JP2002226681A - Heat resistant resin composition and prepreg and laminate each using the same - Google Patents
Heat resistant resin composition and prepreg and laminate each using the sameInfo
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- JP2002226681A JP2002226681A JP2001026265A JP2001026265A JP2002226681A JP 2002226681 A JP2002226681 A JP 2002226681A JP 2001026265 A JP2001026265 A JP 2001026265A JP 2001026265 A JP2001026265 A JP 2001026265A JP 2002226681 A JP2002226681 A JP 2002226681A
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- resin composition
- resin
- laminate
- prepreg
- weight
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、耐熱性に優れ、誘
電特性に優れた樹脂組成物、プリプレグ及び積層板に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition, a prepreg, and a laminate having excellent heat resistance and excellent dielectric properties.
【０００２】ノート型パーソナルコンピューターや携帯
電話等の情報処理機器は小型化が求められている。ＬＳ
Ｉ等の電子部品を搭載するプリント配線板においても小
型軽量化の要求は強くなっている。小型軽量化のために
は配線幅を小さくすることや、スルーホール径を小さく
しメッキ厚を薄くすることが必要である。メッキ厚を薄
くすると熱衝撃時にメッキクラックが発生するおそれが
あり、耐熱性が要求される。また同時にこれらの情報処
理用機器の高速化も要求されておりＣＰＵクロック周波
数が高くなっている。そのため信号伝搬速度の高速化が
要求されており、高速化に有利な誘電率、誘電正接の低
いプリント板であることが必要とされる。Information processing devices such as notebook personal computers and mobile phones are required to be miniaturized. LS
There is a strong demand for smaller and lighter printed wiring boards on which electronic components such as I are mounted. In order to reduce the size and weight, it is necessary to reduce the width of the wiring and to reduce the through hole diameter and the plating thickness. If the plating thickness is reduced, plating cracks may occur at the time of thermal shock, and heat resistance is required. At the same time, speeding up of these information processing devices is also required, and the CPU clock frequency is increasing. Therefore, a higher signal propagation speed is required, and a printed board having a low dielectric constant and a low dielectric loss tangent, which is advantageous for the high speed, is required.
【０００３】耐熱性に優れ、誘電特性に優れた樹脂とし
てベンゾシクロブテン樹脂が用いられる（例えば、特開
２０００−２１８７２号公報）。ベンゾシクロブテン樹
脂は硬化反応によって水酸基などの分極の大きい反応基
が生じることがないため、誘電特性が非常に優れてい
る。しかしながらこれらの極性基がないため銅箔との密
着性に欠ける欠点がある。また反応によって生じるテト
ラリン環が燃焼しやすい構造のため、樹脂の耐燃性が十
分でない欠点がある。A benzocyclobutene resin is used as a resin having excellent heat resistance and excellent dielectric properties (for example, JP-A-2000-21872). The benzocyclobutene resin has extremely excellent dielectric properties because a reactive group having a large polarization such as a hydroxyl group is not generated by a curing reaction. However, since there is no such polar group, there is a defect that the adhesion to the copper foil is lacking. In addition, there is a disadvantage that the flame resistance of the resin is not sufficient due to the structure in which the tetralin ring generated by the reaction easily burns.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、このような
問題を解決すべく検討結果なされたものであり、ベンゾ
シクロブテン樹脂とエポキシ変性ポリブタジエン樹脂と
分子内に１原子以上のハロゲンを含む芳香族アミン化合
物を併用することで耐熱性、誘電特性、密着性及び難燃
性に優れた樹脂組成物、プリプレグ及びプリプレグから
得られた積層板を提供するものである。DISCLOSURE OF THE INVENTION The present invention has been made in order to solve such a problem, and has been made to solve the above-mentioned problems. The present invention relates to a benzocyclobutene resin, an epoxy-modified polybutadiene resin, and an aromatic compound containing one or more halogen atoms in the molecule. An object of the present invention is to provide a resin composition excellent in heat resistance, dielectric properties, adhesion and flame retardancy, a prepreg and a laminate obtained from the prepreg by using a group III amine compound in combination.
