JP2002151638A - Cooler for electronic equipment - Google Patents
Cooler for electronic equipmentInfo
- Publication number
- JP2002151638A JP2002151638A JP2000345470A JP2000345470A JP2002151638A JP 2002151638 A JP2002151638 A JP 2002151638A JP 2000345470 A JP2000345470 A JP 2000345470A JP 2000345470 A JP2000345470 A JP 2000345470A JP 2002151638 A JP2002151638 A JP 2002151638A
- Authority
- JP
- Japan
- Prior art keywords
- pump
- heat sink
- liquid
- cooling
- liquid cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、配線基板上に搭載
されたＬＳＩ等の発熱電子回路部品を、液体冷却するた
めの冷却構造に係り、特に液体冷却ヒートシンクとポン
プとをコンパクトに実装するための冷却構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for liquid cooling a heat-generating electronic circuit component such as an LSI mounted on a wiring board, and more particularly to a liquid cooling heat sink and a pump that are compactly mounted. Cooling structure.
【０００２】[0002]
【従来の技術】近年、コンピュータや通信機器、マルチ
メディア機器等に代表される電子機器の発熱量は著しく
増加する傾向にあり、特に演算処理を集中して行うＣＰ
Ｕや、画像処理用ＬＳＩ、パワーアンプ等の冷却は非常
に重要な課題となってきた。2. Description of the Related Art In recent years, the amount of heat generated by electronic devices such as computers, communication devices, and multimedia devices has tended to increase significantly.
Cooling of the U, the image processing LSI, the power amplifier, and the like has become a very important issue.
【０００３】また、冷却方式としては、従来から、空冷
フィンとファンを組合せた空冷方式が数多く用いられて
きた。しかしながら、空冷方式は、液冷方式に比較して
冷却限界が低いため、最近、ＣＰＵ等の高発熱ＬＳＩの
みを水等の液体冷媒により液冷する方式が検討されてい
る。[0003] As a cooling system, many air cooling systems using a combination of an air cooling fin and a fan have been conventionally used. However, since the cooling limit of the air cooling method is lower than that of the liquid cooling method, a method of liquid cooling only a high heat generation LSI such as a CPU with a liquid refrigerant such as water has recently been studied.
【０００４】例えば、特開平8−32262号公報には、図４
に示すような液冷方式が開示されている。発熱量の大き
くない空冷可能なＬＳＩ５１と、発熱量が大きいため水
冷ヒートシンク４０で冷却されるＬＳＩとが、同じ配線
基板５０上に搭載されている。空冷可能なＬＳＩ５１は
２つのファン４７により空冷される。冷却空気は４８に
示すように外部から供給され、４９に示すように排気さ
れる。発熱量の大きいＬＳＩに搭載された水冷ヒートシ
ンク４０はホース４１でを介して出口配管４２に連結さ
れ、４０で温められた冷却水は熱交換器４３においてフ
ァン４７の空気により冷却される。冷却された冷却水は
冷媒配管４４を経由してポンプ４５に流れ、加圧された
後に入口配管４６を通って再び水冷ヒートシンク４０に
供給される。[0004] For example, Japanese Patent Application Laid-Open No. 8-32262 discloses FIG.
A liquid cooling system as shown in FIG. An air-coolable LSI 51 that does not generate a large amount of heat and an LSI that has a large amount of heat and is cooled by the water-cooled heat sink 40 are mounted on the same wiring board 50. The air-coolable LSI 51 is air-cooled by two fans 47. The cooling air is supplied from outside as shown at 48 and exhausted as shown at 49. A water-cooled heat sink 40 mounted on an LSI that generates a large amount of heat is connected to an outlet pipe 42 via a hose 41, and the cooling water heated at 40 is cooled by the air of a fan 47 in a heat exchanger 43. The cooled cooling water flows to the pump 45 via the refrigerant pipe 44, and after being pressurized, is supplied again to the water-cooled heat sink 40 through the inlet pipe 46.
