JP2002234110A - Release film - Google Patents
Release filmInfo
- Publication number
- JP2002234110A JP2002234110A JP2001030797A JP2001030797A JP2002234110A JP 2002234110 A JP2002234110 A JP 2002234110A JP 2001030797 A JP2001030797 A JP 2001030797A JP 2001030797 A JP2001030797 A JP 2001030797A JP 2002234110 A JP2002234110 A JP 2002234110A
- Authority
- JP
- Japan
- Prior art keywords
- film
- layer
- release
- metal
- release film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は導体箔積層体製造時
のプリプレグプレス工程に用いる離型フィルムに関し、
詳細には、電子機器などに広範に使用される積層配線基
板の製造に好適に用いられる導体箔積層体製造用離型フ
ィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a release film used in a prepreg press step in producing a conductor foil laminate.
Specifically, the present invention relates to a release film for producing a conductor foil laminate which is suitably used for producing a laminated wiring board widely used in electronic devices and the like.
【０００２】[0002]
【従来の技術】従来、多層の導体回路を有する積層配線
基板の製造方法としては、片面又は両面に導体回路を有
する内層材にプリプレグを積層し、その最外層に銅箔な
どの導体箔を配置し、熱プレスして一体化させる方法が
一般的である。このような方法においては、プリプレグ
から生じた粉末物や他の異物が導体箔上に入り込みやす
く、これが原因となって導体箔に局部的な圧力がかか
り、導体箔の表面に打痕が生じる懸念がある。この問題
を防止するため、導体箔と鏡面板との間に樹脂等により
形成された離型フィルムを配置し、異物による局部的な
圧力を緩和させるやり方が提案されている。2. Description of the Related Art Conventionally, as a method of manufacturing a laminated wiring board having a multilayered conductor circuit, a prepreg is laminated on an inner layer material having a conductor circuit on one or both sides, and a conductor foil such as a copper foil is arranged on the outermost layer. Then, a method of integrating the components by hot pressing is common. In such a method, there is a concern that powder or other foreign matter generated from the prepreg easily enters the conductor foil, which causes a local pressure on the conductor foil and causes dents on the surface of the conductor foil. There is. In order to prevent this problem, a method has been proposed in which a release film formed of a resin or the like is disposed between the conductor foil and the mirror surface plate to alleviate local pressure due to foreign matter.
【０００３】このような離型フィルムとして、ポリエチ
レンテレフタレートの片面ないし両面にシリコーンなど
の離型剤を処理したフィルム、フッ素系フィルム、ポリ
オレフィン系フィルムなどが用いられている。しかしな
がら、ポリエチレンテレフタレートの片面ないし両面に
シリコーンなどの離型剤を処理したフィルムでは、プリ
プレグ／導体箔の積層時の加熱プレスの際に、ポリエチ
レンテレフタレート中のオリゴマーが析出し、積層体表
面を汚染したり、プレスに用いる鏡面板の表面に蓄積
し、鏡面板の平滑性を損なうといった問題があった。プ
レスに用いる鏡面板の表面に凹凸があるとプリプレグ／
導体箔の積層体表面の平滑性が低下し、得られる導体箔
積層体の品質に問題が生じるため、従来はこの鏡面板の
清掃に多大な労力を要していた。また、フッ素系フィル
ムはその特性上、離型性には優れるものの、フッ素系フ
ィルム自体が高価なため、コスト的な問題がある。ポリ
オレフィン系フィルムは耐熱性に乏しく、従って、加熱
プレス時に１２０℃以上の温度となる用途には使用でき
ず、用途が限定される問題があった。As such a release film, a film obtained by treating one or both sides of polyethylene terephthalate with a release agent such as silicone, a fluorine-based film, a polyolefin-based film, and the like are used. However, in a film in which a release agent such as silicone is treated on one or both sides of polyethylene terephthalate, oligomers in polyethylene terephthalate precipitate during heating and press during lamination of the prepreg / conductor foil and contaminate the surface of the laminate. Or accumulated on the surface of the mirror plate used in the press, and the smoothness of the mirror plate is impaired. If the surface of the mirror plate used for pressing has irregularities, the prepreg /
Conventionally, cleaning of the mirror surface plate has required a great deal of work because the smoothness of the surface of the conductor foil laminate is reduced and the quality of the obtained conductor foil laminate is problematic. In addition, although the fluorine-based film is excellent in releasability due to its characteristics, it has a problem in cost because the fluorine-based film itself is expensive. Polyolefin-based films have poor heat resistance, and therefore cannot be used in applications where the temperature is 120 ° C. or higher during hot pressing, and there is a problem that applications are limited.
