JP2002103229A - Method and device for grinding/polishing/cleaning - Google Patents
Method and device for grinding/polishing/cleaningInfo
- Publication number
- JP2002103229A JP2002103229A JP2000288682A JP2000288682A JP2002103229A JP 2002103229 A JP2002103229 A JP 2002103229A JP 2000288682 A JP2000288682 A JP 2000288682A JP 2000288682 A JP2000288682 A JP 2000288682A JP 2002103229 A JP2002103229 A JP 2002103229A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- polishing
- container
- abrasive grains
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、 移動する被処理
品に砥粒を投射して前記被処理品を研掃する研掃方法お
よびその装置の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for blasting a workpiece by projecting abrasive grains on a moving workpiece.
【０００２】[0002]
【従来の技術】従来、この種の研掃装置として、被処理
品に砥粒を投射するに当たり、被処理品を収納する略円
筒形の有底ドラムを傾斜させた状態で軸線を中心にして
一定方向へ回転させて被処理品を攪拌するように構成さ
れたものや、無端ベルトを垂直面内で回転可能に配設す
るとともに無端ベルトの左右両端に円盤を設けて研掃室
を構成して無端ベルトを一定方向へ回転させて被処理品
を攪拌するように構成されたものがある。2. Description of the Related Art Conventionally, as a polishing apparatus of this type, when projecting abrasive grains on a workpiece, a substantially cylindrical bottomed drum for accommodating the workpiece is inclined about an axis. A cleaning chamber is constructed by rotating in a certain direction to stir the workpiece, or by arranging an endless belt rotatably in a vertical plane and providing disks on both left and right ends of the endless belt. In some cases, the endless belt is rotated in a predetermined direction to stir the workpiece.
【０００３】[0003]
【発明が解決しようとする課題】しかし、このように構
成された従来の研掃装置のうち前者では、被処理品の移
動性が悪いため、特に有底ドラム内の底部に位置する被
処理品が、上方へ移動して投射される砥粒に当たる頻度
が少なく、したがって、全部の被処理品を所要の状態に
研掃するのに時間が非常にかかり、また、後者では、被
処理品が無端ベルト内を幅方向である左右方向へはほと
んど移動しないため、被処理品に研掃むらが生じるなど
の問題があった。However, in the former polisher of the above-described construction, the former has a poor mobility of the workpiece, and therefore the workpiece located particularly at the bottom of the bottomed drum. However, the frequency with which the abrasive grains are moved upward and hit the projected particles is low, and therefore it takes a long time to clean all the workpieces to a required state, and in the latter case, the workpieces are endless. Since it hardly moves in the width direction, that is, the left and right direction in the belt, there is a problem in that the object to be processed may be scrubbed.
【０００４】本発明は、上記の事情に鑑みて成されたも
ので、その目的は、比較的小型あるいは中型の被処理品
に全体に亘って効率良く砥粒を当てて被処理品を短時間
にして研掃むらなく研掃することができる研掃方法およ
びその装置を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to efficiently apply abrasive grains over a relatively small or medium-sized workpiece and to shorten the workpiece in a short time. It is an object of the present invention to provide a lapping method and a lapping method capable of lapping without even lapping.
【０００５】[0005]
【課題を解決するための手段】上記の目的を達成するた
めに本発明は、 移動する被処理品に砥粒を投射して前
記被処理品を研掃する研掃方法において、前記被処理品
を収納した容器を、または前記被処理品を保持した保持
手段を、前後方向および左右方向へ同時にまたは順次に
所要角度回動させて前記被処理品を前記容器内または空
間内において広い範囲に亘って移動あるいは攪拌させな
がら前記被処理品に砥粒を当てて前記被処理品を研掃す
ることを特徴とする。In order to achieve the above object, the present invention relates to a polishing method for blasting a workpiece by projecting abrasive grains on a moving workpiece. Or the holding means holding the article to be processed is simultaneously or sequentially rotated at a required angle in the front-rear direction and the left-right direction so that the article to be processed covers a wide range in the container or space. The object to be processed is polished by applying abrasive grains to the object while moving or stirring the object.
