuit board appearance
JPH06207963A (en) Production of test data for printed board
JP2000046745A (en) Wiring pattern inspection apparatus
JP2007057505A (en) Method and device for inspecting printed board, and manufacturing method of printed board
EP3525566A1 (en) Substrate inspection device and substrate distortion compensating method using same
JP2005069864A (en) Apparatus, system, method, program and auxiliary means for inspecting substrate
CN109490319B (en) Detection device and detection method of test equipment
JP3123275B2 (en) Inspection data creation method for electronic parts shortage inspection
JPH11176899A (en) Method and system for alarming defect
CN109211924A (en) The defects of chip manufacturing proces detection method
JP2002313861A (en) Pattern inspection apparatus and method therefor
JPH04184244A (en) Method for inspecting pattern of printed circuit board
JP2000149027A (en) Line laying checking device and method
JP2009085900A (en) System and method for testing component