JP2002159956A - Treating method for recycling liquid crystal panel as resource - Google Patents
Treating method for recycling liquid crystal panel as resourceInfo
- Publication number
- JP2002159956A JP2002159956A JP2000362216A JP2000362216A JP2002159956A JP 2002159956 A JP2002159956 A JP 2002159956A JP 2000362216 A JP2000362216 A JP 2000362216A JP 2000362216 A JP2000362216 A JP 2000362216A JP 2002159956 A JP2002159956 A JP 2002159956A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal panel
- substrate
- substrate surface
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000004064 recycling Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- 239000011521 glass Substances 0.000 claims description 17
- 239000003566 sealing material Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 229910052738 indium Inorganic materials 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000006063 cullet Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000007790 scraping Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 150000002739 metals Chemical class 0.000 abstract description 3
- 239000000565 sealant Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 30
- 239000002699 waste material Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000003723 Smelting Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は液晶パネルの再資源
化処理方法に関し、特に液晶パネルを構成する基板と、
基板に積層された膜中に含まれる金属の回収を行う液晶
パネルの再資源化処理方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal panel recycling method, and more particularly, to a substrate forming a liquid crystal panel,
The present invention relates to a liquid crystal panel recycling method for recovering a metal contained in a film laminated on a substrate.
【０００２】[0002]
【従来の技術】近年、廃棄物や地球環境問題が注目を集
め、これまでの大量生産、大量消費、大量廃棄型の経済
システムから資源循環型経済システムへの転換が社会的
に重要な課題となってきている。2. Description of the Related Art In recent years, waste and global environmental problems have attracted attention, and the shift from a mass production, mass consumption, mass disposal type economic system to a resource recycling type economic system has become an important social issue. It has become to.
【０００３】処理の優先順位を法制化した循環型社会形
成推進基本法（平成12年6月2日公布）によれば、１.廃
棄物の発生抑制（リデュース）、２.再利用（リユー
ス）、３.再資源化（マテリアルリサイクル）、４.サー
マルリサイクル、５.適性処分とされている。According to the Basic Law for Promoting the Formation of a Recycling-Oriented Society (promulgated on June 2, 2000), the priorities of treatment are legislated, 1. Reduction of waste generation (reduce), 2. Reuse (reuse), 3. Recycling (material recycling), 4. Thermal recycling, 5. Appropriate disposal.
【０００４】さらに、大型の家電であるテレビ、冷蔵
庫、洗濯機、エアコンは「家電リサイクル法」の本格施行
に向けてリサイクル義務の生じる家電メーカー各社がそ
の準備を整えつつあり、一部では実施されている。例え
ば、テレビにおいては、ＣＲＴ（Cathode Ray Tube）の
ガラスを切断して電子銃や蛍光体を除去した後、ガラス
カレットとして元のＣＲＴ用ガラスに再生使用するリサ
イクル技術がすでに実用化されつつある。[0004] Further, large-sized home appliances such as televisions, refrigerators, washing machines, and air conditioners are being prepared by home appliance manufacturers who are obliged to recycle toward the full enforcement of the Home Appliance Recycling Law, and some of them are being implemented. ing. For example, in televisions, a recycling technique of cutting glass of a CRT (Cathode Ray Tube) to remove an electron gun and a phosphor and then reusing the glass as a glass cullet for the original CRT glass has already been put into practical use.
【０００５】一方，電子機器、情報機器などの廃棄物に
含まれるテレビと同じ表示装置である液晶パネルは、ま
だ廃棄物の量が比較的少ないこともあって、処理施設で
製品とともに破砕されて、シュレッダーダストなどとと
もに埋め立て処理されたり、焼却処理後、埋め立て処理
されているのが現状である。[0005] On the other hand, a liquid crystal panel, which is the same display device as a television included in waste such as electronic equipment and information equipment, is crushed together with the product in a processing facility because the amount of waste is still relatively small. At present, they are landfilled with shredder dust and the like, or are landfilled after incineration.
【０００６】しかし、液晶パネルは省電力のみならず省
スペースに貢献できる表示装置であり、近年、パソコン
など情報機器の急激な普及に伴い急激に生産量が増大し
てきている。そして、産業廃棄物などの埋め立てスペー
スも年々減少してきており、近い将来限界がきて廃棄で
きなくなる恐れが生じている。[0006] However, the liquid crystal panel is a display device that can contribute to not only saving power but also saving space. In recent years, with the rapid spread of information devices such as personal computers, the amount of production has rapidly increased. In addition, the landfill space for industrial waste and the like is decreasing year by year, and there is a possibility that the limit will be reached in the near future and disposal will not be possible.