【０００６】なお、本発明において、被処理品が容器内
を滑降あるいは転動して移動できるように容器の回動速
度を制御して、容器を前後方向および左右方向へ同時に
または順次に所要角度回動させると、被処理品は、容器
内で滑降あるいは転動しながら比較的長い距離移動して
投射される砥粒が確実に当たることとなる。In the present invention, the rotation speed of the container is controlled so that the article to be processed can slide down or roll inside the container, and the container is moved simultaneously or sequentially in the front-rear direction and the left-right direction by a required angle. When the object is rotated, the object to be processed moves relatively long distance while sliding down or rolling in the container, and is reliably hit by the projected abrasive grains.
【０００７】なおまた、本発明において、投射される砥
粒が被処理品に十分当たるように被処理品を保持する保
持手段の回動速度を制御して、保持手段を前後方向およ
び左右方向へ同時にまたは順次に所要角度回動させる
と、被処理品は全面に亘って投射される砥粒が確実に当
たることとなる。Further, in the present invention, the rotation speed of the holding means for holding the workpiece is controlled so that the projected abrasive particles sufficiently hit the workpiece, and the holding means is moved in the front-rear direction and the left-right direction. Simultaneously or sequentially rotating by a required angle ensures that the abrasive grains projected onto the entire surface of the workpiece hit the surface.
【０００８】[0008]
【発明の実施の形態】以下、本発明を適用した研掃装置
の実施例について図１〜図４に基づき詳細に説明する。
第1実施例の研掃装置は、図１および図2に示すように、
一部に研掃室１を構成するキャビネット２と、前記研掃
室１内に配置されて被処理品を収納する容器３と、容器
３を前後方向および左右方向へそれぞれ所要角度回動さ
せる回動手段４と、前記キャビネット２に装着されて前
記容器３に向けて砥粒を投射する砥粒投射機構５と、で
構成してあり、前記容器３には砥粒が貫流可能な細孔が
多数透設してある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a polishing apparatus to which the present invention is applied will be described below in detail with reference to FIGS.
As shown in FIGS. 1 and 2, the polishing apparatus of the first embodiment
A cabinet 2 partially constituting the cleaning chamber 1, a container 3 disposed in the cleaning chamber 1 for storing the object to be processed, and a rotating unit for rotating the container 3 by a required angle in the front-rear direction and the left-right direction. Moving means 4 and an abrasive grain projection mechanism 5 mounted on the cabinet 2 and projecting abrasive grains toward the container 3. The container 3 has pores through which abrasive grains can flow. Many are transparent.
【０００９】そして、図3に示すように、前記回動手段
４においては、コの字状の保持部材６に前記容器３が第
1減速機付きモータ７によって前後方向へ回動可能にし
て装着してあり、さらに、前記容器３の左右外側面には
円盤状の遮蔽板８・８が固着してある。また、前記保持
部材６の外面中央部には水平に延びる回転軸９の一端が
固着してあり、回転軸９の他端には前記キャビネット２
に装着された第2減速機付きモータ１０の出力軸が連結
してある（図2参照）。As shown in FIG. 3, in the rotating means 4, the container 3 is attached to a U-shaped holding member 6.
(1) It is mounted so as to be rotatable in the front-rear direction by a motor 7 with a speed reducer, and furthermore, disc-shaped shielding plates 8.8 are fixed to the left and right outer surfaces of the container 3. One end of a horizontally extending rotating shaft 9 is fixed to the center of the outer surface of the holding member 6, and the other end of the rotating shaft 9 is attached to the cabinet 2.
The output shaft of the second motor with speed reducer 10 is connected (see FIG. 2).
【００１０】このように構成したものは、容器３に被処
理品を収納したのち、回動手段４の第1・第2減速機付き
モータ７・１０を同時にまたは順次正逆回転駆動して容
器３を前後方向および左右方向へ同時にまたは順次に所
要角度回動（正逆回転）させて被処理品を容器３内にお
いて広い範囲に亘って移動させるとともに攪拌させなが
ら、砥粒投射機構５から砥粒を投射する。これにより、
被処理品は全体に亘って砥粒が当たり研掃される。In the above-described apparatus, after the article to be processed is stored in the container 3, the motors 7 and 10 with the first and second reduction gears of the rotating means 4 are simultaneously or sequentially driven to rotate forward and backward. The workpiece 3 is rotated (forward / reverse rotation) simultaneously or sequentially in the front-rear direction and the left-right direction by a required angle (forward / reverse rotation) to move the article to be processed in the container 3 over a wide range and to agitate the workpiece. Project the grains. This allows
The article to be processed is entirely polished with abrasive grains.