【０００５】[0005]
【課題を解決するための手段】本発明は、（１）（Ａ）
下記一般式（１）で表されるベンゾシクロブテン樹脂又
はそのプレポリマー、The present invention provides (1) (A)
A benzocyclobutene resin represented by the following general formula (1) or a prepolymer thereof,
【化２】 （Ｂ）エポキシ変性ポリブタジエン樹脂、及び（Ｃ）分
子内に１原子以上のハロゲンを含む芳香族アミン化合物
を必須成分として含有してなることを特徴とする耐熱性
樹脂組成物、（２）前記第（１）項記載の樹脂組成物を
基材に含浸させてなることを特徴とするプリプレグ、
（３）前記第（２）項記載のプリプレグを１枚又は２枚
以上重ね合わせ加熱加圧してなることを特徴とする難燃
性積層板又は銅張積層板、である。Embedded image (B) a heat-resistant resin composition comprising, as essential components, an epoxy-modified polybutadiene resin, and (C) an aromatic amine compound containing at least one halogen in the molecule. (1) A prepreg characterized by impregnating a substrate with the resin composition according to the above (1),
(3) A flame-retardant laminate or a copper-clad laminate obtained by laminating one or more of the prepregs described in the above (2) and heating and pressing them.
【０００６】[0006]
【発明の実施の形態】前述のように、ベンゾシクロブテ
ン樹脂は硬化反応によって水酸基などの分極の大きい反
応基が生じることがないため、誘電特性が非常に優れて
おり、かつ低吸水である。また剛直な構造を持つため耐
熱性に優れている。しかしながら、水酸基等の極性基が
ないため銅箔との密着性に欠ける欠点がある。また硬化
反応が遅いため成型が困難である欠点がある。DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, a benzocyclobutene resin does not generate a reactive group having a large polarization such as a hydroxyl group by a curing reaction, and therefore has extremely excellent dielectric properties and low water absorption. Also, it has excellent heat resistance due to its rigid structure. However, since there is no polar group such as a hydroxyl group, there is a disadvantage that the adhesion to the copper foil is lacking. Further, there is a disadvantage that molding is difficult due to a slow curing reaction.
【０００７】本発明においてはこの問題を解決するた
め、エポキシ変性ポリブタジエン樹脂と分子内に１原子
以上のハロゲンを含む芳香族アミン化合物を用いる。エ
ポキシ変性ポリブタジエン樹脂は分子内にシス型二重結
合を含むため可とう性に優れ、銅箔との密着性が向上す
る。また分子内の二重結合部は誘電特性を悪化させな
い。分子内に１原子以上のハロゲンを含む芳香族アミン
化合物は分子内にハロゲンを含むため難燃性が向上す
る。アミン化合物はエポキシ変性ポリブタジエン樹脂の
エポキシ基と反応し、ベンゾシクロブテン樹脂はエポキ
シ変性ポリブタジエン樹脂の二重結合部と反応する。こ
のため難燃成分、可とう成分ともに樹脂骨格中に組み込
むことができるため耐熱性が低下しない。本発明の樹脂
組成物は耐熱性、誘電特性、密着性及び耐燃性に優れた
樹脂組成物であり、プリント配線板用積層板等に好適に
使用されるものである。In the present invention, to solve this problem, an epoxy-modified polybutadiene resin and an aromatic amine compound containing one or more halogen atoms in the molecule are used. Since the epoxy-modified polybutadiene resin contains a cis-type double bond in the molecule, it is excellent in flexibility and adhesion to a copper foil is improved. The double bond in the molecule does not deteriorate the dielectric properties. Aromatic amine compounds containing one or more halogen atoms in the molecule have improved flame retardancy because they contain halogen atoms in the molecule. The amine compound reacts with the epoxy group of the epoxy-modified polybutadiene resin, and the benzocyclobutene resin reacts with the double bond of the epoxy-modified polybutadiene resin. Therefore, both the flame-retardant component and the flexible component can be incorporated into the resin skeleton, so that the heat resistance does not decrease. The resin composition of the present invention is a resin composition having excellent heat resistance, dielectric properties, adhesion, and flame resistance, and is suitably used for laminated boards for printed wiring boards.
【０００８】本発明で用いる（Ａ）成分のベンゾシクロ
ブテン樹脂は下記一般式（１）で示される。The benzocyclobutene resin (A) used in the present invention is represented by the following general formula (1).