【０００７】資源循環型経済社会の構築のためにも、今
後生産量が増え続けると予想される液晶パネルが使用済
みとなった時に「循環資源」として回収・再利用されるこ
とが望ましいが、従来では、テレビなどの上記家電製品
に比べてリサイクルの技術検討が遅れており、液晶パネ
ルの適切なリサイクル方法が確立されていないのが実状
である。したがって、今後廃液晶パネルの増加に備えた
リサイクル技術の確立が早急に要求される。[0007] In order to build a resource-recycling economy and society, it is desirable that liquid crystal panels whose production volume is expected to continue increasing in the future be recovered and reused as "recycling resources" when they become used. In the past, the study of recycling technology has been delayed compared to the above-mentioned home appliances such as televisions, and in reality, an appropriate method of recycling liquid crystal panels has not been established. Therefore, it is urgently required to establish a recycling technology in preparation for an increase in waste liquid crystal panels.
【０００８】液晶パネルのリサイクル関連技術として
は、特開２０００−２４６１３では廃液晶パネルを４５
０〜６５０℃に加熱し液晶パネルに設けられている有機
物をガス化して除去した後、ガラスカレットをリサイク
ルする方法が開示されている。As a liquid crystal panel recycling-related technology, Japanese Patent Application Laid-Open No.
A method is disclosed in which a glass cullet is recycled after heating to 0 to 650 ° C. to gasify and remove organic substances provided in a liquid crystal panel.
【０００９】また、特開２０００−５１８２９では液晶
表示装置の廃棄物を固体熱媒体が流動している流動層内
に投入し、リサイクル可能なガラスを回収する方法が開
示されている。[0009] Japanese Patent Application Laid-Open No. 2000-51829 discloses a method in which waste of a liquid crystal display device is put into a fluidized bed in which a solid heat medium is flowing to collect recyclable glass.
【００１０】さらに、特開２０００−８４５３１では廃
液晶パネルをせん断破壊した後、約１２００℃の非鉄精
錬炉に投入しガラスを非鉄精錬炉内での鉄の除去処理に
利用する方法が開示されている。Furthermore, Japanese Patent Application Laid-Open No. 2000-84531 discloses a method in which a waste liquid crystal panel is subjected to shear fracture and then charged into a nonferrous smelting furnace at about 1200 ° C. to use glass for iron removal treatment in the nonferrous smelting furnace. I have.
【００１１】また、特開２０００−１８９９３９では液
晶ディスプレイを破砕し、高温加熱処理した後、溶剤処
理しガラスカレットなどに再資源化する方法が開示され
ている。Japanese Patent Application Laid-Open No. 2000-189939 discloses a method in which a liquid crystal display is crushed, heated at a high temperature, and then treated with a solvent to recycle the glass cullet or the like.
【００１２】[0012]
【発明が解決しようとする課題】しかし、これらの技術
は廃液晶パネル全体をまず高温処理することを特徴とし
ており、このため処理には膨大なエネルギーと大掛かり
な設備が必要となり、今後生産量が増え続けると予想さ
れる液晶パネルが使用済みとなった時にトータル的に環
境負荷が増大することが懸念される。However, these technologies are characterized in that the entire waste liquid crystal panel is first treated at a high temperature, so that the treatment requires enormous energy and large-scale equipment. There is a concern that when the liquid crystal panels, which are expected to continue to increase, become used, the environmental load will increase in total.
【００１３】また、多くの技術において主眼は液晶パネ
ルを構成するガラスのリサイクルに向けられており、液
晶パネルを構成しているその他の金属の回収は行われて
いない。Further, in many technologies, the main focus is on recycling glass constituting the liquid crystal panel, and other metals constituting the liquid crystal panel are not recovered.
【００１４】基板に積層された膜中に含まれる金属を回
収する例としては上記特開２０００−２４６１３におい
て基板表面をサンドペーパーで研磨する方法が開示され
ているが、サンドペーパーは目詰まりし易いという問題
点がある。As an example of recovering the metal contained in the film laminated on the substrate, a method of polishing the substrate surface with sandpaper is disclosed in JP-A-2000-24613, but the sandpaper is easily clogged. There is a problem.