【００１１】なお、上記の実施例において被処理品の移
動効果を確認すべく、従来の研掃装置との比較テストを
行なった。すなわち、直径３０ｍｍ、長さ２０ｍｍの円
柱状の被処理品を多数、容器３に収納し、この容器３
を、まず６．５ｒｐｍの回転数で前後方向における一方
向へ所定角度回転させると同時に、１．９ｒｐｍの回転
数で左右方向における一方向へ所定角度回転させ、１．
２秒後に前後方向における他方向へ所定角度逆転させ、
１．２秒後に前後方向における一方向へ所定角度回転さ
せると同時に、左右方向における他方向へ所定角度逆転
させた。Incidentally, in order to confirm the effect of moving the article to be processed in the above embodiment, a comparative test was performed with a conventional polishing apparatus. That is, a large number of cylindrical articles to be processed having a diameter of 30 mm and a length of 20 mm are stored in the container 3.
First, at a rotation speed of 6.5 rpm, a predetermined angle is rotated in one direction in the front-back direction, and at the same time, a rotation angle of 1.9 rpm is rotated a predetermined angle in one direction in the left-right direction.
After 2 seconds, it is reversed by a predetermined angle in the other direction in the front and rear direction,
After 1.2 seconds, it was rotated by a predetermined angle in one direction in the front-rear direction, and at the same time, it was reversed by a predetermined angle in another direction in the left-right direction.
【００１２】一方、従来の研掃装置においては、同じ被
処理品を多数、容器内に収納し、この容器を所定角度傾
斜させた状態で一方向へ本発明の研掃装置の所要時間の
同じ時間回転させた。この比較テストの結果、本発明の
研掃装置においては、従来の研掃装置よりも約５０％増
しの被処理品が砥粒の当たる位置に移動する現象が見ら
れた。On the other hand, in a conventional polishing apparatus, a large number of the same articles to be processed are stored in a container, and the required time of the cleaning apparatus of the present invention is the same in one direction while the container is inclined at a predetermined angle. Rotated for hours. As a result of this comparison test, a phenomenon was observed in the polishing apparatus according to the present invention in which an object to be processed, which is about 50% more than that of the conventional polishing apparatus, moved to the position where the abrasive particles hit.
【００１３】なおまた、上記の実施例は、被処理品が比
較的小さい場合であるが、被処理品が比較的大きい場合
には、図4に示すように、容器３の代りに被処理品を載
せて保持するターンテーブル２３を支持部材２６に第1
減速機付きモータ７によって水平面内で前後方向へ回動
可能に装着するとともに、前記支持部材２６を第2減速
機付きモータ１０によって左右方向へ同時にまたは順次
回動するようにしてもよい。In the above embodiment, the article to be treated is relatively small. However, when the article to be treated is relatively large, as shown in FIG. The turntable 23 for mounting and holding the first
The motor 7 with a speed reducer may be mounted so as to be rotatable in the front-rear direction in a horizontal plane, and the support member 26 may be simultaneously or sequentially rotated in the left-right direction by the motor 10 with a second speed reducer.
【００１４】このように構成したものは、ターンテーブ
ル２３上に被処理品をセットしたのち、第1・第２減速
機付きモータ７・１０を所定角度正逆回転して被処理品
をセットしたをターンテーブル２３を所要の速度で、前
後方向および左右方向へ同時にまたは順次に所要角度回
動させると、被処理品は、投射される砥粒が全面に亘っ
て確実に当たることとなる。In the apparatus having the above-described structure, after the article to be processed is set on the turntable 23, the motors 7 and 10 with the first and second reduction gears are rotated forward and backward by a predetermined angle to set the article to be processed. When the turntable 23 is rotated at a required speed in the front-rear direction and the left-right direction simultaneously or sequentially at a required angle, the object to be processed surely hits the projected abrasive grains over the entire surface.
