JP2002208323A - Manufacturing method of very thin wire or coated very thin wire - Google Patents
Manufacturing method of very thin wire or coated very thin wireInfo
- Publication number
- JP2002208323A JP2002208323A JP2001002966A JP2001002966A JP2002208323A JP 2002208323 A JP2002208323 A JP 2002208323A JP 2001002966 A JP2001002966 A JP 2001002966A JP 2001002966 A JP2001002966 A JP 2001002966A JP 2002208323 A JP2002208323 A JP 2002208323A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- coated
- resin
- coating
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気・電子機器用
配線に適した高品質の極細線または被覆極細線の製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a high-quality extra fine wire or coated extra fine wire suitable for wiring for electric / electronic equipment.
【０００２】[0002]
【従来の技術】従来から、コイルなどの電気・電子機器
の配線には、線径が２０μｍ程度の銅、銅合金、アルミ
ニウム、アルミニウム合金などの極細線が用いられてい
る。これらの極細線はキャプスタン型連続伸線機により
伸線しボビンなどに巻き取る方法により製造されてお
り、その後、必要に応じて、別のメッキライン或いは樹
脂被覆ラインに通してそれぞれ金属メッキ或いは樹脂被
覆が施される。前記キャプスタン型連続伸線機では、素
線は、前記伸線機に装備された複数のダイス間で引抜張
力が負荷され、各ダイス毎に１０〜２５％の減面率で伸
線加工が施される。2. Description of the Related Art Conventionally, ultrafine wires such as copper, copper alloy, aluminum, and aluminum alloy having a wire diameter of about 20 μm have been used for wiring of electric and electronic devices such as coils. These extra fine wires are manufactured by a method of drawing by a capstan type continuous drawing machine and winding them around a bobbin, and then, if necessary, pass through another plating line or a resin coating line to perform metal plating or A resin coating is applied. In the capstan-type continuous wire drawing machine, a drawing tension is applied to a plurality of dies provided in the wire drawing machine, and wire drawing is performed with a reduction of 10 to 25% for each die. Will be applied.
【０００３】[0003]
【発明が解決しようとする課題】近年、携帯電話などの
電気・電子機器の小型化に伴い、線径が１０〜１５μｍ
或いは更に細い極細線が要求されるようになり、このよ
うな極細線をキャプスタン型連続伸線機で伸線加工する
と断線が多発し、その原因は伸線加工時に生じる異物混
入や表面傷であることが多い。また断線に至らない場合
でも表面に露出した異物は金属メッキの密着性を低下さ
せ、表面傷は樹脂被覆層の密着不良や膨れなどの原因に
なるという問題があった。In recent years, with the miniaturization of electric and electronic devices such as mobile phones, the wire diameter has been reduced to 10 to 15 μm.
Alternatively, even finer ultrafine wires are required, and when such ultrafine wires are drawn by a capstan-type continuous drawing machine, breakage frequently occurs, and the cause is foreign material contamination or surface scratches generated during drawing. There are many. Further, even when the wire is not broken, there is a problem that the foreign matter exposed on the surface lowers the adhesion of the metal plating, and the surface scratches cause poor adhesion and swelling of the resin coating layer.
【０００４】このようなことから、異物混入や表面傷に
よる断線防止などを目的として、伸線加工の途中に皮む
き工程を入れて異物や表面傷を除去する方法が検討さ
れ、また引抜張力の調整、潤滑油の性状、ダイス形状、
素線の機械的性質などの改善が試みられているが、いず
れも十分な効果が得られていない。本発明は、このよう
な状況に鑑みなされたもので、その目的とするところ
は、電気・電子機器用配線に適した高品質の極細線また
は被覆極細線の製造方法を提供することにある。In view of the above, for the purpose of preventing breakage due to foreign matter contamination and surface scratches, a method of removing a foreign matter and surface scratches by inserting a peeling process in the middle of wire drawing has been studied. Adjustment, lubricating oil properties, die shape,
Attempts have been made to improve the mechanical properties of the strands, but none of them have been sufficiently effective. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method for manufacturing a high-quality ultrafine wire or a coated ultrafine wire suitable for wiring for electric / electronic devices.
【０００５】[0005]
【課題を解決するための手段】請求項１記載の発明は、
導電性金属素線に金属Ａまたは樹脂Ａを前記導電性金属
素線の線径の１〜１００％の厚さに層状に被覆する工
程、前記被覆素線を縮径加工する工程、前記縮径加工後
の被覆素線の被覆層を除去して極細線とする工程をこの
順に施すことを特徴とする極細線の製造方法である。According to the first aspect of the present invention,
A step of coating the conductive metal strand with metal A or resin A in a thickness of 1 to 100% of the diameter of the conductive metal strand, a step of reducing the diameter of the coated strand, and a step of reducing the diameter. A method of manufacturing an ultrafine wire, comprising the steps of removing a coating layer of a coated wire after processing to obtain an ultrafine wire in this order.