【００１５】また、液晶パネルに含まれる金属として
は、例えばモリブデン、タンタル、チタン、アルミニュ
ウムそして透明電極のIＴＯ（Indium Tin Oxide）中の
インジュウムなどがあるが、インジュウム以外は液晶パ
ネル中の含有量が約１５０ｐｐｍ未満であり、自然鉱石
中の含有量よりも大幅に低濃度であるため、経済的にリ
サイクルは困難である。一方、インジュウムは天然にイ
ンジュウムを主原料とする鉱石が存在せず、主に亜鉛な
どの鉱石に５〜３０ｐｐｍ程度含まれているにすぎず希
少な金属であるが、液晶パネル中にはおよそ１５０〜７
００ｐｐｍ程度含まれており、これを回収し再生するこ
とは資源有効活用上価値があり、また、経済的にも有利
と考えられる。The metal contained in the liquid crystal panel includes, for example, molybdenum, tantalum, titanium, aluminum and indium in ITO (Indium Tin Oxide) of a transparent electrode. It is economically difficult to recycle because it is less than about 150 ppm, which is much lower than the content in natural ores. On the other hand, indium is a rare metal in which there is no natural ore containing indium as a main raw material and which is mainly contained in an ore such as zinc in only about 5 to 30 ppm. ~ 7
It is contained in about 00 ppm, and it is considered that recovering and regenerating this is valuable for effective use of resources and is economically advantageous.
【００１６】本発明はこのような点に鑑みてなされたも
のであり、大掛かりな設備を必要とせず、液晶パネルに
含まれる金属を回収すると同時にガラス素材を回収する
液晶パネルの再資源化処理方法を提供することを目的と
する。The present invention has been made in view of the above points, and does not require a large-scale facility, and a method of recycling a liquid crystal panel for recovering a metal material contained in the liquid crystal panel and simultaneously recovering a glass material. The purpose is to provide.
【００１７】[0017]
【課題を解決するための手段】本発明によれば、使用済
み液晶パネルから資源を回収する液晶パネルの再資源化
処理方法において、液晶パネルの貼り合わせに使用され
ているシール材部分のみを基板表面から局部的に加熱
し、接着力を劣化させ、前記液晶パネルを構成する２枚
の基板を分離し、前記基板表面に積層された膜中に含ま
れる金属を回収すると同時に、前記基板をガラス素材と
して回収することを特徴とする液晶パネルの再資源化処
理方法が提供される。According to the present invention, in a method of recycling a liquid crystal panel for recovering resources from a used liquid crystal panel, only a sealing material portion used for bonding the liquid crystal panels is formed on a substrate. The substrate is locally heated from the surface to degrade the adhesive strength, separate the two substrates constituting the liquid crystal panel, collect the metal contained in the film laminated on the substrate surface, and at the same time, remove the substrate from glass A recycling method for a liquid crystal panel characterized by being recovered as a material is provided.
【００１８】基板表面からシール材部分を加熱して接着
力を劣化させることで、２枚の基板を容易に分離するこ
とができる。また、基板の表面に積層されている膜中に
含まれる金属を、例えば金属製ブラシなどを使用して掻
き取って切削物を回収するので、基板と基板表面に積層
された膜の分離を容易にし、さらに、基板表面に積層さ
れた膜に含まれる金属を再資源化することができる。同
時に基板もガラスカレットとして基板材料に再資源化す
る。The two substrates can be easily separated by heating the sealing material from the substrate surface to degrade the adhesive strength. In addition, since the metal contained in the film laminated on the surface of the substrate is scraped with a metal brush, for example, and the cut material is collected, the substrate and the film laminated on the substrate surface can be easily separated. In addition, metal contained in the film stacked on the substrate surface can be recycled. At the same time, the substrate is recycled as glass cullet into the substrate material.
【００１９】[0019]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して説明する。図１は本発明の実施の形態に係る
液晶パネルの再資源化処理方法の概略図である。図１
（ａ）は液晶パネルのシール材部分を加熱する工程、図
１（ｂ）はカラーフィルター基板とＴＦＴ基板を分離す
る工程、図１（ｃ）は基板表面に積層された膜を金属製
ブラシにより掻き取る工程を示している。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram of a liquid crystal panel recycling method according to an embodiment of the present invention. FIG.
