JP2002134032A - Plasma display device and manufacturing method thereof - Google Patents
Plasma display device and manufacturing method thereofInfo
- Publication number
- JP2002134032A JP2002134032A JP2000325295A JP2000325295A JP2002134032A JP 2002134032 A JP2002134032 A JP 2002134032A JP 2000325295 A JP2000325295 A JP 2000325295A JP 2000325295 A JP2000325295 A JP 2000325295A JP 2002134032 A JP2002134032 A JP 2002134032A
- Authority
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- Prior art keywords
- partition
- display device
- opening
- plasma display
- partition wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プラズマディスプ
レイ表示装置およびその製造方法に関する。The present invention relates to a plasma display device and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来からプラズマディスプレイ表示装置
の一例としては図４に示すようなＡＣ型のプラズマディ
スプレイ表示装置（以下ＰＤＰという）が知られてい
る。以下図面を参照しながら従来のＰＤＰのパネル構成
とその動作原理を説明する。2. Description of the Related Art As an example of a plasma display device, an AC type plasma display device (hereinafter referred to as PDP) as shown in FIG. 4 has been known. Hereinafter, a panel configuration of a conventional PDP and an operation principle thereof will be described with reference to the drawings.
【０００３】同図において１１６は前面板であり１０６
は背面板である。In FIG. 1, reference numeral 116 denotes a front plate,
Is a back plate.
【０００４】ＰＤＰ１０１は前面板１１６と背面板１０
６とが対向に配置されその外周端縁部の間には、ガス放
電用空間を形成するために低融点ガラスからからなる封
止部材１１５により封止されており、その密閉空間に４
０ｋＰａ（３００Ｔｏｒｒ）〜６６．５ｋＰａ（５００
Ｔｏｒｒ）の希ガス（ヘリウム、キセノン、ネオン等の
混合ガス）が封入された構成である。The PDP 101 has a front panel 116 and a rear panel 10.
And a sealing member 115 made of low-melting glass to form a space for gas discharge.
0 kPa (300 Torr) to 66.5 kPa (500
Torr) (a mixed gas of helium, xenon, neon, etc.).
【０００５】背面板１０６は背面ガラス１０７と背面ガ
ラス１０７の表面にパターン形成されたアドレス電極１
０８とそれを覆うように成膜された背面板誘電体１０９
と複数の隔壁１１０と隔壁１１０同士の間に形成された
赤、青、緑の蛍光体１１１から構成されている。ここで
隔壁１１０は上記ガス放電用空間を仕切るための手段で
ある。このようにして仕切られた空間部１１２が発光領
域となるものであり、蛍光体１１１はこの発光領域ごと
に形成されている。The back plate 106 includes a back glass 107 and address electrodes 1 formed on the surface of the back glass 107 by patterning.
08 and back plate dielectric 109 formed so as to cover it
And a plurality of partitions 110 and red, blue, and green phosphors 111 formed between the partitions 110. Here, the partition wall 110 is a means for partitioning the gas discharge space. The space 112 thus partitioned serves as a light emitting region, and the phosphor 111 is formed for each light emitting region.
【０００６】一方、前面板１１６は前面ガラス１０２と
前面ガラス１０２の表面にパターン形成された透明電極
１１４とバス電極１０３とからなる表示電極とそれを覆
うように成膜された前面板誘電体１０４とその上に成膜
された酸化マグネシウムからなる保護膜１０５から構成
されている。On the other hand, the front plate 116 is composed of a front glass 102, a display electrode comprising a transparent electrode 114 and a bus electrode 103 formed on the surface of the front glass 102 and a front plate dielectric 104 formed to cover the display electrode. And a protective film 105 made of magnesium oxide formed thereon.
【０００７】ＰＤＰ１０１は背面板１０６のアドレス電
極１０８と前面板１１６のバス電極１０３及び透明電極
１１４とからなる表示電極とが直交している。In the PDP 101, the address electrodes 108 on the rear plate 106 are orthogonal to the display electrodes formed by the bus electrodes 103 and the transparent electrodes 114 on the front plate 116.
