JP2002140935A - Extrafine wire and its manufacturing method, metal plated extrafine wire and its manufacturing method, and resin coated extrafine wire and its manufacturing method - Google Patents
Extrafine wire and its manufacturing method, metal plated extrafine wire and its manufacturing method, and resin coated extrafine wire and its manufacturing methodInfo
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- JP2002140935A JP2002140935A JP2000336622A JP2000336622A JP2002140935A JP 2002140935 A JP2002140935 A JP 2002140935A JP 2000336622 A JP2000336622 A JP 2000336622A JP 2000336622 A JP2000336622 A JP 2000336622A JP 2002140935 A JP2002140935 A JP 2002140935A
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、表面品質に優れ、
電気・電子機器配線などに適した極細線、前記極細線に
金属をメッキした金属メッキ極細線、前記極細線に樹脂
を被覆した樹脂被覆極細線、前記極細線の製造方法、前
記金属メッキ線の製造方法、および前記樹脂被覆極細線
の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention
Ultra-fine wire suitable for electrical / electronic equipment wiring, metal-plated ultra-fine wire obtained by plating metal on the ultra-fine wire, resin-coated ultra-fine wire coated with resin on the ultra-fine wire, method for producing the ultra-fine wire, production of the metal-plated wire The present invention relates to a manufacturing method and a method for manufacturing the resin-coated ultrafine wire.
【０００２】[0002]
【従来の技術】従来、電気・電子機器配線やコイルなど
にはキャプスタン型連続伸線機により線径２０μｍ程度
に伸線された銅またはアルミニウム極細線が使用されて
いる。前記キャプスタン型連続伸線機には複数のダイス
が装備され、導電性素線は各ダイス毎に断面縮小率１０
〜２５％の伸線加工が施されて極細線に加工されコイラ
ーに巻取られる。そして前記極細線は、前記伸線機とは
別に設けられたメッキラインまたは樹脂被覆ラインを通
して金属メッキ極細線または樹脂被覆極細線に加工され
る。2. Description of the Related Art Conventionally, copper or aluminum ultrafine wires drawn to a wire diameter of about 20 .mu.m by a capstan type continuous wire drawing machine have been used for wiring and coils of electric and electronic equipment. The capstan-type continuous wire drawing machine is equipped with a plurality of dies, and the conductive strands have a sectional reduction ratio of 10 per die.
２５25% wire drawing is performed, processed into a very fine wire, and wound around a coiler. The ultrafine wire is processed into a metal-plated ultrafine wire or a resin-coated ultrafine wire through a plating line or a resin-coated line provided separately from the wire drawing machine.
【０００３】近年、携帯電話など電気・電子機器の小型
化に伴い１０〜１５μｍまたは更に細い線径の極細線の
ニーズが高まってきた。しかしこのような極細線を前記
キャプスタン型連続伸線機で伸線加工すると、素線はそ
のときの引抜張力に耐えられず断線することが多い。断
線は異物の混入や素線の表面傷が原因で発生するが、実
用上問題のない微細な異物や傷であっても断線の原因に
なることがある。In recent years, with the miniaturization of electric and electronic devices such as mobile phones, the need for ultra-fine wires having a diameter of 10 to 15 μm or smaller has increased. However, when such an ultrafine wire is drawn by the capstan-type continuous drawing machine, the element wire often fails to withstand the pulling tension at that time and breaks. The disconnection is caused by the incorporation of foreign matter or the surface flaw of the element wire. However, even a fine foreign matter or flaw having no practical problem may cause disconnection.
【０００４】[0004]
【発明が解決しようとする課題】このような製造時の断
線を防止するために、引抜張力、潤滑油、ダイス形状な
どについて検討され、さらに材料の機械的性質の改善や
伸線工程の途中に「皮むき処理」を行って異物や表面傷
を除去する方法が検討されているが、いずれの方法も十
分な効果を得るには至っていない。一方、表面に露出し
た異物は金属メッキ層の密着性を低下させ、また表面傷
は樹脂被覆層の密着性の低下や膨れなどの原因になると
いった問題がある。In order to prevent such disconnection during manufacturing, drawing tension, lubricating oil, die shape, and the like have been studied. Methods for removing foreign matter and surface flaws by performing "peeling treatment" have been studied, but none of these methods has achieved a sufficient effect. On the other hand, there is a problem that the foreign matter exposed on the surface lowers the adhesion of the metal plating layer, and the surface flaw causes a decrease in the adhesion of the resin coating layer and swelling.