(A) is a step of heating the sealing material portion of the liquid crystal panel, FIG. 1 (b) is a step of separating the color filter substrate and the TFT substrate, and FIG. 1 (c) is a film laminated on the substrate surface using a metal brush. The process of scraping is shown.
【００２０】図１（ａ）では、液晶パネル１０の貼り合
わせに使用されているシール材１２をカラーフィルター
基板１１またはＴＦＴ基板１３の表面からガスバーナー
１５で局部的に加熱し、接着力を劣化させる。In FIG. 1A, the sealing material 12 used for bonding the liquid crystal panel 10 is locally heated by the gas burner 15 from the surface of the color filter substrate 11 or the TFT substrate 13 to deteriorate the adhesive force. Let it.
【００２１】図１（ｂ）では、液晶パネル１０を構成す
るカラーフィルター基板１１およびＴＦＴ基板１３を分
離する。図１（ｃ）では、カラーフィルター基板１１お
よびＴＦＴ基板１３の内表面を金属製ブラシ２０ａを表
面に押し当て回転して掻き取り、基板表面に積層された
膜１４ａおよび１４ｂと同時にＩＴＯを回収するととも
に、基板表面に積層された膜１４ａおよび１４ｂを剥離
したカラーフィルター基板１１およびＴＦＴ基板１３を
得る。In FIG. 1B, the color filter substrate 11 and the TFT substrate 13 constituting the liquid crystal panel 10 are separated. In FIG. 1C, the inner surfaces of the color filter substrate 11 and the TFT substrate 13 are pressed against the surfaces of the metal brushes 20a and rotated to scrape, and the ITO is collected simultaneously with the films 14a and 14b laminated on the substrate surface. At the same time, the color filter substrate 11 and the TFT substrate 13 from which the films 14a and 14b laminated on the substrate surface are peeled off are obtained.
【００２２】図２は液晶パネルの概略の断面図であり、
図３は液晶パネルの概略の平面図を示した図である。内
面にブラックマスク、カラーフィルター、透明導電膜、
液晶配向膜などが形成されたカラーフィルター基板１１
は、エポキシ接着剤などからなるシール材１２により内
面にＴＦＴ（Thin Film Transistor）、信号線、透明電
極、液晶配向膜が形成されたＴＦＴ基板１３と貼り合わ
せられている。そして、貼り合わせたカラーフィルター
基板１１およびＴＦＴ基板１３間に液晶が充填され液晶
パネル１０が構成されている。シール材１２は液晶パネ
ル１０の大きさによって変化はあるものの通常１〜４ｍ
ｍ程度の幅となっている。FIG. 2 is a schematic sectional view of a liquid crystal panel.
FIG. 3 is a schematic plan view of the liquid crystal panel. Black mask, color filter, transparent conductive film on the inner surface,
Color filter substrate 11 on which a liquid crystal alignment film or the like is formed
Is bonded to a TFT substrate 13 having a TFT (Thin Film Transistor), a signal line, a transparent electrode, and a liquid crystal alignment film formed on an inner surface thereof by a sealing material 12 made of an epoxy adhesive or the like. Then, a liquid crystal is filled between the color filter substrate 11 and the TFT substrate 13 which are bonded to each other to form a liquid crystal panel 10. Although the sealing material 12 varies depending on the size of the liquid crystal panel 10, it is usually 1 to 4 m.
The width is about m.
【００２３】次に基板の分離について述べる。シール材
１２をカラーフィルター基板１１またはＴＦＴ基板１３
の表面から炎の先端を絞り数ｍｍ程度にしたガスバーナ
ー１５でシール材１２の部分だけを加熱し、カラーフィ
ルター基板１１とＴＦＴ基板１３を分離する。この作業
はパネルが熱いうちに行ってもよいが、安全上、冷めて
から行ってもよい。Next, separation of the substrate will be described. Sealing material 12 is used for color filter substrate 11 or TFT substrate 13
The color filter substrate 11 and the TFT substrate 13 are separated by heating only the sealing material 12 with a gas burner 15 in which the front end of the flame is squeezed from the surface to a few mm. This operation may be performed while the panel is hot, but may be performed after the panel is cooled for safety.