【０００４】さらに、前述した離型フィルムはいずれも
取り扱い時に帯電しやすく、その結果として、作業環境
中の塵や埃が付着しやすくなり、その表面に付着した異
物による打痕や導体箔の裂け等も問題となっていた。Further, the above-mentioned release films are all easily charged during handling, and as a result, dust and dirt in the working environment are apt to adhere, and dents and tearing of the conductor foil due to foreign matter adhering to the surface thereof. Etc. were also problems.
【０００５】[0005]
【発明が解決しようとする課題】上記の問題を解決する
ため本発明はなされたものであり、本発明の目的はプリ
プレグ／導体箔の積層時における積層体やプレス用の鏡
面板の表面の汚染、帯電が抑制され、安価で、且つ、耐
熱性の良好な、導体箔積層体製造に適する離型フィルム
を提供することにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to contaminate the surface of a laminate or a press mirror plate during lamination of prepreg / conductor foil. Another object of the present invention is to provide a release film that is suppressed in charging, is inexpensive, and has good heat resistance and is suitable for producing a conductor foil laminate.
【０００６】[0006]
【課題を解決するための手段】本発明者らは、検討の結
果、特定の合成樹脂製フィルムと金属または金属酸化物
の層とを積層してなるベースフィルム表面に離型層を設
けることにより前記問題点を解決しうることを見出し、
本発明を完成した。即ち、本発明の離型フィルムは、導
体箔積層体製造時のプリプレグプレス工程に用いる離型
フィルムであって、ポリエステル系またはポリアミド系
の合成樹脂フィルムを基材として用い、ポリアミド系合
成樹脂フィルムの少なくとも一方の面、或いはポリエス
テル系合成樹脂フィルムの両面に、金属または金属酸化
物層を設けてなるベースフィルムの少なくとも一方の面
に離型剤層を設けたことを特徴とする。ここで、金属ま
たは金属酸化物層（以下、適宜、金属（酸化物）層と称
する）はアルミニウム層であることが好ましく、また、
本発明の離型フィルムは、２３℃、５０％ＲＨ環境下に
おける表面固有抵抗値が１０12Ω以下であるという物性
を有することが好ましい態様である。As a result of the study, the present inventors have found that a release layer is provided on the surface of a base film formed by laminating a specific synthetic resin film and a metal or metal oxide layer. Finding that the problem can be solved,
The present invention has been completed. That is, the release film of the present invention is a release film used in a prepreg press step at the time of manufacturing a conductor foil laminate, using a polyester-based or polyamide-based synthetic resin film as a base material, a polyamide-based synthetic resin film. A release agent layer is provided on at least one surface of a base film having a metal or metal oxide layer provided on at least one surface or both surfaces of a polyester-based synthetic resin film. Here, the metal or metal oxide layer (hereinafter, appropriately referred to as a metal (oxide) layer) is preferably an aluminum layer,
In a preferred embodiment, the release film of the present invention has physical properties such that its surface specific resistance value is 10 12 Ω or less under an environment of 23 ° C. and 50% RH.