【０００５】本発明の目的は、表面品質に優れ、電気・
電子機器配線に適した極細線、前記極細線に金属をメッ
キした金属メッキ極細線、前記極細線に樹脂を被覆した
樹脂被覆極細線、前記極細線の製造方法、前記金属メッ
キ線の製造方法、および前記樹脂被覆極細線の製造方法
を提供することにある。It is an object of the present invention to provide an excellent surface quality,
Ultrafine wire suitable for electronic equipment wiring, metal-plated ultrafine wire plated with metal on the ultrafine wire, resin-coated ultrafine wire coated with resin on the ultrafine wire, method for manufacturing the ultrafine wire, method for manufacturing the metal-plated wire, And a method for producing the resin-coated ultrafine wire.
【０００６】[0006]
【課題を解決するための手段】請求項１記載の発明は、
伸線機により伸線加工された導電性素線が化学溶解また
は電気化学溶解により縮径されていることを特徴とする
極細線である。According to the first aspect of the present invention,
An ultrafine wire characterized in that the conductive element wire drawn by a wire drawing machine is reduced in diameter by chemical dissolution or electrochemical dissolution.
【０００７】請求項２記載の発明は、請求項１記載の極
細線に金属がメッキされていることを特徴とする金属メ
ッキ極細線である。According to a second aspect of the present invention, there is provided a metal-plated ultrafine wire wherein the ultrafine wire according to the first aspect is plated with a metal.
【０００８】請求項３記載の発明は、請求項１記載の極
細線に樹脂が被覆されていることを特徴とする樹脂被覆
極細線である。According to a third aspect of the present invention, there is provided a resin-coated ultrafine wire, wherein the ultrafine wire according to the first aspect is coated with a resin.
【０００９】請求項４記載の発明は、伸線機により伸線
加工された導電性素線を化学溶解または電気化学溶解に
より縮径することを特徴とする極細線の製造方法であ
る。A fourth aspect of the present invention is a method for manufacturing an ultrafine wire, comprising reducing the diameter of a conductive wire drawn by a wire drawing machine by chemical melting or electrochemical melting.
【００１０】請求項５記載の発明は、伸線機により伸線
加工された導電性素線を化学溶解または電気化学溶解に
より縮径して極細線とする工程、前記極細線に金属をメ
ッキする工程を連続して施すことを特徴とする金属メッ
キ極細線の製造方法である。According to a fifth aspect of the present invention, a step of reducing the diameter of a conductive wire drawn by a wire drawing machine by chemical melting or electrochemical melting to form an ultrafine wire, and plating the ultrafine wire with metal. A method for producing a metal-plated ultrafine wire, wherein the steps are continuously performed.
【００１１】請求項６記載の発明は、伸線機により伸線
加工された導電性素線を化学溶解または電気化学溶解に
より縮径して極細線とする工程、前記極細線に樹脂を被
覆する工程を連続して施すことを特徴とする樹脂被覆極
細線の製造方法である。According to a sixth aspect of the present invention, there is provided a step of reducing the diameter of a conductive wire drawn by a wire drawing machine by chemical melting or electrochemical melting to form an ultrafine wire, and coating the ultrafine wire with a resin. A method for producing a resin-coated ultrafine wire, characterized by continuously performing steps.
