JP2002093257A - Mica substrate sheet body and insulated coil - Google Patents
Mica substrate sheet body and insulated coilInfo
- Publication number
- JP2002093257A JP2002093257A JP2000277400A JP2000277400A JP2002093257A JP 2002093257 A JP2002093257 A JP 2002093257A JP 2000277400 A JP2000277400 A JP 2000277400A JP 2000277400 A JP2000277400 A JP 2000277400A JP 2002093257 A JP2002093257 A JP 2002093257A
- Authority
- JP
- Japan
- Prior art keywords
- mica
- layer
- backing material
- weight
- inorganic powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Insulated Conductors (AREA)
- Insulating Bodies (AREA)
- Insulating Of Coils (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気用品、特に発
電機等の電気機器におけるコイル、特に高電圧コイルの
絶縁層を形成する際に用いるマイカ基材シート状体及び
これを用いた絶縁コイルに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mica substrate sheet used for forming an insulating layer of a coil, particularly a high voltage coil, in an electric appliance, particularly an electric device such as a generator, and an insulating coil using the same. About.
【０００２】[0002]
【従来の技術】発電機等の電気機器における回転子や固
定子に用いられるコイルの巻線の束を絶縁するために絶
縁特性のよいマイカ材料を用いることが行われている。
この場合、マイカを主成分として抄造した絶縁紙をコイ
ルの絶縁用に用いると、その絶縁紙の熱伝導性が悪く、
動作中のコイルにより発生した熱を放熱し難いためコイ
ルは蓄熱し易く、コイルの電気特性に悪影響を与え、電
気機器としての性能を維持する上では問題がある。特に
最近は小型で、高性能の電気機器の出現が要望されてい
るのでその問題が大きくなりつつある。この問題を解決
するために、特公昭５６−３８００６号公報に記載され
ているように、マイカと合成繊維フィブリッドを混抄す
る際にマイカより熱伝導性の良い無機質粉末を含有させ
たマイカ基材シートをコイルに巻き付け、その後樹脂を
含浸させるか、特開昭６３−１１０９２９号公報に記載
されているようにガラス繊維織布にポリエチレングリコ
ールテレフタレート膜によりマイカテープを接着させた
絶縁テープをコイルに巻付けた後、マイカより熱伝導性
の良い無機質粉末を含有させた樹脂を含浸させ、いずれ
の場合も絶縁層の熱伝導性を改善することが提案されて
いる。2. Description of the Related Art In order to insulate a bundle of windings of a coil used for a rotor or a stator in an electric device such as a generator, a mica material having good insulating properties has been used.
In this case, if insulating paper made of mica as a main component is used for insulating the coil, the thermal conductivity of the insulating paper is poor,
Since it is difficult to dissipate the heat generated by the coil during operation, the coil is likely to store heat, adversely affecting the electrical characteristics of the coil, and has a problem in maintaining the performance as an electric device. In particular, recently, there has been a demand for the appearance of small-sized and high-performance electric devices, and the problem is increasing. In order to solve this problem, as described in JP-B-56-38006, a mica base sheet containing an inorganic powder having better heat conductivity than mica when mixing mica and synthetic fiber fibrids is used. Is wound around a coil and then impregnated with a resin, or as described in JP-A-63-110929, an insulating tape in which a mica tape is adhered to a glass fiber woven fabric with a polyethylene glycol terephthalate film is wound around the coil. After that, it has been proposed to impregnate a resin containing an inorganic powder having better thermal conductivity than mica, and to improve the thermal conductivity of the insulating layer in any case.
【０００３】しかしながら、前者は、マイカより熱伝導
性の良い無機質粉末の粒径が３０μｍより小さいと、合
成繊維フィブリッドとマイカとともに抄造する際に抄き
網から抜け落ち、その抄造歩留まりが悪いということが
あるため、その粒径は３０μｍ〜１００μｍに限定さ
れ、合成繊維フィブリッドとマイカの混合層の小さい隙
間を十分に埋めることができず、その隙間の空気の存在
により熱伝導性を十分に向上させることができないとい
う問題があった。また、後者は、その粒径を０．１μｍ
〜１５μｍのように逆に小さくしているが、樹脂ととも
に含浸されるので絶縁テープの隙間に浸透するその流通
抵抗が大きく、特に奥の細かい隙間には樹脂だけが浸透
し無機質粒子は表面側に引っ掛かって奥まで浸透でき
ず、その含浸層が不均一になり易く、その浸透にも時間
がかかり生産性が良くないという問題や、さらには無機
質粉末を含浸用樹脂液に混ぜる作業が必要になり、通常
は絶縁材料を提供する側と、これを使用する側は異なる
ので、その使用者側にその負担を強いることは生産性の
点で好ましくなく、一方絶縁材料の供給者と含浸用樹脂
の供給者は異なる場合が多いので、これらのどちら側で
その作業を行う場合にも余分な負担になり生産性を害す
るという問題がある。[0003] However, in the former, if the particle size of the inorganic powder having better thermal conductivity than mica is smaller than 30 µm, the inorganic powder falls off from the paper net when forming with synthetic fiber fibrid and mica, and the papermaking yield is poor. Therefore, the particle size is limited to 30 μm to 100 μm, it is not possible to sufficiently fill a small gap between the mixed layer of synthetic fiber fibrid and mica, and the heat conductivity is sufficiently improved by the presence of air in the gap. There was a problem that can not be. The latter has a particle size of 0.1 μm
On the contrary, although it is small as ~ 15 μm, since it is impregnated with the resin, its flow resistance that penetrates into the gap of the insulating tape is large, especially only the resin penetrates into the fine gap inside and the inorganic particles are on the surface side. The impregnated layer tends to be uneven because it is caught and cannot be penetrated deeply.The impregnated layer tends to be non-uniform, and it takes a long time to penetrate, resulting in poor productivity. Usually, the side that provides the insulating material and the side that uses it are different, so imposing a burden on the user side is not preferable in terms of productivity.On the other hand, the supplier of the insulating material and the impregnating resin Since the suppliers are often different, there is a problem in that performing the work on either side imposes an extra burden and impairs productivity.
【０００４】[0004]
【発明が解決しようとする課題】そこで、特願平７−２
１３９７１号明細書において、マイカ層と裏打ち材との
間の接着層に熱伝導性の良い無機質粉末を含有させたマ
イカ基材シート状体を提案したが、裏打ち材にガラスク
ロスを使用したその具体的製品のマイカテープをコイル
の絶縁材に使用するときは、テープをコイルに巻回する
ときに斜めに重ね巻きしていくので、そのテープに剪断
力がかかり、そのテープが側端から裂けることがあり、
その裂けることを起き難くする、いわゆる端裂抵抗を高
めることが求められている。このテープが裂けると巻回
作業を停止し、再度その作業をやり直したり、修復作業
を行うなど作業性を悪くし、生産性を悪くするという問
題があるからである。その対策として、ガラスクロスの
ガラス糸を太くしたり、縦横の糸の本数を多くすること
も考えられるが、あまり糸を太くするとマイカ基材シー
ト状体の厚さ方向の割合が多くなり、コイルの耐電圧を
低下させることになり、糸の本数を多くし過ぎると裏打
ち材を通しての樹脂の浸透が良く行われず、マイカ層と
裏打ち材の接着性に問題が生じ、マイカ基材シート状体
をコイルの絶縁部に巻回するときに両者の剥離が生じ、
巻回作業性を害し、その出来上がりも良くなく、所定の
絶縁性が得られないことがある。このようなガラスクロ
スを用いる場合の問題を解決するために、特願昭１０−
１４６６６１号明細書において、ガラスクロスの代わり
に例えばポリアミド又はポリエステルの糸からなるクロ
スを用いて得られるマイカ基材シート状体及び絶縁コイ
ルについて提案したが、これらの有機系材料の糸はコス
ト高になったり、耐熱性が低下するなどの問題があるの
で、その改善が求められていた。本発明の第１の目的
は、熱伝導性が比較的均一であり、放熱が比較的均一に
行われ、特にコイル用絶縁材料に使用した場合蓄熱し難
く、かつ端裂抵抗の大きいマイカ基材シート状体及びこ
れを用いた絶縁コイルを提供することにある。本発明の
第２の目的は、裏打ち材にガラスクロスを使用すること
により耐熱性を低下せずに安価に得られるマイカ基材シ
ート状体及びこれを用いた絶縁コイルを提供することに
ある。本発明の第３の目的は、特に最近の小型化、高性
能化のコイルに適するマイカ基材シート状体及びこれを
用いた絶縁コイルを提供することにある。本発明の第４
の目的は、コイル製造業者においてマイカ基材シート状
体を使用する際に巻回作業性を高め、生産性を向上する
ことにある。本発明の第５の目的は、絶縁材料提供者、
含浸用樹脂提供者、これらの使用者において従来の生産
工程の大幅な変更をすることなく、生産性を害すること
がないようにすることにある。SUMMARY OF THE INVENTION Therefore, Japanese Patent Application No. Hei 7-2
In the specification of Japanese Patent No. 13971, a mica base sheet in which an adhesive layer between a mica layer and a backing material contains an inorganic powder having good thermal conductivity is proposed. When mica tape is used as an insulating material for a coil, the tape is wound obliquely when wound around the coil, so shearing force is applied to the tape and the tape is torn from the side edges. There is
There is a need to increase the so-called end tear resistance, which makes the tearing less likely to occur. If the tape is torn, there is a problem that the winding work is stopped, the work is re-executed, the repair work is performed, and the workability is deteriorated, and the productivity is deteriorated. As a countermeasure, it is conceivable to increase the glass thread of the glass cloth or increase the number of vertical and horizontal threads, but if the thread is too thick, the ratio of the mica substrate sheet in the thickness direction increases, and the If the number of yarns is too large, the penetration of the resin through the backing material will not be performed well, and there will be a problem in the adhesion between the mica layer and the backing material. When wound around the insulating part of the coil, peeling of both occurs,
The winding workability is impaired, the finished product is not good, and a predetermined insulating property may not be obtained. To solve the problem when using such a glass cloth, Japanese Patent Application No.