【０００７】本発明においては、基材に金属（酸化物）
層を形成することにより、ベースフィルムに発生する静
電気を散逸させ、帯電を効果的に抑制することができる
ので、ベースフィルムがプリプレグの樹脂粉末や作業環
境中の塵や埃を吸着し難くなる。ここで、金属（酸化
物）層は、合成樹脂フィルムの片面に設けられるだけで
帯電防止効果を奏するが、両面に設けられることによ
り、より確実に帯電を防止できる。また、ベースフィル
ムの基材としてポリエステル系合成樹脂フィルムを用い
る場合には、プリプレグプレス工程における加熱プレス
時にオリゴマーが析出し、鏡面板に蓄積したり、導体箔
積層体を汚染する虞があるため、金属（酸化物）層は両
面に設け、析出防止層を兼ねるようにすることが好まし
い。一方、ベースフィルムの基材としてポリアミド系合
成樹脂フィルムを使用する場合には、加熱プレス時にオ
リゴマーが析出しないか、もしくは析出した場合でもご
く僅かで、鏡面板に蓄積したり、導体箔積層体を汚染す
る虞がないことから、金属（酸化物）層は片面のみに設
けて、帯電防止機能のみを発現させるようにしてもよ
い。また、離型層はベースフィルムの片面設けられてい
れば、導体箔との離型性が確保されるが、両面に設けら
れていてもよい。両面に離型層を設けることで、鏡面板
との離型性が向上する。さらに、金属（酸化物）層が両
面に設けられている場合、或いはベースフィルムの基材
がポリアミド系合成樹脂フィルムである場合、両面に離
型剤層が設けられていると、加熱プレス作業時に離型層
を設けた面の判別に迷ったり、導体箔積層体側に離型剤
層が設けられていない面を使用するなどの誤作業を防止
することができる。また、複数の導体箔積層体を一度に
加熱プレスする場合には、導体箔積層体の間にも離型フ
ィルムが挟まれるので、そのような用途には両面に離型
剤層を設けたものを用いることが好ましい。In the present invention, a metal (oxide) is used as a base material.
By forming the layer, static electricity generated in the base film can be dissipated and charging can be effectively suppressed, so that the base film does not easily adsorb the resin powder of the prepreg or dust or dust in the working environment. Here, the metal (oxide) layer has an antistatic effect only by being provided on one surface of the synthetic resin film, but by being provided on both surfaces, the charging can be more reliably prevented. Further, when a polyester-based synthetic resin film is used as the base material of the base film, oligomers are precipitated during hot pressing in the prepreg pressing step, and may accumulate on the mirror surface plate, or may contaminate the conductive foil laminate, It is preferable that metal (oxide) layers are provided on both sides so as to also serve as a deposition preventing layer. On the other hand, when a polyamide-based synthetic resin film is used as the base material of the base film, oligomers do not precipitate at the time of hot pressing, or even when precipitated, they are very small and accumulate on the mirror surface plate, or the conductor foil laminate is formed. Since there is no risk of contamination, the metal (oxide) layer may be provided only on one side to exhibit only the antistatic function. Further, if the release layer is provided on one side of the base film, releasability from the conductive foil is ensured, but it may be provided on both sides. By providing a release layer on both surfaces, the releasability from the mirror plate is improved. Furthermore, when a metal (oxide) layer is provided on both sides, or when the base material of the base film is a polyamide-based synthetic resin film, and when a release agent layer is provided on both sides, the heat pressing operation It is possible to prevent erroneous operations such as erroneous determination of the surface on which the release layer is provided and use of a surface on which the release agent layer is not provided on the conductor foil laminate side. In addition, when a plurality of conductor foil laminates are heated and pressed at one time, a release film is sandwiched between the conductor foil laminates. For such an application, a release agent layer is provided on both surfaces. It is preferable to use
【０００８】[0008]
【発明の実施の形態】以下、本発明を詳細に説明する。
本発明において離型フィルムの基材となるベースフィル
ムには、ポリエステル系またはポリアミド系の合成樹脂
フィルムが用いられる。合成樹脂フィルムとしてポリエ
ステル系合成樹脂を用いる場合、公知のポリエステル系
合成樹脂フィルムより任意に選択できるが、加熱プレス
時の耐熱性を考慮すれば、芳香族ポリエステル類を用い
ることが好ましい。本発明のポリエステル系フィルムに
使用しうる樹脂としては、例えば、ポリエチレンテレフ
タレート（ＰＥＴ）、ポリブチレンテレフタレート、ポ
リエチレンイソフタレート、ポリエチレンナフタレート
（ＰＥＮ）などが挙げられ、これらのポリエステル系合
成樹脂を公知の方法により成膜したフィルムを用いれば
よい。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
In the present invention, a polyester-based or polyamide-based synthetic resin film is used as a base film serving as a base material of a release film. When a polyester-based synthetic resin is used as the synthetic resin film, it can be arbitrarily selected from known polyester-based synthetic resin films. However, in consideration of heat resistance during hot pressing, it is preferable to use aromatic polyesters. Examples of the resin that can be used for the polyester film of the present invention include polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene isophthalate, and polyethylene naphthalate (PEN). A film formed by the method may be used.