【０００６】請求項２記載の発明は、請求項１記載の極
細線に金属Ｂまたは樹脂Ｂを層状に被覆することを特徴
とする被覆極細線の製造方法である。According to a second aspect of the present invention, there is provided a method for producing a coated ultrafine wire, wherein the ultrafine wire according to the first aspect is coated with a metal B or a resin B in a layered manner.
【０００７】請求項３記載の発明は、導電性金属素線に
金属Ａまたは樹脂Ａを前記導電性金属素線の線径の１〜
１００％の厚さに層状に被覆する工程、前記被覆素線を
縮径加工する工程、前記縮径加工後の被覆素線の被覆層
を除去する工程、前記被覆層を除去した素線（極細線）
に金属Ｂまたは樹脂Ｂを層状に被覆する工程をこの順に
連続して施すことを特徴とする被覆極細線の製造方法で
ある。According to a third aspect of the present invention, the conductive metal strand is provided with a metal A or a resin A having a wire diameter of 1 to 5 mm.
A step of coating in a layered manner to a thickness of 100%, a step of reducing the diameter of the coated wire, a step of removing the coating layer of the coated wire after the diameter reduction, a wire from which the coating layer is removed (ultrafine line)
In which a step of coating a metal B or a resin B in a layered manner is continuously performed in this order.
【０００８】[0008]
【発明の実施の形態】請求項１記載の発明は、導電性金
属素線に、金属Ａまたは樹脂Ａを被覆して被覆素線と
し、この被覆素線を伸線加工し、その後、金属Ａまたは
樹脂Ａの被覆層を除去する極細線の製造方法である。こ
の発明では、金属Ａまたは樹脂Ａの被覆層が、ダイス内
面と導電性素線との間で緩衝材として作用するので、伸
線加工時に、導電性金属素線がダイス内面と直接擦れあ
って傷が付いたり異物が混入したりするのが防止され、
高品質の極細線が得られる。DETAILED DESCRIPTION OF THE INVENTION According to the first aspect of the present invention, a conductive metal wire is coated with a metal A or a resin A to form a coated wire. Alternatively, it is a method for producing an ultrafine wire in which the coating layer of the resin A is removed. In the present invention, since the coating layer of the metal A or the resin A acts as a buffer between the inner surface of the die and the conductive wire, the conductive metal wire directly rubs against the inner surface of the die during wire drawing. It prevents scratches and foreign matter from entering,
High quality ultra fine lines can be obtained.
【０００９】本発明において、前記導電性金属素線に
は、キャプスタン型連続伸線機などの通常の伸線機によ
り伸線した純銅、銅合金、純アルミニウム、アルミニウ
ム合金などの素線が使用される。前記素線の線径は、
０．０１ｍｍより細いと、その後の処理で除去できない
表面傷が生じる恐れがあり、０．５ｍｍより太いと極細
線に加工するまでに金属Ａまたは樹脂Ａの被覆層が部分
的に剥離して被覆の効果が十分に得られなくなる恐れが
ある。従って、前記導電性金属素線の線径は０．０１〜
０．５ｍｍの範囲が好ましい。In the present invention, as the conductive metal wire, a wire such as pure copper, copper alloy, pure aluminum, or aluminum alloy drawn by a normal wire drawing machine such as a capstan type continuous wire drawing machine is used. Is done. The wire diameter of the strand is
If it is thinner than 0.01 mm, there is a possibility that surface scratches that cannot be removed by subsequent processing may occur, and if it is thicker than 0.5 mm, the coating layer of metal A or resin A is partially peeled off before processing into an ultrafine wire. May not be sufficiently obtained. Therefore, the wire diameter of the conductive metal strand is 0.01 to
A range of 0.5 mm is preferred.
【００１０】この発明において、金属Ａには導電性金属
素線との密着性に優れるＳｎなどが好適である。前記金
属Ａの被覆方法には電気メッキ法、蒸着法など任意の方
法が適用できるが、電気メッキ法が、均一な厚さにかつ
安価に被覆でき好ましい。In the present invention, the metal A is preferably Sn or the like which has excellent adhesion to the conductive metal wire. Although any method such as an electroplating method and a vapor deposition method can be applied to the method of coating the metal A, the electroplating method is preferable because it can be coated at a uniform thickness and at low cost.
【００１１】この発明において、被覆樹脂Ａには、伸線
加工性に優れるイミド系樹脂、ポリエステル系樹脂等が
好適である。樹脂Ａの被覆方法は塗布法が簡便で好まし
い。In the present invention, as the coating resin A, an imide-based resin, a polyester-based resin or the like which is excellent in wire drawing workability is preferable. The coating method of the resin A is preferably a simple coating method.