In the specification of 146661, a mica base sheet and an insulating coil obtained by using a cloth made of, for example, a polyamide or polyester yarn instead of a glass cloth have been proposed. However, these organic materials are expensive. Therefore, there is a problem that the heat resistance is lowered or the heat resistance is lowered. A first object of the present invention is to provide a mica base material having relatively uniform thermal conductivity, relatively uniform heat dissipation, and particularly difficult to store heat when used as an insulating material for a coil, and having high edge crack resistance. An object of the present invention is to provide a sheet-like body and an insulating coil using the same. A second object of the present invention is to provide a mica base sheet which can be obtained at low cost without lowering heat resistance by using glass cloth as a backing material, and an insulating coil using the same. A third object of the present invention is to provide a mica substrate sheet which is particularly suitable for recent miniaturized and high performance coils and an insulating coil using the same. Fourth Embodiment of the Present Invention
An object of the present invention is to improve winding workability and improve productivity when using a mica base sheet in a coil manufacturer. A fifth object of the present invention is to provide an insulating material provider,
An object of the present invention is to provide an impregnating resin provider and a user thereof without significantly changing a conventional production process and without impairing productivity.
【０００５】本発明は、上記目的を達成するために、
（１）、裏打ち材と、マイカを含有するマイカ層とを接
着層を介して接合し、少なくとも樹脂とマイカより熱伝
導性の良い無機質粉末を含有する熱伝導層を有するマイ
カ基材シート状体であって、上記裏打ち材にガラスクロ
スを用いるとともに、上記熱伝導層は該ガラスクロスに
無機質粉末を含有する充填体を充填して得られる充填裏
打ち材及び上記マイカ層の少なくとも一方に設けられ、
かつ該充填裏打ち材は上記熱伝導層の成分を上記ガラス
クロスに充填した場合より端裂抵抗が大きくなる充填体
を用いるマイカ基材シート状体を提供するものである。
また、本発明は、（２）、充填体に含有される無機質粉
末はマイカ粉末であり、マイカより熱伝導性の良い無機
質粉末はランダム形状のアルミナ粉末である上記（１）
のマイカ基材シート状体、（３）、マイカ層と接着層の
内少なくとも接着層にマイカより熱伝導性の良い無機質
粉末を含有する上記（１）又は（２）のマイカ基材シー
ト状体、（４）、熱伝導層に含有されるマイカより熱伝
導性の良い無機質粉末の粒径は０．１μｍ〜５０μｍで
ある上記（１）ないし（３）のいずれかのマイカ基材シ
ート状体、（５）、マイカ層は集成マイカと、この集成
マイカ１００重量部に対し５〜５０重量部の合成繊維フ
ィブリッドと、上記集成マイカ１００重量部に対して５
〜５０重量部の上記集成マイカより熱伝導性の良い無機
質粉末を含有し、かつ該マイカ層に含有させる熱伝導性
の良い無機質粉末の粒径は５μｍ〜５０μｍである上記
（１）ないし（４）のいずれかのマイカ基材シート状
体、（６）、マイカ層と充填裏打ち材と接着層の全体に
占める接着層の割合が５〜１５重量％であり、マイカ層
と充填裏打ち材と接着層と熱伝導層の全体に占める熱伝
導層の割合が２５〜５５重量％であり、該熱伝導層は７
５〜９５重量％のマイカより熱伝導性の良い無機質粉末
を含む上記（１）ないし（５）のいずれかのマイカ基材
シート状体、（７）、マイカ層と充填裏打ち材と接着層
の全体に占める接着層の割合が２５〜５０重量％であ
り、マイカ層と充填裏打ち材と接着層と熱伝導層の全体
に占める熱伝導層の割合が２０〜５０重量％であり、該
熱伝導層は６５〜８５重量％のマイカより熱伝導性の良
い無機質粉末を含む上記（１）ないし（６）のいずれか
のマイカ基材シート状体、（８）、コイルの絶縁部に上
記（６）のマイカ基材シート状体及び含浸樹脂の硬化層
により絶縁層を形成した絶縁コイル、（９）、含浸樹脂
層にマイカより熱伝導性の良い無機質粉末を含有させ、
かつ該無機質粉末の粒径を０．１〜１５μｍとする上記
（８）の絶縁コイル、（１０）、コイルの絶縁部に上記
（７）のマイカ基材シート状体及びその含有した接着層
及び熱伝導層の熱硬化層により絶縁層を形成した絶縁コ
イルを提供するものである。[0005] In order to achieve the above object, the present invention provides:
(1) A mica base sheet having a backing material and a mica layer containing mica bonded via an adhesive layer, and having a heat conductive layer containing at least a resin and an inorganic powder having better heat conductivity than mica. Wherein, while using a glass cloth for the backing material, the heat conductive layer is provided on at least one of the mica layer and a filled backing material obtained by filling the glass cloth with a filler containing an inorganic powder,
Further, the filled backing material provides a mica base sheet using a filler having a higher resistance to edge tear than when the components of the heat conductive layer are filled in the glass cloth.
Further, in the present invention, (2) the inorganic powder contained in the filler is mica powder, and the inorganic powder having better thermal conductivity than mica is a random-shaped alumina powder.
(3) The mica base sheet according to (1) or (2), wherein at least the mica layer and the bonding layer contain an inorganic powder having better thermal conductivity than mica. (4) The mica base sheet according to any one of (1) to (3), wherein the inorganic powder having a higher thermal conductivity than the mica contained in the thermal conductive layer has a particle size of 0.1 μm to 50 μm. , (5), the mica layer is composed of mica, 5 to 50 parts by weight of synthetic fiber fibrids with respect to 100 parts by weight of the mica, and 5 with respect to 100 parts by weight of the mica.
(1) to (4), wherein the inorganic powder having good thermal conductivity is contained in the mica layer, and the particle diameter of the inorganic powder having good thermal conductivity to be contained in the mica layer is 5 μm to 50 μm. (6), wherein the ratio of the adhesive layer to the whole of the mica layer, the filled backing material and the adhesive layer is 5 to 15% by weight, and the mica layer and the filled backing material are adhered to each other. The ratio of the heat conductive layer to the whole of the layer and the heat conductive layer is 25 to 55% by weight, and the heat conductive layer
The mica base sheet according to any one of the above (1) to (5), containing an inorganic powder having better thermal conductivity than 5 to 95% by weight of mica, (7), a mica layer, a filled backing material and an adhesive layer. The ratio of the heat conductive layer to the whole of the mica layer, the filling backing material, the adhesive layer and the heat conductive layer is 20 to 50% by weight, and the ratio of the heat conductive layer is 25 to 50% by weight. The layer is composed of an inorganic powder having better thermal conductivity than 65 to 85% by weight of mica, and the mica base sheet according to any one of the above (1) to (6); (9) an insulating coil having an insulating layer formed by a mica substrate sheet and a cured layer of an impregnated resin; (9) an impregnated resin layer containing an inorganic powder having better thermal conductivity than mica;
And (8) an insulating coil in which the particle diameter of the inorganic powder is 0.1 to 15 μm, (10), a mica base sheet in (7), an adhesive layer containing the mica base sheet, An object of the present invention is to provide an insulating coil in which an insulating layer is formed by a thermosetting layer of a heat conductive layer.
【０００６】本発明のマイカ基材シート状体は、マイカ
を含有するマイカ層と、裏打ち材に無機質粉末を含有す
る充填体を充填した充填裏打ち材と、これらマイカ層と
充填裏打ち材を接合する接着層と、熱伝導層を有し、少
なくとも熱伝導層にマイカより熱伝導性の良い無機質粉
末を含有するが、この裏打ち材には、ガラスクロスを用
いる。ガラスクロスと有機系高分子フィルムを併用して
もよい。ポリアミドからなる糸を使用したクロスはガラ
スクロスよりは引っ張り強度が大きく、端裂抵抗も大き
く、耐熱性もあり、大型の発電機のコイル等に用いるマ
イカ基材シート状体の裏打ち材として好ましく、また、
ポリエステルからなる糸を使用したクロスはある程度伸
縮するため、応力に強く、比較的小型のコイル等に用い
るマイカ基材シート状体の裏打ち材として好ましいが、
前者はガラスクロスに比べればコスト高になるという問
題があり、後者は耐熱性が低下するという問題がある。
ポリオレフィン、その他の有機系高分子材料も同様な問
題がある。ガラスクロスを裏打ち材に用いたマイカ基材
シート状体は、上記の端裂抵抗を改善することにより、
安価に得られ、耐熱性がある等の優れた性能を活かすこ
とができるが、その端裂抵抗を高めるために、無機質粉
末を含有する充填体を充填する。マイカ層を裏打ち材に
接着する接着層や熱伝導層にマイカより熱伝導性の良い
無機質粉末を含有させた場合には、ガラスクロスを裏打
ち材に使用したマイカ基材シート状体の端裂抵抗は裏打
ち材のみの端裂抵抗よりは低下するが、上記の充填体を
充填した裏打ち材、すなわち充填裏打ち材の上に上記の
熱伝導層を設ける場合には、その熱伝導層を形成する際
にマイカより熱伝導性の良い無機質粉末がガラスクロス
に充填されることを防止し、マイカより熱伝導性の良い
無機質粉末を用いる熱伝導層はその材料が制約されるた
めにその熱伝導層に柔軟性を持たせるための選択幅も狭
いのに対し、その制約のない無機質粉末をガラスクロス
に充填した場合にはその充填裏打ち材に柔軟性を持たせ
る選択幅を広くすることができることにより、結果的に
上記の端裂抵抗を向上することができると考えられる。
このことにより、充填裏打ち材は上記熱伝導層の成分を
上記ガラスクロスに充填した場合より柔軟性を持たせ、
端裂抵抗を向上することができる。また、熱伝導層をマ
イカ層上に設けると、ガラスクロスはその影響を受け
ず、端裂抵抗を低下させず、むしろ向上させることもで
きる。The mica substrate sheet of the present invention is a mica layer containing mica, a backing material filled with a backing material containing a filler containing an inorganic powder, and the mica layer and the backing material are joined together. It has an adhesive layer and a heat conductive layer, and at least the heat conductive layer contains an inorganic powder having better heat conductivity than mica, and a glass cloth is used as the backing material. A glass cloth and an organic polymer film may be used in combination. A cloth using a yarn made of polyamide has a higher tensile strength than glass cloth, a large tear resistance, heat resistance, and is preferable as a backing material for a mica base sheet used for a coil of a large generator, etc. Also,
Since the cloth using the yarn made of polyester expands and contracts to some extent, it is strong as a stress and is preferable as a backing material for the mica base sheet used for relatively small coils,
The former has a problem that the cost is higher than that of the glass cloth, and the latter has a problem that the heat resistance is reduced.
