JP2002221802A - Exposure method for circuit board - Google Patents
Exposure method for circuit boardInfo
- Publication number
- JP2002221802A JP2002221802A JP2001020159A JP2001020159A JP2002221802A JP 2002221802 A JP2002221802 A JP 2002221802A JP 2001020159 A JP2001020159 A JP 2001020159A JP 2001020159 A JP2001020159 A JP 2001020159A JP 2002221802 A JP2002221802 A JP 2002221802A
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- exposure
- exposing
- photomask
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、回路基板を製作す
る場合の露光処理を確実に行えるように案出した回路基
板の露光方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board exposure method devised so as to reliably perform an exposure process when a circuit board is manufactured.
【０００２】[0002]
【従来の技術及びその問題点】フレキシブル回路基板等
の回路基板を製作するには、銅張積層板等のフレキシブ
ル基板に感光性材料を設け、この感光性材料に所要の露
光・現像処理を施した後、エッチング処理を加えて所要
の回路配線パタ−ンを形成する手法が一般的である。2. Description of the Related Art In order to manufacture a circuit board such as a flexible circuit board, a photosensitive material is provided on a flexible board such as a copper-clad laminate, and the photosensitive material is subjected to a required exposure and development treatment. After that, a method of forming a required circuit wiring pattern by etching is generally applied.
【０００３】その為の露光手段としては、通常の密着式
露光機も使用されるが、フォトマスクと感光性材料の密
着性を高める為に露光機のチャックからエア−を均一に
噴射してフレキシブル基板を押し上げるバックブロ−が
可能な密着式露光機も使用される。As the exposure means for this purpose, a normal contact type exposure device is also used, but in order to enhance the adhesion between the photomask and the photosensitive material, air is uniformly jetted from the chuck of the exposure device to obtain a flexible exposure device. A contact type exposure machine capable of back blowing up the substrate is also used.
【０００４】しかし、このような密着式露光機を使用す
る場合、フレキシブル基板を露光する際にフレキシブル
基板の周囲が中央部よりも先にフォトマスクに密着して
しまうと、フォトマスクと感光性材料の間に気泡が溜ま
って充分な密着が得られず、解像度にバラツキが生じて
しまうという問題があった。[0004] However, when such a contact type exposure machine is used, if the periphery of the flexible substrate comes into close contact with the photomask before the central portion when exposing the flexible substrate, the photomask and the photosensitive material are exposed. However, there is a problem that bubbles are accumulated between the layers and sufficient adhesion cannot be obtained, resulting in a variation in resolution.
【０００５】そこで、本発明は、密着式露光機を用いた
場合でも露光処理を確実に行えるように案出した回路基
板の露光方法を提供するものである。Accordingly, the present invention provides a circuit board exposure method devised so that exposure processing can be performed reliably even when a contact type exposure apparatus is used.
【０００６】[0006]
【課題を解決するための手段】その為に本発明による回
路基板の露光方法では、フォトマスクと感光性材料の密
着性を高める為に露光機のチャックからエア−を噴射し
てフレキシブル基板を押し上げて露光処理する回路基板
の露光方法に於いて、露光時に中央部のエア−圧又は流
速が高い露光機のチャックを用いてフォトマスクと感光
性材料の間に発生する気泡を追い出してフォトマスクと
感光性材料を密着させながら露光処理する手法を採用し
たものである。Therefore, in the method of exposing a circuit board according to the present invention, air is jetted from a chuck of an exposing machine to push up a flexible substrate in order to enhance the adhesion between a photomask and a photosensitive material. In the method of exposing a circuit board to be exposed by exposure, air bubbles generated between the photomask and the photosensitive material are expelled by using a chuck of an exposing machine having a high air pressure or a high flow rate at the central portion during the exposure, thereby exposing the photomask. It employs a technique of performing exposure processing while bringing a photosensitive material into close contact.
【０００７】ここで、チャックに於ける中央部のエア−
圧又は流速を高くする為の手段としては、その領域のエ
ア−噴出の穴径を小さく形成するか、又は中央部のエア
−圧又は流速を高くするポンプとそれ以外を低くするポ
ンプとの２系統を用いる手法を採用できる。ポンプを２
系統用いる場合には、エア−圧の制御に加えて、エア−
を噴射するタイミングも制御できるので、フォトマスク
と感光性材料の間に発生する気泡を更に効果的に追い出
せる。Here, the air at the center of the chuck is
Means for increasing the pressure or flow rate include a pump having a small hole diameter for air ejection in the area or a pump for increasing the air pressure or flow rate in the center and a pump for decreasing the other. A method using a system can be adopted. Pump 2
When using a system, in addition to controlling air pressure,
Can be controlled, so that bubbles generated between the photomask and the photosensitive material can be more effectively expelled.
