JPH0945133A - Mica base sheet-like body and insulated coil - Google Patents
Mica base sheet-like body and insulated coilInfo
- Publication number
- JPH0945133A JPH0945133A JP21397195A JP21397195A JPH0945133A JP H0945133 A JPH0945133 A JP H0945133A JP 21397195 A JP21397195 A JP 21397195A JP 21397195 A JP21397195 A JP 21397195A JP H0945133 A JPH0945133 A JP H0945133A
- Authority
- JP
- Japan
- Prior art keywords
- mica
- layer
- inorganic powder
- thermal conductivity
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気用品、特に発
電機等の電気機器におけるコイル、特に高電圧コイルの
絶縁層を形成する際に用いるマイカ基材シート状体及び
これを用いた絶縁コイルに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mica base sheet used for forming an insulating layer of an electric appliance, particularly a coil in an electric device such as a generator, especially a high voltage coil, and an insulating coil using the same. Regarding
【０００２】[0002]
【従来の技術】発電機等の電気機器における回転子や固
定子に用いられるコイルの巻線の束を絶縁するために絶
縁特性のよいマイカ材料を用いることが行われている。
この場合、マイカを主成分として抄造した絶縁紙をコイ
ルの絶縁用に用いると、その絶縁紙の熱伝導性が悪く、
動作中のコイルにより発生した熱を放熱し難いためコイ
ルは蓄熱し易く、コイルの電気特性に悪影響を与え、電
気機器としての性能を維持する上では問題がある。特に
最近は小型で、高性能の電気機器の出現が要望されてい
るのでその問題が大きくなりつつある。この問題を解決
するために、特公昭５６−３８００６号公報に記載され
ているように、マイカと合成繊維フィブリッドを混抄す
る際にマイカより熱伝導性の良い無機質粉末を含有させ
たマイカ基材シートをコイルに巻き付け、その後樹脂を
含浸させるか、特開昭６３−１１０９２９号公報に記載
されているようにガラス繊維織布にポリエチレングリコ
ールテレフタレート膜によりマイカテープを接着させた
絶縁テープをコイルに巻付けた後、マイカより熱伝導性
の良い無機質粉末を含有させた樹脂を含浸させ、いずれ
の場合も絶縁層の熱伝導性を改善することが提案されて
いる。2. Description of the Related Art It has been practiced to use a mica material having a good insulating property in order to insulate a bundle of windings of a coil used for a rotor or a stator in electric equipment such as a generator.
In this case, if an insulating paper made from mica as the main component is used for coil insulation, the thermal conductivity of the insulating paper is poor,
Since it is difficult to dissipate the heat generated by the operating coil, the coil easily accumulates heat, which adversely affects the electrical characteristics of the coil and causes a problem in maintaining the performance as an electrical device. Particularly, recently, the advent of small-sized and high-performance electric devices has been demanded, and the problem is becoming serious. In order to solve this problem, as described in JP-B-56-38006, a mica base sheet containing an inorganic powder having better thermal conductivity than mica when mixing mica and synthetic fiber fibrids Is wound around a coil and then impregnated with a resin, or an insulating tape in which a mica tape is adhered to a woven glass fiber cloth with a polyethylene glycol terephthalate film as described in JP-A-63-110929 is wound around the coil. After that, it is proposed to impregnate a resin containing an inorganic powder having better thermal conductivity than mica to improve the thermal conductivity of the insulating layer in any case.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前者
は、マイカより熱伝導性の良い無機質粉末の粒径が３０
μｍより小さいと、合成繊維フィブリッドとマイカとと
もに抄造する際に抄き網から抜け落ち、その抄造歩留ま
りが悪いということがあるため、その粒径は３０μｍ〜
１００μｍに限定され、合成繊維フィブリッドとマイカ
の混合層の小さい隙間を十分に埋めることができず、そ
の隙間の空気の存在により熱伝導性を十分に向上させる
ことができないという問題があった。また、後者は、そ
の粒径を０．１μｍ〜１５μｍのように逆に小さくして
いるが、樹脂とともに含浸されるので絶縁テープの隙間
に浸透するその流通抵抗が大きく、特に奥の細かい隙間
には樹脂だけが浸透し無機質粒子は表面側に引っ掛かっ
て奥まで浸透できず、その含浸層が不均一になり易く、
その浸透にも時間がかかり生産性が良くないという問題
や、さらには無機質粉末を含浸用樹脂液に混ぜる作業が
必要になり、通常は絶縁材料を提供する側と、これを使
用する側は異なるので、その使用者側にその負担を強い
ることは生産性の点で好ましくなく、一方絶縁材料の供
給者と含浸用樹脂の供給者は異なる場合が多いので、こ
れらのどちら側でその作業を行う場合にも余分な負担に
なり生産性を害するという問題がある。However, in the former case, the particle size of the inorganic powder, which has better thermal conductivity than mica, is 30.
