CN110006903A - Printed circuit board rechecks system, marker method and reinspection method - Google Patents
Printed circuit board rechecks system, marker method and reinspection method Download PDFInfo
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- CN110006903A CN110006903A CN201810011022.6A CN201810011022A CN110006903A CN 110006903 A CN110006903 A CN 110006903A CN 201810011022 A CN201810011022 A CN 201810011022A CN 110006903 A CN110006903 A CN 110006903A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8809—Adjustment for highlighting flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8861—Determining coordinates of flaws
- G01N2021/8864—Mapping zones of defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/888—Marking defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
A kind of printed circuit board reinspection system, marker method and reinspection method are made of for detecting the defective locations of printed circuit board an arithmetic element, a display unit, a projecting cell and a workbench.Wherein, arithmetic element generates reference coordinate image and plane coordinate system according to the original design image of printed circuit board, the coordinate of plane coordinate system is scaled according to the size of printed circuit board and defective locations and generates symbol, projecting cell is projected out reference coordinate image and symbol towards the printed circuit board being located on workbench, so that the reference coordinate image and the size of printed circuit board that are located on workbench are substantially equal.In this way, staff can directly carry out the reinspection operation of defective locations using symbol, it is more efficiently also more accurate.
Description
Technical field
The present invention is related with the defect detecting technique of printed circuit board, specifically refers to that a kind of utilization projection device is assisted
Staff carries out reinspection system, marker method and the reinspection method of printed circuit board reinspection operation, and it is multiple to promote printed circuit board
Examine the efficiency and correctness of operation.
Background technique
Automatic optical detecting system (AutomaticOptical can be utilized in the manufacturing process of existing printed circuit board
Inspection, AOI) it is detected, defect whether there is with machine vision Fast Identification printed circuit board, then examine for AOI
It surveys the PCB under-test that result is existing defects manually to be rechecked, it is true lack that confirmation AOI, which detects found defect,
The machine for falling into either automatic optical detecting system judges (Artifact) by accident.
The AOI testing result of the PCB under-test and corresponding PCB under-test that need manually to be rechecked,
The PCB under-test image that detects comprising AOI compares the data such as difference results image and defective locations and can transmit
It stands to reinspection, using the aforementioned comparison difference results image of a display unit simultaneous display, and utilizes PCB under-test figure
As the defective locations image of collocation symbol.
Therefore, the staff for rechecking station, which can first observe, compares difference results image, as that can not judge indicated defect
Position is real defect or Artifact, then has to take the real product identification of PCB under-test progress, that is, first observe simultaneously
The defective locations that memory display unit is indicated find corresponding position on PCB under-test in mobile sight, with judgement
Whether defect present in the defective locations is Artifact.When AOI detection judges that PCB under-test has more several defects
When, staff must just execute real product identification step repeatedly, confirm one by one to defective locations, and will confirm that be true
The sunken defective locations of powerful position are marked.After all defective locations of PCB under-test, which all confirm, to be finished, has and lack
The PCB under-test for falling into label can be identified as defective products, otherwise should regard as non-defective unit and send the subsequent work of producing line progress back to
Industry.After staff must complete all reinspection steps, reinspection operation could be carried out to another PCB under-test again.
Since staff must carry out observation and memory repeatedly in the real product identification step of reinspection process, in addition to expending
Except a large amount of activity duration, it is also possible to have the situation manually judged by accident because of fatigue.Manually rechecking operating efficiency not
In the case where evident, current a set of automatic optical detecting system usually may require that 3 to 4 reinspection systems of collocation, so that printed circuit
The detection device of plate is significantly increased with human cost.
Summary of the invention
The purpose of the present invention is to provide a kind of printed circuit board reinspection systems and reinspection method, during can be shortened reinspection
The number of working processes of real product identification, promotes operating efficiency and correctness.
The present invention provides a kind of printed circuit board reinspection system, for detecting the defective locations of printed circuit board, it includes
Have: an arithmetic element, for the electronic equipment with information operation Yu data storage function, according to the original design of printed circuit board
Image generates reference coordinate image and plane coordinate system, is scaled plane coordinates according to the size of printed circuit board and defective locations
The coordinate of system, and in Coordinate generation symbol;One display unit is electrically connected with arithmetic element and is controlled by arithmetic element
And show that one compares difference results image;One projecting cell is electrically connected with arithmetic element and is controlled and throw by arithmetic element
Shadow goes out reference coordinate image and symbol;And a workbench, multiply load printed circuit board, receives what projecting cell was projected
Reference coordinate image and symbol, the size essence phase of reference coordinate image and printed circuit board on workbench
Deng.