【０００８】また、チャックの中央部のエア−噴出の穴
径を小さく形成し、それ以外を大きく形成する場合に
は、その穴径の小大の分布をチャックの中央部に対して
線対称又は点対称に配置することができ、このような穴
径の配置と上記２系統のポンプの使用により、ワ−クに
対して適切なエア−圧の分布を持たせてフォトマスクと
感光性材料の間に発生する気泡を更に効果的に追い出し
ながら確実な露光処理を行うことが可能となる。In the case where the diameter of the air jet hole at the center of the chuck is made small and the other diameter is made large, the distribution of the small diameter of the hole is made line-symmetric or centrally symmetric with respect to the center of the chuck. With the arrangement of the hole diameter and the use of the two pumps described above, the photomask and the photosensitive material can be provided with an appropriate air-pressure distribution to the work. It is possible to perform a reliable exposure process while expelling bubbles generated between them more effectively.
【０００９】[0009]
【発明の実施の形態】以下、図示の実施例を参照しなが
ら本発明を更に詳述する。図１は本発明による回路基板
の露光方法を説明する為の図である。図に於いて、所要
のフォトマスク１の下面には適当な感光性材料２を設け
た銅張積層板等のフレキシブル基板３を配置し、このフ
レキシブル基板３を露光機のチャック４によりフォトマ
スク１に押し付けて露光処理するものであるが、本発明
では、チャック４に於ける中央部のエア−圧又は流速が
矢印の如く高い露光機のチャック４を用いてフォトマス
ク１と感光性材料２の間に発生する気泡５を追い出して
フォトマスク１と感光性材料２を密着させながら露光処
理するものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in further detail with reference to the illustrated embodiments. FIG. 1 is a view for explaining a circuit board exposure method according to the present invention. In the figure, a flexible substrate 3 such as a copper-clad laminate provided with an appropriate photosensitive material 2 is disposed on the lower surface of a required photomask 1 and the flexible substrate 3 is attached to the photomask 1 by a chuck 4 of an exposure machine. In the present invention, the photomask 1 and the photosensitive material 2 are exposed by using the chuck 4 of the exposing machine in which the air pressure or the flow rate at the center of the chuck 4 is high as shown by an arrow. Exposure is performed while the photomask 1 and the photosensitive material 2 are brought into close contact with each other by expelling bubbles 5 generated therebetween.
【００１０】このような露光方法によれば、露光時に中
央部から外方に向かってフレキシブル基板３がフォトマ
スク１の方向に密着して行くので、フォトマスク１と感
光性材料２の間に発生する気泡５を追い出して図２のよ
うにフォトマスク１と感光性材料２を密着させながら確
実に露光処理できる。According to such an exposure method, since the flexible substrate 3 comes in close contact with the photomask 1 from the center toward the outside at the time of exposure, the exposure between the photomask 1 and the photosensitive material 2 occurs. Expelling bubbles 5 are expelled, and as shown in FIG. 2, the exposure process can be reliably performed while the photomask 1 and the photosensitive material 2 are in close contact with each other.
【００１１】チャック４に於ける中央部のエア−圧又は
流速を高くする為の手段としては、その領域のエア−噴
出の穴径を小さく形成するか、又は中央部のエア−圧又
は流速を高くするポンプとそれ以外を低くするポンプと
の２系統を用いる手法を採用することもできる。ポンプ
を２系統用いる場合には、エア−圧の制御に加えて、エ
ア−を噴射するタイミングも制御できるので、フォトマ
スク１と感光性材料２の間に発生する気泡５を更に効果
的に追い出せる。Means for increasing the air pressure or flow velocity at the central portion of the chuck 4 may be to reduce the diameter of the air jet hole in that area or to reduce the air pressure or flow velocity at the central portion. It is also possible to adopt a method using two systems, a pump for raising the pressure and a pump for lowering the others. When two pumps are used, the timing of jetting air can be controlled in addition to the control of air pressure, so that bubbles 5 generated between the photomask 1 and the photosensitive material 2 can be more effectively expelled. You.
【００１２】また、チャック４の中央部のエア−噴出の
穴径を小さく形成し、それ以外の領域の穴径を大きく形
成する場合には、その穴径の小大の分布をチャック４の
中央部に対して線対称又は点対称に配置することがで
き、このような穴径の配置と記述した２系統のポンプの
使用により、ワ−クに対して適切なエア−圧の分布を持
たせてフォトマスク１と感光性材料２の間に発生する気
泡５を更に効果的に追い出しながら確実な露光処理を行
うことが可能である。In the case where the hole diameter of the air jet at the center of the chuck 4 is formed small and the hole diameter of the other region is formed large, the distribution of the small hole diameter is determined by the center of the chuck 4. The arrangement can be arranged line-symmetrically or point-symmetrically with respect to the part, and by using such a two-system pump described as the arrangement of the hole diameter, an appropriate air pressure distribution can be provided to the work. As a result, it is possible to perform a reliable exposure process while expelling bubbles 5 generated between the photomask 1 and the photosensitive material 2 more effectively.