If it is smaller than μm, it may fall out from the paper making net during the papermaking together with the synthetic fiber fibrid and mica, and the papermaking yield may be poor.
It was limited to 100 μm, and there was a problem that the small gap between the mixed layer of synthetic fiber fibrid and mica could not be filled sufficiently, and the presence of air in the gap could not sufficiently improve the thermal conductivity. In the latter, the particle size is conversely small, such as 0.1 μm to 15 μm, but since it is impregnated with the resin, its flow resistance that penetrates into the gaps of the insulating tape is large, especially in the deep gaps. Only the resin penetrates and the inorganic particles are caught on the surface side and cannot penetrate deeply, and the impregnated layer tends to be non-uniform,
The problem is that the penetration also takes time and the productivity is not good, and further, the work of mixing the inorganic powder with the impregnating resin liquid is required, and the side that normally provides the insulating material and the side that uses this are different. Therefore, it is not preferable in terms of productivity to impose the burden on the user side, and on the other hand, the supplier of the insulating material and the supplier of the impregnating resin are often different. Even in this case, there is a problem that an extra burden is imposed and productivity is impaired.
【０００４】本発明の第１の目的は、熱伝導性が比較的
均一であり、放熱が比較的均一に行われ、特にコイル用
絶縁材料に使用した場合蓄熱し難いマイカ基材シート状
体及びこれを用いた絶縁コイルを提供することにある。
本発明の第２の目的は、熱伝導による放熱が速やかに行
われ、特にコイル用絶縁材料に使用した場合蓄熱し難
く、特に最近の小型化、高性能化のコイルに適するマイ
カ基材シート状体及びこれを用いた絶縁コイルを提供す
ることにある。本発明の第３の目的は、絶縁材料提供
者、含浸用樹脂提供者、これらの使用者において従来の
生産工程の大幅な変更をすることなく、生産性を害する
ことがないようにすることにある。A first object of the present invention is to provide a mica base sheet having a relatively uniform thermal conductivity and a relatively uniform heat dissipation, which is hard to store heat when used as an insulating material for a coil, and An object is to provide an insulated coil using this.
A second object of the present invention is that mica base sheet-like sheet, which is capable of quickly radiating heat by heat conduction, is hard to store heat particularly when used as an insulating material for coils, and is particularly suitable for recent miniaturized and high-performance coils. The object is to provide a body and an insulated coil using the same. A third object of the present invention is to prevent the productivity of the insulating material provider, the impregnating resin provider, and the users from being impaired without drastically changing the conventional production process. is there.