【０００９】また、ポリアミド系合成樹脂フィルムを構
成する樹脂も、公知のポリアミド系樹脂から適宜選択で
きるが、具体的には、例えば、ナイロン６、ナイロン６
６、ナイロン６１０、ナイロン６１２、また、ポリ−ｐ
−フェニレンテレフタルアミド、ポリ−ｐ−フェニレン
イソフタルアミド、ポリ−ｍ−フェニレンイソフタルア
ミドなどの芳香族ポリアミド樹脂なども好適に使用で
き、これらのポリアミド系合成樹脂を公知の方法により
成膜したフィルムを用いればよい。このうち、吸湿寸法
安定性の観点からは、ポリエステル系合成樹脂フィルム
が好ましく、なかでも、耐熱性、品種の多さ、コストの
観点から、ポリエチレンテレフタレートがより好まし
い。The resin constituting the polyamide-based synthetic resin film can be appropriately selected from known polyamide-based resins. Specifically, for example, nylon 6 and nylon 6 can be used.
6, nylon 610, nylon 612, and poly-p
Aromatic polyamide resins such as phenylene terephthalamide, poly-p-phenylene isophthalamide, and poly-m-phenylene isophthalamide can also be suitably used, and a film obtained by forming these polyamide-based synthetic resins by a known method is used. I just need. Among these, a polyester-based synthetic resin film is preferable from the viewpoint of moisture absorption dimensional stability, and among them, polyethylene terephthalate is more preferable from the viewpoint of heat resistance, variety of products, and cost.
【００１０】合成樹脂フィルムは、単層品でも、同種又
は互いに異なる２種以上のフィルムを公知の方法により
積層した多層品のいずれでもよいが、コストの観点から
は単層品が好ましい。合成樹脂フィルムの厚みには特に
制限はなく、目的に応じて選択すればよいが、得られた
離型フィルムのコストや使用時の作業性の観点から、１
６〜１００μｍ程度であることが好ましい。フィルムが
厚すぎるとコストが上昇し、薄すぎると取り扱い性が低
下し、フィルム表面に付着した異物の影響を受けやす
く、しわになり易くなることから、いずれも好ましくな
い。The synthetic resin film may be a single layer product or a multilayer product obtained by laminating two or more films of the same type or different from each other by a known method, but a single layer product is preferred from the viewpoint of cost. The thickness of the synthetic resin film is not particularly limited and may be selected according to the purpose. However, from the viewpoint of the cost of the obtained release film and workability during use, 1
It is preferably about 6 to 100 μm. If the film is too thick, the cost increases, and if the film is too thin, the handleability deteriorates, and the film is susceptible to foreign matter adhering to the film surface and is easily wrinkled.
【００１１】これらのポリエステル系或いはポリアミド
系合成樹脂からなるフィルムの片面若しくは両面に設け
られる金属または金属酸化物層は、公知のものでよい
が、作業時における帯電を効果的に抑制するという観点
からは、表面固有抵抗値の低いものを選択することが好
ましい。このような金属、或いはその酸化物としては、
アルミニウム、ケイ素、銅、銀、金、インジウム等及び
それらの酸化物、シリケート化合物などが挙げられる。
金属（酸化物）層の形成は公知の方法により行えばよ
く、前記合成樹脂フィルムに金属（酸化物）を蒸着する
方法、コーティングする方法、金属（酸化物）層箔を合
成樹脂フィルムと貼り合わせる方法などを適用できる。The metal or metal oxide layer provided on one or both sides of the film made of the polyester or polyamide synthetic resin may be a known one, but from the viewpoint of effectively suppressing charging during work. Is preferably selected from those having a low surface resistivity. As such a metal or its oxide,
Examples include aluminum, silicon, copper, silver, gold, indium and the like, and oxides and silicate compounds thereof.