【００１３】[0013]
【発明の効果】本発明による回路基板の露光方法によれ
ば、露光時に中央部のエア−圧又は流速が高い露光機の
チャックを用いてフォトマスクと感光性材料の間に発生
する気泡を確実に追い出してフォトマスクと感光性材料
を密着させながら露光処理するので、解像度の高い露光
処理を行える。According to the method of exposing a circuit board according to the present invention, bubbles generated between a photomask and a photosensitive material can be reliably formed by using a chuck of an exposing machine having a high air pressure or a high flow rate at the central portion during exposure. And the exposure process is performed while the photomask and the photosensitive material are in close contact with each other, so that the exposure process with high resolution can be performed.
【００１４】また、各種のフレキシブル基板等の品目毎
に気泡が溜まりやすい箇所が異なるような場合にも好適
に対応できる。Further, it is possible to suitably cope with a case where a place where air bubbles easily accumulate differs depending on items such as various kinds of flexible substrates.
【００１５】従って、高解像度を要求される微細品目の
フレキシブル基板等に対する露光手段として極めて有効
である。Therefore, it is extremely effective as an exposing means for a fine item such as a flexible substrate requiring high resolution.
【図１】本発明による回路基板の露光方法を説明する為
の図。FIG. 1 is a diagram for explaining a circuit board exposure method according to the present invention.
【図２】本発明により適正な露光処理を行った場合の説
明図。FIG. 2 is an explanatory diagram when a proper exposure process is performed according to the present invention.
１ フォトマスク ２ 感光性材料 ３ フレキシブル基板 ４ 露光機のチャック ５ 気泡 DESCRIPTION OF SYMBOLS 1 Photomask 2 Photosensitive material 3 Flexible substrate 4 Exposure machine chuck 5 Bubbles
Claims (4)
る為に露光機のチャックからエア−を噴射してフレキシ
ブル基板を押し上げて露光処理する回路基板の露光方法
に於いて、露光時に中央部のエア−圧又は流速が高い露
光機のチャックを用いてフォトマスクと感光性材料の間
に発生する気泡を追い出してフォトマスクと感光性材料
とを密着させながら露光処理することを特徴とする回路
基板の露光方法。1. A method of exposing a circuit board in which a flexible substrate is pushed up by injecting air from a chuck of an exposing machine to increase the adhesion between a photomask and a photosensitive material, thereby exposing the flexible substrate to a central portion. A circuit for exposing air bubbles generated between a photomask and a photosensitive material by using a chuck of an exposure machine having a high air pressure or a high flow rate and exposing the photomask to the photosensitive material while keeping the photomask and the photosensitive material in close contact with each other. Substrate exposure method.
速を高くする為にその領域のエア−噴出の穴径を小さく
形成したチャックを用いる請求項１に記載の回路基板の
露光方法。2. The circuit board exposure method according to claim 1, wherein a chuck having a small hole diameter for air ejection in the area is used in order to increase the air pressure or flow velocity at the center of the chuck.
速を高くする為にその中央部のエア−圧又は流速を高く
するポンプとそれ以外を低くするポンプとの２系統を用
いる請求項１に記載の回路基板の露光方法。3. A system for increasing the air pressure or flow rate at the center of the chuck by using two systems, a pump for increasing the air pressure or flow rate at the center and a pump for lowering the other. 2. The method for exposing a circuit board according to claim 1.
さく形成し、それ以外を大きく形成する場合、その穴径
の小大の分布をチャックの中央部に対して線対称又は点
対称に配置する前記請求項いずれかに記載の回路基板の
露光方法。4. When the diameter of the air jet hole at the center of the chuck is made small and the other diameter is made large, the distribution of the small hole diameter is line-symmetric or point-symmetric with respect to the center of the chuck. The method for exposing a circuit board according to any one of the preceding claims, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001020159A JP4316816B2 (en) | 2001-01-29 | 2001-01-29 | Flexible circuit board exposure method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001020159A JP4316816B2 (en) | 2001-01-29 | 2001-01-29 | Flexible circuit board exposure method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002221802A true JP2002221802A (en) | 2002-08-09 |
| JP4316816B2 JP4316816B2 (en) | 2009-08-19 |
Family
ID=18885915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001020159A Expired - Fee Related JP4316816B2 (en) | 2001-01-29 | 2001-01-29 | Flexible circuit board exposure method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4316816B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011216917A (en) * | 2011-08-01 | 2011-10-27 | Sony Corp | Pattern transfer method, metal thin-film pattern transfer method, and transfer device |
| US8943968B2 (en) | 2007-06-15 | 2015-02-03 | Sony Corporation | Method for producing metal thin film |
-
2001
- 2001-01-29 JP JP2001020159A patent/JP4316816B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8943968B2 (en) | 2007-06-15 | 2015-02-03 | Sony Corporation | Method for producing metal thin film |
| US8943963B2 (en) | 2007-06-15 | 2015-02-03 | Sony Corporation | Method for producing metal thin film |
| JP2011216917A (en) * | 2011-08-01 | 2011-10-27 | Sony Corp | Pattern transfer method, metal thin-film pattern transfer method, and transfer device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4316816B2 (en) | 2009-08-19 |
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