【化３】 また、かかる一般式を有するベンゾシクロブテン樹脂を
プレポリマー化したものも成形性、流動性を調整するた
めに好ましく使用され、本発明の（Ａ）成分に含まれる
ものである。プレポリマー化は、通常加熱溶融して行わ
れる。ベンゾシクロブテン樹脂は樹脂成分１００重量部
中、３０〜７０重量部が好ましい。３０重量部未満では
誘電特性の向上効果が十分でないことがあり、また７０
重量部を越えると成形性が悪化することがある。Embedded image Further, a benzocyclobutene resin having such a general formula, which is prepolymerized, is also preferably used for adjusting moldability and fluidity, and is included in the component (A) of the present invention. The prepolymerization is usually performed by heating and melting. The benzocyclobutene resin is preferably used in an amount of 30 to 70 parts by weight based on 100 parts by weight of the resin component. If the amount is less than 30 parts by weight, the effect of improving the dielectric properties may not be sufficient.
If the amount exceeds the weight part, the moldability may be deteriorated.
【０００９】本発明で用いる（Ｂ）成分のエポキシ変性
ポリブタジエン樹脂は樹脂成分１００重量部中、７〜３
０重量部が好ましい。７重量部未満では密着性が十分で
ないことがあり、また３０重量部を越えると耐熱性が劣
る場合がある。The epoxy-modified polybutadiene resin (B) used in the present invention is used in an amount of 7 to 3 per 100 parts by weight of the resin component.
0 parts by weight is preferred. If the amount is less than 7 parts by weight, the adhesion may not be sufficient, and if it exceeds 30 parts by weight, the heat resistance may be poor.
【００１０】本発明で用いる（Ｃ）成分の分子内に１原
子以上のハロゲンを含む芳香族アミン化合物は、４，
４’−メチレン−ビス（２−クロロアニリン）、４，
４’−メチレン−ビス（２，３−ジクロロアニリン）、
３，３’−ジクロロ−４，４’−ジアミノビフェニル、
ジクロロアニリン、ジブロモアニリン、４，４’−メチ
レン−ビス（２，５−ジブロモアニリン）などがあげら
れる。分子内に１原子以上のハロゲンを含む芳香族アミ
ン化合物は樹脂成分１００重量部中、１５〜４０重量部
が好ましい。１５重量部未満では難燃性付与効果が十分
でなく、また４０重量部を越えると誘電特性が低下する
ことがある。エポキシ基とアミノ基の当量比は０．８〜
１．２が好ましい。当量比がこの範囲にない場合、耐熱
性、吸水性が低下することがある。The aromatic amine compound containing one or more halogen atoms in the molecule of the component (C) used in the present invention is 4,4.
4'-methylene-bis (2-chloroaniline), 4,
4'-methylene-bis (2,3-dichloroaniline),
3,3′-dichloro-4,4′-diaminobiphenyl,
Dichloroaniline, dibromoaniline, 4,4′-methylene-bis (2,5-dibromoaniline) and the like can be mentioned. The aromatic amine compound containing one or more halogen atoms in the molecule is preferably 15 to 40 parts by weight based on 100 parts by weight of the resin component. If it is less than 15 parts by weight, the effect of imparting flame retardancy is not sufficient, and if it exceeds 40 parts by weight, the dielectric properties may be reduced. The equivalent ratio of the epoxy group to the amino group is 0.8 to
1.2 is preferred. If the equivalent ratio is not within this range, heat resistance and water absorption may be reduced.
【００１１】本発明の樹脂組成物は、上述したベンゾシ
クロブテン樹脂とエポキシ変性ポリブタジエン樹脂と分
子内に１原子以上のハロゲンを含む芳香族アミン化合物
を必須成分として含有するが、本発明の目的に反しない
範囲において、その他の樹脂、硬化促進剤、カップリン
グ剤、その他の成分を添加することは差し支えない。The resin composition of the present invention contains the above-mentioned benzocyclobutene resin, epoxy-modified polybutadiene resin, and an aromatic amine compound containing one or more halogen atoms in the molecule as essential components. Other resins, curing accelerators, coupling agents, and other components may be added as long as they do not conflict.
【００１２】本発明の樹脂組成物は種々の形態で利用さ
れるが、基材に含浸する際には通常溶剤に溶解したワニ
スの形で使用される。用いられる溶剤は組成に対して良
好な溶解性を示すことが望ましいが、悪影響を及ぼさな
い範囲で貧溶媒を使用しても構わない。The resin composition of the present invention is used in various forms. When impregnating a substrate, it is usually used in the form of a varnish dissolved in a solvent. It is desirable that the solvent used has good solubility in the composition, but a poor solvent may be used as long as the solvent is not adversely affected.