【０００８】以上のように構成されたＰＤＰ１０１はア
ドレス電極１０８、透明電極１１４とバス電極１０３と
から成る表示電極に適当なタイミングで電圧を印加する
ことにより表示画素に相当する隔壁１１０で仕切られた
空間部１１２で放電が起こり、紫外線が発生し紫外線に
より励起された赤、緑、青の蛍光体１１１から可視光が
放出され、それが画像として表示されるのである。The PDP 101 configured as described above is partitioned by partition walls 110 corresponding to display pixels by applying a voltage to a display electrode composed of the address electrode 108, the transparent electrode 114 and the bus electrode 103 at an appropriate timing. Discharge occurs in the space 112, ultraviolet rays are generated, and visible light is emitted from the red, green, and blue phosphors 111 excited by the ultraviolet rays, and the visible light is displayed as an image.
【０００９】次にこのようなＰＤＰの製造方法について
図４を参照しながら述べる。Next, a method of manufacturing such a PDP will be described with reference to FIG.
【００１０】同図における前面板１１６の表示電極は幅
の広い透明電極１１４と幅の狭い不透明のバス電極１０
３の２層構造を取るのが一般的である。まず前面ガラス
１０２に対して、ＩＴＯ（インジウム・スズ・オキサイ
ド）の透明電極１１４と、その上にバス電極として銀を
導電材料として混合した低融点ガラスフリット１０３を
フォトリソグラフィー法にて形成し、それを覆って前面
板誘電体１０４を成膜焼成し、その上に酸化マグネシウ
ムからなる保護膜１０５を成膜し作製する。In FIG. 1, the display electrodes of the front plate 116 are a wide transparent electrode 114 and a narrow opaque bus electrode 10.
It is common to adopt a two-layer structure of No. 3. First, a transparent electrode 114 of ITO (indium tin oxide) and a low melting glass frit 103 mixed with silver as a conductive material as a bus electrode are formed on the front glass 102 by a photolithography method. , A front plate dielectric 104 is formed and baked, and a protective film 105 made of magnesium oxide is formed thereon to produce.
【００１１】又、背面板１０６については背面ガラス１
０７上にアドレス電極１０８を形成する。このアドレス
電極１０８も銀を導電材料として混合した低融点ガラス
フリットをフォトリソグラフィー法にて形成する。それ
を覆って背面板誘電体１０９を成膜後、焼成し、その上
一面に印刷によって隔壁材料を成膜した後サンドブラス
ト法によって隔壁１１０を形成しない部分を削り取り焼
成工程を経てストライプ状になった隔壁１１０を形成す
る。その後隔壁１１０の間に印刷法によって蛍光体１１
１を赤、緑、青の各色ごとに充填し、乾燥、焼成して作
製する。The back plate 106 has a back glass 1
The address electrode 108 is formed on the address line 07. This address electrode 108 is also formed by photolithography of a low melting point glass frit mixed with silver as a conductive material. A back plate dielectric 109 was formed to cover it, baked, and a partition wall material was formed thereon by printing. After that, a portion where the partition wall 110 was not formed was cut off by sand blasting to form a stripe shape through a firing process. The partition 110 is formed. Then, the phosphor 11 is formed between the partition walls 110 by a printing method.
1 is filled for each color of red, green and blue, and dried and fired to produce.
【００１２】このようにして完成した前面板１１６と背
面板１０６を周囲に低融点ガラスの封止部材１１５を塗
布した後、焼成することで封止する。封止後のパネルは
チップ管１１３より真空引きした後希ガスを封入しチッ
プオフしてＰＤＰ１０１を完成させるものである。A sealing member 115 made of low melting glass is applied to the periphery of the front plate 116 and the rear plate 106 thus completed, and then fired to seal them. After sealing, the panel is vacuum-evacuated from the chip tube 113, filled with a rare gas and chip-off to complete the PDP 101.
【００１３】[0013]
【発明が解決しようとする課題】従来ＰＤＰの隔壁製造
法としては隔壁材料を全面に形成し不要部分を削り取る
サンドブラスト法や所定の位置に隔壁材料をペースト化
し印刷、乾燥する工程を１０回以上繰り返すスクリーン
印刷法が用いられ、隔壁形状もストライプ状が一般的で
ある。しかしこの隔壁形状では蛍光体１１１は隔壁１１
０の側壁と隔壁１１０間の背面板誘電体１０９の表面部
分しか形成されず、蛍光体１１１の発光面積が制約され
る。Conventionally, as a method of manufacturing a partition wall of a PDP, a step of forming a partition wall material on the entire surface and shaving off unnecessary portions, or a process of pasting the partition wall material at a predetermined position, printing and drying is repeated 10 times or more. A screen printing method is used, and the partition wall shape is generally a stripe shape. However, in this partition shape, the phosphor 111 is
Only the surface portion of the back plate dielectric 109 between the side wall 0 and the partition 110 is formed, and the light emitting area of the phosphor 111 is restricted.