【００１２】金属Ａまたは樹脂Ａの被覆厚さは、線径の
１％より薄いと、その緩衝効果が十分に得られず、伸線
時に導電性金属素線がダイス内面と直接接触して表面傷
が生じて断線が起きたりする。また素線径の１００％よ
り厚いと、伸線加工で導電性金属素線の断面形状が真円
にならず断線が生じ易くなる。また被覆材料費が嵩んで
実用性に欠ける。If the coating thickness of the metal A or the resin A is less than 1% of the wire diameter, a sufficient buffering effect cannot be obtained. Scratches occur and disconnections occur. On the other hand, if the diameter is larger than 100% of the wire diameter, the cross-sectional shape of the conductive metal wire will not be a perfect circle by wire drawing, and the wire will be easily broken. In addition, the cost of the coating material is high, and it is not practical.
【００１３】伸線後の被覆素線から、被覆金属Ａを除去
するには、除去厚さを精度良く制御でき、かつ除去速度
が比較的速い電気化学溶解法が好ましい。前記電気化学
溶解法では、電解液および電解条件は、素線となる導電
性金属と被覆金属の溶解電位の差を利用し、前記導電性
金属は溶解せずに被覆金属のみが溶解する電解液および
電解条件を選定する。代表的な電解液および好ましい濃
度範囲を表１に示した。In order to remove the coating metal A from the coated strand after the drawing, an electrochemical dissolution method which can control the thickness of the coating with high precision and has a relatively high removal rate is preferable. In the electrochemical dissolution method, the electrolytic solution and the electrolytic conditions utilize the difference in the dissolution potential between the conductive metal serving as the strand and the coating metal, and the electrolytic solution dissolves only the coating metal without dissolving the conductive metal. And electrolysis conditions. Table 1 shows typical electrolytic solutions and preferred concentration ranges.
【００１４】[0014]
【表１】 [Table 1]
【００１５】伸線後の被覆素線から、被覆樹脂Ａを除去
するには、化学溶解法、加熱蒸発法なども推奨される。
前記化学溶解法は被覆樹脂の種類に応じて溶解液を選定
し、適正な温度と時間で処理を行う。前記加熱蒸発法は
減圧した加熱炉或いは不活性ガスを充満させた加熱炉
に、縮径加工後の被覆素線を通し、被覆樹脂Ａを熱分解
させて蒸発させる方法である。加熱条件は、樹脂の種類
などにもよるが、極細線への影響を考慮すると、３５０
〜５００℃で１０秒〜１０分が好ましい。In order to remove the coating resin A from the coated strand after the drawing, a chemical dissolution method, a heat evaporation method and the like are also recommended.
In the chemical dissolution method, a solution is selected according to the type of the coating resin, and the treatment is performed at an appropriate temperature and time. The heating evaporation method is a method in which the coated resin A is thermally decomposed and evaporated by passing the coated wire after diameter reduction through a reduced pressure heating furnace or a heating furnace filled with an inert gas. The heating condition depends on the type of the resin and the like.
The temperature is preferably 10 seconds to 10 minutes at -500 ° C.
【００１６】請求項２記載の発明は、請求項１記載発明
で製造された極細線に金属Ｂを被覆してハンダ付け性、
導電性、耐食性を向上させた被覆極細線の製造方法、ま
たは樹脂Ｂを被覆して、絶縁性を付与し或いは耐食性を
向上させた被覆極細線の製造方法である。According to a second aspect of the present invention, the ultrafine wire produced by the first aspect of the present invention is coated with a metal B to have solderability.
This is a method for producing a coated ultrafine wire having improved conductivity and corrosion resistance, or a method for producing a coated ultrafine wire having resin B to impart insulation or improve corrosion resistance.
【００１７】前記被覆金属Ｂには、錫、金、銀、ニッケ
ル、パラジウム、或いはこれらの合金が挙げられる。金
属Ｂの被覆方法には電気メッキ法が被覆厚さを制御し易
く、かつ安価で推奨される。Examples of the coating metal B include tin, gold, silver, nickel, palladium, and alloys thereof. As a coating method of the metal B, an electroplating method is recommended because it is easy to control the coating thickness and is inexpensive.
【００１８】前記被覆樹脂Ｂにはエナメル、熱可塑性樹
脂であるポリエチレン、ポリスチレン、ポリ塩化ビニ
ル、ポリアミドなどが好適である。樹脂Ｂの被覆方法に
は塗布法、押出被覆法などが好適である。The coating resin B is preferably enamel, a thermoplastic resin such as polyethylene, polystyrene, polyvinyl chloride, or polyamide. The coating method of the resin B is preferably a coating method, an extrusion coating method, or the like.