【００１２】請求項１記載の発明は、伸線機により伸線
加工された導電性素線を、化学溶解または電気化学溶解
により所要径に縮径した極細線である。この極細線は溶
解により縮径するため、導電性素線の伸線加工傷が溶解
除去され、また縮径中に傷が発生するようなことがな
く、高品質である。さらにこの極細線は製造中大きな張
力が掛からないため断線が起き難い。前記導電性素線に
は任意の導電性材料が使用されるが、特に純銅、銅合
金、純アルミニウム、アルミニウム合金などが加工性に
優れ、また低コストであり好適である。前記導電性素線
の線径は１５〜１００μｍが好ましく、１５μｍ未満で
は伸線加工工程中に、後の溶解による縮径で十分に除去
し得ない深さの表面傷が発生する恐れがあり、１００μ
ｍを超えると溶解による縮径にコストが掛かるようにな
る。The first aspect of the present invention is an ultrafine wire obtained by reducing a conductive wire drawn by a wire drawing machine to a required diameter by chemical melting or electrochemical melting. The diameter of the ultrafine wire is reduced by melting, so that the wire processing flaw of the conductive element wire is dissolved and removed, and no damage is generated during the diameter reduction, resulting in high quality. Further, since the extra fine wire does not receive a large tension during the production, the wire is hardly broken. Although any conductive material is used for the conductive element wire, pure copper, copper alloy, pure aluminum, aluminum alloy and the like are particularly excellent in workability and low in cost and are suitable. The wire diameter of the conductive element wire is preferably 15 to 100 μm, and if it is less than 15 μm, a surface flaw having a depth that cannot be sufficiently removed due to a reduction in diameter due to subsequent melting may occur during the wire drawing process, 100μ
If it exceeds m, cost will be required for diameter reduction by melting.
【００１３】前記化学溶解または電気化学溶解には通常
の酸性液またはアルカリ性液が使用される。即ち、銅ま
たは銅合金素線を化学溶解する場合は、塩酸、硫酸、り
ん酸、硝酸系酸性液または水酸化ナトリウム、水酸化カ
リウム系アルカリ性液などが使用される。また電気化学
溶解する場合は、塩酸、硫酸、りん酸、硝酸系酸性液ま
たはシアン化カリウム、シアン化ナトリウム、水酸化ナ
トリウム、水酸化カリウム系アルカリ性液などが使用さ
れる。また、アルミニウムまたはアルミニウム合金を化
学溶解または電気化学溶解する場合は、塩酸、硫酸、り
ん酸、硝酸系酸性液または水酸化ナトリウム、水酸化カ
リウム系アルカリ性液などが使用される。For the chemical dissolution or the electrochemical dissolution, a usual acidic solution or alkaline solution is used. That is, when chemically dissolving copper or copper alloy strands, hydrochloric acid, sulfuric acid, phosphoric acid, nitric acid-based acid solution, sodium hydroxide, potassium hydroxide-based alkaline solution and the like are used. In the case of electrochemical dissolution, hydrochloric acid, sulfuric acid, phosphoric acid, nitric acid-based acidic solution, potassium cyanide, sodium cyanide, sodium hydroxide, potassium hydroxide-based alkaline solution, and the like are used. When aluminum or an aluminum alloy is chemically or electrochemically dissolved, hydrochloric acid, sulfuric acid, phosphoric acid, a nitric acid-based acid solution or a sodium hydroxide or potassium hydroxide-based alkaline solution is used.
【００１４】本発明において、溶解による線径減少速度
は０．１〜２０μｍ／分が好ましく、０．１μｍ／分未
満では所要線径を得るのに長時間を要するため溶解設備
が長大になり設備費が高くなる。また２０μｍ／分を超
えると溶解が急激に進むため外観形状が不均一になる。
この場合は、溶解による縮径後に断面減少率１０％以下
のスキンパスを施して表面性状を整えるのが良い。溶解
液の濃度は、目的とする線径減少速度に応じて調整す
る。一般には５％〜３０％の範囲が好ましい。溶解の均
一性または溶解後の線材表面の平滑性を良好にするため
に溶解液に界面活性剤を添加しても良い。In the present invention, the rate of reduction of the wire diameter by melting is preferably 0.1 to 20 μm / min. Costs will be higher. If it exceeds 20 μm / min, the dissolution proceeds rapidly, resulting in an uneven appearance.
In this case, it is preferable to apply a skin pass having a cross-sectional reduction rate of 10% or less after reducing the diameter by melting to adjust the surface properties. The concentration of the lysis solution is adjusted according to the target wire diameter reduction speed. Generally, a range of 5% to 30% is preferable. A surfactant may be added to the dissolution solution in order to improve the uniformity of dissolution or the smoothness of the surface of the wire after dissolution.
【００１５】電気化学溶解における電流密度も、目的と
する線径減少速度に応じて調整するが、一般には２Ａ／
ｄｍ2 〜５０Ａ／ｄｍ2 の範囲が好ましい。使用後の酸
性液などは電解などにより金属分を回収して廃液を最小
量に抑えるのが好ましい。The current density in the electrochemical dissolution is also adjusted according to the desired wire diameter reduction rate, but is generally 2 A / A.