【００１４】さらに、空間部１１２で発生した紫外線が
本来発光させない部分まで漏れ、この部分の蛍光体まで
発光させ、ＰＤＰのコントラストを低下させる一因とな
っている。Further, ultraviolet rays generated in the space 112 leak to a portion where light is not originally emitted, and light is emitted to the fluorescent material in this portion, which is one of the causes of lowering the contrast of the PDP.
【００１５】この問題を解決しＰＤＰの画質を向上させ
る方法として最小放電空間を格子状の隔壁で囲うＰＤＰ
が提案されている。放電空間を隔壁で囲うことにより発
光させる蛍光体だけを紫外線によって励起させることが
でき、コントラスト高めることができる。また、隔壁の
側壁面積が増しこれに形成させる蛍光体面積も広くなり
ＰＤＰの輝度向上もはかれる。As a method of solving this problem and improving the image quality of a PDP, a PDP in which a minimum discharge space is surrounded by grid-like partition walls
Has been proposed. By enclosing the discharge space with partition walls, only the phosphor that emits light can be excited by ultraviolet rays, and the contrast can be enhanced. Further, the area of the side wall of the partition wall is increased, the area of the phosphor formed thereon is increased, and the luminance of the PDP is improved.
【００１６】反面、この隔壁で囲まれた放電空間に放電
ガスを封入する際、まずＰＤＰを真空引きするがこの放
電空間の排気が困難となる。また、封入するガスの均一
性が得られない等の課題があり、隔壁の一部に開口部を
設け排気経路、放電ガスの通路を確保する手法が取られ
ている（特開平１１−２６０２６４号、特開平１１−３
０６９９３号）。On the other hand, when the discharge gas is filled in the discharge space surrounded by the partition walls, first, the PDP is evacuated, but it becomes difficult to exhaust the discharge space. In addition, there is a problem that the uniformity of the gas to be filled cannot be obtained, and a technique of providing an opening in a part of the partition wall to secure an exhaust path and a discharge gas path has been adopted (Japanese Patent Laid-Open No. 11-260264). JP-A-11-3
No. 06993).
【００１７】しかし、この開口部を従来工法で設けるに
は工程が煩雑となり生産性が悪く、また隔壁焼成時にア
ドレス電極と平行方向の隔壁と直交する接合部にクラッ
クが発生して隔壁強度を低下させる。このクラックは各
隔壁の収縮量の違いによって起こると考えられる。However, providing such an opening by the conventional method complicates the process and reduces productivity. In addition, cracks occur at the joints perpendicular to the partition walls in the direction parallel to the address electrodes when the partition walls are baked, and the partition wall strength is reduced. Let it. This crack is considered to be caused by the difference in the amount of shrinkage of each partition.
【００１８】さらに、アドレス電極と平行方向の隔壁と
直交する隔壁が接していない隔壁構造も提案されている
が、平行方向の隔壁と接していない隔壁は背面板誘電体
との接触面積が小さいためにその付着強度が弱いという
課題がある。Further, there has been proposed a partition structure in which a partition orthogonal to the partition in the direction parallel to the address electrode is not in contact with the partition, but the partition not in contact with the partition in the parallel direction has a small contact area with the back plate dielectric. There is a problem that the adhesive strength is weak.
【００１９】本発明の目的はこれらの課題を解決しクラ
ックの発生がなく付着強度の高い隔壁を実現でき、かつ
隔壁の一部に開口部を設け排気経路、放電ガスの通路を
確保したプラズマディスプレイ表示装置およびその製造
方法を提供することである。An object of the present invention is to solve these problems, to realize a partition having high adhesion strength without cracks, and to provide an exhaust path and a discharge gas path by providing an opening in a part of the partition. An object of the present invention is to provide a display device and a manufacturing method thereof.