【００１９】請求項３記載発明は、請求項１記載発明で
導電性金属素線を極細線に連続して加工し、この極細線
に、工程を中断することなく、連続して金属Ｂまたは樹
脂Ｂを被覆する被覆極細線の製造方法である。この発明
によれば、極細線をボビンに巻き取り、これを別のメッ
キラインに搬送する方法に較べて、搬送の際の取り扱い
傷が発生しないので、表面品質が一層向上する。また生
産性も向上する。According to a third aspect of the present invention, in the first aspect of the invention, the conductive metal wire is continuously processed into a fine wire, and the metal B or resin is continuously formed on the fine wire without interrupting the process. This is a method for producing a coated ultrafine wire for coating B. According to the present invention, as compared with a method of winding an ultrafine wire around a bobbin and transporting the same to another plating line, handling scratches during transport are not generated, so that the surface quality is further improved. Also, productivity is improved.
【００２０】以下に、請求項３記載発明の実施形態を図
を参照して説明する。図１に示した実施形態は、（１）
導電性金属素線２に金属Ａを被覆する工程、（２）被覆
素線４を連続伸線する工程、（３）被覆素線４から被覆
金属Ａを除去して極細線７を露出させる工程、（４）極
細線７に金属Ｂを被覆する工程からなり、これら４工程
は連続して行われる。Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The embodiment shown in FIG.
A step of coating the conductive metal strand 2 with the metal A; (2) a step of continuously drawing the coated strand 4; and (3) a step of removing the coated metal A from the coated strand 4 to expose the ultrafine wire 7. , (4) a step of coating the fine wire 7 with the metal B, and these four steps are performed continuously.
【００２１】具体的に説明すると、前記（１）の工程で
はサプライ１から供給される導電性金属素線２に脱脂、
酸洗の各処理を施し、電気メッキ槽３で金属Ａをメッキ
して被覆素線４とし、次に水洗、湯洗、乾燥の各処理を
施す。（２）の工程では被覆素線４をキャプスタン型連
続伸線機５で縮径加工する。（３）の工程では被覆素線
４を脱脂後、電解槽６で被覆金属Ａを除去して極細線７
を露出させる。（４）の工程では極細線７に、脱脂、酸
洗の各処理を施した後、電気メッキ槽８で金属Ｂをメッ
キして被覆極細線９とし、その後水洗、湯洗、乾燥の各
処理を施してボビン１０に巻き取る。図１で１７はガイ
ドロール、１８は給電ロールである。More specifically, in the step (1), the conductive metal wire 2 supplied from the supply 1 is degreased,
Each process of pickling is performed, and the metal A is plated in the electroplating tank 3 to obtain the coated wire 4. Next, each process of washing with water, washing with hot water and drying is performed. In the step (2), the coated strand 4 is reduced in diameter by a capstan-type continuous drawing machine 5. In the step (3), after the coated wire 4 is degreased, the coated metal A is removed in the electrolytic bath 6 to remove the ultrafine wire 7.
To expose. In the step (4), each of the ultrafine wires 7 is subjected to degreasing and pickling treatments, and then metal B is plated in an electroplating tank 8 to form coated ultrafine wires 9, followed by water washing, hot water washing, and drying treatments. And wound on the bobbin 10. In FIG. 1, 17 is a guide roll, and 18 is a power supply roll.
【００２２】図２に示した実施形態は、（１）純銅素線
２に樹脂Ａを被覆する工程、（２）被覆素線１２を連続
伸線する工程、（３）被覆樹脂Ａを除去して極細線７を
露出させる工程、（４）極細線７に樹脂Ｂを被覆する工
程からなり、これら４工程は連続して行われる。In the embodiment shown in FIG. 2, (1) a step of coating the pure copper wire 2 with the resin A, (2) a step of continuously drawing the coated wire 12, and (3) removing the coated resin A And (4) a step of coating the ultrafine wire 7 with the resin B. These four steps are performed continuously.
【００２３】具体的に説明すると、前記（１）の工程で
はサプライ１から供給される導電性金属素線２に樹脂被
覆槽１１で樹脂Ａを被覆して被覆素線１２とする。
（２）の工程では被覆素線１２をキャプスタン型連続伸
線機５で縮径加工する。（３）の工程では加熱炉１３で
被覆樹脂Ａを加熱蒸発させて除去して極細線７を露出さ
せる。（４）の工程では極細線７に、エナメル塗布槽１
４でエナメルを塗布し、焼付け炉１５で前記エナメルを
焼付けて被覆極細線１６として、ボビン１０に巻き取
る。図２で１７はガイドロールである。More specifically, in the step (1), the conductive metal wire 2 supplied from the supply 1 is coated with the resin A in the resin coating tank 11 to form the coated wire 12.