Therefore, aforementioned printed circuit board reinspection system is located at the printed circuit board on workbench using projecting cell direction
It is projected, the symbol projected can clearly indicate the defective locations of printed circuit board, and staff is allowed not need instead
Multiple observation can soon be judged that confirmation defective locations whether there is Artifact with memory.
The present invention also provides a kind of printed circuit boards to recheck marker method, and step includes: according to printed circuit board
Original design image generates plane coordinate system and reference coordinate image;Then, according to the size of printed circuit board image and extremely
Few defective locations, operation obtain defective locations in the coordinate of plane coordinate system, and generate symbol in corresponding on coordinate;Most
Afterwards, reference coordinate image and symbol are projected in printed circuit board, and the size of reference coordinate image and printed circuit board
Essence is equal, and symbol is incident upon defective locations.
Aforementioned marker method is that plane coordinate system and reference coordinate image are generated using original design image, therefore can be with
It quickly generates accurate as a result, avoiding error from generating simultaneously, so that the symbol projected can accurately be shown in defective bit
It sets.
The present invention also provides a kind of printed circuit boards to recheck method, and step includes: printed circuit board is placed in work
Make on platform, generates reference coordinate image and an at least symbol, and reference coordinate using reinspection marker method as the aforementioned
Image coincide printed circuit board;Observation display unit shown by comparison difference results image and judge printed circuit board whether be
Artifact then judges whether the next defect for checking printed circuit board if YES, on the contrary then enter next step;Observation
It is projected on the symbol of printed circuit board, judges whether it is Artifact, if NO, is just marked and enters back into next step
Suddenly, on the contrary then be just directly entered next step;And judge whether to check next defect, if so, under returning to previous step just
One defect recognizes whether again as Artifact, on the contrary then terminate.
In the present invention, reference coordinate image can quickly proofread the actual size and ratio with printed circuit board, in turn
Ensure that symbol can be shown in defective locations.Therefore reference coordinate image can be the simple appearance profile of printed circuit board, contracting
Short proof time, while determining the correctness of projected symbol.
Detailed description of the invention
Fig. 1 is the system block diagram that embodiment printed circuit board rechecks system.
Fig. 2 is the schematic diagram of projecting cell and workbench in embodiment printed circuit board reinspection system.
Fig. 3 is the projection mark flow chart that embodiment printed circuit board rechecks system.
Fig. 4 is the reinspection operation process chart that embodiment printed circuit board rechecks system.
Description of symbols:
10 arithmetic element, 20 display unit
30 display unit, 40 workbench
41 locating piece A reference coordinate images
B symbol S11~S13 step
S21~S29 step
Specific embodiment
For clear expression specific structure of the invention, technical characteristic and realization technical effect, embodiment presented below is simultaneously
Cooperation attached drawing is specifically described.Referring to FIG. 1, the present embodiment is that a printed circuit board rechecks system, there is an arithmetic element
10, a display unit 20, projecting cell 30 and a workbench 40, wherein display unit 20 and projecting cell 30 and arithmetic element
10 are electrically connected and are controlled by it and show or project specific image.
Arithmetic element 10 is the electronic equipment with information operation Yu data storage function, can be in a wired or wireless fashion
It is connect with automatic optical detecting system (AOI System), receives PCB under-test figure related with PCB under-test
Picture compares difference results image and defective locations, additionally it is possible to store the original design figure of PCB under-test in advance
Picture, but not limited to this.
Display unit 20 receives the control of arithmetic element 10 and shows the comparison difference results for corresponding to PCB under-test
Image enables operating personnel to observe and recognize and compares whether defect shown on difference results image is evident as machine erroneous judgement
(Artifact) otherwise just has to carry out real product identification.
When operating personnel thinks to need to be implemented the identification of real product, arithmetic element 10 can read the original of PCB under-test
Designed image generates plane coordinate system along the length direction and width direction of original design image, according to original design image
Length and width dimensions generate reference coordinate image A (as shown in Figure 2), according to the size of PCB under-test and defective locations conversion
For the coordinate of aforesaid plane coordinate system, and in applying symbol B (as shown in Figure 2) on the coordinate of defective locations.Aforementioned basic
The appearance profile (being rectangular in the present embodiment) that image coordinate A can be as original design image.Aforementioned symbol B can be
The color lump (such as red spots, color are different from the color of printed circuit board surface) of specific pattern (such as X) or particular color, but simultaneously
It is not limited.