【００２０】[0020]
【課題を解決するための手段】上記目的を達成する第１
の手段として本発明のプラズマディスプレイ表示装置
は、放電空間を規定する隔壁がアドレス電極と平行に形
成された第１隔壁と第１隔壁と直交方向に形成された第
２隔壁とを有し、第１隔壁、第２隔壁の隔壁幅が異なる
ことを特徴としたものであり、隔壁に発生するクラック
を防止し隔壁強度や付着強度の高い隔壁とすることがで
きるという作用を有する。A first aspect of the present invention for achieving the above object is as follows.
As means of the present invention, the plasma display device of the present invention has a first partition in which a partition defining a discharge space is formed in parallel with an address electrode, and a second partition formed in a direction orthogonal to the first partition. It is characterized in that the partition walls of the first partition and the second partition are different in width, and has an effect of preventing cracks generated in the partition and providing a partition having high partition strength and adhesion strength.
【００２１】また、上記目的を達成する第２の手段とし
て請求項２に記載のプラズマディスプレイ表示装置は、
第１隔壁または第２隔壁の一方に開口部が設けられてい
ることを特徴とし、放電空間内の排気経路、放電ガスの
通路を確保できるという作用を有する。According to a second aspect of the present invention, there is provided a plasma display apparatus comprising:
An opening is provided in one of the first partition and the second partition, which has an effect that an exhaust path and a discharge gas path in the discharge space can be secured.
【００２２】さらに請求項６に記載のプラズマディスプ
レイ表示装置の製造方法は、隔壁に設ける開口部は前記
隔壁の焼成時に形成することを特徴とし、従来工法で簡
便に隔壁に開口部を設けられるという作用を有する。Further, in the method of manufacturing a plasma display device according to the present invention, the opening provided in the partition is formed at the time of firing the partition, and the opening can be easily provided in the partition by a conventional method. Has an action.
【００２３】[0023]
【発明の実施の形態】（実施の形態１）以下本発明のプ
ラズマディスプレイ表示装置の実施の形態１を、図面に
基づいて説明する。(Embodiment 1) Hereinafter, Embodiment 1 of a plasma display device according to the present invention will be described with reference to the drawings.
【００２４】隔壁形成工程を実施するにあたってまず前
面板を作成するが、前面板は従来の仕様でよく、図４を
参照しながら以下に説明する。In carrying out the partition forming step, a front plate is first prepared. The front plate may have conventional specifications, and will be described below with reference to FIG.
【００２５】前面板１１６には前面ガラス１０２上に透
明電極１１４、銀を導電材料とした低融点ガラスフリッ
トからなるバス電極１０３とをフォトリソグラフィー法
にて形成する。次に前面板誘電体１０４をスクリーン印
刷法で形成しこれを焼成する。この後、保護膜１０５を
蒸着法によって成膜し、前面板１１６を完成させる。On the front plate 116, a transparent electrode 114 and a bus electrode 103 made of a low-melting glass frit using silver as a conductive material are formed on the front glass 102 by photolithography. Next, a front plate dielectric 104 is formed by a screen printing method, and is fired. After that, the protective film 105 is formed by an evaporation method, and the front plate 116 is completed.
【００２６】背面板についてもアドレス電極、背面板誘
電体は従来どおりである。以下図４を用いて背面板の製
造法について述べる。図４において背面板１０６もまず
銀を導電材料とした低融点ガラスフリットからなるアド
レス電極１０８をフォトリソグラフィー法にて背面ガラ
ス１０７上に形成する。次に背面板誘電体１０９を印刷
形成し、焼成する。この背面板誘電体１０９は透明でも
良いが、輝度を向上させる目的で白色に着色された材料
を用いてもかまわない。又、コントラストを向上させる
ために白色以外の色に着色された材料でも良い。As for the back plate, the address electrodes and the back plate dielectric are the same as in the conventional case. Hereinafter, a method of manufacturing the back plate will be described with reference to FIG. 4, an address electrode 108 made of a low melting point glass frit using silver as a conductive material is formed on a rear glass 107 by photolithography. Next, the back plate dielectric 109 is printed and fired. Although the back plate dielectric 109 may be transparent, a white colored material may be used for the purpose of improving luminance. Further, a material colored in a color other than white to improve contrast may be used.
【００２７】この背面板誘電体１０９上に隔壁を形成す
る工程を実施する。図１（ａ）は本実施形態の隔壁形状
を示している。以下、隔壁形成法について説明する。A step of forming a partition on the back plate dielectric 109 is performed. FIG. 1A shows the partition shape of the present embodiment. Hereinafter, the partition wall forming method will be described.