【０００５】[0005]
【発明が解決しようとする課題】特開平8−32262号公報
に開示された冷却構造では、ポンプ４５が配線基板５０
や水冷ヒートシンク４０と離れて設置されているため、
ポンプ４５を実装するスペースとポンプ４５に接続する
配管スペースが筐体内に別途必要となり、電子機器筐体
をコンパクトにすることができないという問題点があっ
た。In the cooling structure disclosed in Japanese Patent Application Laid-Open No. 8-32262, the pump 45 is
And water-cooled heat sink 40,
A space for mounting the pump 45 and a piping space for connecting to the pump 45 are separately required in the housing, and there has been a problem that the electronic device housing cannot be made compact.
【０００６】本発明の目的は、コンパクトで、低騒音
で、冷却性能に優れ、かつ信頼性の高い電子機器の冷却
構造を提供することである。An object of the present invention is to provide a cooling structure for electronic equipment which is compact, has low noise, has excellent cooling performance, and has high reliability.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するた
め、本発明では、配線基板と、配線基板上に搭載された
ＬＳＩ等の電子回路部品を含む発熱体と、発熱体上に熱
的に接触して搭載された液体冷却ヒートシンクと、液体
冷媒を加圧して循環させるポンプとからなる電子機器の
冷却装置を前提とし、ポンプが液体冷却ヒートシンクの
上部に搭載される構造とした。In order to achieve the above object, according to the present invention, there is provided a wiring board, a heating element including an electronic circuit component such as an LSI mounted on the wiring board, and a heating element on the heating element. Assuming a cooling device for an electronic device including a liquid cooling heat sink mounted in contact and a pump for pressurizing and circulating a liquid refrigerant, the pump is mounted on the liquid cooling heat sink.
【０００８】また、ポンプが液体冷却ヒートシンクの上
部に固定され、さらにポンプと液体冷却ヒートシンクと
を一体構造として取扱える構造とした。Further, the pump is fixed to the upper part of the liquid cooling heat sink, and the pump and the liquid cooling heat sink can be handled as an integral structure.
【０００９】また、ポンプの液体冷媒吐出し部が液体冷
却ヒートシンクに配管等で直接連結された構造とした。[0009] Further, the liquid refrigerant discharge part of the pump is directly connected to the liquid cooling heat sink by piping or the like.
【００１０】さらに、ポンプが直流電源で動作する構成
とした。Further, the pump is operated by a DC power supply.
【００１１】さらに、ポンプが振動吸収部材等を介して
液体冷却ヒートシンクに固定される構造とした。Further, the pump is fixed to the liquid cooling heat sink via a vibration absorbing member or the like.
【００１２】[0012]
【発明の実施の形態】本発明の第一の実施例について図
１を用いて説明する。ＬＳＩ等の電子回路部品を含む発
熱体１は、配線基板２上に配線用ピン３や半田ボール等
を介して電気的に接続されて搭載されている。発熱体１
は、例えばコンピュータ用のＣＰＵや、画像処理用ＬＳ
Ｉ、ＦＥＴパワーアンプ等である。発熱体１上には、発
熱体１を液冷するための液体冷却ヒートシンク４が、熱
伝導コンパウンド２１や熱伝導グリース、または熱伝導
シート等を介して熱的に接続されて搭載されている。さ
らに、液体冷却ヒートシンク４の上部には、液体冷媒を
加圧して循環させるポンプ５が搭載されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIG. A heating element 1 including an electronic circuit component such as an LSI is mounted on a wiring board 2 by being electrically connected via wiring pins 3 and solder balls. Heating element 1
Is, for example, a CPU for a computer or an LS for image processing.
I, FET power amplifier and the like. A liquid cooling heat sink 4 for liquid cooling the heating element 1 is thermally mounted on the heating element 1 via a heat conductive compound 21, a heat conductive grease, a heat conductive sheet, or the like. Further, a pump 5 for pressurizing and circulating the liquid refrigerant is mounted on the upper part of the liquid cooling heat sink 4.