It, can be with since arithmetic element 10 is to generate coordinate system and reference coordinate image A according to original design image
It quickly generates accurate as a result, avoiding error from generating simultaneously.If using PCB under-test image or comparing difference results
Image, will inevitably because automatic optical detecting system itself generated micro using the resolution ratio of image capturing element
Error is unfavorable for rechecking the progress of operation.
Projecting cell 30 receive the control of arithmetic element 10 and project aforementioned basic image coordinate A and symbol B at least its
One of in workbench 40.It is noted that being projected on the reference coordinate image A and tested printed circuit of workbench 40
The size of plate is substantially equal.Therefore, PCB under-test can be directly placed in workbench 40 and be aligned base by staff
Quasi coordinates image A, so that symbol B is correctly projected in the defective locations of PCB under-test.In the present embodiment, when
When PCB under-test has multiple defective locations, arithmetic element 10 will control projecting cell 30 and sequentially project symbol
One of B, and can sequentially be projected along the sequence of zigzag, to meet the mobile habit of human visual, facilitate
Raising efficiency simultaneously reduces fatigue.
In order to facilitate the storing operation of PCB under-test, workbench 40 is equipped with positioning piece 41, in this example
For a right angle L-type convex block, facilitates PCB under-test to contact when placing with locating piece 41 and complete positioning.Aforementioned locating piece
It is not limited to the convex block of the present embodiment, is also possible to groove or other provides the structure of identical function.
Referring to Fig. 3, the present embodiment printed circuit board reinspection system projection marker method comprise the steps of: first in
Step S11 generates plane coordinate system and reference coordinate image A according to the original design image of PCB under-test, then in step
Rapid S12 is from PCB under-test image and compares difference results image, obtains the letter such as printed circuit board sizes and defective locations
Breath, and then operation obtains each defective locations in the coordinate on aforesaid plane coordinate system, in applying mark on the coordinate of defective locations
Symbol B.Step S13 is finally executed, is projected out reference coordinate image A and an at least symbol B using projecting cell 30, and
Reference coordinate image A and the size of PCB under-test for being projected on workbench 40 are substantially equal.Tested circuit board at this time
On will have symbol B and accurately be incident upon each defective locations, convenient working personnel carry out operation.
When the practical reinspection operation for carrying out printed circuit board, referring to Fig. 4, step S21 is first carried out, corresponding print of taking
Printed circuit board is placed on workbench 40, generates reference coordinate image A by projection marker method above-mentioned, and allow benchmark
Image coordinate A coincide printed circuit board;Then the comparison difference results image shown in step S22 observation display unit 20, in
Step S23 judges whether it is Artifact according to image, picks out Artifact (i.e. machine erroneous judgement) when image can understand, just directly
Judge whether to next defect identification (step S27).If can not determine or have doubt (result is no), carry out with that
Subsequent reality product identification, that is, execute step S24.
Staff directly observes the symbol B being projected on printed circuit board in step 24, then sentences in step S25
Whether the defective locations where disconnected symbol B are Artifact;If YES, S27 is entered step;If NO, then enter step
Rapid S26 is marked in the defective locations where symbol B, just enters step S27 later and decides whether to check next lack
It falls into.
If the judging result of step S27 be it is yes, enter step S28 switching display unit and show next defect image,
It re-execute the steps S22 again;If NO, then S29 is entered step, carries out subsequent job according to non-defective unit or defective products.Wherein, step
S29 is the final process of printed circuit board reinspection.If all confirming by multiple checks, the defective locations of AOI testing result are equal
For Artifact, then non-defective unit is regarded as.Conversely, if printed circuit board defective label, is identified as defective products.Non-defective unit can
It sends producing line back to and carries out subsequent job, defective products is directly scrapped according to situation, or is moved to repair station and repaired, and reduces loss whereby.
It can restart to carry out the reinspection operation of another printed circuit board later.
It in the present invention, is to project to generate symbol in the defective locations of PCB under-test using projection pattern,
Operating personnel is set not need to observe and remember repeatedly, reduction personnel are tired and improve operating efficiency and correctness.When tested printing
The more, the present invention more can play effect to defect counts on circuit board, substantially shorten working hour, save human cost, and promote life
Produce efficiency.