【００２８】まず隔壁材であるガラスフリットにアルミ
ナ等の骨材、樹脂、溶剤とからなるペーストをまず準備
し、ダイコート法でアドレス電極１０８と背面板誘電体
（図中省略）の形成された背面ガラスに１５０μｍの膜
厚で塗布し、８０〜１２０℃に加熱して溶剤を乾燥させ
た。この乾燥を熱風加熱で隔壁材塗布面から行うと塗布
膜の表面が先に乾燥し、塗布膜内部の溶剤が乾燥する際
に塗布膜表面に突起やクラックが発生しやすくなるの
で、赤外線加熱や背面ガラス側からの加熱が好ましい。First, a paste composed of an aggregate such as alumina, a resin, and a solvent is first prepared on a glass frit serving as a partition wall material, and the back surface on which the address electrode 108 and the back plate dielectric (not shown in the figure) are formed by a die coating method. The solution was applied to glass in a thickness of 150 μm, and heated to 80 to 120 ° C. to dry the solvent. If this drying is performed from the coating surface of the partition wall material by hot air heating, the surface of the coating film is dried first, and when the solvent inside the coating film is dried, projections and cracks are likely to be generated on the coating film surface. Heating from the back glass side is preferred.
【００２９】次に４０μｍ厚のドライフィルムレジスト
をラミネートする。このとき背面ガラス、ラミネートロ
ールは８０〜１２０℃に加熱しておく方が、隔壁材とレ
ジストとの接着力が増して好ましい。Next, a dry film resist having a thickness of 40 μm is laminated. At this time, it is preferable to heat the back glass and the laminating roll to 80 to 120 ° C. because the adhesion between the partition wall material and the resist increases.
【００３０】このレジストをフォトマスクを介して露光
後、アルカリ性の水溶液で現像を行いレジストに所定の
パターンを形成する。After exposing the resist through a photomask, the resist is developed with an alkaline aqueous solution to form a predetermined pattern on the resist.
【００３１】形成したレジストパターン部が隔壁となる
部分で、第２隔壁１２となるパターン部は第１隔壁１１
との接合部１３付近の隔壁幅を広くし、中心部に狭隙部
１４を形成する。空間部１１２は長辺側約１ｍｍ、短辺
側お０．３ｍｍの楕円形状としている。The formed resist pattern portion serves as a partition, and the second partition 12 has a pattern portion serving as a first partition 11.
The width of the partition wall in the vicinity of the junction 13 is increased, and a narrow gap 14 is formed at the center. The space 112 has an elliptical shape of about 1 mm on the long side and 0.3 mm on the short side.
【００３２】この状態でサンドブラスト法にて空間部１
１２の部分の隔壁材を削り取り除去する。In this state, the space 1 is formed by sandblasting.
The partition wall material of the portion 12 is scraped off.
【００３３】その後、ドライフィルムレジストを剥離し
て、最後に焼成温度４５０〜５５０℃で焼成して隔壁を
完成させる。Thereafter, the dry film resist is peeled off and finally baked at a calcination temperature of 450 to 550 ° C. to complete the partition.
【００３４】このとき、第２隔壁の中心部の狭隙部１４
の隔壁幅を１０μｍ以下で形成しておくと、隔壁焼成時
に隔壁材が収縮して隔壁に凹みが生じ開口部１５を形成
することができる（図１（ｂ））。At this time, the narrow gap 14 at the center of the second partition wall is formed.
When the partition wall width is set to 10 μm or less, the partition wall material shrinks at the time of baking of the partition wall, and the partition wall is dented, so that the opening 15 can be formed (FIG. 1B).
【００３５】さらに開口部を確実に形成するために事前
にレジストパターンに開口部を設けて、サンドブラスト
法にて焼成前の隔壁に開口部を形成しておいてもかまわ
ない。この焼成前の隔壁に開口部を形成する工法として
例えば印刷法を用いる場合、用いるスクリーン版の数が
増す、形成した隔壁の精度が得られない等の課題があ
る。Further, in order to form the opening surely, an opening may be provided in the resist pattern in advance, and the opening may be formed in the partition wall before firing by a sandblast method. For example, when a printing method is used as a method of forming an opening in the partition wall before firing, there are problems such as an increase in the number of screen plates to be used and inaccuracy of the formed partition wall.