【００１３】本実施例では、ポンプ５が振動吸収部材１
９を介して液体冷却ヒートシンク４に固定される構造を
採っている。そのためポンプ５の振動が直接ＣＰＵ等の
電子部品に影響を及ぼし難い構造となっている。ポンプ
５はフレキシブルなホース６により液体冷却ヒートシン
ク４と接続されている。ホース６は一端がポンプ５の冷
媒吐出し部カプラ７に接続され、他端が液体冷却ヒート
シンク４の給水カプラ９に接続されており、加圧された
液体冷媒は８のように流れた後に１０のように直接液体
冷却ヒートシンク４に流入する。液体冷媒は、液体冷却
ヒートシンク４内に流入した後に、ヒートシンク内に構
成された複数の流路に別れて蛇行状に流れ、発熱体１の
熱を吸収する。加熱された液体冷媒は排水カプラ１７、
ホース１６を経て、液体冷媒を冷却する熱交換部（図示
せず）に１８に示すように流れる。熱交換部で冷却され
た液体冷媒は、１５のように戻ってきて、ホース１３、
冷媒吸込み部カプラ１４を介してポンプ５に吸込まれ、
再び加圧されて液体冷却ヒートシンク４に供給される。In this embodiment, the pump 5 is connected to the vibration absorbing member 1.
A structure is adopted in which it is fixed to the liquid cooling heat sink 4 via the heat sink 9. Therefore, the structure is such that the vibration of the pump 5 does not directly affect the electronic components such as the CPU. The pump 5 is connected to the liquid cooling heat sink 4 by a flexible hose 6. One end of the hose 6 is connected to the refrigerant discharge coupler 7 of the pump 5, and the other end is connected to the water supply coupler 9 of the liquid cooling heat sink 4. Directly flows into the liquid cooling heat sink 4 as shown in FIG. After flowing into the liquid cooling heat sink 4, the liquid refrigerant flows into a plurality of flow paths formed in the heat sink, flows in a meandering manner, and absorbs heat of the heating element 1. The heated liquid refrigerant is supplied to the drain coupler 17,
Through a hose 16, the refrigerant flows into a heat exchanger (not shown) for cooling the liquid refrigerant, as shown at 18. The liquid refrigerant cooled in the heat exchange section returns as indicated by 15, and the hose 13,
Sucked into the pump 5 via the refrigerant suction coupler 14,
It is pressurized again and supplied to the liquid cooling heat sink 4.
【００１４】なお、前述したカプラ７，９，１４，１７
によってホース６，１３，１６は脱着が容易になってい
るため、組立て性やメンテナンス性が良い構造を実現し
ている。The above-mentioned couplers 7, 9, 14, 17
As a result, the hoses 6, 13, and 16 are easily attached and detached, so that a structure with good assemblability and maintainability is realized.
【００１５】上記のように、ポンプ５が液体冷却ヒート
シンク４の上部に搭載される構造とすることにより、ポ
ンプ５を別途設置するスペースを電子機器筐体内に用意
する必要が無くなり、またポンプから液体冷却ヒートシ
ンク４までのホースを短くできるので、液体冷却システ
ムを電子機器筐体内にコンパクトに搭載できる。そのた
め、現状の空冷方式の電子機器筐体構造を大きく変える
ことなく、冷却性能が高く、かつ低騒音の液体冷却シス
テムを搭載することが可能となる。As described above, the structure in which the pump 5 is mounted on the upper part of the liquid cooling heat sink 4 eliminates the necessity of preparing a space for separately installing the pump 5 in the housing of the electronic device. Since the hose up to the cooling heat sink 4 can be shortened, the liquid cooling system can be compactly mounted in the electronic device housing. Therefore, it is possible to mount a liquid cooling system having high cooling performance and low noise without largely changing the current air-cooled electronic device housing structure.
【００１６】また、ポンプ５が液体冷却ヒートシンク４
の上部に固定され、ポンプと液冷ヒートシンクとを一体
構造として取扱えるようにすると、組立て時の部品点数
が低減し、さらに、現状パソコン等で多用されているフ
ァン付き空冷ヒートシンクの代わりに、このポンプと液
冷ヒートシンクの一体部品キットを組付けることができ
るため、液体冷却システムを無理なく電子機器に導入可
能である。The pump 5 is connected to the liquid cooling heat sink 4.
When the pump and liquid-cooled heat sink can be handled as an integral structure, the number of parts during assembly is reduced, and this air-cooled heat sink with a fan, which is currently frequently used in personal computers etc., is replaced with this one. Since the integrated component kit of the pump and the liquid cooling heat sink can be assembled, the liquid cooling system can be easily introduced into the electronic device.