The formation of the metal (oxide) layer may be performed by a known method. A method of depositing a metal (oxide) on the synthetic resin film, a method of coating, and bonding a metal (oxide) layer foil to the synthetic resin film. Methods can be applied.
【００１２】金属（酸化物）層の厚みは、その形成方法
により大きく異なり、例えば、蒸着法によれば、２０〜
１０００オングストローム程度、コーティング方法であ
れば０．０５〜１μｍ程度、金属箔貼り合わせ方法であ
れば１〜１０μｍ程度が一般的であるがこれらに制限さ
れるものではない。金属（酸化物）層の厚みは、離型フ
ィルムの所望される特性、例えば、加工適性、所望の表
面固有抵抗値、合成樹脂フィルムのオリゴマー遮断性能
等、に応じて選択すればよい。The thickness of the metal (oxide) layer varies greatly depending on the method of forming the metal layer.
The thickness is generally about 1000 angstroms, about 0.05 to 1 μm for a coating method, and about 1 to 10 μm for a metal foil bonding method, but is not limited thereto. The thickness of the metal (oxide) layer may be selected according to desired properties of the release film, for example, suitability for processing, a desired surface specific resistance, oligomer blocking performance of the synthetic resin film, and the like.
【００１３】上記のようにして形成されたベースフィル
ムに離型剤層を形成することで本発明の離型フィルムを
得ることができる。本発明に係る離型剤層は、加熱時に
も樹脂が鏡面板や導体箔積層体に溶着しないように耐熱
性、硬度及び離型性を有する材料からなる薄層の離型剤
層である。離型剤層を形成する離型剤としては、公知の
ものを適宜使用することができるが、具体的には、アル
キッド樹脂系離型剤、ポリオレフィン系離型剤、長鎖ア
ルキル基含有樹脂系離型剤、シリコーン系離型剤、シリ
コン、アルミなどを含有するガラス系無機化合物等が挙
げられ、これらのうち、離型性、耐熱性に優れるという
観点からシリコーン系離型剤が好ましい。The release film of the present invention can be obtained by forming a release agent layer on the base film formed as described above. The release agent layer according to the present invention is a thin release agent layer made of a material having heat resistance, hardness and release properties such that the resin does not adhere to the mirror plate or the conductive foil laminate even when heated. As the release agent for forming the release agent layer, a known release agent can be appropriately used, and specifically, an alkyd resin-based release agent, a polyolefin-based release agent, and a long-chain alkyl group-containing resin-based release agent are used. Examples include a release agent, a silicone release agent, and a glass-based inorganic compound containing silicon, aluminum, and the like. Of these, a silicone release agent is preferable from the viewpoint of excellent release properties and heat resistance.
【００１４】前記離型剤層の形成は、メイヤーバーコー
ティング、グラビアコーティング、又はドクターコーテ
ィング等の公知の塗布方法を利用してベースフィルム基
材に離型剤を塗布した後、加熱処理、紫外線照射、電子
線照射などの公知の方法で乾燥、硬化させる方法をとる
ことができる。ここで離型剤層を形成した後の本発明の
離型フィルムの好ましい物性を挙げれば、例えば、２３
℃、５０％ＲＨ環境下で測定した表面固有抵抗値が１０
12Ω以下、好ましくは、１０2〜１０12Ω程度であり、
離型性としては、鏡面板（ｓｕｓ）及び導体箔積層体と
接触させて熱プレス（１８０℃、３０ｋｇ／ｃｍ2、９
０分）した後、容易に手で剥離できる程度の離型性を有
するものであることが好ましい。また、離型剤層の厚み
は、前記物性を満たせば特に制限はないが、コストの観
点から、０．０１〜２．０μｍ程度であることが好まし
い。The release agent layer is formed by applying a release agent to a base film substrate using a known coating method such as Meyer bar coating, gravure coating, or doctor coating, followed by heat treatment, ultraviolet irradiation. And a method of drying and curing by a known method such as electron beam irradiation. Here, preferred physical properties of the release film of the present invention after forming the release agent layer include, for example, 23
Surface resistivity measured in an environment of 50 ° C. and 50% RH is 10
12 Ω or less, preferably about 10 2 to 10 12 Ω,
As the releasability, hot pressing (180 ° C., 30 kg / cm 2 , 9
(0 minutes), it is preferable that the material has a releasability such that it can be easily peeled off by hand. The thickness of the release agent layer is not particularly limited as long as the physical properties are satisfied, but is preferably about 0.01 to 2.0 μm from the viewpoint of cost.