Polyolefins and other organic polymer materials have similar problems. Mica substrate sheet using glass cloth as backing material, by improving the end crack resistance,
Although it can be used at a low cost and can make use of its excellent performance such as heat resistance, it is filled with a filler containing an inorganic powder in order to increase its edge crack resistance. If the adhesive layer or the heat conductive layer that bonds the mica layer to the backing material contains an inorganic powder with better thermal conductivity than mica, the crack resistance of the mica base sheet using glass cloth as the backing material Is lower than the crack resistance of only the backing material, but when the above-described heat conductive layer is provided on the backing material filled with the filler, that is, on the filled backing material, when forming the heat conductive layer, In addition, it is possible to prevent the glass cloth from being filled with an inorganic powder having better heat conductivity than mica, and to use a heat conductive layer using an inorganic powder having better heat conductivity than mica because the material is restricted. While the selection range for giving flexibility is narrow, when the glass powder is filled with unrestricted inorganic powder, the selection range for giving flexibility to the filled backing material can be widened, result Would be able to improve the edge tear resistance of above.
Due to this, the filling backing material has more flexibility than when the glass cloth is filled with the components of the heat conductive layer,
End tear resistance can be improved. Further, when the heat conductive layer is provided on the mica layer, the glass cloth is not affected by the heat conduction layer, and the end resistance can be improved rather than reduced.
【０００７】ガラスクロスに充填する充填体は、上記の
柔軟性を付与し、端裂抵抗を向上することができる無機
質粉末を含有するが、その無機質粉末としてはマイカ粉
末、タルク、シリカ、窒化ホウ素、球状アルミナ等が挙
げられ、これらの内少なくとも１種を用いることができ
る。同じアルミナでも、ランダム形状のアルミナをガラ
スクロスに充填した場合には端裂抵抗が低下するのに、
球状アルミナの場合にはその低下が小さいが、これはガ
ラスクロスの繊維に侵入する粒子の形状が端裂抵抗に影
響すると考えられる。マイカ粉末としては、天然の硬
質、軟質の焼成、未焼成のいずれのマイカでもよく、は
がしマイカでもよく、合成マイカでもよい。この無機質
粉末としては、接着剤に混合でき、その混合物がロール
コータ等の塗布手段により塗布できることが好ましく、
粒径としては例えば０．１μｍ〜５０μｍの範囲のもの
が例示できるが、無機質粉末のみやその他樹脂等の成分
を溶媒に分散させた分散液をガラスクロスに含浸させた
ものでもよい。接着剤と無機質粉末、樹脂と無機質粉末
の割合は、固形分比（重量比）で１：２〜１：１９が好
ましく、塗布する場合には溶剤を加えてもよい。ガラス
クロスに対して、無機質粉末及び接着剤又は樹脂の固形
分を含有する充填体の充填量は、ガラスクロスを含めた
全体に対して、固形分で３０〜１５０重量％が好まし
い。各成分比、充填量が上記範囲内であると、上記の端
裂抵抗が向上効果に有利である。上記接着剤、樹脂とし
ては、例えばエポキシ系樹脂、ポリエステル系樹脂、シ
リコーン系樹脂等が使われる。[0007] The filler to be filled in the glass cloth contains an inorganic powder capable of imparting the above-mentioned flexibility and improving end crack resistance. Examples of the inorganic powder include mica powder, talc, silica and boron nitride. And spherical alumina, and at least one of them can be used. Even with the same alumina, when the alumina of random shape is filled in glass cloth, the end crack resistance decreases,
In the case of spherical alumina, the decrease is small, but it is considered that the shape of particles penetrating into the glass cloth fiber affects end crack resistance. The mica powder may be any of natural hard and soft fired and unfired mica, peeled mica, and synthetic mica. As the inorganic powder, it is preferable that the inorganic powder can be mixed with an adhesive, and the mixture can be applied by an application means such as a roll coater.
The particle size may be, for example, in the range of 0.1 μm to 50 μm, but may be a glass cloth impregnated with a dispersion of inorganic powder alone or other components such as resin dispersed in a solvent. The ratio between the adhesive and the inorganic powder and the ratio between the resin and the inorganic powder are preferably 1: 2 to 1:19 in terms of solid content ratio (weight ratio), and a solvent may be added when applying. The filling amount of the filler containing the solid content of the inorganic powder and the adhesive or the resin with respect to the glass cloth is preferably 30 to 150% by weight based on the total weight including the glass cloth. When the respective component ratios and the filling amounts are within the above ranges, the above-mentioned end crack resistance is advantageous for the effect of improvement. As the adhesive or resin, for example, an epoxy resin, a polyester resin, a silicone resin, or the like is used.
【０００８】本発明のマイカ基材シート状体は、熱伝導
層には必ず、マイカを含有するマイカ層と充填裏打ち材
とを接合する接着層には選択的に、マイカより熱伝導性
の良い無機質粉末を含有させるが、このようにすると接
着剤に無機質粉末をロールミル等のミリング手段により
細かく、しかも均一に含有させることができ、その塗布
層も任意の均一な厚さに形成できるので、その熱伝導層
や接着層は組成が均一になり、厚さも均一で熱伝導性も
均一にすることができる。このように熱伝導性が均一な
熱伝導層、接着層が介在すると、この層を通って放熱が
この層の各部分において比較的均一に行われ、全体の放
熱を促進することができる。上記マイカより熱伝導性の
良い無機質粉末とは、マイカの熱伝導率約０．６Ｗ／ｍ
・Ｋよりも大きければ良く、その充填性から粒状のもの
が好ましい。具体的には、例えば窒化ホウ素（熱伝導率
約８４Ｗ／ｍ・Ｋ、以下括弧内熱伝導率）、アルミナ
（酸化アルミニウム）（約３３Ｗ／ｍ・Ｋ）、酸化マグ
ネシウム（約３８Ｗ／ｍ・Ｋ）、酸化ベリリウム（約３
７７Ｗ／ｍ・Ｋ）、炭化ケイ素（約４２Ｗ／ｍ・Ｋ）等
の１種又は２種以上を混合して用いることができる。こ
の無機質粉末の粒径及びその配合量としては、接着剤に
混合でき、その混合物がロールコータ等の塗布手段によ
り塗布でき、しかも接着層の場合には接着剤の機能を損
なわないものであれば良いが、粒径としては例えば０．
１μｍ〜５０μｍの範囲のものが例示できる。その配合
量としては、マイカ基材シート状体の種類により異な
り、マイカ層と充填裏打ち材と接着層の全体に占める接
着層の割合が５〜１５重量％であり、マイカ層と充填裏
打ち材と接着層と熱伝導層の全体に占める熱伝導層の割
合が２５〜５５重量％である、いわゆるドライマイカテ
ープの場合には、接着層全体に占める割合は０〜７０重
量％、熱伝導層全体に占める割合は７５〜９５重量％が
好ましく、マイカ層と充填裏打ち材と接着層の全体に占
める接着層の割合が２５〜５０重量％であり、マイカ層
と充填裏打ち材と接着層と熱伝導層の全体に占める熱伝
導層の割合が２０〜５０重量％である、いわゆるプリプ
レグマイカテープの場合には、接着層全体に占める割合
は０〜４０重量％、熱伝導層全体に占める割合は６５〜
８５重量％が好ましい。熱伝導層における配合量がこれ
より少ないと熱伝導性があまり向上せず、接着層におけ
る配合量がこれより多いと接着剤としての効果が十分で
ないことがある。上記接着層、熱伝導層に使用できる接
着剤としては、例えばエポキシ系樹脂、ポリエステル系
樹脂、シリコーン系樹脂等が使われる。赤外線照射等に
より熱硬化されることが好ましい。In the mica substrate sheet of the present invention, the heat conduction layer is always selectively heat-resistant to the adhesive layer for joining the mica-containing mica layer and the backing material. Although the inorganic powder is contained, the inorganic powder can be finely and uniformly contained in the adhesive by a milling means such as a roll mill in this manner, and the coating layer can be formed to have an arbitrary uniform thickness. The composition of the heat conductive layer and the adhesive layer becomes uniform, and the thickness and the heat conductivity can be made uniform. When the heat conductive layer and the adhesive layer having uniform heat conductivity are interposed in this way, heat is radiated relatively uniformly in each part of the layer through this layer, and the entire heat can be promoted. The inorganic powder having a higher thermal conductivity than the mica refers to a thermal conductivity of the mica of about 0.6 W / m.
-It is only necessary to be larger than K, and a granular material is preferable from the viewpoint of its filling property. Specifically, for example, boron nitride (thermal conductivity of about 84 W / m · K; hereinafter, thermal conductivity in parentheses), alumina (aluminum oxide) (about 33 W / m · K), magnesium oxide (about 38 W / m · K) ), Beryllium oxide (about 3
77 W / mK), silicon carbide (about 42 W / mK), or a mixture of two or more thereof. The particle size of the inorganic powder and the compounding amount thereof can be mixed with the adhesive, and the mixture can be applied by a coating means such as a roll coater, and if the adhesive layer does not impair the function of the adhesive. Good, but the particle size is, for example, 0.1.