In the process (2), the coated strand 12 is subjected to diameter reduction by the capstan-type continuous wire drawing machine 5. In the step (3), the coating resin A is removed by heating and evaporating the coating resin A in the heating furnace 13 to expose the ultrafine wires 7. In the step (4), the enamel coating tank 1
In 4, the enamel is applied, and the enamel is baked in a baking furnace 15 to be wound on the bobbin 10 as a coated ultrafine wire 16. In FIG. 2, reference numeral 17 denotes a guide roll.
【００２４】請求項３記載発明では、金属Ａを被覆した
導電性金属素線を連続伸線加工し、次いで被覆金属Ａを
除去して得た極細線に樹脂Ｂを被覆しても、樹脂Ａを被
覆した素線を連続伸線加工し、被覆樹脂Ａを除去して得
た極細線に金属Ｂを被覆しても良い。According to the third aspect of the present invention, the conductive metal wire coated with the metal A is continuously drawn, and then the resin B is coated on the ultrafine wire obtained by removing the coated metal A. May be coated with a metal B on an ultrafine wire obtained by continuously drawing the coated wire and removing the coating resin A.
【００２５】[0025]
【実施例】以下に、本発明を実施例により詳細に説明す
る。 （実施例１）線径１００μｍの純銅素線にＳｎを、本発
明規定値内で種々の厚さに電気メッキして被覆素線と
し、これをタンデム式連続伸線機により所定線径に伸線
加工し、引き続き、脱脂槽にて脱脂し、次いで濃度１７
０ミリリットル／リットルの塩酸を貯留した電解槽内を
電流密度２Ａ／ｄｍ2 で通電させつつ通過させてＳｎメ
ッキ層のみを溶解除去し、線径１５μｍの純銅極細線を
製造した。電解槽内にはガイドロールを配置して被覆素
線の走行長さを、その金属メッキ厚さに応じて変えられ
るようにした。The present invention will be described below in detail with reference to examples. (Example 1) A pure copper wire having a wire diameter of 100 µm was electroplated with Sn to various thicknesses within the specified value of the present invention to obtain a coated wire, which was drawn to a predetermined wire diameter by a tandem continuous wire drawing machine. Wire processing, followed by degreasing in a degreasing tank,
A current density of 2 A / dm 2 was passed through an electrolytic cell containing hydrochloric acid of 0 ml / liter while the electrolytic solution was passed through the electrolytic cell to dissolve and remove only the Sn plating layer, thereby producing a fine copper wire having a wire diameter of 15 μm. A guide roll was arranged in the electrolytic cell so that the running length of the coated wire could be changed according to the thickness of the metal plating.
【００２６】（比較例１）線径１００μｍの純銅素線に
Ｓｎを、本発明規定値外の厚さに電気メッキして被覆素
線とした他は、実施例１と同じ方法により線径１５μｍ
の純銅極細線を製造した。Comparative Example 1 A wire diameter of 15 μm was obtained in the same manner as in Example 1 except that a pure copper wire having a wire diameter of 100 μm was electroplated to a thickness outside the specified value of the present invention to form a coated wire.
Was manufactured.
【００２７】（比較例２）線径１００μｍの純銅素線を
タンデム式連続伸線機により伸線して線径１５μｍの極
細線を製造した。(Comparative Example 2) A pure copper wire having a wire diameter of 100 µm was drawn by a tandem-type continuous wire drawing machine to produce an ultrafine wire having a wire diameter of 15 µm.
【００２８】実施例１および比較例１、２では純銅極細
線を各４ロット製造し、各ロットにおける１ｋｇあたり
の断線回数を調べた。結果を表２に示す。表２にはＳｎ
メッキ厚さを併記した。In Example 1 and Comparative Examples 1 and 2, four lots of ultrafine copper wire were manufactured, and the number of disconnections per kg in each lot was examined. Table 2 shows the results. Table 2 shows that Sn
The plating thickness is also shown.
【００２９】[0029]
【表２】 [Table 2]
【００３０】表２から明らかなように、本発明例のＮ
ｏ．１〜４は１ｋｇあたりの平均断線回数が０．２５〜
１．５０回でいずれも少なかった。これは、Ｓｎメッキ
被覆層がダイス内面と導電性素線との間で緩衝材として
作用して、伸線加工時に、ダイスとの擦れ合いで、導電
性金属素線に、傷が付いたり、異物が混入したりするの
が防止されたためである。これに対し、比較例のＮｏ．
５はＳｎメッキ厚さが薄かったため、Ｎｏ．６はＳｎメ
ッキを施さなかったためいずれも断線回数が多くなっ
た。As is evident from Table 2, N of the present invention example
o. For 1-4, the average number of disconnections per kg is 0.25-
1.50 times were all small. This is because the Sn plating coating layer acts as a buffer between the inner surface of the die and the conductive element wire, and at the time of wire drawing, the conductive metal element wire is scratched by rubbing with the die, This is because foreign substances are prevented from being mixed. On the other hand, in Comparative Example No.