【００１５】[0015]
【発明の効果】以上の説明から明らかなように本発明
は、移動する被処理品に砥粒を投射して前記被処理品を
研掃する研掃方法において、前記被処理品を収納した容
器を、または前記被処理品を保持した保持手段を、前後
方向および左右方向へ同時にまたは順次に所要角度回動
させて前記被処理品を前記容器内または空間内において
広い範囲に亘って移動あるいは攪拌させながら前記被処
理品に砥粒を当てて前記被処理品を研掃するから、比較
的小型あるいは中型の被処理品に全体に亘って効率良く
砥粒を当てて被処理品を短時間にして研掃むらなく研掃
することができるなどの優れた実用的効果を奏する。As is apparent from the above description, the present invention relates to a polishing method for blasting a workpiece by projecting abrasive grains on a moving workpiece, wherein the container accommodating the workpiece is provided. Or the holding means holding the object to be processed is simultaneously or sequentially rotated by a required angle in the front and rear direction and the left and right direction to move or agitate the object to be processed over a wide range in the container or space. Since the object to be processed is polished by applying abrasive grains to the object to be processed, the abrasive is efficiently applied to the relatively small or medium-sized object to be processed, and the object to be processed is shortened in a short time. It has excellent practical effects such as being able to clean without even polishing.
【図１】本発明を適用した一実施例の概略正面図であ
る。FIG. 1 is a schematic front view of an embodiment to which the present invention is applied.
【図２】図1の右側面図である。FIG. 2 is a right side view of FIG.
【図３】本発明における一実施例の主要部の斜視図であ
る。FIG. 3 is a perspective view of a main part of one embodiment of the present invention.
【図４】本発明における他の実施例の主要部の斜視図で
ある。FIG. 4 is a perspective view of a main part of another embodiment of the present invention.
３ 容器 ４ 回動手段 ２３ ターンテーブル 3 container 4 rotating means 23 turntable
Claims (3)
被処理品を研掃する研掃方法において、前記被処理品を
収納した容器を前後方向および左右方向へ同時にまたは
順次に所要角度回動させて前記被処理品を前記容器内に
おいて広い範囲に亘って移動あるいは攪拌させながら前
記被処理品に砥粒を当てて前記被処理品を研掃すること
を特徴とする研掃方法。1. A polishing method for blasting a workpiece by projecting abrasive grains on a moving workpiece, wherein a container accommodating the workpiece is simultaneously or sequentially required in a front-rear direction and a left-right direction. A polishing method, wherein the object is polished by applying abrasive grains to the object while moving or stirring the object over a wide range in the container by rotating the object by an angle. .
被処理品を研掃する研掃方法において、前記被処理品を
保持した保持手段を前後方向および左右方向へ同時にま
たは順次に所要角度回動させて前記被処理品を空間にお
いて広い範囲に亘って移動あるいは攪拌させながら被処
理品に砥粒を当てて前記被処理品を研掃することを特徴
とする研掃方法。2. A polishing method for projecting abrasive grains onto a moving workpiece by polishing the workpiece, wherein the holding means holding the workpiece is simultaneously or sequentially moved in the front-rear direction and the left-right direction. A polishing method, wherein the object to be processed is polished by applying abrasive grains to the object while moving or stirring the object over a wide range in space by rotating the object by a required angle.
被処理品を研掃する研掃装置において、前記被処理品を
収納する容器または前記被処理品を保持する保持手段を
前後方向および左右方向へそれぞれ同時にまたは順次に
所要角度回動させる回動手段を具備したことを特徴とす
る研掃装置。3. A polishing apparatus for projecting abrasive grains onto a moving workpiece by polishing the workpiece, wherein a container for accommodating the workpiece or holding means for holding the workpiece is moved back and forth. A polishing apparatus comprising a rotating means for simultaneously or sequentially rotating a required angle in a direction and a left and right direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000288682A JP2002103229A (en) | 2000-09-22 | 2000-09-22 | Method and device for grinding/polishing/cleaning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000288682A JP2002103229A (en) | 2000-09-22 | 2000-09-22 | Method and device for grinding/polishing/cleaning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002103229A true JP2002103229A (en) | 2002-04-09 |
Family
ID=18772223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000288682A Pending JP2002103229A (en) | 2000-09-22 | 2000-09-22 | Method and device for grinding/polishing/cleaning |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002103229A (en) |
-
2000
- 2000-09-22 JP JP2000288682A patent/JP2002103229A/en active Pending
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