【００３６】また、隔壁の精度が比較的得られるフォト
・埋め込み法では同一高さの隔壁しか形成することがで
きず、隔壁に開口部を設ける新たな工法が必要となる。Further, in the photo-embedding method in which the accuracy of the partition can be relatively obtained, only the partition having the same height can be formed, and a new method of providing an opening in the partition is required.
【００３７】本発明によれば隔壁に狭隙部を設け、隔壁
焼成時の収縮を用いて凹みを発生させることにより、フ
ォト・埋め込み工法等で同一高さの隔壁しか形成できな
い工法でも容易に隔壁に開口部を設けることが可能で、
放電空間の排気経路、放電ガスの通路を確保できる。According to the present invention, the partition is provided with a narrow gap, and the recess is generated by using shrinkage during the baking of the partition, so that the partition can be easily formed even by the method of forming only the same height by the photo-embedding method. It is possible to provide an opening in the
The exhaust path of the discharge space and the path of the discharge gas can be secured.
【００３８】隔壁焼成後に発生するクラックについても
第２隔壁１２は第１隔壁１１との接合部１３付近の隔壁
幅を広くし、中心部に狭隙部１４を形成することにより
防止できる。クラックは第１隔壁１１と第２隔壁１２の
隔壁幅がほぼ同じである場合に接合部１３のコーナ部１
６に、各隔壁の収縮による応力が集中して起こる。The cracks generated after the baking of the partition can also be prevented by increasing the width of the partition near the junction 13 with the first partition 11 and forming the narrow gap 14 at the center. When the first partition 11 and the second partition 12 have substantially the same partition width, cracks occur in the corners 1 of the joint 13.
6, stress due to the shrinkage of each partition is concentrated.
【００３９】第２隔壁１２に狭隙部１４を設けることに
より、この収縮による応力を分散させることができクラ
ックの発生が防止でき、隔壁の強度を 確保できる。By providing the narrow space 14 in the second partition 12, the stress due to this shrinkage can be dispersed, the occurrence of cracks can be prevented, and the strength of the partition can be ensured.
【００４０】接合部１３のコーナ部１６をＲ形状とする
とさらにこの効果を高めることができる。This effect can be further enhanced by forming the corner portion 16 of the joint portion 13 into an R shape.
【００４１】また、第１隔壁１１と第２隔壁１２は接合
部１３で接合されているので、隔壁幅の狭い隔壁１２の
背面板誘電体との付着力は第２隔壁が単独で形成されて
いる場合よりはるかに高くなる。Further, since the first partition 11 and the second partition 12 are joined at the joint portion 13, the adhesive force of the partition 12 having a small partition width to the back plate dielectric is such that the second partition is formed alone. Much higher than if you were.
【００４２】本実施形態ではアドレス電極１０８と直交
する隔壁１２に狭隙部１４を設けたが、アドレス電極１
０８と平行方向に形成する第１隔壁に、あるいは両隔壁
に狭隙部を設けてもかまわない。In this embodiment, the narrow space 14 is provided in the partition wall 12 orthogonal to the address electrode 108.
A narrow space may be provided in the first partition wall formed in a direction parallel to 08 or both partition walls.
【００４３】その後各隔壁に仕切られた空間部１１２に
印刷法によって蛍光体１１１を充填し、乾燥、焼成して
背面板１０６を作製する（以下図４参照）。Thereafter, the phosphors 111 are filled in the spaces 112 partitioned by the partition walls by a printing method, dried and fired to produce the back plate 106 (see FIG. 4).
【００４４】このようにして完成した前面板１１６と背
面板１０６を周囲に低融点ガラスを封止部材１１５を塗
布した後、焼成することで封止しＰＤＰ１０１とする。
最後にチップ管１１３より空間部１１２を真空引きした
後、４０ｋＰａ（３００Ｔｏｒｒ）〜６６．５ｋＰａ
（５００Ｔｏｒｒ）の希ガス（ヘリウム、キセノン、ネ
オン等の混合ガス）を封入しＰＤＰ１０１を完成させ
る。A low-melting glass is applied around the completed front plate 116 and back plate 106 with a sealing member 115 and then fired to seal the PDP 101.
Finally, after evacuating the space 112 from the chip tube 113, the pressure is reduced from 40 kPa (300 Torr) to 66.5 kPa.