【００１７】また、ポンプ５の冷媒吐出し部７が液体冷
却ヒートシンク４の給水カプラ９に配管等で直接連結さ
れた構造とした。そのため、ポンプ５から液体冷却ヒー
トシンク４までのホースを非常に短くできるので、ホー
スでの液体冷媒の流動損失を小さくでき、その結果ポン
プ５の揚程能力を小さくでき、最終的にモータの能力を
より小さくし、ポンプを小型化することができる。Further, the refrigerant discharge portion 7 of the pump 5 is directly connected to the water supply coupler 9 of the liquid cooling heat sink 4 by a pipe or the like. Therefore, the length of the hose from the pump 5 to the liquid cooling heat sink 4 can be extremely short, so that the flow loss of the liquid refrigerant in the hose can be reduced, and as a result, the pumping capacity of the pump 5 can be reduced, and finally the capacity of the motor can be improved. It is possible to reduce the size and the size of the pump.
【００１８】ポンプ５は羽根車ケース１１とモータ１２
から構成される。本実施例において、ポンプ５は羽根車
ケース１１内に設置された羽根車を回転させて液体冷媒
を加圧する遠心型の例を示したが、ダイヤフラムなどを
用いて機械的容積変化により液体冷媒を加圧する容積型
ポンプであっても良い。また、本実施例においては、モ
ータと羽根車の軸が液体冷却ヒートシンク４の上面にほ
ぼ垂直になるように搭載されており、よって、モータの
底面が液体冷却ヒートシンク４の上面に振動吸収部材１
９を介して面同士で接合されるため、モータの座りが良
い構造を実現できる。The pump 5 comprises an impeller case 11 and a motor 12
Consists of In this embodiment, the pump 5 is an example of a centrifugal type in which the impeller provided in the impeller case 11 is rotated to pressurize the liquid refrigerant, but the liquid refrigerant is changed by mechanical volume change using a diaphragm or the like. It may be a positive displacement pump for pressurizing. In this embodiment, the motor and the impeller are mounted so that the axes of the motor and the impeller are substantially perpendicular to the upper surface of the liquid cooling heat sink 4, so that the bottom surface of the motor is mounted on the upper surface of the liquid cooling heat sink 4.
Since the surfaces are joined to each other via the intermediate member 9, it is possible to realize a structure in which the motor is well seated.
【００１９】モータ１２は直流電源で駆動するＤＣモー
タである。ＤＣモータとすることにより、ＤＣ電圧を変
化させて容易にモータの回転数を変えられるので、冷却
能力の制御も可能になる。さらに、モータをＤＣブラシ
レスモータとすることにより、低騒音でかつ高寿命のポ
ンプを実現することができる。The motor 12 is a DC motor driven by a DC power supply. By using a DC motor, the number of rotations of the motor can be easily changed by changing the DC voltage, so that the cooling capacity can be controlled. Further, by using a DC brushless motor as the motor, a low-noise and long-life pump can be realized.
【００２０】液体冷媒の流量が ０.１（リットル／分）
のオーダーのように比較的小さい場合には、駆動電圧を
例えば １〜１.５（Ｖ）程度の乾電池でも駆動可能なも
のとすれば、ポンプのバッテリー駆動が可能となり、信
頼性の高い液体冷却システムを構築できる。また、液体
冷媒の流量が１（リットル／分）のオーダーのように比
較的大きい場合には、駆動電圧を例えば２〜１２（Ｖ）
程度の電子機器のＤＣ電源で供給可能な電圧とすると、
ポンプ用の専用電源を用意する必要がないためコンパク
トで安価に液体冷却システムを構築できる。だだし、本
発明は、モータ１２を必ずしもＤＣモータに限定するも
のではなく、例えば１００（Ｖ）や 200（Ｖ）の交流電
源で駆動するＡＣモータであっても構わない。The flow rate of the liquid refrigerant is 0.1 (liter / minute)
If the driving voltage can be driven by a dry battery of, for example, about 1 to 1.5 (V), the pump can be driven by a battery, and the liquid cooling can be performed with high reliability. Can build a system. When the flow rate of the liquid refrigerant is relatively large, such as on the order of 1 (liter / minute), the driving voltage is set to, for example, 2 to 12 (V).