【００１３】本発明の樹脂組成物を溶剤に溶解して得ら
れるワニスは、ガラス繊布、ガラス不繊布、あるいはガ
ラス以外を成分とする繊布又は不繊布等の基材に塗布、
含浸させ、８０〜２００℃で乾燥させることによりプリ
プレグを得ることが出来る。かかるプリプレグは加熱加
圧して積層板又は銅張積層板を製造することに用いられ
る。本発明の樹脂組成物は耐熱性、誘電特性の優れた樹
脂組成物であり、特に、プリント配線板用の積層板等に
好適に使用されるものである。The varnish obtained by dissolving the resin composition of the present invention in a solvent is applied to a base material such as glass woven cloth, glass non-woven cloth, or woven cloth or non-woven cloth containing components other than glass.
The prepreg can be obtained by impregnating and drying at 80 to 200 ° C. Such a prepreg is used for producing a laminate or a copper-clad laminate by heating and pressing. The resin composition of the present invention is a resin composition having excellent heat resistance and dielectric properties, and is particularly suitably used for a laminated board for a printed wiring board.
【００１４】[0014]
【実施例】（実施例１）ジビニルシロキサン−ビスベン
ゾシクロブテン（プレポリマー化したもの、重量平均分
子量１４００００、ダウケミカル社製サイクロテンＸＵ
Ｒ）５９重量部、エポキシ変性ポリブタジエン樹脂（重
量平均分子量３０００、エポキシ当量２００、ダイセル
化学工業社製ＰＢ３６００）２５重量部、２，５−ジブ
ロモアニリン１６重量部にトルエンを加え、不揮発分濃
度５５重量％となるようにワニスを調整した。このワニ
スを用いて、ガラス繊布（厚さ０．１８ｍｍ、日東紡績
（株）製）１００重量部にワニス固形分で８０重量部含
浸させて、１５０℃の乾燥機炉で５分乾燥させ、樹脂含
有量４４．４％のプリプレグを作成した。上記プリプレ
グを６枚重ね、上下に厚さ３５μｍの電解銅箔を重ね
て、圧力４０ｋｇｆ／ｃｍ2 、温度２００℃で１２０
分、２２０℃で６０分加熱加圧成形を行い、厚さ１．２
ｍｍの両面銅張積層板を得た。EXAMPLES Example 1 Divinylsiloxane-bisbenzocyclobutene (prepolymerized, weight average molecular weight 140,000, Cycloten XU manufactured by Dow Chemical Company)
R) 59 parts by weight, 25 parts by weight of an epoxy-modified polybutadiene resin (weight average molecular weight 3000, epoxy equivalent 200, PB3600 manufactured by Daicel Chemical Industries, Ltd.), and 16 parts by weight of 2,5-dibromoaniline, and toluene was added thereto. %, The varnish was adjusted. Using this varnish, 100 parts by weight of glass fiber cloth (0.18 mm thick, manufactured by Nitto Boseki Co., Ltd.) was impregnated with 80 parts by weight of varnish solids, dried in a dryer oven at 150 ° C. for 5 minutes, and dried. A prepreg having a content of 44.4% was prepared. It overlapped six sheets of the above prepreg, overlapping the electrolytic copper foil having a thickness of 35μm up and down, pressure 40 kgf / cm 2, 120 at a temperature 200 ° C.
And pressure molding at 220 ° C. for 60 minutes to a thickness of 1.2
mm double-sided copper-clad laminate was obtained.
【００１５】（実施例２〜３、及び比較例１〜３）表１
に示した配合処方で、これ以外は全て実施例１と同様の
方法で両面銅張積層板を作成した。(Examples 2 and 3 and Comparative Examples 1 to 3)
, A double-sided copper-clad laminate was prepared in the same manner as in Example 1 except for the above formulation.
【００１６】得られた銅張積層板については難燃性半田
耐熱性およびピール強度を測定した。半田耐熱性、ピー
ル強度についてはＪＩＳ Ｃ ６４８１に準じて測定し、
半田耐熱性は煮沸２時間の吸湿処理を行った後、２６０
℃の半田槽に１２０秒浸漬した後の外観の異常の有無を
調べた。難燃性はＵＬ−９４規格に従い垂直法で評価し
た。ガラス転移点はＤＭＡ法で測定した。誘電率、誘電
正接の測定はＪＩＳＣ ６４８１に準じて行い、周波数
１ＭＨｚの静電容量を測定して求めた。評価結果を表１
に示す。実施例に示す銅張積層板はいずれも誘電率、誘
電正接が低く、耐熱性、半田耐熱性、密着性に優れてい
ることがわかる。The obtained copper-clad laminate was measured for flame-retardant solder heat resistance and peel strength. Solder heat resistance and peel strength were measured according to JIS C6481.