【０００５】本発明は、上記目的を達成するために、
（１）、裏打ち材と、マイカを含有するマイカ層と、該
裏打ち材と該マイカ層を接合する接着層を有するマイカ
基材シート状体において、該マイカ層と該接着層の内少
なくとも接着層にマイカより熱伝導性の良い無機質粉末
を含有するマイカ基材シート状体を提供するものであ
る。また、本発明は、（２）、マイカ層は集成マイカ
と、この集成マイカ１００重量部に対し５〜８５重量部
の合成繊維フィブリッドと、上記集成マイカ１００重量
部対して５ないし８５重量部の上記集成マイカより熱伝
導性の良い無機質粉末を含有し、かつ該マイカ層に含有
させる熱伝導性の良い無機質粉末の粒径は３０μｍ〜１
００μｍであり、接着層に含有させる熱伝導性の良い無
機質粉末の粒径は０．１μｍ〜１００μｍである上記
（１）のマイカ基材シート状体、（３）、半硬化状態の
含浸用樹脂を含有させた上記（１）又は（２）に記載の
マイカ基材シート状体、（４）、半硬化状態の含浸用樹
脂はマイカより熱伝導性の良い無機質粉末を含有する上
記（３）のマイカ基材シート状体、（５）、コイルの絶
縁部に上記（１）又は（２）のマイカ基材シート状体及
び含浸樹脂の硬化層により絶縁層を形成した絶縁コイ
ル、（６）、含浸樹脂層にマイカより熱伝導性の良い無
機質粉末を含有させ、かつ該無機質粉末の粒径を０．１
〜１５μｍとする上記（５）の絶縁コイル、（７）、コ
イルの絶縁部に上記（３）又は（４）のマイカ基材シー
ト状体及びその含有した半硬化状態の含浸用樹脂の熱硬
化層により絶縁層を形成した絶縁コイルを提供するもの
である。In order to achieve the above object, the present invention provides
(1) A mica substrate sheet having a backing material, a mica layer containing mica, and an adhesive layer for joining the backing material and the mica layer, wherein at least the adhesive layer of the mica layer and the adhesive layer In addition, the present invention provides a mica-based sheet material containing an inorganic powder having better thermal conductivity than mica. The present invention also provides (2), wherein the mica layer is composed of mica, 5 to 85 parts by weight of synthetic fiber fibrids per 100 parts by weight of the mica, and 5 to 85 parts by weight of 100 parts by weight of the mica. The particle size of the inorganic powder having a better thermal conductivity than that of the above mica and having a good thermal conductivity contained in the mica layer is 30 μm to 1
The particle size of the inorganic powder having a heat conductivity of 00 μm and good thermal conductivity to be contained in the adhesive layer is 0.1 μm to 100 μm, and the mica-based sheet material according to (1), (3), a semi-cured impregnating resin The mica-based sheet material according to (1) or (2) above, (4), wherein the semi-cured impregnating resin contains an inorganic powder having better thermal conductivity than mica (3). (5), an insulating coil in which an insulating layer is formed on the insulating part of the coil by the mica substrate sheet of (1) or (2) and a cured layer of impregnated resin, (6) The impregnated resin layer contains an inorganic powder having a better thermal conductivity than mica, and the particle size of the inorganic powder is 0.1.
To 15 μm, the insulating coil according to (5) above, (7), the mica base sheet material according to (3) or (4) above in the insulating portion of the coil, and thermosetting of the semi-cured impregnating resin contained therein. An insulating coil having an insulating layer formed by layers is provided.
【０００６】本発明のマイカ基材シート状体は、マイカ
を含有するマイカ層と裏打ち材を接合する接着層に、マ
イカより熱伝導性の良い無機質粉末を含有させるが、こ
のようにすると接着剤に無機質粉末をロールミル等のミ
リング手段により細かく、しかも均一に含有させること
ができ、その塗布層も任意の均一な厚さに形成できるの
で、その接着層は組成が均一になり、厚さも均一で熱伝
導性も均一にすることができる。このように熱伝導性が
均一な接着層が介在すると、この層を通って放熱がこの
層の各部分において比較的均一に行われ、全体の放熱を
促進することができる。上記マイカより熱伝導性の良い
無機質粉末とは、マイカの熱伝導率約１．５×１０-3ｃ
ａｌ／ｃｍ・ｓｅｃ・℃よりも大きければ良く、その充
填性から粒状のものが好ましい。具体的には、例えは窒
化ホウ素（熱伝導率約２×１０-1ｃａｌ／ｃｍ・ｓｅｃ
・℃、以下括弧内熱伝導率）、酸化アルミニウム（約８
×１０-2ｃａｌ／ｃｍ・ｓｅｃ・℃）、酸化マグネシウ
ム（約９×１０-2ｃａｌ／ｃｍ・ｓｅｃ・℃）、酸化ベ
リリウム（約９×１０-1ｃａｌ／ｃｍ・ｓｅｃ・℃）、
炭化ケイ素（約１×１０-1ｃａｌ／ｃｍ・ｓｅｃ・℃）
等の１種又は２種以上を混合して用いることができる。
この無機質粉末の粒径及びその配合量としては、接着剤
に混合でき、その混合物がロールコータ等の塗布手段に
より塗布でき、しかも接着剤の機能を損なわなないもの
であれば良いが、粒径としては例えば０．１μｍ〜１０
０μｍの範囲のものが例示でき、その配合量としては接
着剤の固形分に対して５〜１００量％が好ましい。配合
量がこれより少ないと熱伝導性があまり向上せず、これ
より多いと接着剤としての効果が十分でないことがあ
る。上記接着剤としては、例えばエポキシ−酸無水物−
アミン系樹脂、ポリエステル系樹脂、シリコーン系樹脂
等の熱硬化性接着剤が好ましく、熱風、赤外線照射等に