【００２４】次に、基板表面に積層された膜を剥離する
方法について述べる。図４は基板表面に積層された膜を
剥離する方法を表す図である。分離されたカラーフィル
ター基板１１またはＴＦＴ基板１３の内表面を、円形の
支持具２１ａと、支持具２１ａにより固定された金属ワ
イヤー２２ａとからなる金属製ブラシ２０ａを基板表面
に押し当て、回転して掻き取り、基板表面に積層された
膜１４ａおよび１４ｂと同時にＩＴＯを回収しインジュ
ウムとして再資源化する。さらに、基板表面に積層され
た膜１４ａおよび１４ｂが剥離されたカラーフィルター
基板１１およびＴＦＴ基板１３を得る。Next, a method of peeling the film laminated on the substrate surface will be described. FIG. 4 is a diagram illustrating a method of peeling a film laminated on a substrate surface. The inner surface of the separated color filter substrate 11 or TFT substrate 13 is pressed against a metal brush 20a composed of a circular support 21a and a metal wire 22a fixed by the support 21a against the substrate surface, and rotated. At the same time as scraping and removing the films 14a and 14b laminated on the substrate surface, ITO is collected and recycled as indium. Further, the color filter substrate 11 and the TFT substrate 13 from which the films 14a and 14b laminated on the substrate surface are peeled off are obtained.
【００２５】最後に、表面に積層された全ての膜１４ａ
および１４ｂを取り去った基板を回収し再びガラスの原
料とする。次に、基板表面に積層された膜１４ａおよび
１４ｂを剥離する他の方法について述べる。図５は基板
表面に積層された膜１４ａおよび１４ｂを剥離する他の
方法を表す図である。ロール形の金属製ブラシ２０ｂ
は、支持具２１ｂと、支持具２１ｂの側面に配置された
金属ワイヤー２２ｂとからなる。金属製ブラシ２０ｂを
基板表面に押し当て、回転して掻き取り、基板表面に積
層された膜１４ａおよび１４ｂと同時にＩＴＯを回収
し、インジュウムとして再資源化する。さらに、基板表
面に積層された膜１４ａおよび１４ｂが剥離されたカラ
ーフィルター基板１１およびＴＦＴ基板１３を得る。Finally, all the films 14a stacked on the surface
And the substrate from which 14b has been removed is recovered and used again as a raw material for glass. Next, another method of peeling the films 14a and 14b laminated on the substrate surface will be described. FIG. 5 is a view showing another method of peeling the films 14a and 14b laminated on the substrate surface. Roll type metal brush 20b
Consists of a support 21b and a metal wire 22b arranged on the side surface of the support 21b. The metal brush 20b is pressed against the surface of the substrate, rotated and scraped, and the ITO is collected simultaneously with the films 14a and 14b laminated on the surface of the substrate, and recycled as indium. Further, the color filter substrate 11 and the TFT substrate 13 from which the films 14a and 14b laminated on the substrate surface are peeled off are obtained.
【００２６】このように、金属製ブラシをロール形とす
ることで、基板表面に積層された膜の取れていない部分
が生じた場合、剥離が完全に完了していない場合など
に、局所的に処理を行う場合には向かないが、膜の剥離
を連続的に効率良く行うことができる。As described above, by using the metal brush in the form of a roll, when a portion where the film laminated on the substrate surface is not removed, or when the peeling is not completely completed, the metal brush is locally applied. Although it is not suitable for performing the treatment, the film can be continuously and efficiently removed.
【００２７】本発明における金属ワイヤー２２ａ、２２
ｂとしては鉄、銅、アルミニュウム、ステンレスなどの
素材を使うことが可能であるが、検討の結果、銅を用い
るのが最適であった。鉄やステンレスは硬度が高いた
め、場合によっては基板の表面まで削り取り、切削屑が
増えてしまう。一方、アルミニュウムでは素材が軟らか
過ぎて処理に時間がかかり、金属ワイヤーの先が寝てし
まい、掻き取りの効率が低下しやすく頻繁に交換する必
要がでてくる。これらに対し、銅のブラシでは適度な硬
度のため能力、寿命ともに優れていることが見出され
た。The metal wires 22a, 22 according to the present invention
As b, materials such as iron, copper, aluminum, and stainless steel can be used, but as a result of examination, it was found that copper was most suitable. Since iron and stainless steel have high hardness, the surface of the substrate may be cut off in some cases, resulting in an increase in cutting chips. On the other hand, in the case of aluminum, the material is too soft, it takes a long time to process, the tip of the metal wire falls asleep, the efficiency of scraping is easily reduced, and it is necessary to frequently change the material. On the other hand, it was found that the copper brush was excellent in both performance and life due to appropriate hardness.