The solder heat resistance was measured after the moisture absorption treatment for 2 hours after boiling.
After immersion in a solder bath at 120 ° C. for 120 seconds, the presence or absence of an abnormal appearance was examined. Flame retardancy was evaluated by the vertical method according to the UL-94 standard. The glass transition point was measured by a DMA method. The dielectric constant and the dielectric loss tangent were measured according to JIS C 6481, and were determined by measuring the capacitance at a frequency of 1 MHz. Table 1 shows the evaluation results.
Shown in It can be seen that all of the copper-clad laminates shown in Examples have a low dielectric constant and a low dielectric loss tangent, and are excellent in heat resistance, solder heat resistance and adhesion.
【００１７】[0017]
【表１】 [Table 1]
【００１８】[0018]
【表２】 [Table 2]
【００１９】表の注 （１）ジビニルシロキサン−ビスベンゾシクロブテン
（プレポリマー化：分子量１４００００、商品名：ダウ
ケミカル社製サイクロテンＸＵＲ） （２）エポキシ変性ポリブタジエン（分子量３０００、
エポキシ当量２００、商品名：ダイセル化学工業社製Ｐ
Ｂ３６００） （３）エポキシ変性ポリブタジエン（分子量１４０００
０、エポキシ当量５１０、商品名：ダイセル化学工業社
製エポフレンド１０２０） （４）２，５−ジブロモアニリン （５）４，４’−メチレン−ビス（２、５−ジブロモア
ニリン） （６）ポリブタジエン（分子量１０００００、商品名：
ＪＳＲ社製ＢＲ０１Ｆ） （７）４，４’−ジアミノジフェニルメタンNotes to the table (1) Divinylsiloxane-bisbenzocyclobutene (prepolymerization: molecular weight 140000, trade name: Cycloten XUR manufactured by Dow Chemical Co.) (2) Epoxy-modified polybutadiene (molecular weight 3000,
Epoxy equivalent 200, Trade name: Daicel Chemical Industries P
B3600) (3) Epoxy-modified polybutadiene (molecular weight 14,000)
0, epoxy equivalent 510, trade name: Epofriend 1020 manufactured by Daicel Chemical Industries, Ltd. (4) 2,5-dibromoaniline (5) 4,4′-methylene-bis (2,5-dibromoaniline) (6) polybutadiene (Molecular weight 100000, trade name:
(BR01F manufactured by JSR) (7) 4,4'-diaminodiphenylmethane
【００２０】[0020]
【発明の効果】本発明の耐熱性樹脂組成物は、プリント
配線板材料に適用された場合、高耐熱性を有し、誘電率
が低い特性を有し、かつ密着性、難燃性に優れた特性を
有している。従って、今後、小型情報処理用機器のプリ
ント配線板に最適な樹脂組成物を提供するものである。The heat-resistant resin composition of the present invention, when applied to a printed wiring board material, has high heat resistance, low dielectric constant, and excellent adhesion and flame retardancy. It has characteristics. Accordingly, in the future, the present invention will provide a resin composition most suitable for a printed wiring board of a small information processing device.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 1/03 ６１０ Ｈ０５Ｋ 1/03 ６１０Ｌ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H05K 1/03 610 H05K 1/03 610L
Claims (3)
ゾシクロブテン樹脂又はそのプレポリマー、 【化１】 （Ｂ）エポキシ変性ポリブタジエン樹脂、及び（Ｃ）分
子内に１原子以上のハロゲンを含む芳香族アミン化合物
を必須成分として含有してなることを特徴とする耐熱性
樹脂組成物。(A) a benzocyclobutene resin represented by the following general formula (1) or a prepolymer thereof, A heat-resistant resin composition comprising (B) an epoxy-modified polybutadiene resin and (C) an aromatic amine compound containing one or more halogen atoms in a molecule as essential components.
させてなることを特徴とするプリプレグ。2. A prepreg obtained by impregnating a base material with the resin composition according to claim 1.