より熱硬化されることが好ましい。In the mica-based sheet of the present invention, the adhesive layer for joining the mica-containing mica layer and the backing material contains an inorganic powder having a higher thermal conductivity than mica. Since the inorganic powder can be finely and uniformly contained by a milling means such as a roll mill, and the coating layer can be formed to have an arbitrary uniform thickness, the adhesive layer has a uniform composition and a uniform thickness. The thermal conductivity can also be made uniform. When the adhesive layer having uniform thermal conductivity is interposed in this manner, heat is radiated through the layer relatively uniformly in each part of the layer, and the heat radiation of the whole can be promoted. The inorganic powder having better thermal conductivity than that of mica means that the thermal conductivity of mica is about 1.5 × 10 −3 c
It is sufficient if it is higher than al / cm · sec · ° C, and granular particles are preferable from the viewpoint of its filling property. Specifically, for example, boron nitride (thermal conductivity of about 2 × 10 −1 cal / cm · sec
・ ℃, the thermal conductivity in parentheses below, aluminum oxide (about 8
X10 -2 cal / cm-sec- ° C), magnesium oxide (about 9x10 -2 cal / cm-sec- ° C), beryllium oxide (about 9x10 -1 cal / cm-sec- ° C),
Silicon Carbide (about 1 × 10 -1 cal / cm ・ sec ・ ° C)
1 type or 2 types or more of these can be mixed and used.
The particle size of the inorganic powder and its blending amount are not limited as long as they can be mixed with an adhesive, the mixture can be applied by a coating means such as a roll coater, and the function of the adhesive is not impaired. For example, 0.1 μm to 10
One in the range of 0 μm can be exemplified, and the compounding amount thereof is preferably 5 to 100% by weight based on the solid content of the adhesive. If the blending amount is less than this, the thermal conductivity does not improve so much, and if it is more than this, the effect as an adhesive may not be sufficient. Examples of the adhesive include epoxy-anhydride-
Thermosetting adhesives such as amine-based resins, polyester-based resins and silicone-based resins are preferable, and they are preferably heat-cured by hot air, infrared irradiation or the like.
【０００７】本発明に用いるマイカを含有するマイカ層
は、マイカとしては天然の軟質、硬質、はがしマイカの
いずれも使用でき、合成マイカも使用でき、さらには集
成マイカも使用でき、これらは単独又は複数使用でき、
マイカのみあるいは他の後述の材料、さらにはポリエチ
レンオキサイドなどの分散剤の少なくとも１種とともに
水中に分散させ、その分散液を長網式抄紙機等により抄
造し、シート状に形成することが好ましい。なお、集成
マイカは、硬質あるい軟質マイカを叩解し、微細なりん
片（例えば厚さ約１〜５０μｍ、大きさ０．１〜１．５
ｍｍ2 ）にしたもので、そのなかでも焼成集成マイカを
用いることが好ましい。この焼成集成マイカは、焼成処
理した硬質マイカを酸及びアルカリで処理した後、叩解
し、微細りん片としたもので、焼成処理によりマイカは
結晶水の一部を放出し、結晶面にしわを生じ、へき開層
間を拡大し、このため沈降速度が遅く、後述の合成繊維
フィブリッドとのからみ合いが生じ易く、これによりシ
ートとしたとき、地合の均一な強度の優れたものにする
ことができる。このマイカ層には、上記マイカより熱伝
導性の良い無機質粉末を混合させることが好ましく、そ
の配合量としては上記マイカ１００重量部に対して５な
いし８５重量部が好ましく、これより少ないと、熱伝導
性がマイカ単独の場合に比べて向上する効果が少なく、
これより多いとシート状にしたときその機械的強度を低
下させる傾向がある。また、この無機質粉末の粒径とし
ては、３０μｍ以上１００μｍ以下が好ましく、これよ
り小さいと抄造の際、抄き網から抜け落ちて歩留まりが
悪くなる傾向があり、また、大き過ぎるとマイカ層をシ
ート状に形成した際強度を低下させる原因になることが
ある。また、マイカ層には合成繊維フィブリッドを混合
することが、抄いたときにこれによりマイカ、上記無機
質粉末を包むようにして自らを絡ませることができ、機
械的強度を向上できる点で好ましいが、これが多すぎる
とマイカ層の熱伝導率を低下させるので、マイカ層を抄
造により形成したときシート状に維持でき、裏打ち材と
接着剤により接合できるものであればよく、その配合量
はマイカ１００重量部に対して５〜８５重量部が好まし
い。The mica-containing mica layer used in the present invention can be any of natural soft, hard, and peelable mica, mica, synthetic mica, and mica mica, which can be used alone or You can use multiple,
It is preferable that mica alone or other materials described below and at least one dispersant such as polyethylene oxide are dispersed in water, and the dispersion is formed into a sheet by paper making with a Fourdrinier paper machine or the like. In addition, the integrated mica is obtained by beating hard or soft mica to obtain fine pieces (for example, a thickness of about 1 to 50 μm and a size of 0.1 to 1.5).