【００２８】次に、本発明の実施の形態を、ノート型の
パソコンに使用されている対角１２．４ｃｍのＴＦＴ方
式液晶パネルの処理に適用した場合を例にして説明す
る。まず、取り出された液晶パネルの偏光板や駆動用Ｉ
Ｃが搭載されている回路基板などをカッターなどを用い
て取り除く。Next, an embodiment of the present invention will be described by taking as an example a case where the present invention is applied to processing of a TFT type liquid crystal panel having a diagonal of 12.4 cm used in a notebook personal computer. First, the polarizing plate and the driving I
The circuit board or the like on which C is mounted is removed using a cutter or the like.
【００２９】次に、ブタンガスを用いた携帯式ハンドバ
ーナーを使い、カラーフィルター基板１１の表面にガス
バーナー１５の炎の先端が当るように距離を調節し、シ
ール材１２のライン上を１０ｍｍ/ｓの速度で移動させ
加熱する。この速度は５〜３０ｍｍ/ｓの範囲であれば
問題なく、パネルの大きさとシール材１２の幅によって
任意に調節する。そして、加熱するポイントが一周し、
加熱初めのポイントに戻ったら加熱を止め、カッターの
刃をカラーフィルター基板１１およびＴＦＴ基板１３間
に刺し入れ、カラーフィルター基板１１およびＴＦＴ基
板１３を分離する。本実施例ではパネルが熱いうちにこ
の作業を行った。Next, using a portable hand burner using butane gas, the distance was adjusted so that the tip of the flame of the gas burner 15 hit the surface of the color filter substrate 11, and the line of the sealing material 12 was moved by 10 mm / s. Move at the speed of and heat. This speed can be arbitrarily adjusted depending on the size of the panel and the width of the sealing material 12 as long as the speed is in the range of 5 to 30 mm / s. And the point of heating goes around,
When returning to the heating start point, the heating is stopped, the blade of the cutter is inserted between the color filter substrate 11 and the TFT substrate 13, and the color filter substrate 11 and the TFT substrate 13 are separated. In this example, this operation was performed while the panel was hot.
【００３０】次に図４で示す構造で支持体の直径が５０
ｍｍで銅材の金属ワイヤー２２ａの毛先が１０ｍｍの金
属製ブラシ２０ａを電動式のモーターに取り付け８００
ｒ/minで回転させ、作業台上に分離したカラーフィルタ
ー基板１１を置き、その内表面を１５ｍｍ/ｓの速度で
移動させながら全面の膜が剥離するまで処理を行う。こ
の時の金属製ブラシ２０ａの押し付け圧力は、手動で金
属製ブラシ２０ａの回転数が極端に低下することのない
よう調整しながら行う。Next, in the structure shown in FIG.
Attach a metal brush 20a having a 10 mm tip of a copper metal wire 22a to an electric motor.
After rotating at r / min, the separated color filter substrate 11 is placed on a work table, and the inner surface is moved at a speed of 15 mm / s until the film on the entire surface is peeled off. At this time, the pressing pressure of the metal brush 20a is manually adjusted while the rotation speed of the metal brush 20a is not extremely reduced.
【００３１】また、剥離された膜が粉状で飛散するのを
防ぐため２０ｍｌの水を適宜表面に滴下しながら行う。
滴下する水には無機物からなる研磨剤を含めることで、
基板表面に積層された膜１４ａおよび１４ｂをより効率
的に剥離することができる。In order to prevent the peeled film from being scattered in a powder form, 20 ml of water is dropped on the surface as appropriate.
By including an abrasive made of inorganic material in the water to be dropped,
The films 14a and 14b laminated on the substrate surface can be more efficiently peeled off.
【００３２】次に、ＴＦＴ基板１３を同様の条件で処理
する。金属製ブラシ２０ａおよび２０ｂに付着した切削
物は少量の水で洗い落とし所定の容器に保存し、所定量
溜まった後非鉄メーカーにてインジュウムの回収に供す
る。Next, the TFT substrate 13 is processed under the same conditions. The cuttings adhered to the metal brushes 20a and 20b are washed away with a small amount of water and stored in a predetermined container. After a predetermined amount is accumulated, the non-ferrous maker provides for the recovery of indium.