The range of dm 2 to 50 A / dm 2 is preferred. It is preferable to recover the metal content of the used acid solution or the like by electrolysis or the like to minimize the waste liquid.
【００１６】上述のようにして製造される極細線は、通
常、金属メッキが施されて、ハンダ付性、導電性、耐食
性などが改善される。メッキ金属としては錫、金、銀、
ニッケル、パラジウム、またはこれらの合金などの通常
のメッキ金属が適用できる。また前記極細線は、樹脂被
覆が施されて、絶縁性が付与され、また耐食性が改善さ
れる。前記樹脂には、エナメルの他、熱可塑性樹脂のポ
リエチレン、ポリスチレン、ポリ塩化ビニル、ポリアミ
ドなどが適用される。The ultrafine wire manufactured as described above is usually plated with metal to improve solderability, conductivity, corrosion resistance, and the like. Tin, gold, silver,
Normal plating metals such as nickel, palladium, or alloys thereof can be applied. In addition, the ultrafine wire is coated with a resin, thereby imparting insulation and improving corrosion resistance. As the resin, besides enamel, thermoplastic resins such as polyethylene, polystyrene, polyvinyl chloride, and polyamide are applied.
【００１７】本発明では、化学溶解または電気化学溶解
による縮径工程と、金属メッキまたは樹脂被覆工程は中
断することなく連続して行う。このように両工程を連続
して行う理由は、前記縮径工程後の極細線をコイラーに
巻取り、これを別ラインに搬送してから金属メッキまた
は樹脂被覆を施すと、搬送時に傷が付いて、高品質の金
属メッキ極細線或いは樹脂被覆極細線が得難くなるため
である。In the present invention, the diameter reducing step by chemical dissolution or electrochemical dissolution and the metal plating or resin coating step are performed continuously without interruption. The reason for performing both steps continuously in this way is that the extra-fine wire after the diameter reduction step is wound on a coiler, transported to another line, and then coated with metal plating or resin. This is because it is difficult to obtain a high-quality metal-plated ultrafine wire or resin-coated ultrafine wire.
【００１８】以下に本発明の金属メッキ極細線の製造方
法を図により具体的に説明する。図１は本発明の金属メ
ッキ極細線の製造方法の実施形態を示す工程説明図であ
る。なお、実施形態を説明するための全図において、同
一機能を有するものは同一符号を付け、その繰り返しの
説明は省略する。ここでは、電気化学溶解による縮径工
程と金属メッキ工程とが同一ラインに組込まれている。
すなわち、リコイラー１から繰り出される導電性素線２
に、脱脂槽３での脱脂、（水洗）、電気化学溶解槽４で
の表層溶解の各処理を施して極細線５とし（以上溶解に
よる縮径工程）、引き続き、極細線５に脱脂槽６での脱
脂、（水洗）、酸洗槽７での洗浄、（水洗）、メッキ槽
８での金属メッキ、水洗槽９および湯洗槽１０での洗
浄、乾燥器１１での乾燥の各処理を施して金属メッキ極
細線１２とし（以上金属メッキ工程）、これをコイラー
１３に巻取る。図１で１４は電気化学溶解による縮径ま
たはメッキのための給電ロール、１５はガイドロールで
ある。なお、図１では水洗槽を省略したところもある。Hereinafter, the method for producing a metal-plated ultrafine wire of the present invention will be specifically described with reference to the drawings. FIG. 1 is a process explanatory view showing an embodiment of the method for producing a metal-plated ultrafine wire according to the present invention. In all the drawings for describing the embodiments, components having the same function are denoted by the same reference numerals, and a repeated description thereof will be omitted. Here, the diameter reduction step by electrochemical dissolution and the metal plating step are incorporated in the same line.
That is, the conductive wire 2 fed from the recoiler 1
Then, each treatment of degreasing in the degreasing tank 3 (washing with water) and dissolution of the surface layer in the electrochemical dissolving tank 4 is performed to obtain an ultrafine wire 5 (above-described diameter reduction step by dissolution). Dewatering, (washing), washing in the pickling tank 7, (washing), metal plating in the plating tank 8, washing in the washing tank 9 and the hot water tank 10, and drying in the dryer 11. Then, the metal-plated ultrafine wire 12 is formed (the above-described metal-plating step), and the wire is wound around a coiler 13. In FIG. 1, 14 is a power supply roll for reducing the diameter or plating by electrochemical dissolution, and 15 is a guide roll. In FIG. 1, the washing tank is omitted in some cases.