Claims (13)
1. a kind of printed circuit board rechecks system, for detecting an at least defective locations for a printed circuit board, the printed circuit
Plate reinspection system includes:
One arithmetic element, for the electronic equipment with information operation Yu data storage function;
One display unit is electrically connected with the arithmetic element and is controlled by the arithmetic element and show that one compares difference results figure
Picture;
One projecting cell is electrically connected with the arithmetic element and is controlled by the arithmetic element and be projected out the reference coordinate image
With an at least symbol;And
One workbench multiplies and carries the printed circuit board, receive the reference coordinate image that the projecting cell is projected and this at least
One symbol;
Wherein, which can generate a plane coordinate system and a base according to an original design image of the printed circuit board
Quasi coordinates image is scaled at least the one of the plane coordinate system according to the size of the printed circuit board and an at least defective locations
Coordinate, and in an an at least Coordinate generation at least symbol, which can make way for being somebody's turn to do on the workbench
Reference coordinate image and the size of the printed circuit board are substantially equal.
2. printed circuit board as described in claim 1 rechecks system, wherein the arithmetic element in a wired or wireless fashion with one from
Dynamic Systems for optical inspection connection.
3. printed circuit board as described in claim 1 rechecks system, wherein the arithmetic element stores the original design figure in advance
Picture.
4. printed circuit board as described in claim 1 rechecks system, wherein the workbench has positioning piece, which is
One convex block or a groove.
5. printed circuit board rechecks system as described in Claims 1-4 any item, wherein the symbol is a specific symbol
Number or a color lump.
6. printed circuit board as claimed in claim 5 rechecks system, when wherein the quantity of an at least symbol is multiple
It waits, which sequentially projects one of the multiple symbol.
7. a kind of printed circuit board rechecks marker method, step includes:
A plane coordinate system and a reference coordinate image are generated according to an original design image of a printed circuit board;
According to the size of the printed circuit board image and an at least defective locations, operation obtains an at least defective locations in this
An at least coordinate for plane coordinate system, and an at least symbol is generated in corresponding on this at least a coordinate;And
The reference coordinate image and an at least symbol are projected in the printed circuit board, and the reference coordinate image with should
The size of printed circuit board is substantially equal, which is incident upon an at least defective locations.
8. printed circuit board as claimed in claim 7 rechecks marker method, wherein the quantity of an at least symbol is multiple
When, sequentially project one of the multiple symbol.
9. printed circuit board as claimed in claim 8 rechecks marker method, wherein the multiple symbol is along the suitable of zigzag
Sequence is sequentially projected.
10. printed circuit board as claimed in claim 7 rechecks marker method, wherein an at least symbol is a special symbol
An or color lump.
11. printed circuit board as claimed in claim 7 rechecks marker method, wherein the plane coordinate system is along the original design
One length direction of image is generated with a width direction, which is the appearance profile of the original design image.
12. a kind of printed circuit board rechecks method, step includes:
One printed circuit board is placed on a workbench, generates one using reinspection marker method as claimed in claim 6
Reference coordinate image and an at least symbol, and the reference coordinate image coincide the printed circuit board;
It observes a comparison difference results image shown by a display unit and judges whether the printed circuit board is Artifact, such as
Fruit be it is yes, then judge whether the next defect for checking the printed circuit board, it is on the contrary then enter next step;
Observation is projected on an at least symbol for the printed circuit board, judges whether it is Artifact, if NO, with regard to carrying out
Label enters back into next step, on the contrary then be just directly entered next step;And
Judge whether to check next defect, next defect recognized whether again as Artifact if so, returning to previous step,
It is on the contrary then terminate.
13. printed circuit board reinspection method as claimed in claim 12 switches the display list when next defect is checked in judgement
Member shows the image of next defect.
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CN201810011022.6A CN110006903A (en) | 2018-01-05 | 2018-01-05 | Printed circuit board rechecks system, marker method and reinspection method |
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CN201810011022.6A CN110006903A (en) | 2018-01-05 | 2018-01-05 | Printed circuit board rechecks system, marker method and reinspection method |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110579479A (en) * | 2019-08-09 | 2019-12-17 | 康代影像科技(苏州)有限公司 | PCB maintenance system and maintenance method based on false point defect detection |
CN113805365A (en) * | 2020-06-16 | 2021-12-17 | 艾聚达信息技术(苏州)有限公司 | Marking apparatus and defect marking method |
WO2022104585A1 (en) * | 2020-11-18 | 2022-05-27 | 苏州康代智能科技股份有限公司 | Remote optical inspection and maintenance method and system for printed circuit board |
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