【００３３】一方、基板についてはガラスメーカーにて
カレット化され再度ガラスの原料として使用される。な
お、上記液晶パネルの構造は現在主流となりつつあるＴ
ＦＴ方式の液晶パネルの例であるが、本発明はこの構造
に限定されるものではなく従来のＳＴＮ（Super Twiste
d Nematic）方式、ＴＮ（Twisted Nematic）方式などの
液晶パネルにも適用可能である。On the other hand, the substrate is culleted by a glass maker and used again as a raw material for glass. Note that the structure of the above-mentioned liquid crystal panel is currently becoming mainstream.
Although this is an example of an FT type liquid crystal panel, the present invention is not limited to this structure, and the conventional STN (Super Twiste
d Nematic) and TN (Twisted Nematic) liquid crystal panels.
【００３４】[0034]
【発明の効果】以上説明したように本発明では、基板表
面からシール材部分を加熱して、接着力を劣化させ、２
枚の基板を分離し、基板表面に積層された膜中の金属を
回収し、同時に基板も基板材料に再資源化するようにし
たので、大掛かりな設備を必要とせず、かつ低エネルギ
ーで液晶パネルの再資源化が可能となる。As described above, in the present invention, the sealing material is heated from the substrate surface to degrade the adhesive strength,
Separating the substrates, collecting the metal in the film laminated on the substrate surface, and also recycling the substrate into substrate material at the same time, eliminating the need for large-scale equipment and low-energy LCD panels Can be recycled.
【００３５】特に、将来的に産出量が減少していく可能
性のある希少な金属であるインジュウムを効率的に回収
でき、再資源化ができる。そして、埋め立てが中心であ
った使用済み液晶パネルを再資源化することにより、天
然資源の枯渇問題ならびに埋め立て処分場不足問題が解
消できる。In particular, indium, which is a rare metal whose production is likely to decrease in the future, can be efficiently recovered and recycled. Then, by recycling used liquid crystal panels mainly used for landfill, the problem of depletion of natural resources and the problem of shortage of landfill disposal sites can be solved.
【図１】本発明の実施の形態に係る液晶パネルの再資源
化処理方法の概略の説明図である。FIG. 1 is a diagram schematically illustrating a method of recycling a liquid crystal panel according to an embodiment of the present invention.
【図２】液晶パネルの概略の断面図である。FIG. 2 is a schematic sectional view of a liquid crystal panel.
【図３】液晶パネルの概略の平面図である。FIG. 3 is a schematic plan view of a liquid crystal panel.
【図４】基板表面に積層された膜を剥離する方法の概略
を示した図である。FIG. 4 is a diagram schematically illustrating a method of peeling a film laminated on a substrate surface.
【図５】基板表面に積層された膜を剥離する他の方法の
概略を示した図である。FIG. 5 is a view schematically showing another method of peeling a film laminated on a substrate surface.
１０……液晶パネル、１１……カラーフィルター基板、
１２……シール材、１３……ＴＦＴ基板、１４……膜、
１５……ガスバーナー、２０ａ、２０ｂ……金属製ブラ
シ、２１ａ、２１ｂ……支持具、２２ａ、２２ｂ……金
属ワイヤー10: liquid crystal panel, 11: color filter substrate,
12 ... sealing material, 13 ... TFT substrate, 14 ... film,
15 Gas burner, 20a, 20b Metal brush, 21a, 21b Support, 22a, 22b Metal wire
Claims (9)
液晶パネルの再資源化処理方法において、 前記液晶パネルの貼り合わせに使用されているシール材
部分のみを基板表面から局部的に加熱し、接着力を劣化
させ、 前記液晶パネルを構成する２枚の基板を分離し、 前記基板表面に積層された膜中に含まれる金属を回収す
ると同時に前記基板をガラス素材として回収することを
特徴とする液晶パネルの再資源化処理方法。1. A method of recycling a liquid crystal panel for recovering resources from a used liquid crystal panel, wherein only a sealing material portion used for bonding the liquid crystal panels is locally heated from the substrate surface and adhered. A liquid crystal panel which separates two substrates constituting the liquid crystal panel, recovers a metal contained in a film laminated on the surface of the substrate, and simultaneously recovers the substrate as a glass material. Panel recycling method.