Assuming that the voltage can be supplied by the DC power supply of
Since there is no need to prepare a dedicated power supply for the pump, a liquid cooling system that is compact and inexpensive can be constructed. However, in the present invention, the motor 12 is not necessarily limited to a DC motor, but may be an AC motor driven by an AC power supply of, for example, 100 (V) or 200 (V).
【００２１】液体冷媒は入手が容易な水が良く、特に純
水であると熱容量が大きいので冷却性能を高くでき、さ
らに腐食に強く、不純物が流路内に堆積し難いので信頼
性の高い液体冷却システムを実現することができる。ま
た、液体冷媒として、水にエチレングリコール等を添加
した不凍液を使えば、寒冷時の液体冷媒凍結による流路
部破損を防止できる。また、液体冷媒にパーフルオロカ
ーボン等の非電導性冷媒を使えば、万一の液漏れ時にも
電子回路のショート等の事故を防ぐことができる。The liquid refrigerant is preferably water, which is easily available. In particular, pure water has a large heat capacity, so that the cooling performance can be enhanced. Further, the liquid refrigerant is resistant to corrosion, and it is difficult to deposit impurities in the flow path. A cooling system can be realized. In addition, if an antifreeze liquid obtained by adding ethylene glycol or the like to water is used as the liquid refrigerant, breakage of the flow path due to freezing of the liquid refrigerant during cold can be prevented. If a non-conductive refrigerant such as perfluorocarbon is used as the liquid refrigerant, an accident such as a short circuit of an electronic circuit can be prevented even in the event of a liquid leak.
【００２２】本発明の第二の実施例について図２を用い
て説明する。本実施例においては、モータ５と羽根車の
軸が液体冷却ヒートシンク４の上面にほぼ平行になるよ
うに搭載されている。それにより、モータ出力が高く、
そのためモータの軸方向長さが長い高出力ポンプでも、
液体冷却ヒートシンク４上にコンパクトに搭載できる。
本実施例では、ポンプ５は液体冷却ヒートシンク４上に
ブラケット２０で固定されている。ブラケット２０は、
材質が振動吸収部材であるか、その一部に振動吸収部材
を用いることにより、ポンプ５の振動が直接ＣＰＵ等の
電子部品に影響を及ぼし難い構造とすることができる。
第二の実施例は、上記以外は第一の実施例と同様であ
る。A second embodiment of the present invention will be described with reference to FIG. In this embodiment, the motor 5 and the impeller are mounted so that their axes are substantially parallel to the upper surface of the liquid cooling heat sink 4. As a result, the motor output is high,
Therefore, even with a high-power pump with a long motor axial length,
It can be mounted compactly on the liquid cooling heat sink 4.
In this embodiment, the pump 5 is fixed on the liquid cooling heat sink 4 by a bracket 20. The bracket 20 is
If the material is a vibration absorbing member or a part of the vibration absorbing member is used, a structure in which the vibration of the pump 5 does not directly affect the electronic components such as the CPU can be obtained.
The second embodiment is the same as the first embodiment except for the above.
【００２３】本発明の第三の実施例について図３を用い
て説明する。本実施例は、第一の実施例で示したポンプ
と液冷ヒートシンク一体型の液体冷却システムを、実際
の電子機器筐体内に搭載した例を示している。A third embodiment of the present invention will be described with reference to FIG. This embodiment shows an example in which the liquid cooling system integrated with the pump and the liquid cooling heat sink shown in the first embodiment is mounted in an actual electronic device housing.