A rare gas (mixed gas of helium, xenon, neon, or the like) of (500 Torr) is sealed to complete the PDP 101.
【００４５】（実施の形態２）次に本発明のプラズマデ
ィスプレイ表示装置の実施の形態２について説明する。(Embodiment 2) Next, Embodiment 2 of the plasma display device of the present invention will be described.
【００４６】実施の形態１と異なるのは、第２隔壁の狭
隙部を第１隔壁との間に設け開口部を形成する点であ
る。The difference from the first embodiment is that a narrow portion of the second partition is provided between the second partition and the first partition to form an opening.
【００４７】図２は第１隔壁１１から一方方向に第２隔
壁を設けた実施形態、図３は交互に第２隔壁を設けた実
施形態を示す。FIG. 2 shows an embodiment in which second partitions are provided in one direction from the first partitions 11, and FIG. 3 shows an embodiment in which second partitions are provided alternately.
【００４８】いずれの実施形態でも第２隔壁１２の一辺
は第１隔壁１１と接合されており、接合部付近の第２隔
壁幅を広く、開口部１５を形成する辺は細く形成する。In any of the embodiments, one side of the second partition 12 is joined to the first partition 11, and the width of the second partition near the junction is wide, and the side forming the opening 15 is narrow.
【００４９】この状態で隔壁を焼成すると開口部１５側
に比較的大きな凹みを持った第２隔壁１２を形成でき
る。When the partition is fired in this state, the second partition 12 having a relatively large recess on the opening 15 side can be formed.
【００５０】この隔壁の形成法、効果等は実施の形態１
と同じである。The method of forming the partition and the effects thereof are described in Embodiment 1.
Is the same as
【００５１】なお、図中では第１隔壁１１と第２隔壁１
２の間に開口部１５を設けているが、この間が接合され
ていてもかまわない。The first partition 11 and the second partition 1 are shown in FIG.
Although the opening 15 is provided between the two, the opening may be joined.
【００５２】[0052]
【発明の効果】本発明によれば従来の隔壁形成法を用い
て隔壁に開口部を設け、放電空間の排気経路、放電ガス
の通路を確保できる。According to the present invention, an opening is formed in a partition wall by using a conventional partition wall forming method, and an exhaust path of a discharge space and a discharge gas path can be secured.
【００５３】また、隔壁焼成時に発生する収縮による応
力を分散させ、隔壁に発生するクラックを防止し、隔壁
の付着力、強度を高めることが可能となりプラズマディ
スプレイ表示装置の性能を向上させることができる。Further, stress due to shrinkage generated at the time of baking of the partition walls is dispersed, cracks generated at the partition walls are prevented, and the adhesion and strength of the partition walls can be increased, so that the performance of the plasma display device can be improved. .
【図１】本発明の実施の形態１に係わるプラズマディス
プレイ表示装置の隔壁概略を示す上面図および断面図FIG. 1 is a top view and a cross-sectional view schematically showing a partition wall of a plasma display device according to a first embodiment of the present invention.
【図２】本発明の実施の形態２に係わるプラズマディス
プレイ表示装置の隔壁概略を示す上面図（その１）FIG. 2 is a top view schematically showing a partition wall of a plasma display device according to a second embodiment of the present invention (part 1);
【図３】本発明の実施の形態２に係わるプラズマディス
プレイ表示装置の隔壁概略を示す上面図（その２）FIG. 3 is a top view schematically showing a partition wall of the plasma display device according to the second embodiment of the present invention (part 2);
【図４】プラズマディスプレイ表示装置の概略構成を示
す斜視図FIG. 4 is a perspective view showing a schematic configuration of a plasma display device.