Those having a range of 1 μm to 50 μm can be exemplified. The content of the mica base sheet varies depending on the type of the mica base sheet. The ratio of the mica layer, the filled backing material, and the adhesive layer to the entire adhesive layer is 5 to 15% by weight. In the case of a so-called dry mica tape in which the ratio of the heat conductive layer to the whole of the adhesive layer and the heat conductive layer is 25 to 55% by weight, the ratio to the whole of the adhesive layer is 0 to 70% by weight. The ratio of the mica layer, the filled backing material, and the adhesive layer to the whole of the adhesive layer is 25 to 50% by weight, and the mica layer, the filled backing material, the adhesive layer, In the case of a so-called prepreg mica tape in which the ratio of the heat conductive layer to the whole layer is 20 to 50% by weight, the ratio to the whole adhesive layer is 0 to 40% by weight, and the ratio to the whole heat conductive layer is 65. ~
85% by weight is preferred. If the amount in the heat conductive layer is less than this, the thermal conductivity is not so much improved, and if the amount in the adhesive layer is more than this, the effect as an adhesive may not be sufficient. As an adhesive that can be used for the adhesive layer and the heat conductive layer, for example, an epoxy resin, a polyester resin, a silicone resin, or the like is used. It is preferred that the resin be thermally cured by infrared irradiation or the like.
【０００９】本発明に用いるマイカを含有するマイカ層
は、マイカとしては天然の軟質、硬質、さらには合成マ
イカも使用でき、これらの形態としてははがしマイカで
も集成マイカでもよく、これらは単独又は複数使用で
き、マイカのみあるいは他の後述の材料、さらにはポリ
エチレンオキサイドなどの分散剤の少なくとも１種とと
もに水中に分散させ、その分散液を長網式抄紙機等によ
り抄造し、シート状に形成することが好ましい。なお、
集成マイカは、合成マイカや天然マイカを集成したもの
で、天然マイカについては硬質あるいは軟質マイカを叩
解し、微細なりん片（例えば厚さ約０．１〜１０μｍ、
大きさ０．００５〜５ｍｍ2 ）を集成したもので、その
なかでも焼成集成マイカを用いることが好ましい。この
焼成集成マイカのマイカは、焼成処理した硬質マイカを
酸及びアルカリで処理した後、叩解し、微細りん片とし
たもので、焼成処理によりマイカは結晶水の一部を放出
し、結晶面にしわを生じ、へき開層間を拡大し、このた
め沈降速度が遅く、後述の合成繊維フィブリッドとのか
らみ合いが生じ易く、これによりシートとしたとき、地
合の均一な強度の優れたものにすることができる。この
マイカ層には、上記マイカより熱伝導性の良い無機質粉
末を混合させることが好ましく、その配合量としては上
記マイカ１００重量部に対して５ないし５０重量部が好
ましく、これより少ないと、熱伝導性がマイカ単独の場
合に比べて向上する効果が少なく、これより多いとシー
ト状にしたときその機械的強度を低下させる傾向があ
る。また、この無機質粉末の粒径としては、５μｍ以上
５０μｍ以下が好ましく、これより小さいと抄造の際、
抄き網から抜け落ちて歩留まりが悪くなる傾向があり、
また、大き過ぎるとマイカ層をシート状に形成した際強
度を低下させる原因になることがある。また、マイカ層
には合成繊維フィブリッドを混合することが、抄いたと
きにこれによりマイカ、上記無機質粉末を包むようにし
て自らを絡ませることができ、機械的強度を向上できる
点で好ましいが、これが多すぎるとマイカ層の熱伝導率
を低下させるので、マイカ層を抄造により形成したとき
シート状に維持でき、裏打ち材又は充填裏打ち材と接着
剤により接合できるものであればよく、その配合量はマ
イカ１００重量部に対して５〜５０重量部が好ましい。The mica layer containing mica used in the present invention may be a natural soft or hard mica, or may be a synthetic mica. These forms may be peeled mica or laminated mica. These may be used alone or in combination. It can be used, mica alone or other materials described below, and further dispersed in water together with at least one kind of dispersant such as polyethylene oxide, and the dispersion is formed into a sheet by using a fourdrinier paper machine or the like. Is preferred. In addition,
The aggregated mica is a composite of synthetic mica and natural mica. For natural mica, hard or soft mica is beaten to form fine pieces (for example, about 0.1 to 10 μm thick,
A size of 0.005 to 5 mm 2 ) is assembled, and among them, calcined mica is preferably used. The mica of this calcined aggregate mica is obtained by treating the hard mica that has been calcined with an acid and an alkali, and then beating it into fine flakes. It causes wrinkles and enlarges the cleavage layer, so that the sedimentation speed is slow, and it is easy to get entangled with the synthetic fiber fibrid described later, so that when it is made into a sheet, it should have excellent uniform strength of formation. Can be. The mica layer is preferably mixed with an inorganic powder having better thermal conductivity than the mica. The amount of the inorganic powder is preferably 5 to 50 parts by weight per 100 parts by weight of the mica. The effect of improving the conductivity as compared with the case of using mica alone is small, and if it is more than this, the mechanical strength tends to be reduced when the sheet is formed. In addition, the particle diameter of the inorganic powder is preferably 5 μm or more and 50 μm or less.
There is a tendency for the yield to deteriorate due to falling off from the paper net,
On the other hand, if it is too large, the mica layer may be reduced in strength when formed into a sheet. In addition, it is preferable to mix a synthetic fiber fibrid in the mica layer, since it is possible to wrap the mica and the above-mentioned inorganic powder so that the mica and the above-mentioned inorganic powder can be entangled with each other when the paper is made. If it is too much, the thermal conductivity of the mica layer is reduced, so that the mica layer can be maintained in a sheet shape when formed by papermaking and can be bonded to the backing material or the filling backing material with an adhesive, and the compounding amount is mica. 5 to 50 parts by weight per 100 parts by weight is preferred.
【００１０】上記裏打ち材の一方の面と上記マイカ層は
上記接着層により接合され、その後に裏打ち材の他方の
面に上記の充填体を塗り込み充填裏打ち材とするか、又
は上記の充填体を塗り込み若しくは浸漬により充填した
充填裏打ち材と上記マイカ層はその充填裏打ち材に塗布
形成した接着層により接合され、いずれの場合も熱伝導
層が充填裏打ち材、マイカ層のいずれか一方又は両方に
形成されることによりマイカ基材シート状体が得られ
る。マイカ基材シート状体は、そのままテープ状に裁断
し、上述したドライマイカテープの場合には、そのテー
プをコイルの絶縁部に巻回し、空気を抜く真空処理をし
た後、その巻回層に樹脂を含浸させ、小型コイルの場合
には熱風硬化させ、大型コイルの場合には加熱・加圧硬
化させて絶縁層を形成することができる。その含浸用樹
脂としては、例えばエポキシ−酸無水物系樹脂、ボリエ
ステル系樹脂、シリコーン系樹脂等が用いられる。これ
らの樹脂の熱伝導率は空気よりは良く、一般にマイカよ
りは悪いが、裏打ち材とマイカ層を接合する接着層や熱
伝導層の少なくとも熱伝導層にはマイカより熱伝導率の
良い無機質粉末が含まれているので、熱伝導率が良くか
つその熱伝導性が均一であることによりコイルの動作で
発生した熱を外部に放熱する伝熱を促進し、放熱を促進
することができる。 このように、マイカ基材シート状
体は樹脂を含浸させずに供給することもできるが、上述
したプリプレグマイカテープの場合には、接着層及び熱
伝導層の樹脂を半硬化状態にしておくこともでき、その
場合にはコイルの絶縁部に巻回させた後、樹脂を含浸す
ることなく、加熱・加圧硬化したり、上記と同様に真空
処理をした後に加熱・加圧硬化することによりその樹脂
を硬化させ、絶縁層を形成することができる。[0010] One surface of the backing material and the mica layer are joined by the adhesive layer, and then the other surface of the backing material is filled with the above-mentioned filler to form a filled backing material, or The filled backing material filled by filling or dipping and the mica layer are joined by an adhesive layer applied and formed on the filled backing material, and in any case, the heat conductive layer is filled with one or both of the filled backing material and the mica layer. Thus, a mica base sheet is obtained. The mica base material sheet is cut into a tape shape as it is, and in the case of the above-mentioned dry mica tape, the tape is wound around the insulating portion of the coil, vacuum-treated to release air, and then the wound layer is formed. The insulating layer can be formed by impregnating a resin and hardening with a hot air in the case of a small coil, and by heating and pressurizing in the case of a large coil. As the impregnating resin, for example, an epoxy-acid anhydride resin, a polyester resin, a silicone resin or the like is used. The thermal conductivity of these resins is better than air, and generally worse than mica, but at least the adhesive layer that joins the backing material and the mica layer and at least the heat conductive layer of the heat conductive layer are inorganic powders with better thermal conductivity than mica. , Heat conduction that dissipates heat generated by the operation of the coil to the outside by promoting good heat conductivity and uniform heat conductivity can be promoted, and heat dissipation can be promoted. As described above, the mica base sheet can be supplied without impregnating the resin, but in the case of the prepreg mica tape described above, the resin of the adhesive layer and the heat conductive layer should be semi-cured. In that case, after being wound around the insulating part of the coil, it can be cured by heating and pressure without impregnation with resin, or by heating and pressure curing after vacuum treatment as above. By curing the resin, an insulating layer can be formed.
【００１１】ドライマイカテープの場合には、その含浸
樹脂に上記マイカより熱伝導性の良い無機質粉末を含有
させることもでき、その際にはその無機質粉末の粒径は
０．１μｍ〜１５μｍであることがその混合物を含浸さ
せる流通抵抗を小さくする点、絶縁破壊電圧を大きくで
きる点で好ましく、その樹脂との混合割合は両者の固形
分合計に対して５〜５０重量％であることが好ましく、
これより少ないと熱伝導性の向上効果が少なく、これよ
り多いと含浸樹脂液の粘度が増し含浸性を悪くする傾向
がある。In the case of dry mica tape, the impregnated resin may contain an inorganic powder having better thermal conductivity than the above mica, and in this case, the particle diameter of the inorganic powder is 0.1 μm to 15 μm. It is preferable to reduce the flow resistance for impregnating the mixture and to increase the dielectric breakdown voltage, and the mixing ratio with the resin is preferably 5 to 50% by weight based on the total solid content of both.