【００２４】ＬＳＩ等の発熱体１は、マザーボードであ
る配線基板２上に搭載されている。発熱体１上には、発
熱体１を液冷するための液体冷却ヒートシンク４が搭載
されている。さらに、液体冷却ヒートシンク４の上部に
は、ポンプ５が搭載されている。配線基板２上には、発
熱体１以外に、メモリＬＳＩやドライバＬＳＩなどの空
冷で冷却可能な発熱体２２ａ，２２ｂ，２２ｃや、ＩＯ
カード、メモリカード、ハードディスク等のカード実装
基板２３等が搭載されている。配線基板２は、電子機器
筐体のケース２４内に収められている。ケース２４には
空冷用のファン３４が取付けられており、前記多数の空
冷部品を冷却風２５で空冷している。A heating element 1 such as an LSI is mounted on a wiring board 2 which is a mother board. A liquid cooling heat sink 4 for liquid cooling the heating element 1 is mounted on the heating element 1. Further, a pump 5 is mounted on the liquid cooling heat sink 4. On the wiring board 2, in addition to the heating element 1, heating elements 22 a, 22 b, 22 c that can be cooled by air, such as a memory LSI and a driver LSI, and IOs
A card mounting board 23 such as a card, a memory card, and a hard disk is mounted. The wiring board 2 is housed in a case 24 of an electronic device housing. A fan 34 for air cooling is attached to the case 24, and the large number of air-cooled components are air-cooled by cooling air 25.
【００２５】液体冷却ヒートシンク４で加熱された液体
冷媒は、ホース１６で１８に示すように流れ、筐体ケー
スの側板３２に取付けられた熱交換器２７に接続カプラ
２６を介して接続される。本実施例では、熱交換器２７
の配管が側板３２に熱的に接触して取付けられており、
液体冷媒は熱交換器内で２８や２９のように蛇行しなが
ら上方へ流れる。液体冷媒の熱は側板３２全体に熱伝導
により広げられた後に、電子機器筐体周囲の自然対流に
よる空気流３３やファン３４による冷却風２５により放
熱される。The liquid refrigerant heated by the liquid cooling heat sink 4 flows through the hose 16 as shown at 18 and is connected via a connection coupler 26 to a heat exchanger 27 attached to a side plate 32 of the housing case. In the present embodiment, the heat exchanger 27
Pipes are attached in thermal contact with the side plate 32,
The liquid refrigerant flows upward while meandering like 28 and 29 in the heat exchanger. After the heat of the liquid refrigerant is spread to the entire side plate 32 by heat conduction, the heat is radiated by the air flow 33 due to natural convection around the electronic device housing and the cooling air 25 by the fan 34.
【００２６】冷却された液体冷媒は、３０のように流
れ、接続カプラ３１を介して戻り側のホース１３に接続
され、１５のようにポンプ５に戻り、再び加圧されて液
体冷却ヒートシンク４に供給される。The cooled liquid refrigerant flows as shown at 30 and is connected to the hose 13 on the return side via the connecting coupler 31, returns to the pump 5 as at 15, is pressurized again, and is sent to the liquid cooling heat sink 4. Supplied.
【００２７】側板３２と熱交換器２７の構成方法の一例
として、側板３２をアルミニウムやマグネシウムや銅等
の金属材料で構成し、さらに熱交換器の配管を金属材料
で構成し、両者をろう付けや半田付け等の金属接合や熱
伝導性接着剤等で接続する方法がある。この場合、熱伝
導を良好にできるので、液体冷却システムの冷却性能を
向上させることができる。また、２枚の金属板を熱交換
器の蛇行流路を空けた状態で接合させて、側板と熱交換
器を一体成形するロールボンド等の製法を用いれば、よ
り安価に熱交換器を製造できる。ただし、側板３２が樹
脂製等の非金属材料であったり、熱交換器２７の配管が
非金属材料であっても、本発明の効果は実現できるもの
である。As an example of a method of forming the side plate 32 and the heat exchanger 27, the side plate 32 is formed of a metal material such as aluminum, magnesium, or copper, and the piping of the heat exchanger is formed of a metal material. There is a method of connecting with a metal joint such as soldering or the like, a heat conductive adhesive or the like. In this case, since the heat conduction can be improved, the cooling performance of the liquid cooling system can be improved. In addition, if the two metal plates are joined with the meandering flow path of the heat exchanger opened, and a method such as roll bonding is used to integrally mold the side plate and the heat exchanger, the heat exchanger can be manufactured at lower cost. it can. However, the effects of the present invention can be realized even if the side plate 32 is made of a nonmetallic material such as a resin or the piping of the heat exchanger 27 is made of a nonmetallic material.