No. 5 had a small Sn plating thickness. In No. 6, the number of disconnections increased in each case because no Sn plating was applied.
【００３１】（実施例２）線径１００μｍの純銅素線に
ポリエチレン樹脂を本発明規定値内の種々厚さに押出被
覆して被覆素線とし、これをタンデム式連続伸線機によ
り所定線径に伸線加工し、引き続き、４００℃の還元ガ
ス雰囲気中で１分間加熱して樹脂層を蒸発除去して線径
１５μｍの純銅極細線を製造した。Example 2 A pure copper wire having a wire diameter of 100 μm was extrusion-coated with a polyethylene resin to various thicknesses within the specified value of the present invention to obtain a coated wire, which was then subjected to a predetermined wire diameter by a tandem-type continuous wire drawing machine. Then, the resultant was heated in a reducing gas atmosphere at 400 ° C. for 1 minute to evaporate and remove the resin layer to produce a pure copper ultrafine wire having a wire diameter of 15 μm.
【００３２】（比較例３）線径１００μｍの純銅素線に
ポリエチレン樹脂を本発明規定値外の厚さに押出被覆し
て被覆素線とした他は、実施例２と同じ方法により線径
１５μｍの純銅極細線を製造した。Comparative Example 3 A wire diameter of 15 μm was obtained in the same manner as in Example 2, except that a pure copper wire having a wire diameter of 100 μm was extruded and coated with a polyethylene resin to a thickness outside the range specified in the present invention to obtain a coated wire. Was manufactured.
【００３３】（比較例４）線径１００μｍの純銅素線を
タンデム式連続伸線機により伸線して線径１５μｍの極
細線を製造した。(Comparative Example 4) A pure copper wire having a wire diameter of 100 µm was drawn by a tandem-type continuous wire drawing machine to produce a fine wire having a wire diameter of 15 µm.
【００３４】実施例２および比較例３、４では純銅極細
線を各４ロット製造し、各ロットにおける１ｋｇあたり
の断線回数を調べた。結果を表３に示す。表３にはポリ
エチレン樹脂の被覆厚さを併記した。In Example 2 and Comparative Examples 3 and 4, four lots of ultrafine copper wire were manufactured, and the number of disconnections per kg in each lot was examined. Table 3 shows the results. Table 3 also shows the coating thickness of the polyethylene resin.
【００３５】[0035]
【表３】 [Table 3]
【００３６】表３から明らかなように、本発明例のＮ
ｏ．７〜１０は１ｋｇあたりの平均断線回数が０〜１．
７５回でいずれも少なかった。これは、ポリエチレン樹
脂の被覆層がダイス内面と導電性素線との間で緩衝材と
して作用して、伸線加工時に、ダイスとの擦れ合いで、
導電性金属素線に、傷が付いたり、異物が混入したりす
るのが防止されたためである。これに対し、比較例のＮ
ｏ．１１は樹脂の被覆厚さが薄かったため、Ｎｏ．１２
は樹脂を被覆しなかったためいずれも断線回数が多くな
った。As is clear from Table 3, N of the present invention example
o. For 7 to 10, the average number of disconnections per kg is 0 to 1.
There were few in 75 times. This is because the polyethylene resin coating layer acts as a cushioning material between the inner surface of the die and the conductive strand, and at the time of wire drawing, rubbing with the die,
This is because the conductive metal element wire is prevented from being scratched or mixed with foreign matter. On the other hand, N
o. No. 11 was thin because the coating thickness of the resin was thin. 12
Since no resin was coated, the number of disconnections increased in each case.
【００３７】（実施例３）実施例１で製造したＮｏ．２
の極細線（表２参照）にＡｇを２μｍ厚さに電気メッキ
し、メッキ層の耐剥離性と耐膨れ性を下記方法により調
べた。耐剥離性は、前記Ａｇメッキ極細線から長さ２０
０ｍｍの試験片を切り出し、これを１ロットあたり３本
づつ捻回試験してメッキ層に剥離が生じた本数を調べ
た。耐膨れ性は、前記Ａｇメッキ極細線から長さ１ｍの
試験片を切出し、これを３００℃で１０分間加熱し、メ
ッキ層に膨れが生じた本数を調べた。比較のため、従来
法により製造した線径１５μｍの極細線（表２のＮｏ．
６）についても同様の調査を行った。各９ロットづつ調
査し、結果を表４に示した。(Example 3) No. 3 manufactured in Example 1 2
(See Table 2) was electroplated with Ag to a thickness of 2 μm, and the peel resistance and swelling resistance of the plated layer were examined by the following methods. The peel resistance is 20 mm in length from the Ag-plated extra fine wire.