If the amount is less than this, the effect of improving the thermal conductivity is small, and if it is more than this, the viscosity of the impregnated resin liquid tends to increase and the impregnating property tends to deteriorate.
【００１２】マイカ基材シート状体に樹脂を半硬化状態
で含浸させた場合、あるいはコイルに巻いたマイカ基材
シート状体にその含浸を行なう場合のいずれも、熱伝導
層に必ず、接着層には選択的に、マイカより熱伝導率の
良い無機質粉末を含有させるが、その厚さはその無機質
粉末をマイカ層、含浸樹脂に含有させない場合は厚く、
含有させる場合は薄くすることが好ましい。When the resin is impregnated in a semi-cured state into the mica substrate sheet, or when the mica substrate sheet wound in a coil is impregnated with the resin, the adhesive layer must be formed on the heat conductive layer. Optionally, contains an inorganic powder with better thermal conductivity than mica, but its thickness is thicker if the inorganic powder is not contained in the mica layer, impregnated resin,
When it is contained, it is preferable to make it thin.
【００１３】このようにして本発明のマイカ基材シート
状体、これを用いた絶縁コイルが得られるが、熱伝導
層、接着層にマイカより熱伝導率の良い無機質粉末を含
有させることにより、 その無機質粉末の粒径を広く
とることができ、それだけ粒径を選別する手間が省け、
その接着剤との混合手段も簡単に行なうことがで
き、 熱伝導層、接着層は例えばマイカ層の隙間に樹
脂を含浸させる場合のように隙間に樹脂を浸透させる必
要がないから組成及び厚さを均一にでき、その塗布作業
も容易であり、 熱伝導率を良くすることにより放熱
を促進できるという効果を有し、さらにマイカ層やその
含浸樹脂にマイカより熱伝導率の良い無機質粉末を含有
させることにより、その放熱効果を高めることができ、
最近の小型化、高性能化の電気機器の特に高電圧用コイ
ル用絶縁材料としての要求を満たすことができる。この
ように電気機器の絶縁特性を高性能に維持できると、そ
の電気機器の動作特性を損なわないようにできる。この
ことから、上記発明において、「マイカ基材シート状
体」を「コイル用マイカ基材絶縁シート状体」とするこ
ともでき、さらに「コイル」を「小型コイル」、「小型
化・高性能化コイル」とすることもできる。また、これ
ら発明において、これら及び絶縁コイル（小型絶縁コイ
ル又は小型化・高性能化絶縁コイル）の製造方法とし、
これらに準用できる。また、本発明のマイカ基材シート
状体は耐熱電気絶縁放熱スペーサーとして、例えばパワ
ートランジスタ放熱用絶縁板などにおいて放熱性を向上
した材料としても使用することができる。The mica substrate sheet of the present invention and the insulated coil using the same are obtained in this manner. By adding an inorganic powder having a higher thermal conductivity than mica to the heat conductive layer and the adhesive layer, The particle size of the inorganic powder can be widened, eliminating the need to select the particle size accordingly,
The mixing means with the adhesive can also be easily performed, and the composition and thickness of the heat conductive layer and the adhesive layer are not required because, for example, the resin does not need to be penetrated into the gap as in the case of impregnating the resin with the gap in the mica layer. It has the effect of promoting heat dissipation by improving thermal conductivity, and also contains an inorganic powder with better thermal conductivity than mica in the mica layer and its impregnated resin. By doing so, the heat radiation effect can be increased,
It is possible to satisfy the recent demand for an insulating material for a small-sized and high-performance electric device, particularly for a high-voltage coil. As described above, if the insulation characteristics of the electric device can be maintained at a high level, the operating characteristics of the electric device can be maintained. For this reason, in the above invention, the "mica substrate sheet" may be a "mica substrate insulation sheet for coil", and the "coil" may be "small coil", "small size and high performance". Coil ". In these inventions, the method for manufacturing these and an insulating coil (small insulated coil or downsized / high performance insulated coil)
These can be applied mutatis mutandis. Further, the mica substrate sheet of the present invention can be used as a heat-resistant electric insulating heat-radiating spacer, for example, as a material having improved heat radiation in a power transistor heat-radiating insulating plate or the like.
【００１４】[0014]
【発明の実施の形態】次に本発明の実施の形態を説明す
る。裏打ち材として縦糸、横糸にガラス繊維からなる糸
を用いた厚さ０．０３ｍｍ〜０．０８ｍｍのガラスクロ
スを使用し、マイカ層と充填裏打ち材と接着層の全体に
占める接着層の割合が７〜９重量％であり、マイカ層と
充填裏打ち材と接着層と熱伝導層の全体に占める熱伝導
層の割合が３５〜４５量％であり、該熱伝導層は８０〜
９０重量％のアルミナを含むドライマイカテープと、マ
イカ層と充填裏打ち材と接着層の全体に占める接着層の
割合が３０〜４０重量％であり、マイカ層と充填裏打ち
材と接着層と熱伝導層の全体に占める熱伝導層の割合が
３０〜４０重量％であり、該熱伝導層は７０〜８０重量
％のアルミナを含むプリプレグマイカテープを作成す
る。その際、マイカ層は下記３種類のそれぞれの集成マ
イカ基材箔を使用し、熱伝導層と接着層にはエポキシ−
アミン系の熱硬化性樹脂を主成分とする接着剤を使用
し、その接着剤に混ぜて使用するアルミナ粉末は粒径約
０．１μｍ〜３０μｍを使用し、接着層はマイカ層と裏
打ち材を重ねて裏打ち材を下側にして裏打ち材側からロ
ールコータで塗布して形成し、その後裏打ち材側にマイ
カ粉末と接着剤又は樹脂を含有し溶媒を加えて得られる
充填体液を塗布・乾燥して充填裏打ち材とし、その後熱
伝導層を充填裏打ち材側又はマイカ層に塗布により形成
する。集成マイカ基材箔の種類としては、マイカを含有
するマイカ層として焼成集成マイカのみ、あるいは焼成
集成マイカ１００重量部に対して芳香族ポリアミドフィ
ブリット（濾水度６０°ＳＲ）１０〜３０重量部、ある
いはさらに焼成集成マイカ１００重量部に対してアルミ
ナ（粒径約２０μｍ〜４０μｍ）２０〜４０重量部を水
中に分散し、その分散液を長網式抄紙機にて抄造し、厚
さ０．０８〜０．１６ｍｍのそれぞれに対応する３種類
の集成マイカ基材箔を作製した。このようにして、３種
類のドライマイカテープと、３種類のプリプレグマイカ
テープを作製し、コイル導体上に半掛け３回巻き（幅の
半分を重ねながら巻く巻き方）した後、前者の３種類の
ドライマイカテープについては、真空度約１ｍｍＨｇ、
温度約９０℃で乾燥し水分などの揮発成分を除いた後、
エポキシ−酸無水物系熱硬化性樹脂を主成分とする含浸
用樹脂組成物を真空含浸させ、１００℃より１８０℃ま
で段階的に昇温させて樹脂を完全硬化させ、後者の３種
類については１００℃より１８０℃まで段階的に昇温さ
せ樹脂を完全硬化させ、それぞれの絶縁コイルを作製し
た。このようにすると、いずれのドライマイカテープ、
プリプレグマイカテープとも、ガラスクロスに充填体が
充填されているので、端裂抵抗が大きく、巻回作業時に
テープが切れることがなく、また、絶縁コイルは接着層
を媒介してコイル導体に発生した熱が放熱され、接着層
は組成が均一、厚さが均一であるのでその放熱の効率が
良く、その促進をすることができる。Next, an embodiment of the present invention will be described. As a backing material, a glass cloth having a thickness of 0.03 mm to 0.08 mm using a glass fiber as a warp and a weft is used, and the ratio of the adhesive layer to the entire mica layer, the filled backing material and the adhesive layer is 7%. About 9% by weight, and the ratio of the heat conductive layer to the whole of the mica layer, the filling backing material, the adhesive layer and the heat conductive layer is 35 to 45% by weight, and the heat conductive layer is 80 to 90% by weight.
The dry mica tape containing 90% by weight of alumina, the ratio of the mica layer, the filled backing material and the adhesive layer to the whole adhesive layer is 30 to 40% by weight, and the mica layer, the filled backing material, the adhesive layer and the heat conduction The proportion of the heat conductive layer in the whole layer is 30 to 40% by weight, and the heat conductive layer makes a prepreg mica tape containing 70 to 80% by weight of alumina. At that time, the following three types of laminated mica base foils were used for the mica layer, and the heat conductive layer and the adhesive layer were epoxy-based.
Using an adhesive mainly composed of an amine-based thermosetting resin, alumina powder used by mixing with the adhesive has a particle size of about 0.1 μm to 30 μm, and an adhesive layer comprises a mica layer and a backing material. The backing material is layered on the lower side and applied by a roll coater from the backing material side to form a coating material.Then, the filling material liquid obtained by adding a solvent containing mica powder and an adhesive or a resin to the backing material side is applied and dried. Then, a thermal conductive layer is formed on the filled backing material side or the mica layer by coating. As the type of the mica-assembled base material foil, only mica-containing mica layer containing calcined mica alone or 10 to 30 parts by weight of aromatic polyamide fibrite (freeness 60 ° SR) per 100 parts by weight of calcined mica Alternatively, 20 to 40 parts by weight of alumina (particle size: about 20 μm to 40 μm) is dispersed in water with respect to 100 parts by weight of the calcined aggregated mica, and the resulting dispersion is formed by a fourdrinier paper machine. Three types of laminated mica substrate foils corresponding to each of 08 to 0.16 mm were produced. In this way, three types of dry mica tapes and three types of prepreg mica tapes are produced, wound on the coil conductor three times by half (winding while overlapping half the width), and then the former three types About the dry mica tape, the degree of vacuum is about 1 mmHg,
After drying at a temperature of about 90 ° C to remove volatile components such as moisture,
The impregnating resin composition mainly composed of an epoxy-anhydride thermosetting resin is vacuum impregnated, and the temperature is gradually increased from 100 ° C. to 180 ° C. to completely cure the resin. The temperature was gradually increased from 100 ° C. to 180 ° C., and the resin was completely cured, thereby producing respective insulating coils. In this way, any dry mica tape,
Both the prepreg mica tape and glass cloth are filled with filler, so the resistance to tearing is large, the tape does not break during winding work, and the insulating coil is generated in the coil conductor through the adhesive layer The heat is dissipated, and the adhesive layer has a uniform composition and a uniform thickness, so that the heat dissipating efficiency is good and the adhesion can be promoted.