【００１５】離型剤層は、前記ベースフィルムの片面の
みに設けても、両面に設けてもよい。離型剤層を設ける
にあたり、前記基材と離型剤の密着性向上のために、基
材表面にコロナ放電処理や易接着コート剤塗布などの処
理を行なって表面の濡れ性を改良してもよい。また、前
記離型剤にシランカップリング剤などの密着性向上剤等
を内添して接着性向上を図ることもできる。The release agent layer may be provided on only one side of the base film or on both sides. In providing the release agent layer, in order to improve the adhesion between the base material and the release agent, the surface of the base material is subjected to a treatment such as a corona discharge treatment or an easy adhesion coating agent to improve the wettability of the surface. Is also good. Further, an adhesiveness improving agent such as a silane coupling agent may be internally added to the release agent to improve the adhesiveness.
【００１６】本発明の離型フィルムは、加熱プレス時の
鏡面板や導体箔積層体の汚染や帯電を抑制することがで
き、多層配線基板を作成する導体箔積層体の加工に好適
に使用することができる。また、本発明の離型フィルム
は、ＰＥＴなどの合成樹脂フィルム、金属（酸化物）、
離型剤など、汎用の材料で構成され、コストが安価であ
るという利点をも有する。The release film of the present invention can suppress contamination and electrification of the mirror plate and the conductor foil laminate during hot pressing, and is suitably used for processing of the conductor foil laminate for forming a multilayer wiring board. be able to. In addition, the release film of the present invention includes a synthetic resin film such as PET, a metal (oxide),
It is made of a general-purpose material such as a release agent, and has an advantage that the cost is low.
【００１７】[0017]
【実施例】以下、本発明を実施例を挙げて詳細に説明す
るが、本発明はこれらに制限されるものではない。 （実施例１）厚み２５μｍのＰＥＴフィルム（東洋紡績
製、エステルＥ−５０００）の両面に、厚さ２００オン
グストロームのアルミニウムを蒸着して金属層を形成
し、ベースフィルムを得た。このベースフィルムの片面
にシリコーン系離型剤〔東レ・ダウコーニング・シリコ
ーン社製、ＳＲＸ−２１１（触媒ＳＲＸ−２１２を離型
剤１００重量部に対して１重量部添加）〕を固形分とし
て０．２ｇ／ｍ2となるように塗布した後、１４０℃の
熱風循環式オーブン中で３０秒間加熱することにより乾
燥、硬化させて片面にシリコーン系の離型剤層を形成
し、離型フィルムを得た。EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited thereto. Example 1 A metal film was formed on both surfaces of a PET film having a thickness of 25 μm (Ester E-5000, manufactured by Toyobo Co., Ltd.) by vapor deposition of aluminum to form a metal layer to obtain a base film. On one surface of this base film, a silicone-based release agent (SRX-211 manufactured by Dow Corning Toray Silicone Co., Ltd. (1 part by weight of catalyst SRX-212 added to 100 parts by weight of release agent)) was used as a solid content. 2 g / m 2, and then dried and cured by heating in a hot air circulating oven at 140 ° C. for 30 seconds to form a silicone-based release agent layer on one side, and a release film was formed. Obtained.
【００１８】（実施例２）金属層の形成にあたり、アル
ミニウム蒸着の代わりにシリカ蒸着を施した以外は実施
例１と同様にして離型フィルムを得た。 （実施例３）基材に用いたＰＥＴ樹脂フィルムの代わり
にポリアミド系樹脂フィルム（ナイロン６成膜フィル
ム、厚み２５μｍ）を用い、片面に実施例１と同様にし
て金属層を形成し、該金属層上に実施例１と同様にして
離型剤層を設けて、離型フィルムを得た。Example 2 A release film was obtained in the same manner as in Example 1 except that the metal layer was formed by depositing silica instead of aluminum. (Example 3) A polyamide resin film (nylon 6 film, thickness 25 µm) was used in place of the PET resin film used as the base material, and a metal layer was formed on one surface in the same manner as in Example 1 to form a metal layer. A release agent layer was provided on the layer in the same manner as in Example 1 to obtain a release film.