ら局部的に加熱するためにガスバーナーを使用すること
を特徴とする請求項１記載の液晶パネルの再資源化処理
方法。2. The liquid crystal panel recycling method according to claim 1, wherein a gas burner is used to locally heat only the sealing material portion from the substrate surface.
り、前記基板表面に積層された膜を同時に剥離処理する
ことを特徴とする請求項１記載の液晶パネルの再資源化
処理方法。3. The liquid crystal panel recycling method according to claim 1, wherein the substrate surface is scraped off with a metal brush, and the films laminated on the substrate surface are simultaneously peeled off.
材料からなることを特徴とする請求項１記載の液晶パネ
ルの再資源化処理方法。4. The method according to claim 1, wherein the metal brush is made of a material containing copper as a main component.
面に配置されたことを特徴とする請求項１記載の液晶パ
ネルの再資源化処理方法。5. The method according to claim 1, wherein the metal brush is disposed on the side of the disk or the roll.
物から主にインジュウムを資源として回収することを特
徴とする請求項１記載の液晶パネルの再資源化処理方
法。6. The liquid crystal panel recycling method according to claim 1, wherein indium is mainly recovered as a resource from a cutting containing metal separated by a metal brush.
をガラスカレットとして基板材料に再資源化することを
特徴とする請求項１記載の液晶パネルの再資源化処理方
法。7. The liquid crystal panel recycling method according to claim 1, wherein the substrate from which the film on the substrate surface has been removed is recycled as a glass cullet into a substrate material.
時に水を滴下しながら行うことを特徴とする請求項１記
載の液晶パネルの再資源化処理方法。8. The liquid crystal panel recycling method according to claim 1, wherein water is dropped while scraping the substrate surface with a metal brush.
剤を含めたことを特徴とする請求項８記載の液晶パネル
の再資源化処理方法。9. The liquid crystal panel recycling method according to claim 8, wherein said dropped water contains an abrasive made of an inorganic substance.
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|---|---|---|---|
| JP2000362216A JP4374770B2 (en) | 2000-11-29 | 2000-11-29 | Recycling method of liquid crystal panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000362216A JP4374770B2 (en) | 2000-11-29 | 2000-11-29 | Recycling method of liquid crystal panel |
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|---|---|
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| JP4374770B2 JP4374770B2 (en) | 2009-12-02 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007134212A (en) * | 2005-11-11 | 2007-05-31 | Matsushita Electric Ind Co Ltd | Method and device for removing coating film |
| JP2008216566A (en) * | 2007-03-02 | 2008-09-18 | Sharp Corp | Method and device for recovering glass substrate from waste liquid crystal panel |
| JP2008246428A (en) * | 2007-03-30 | 2008-10-16 | Sharp Corp | Recycling device of waste material, recycling method using the same, and metal, metal compound, and base material obtained by this method |
| JP2009242877A (en) * | 2008-03-31 | 2009-10-22 | Dowa Eco-System Co Ltd | Method for leaching of metal from liquid crystal panel |
| JP2014054593A (en) * | 2012-09-12 | 2014-03-27 | Terumu:Kk | Recycling apparatus and recycle method for solar battery panel |
-
2000
- 2000-11-29 JP JP2000362216A patent/JP4374770B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007134212A (en) * | 2005-11-11 | 2007-05-31 | Matsushita Electric Ind Co Ltd | Method and device for removing coating film |
| JP4665724B2 (en) * | 2005-11-11 | 2011-04-06 | パナソニック株式会社 | Method and apparatus for removing coating film |
| JP2008216566A (en) * | 2007-03-02 | 2008-09-18 | Sharp Corp | Method and device for recovering glass substrate from waste liquid crystal panel |
| JP2008246428A (en) * | 2007-03-30 | 2008-10-16 | Sharp Corp | Recycling device of waste material, recycling method using the same, and metal, metal compound, and base material obtained by this method |
| JP2009242877A (en) * | 2008-03-31 | 2009-10-22 | Dowa Eco-System Co Ltd | Method for leaching of metal from liquid crystal panel |
| JP2014054593A (en) * | 2012-09-12 | 2014-03-27 | Terumu:Kk | Recycling apparatus and recycle method for solar battery panel |
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| Publication number | Publication date |
|---|---|
| JP4374770B2 (en) | 2009-12-02 |
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