【００１５】[0015]
【実施例】次に本発明の実施例を説明する。 実施例１ 裏打ち材に（株）有沢製作所製ガラスクロスＭ０．０４
（縦６０本／インチ（Ｄ４５０ １／０）、横３４本／
インチ（Ｄ９００ １／０）の厚さ０．０４６ｍｍのガ
ラスクロス）を使用する。焼成集成マイカ１００部を水
中に分散し、その分散液を長網式抄紙機にて抄造し、厚
さ０．０８ｍｍのマイカ層としての集成マイカ基材箔を
作製した。この集成マイカ基材箔を上側にして上記ガラ
スクロスを重ね、このガラスクロス側からエポキシ−ア
ミン系の熱硬化性樹脂を主成分とする接着剤（エピコー
ト８２８（油化シエルエポキシ社製エポキシ樹脂）１０
０重量部とＢＦ3 モノエチルアミン３重量部からなる）
をロールコータにより塗布し、乾燥して接着層（マイカ
層と裏打ち材と接着層の全体に占める接着層（固形分）
の割合が８重量％）を形成し、さらにガラスクロス側に
上記の接着剤にマイカ粉末（（株）日本マイカ製作所製
Ａ２０００）を固形分重量比で１：４にし、溶媒（トル
エン／メチルエチルケトン＝１：１）を加えて充填体液
（粘度 ８０ポイズ）を調製し、これをロールコータに
より塗布し、乾燥して充填裏打ち材を形成する。この
際、マイカ粉末塗布量（ｇ／ｍ2 ）を表１に示すよう
に、０〜２５ｇ／ｍ2 において、５ｇ／ｍ2 づつ増加さ
せた各場合について充填裏打ち材を形成する。この後、
上記接着剤にアルミナＡＬ−４３−Ｌ（昭和電工社製の
酸化アルミニウム（平均粒径１μｍのランダム形状のア
ルミナ））を全固形分中８５重量％になるように混合し
たアルミナ含有接着剤を上記充填裏打ち材側に塗布し、
乾燥して熱伝導層を形成した。この際、アルミナ塗布量
を表１に示すように、１６０ｇ／ｍ2 目標で塗布し、各
場合について熱伝導層を形成する。アルミナ塗布量が２
１０ｇ／ｍ2 のとき、マイカ層と充填裏打ち材と接着層
と熱伝導層の全体に占める熱伝導層の割合が４０重量％
になる。このようにして得られたドライマイカテープを
導体上に半掛け３回巻きした後、真空度約１ｍｍＨｇ、
温度約９０℃で乾燥し水分などの揮発成分を除いた後、
エポキシ−酸無水物系の熱硬化性樹脂を主成分とする含
浸用樹脂組成物（エピコート８２８（油化シエルエポキ
シ社製エポキシ樹脂）１００重量部とカヤハードＭＣＤ
（日本化薬株式会社製酸無水物）９０重量部を主成分と
する含浸用樹脂組成物）を含浸させ、１００℃より１８
０℃まで段階的に昇温させて樹脂を完全硬化させ、導体
上に絶縁層を形成した絶縁コイルを作製した。Next, an embodiment of the present invention will be described. Example 1 Glass cloth M0.04 manufactured by Arisawa Seisakusho Co., Ltd.
(60 lines / inch (D450 1/0), 34 lines /
An inch (D900 1/0) 0.046 mm thick glass cloth is used. 100 parts of the calcined aggregated mica was dispersed in water, and the resulting dispersion was paper-formed with a fourdrinier paper machine to produce a laminated mica base foil having a mica layer thickness of 0.08 mm. The glass cloth is laminated with the laminated mica substrate foil on the upper side, and an adhesive (Epicoat 828 (epoxy resin manufactured by Yuka Shell Epoxy)) containing an epoxy-amine-based thermosetting resin as a main component from the glass cloth side 10
0 parts by weight and 3 parts by weight of BF 3 monoethylamine)
Is applied by a roll coater and dried to form an adhesive layer (adhesive layer (solid content) in the entire mica layer, backing material and adhesive layer)
Is 8% by weight), and mica powder (A2000, manufactured by Nippon Mica Seisakusho Co., Ltd.) is added to the above adhesive on a glass cloth side at a solid content weight ratio of 1: 4, and a solvent (toluene / methyl ethyl ketone = 1: 1) is added to prepare a filling body fluid (viscosity of 80 poise), which is applied by a roll coater and dried to form a filling backing material. At this time, mica powder coating amount (g / m 2) as shown in Table 1, in 0~25g / m 2, to form a filled backing for each case was increased 5 g / m 2 at a time. After this,
The alumina-containing adhesive obtained by mixing alumina AL-43-L (aluminum oxide manufactured by Showa Denko KK (alumina having a random shape with an average particle size of 1 μm)) to the above adhesive so as to be 85% by weight of the total solid content was used. Apply to the filling backing material side,
After drying, a heat conductive layer was formed. At this time, as shown in Table 1, alumina was applied at a target of 160 g / m 2 , and a heat conductive layer was formed in each case. Alumina coating amount is 2
At 10 g / m 2 , the ratio of the heat conductive layer to the whole of the mica layer, the filling backing material, the adhesive layer, and the heat conductive layer is 40% by weight.
become. The dry mica tape obtained in this manner was wound half a time on a conductor three times, and then the degree of vacuum was about 1 mmHg.
After drying at a temperature of about 90 ° C to remove volatile components such as moisture,
100 parts by weight of an impregnating resin composition (Epicoat 828 (epoxy resin manufactured by Yuka Shell Epoxy Co., Ltd.)) containing an epoxy-acid anhydride-based thermosetting resin as a main component and Kayahard MCD
(An acid anhydride manufactured by Nippon Kayaku Co., Ltd.), an impregnating resin composition containing 90 parts by weight as a main component, and
The temperature was gradually increased to 0 ° C. to completely cure the resin, and an insulating coil having an insulating layer formed on a conductor was produced.
【００１６】表１中のドライマイカテープＮｏ．３〜７
（充填裏打ち材使用アルミナ含有マイカ基材シート状
体）と、裏打ち材に充填体を充填せず、そのままのもの
とガラスクロス側に直接上記のアルミナ含有接着剤を塗
布したこと以外は同様にして形成したドライマイカテー
プＮｏ．１、２（無充填裏打ち材使用マイカ基材シート
状体、無充填裏打ち材使用アルミナ含有マイカ基材シー
ト状体）について、端裂抵抗をそのドライマイカテープ
の厚さとともに測定した結果を表１に示す。また、導体
上に形成された絶縁層を切り取り、表面を研磨した後の
絶縁層については、熱伝導率を０．３〜０．５Ｗ／ｍ・
Ｋとすることができる。なお、端裂抵抗は、ドライマイ
カテープを１５ｍｍ幅に切断してそれぞれの試験におい
て各５個の試験片を作成し、（株）島津製作所製万能試
験器ＡＧＳ−５００Ａを使用して測定した。試験時の試
験片に対する負荷のスピードは、５０ｍｍ／分とした。
熱伝導率は定常状態における低沸点液体の蒸発量から通
過熱量を求める方法（柴山科学器械製作所製熱伝導率測
定装置）により求めることができる。表１の結果から、
マイカ粉末塗布量２０ｇ／ｍ2 以上（少なくとも２０ｇ
／ｍ 2 、以下同様）とすれば、裏打ち材にガラスクロス
を用いても、巻回作業に支障があるほど端裂抵抗は低下
しないことがわかる。その範囲を拡大して、１０ｇ／ｍ
2 以上又は１５ｇ／ｍ2 としてもよい。In Table 1, dry mica tape No. 3-7
(Alumina-containing mica base sheet with filled backing material
Body) and backing material without filling material
And the above-mentioned alumina-containing adhesive directly on the glass cloth side.
Dry Mykate formed in the same way except that it was clothed
No. 1, 2 (Mica base sheet with unfilled backing material)
Mica substrate containing alumina
G), the crack resistance of the dry mica tape
Table 1 shows the results measured together with the thickness of the sample. Also, conductor
After cutting off the insulating layer formed on and polishing the surface
As for the insulating layer, the thermal conductivity is set to 0.3 to 0.5 W / m ·
K. In addition, the end crack resistance
Cut the tape into 15mm width and smell each test
To make five test pieces each, and use the Shimadzu Corporation
The measurement was performed using an AGS-500A tester. At the time of the test
The speed of loading on the specimen was 50 mm / min.
The thermal conductivity is calculated from the amount of evaporation of the low-boiling liquid in the steady state.
Method of determining the amount of overheating (thermal conductivity measurement made by Shibayama Scientific Instruments)
Fixed device). From the results in Table 1,
Mica powder application amount 20g / mTwoAbove (at least 20g
/ M Two, The same applies to the following.)
, The tear resistance is so low that it hinders the winding operation
It turns out that it does not. By expanding the range, 10 g / m
TwoOr more or 15 g / mTwoIt may be.
【００１７】[0017]
【表１】 [Table 1]
【００１８】実施例２ 実施例１において、焼成集成マイカ１００重量部の代わ
りに、焼成集成マイカ１００重量部、芳香族ポリアミド
フィブリット（濾水度６０°ＳＲ）２０重量部を用いた
以外は同様にしてドライマイカテープ、絶縁コイルを作
製し、実施例１と同様に試験をしたところ、表２に示す
結果が得られた。Example 2 The procedure of Example 1 was repeated except that 100 parts by weight of calcined aggregate mica and 20 parts by weight of aromatic polyamide fibrite (freeness 60 ° SR) were used instead of 100 parts by weight of calcined aggregate mica. Then, a dry mica tape and an insulated coil were prepared and subjected to the same test as in Example 1. As a result, the results shown in Table 2 were obtained.