【００２８】以上から、本実施例の構成とすることによ
り、ポンプ５を別途設置するスペースを電子機器筐体内
に用意する必要が無くなり、またポンプから液体冷却ヒ
ートシンク４までのホースを短くできるので、液体冷却
システムを電子機器筐体内にコンパクトに搭載できる。As described above, with the configuration of the present embodiment, it is not necessary to provide a space for separately installing the pump 5 in the housing of the electronic device, and the hose from the pump to the liquid cooling heat sink 4 can be shortened. The liquid cooling system can be compactly mounted in the electronic device housing.
【００２９】さらに、現状の空冷方式の電子機器筐体構
造を大きく変えることなく、熱交換器２７を備えた側板
３２と、ポンプ一体型液冷ヒートシンクと、２本の接続
ホース１３，１６を追加するだけで、冷却性能が高く、
かつ低騒音の液体冷却システムを実現することが可能と
なる。Further, a side plate 32 provided with a heat exchanger 27, a pump-integrated liquid-cooled heat sink, and two connection hoses 13 and 16 are added without largely changing the current air-cooled electronic device housing structure. Just by doing, the cooling performance is high,
In addition, a liquid cooling system with low noise can be realized.
【００３０】また、現状パソコン等で多用されているフ
ァン付き空冷ヒートシンクの代わりに、このポンプと液
冷ヒートシンクの一体部品キットを組付けることができ
るため、液体冷却システムを無理なく電子機器に導入可
能である。ポンプの電源がファン付き空冷ヒートシンク
のファン用電源と互換性があれば、さらに導入が容易と
なることは言うまでもない。Also, instead of an air-cooled heat sink with a fan, which is currently frequently used in personal computers, etc., an integrated kit of this pump and a liquid-cooled heat sink can be assembled, so that a liquid cooling system can be easily introduced into electronic equipment. It is. Needless to say, if the power supply of the pump is compatible with the power supply for the fan of the air-cooled heat sink with a fan, the introduction becomes easier.
【００３１】[0031]
【発明の効果】以上説明したように、本発明によれば、
第一に、液体冷却システムを電子機器筐体内にコンパク
トに搭載できる。As described above, according to the present invention,
First, the liquid cooling system can be compactly mounted in the electronic device housing.
【００３２】第二に、現状の空冷方式の電子機器筐体構
造を大きく変えることなく、冷却性能が高く、かつ低騒
音で、信頼性の高い液体冷却システムを搭載することが
できる。Second, a liquid cooling system having high cooling performance, low noise, and high reliability can be mounted without largely changing the current air-cooled electronic device housing structure.
【００３３】第三に、組立て時の部品点数が低減し、か
つ、ファン付き空冷ヒートシンクの代わりに、ポンプと
液冷ヒートシンクの一体部品キットを組付けることがで
きるため、液体冷却システムを無理なく電子機器に導入
できる。Third, since the number of parts during assembly is reduced and an integrated kit of a pump and a liquid-cooled heat sink can be assembled instead of an air-cooled heat sink with a fan, the liquid cooling system can be easily electronically mounted. Can be introduced into equipment.
【００３４】第四に、ポンプの揚程能力を小さくでき、
モータの能力をより小さくし、小型化できる。Fourth, the pump head capacity can be reduced,
The capacity of the motor can be made smaller and downsized.
【００３５】第五に、ポンプの回転数を変化させて冷却
能力を制御可能な液体冷却システムとすることができ
る。Fifth, a liquid cooling system capable of controlling the cooling capacity by changing the rotation speed of the pump can be provided.
【図１】本発明の第一の実施例である電子機器の冷却装
置の斜視図。FIG. 1 is a perspective view of a cooling device for electronic equipment according to a first embodiment of the present invention.
【図２】本発明の第二の実施例である電子機器の冷却装
置の斜視図。FIG. 2 is a perspective view of a cooling device for electronic equipment according to a second embodiment of the present invention.
【図３】本発明の第三の実施例である電子機器の冷却装
置の斜視図。FIG. 3 is a perspective view of a cooling device for electronic equipment according to a third embodiment of the present invention.
【図４】従来例の電子機器の冷却装置を示す斜視図。FIG. 4 is a perspective view showing a cooling device for a conventional electronic device.