mm 2 ), and among them, it is preferable to use calcined mica. This calcined laminated mica is obtained by treating calcined hard mica with an acid and an alkali and then beating it into fine flakes.By calcining, the mica releases a part of water of crystallization and wrinkles on the crystal surface. Occurrence and expansion of the cleavage layer, and thus the sedimentation speed is slow, and entanglement with the synthetic fiber fibrids described later is likely to occur, and when formed into a sheet, it is possible to make the formation excellent in uniform strength. . The mica layer is preferably mixed with an inorganic powder having a better thermal conductivity than the mica, and the compounding amount thereof is preferably 5 to 85 parts by weight with respect to 100 parts by weight of the mica. Less effective in improving conductivity than mica alone,
If the amount is larger than this, the mechanical strength of the sheet tends to be lowered. The particle size of this inorganic powder is preferably 30 μm or more and 100 μm or less, and if it is smaller than this, it tends to fall out from the paper making net during the papermaking, resulting in poor yield, and if it is too large, the mica layer is formed into a sheet. When it is formed, it may cause a decrease in strength. Further, it is preferable to mix synthetic fiber fibrids in the mica layer, since it is possible to entangle itself by wrapping the mica and the above-mentioned inorganic powder when the paper is made, and the mechanical strength can be improved. If it is too much, the thermal conductivity of the mica layer is lowered, so that it can be maintained in a sheet shape when the mica layer is formed by papermaking, and it can be joined by a backing material and an adhesive, and the compounding amount is 100 parts by weight of mica. On the other hand, 5 to 85 parts by weight is preferable.
【０００８】上記裏打ち材としては、ガラス繊維織布、
ガラス繊維不織布、ポリエステルフィルム等が挙げられ
るが、その厚さとしては０．０２ｍｍ〜０．０８ｍｍが
適当である。上記裏打ち材と上記マイカ層は上記接着層
により接合されることによりマイカ基材シート状体が得
られるが、そのままテープ状に裁断し、そのテープをコ
イルの絶縁部に巻回し、その巻回層に樹脂を含浸させ、
硬化させて絶縁層を形成することができる。その含浸用
樹脂としては、例えばエポキシ−酸無水物−アミン系樹
脂、ボリエステル系樹脂、シリコーン系樹脂等が用いら
れる。これらの樹脂の熱伝導率は空気よりは良く、一般
にマイカよりは悪いが、裏打ち材とマイカ層を接合する
接着層にはマイカより熱伝導率の良い無機質粉末が含ま
れており、この接着層には含浸樹脂層を有するマイカ層
に比べて比較的空気の泡（ボイド）が含まれる確率を小
さくできるので、この接着層は熱伝導率が良くかつその
熱伝導性が均一であることによりコイルの動作で発生し
た熱を外部に放熱する伝熱を促進し、放熱を促進するこ
とができる。As the backing material, a glass fiber woven cloth,
Examples include glass fiber non-woven fabric and polyester film, and the appropriate thickness is 0.02 mm to 0.08 mm. The backing material and the mica layer are bonded by the adhesive layer to obtain a mica base sheet, which is cut into a tape as it is, and the tape is wound around the insulating portion of the coil, and the wound layer is formed. Impregnated with resin,
It can be cured to form an insulating layer. As the impregnating resin, for example, epoxy-acid anhydride-amine resin, polyester resin, silicone resin, etc. are used. The thermal conductivity of these resins is better than that of air and generally worse than that of mica, but the adhesive layer that joins the backing material and the mica layer contains an inorganic powder with a better thermal conductivity than mica. Since the probability that air bubbles (voids) are included in the adhesive layer is relatively small compared to the mica layer having the impregnated resin layer, this adhesive layer has good thermal conductivity and uniform thermal conductivity. It is possible to promote heat transfer by radiating the heat generated by the operation of (3) to the outside, and promote heat dissipation.