A test piece of 0 mm was cut out and twisted three times per lot to examine the number of stripped plating layers. The swelling resistance was determined by cutting out a test piece having a length of 1 m from the Ag-plated ultrafine wire, heating the test piece at 300 ° C. for 10 minutes, and examining the number of swellings in the plating layer. For comparison, an ultrafine wire having a wire diameter of 15 μm manufactured by the conventional method (No.
A similar survey was conducted for 6). Inspection was conducted for each of the 9 lots, and the results are shown in Table 4.
【００３８】[0038]
【表４】 [Table 4]
【００３９】表４から明らかなように、本発明例は、メ
ッキの剥離本数および膨れ本数が比較例に比べて著しく
少なく、Ａｇメッキ層の密着性に優れていることが分か
る。これは、本発明では、純銅素線にＳｎをメッキを被
覆して伸線加工したために純銅極細線に傷が付いたり、
異物が混入したりしなかったためである。As is evident from Table 4, the number of stripped and swelled platings of the present invention was significantly smaller than that of the comparative example, and the adhesion of the Ag plating layer was excellent. This is because, in the present invention, pure copper bare wire is coated with Sn plating and wire-drawing is performed, so that pure copper extra fine wire is damaged,
This is because foreign matter did not enter.
【００４０】（実施例４）実施例２で製造したＮｏ．９
の極細線（表３参照）にポリウレタン系のエナメルを塗
布し、これを５００℃で１分間焼き付けて被覆し、エナ
メル被覆層に発生した膨れの個数を調べた。比較のた
め、従来法により製造した線径１５μｍの極細線（表３
のＮｏ．１２）についても同じ調査を行った。各９ロッ
トづつ調査し、１ｍあたりの膨れ個数を表５に示した。(Example 4) 9
(See Table 3) was coated with a polyurethane-based enamel, which was baked at 500 ° C. for 1 minute to coat, and the number of blisters generated in the enamel coating layer was examined. For comparison, a very fine wire having a wire diameter of 15 μm manufactured by the conventional method (Table 3)
No. The same survey was conducted for 12). Each 9 lots were examined, and the number of blisters per meter was shown in Table 5.
【００４１】[0041]
【表５】 [Table 5]
【００４２】表５から明らかなように、本発明例のエナ
メル被覆線は、比較例に較べて膨れ個数が極めて少なか
った。捻回試験によりエナメル被覆層の密着性を調べた
が、本発明例の方が、比較例より密着性が極めて優れて
いた。これは、本発明では、純銅素線にＳｎをメッキを
被覆して伸線加工したために純銅極細線に傷が付いた
り、異物が混入したりしなかったためである。As is evident from Table 5, the enamel-coated wire of the present invention had a very small number of blisters as compared with the comparative example. The adhesion of the enamel coating layer was examined by a twist test. The adhesion of the present invention example was much better than that of the comparative example. This is because, in the present invention, pure copper bare wire was coated with Sn and plated and drawn, so that the pure copper ultrafine wire was not damaged or foreign matter was not mixed.
【００４３】[0043]
【発明の効果】以上に述べたように、本発明では、導電
性金属素線に金属Ａまたは樹脂Ａを層状に被覆して縮径
加工するので、導電性金属素線に表面傷が生じたり異物
が混入したりし難く、前記被覆層を除去して得られる極
細線は高品質なものとなる。またこの高品質の極細線に
金属Ｂまたは樹脂Ｂを被覆した被覆極細線には被覆層に
膨れなどの不具合が生じ難い。前記極細線の製造工程と
金属Ｂまたは樹脂Ｂの被覆工程とを連続して施すことに
よりボビン運搬などで発生する取扱い傷がなくなり極細
線の表面品質が一層向上する。依って、工業上顕著な効
果を奏する。As described above, according to the present invention, since the conductive metal strand is coated with the metal A or the resin A in a layered form and the diameter thereof is reduced, the conductive metal strand may have surface scratches. The extra fine line obtained by removing the coating layer is less likely to be contaminated with foreign matter and has a high quality. In addition, a defect such as swelling of the coating layer hardly occurs in the coated ultrafine wire in which the metal B or the resin B is coated on the high quality ultrafine wire. By continuously performing the manufacturing process of the ultrafine wire and the coating process of the metal B or the resin B, handling scratches generated during bobbin transportation and the like are eliminated, and the surface quality of the ultrafine wire is further improved. Therefore, an industrially remarkable effect is achieved.