【００１９】[0019]
【表２】 [Table 2]
【００２０】実施例３ 実施例１において、焼成集成マイカ１００部の代わり
に、焼成集成マイカ１００重量部、芳香族ポリアミドフ
ィブリット（濾水度６０°ＳＲ）２０重量部及び実施例
１で使用したと同類のアルミナ（平均粒径３０μｍ）３
０重量部を用いた以外は同様にしてドライマイカテー
プ、絶縁コイルを作製し、実施例１と同様に試験をした
ところ、表３に示す結果が得られた。EXAMPLE 3 In Example 1, 100 parts by weight of calcined mica, 20 parts by weight of aromatic polyamide fibrite (freeness 60 ° SR) and 100 parts by weight of mica were used in place of 100 parts of calcined mica. Alumina similar to (average particle size 30μm) 3
A dry mica tape and an insulating coil were prepared in the same manner except that 0 parts by weight were used, and a test was conducted in the same manner as in Example 1. As a result, the results shown in Table 3 were obtained.
【００２１】[0021]
【表３】 [Table 3]
【００２２】実施例４〜６ 実施例１〜３において、マイカ層と充填裏打ち材と接着
層の全体に占める接着層（固形分）の割合を３５重量％
にし、アルミナＡＬ−４３−Ｌ（昭和電工社製の酸化ア
ルミニウム（平均粒径１μｍ））を全固形分中７５重量
％になるように混合したアルミナ含有接着剤を用いて熱
伝導層を形成し、マイカ層と充填裏打ち材と接着層と熱
伝導層の全体に占める熱伝導層の割合を３５重量％とし
たこと以外は同様にして、実施例４〜６（実施例１〜３
に順次対応）のプリプレグマイカテープを作製し、実施
例１と同様に導体に巻回し、１００℃より１８０℃まで
段階的に昇温させて樹脂を完全硬化させ、導体上に絶縁
層を形成した絶縁コイルを作製する。得られたプリプレ
グマイカテープ（充填裏打ち材使用アルミナ含有マイカ
基材シート状体）と、裏打ち材に充填体を充填せず、そ
のままのものと、ガラスクロス側に直接上記のアルミナ
含有接着剤を塗布したこと以外は同様にして形成したプ
リプレグマイカテープ（無充填裏打ち材使用マイカ基材
シート状体、無充填裏打ち材使用アルミナ含有マイカ基
材シート状体）、絶縁コイルについて実施例１と同様に
試験したところ、表４（実施例４）、表５（実施例
５）、表６（実施例６）示す結果が得られた。Examples 4 to 6 In Examples 1 to 3, the ratio of the adhesive layer (solid content) to the whole of the mica layer, the filled backing material and the adhesive layer was 35% by weight.
A heat conductive layer was formed using an alumina-containing adhesive obtained by mixing alumina AL-43-L (aluminum oxide manufactured by Showa Denko KK (average particle size: 1 μm)) so as to be 75% by weight of the total solid content. Examples 4 to 6 (Examples 1 to 3) were performed in the same manner except that the ratio of the heat conductive layer to the whole of the mica layer, the filled backing material, the adhesive layer, and the heat conductive layer was 35% by weight.
Prepreg mica tape was wound around a conductor in the same manner as in Example 1, and the temperature was gradually increased from 100 ° C. to 180 ° C. to completely cure the resin, and an insulating layer was formed on the conductor. Make an insulated coil. The obtained prepreg mica tape (alumina-containing mica base sheet using a filling backing material) and the above-mentioned alumina-containing adhesive are directly applied to the glass cloth side as it is without filling the filling material into the backing material. A prepreg mica tape (mica base sheet using an unfilled backing material, alumina-containing mica base sheet using an unfilled backing material) and an insulating coil were formed in the same manner as in Example 1 except for the following. As a result, the results shown in Table 4 (Example 4), Table 5 (Example 5), and Table 6 (Example 6) were obtained.
【００２３】[0023]
【表４】 [Table 4]
【００２４】[0024]
【表５】 [Table 5]
【００２５】[0025]
【表６】 [Table 6]
【００２６】実施例７ 実施例１において、マイカ粉Ａ２０００の代わりに、窒
化ホウ素を使用したこと以外は同様にして作製したドラ
イマイカテープ、すなわち充填裏打ち材使用アルミナ含
有マイカ基材シート状体や、無充填裏打ち材使用マイカ
基材シート状体、無充填裏打ち材使用アルミナ含有マイ
カ基材シート状体の各ドライマイカテープ、さらにはこ
れらドライマイカテープを用いた絶縁コイルについて実
施例１と同様に試験すると、端裂抵抗及びドライマイカ
テープの厚さについては表２に示すとおりであった。そ
の他のことは実施例１に準じる結果が得られる。この場
合には、窒化ホウ素塗布量２５ｇ／ｍ2 以上が好ましい
が、１０ｇ／ｍ 2 以上又は１５ｇ／ｍ2 以上としてもよ
い。上記実施例２〜６において、マイカ粉Ａ２０００の
代わりに、窒化ホウ素を使用したこと以外は同様にして
作製したドライマイカテープについても、実施例２〜６
の各実施例及び表７に準じる結果が得られる。Example 7 In Example 1, mica powder A2000 was replaced with nitrogen
A drive made in the same manner except that boron boride was used.
Imai mica tape, including alumina with a filling backing
Mica with mica base sheet or unfilled backing material
Substrate sheet, unfilled backing material
Dry mica tape of the base material sheet
Insulated coil using dry mica tape
When the test was carried out in the same manner as in Example 1, the crack resistance and dry mica
The thickness of the tape was as shown in Table 2. So
In other respects, the result according to the first embodiment is obtained. This place
In the case, the coating amount of boron nitride is 25 g / mTwoAbove is preferred
Is 10 g / m TwoOr more or 15 g / mTwoOr more
No. In the above Examples 2 to 6, the mica flour A2000
Instead, do the same except that boron nitride was used.
Examples 2 to 6 were also applied to the produced dry mica tape.
And the results according to Table 7 and Table 7 are obtained.
【００２７】[0027]
【表７】 [Table 7]
【００２８】実施例８ 実施例１において、熱伝導層を充填裏打ち材側に形成せ
ず、マイカ層側に形成したこと以外は同様にして作製し
たドライマイカテープ、すなわち充填裏打ち材使用アル
ミナ含有マイカ基材シート状体（マイカ層と充填体の粉
体と樹脂の比率は重量比で４：１）や、無充填裏打ち材
使用マイカ基材シート状体、無充填裏打ち材使用アルミ
ナ含有マイカ基材シート状体の各ドライマイカテープ、
さらにはこれらドライマイカテープを用いた絶縁コイル
について実施例１と同様に試験すると、端裂抵抗及びド
ライマイカテープの厚さについては表３に示すとおりで
あった。その他のことは実施例１に準じる結果が得られ
る。この場合には、アルミナ塗布量に関係なく、良い端
裂抵抗がえられるが、熱伝導性の点から、アルミナ塗布
量は基材シート状体重量の２５〜５５重量％が好まし
い。上記実施例２〜７において、マイカ粉Ａ２０００の
代わりに、窒化ホウ素を使用したこと以外は同様にして
作製したドライマイカテープについても、実施例２〜７
の各実施例及び表８に準じる結果が得られる。Example 8 A dry mica tape prepared in the same manner as in Example 1 except that the heat conductive layer was not formed on the filled backing material side but was formed on the mica layer side, that is, an alumina-containing mica using the filled backing material Substrate sheet (mica layer / filler powder to resin ratio 4: 1 by weight), mica substrate sheet with unfilled backing material, alumina-containing mica substrate with unfilled backing material Each dry mica tape in sheet form,
Further, when the insulating coil using these dry mica tapes was tested in the same manner as in Example 1, the end tear resistance and the thickness of the dry mica tape were as shown in Table 3. In other respects, a result similar to that of the first embodiment is obtained. In this case, good crack resistance can be obtained irrespective of the amount of alumina applied, but from the viewpoint of thermal conductivity, the amount of alumina applied is preferably 25 to 55% by weight of the weight of the base sheet. In the above Examples 2 to 7, dry mica tapes prepared in the same manner except that boron nitride was used instead of mica powder A2000 were also used.
And the results according to Table 8 are obtained.
【００２９】[0029]
【表８】 [Table 8]
【００３０】参考例 実施例１において、充填体液における無機質粉末を表４
に示す各物質にし、その塗布量を表４に示すようにし、
熱伝導層を設けなかったこと以外はこれに準じて作製し
たマイカ基材シート状体について、実施例１と同様に端
裂抵抗を測定した結果を表９に示す。Reference Example In Example 1, the amount of the inorganic powder in the filling body liquid was as shown in Table 4.
And the coating amount is as shown in Table 4.
Table 9 shows the results of measuring the end tear resistance in the same manner as in Example 1 for the mica base sheet formed in accordance with this except that the heat conductive layer was not provided.
【００３１】[0031]
【表９】 [Table 9]
【００３２】表８の結果から、マイカ層側に熱伝導層を
形成すると端裂抵抗は、ガラスクロスにマイカ層を接着
層により張り合わせたものよりも大きくすることができ
る。また、表１、７の結果から、充填裏打ち材側に熱伝
導層を形成した場合にはガラスクロスにマイカ層を接着
層により張り合わせたものより端裂抵抗の低下が見られ
るが、ガラスクロスにマイカ粉末を含有する充填体を充
填した場合には、その塗布量が多くなるにつれてその低
下の程度が小さくなることがわかる。表９の結果から、
ランダム形状アルミナ、炭化ケイ素以外の粉末は、端裂
抵抗を低下させず、逆に向上させるものもあり、端裂抵
抗を向上できる無機質粉末とすることができ、熱伝導層
と組み合わせて、端裂抵抗及び熱伝導性の両方が優れる
マイカ基材シート状体及び絶縁層を得ることができる。From the results shown in Table 8, when the heat conductive layer is formed on the mica layer side, the edge crack resistance can be made larger than that obtained by bonding the mica layer to the glass cloth with the adhesive layer. Also, from the results of Tables 1 and 7, when the heat conductive layer is formed on the side of the filled backing material, the end crack resistance is lower than that obtained by bonding the mica layer to the glass cloth with the adhesive layer. When the filler containing mica powder is filled, it can be seen that the degree of the decrease decreases as the amount of application increases. From the results in Table 9,
Powders other than random-shaped alumina and silicon carbide do not reduce end cracking resistance, and some of them can be improved on the contrary.Inorganic powders that can improve end cracking resistance can be used. It is possible to obtain a mica base sheet having excellent resistance and thermal conductivity and an insulating layer.