１…発熱体、２…配線基板、３…配線用ピン、４…液体
冷却ヒートシンク、５…ポンプ、６…ホース、７…冷媒
吐出し部カプラ、８…液体冷媒の流れ、９…給水カプ
ラ、１０…液体冷媒の流れ、１１…羽根車ケース、１２
…モータ、１３…ホース、１４…冷媒吸込み部カプラ、
１５…液体冷媒の流れ、１６…ホース、１７…排水カプ
ラ、１８…液体冷媒の流れ、１９…振動吸収部材、２０
…ブラケット、２１…熱伝導性コンパウンド、２２ａ…
空冷で冷却可能な発熱体、２２ｂ…空冷で冷却可能な発
熱体、２２ｃ…空冷で冷却可能な発熱体、２３…カード
実装基板、２４…電子機器筐体のケース、２５…冷却
風、２６…接続カプラ、２７…熱交換器、２８…蛇行す
る液体冷媒の流れ、２９…蛇行する液体冷媒の流れ、３
０…液体冷媒の流れ、３１…接続カプラ、３２…側板、
３３…空気流、３４…ファン、４０…水冷ヒートシン
ク、４１…ホース、４２…出口配管、４３…熱交換器、
４４…冷媒配管、４５…ポンプ、４６…入口配管、４７
…ファン、４８…冷却空気、４９…冷却空気、５０…配
線基板、５１…空冷可能なＬＳＩ。DESCRIPTION OF SYMBOLS 1 ... Heating element, 2 ... Wiring board, 3 ... Wiring pin, 4 ... Liquid cooling heat sink, 5 ... Pump, 6 ... Hose, 7 ... Refrigerant discharge part coupler, 8 ... Liquid refrigerant flow, 9 ... Water supply coupler, 10: Flow of liquid refrigerant, 11: Impeller case, 12
... Motor, 13 ... Hose, 14 ... Cooler suction part coupler,
15: Flow of liquid refrigerant, 16: Hose, 17: Drain coupler, 18: Flow of liquid refrigerant, 19: Vibration absorbing member, 20
... bracket, 21 ... heat conductive compound, 22a ...
Air-cooled and heatable element, 22b: Air-cooled and heatable element, 22c: Air-cooled and heatable element, 23 ... Card mounting board, 24 ... Electronic device case, 25 ... Cooling air, 26 ... Connecting coupler, 27 heat exchanger, 28 meandering liquid refrigerant flow, 29 meandering liquid refrigerant flow, 3
0: liquid refrigerant flow, 31: connecting coupler, 32: side plate,
33 ... air flow, 34 ... fan, 40 ... water-cooled heat sink, 41 ... hose, 42 ... outlet pipe, 43 ... heat exchanger,
44 ... refrigerant pipe, 45 ... pump, 46 ... inlet pipe, 47
... Fan, 48 ... Cooling air, 49 ... Cooling air, 50 ... Wiring board, 51 ... Air-coolable LSI.
Claims (1)
ＳＩ等の電子回路部品を含む発熱体と、該発熱体上に熱
的に接触して搭載された液体冷却ヒートシンクと、液体
冷媒を加圧して循環させるポンプとからなる電子機器の
冷却装置であって、該ポンプが該液体冷却ヒートシンク
の上部に搭載されることを特徴とする電子機器の冷却装
置。1. A wiring board and an L mounted on the wiring board.
A cooling device for an electronic device, comprising: a heating element including electronic circuit components such as SI; a liquid cooling heat sink mounted in thermal contact with the heating element; and a pump for pressurizing and circulating a liquid refrigerant. Wherein the pump is mounted on the liquid cooling heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000345470A JP2002151638A (en) | 2000-11-08 | 2000-11-08 | Cooler for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000345470A JP2002151638A (en) | 2000-11-08 | 2000-11-08 | Cooler for electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002151638A true JP2002151638A (en) | 2002-05-24 |
| JP2002151638A5 JP2002151638A5 (en) | 2005-05-26 |
Family
ID=18819499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000345470A Withdrawn JP2002151638A (en) | 2000-11-08 | 2000-11-08 | Cooler for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002151638A (en) |
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