【００１９】次に本発明の樹脂被覆極細線の製造方法を
図により具体的に説明する。図２は本発明の樹脂被覆極
細線の製造方法の実施形態を示す工程説明図である。こ
の製造方法は、図１に示した金属メッキ工程を樹脂被覆
工程に置き換えたもので、ここでは、溶解により縮径さ
れた極細線５は、引き続き樹脂塗布槽１６にて樹脂を塗
布し、前記樹脂は次の焼付炉１７で焼付けて樹脂被覆極
細線１８に加工する。Next, the method for producing a resin-coated ultrafine wire of the present invention will be specifically described with reference to the drawings. FIG. 2 is a process explanatory view showing an embodiment of the method for producing a resin-coated ultrafine wire according to the present invention. In this manufacturing method, the metal plating step shown in FIG. 1 is replaced with a resin coating step. Here, the ultrafine wire 5 reduced in diameter by melting is coated with a resin in a resin coating tank 16, The resin is baked in a baking furnace 17 to be processed into a resin-coated ultrafine wire 18.
【００２０】本発明では、このように、溶解による縮径
工程と金属メッキ工程、または溶解による縮径工程と樹
脂被覆工程を同一ラインで連続して行うので、表面品質
良好な金属メッキ極細線または樹脂被覆極細線が得られ
る。In the present invention, since the step of reducing the diameter by melting and the step of plating the metal or the step of reducing the diameter by melting and the step of coating the resin are successively performed on the same line, the metal-coated ultrafine wire having a good surface quality or A resin-coated ultrafine wire is obtained.
【００２１】[0021]
【実施例】以下に、本発明を実施例により詳細に説明す
る。 （実施例１）キャプスタン型連続伸線機により線径２０
μｍまで伸線加工した銅素線を、電気化学溶解により線
径１４μｍの極細線に縮径した。前記電気化学溶解は、
伸線加工した銅素線を電解脱脂し、次いで温度３０℃、
濃度５０ｇ／リットルの硫酸を貯留した長さ２．５ｍの
電解槽中を８０ｃｍ／分の速度で通過させて行った。こ
こで、平均電流密度は５Ａ／ｄｍ2 に設定した。この溶
解による縮径を繰り返して（４ロット）断線回数を調べ
た。結果を表１に示す。The present invention will be described below in detail with reference to examples. (Example 1) A wire diameter of 20 using a capstan type continuous drawing machine.
The copper wire drawn to μm was reduced to an ultrafine wire having a diameter of 14 μm by electrochemical dissolution. The electrochemical dissolution is
The drawn copper strand is electrolytically degreased, and then at a temperature of 30 ° C.
It was passed at a speed of 80 cm / min through a 2.5 m long electrolytic cell storing sulfuric acid having a concentration of 50 g / l. Here, the average current density was set to 5 A / dm 2 . The diameter reduction by this dissolution was repeated (4 lots), and the number of disconnections was examined. Table 1 shows the results.
【００２２】（比較例１）実施例１で用いたのと同じ線
径２０μｍの銅素線をさらに１４μｍまで伸線機により
伸線加工した。前記伸線加工を繰り返して（４ロット）
断線回数を調べた。結果を表１に併記した。Comparative Example 1 The same copper wire having a wire diameter of 20 μm as used in Example 1 was further drawn to 14 μm by a wire drawing machine. Repeat the wire drawing process (4 lots)
The number of disconnections was examined. The results are shown in Table 1.
【００２３】[0023]
【表１】 [Table 1]
【００２４】表１から明らかなように、本発明例の断線
回数はロットあたり平均０．２５回／１ｋｇで比較例の
６回に比べて著しく少なかった。これは、本発明例の極
細線は溶解により縮径したためで、伸線加工での傷が溶
解除去され、縮径中傷が生じるようなことがなく、さら
に縮径中には伸線加工におけるような大きな張力が掛か
らなかったためである。As is evident from Table 1, the number of disconnections in the examples of the present invention was 0.25 times / lot on average per lot, which was remarkably less than that in the comparative example. This is because the ultra-fine wire of the present invention was reduced in diameter by melting, the flaw in the wire drawing process was dissolved and removed, and there was no likelihood of diameter reduction mess. This is because no large tension was applied.