枚以上重ね合わせ加熱加圧してなることを特徴とする難
燃性積層板又は銅張積層板。3. One or two prepregs according to claim 2
A flame-retardant laminate or a copper-clad laminate, characterized by being laminated and heated and pressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001026265A JP4742426B2 (en) | 2001-02-02 | 2001-02-02 | Heat resistant resin composition, prepreg and laminate using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001026265A JP4742426B2 (en) | 2001-02-02 | 2001-02-02 | Heat resistant resin composition, prepreg and laminate using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002226681A true JP2002226681A (en) | 2002-08-14 |
| JP4742426B2 JP4742426B2 (en) | 2011-08-10 |
Family
ID=18891107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001026265A Expired - Fee Related JP4742426B2 (en) | 2001-02-02 | 2001-02-02 | Heat resistant resin composition, prepreg and laminate using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4742426B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018199280A1 (en) * | 2017-04-28 | 2018-11-01 | Jsr株式会社 | Crosslinked rubber and tire |
| WO2021106931A1 (en) | 2019-11-29 | 2021-06-03 | 日本曹達株式会社 | Terminally modified polybutadiene, resin composition for metal-clad laminates, prepreg, and metal-clad laminate |
| WO2024113697A1 (en) * | 2022-12-28 | 2024-06-06 | 武汉迪赛环保新材料股份有限公司 | Benzocyclobutene resin containing olefinic bond, and preparation method therefor |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62161846A (en) * | 1986-01-10 | 1987-07-17 | Hitachi Ltd | Thermosetting resin composition, laminate using same and production thereof |
| JPS62192406A (en) * | 1986-02-19 | 1987-08-24 | Hitachi Ltd | Flame-retarding resin composition and prepreg and laminate using same |
| JPH05102660A (en) * | 1991-10-04 | 1993-04-23 | Hitachi Ltd | Multilayer wiring board and manufacture thereof |
| JPH083365A (en) * | 1994-06-20 | 1996-01-09 | Sumitomo Chem Co Ltd | Resin composition for molding |
| JPH0917916A (en) * | 1995-06-30 | 1997-01-17 | Nitto Denko Corp | Semiconductor device |
| JPH09194549A (en) * | 1996-01-11 | 1997-07-29 | Nitto Denko Corp | Thermosetting resin |
| JP2002179790A (en) * | 2000-12-18 | 2002-06-26 | Sumitomo Bakelite Co Ltd | Heat resistant resin composition and prepreg and laminate using the composition |
-
2001
- 2001-02-02 JP JP2001026265A patent/JP4742426B2/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62161846A (en) * | 1986-01-10 | 1987-07-17 | Hitachi Ltd | Thermosetting resin composition, laminate using same and production thereof |
| JPS62192406A (en) * | 1986-02-19 | 1987-08-24 | Hitachi Ltd | Flame-retarding resin composition and prepreg and laminate using same |
| JPH05102660A (en) * | 1991-10-04 | 1993-04-23 | Hitachi Ltd | Multilayer wiring board and manufacture thereof |
| JPH083365A (en) * | 1994-06-20 | 1996-01-09 | Sumitomo Chem Co Ltd | Resin composition for molding |
| JPH0917916A (en) * | 1995-06-30 | 1997-01-17 | Nitto Denko Corp | Semiconductor device |
| JPH09194549A (en) * | 1996-01-11 | 1997-07-29 | Nitto Denko Corp | Thermosetting resin |
| JP2002179790A (en) * | 2000-12-18 | 2002-06-26 | Sumitomo Bakelite Co Ltd | Heat resistant resin composition and prepreg and laminate using the composition |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018199280A1 (en) * | 2017-04-28 | 2018-11-01 | Jsr株式会社 | Crosslinked rubber and tire |
| WO2021106931A1 (en) | 2019-11-29 | 2021-06-03 | 日本曹達株式会社 | Terminally modified polybutadiene, resin composition for metal-clad laminates, prepreg, and metal-clad laminate |
| KR20220083802A (en) | 2019-11-29 | 2022-06-20 | 닛뽕소다 가부시키가이샤 | Terminal-modified polybutadiene, resin composition for metal-clad laminate, prepreg, and metal-clad laminate |
| WO2024113697A1 (en) * | 2022-12-28 | 2024-06-06 | 武汉迪赛环保新材料股份有限公司 | Benzocyclobutene resin containing olefinic bond, and preparation method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4742426B2 (en) | 2011-08-10 |
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