【図１】請求項３記載発明の被覆極細線の製造方法の実
施形態を示す工程説明図である。FIG. 1 is a process explanatory view showing an embodiment of a method for producing a coated ultrafine wire according to the present invention.
【図２】請求項３記載発明の被覆極細線の製造方法の他
の実施形態を示す工程説明図である。FIG. 2 is a process explanatory view showing another embodiment of the method for producing a coated ultrafine wire according to the third aspect of the present invention.
１ サプライ ２ 導電性金属素線 ３ 導電性金属素線用電気メッキ槽 ４ 金属Ａを被覆した被覆素線 ５ キャプスタン型連続伸線機 ６ 電解槽 ７ 極細線 ８ 極細線用電気メッキ槽 ９ 金属Ｂを被覆した被覆極細線 １０ ボビン １１ 樹脂被覆槽 １２ 樹脂Ａを被覆した被覆素線 １３ 樹脂Ａを除去するための加熱炉 １４ エナメル塗布槽 １５ エナメル焼付け炉 １６ エナメルを被覆した被覆極細線 １７ ガイドロール １８ 給電ロール REFERENCE SIGNS LIST 1 supply 2 conductive metal wire 3 electroplating bath for conductive metal wire 4 coated wire coated with metal A 5 capstan type continuous wire drawing machine 6 electrolytic bath 7 extra fine wire 8 electroplating bath for extra fine wire 9 metal Coated ultrafine wire coated with B 10 Bobbin 11 Resin coating tank 12 Coated strand coated with resin A 13 Heating furnace for removing resin A 14 Enamel coating tank 15 Enamel baking furnace 16 Coated extrafine wire coated with enamel 17 Guide Roll 18 Power supply roll
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ２３Ｃ 26/00 Ｃ２３Ｃ 26/00 Ａ Ｃ２５Ｄ 7/06 Ｃ２５Ｄ 7/06 Ｕ Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) C23C 26/00 C23C 26/00 A C25D 7/06 C25D 7/06 U
Claims (3)
前記導電性金属素線の線径の１〜１００％の厚さに層状
に被覆する工程、前記被覆素線を縮径加工する工程、前
記縮径加工後の被覆素線の被覆層を除去して極細線とす
る工程をこの順に施すことを特徴とする極細線の製造方
法。1. A step of coating a conductive metal strand with metal A or resin A in a thickness of 1 to 100% of the wire diameter of the conductive metal strand, and reducing the diameter of the coated strand. And a step of removing the coating layer of the covered wire after the diameter reduction to form a very fine wire in this order.
脂Ｂを層状に被覆することを特徴とする被覆極細線の製
造方法。2. A method for producing a coated ultrafine wire, comprising coating the ultrafine wire according to claim 1 with a layer of metal B or resin B.
前記導電性金属素線の線径の１〜１００％の厚さに層状
に被覆する工程、前記被覆素線を縮径加工する工程、前
記縮径加工後の被覆素線の被覆層を除去する工程、前記
被覆層を除去した素線（極細線）に金属Ｂまたは樹脂Ｂ
を層状に被覆する工程をこの順に連続して施すことを特
徴とする被覆極細線の製造方法。3. A step of coating the conductive metal strand with metal A or resin A in a thickness of 1 to 100% of the diameter of the conductive metal strand, and reducing the diameter of the coated strand. A step of removing the covering layer of the covered wire after the diameter reduction processing, and applying a metal B or resin B to the wire (ultrafine wire) from which the covering layer has been removed.
Characterized in that the step of coating in a layered manner is continuously performed in this order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001002966A JP2002208323A (en) | 2001-01-10 | 2001-01-10 | Manufacturing method of very thin wire or coated very thin wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001002966A JP2002208323A (en) | 2001-01-10 | 2001-01-10 | Manufacturing method of very thin wire or coated very thin wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002208323A true JP2002208323A (en) | 2002-07-26 |
Family
ID=18871380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001002966A Pending JP2002208323A (en) | 2001-01-10 | 2001-01-10 | Manufacturing method of very thin wire or coated very thin wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002208323A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010046712A (en) * | 2008-07-23 | 2010-03-04 | Bridgestone Corp | Method of manufacturing steel wire |
| EP2343956A1 (en) | 2002-07-17 | 2011-07-13 | NGK Spark Plug Co., Ltd. | Copper paste and wiring board using the same |
-
2001
- 2001-01-10 JP JP2001002966A patent/JP2002208323A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2343956A1 (en) | 2002-07-17 | 2011-07-13 | NGK Spark Plug Co., Ltd. | Copper paste and wiring board using the same |
| JP2010046712A (en) * | 2008-07-23 | 2010-03-04 | Bridgestone Corp | Method of manufacturing steel wire |
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