【００２５】（実施例２）キャプスタン型連続伸線機に
より線径２０μｍまで伸線加工した銅素線を図１に示し
た製造方法の電気化学溶解工程により線径１４μｍの極
細線に縮径し、引き続き金属メッキ工程により銀を２μ
ｍ厚さにメッキした。前記電気化学溶解は、伸線加工し
た銅素線を電解脱脂し、次いで温度３０℃、濃度５０ｇ
／リットルの硫酸を貯留した長さ５ｍの電解槽中に８０
ｃｍ／分の速度で通過させて行った。ここで平均電流密
度は２．５Ａ／ｄｍ2 に設定した。この縮径・メッキ工
程を繰返して９ロットの銀メッキ極細線を得た。Example 2 A copper wire drawn to a wire diameter of 20 μm by a capstan-type continuous wire drawing machine was reduced to an ultra-fine wire having a wire diameter of 14 μm by an electrochemical melting step of the manufacturing method shown in FIG. Then, 2μ of silver is applied by a metal plating process.
m thickness. In the electrochemical dissolution, the drawn copper wire is electrolytically degreased, and then the temperature is 30 ° C. and the concentration is 50 g.
Per liter of sulfuric acid stored in a 5 m long electrolytic cell.
Passing was performed at a speed of cm / min. Here, the average current density was set to 2.5 A / dm 2 . This diameter reduction / plating process was repeated to obtain 9 lots of ultra-fine silver-plated wires.
【００２６】（比較例２）キャプスタン型連続伸線機に
より伸線加工した線径１４μｍの極細線を、メッキライ
ンに搬送して、前記極細線に銀を２μｍ厚さにメッキし
た。このメッキ処理を繰返して９ロットの銀メッキ極細
線を得た。(Comparative Example 2) An ultrafine wire having a wire diameter of 14 µm drawn by a capstan-type continuous drawing machine was conveyed to a plating line, and the fine wire was plated with silver to a thickness of 2 µm. This plating process was repeated to obtain 9 lots of ultrafine silver-plated wires.
【００２７】実施例２および比較例２で得た各々の銀メ
ッキ極細線について、銀メッキ層の密着性を下記２方法
により調べた。第１の方法は前記銀メッキ極細線を長さ
２００ｍｍに切断し、これを１ロットあたり３本づつ捻
回試験してメッキ層が剥離した本数を数えた。第２の方
法は前記銀メッキ極細線を長さ１ｍに切断し、これを３
００℃で１０分間加熱し、メッキ層の膨れ発生個数を数
えた。結果を表２に示す。With respect to each of the ultrafine silver-plated wires obtained in Example 2 and Comparative Example 2, the adhesion of the silver plating layer was examined by the following two methods. In the first method, the silver-plated ultrafine wire was cut into a length of 200 mm, and the three pieces were subjected to a twist test per lot to count the number of peeled plating layers. The second method is to cut the silver-plated ultrafine wire to a length of 1 m,
After heating at 00 ° C. for 10 minutes, the number of blisters generated in the plating layer was counted. Table 2 shows the results.
【００２８】（実施例３）キャプスタン型連続伸線機に
より線径２０μｍまで伸線加工した銅素線を図２に示し
た製造方法の電気化学溶解工程により線径１４μｍの極
細線に縮径し、引き続き樹脂被覆工程で、樹脂としてポ
リウレタン系のエナメルを塗布し、これを５００℃で１
分間加熱して焼付けた。このエナメル被覆処理を繰返し
て９ロットのエナメル被覆極細線を得た。Example 3 A copper wire drawn to a wire diameter of 20 μm by a capstan-type continuous wire drawing machine was reduced to an ultra-fine wire having a wire diameter of 14 μm by an electrochemical melting step of the manufacturing method shown in FIG. Subsequently, in a resin coating step, a polyurethane-based enamel was applied as a resin, and this was applied at 500 ° C. for 1 hour.
Bake by heating for minutes. This enamel coating treatment was repeated to obtain 9 lots of enameled ultrafine wires.