１１ 第１隔壁 １２ 第２隔壁 １３ 接合部 １４ 狭隙部 １５ 開口部 １６ コーナ部 １０１ ＰＤＰ １０２ 前面ガラス １０３ バス電極 １０４ 前面板誘電体 １０５ 保護膜 １０６ 背面板 １０７ 背面ガラス １０８ アドレス電極 １０９ 背面板誘電体 １１０ 隔壁 １１１ 蛍光体 １１２ 空間部 １１３ チップ管 １１４ 透明電極 １１５ 封止部材 １１６ 前面板 DESCRIPTION OF SYMBOLS 11 1st partition 12 Second partition 13 Joining part 14 Narrow part 15 Opening 16 Corner 101 PDP 102 Front glass 103 Bus electrode 104 Front plate dielectric 105 Protective film 106 Back plate 107 Back glass 108 Address electrode 109 Back plate dielectric Body 110 Partition wall 111 Fluorescent substance 112 Space section 113 Chip tube 114 Transparent electrode 115 Sealing member 116 Front plate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 茂夫 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 青木 正樹 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5C027 AA09 5C040 FA01 GF03 GF12 GF19 JA13 JA15 MA03 MA10 MA23 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Shigeo Suzuki 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. (72) Inventor Masaki 1006 Okadoma Kadoma Kadoma, Osaka Pref. Matsushita Electric Industrial F Terms (reference) 5C027 AA09 5C040 FA01 GF03 GF12 GF19 JA13 JA15 MA03 MA10 MA23
Claims (6)
と平行に形成された第１隔壁と前記第１隔壁と直交方向
に形成された第２隔壁とを有し、前記第１隔壁、第２隔
壁の隔壁幅が異なることを特徴とするプラズマディスプ
レイ表示装置。A first partition formed in parallel with the address electrode and a second partition formed in a direction orthogonal to the first partition, wherein the first partition and the second partition are formed in a direction perpendicular to the first partition; A plasma display device, wherein the partition walls have different partition widths.
も一方に開口部が設けられていることを特徴とする請求
項１に記載のプラズマディスプレイ表示装置。2. The plasma display device according to claim 1, wherein at least one of the first partition and the second partition has an opening.
一部分に設けられていることを特徴とする請求項１から
２のいずれか１項に記載のプラズマディスプレイ表示装
置。3. The plasma display device according to claim 1, wherein the opening is provided in a part of the first partition and the second partition.
ることを特徴とする請求項１から２のいずれか１項に記
載のプラズマディスプレイ表示装置。4. The plasma display device according to claim 1, wherein the opening is provided between the first partition and the second partition.
辺が接していることを特徴とする請求項１から４のいず
れか１項に記載のプラズマディスプレイ表示装置。5. The plasma display device according to claim 1, wherein at least one side of the first partition and the second partition are in contact with each other.
ることを特徴とする請求項１から５のいずれか１項に記
載のプラズマディスプレイ表示装置の製造方法。6. The method according to claim 1, wherein the opening is formed when the partition is fired.
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|---|---|---|---|
| JP2000325295A JP3409784B2 (en) | 2000-10-25 | 2000-10-25 | Plasma display device and method of manufacturing the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000325295A JP3409784B2 (en) | 2000-10-25 | 2000-10-25 | Plasma display device and method of manufacturing the same |
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| Publication Number | Publication Date |
|---|---|
| JP2002134032A true JP2002134032A (en) | 2002-05-10 |
| JP3409784B2 JP3409784B2 (en) | 2003-05-26 |
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ID=18802680
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|---|---|---|---|
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100486912B1 (en) * | 2002-06-21 | 2005-05-03 | 엘지전자 주식회사 | Plasma display panel |
| KR100542765B1 (en) * | 2003-05-23 | 2006-01-20 | 엘지전자 주식회사 | Plasma display panel |
| US7187125B2 (en) | 2002-12-17 | 2007-03-06 | Samsung Sdi Co., Ltd. | Plasma display panel |
| EP1655760A3 (en) * | 2004-11-09 | 2009-01-21 | LG Electronics, Inc. | Plasma display apparatus |
| US7580095B2 (en) | 2004-10-20 | 2009-08-25 | Sharp Kabushiki Kaisha | Substrate for display device |
-
2000
- 2000-10-25 JP JP2000325295A patent/JP3409784B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100486912B1 (en) * | 2002-06-21 | 2005-05-03 | 엘지전자 주식회사 | Plasma display panel |
| US7187125B2 (en) | 2002-12-17 | 2007-03-06 | Samsung Sdi Co., Ltd. | Plasma display panel |
| KR100542765B1 (en) * | 2003-05-23 | 2006-01-20 | 엘지전자 주식회사 | Plasma display panel |
| US7580095B2 (en) | 2004-10-20 | 2009-08-25 | Sharp Kabushiki Kaisha | Substrate for display device |
| EP1655760A3 (en) * | 2004-11-09 | 2009-01-21 | LG Electronics, Inc. | Plasma display apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3409784B2 (en) | 2003-05-26 |
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