【００１９】（比較例１）厚み２５μｍのＰＥＴフィル
ム（東洋紡績製、エステルＥ−５０００）を基材として
用い、金属（酸化物）層を形成することなく、その両面
に実施例１と同様の条件で離型剤層を形成して離型フィ
ルムを得た。(Comparative Example 1) A PET film having a thickness of 25 µm (Ester E-5000, manufactured by Toyobo Co., Ltd.) was used as a base material, and a metal (oxide) layer was not formed on both surfaces of the PET film. A release agent layer was formed under the conditions to obtain a release film.
【００２０】〔評価方法〕得られた実施例、比較例の離
型フィルムの離型性とステンレス板（鏡面板）の汚染防
止性を以下の方法で行った。 １．離型性の評価 銅箔／プリプレグ／銅箔と積層したものを、離型剤層が
導体箔積層体側となるようにして、実施例、比較例の離
型フィルム各々２枚で挟み込み、この積層品をさらにス
テンレス板２枚で挟み込んだ。プレス機にて、熱プレス
（１８０℃、５０ｋｇ／ｃｍ2、３０分）処理を行なっ
てプリプレグ樹脂を硬化させ、２層板を作成した。冷却
後、離型フィルムがステンレス板及び２層板より容易に
剥離できるかどうかを観察した。手で容易に剥離できる
ものを離型性が良好であると判断する。[Evaluation Method] The releasability of the release films obtained in Examples and Comparative Examples and the prevention of contamination of the stainless steel plate (mirror plate) were evaluated by the following methods. 1. Evaluation of Release Property The laminate of copper foil / prepreg / copper foil was sandwiched between two release films of Examples and Comparative Examples, with the release agent layer being on the conductor foil laminate side, and this laminate was laminated. The product was further sandwiched between two stainless plates. The prepreg resin was cured by performing a hot press (180 ° C., 50 kg / cm 2 , 30 minutes) treatment with a press machine to form a two-layer plate. After cooling, it was observed whether the release film could be easily peeled off from the stainless steel plate and the two-layer plate. Those that can be easily peeled off by hand are judged to have good release properties.
【００２１】２．ステンレス板汚染防止性 上記熱プレス処理において、積層品を挟み込む２枚のス
テンレス板として同一のものを用いて上記条件の熱プレ
ス処理を３０回繰り返した。その後、ステンレス板に汚
れが付着していないかを目視で観察し、汚れが付着して
いないものを汚染防止性が良好であると評価した。結果
を下記表１に示す。2. Stainless Steel Plate Contamination Prevention In the above hot press treatment, the hot press treatment under the above conditions was repeated 30 times using the same two stainless steel plates sandwiching the laminated product. Thereafter, the stainless steel plate was visually inspected for the presence of dirt, and those having no dirt were evaluated as having good contamination prevention properties. The results are shown in Table 1 below.
【００２２】[0022]
【表１】 [Table 1]
【００２３】表１に明らかなように、本発明の離型フィ
ルムは剥離性が良好であり、熱プレスに用いるステンレ
ス板の汚染が効果的に抑制されていることがわかった。
しかしながら、金属層を設けていない比較例１の離型フ
ィルムは、離型剤層として同様のものを用いているため
離型性に問題はないものの、離型フィルムの樹脂に起因
すると思われる白色の付着物が観察され、汚染防止性が
不充分であった。As is evident from Table 1, the release film of the present invention had good releasability, and it was found that the contamination of the stainless steel plate used for hot pressing was effectively suppressed.
However, the release film of Comparative Example 1 having no metal layer has no problem in the releasability because the same release film is used as the release agent layer, but the release film seems to be caused by the resin of the release film. Was observed, and the contamination-preventing property was insufficient.
【００２４】[0024]
【発明の効果】本発明の離型フィルムは、導体箔積層体
の製造におけるプリプレグプレス工程に好適に使用する
ことができ、プリプレグ／導体箔の積層時における積層
体やプレス用の鏡面板の表面の汚染、帯電が抑制され、
耐熱性が良好であるという効果を奏する。The release film of the present invention can be suitably used in a prepreg press step in the production of a conductor foil laminate, and can be used for laminating a prepreg / conductor foil and the surface of a mirror plate for pressing. Contamination and electrification are suppressed,
This has the effect that the heat resistance is good.