【００２９】（比較例３）キャプスタン型連続伸線機に
より伸線加工した線径１４μｍの極細線を樹脂被覆ライ
ンに搬送して、前記極細線に樹脂としてポリウレタン系
のエナメルを塗布し、これを５００℃で１分間加熱して
焼付けた。このエナメル被覆処理を繰返して９ロットの
エナメル被覆極細線を得た。(Comparative Example 3) An ultrafine wire having a wire diameter of 14 µm drawn by a capstan-type continuous drawing machine was conveyed to a resin coating line, and a polyurethane-based enamel was applied as a resin to the ultrafine wire. Was baked by heating at 500 ° C. for 1 minute. This enamel coating treatment was repeated to obtain 9 lots of enameled ultrafine wires.
【００３０】実施例３および比較例３で得た各々のエナ
メル被覆線について膨れ発生個数を数えた。結果を表２
に併記する。The number of blisters generated in each of the enamel-coated wires obtained in Example 3 and Comparative Example 3 was counted. Table 2 shows the results
It is described together.
【００３１】[0031]
【表２】 [Table 2]
【００３２】表２から明らかなように、本発明例では、
銀メッキ層の剥離本数（平均値）が０．１１本、膨れ発
生個数（平均値）が０．１１個、エナメル被覆の膨れ発
生個数（平均値）が０．２２個でいずれも少なかった。
これは本発明例の極細線が表面品質に優れたためと、搬
送による傷が付かなかったためである。これに対し、比
較例では、各平均値がそれぞれ１．２２本、１．６７
個、１．４４個で多かった。これは搬送時に付いた傷が
原因である。As is apparent from Table 2, in the present invention,
The number of peeled silver plating layers (average value) was 0.11, the number of blisters generated (average value) was 0.11, and the number of blisters generated in the enamel coating (average value) was 0.22.
This is because the ultrafine wire of the example of the present invention was excellent in surface quality and was not damaged by transport. On the other hand, in the comparative example, each average value is 1.22 lines, 1.67, respectively.
The number was 1.44. This is due to scratches during transport.
【００３３】以上、電気化学溶解により縮径する場合に
ついて説明したが、化学溶解により縮径しても同様の効
果が得られることは、別途行った実験により確認した。The case where the diameter is reduced by electrochemical dissolution has been described above, but it was confirmed by a separately conducted experiment that the same effect could be obtained even if the diameter was reduced by chemical dissolution.
【００３４】[0034]
【発明の効果】以上に述べたように、本発明の極細線
は、伸線加工された導電性素線を化学溶解または電気化
学溶解により縮径したものなので表面品質に優れる。本
発明の金属メッキ極細線または樹脂被覆極細線は、前記
表面品質に優れる極細線に金属をメッキしまたは樹脂を
被覆したものなので膨れなどの欠陥が生じ難い。前記極
細線は通常の溶解液を用いて容易に長尺品が製造でき
る。前記金属メッキ極細線は前記極細線の製造後に連続
して金属メッキすることにより、また前記樹脂被覆極細
線は前記極細線の製造後に連続して樹脂被覆することに
より高品質にかつ生産性良く製造できる。依って、工業
上顕著な効果を奏する。As described above, the ultrafine wire of the present invention is excellent in surface quality because the drawn conductive element wire is reduced in diameter by chemical dissolution or electrochemical dissolution. Since the metal-plated ultrafine wire or resin-coated ultrafine wire of the present invention is obtained by plating a metal or coating a resin on the ultrafine wire having excellent surface quality, defects such as swelling hardly occur. The ultrafine wire can be easily manufactured into a long product by using a normal solution. The metal-plated ultrafine wire is manufactured with high quality and high productivity by continuously performing metal plating after manufacturing the ultrafine wire, and the resin-coated ultrafine wire is continuously coated with resin after manufacturing the ultrafine wire. it can. Therefore, an industrially remarkable effect is achieved.
【図１】本発明の金属メッキ極細線の製造方法の実施形
態を示す工程説明図である。FIG. 1 is a process explanatory view showing an embodiment of a method for producing a metal-plated ultrafine wire according to the present invention.
【図２】本発明の樹脂被覆極細線の製造方法の実施形態
を示す工程説明図である。FIG. 2 is a process explanatory view showing an embodiment of the method for producing a resin-coated ultrafine wire according to the present invention.