【００３３】[0033]
【発明の効果】本発明によれば、熱伝導層を設け、これ
にマイカより熱伝導率の良い無機質粉末を含有させたマ
イカ基材シート状体において、裏打ち材にガラスクロス
を用い、これに充填体を充填し、この充填裏打ち材を上
記熱伝導層の成分を上記ガラスクロスに充填した場合よ
り端裂抵抗が大きくなる充填体を用いて形成したので、
例えばコイル等にマイカ基材シート状体を装着する際の
巻回作業時にそのマイカ基材シート状体が切れるような
ことを少なくして、その装着の生産性を向上することが
できる。また、熱伝導性が比較的均一であり、放熱が比
較的均一に行われ、さらに接着層やマイカ層にもマイカ
より熱伝導率の良い無機質粉末を含有させることにより
一層熱伝導による放熱が速やかに行われ、特にコイル用
絶縁材料に使用した場合蓄熱し難く、特に最近の小型
化、高性能化のコイルに適し、しかも比較的安価なガラ
スクロスを裏打ち材に使用しているので、安価なマイカ
基材シート状体を提供することができる。また、このマ
イカ基材シート状体のうちドライマイカテープを用いて
樹脂を含浸させ、熱硬化させた絶縁コイル、あるいはプ
リプレグマイカテープを用い熱硬化させた絶縁コイル
は、放熱性がよくその動作を損なわないようにでき、特
に前者の場合その含浸用樹脂にマイカより熱伝導率の良
い無機質粉末を含有させることにより一層その放熱性が
よくなり、特に最近の小型化、高性能化の要求に応える
絶縁コイルを提供することができる。また、絶縁材料提
供者、含浸用樹脂提供者、これらの使用者において従来
の生産工程の大幅な変更をすることなく、生産性を害す
ることがないようにすることができる。According to the present invention, a heat conductive layer is provided, and a glass cloth is used as a backing material in a mica base sheet containing an inorganic powder having a higher heat conductivity than mica. Since the filling body was filled, and the filling backing material was formed using a filling body having a higher end crack resistance than when the components of the heat conductive layer were filled into the glass cloth,
For example, it is possible to reduce the possibility that the mica base sheet is cut during a winding operation when the mica base sheet is mounted on a coil or the like, thereby improving the productivity of the mounting. In addition, heat conductivity is relatively uniform, heat dissipation is relatively uniform, and furthermore, heat dissipation by heat conduction is more rapid by including an inorganic powder having better heat conductivity than mica in the adhesive layer and mica layer. In particular, it is difficult to store heat when used as an insulating material for coils, and is particularly suitable for recent miniaturized, high-performance coils, and uses a relatively inexpensive glass cloth for the backing material. A mica base sheet can be provided. In addition, among the mica base sheet materials, the insulating coil which is impregnated with resin using dry mica tape and thermally cured, or the insulating coil which is thermally cured using prepreg mica tape, has good heat dissipation and operates well. In particular, in the former case, the impregnating resin contains an inorganic powder having better thermal conductivity than mica, so that its heat dissipation can be further improved, and in particular, it meets the recent demand for miniaturization and high performance. An insulated coil can be provided. In addition, it is possible to prevent the productivity from being impaired by the insulating material provider, the impregnating resin provider, and these users without significantly changing the conventional production process.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E044 CA01 CB03 5G309 MA18 5G333 AA03 AA13 AB14 CB01 CB11 DA11 DA21 DA24 DA25 DA26 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E044 CA01 CB03 5G309 MA18 5G333 AA03 AA13 AB14 CB01 CB11 DA11 DA21 DA24 DA25 DA26
Claims (10)
とを接着層を介して接合し、少なくとも樹脂とマイカよ
り熱伝導性の良い無機質粉末を含有する熱伝導層を有す
るマイカ基材シート状体であって、上記裏打ち材にガラ
スクロスを用いるとともに、上記熱伝導層は該ガラスク
ロスに無機質粉末を含有する充填体を充填して得られる
充填裏打ち材及び上記マイカ層の少なくとも一方に設け
られ、かつ該充填裏打ち材は上記熱伝導層の成分を上記
ガラスクロスに充填した場合より端裂抵抗が大きくなる
充填体を用いるマイカ基材シート状体。1. A mica base sheet having a backing material and a mica layer containing mica bonded thereto via an adhesive layer, and having a heat conductive layer containing at least a resin and an inorganic powder having better heat conductivity than mica. A glass cloth as the backing material, and the heat conductive layer is provided on at least one of the mica layer and the filled backing material obtained by filling the glass cloth with a filler containing an inorganic powder. And a mica base sheet using a filler whose backing material has a higher resistance to cleaving than when the glass cloth is filled with the components of the heat conductive layer.
粉末であり、マイカより熱伝導性の良い無機質粉末はラ
ンダム形状のアルミナ粉末である請求項１記載のマイカ
基材シート状体。2. The mica base sheet according to claim 1, wherein the inorganic powder contained in the filler is mica powder, and the inorganic powder having better thermal conductivity than mica is a random-shaped alumina powder.
にマイカより熱伝導性の良い無機質粉末を含有する請求
項１又は２に記載のマイカ基材シート状体。3. The mica substrate sheet according to claim 1, wherein at least the adhesive layer of the mica layer and the adhesive layer contains an inorganic powder having better thermal conductivity than mica.
性の良い無機質粉末の粒径は０．１μｍ〜５０μｍであ
る請求項１ないし３のいずれかに記載のマイカ基材シー
ト状体。4. The mica substrate sheet according to claim 1, wherein the inorganic powder having a higher thermal conductivity than the mica contained in the thermal conductive layer has a particle size of 0.1 μm to 50 μm.
カ１００重量部に対し５〜５０重量部の合成繊維フィブ
リッドと、上記集成マイカ１００重量部に対して５〜５
０重量部の上記集成マイカより熱伝導性の良い無機質粉
末を含有し、かつ該マイカ層に含有させる熱伝導性の良
い無機質粉末の粒径は５μｍ〜５０μｍである請求項１
ないし４のいずれかに記載のマイカ基材シート状体。5. The mica layer is composed of mica aggregate, 5 to 50 parts by weight of synthetic fiber fibrid with respect to 100 parts by weight of the mica aggregate, and 5 to 5 parts by mass with respect to 100 parts by weight of the mica aggregate.
The particle size of the inorganic powder having good thermal conductivity, which is contained in 0 parts by weight of the mica layer, is 5 μm to 50 μm.
5. The mica base sheet according to any one of items 1 to 4.
に占める接着層の割合が５〜１５重量％であり、マイカ
層と充填裏打ち材と接着層と熱伝導層の全体に占める熱
伝導層の割合が２５〜５５重量％であり、該熱伝導層は
７５〜９５重量％のマイカより熱伝導性の良い無機質粉
末を含む請求項１ないし５のいずれかに記載のマイカ基
材シート状体。6. The ratio of the adhesive layer to the whole of the mica layer, the filling backing material and the adhesive layer is 5 to 15% by weight, and the heat conduction to the whole of the mica layer, the filling backing material, the adhesive layer and the heat conducting layer. The mica substrate sheet according to any one of claims 1 to 5, wherein a ratio of the layer is 25 to 55% by weight, and the heat conductive layer contains 75 to 95% by weight of an inorganic powder having better heat conductivity than mica. body.
に占める接着層の割合が２５〜５０重量％であり、マイ
カ層と充填裏打ち材と接着層と熱伝導層の全体に占める
熱伝導層の割合が２０〜５０重量％であり、該熱伝導層
は６５〜８５重量％のマイカより熱伝導性の良い無機質
粉末を含む請求項１ないし６のいずれかに記載のマイカ
基材シート状体。7. The heat conduction in the mica layer, the filling backing material, the adhesive layer and the heat conducting layer is 25 to 50% by weight of the mica layer, the filling backing material and the adhesive layer. The mica substrate sheet according to any one of claims 1 to 6, wherein a ratio of the layer is 20 to 50% by weight, and the heat conductive layer contains 65 to 85% by weight of an inorganic powder having better heat conductivity than mica. body.
カ基材シート状体及び含浸樹脂の硬化層により絶縁層を
形成した絶縁コイル。8. An insulated coil having an insulating layer formed by a cured layer of the mica base sheet and the impregnated resin according to claim 6 on an insulating portion of the coil.
無機質粉末を含有させ、かつ該無機質粉末の粒径を０．
１〜１５μｍとする請求項８記載の絶縁コイル。9. An impregnated resin layer containing an inorganic powder having a higher thermal conductivity than mica, and a particle diameter of the inorganic powder of 0.1%.
The insulated coil according to claim 8, wherein the thickness is 1 to 15 m.
イカ基材シート状体及びその含有した接着層及び熱伝導
層の熱硬化層により絶縁層を形成した絶縁コイル。10. An insulated coil in which an insulating layer is formed on the insulating portion of the coil by the mica base sheet according to claim 7 and the thermosetting layer containing the adhesive layer and the heat conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000277400A JP3879054B2 (en) | 2000-09-13 | 2000-09-13 | Mica base sheet and insulation coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000277400A JP3879054B2 (en) | 2000-09-13 | 2000-09-13 | Mica base sheet and insulation coil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002093257A true JP2002093257A (en) | 2002-03-29 |
| JP3879054B2 JP3879054B2 (en) | 2007-02-07 |
Family
ID=18762736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000277400A Expired - Fee Related JP3879054B2 (en) | 2000-09-13 | 2000-09-13 | Mica base sheet and insulation coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3879054B2 (en) |
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