フロントページの続き Ｆターム(参考） 4F100 AA17B AK41A AK42 AK46A AK48 BA02 BA03 BA07 BA10A BA10B BA10C GB90 JG03 JJ03 JL06 JL14C Continued on the front page F term (reference) 4F100 AA17B AK41A AK42 AK46A AK48 BA02 BA03 BA07 BA10A BA10B BA10C GB90 JG03 JJ03 JL06 JL14C
Claims (4)
とも一方の面に金属または金属酸化物層を設けてなるベ
ースフィルムの少なくとも一方の面に離型剤層を設けた
ことを特徴とする導体箔積層体製造時のプリプレグプレ
ス工程に用いる離型フィルム。1. A conductor foil laminate comprising a polyamide synthetic resin film having at least one surface provided with a metal or metal oxide layer and a release agent layer provided on at least one surface of a base film. Release film used in prepreg press process during manufacturing.
に金属または金属酸化物層を設けてなるベースフィルム
の少なくとも一方の面に離型剤層を設けたことを特徴と
する導体箔積層体製造時のプリプレグプレス工程に用い
る離型フィルム。2. A method for producing a conductive foil laminate, comprising: a release film layer provided on at least one surface of a base film having a metal or metal oxide layer provided on both surfaces of a polyester-based synthetic resin film. Release film used for prepreg press process.
ウム層であることを特徴とする請求項１または請求項２
に記載の離型フィルム。3. The method according to claim 1, wherein said metal or metal oxide layer is an aluminum layer.
The release film according to 1.
固有抵抗値が１０12Ω以下であることを特徴とする請求
項１乃至請求項３のいずれか１項に記載の離型フィル
ム。4. The release film according to claim 1, wherein a surface specific resistance under an environment of 23 ° C. and 50% RH is 10 12 Ω or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001030797A JP4614552B2 (en) | 2001-02-07 | 2001-02-07 | Release film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001030797A JP4614552B2 (en) | 2001-02-07 | 2001-02-07 | Release film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002234110A true JP2002234110A (en) | 2002-08-20 |
| JP4614552B2 JP4614552B2 (en) | 2011-01-19 |
Family
ID=18894966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001030797A Expired - Fee Related JP4614552B2 (en) | 2001-02-07 | 2001-02-07 | Release film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4614552B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005171224A (en) * | 2003-11-21 | 2005-06-30 | Tosoh Corp | Resin composition for release film and the release film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61145632U (en) * | 1985-03-01 | 1986-09-08 | ||
| JPH09207279A (en) * | 1996-02-06 | 1997-08-12 | Fujimori Kogyo Kk | Release sheet for prepreg |
| JP2000062089A (en) * | 1998-08-14 | 2000-02-29 | Nisshin Steel Co Ltd | Mold release sheet |
| JP2000334885A (en) * | 1999-06-02 | 2000-12-05 | Toyo Metallizing Co Ltd | Release film |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171822A (en) * | 1987-12-26 | 1989-07-06 | San Alum Kogyo Kk | Releasing material for resin base printed board |
-
2001
- 2001-02-07 JP JP2001030797A patent/JP4614552B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61145632U (en) * | 1985-03-01 | 1986-09-08 | ||
| JPH09207279A (en) * | 1996-02-06 | 1997-08-12 | Fujimori Kogyo Kk | Release sheet for prepreg |
| JP2000062089A (en) * | 1998-08-14 | 2000-02-29 | Nisshin Steel Co Ltd | Mold release sheet |
| JP2000334885A (en) * | 1999-06-02 | 2000-12-05 | Toyo Metallizing Co Ltd | Release film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005171224A (en) * | 2003-11-21 | 2005-06-30 | Tosoh Corp | Resin composition for release film and the release film |
| JP4737368B2 (en) * | 2003-11-21 | 2011-07-27 | 東ソー株式会社 | Resin composition for release film and release film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4614552B2 (en) | 2011-01-19 |
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