１ リコイラー ２ 導電性素線 ３ 脱脂槽 ４ 電気化学溶解槽 ５ 極細線 ６ 脱脂槽 ７ 酸洗槽 ８ メッキ槽 ９ 水洗槽 １０ 湯洗槽 １１ 乾燥器 １２ 金属メッキ極細線 １３ コイラー １４ 給電ロール １５ ガイドロール １６ 樹脂塗布槽 １７ 焼付炉 １８ 樹脂被覆極細線 DESCRIPTION OF SYMBOLS 1 Recoiler 2 Conductive element wire 3 Degreasing tank 4 Electrochemical melting tank 5 Extra fine wire 6 Degreasing tank 7 Pickling tank 8 Plating tank 9 Rinse tank 10 Hot water tank 11 Dryer 12 Metal plating extra fine wire 13 Coiler 14 Power supply roll 15 Guide Roll 16 Resin coating tank 17 Baking furnace 18 Resin-coated extra fine wire
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｂ 13/00 ５１７ Ｈ０１Ｂ 13/00 ５１７ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01B 13/00 517 H01B 13/00 517
Claims (6)
が化学溶解または電気化学溶解により縮径されているこ
とを特徴とする極細線。1. An ultrafine wire, wherein a diameter of a conductive wire drawn by a wire drawing machine is reduced by chemical melting or electrochemical melting.
れていることを特徴とする金属メッキ極細線。2. A metal-plated ultrafine wire, wherein the ultrafine wire according to claim 1 is plated with a metal.
ていることを特徴とする樹脂被覆極細線。3. A resin-coated ultrafine wire, wherein the ultrafine wire according to claim 1 is coated with a resin.
を化学溶解または電気化学溶解により縮径することを特
徴とする極細線の製造方法。4. A method for producing an ultrafine wire, comprising reducing the diameter of a conductive wire drawn by a wire drawing machine by chemical melting or electrochemical melting.
を化学溶解または電気化学溶解により縮径して極細線と
する工程、前記極細線に金属をメッキする工程を連続し
て施すことを特徴とする金属メッキ極細線の製造方法。5. A step of reducing the diameter of a conductive wire drawn by a wire drawing machine by chemical melting or electrochemical melting to form an ultrafine wire, and continuously plating a metal on the ultrafine wire. A method for producing a metal-plated ultrafine wire, comprising:
を化学溶解または電気化学溶解により縮径して極細線と
する工程、前記極細線に樹脂を被覆する工程を連続して
施すことを特徴とする樹脂被覆極細線の製造方法。6. A process of reducing the diameter of a conductive wire drawn by a wire drawing machine by chemical dissolution or electrochemical dissolution to form an ultrafine wire, and continuously coating the ultrafine wire with a resin. A method for producing a resin-coated ultrafine wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000336622A JP2002140935A (en) | 2000-11-02 | 2000-11-02 | Extrafine wire and its manufacturing method, metal plated extrafine wire and its manufacturing method, and resin coated extrafine wire and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000336622A JP2002140935A (en) | 2000-11-02 | 2000-11-02 | Extrafine wire and its manufacturing method, metal plated extrafine wire and its manufacturing method, and resin coated extrafine wire and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002140935A true JP2002140935A (en) | 2002-05-17 |
Family
ID=18812144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000336622A Pending JP2002140935A (en) | 2000-11-02 | 2000-11-02 | Extrafine wire and its manufacturing method, metal plated extrafine wire and its manufacturing method, and resin coated extrafine wire and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002140935A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1362727A2 (en) | 2002-05-16 | 2003-11-19 | Calsonic Kansei Corporation | Vehicular air conditioning control apparatus |
| JP2020061289A (en) * | 2018-10-11 | 2020-04-16 | 礎電線株式会社 | Enamel wire and method for producing enamel wire |
-
2000
- 2000-11-02 JP JP2000336622A patent/JP2002140935A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1362727A2 (en) | 2002-05-16 | 2003-11-19 | Calsonic Kansei Corporation | Vehicular air conditioning control apparatus |
| JP2020061289A (en) * | 2018-10-11 | 2020-04-16 | 礎電線株式会社 | Enamel wire and method for producing enamel wire |
| JP7053427B2 (en) | 2018-10-11 | 2022-04-12 | 礎電線株式会社 | Enamel wire manufacturing method |
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