【０００９】このように、マイカ基材シート状体は樹脂
を含浸させずに供給することもできるが、これに上記樹
脂を含浸させ、半硬化状態にして供給することもでき、
その場合にはコイルの絶縁部に巻回させた後、樹脂を含
浸することなく、単に加熱することによりその樹脂を硬
化させ、絶縁層を形成することができる。この場合に、
その含浸樹脂に上記マイカより熱伝導性の良い無機質粉
末を含有させることもでき、その際にはその無機質粉末
の粒径は０．１μｍ〜１５μｍであることがその混合物
を含浸させる流通抵抗を小さくする点、絶縁破壊電圧を
大きくできる点で好ましく、その樹脂との混合割合は両
者の固形分合計に対して５〜５０重量％であることが好
ましく、これより少ないと熱伝導性の向上効果が少な
く、これより多いと含浸樹脂液の粘度が増し含浸性を悪
くする傾向がある。As described above, the mica-based sheet material can be supplied without being impregnated with the resin, but it can also be impregnated with the resin to be semi-cured and supplied.
In that case, after being wound around the insulating portion of the coil, the resin can be cured by simply heating without impregnating the resin to form the insulating layer. In this case,
The impregnating resin may contain an inorganic powder having a better thermal conductivity than the above mica, and in that case, the particle size of the inorganic powder is 0.1 μm to 15 μm, which reduces the flow resistance for impregnating the mixture. And the point that the dielectric breakdown voltage can be increased, and the mixing ratio with the resin is preferably 5 to 50% by weight based on the total solid content of both, and if it is less than this, the effect of improving thermal conductivity is obtained. If the amount is less than the above range, the viscosity of the impregnating resin liquid tends to increase and the impregnating property tends to deteriorate.
【００１０】マイカ基材シート状体に樹脂を半硬化状態
で含浸させた場合、コイルに巻いたマイカ基材シート状
体にその含浸を行なう場合のいずれも、接着層にはマイ
カより熱伝導率の良い無機質粉末を含有させるが、その
厚さはその無機質粉末をマイカ層、含浸樹脂に含有させ
ない場合は厚く、含有させる場合は薄くすることが好ま
しい。In both cases where the resin is impregnated into the mica base sheet in a semi-cured state and the mica base sheet wrapped around the coil is impregnated, the adhesive layer has a thermal conductivity higher than that of mica. A good inorganic powder is contained, but the thickness is preferably thick when the inorganic powder is not contained in the mica layer and the impregnated resin, and is thin when it is contained.
【００１１】このようにして本発明のマイカ基材シート
状体、これを用いた絶縁コイルが得られるが、接着層に
マイカより熱伝導率の良い無機質粉末を含有させること
により、 その無機質粉末の粒径を広くとることがで
き、それだけ粒径を選別する手間が省け、 その接着
剤との混合手段も簡単に行なうことができ、 接着層
は例えばマイカ層の隙間に樹脂を含浸させる場合のよう
に隙間に樹脂を浸透させる必要がないから組成及び厚さ
を均一にでき、その塗布作業も容易であり、熱伝導率
を良くすることにより放熱を促進できるという効果を有
し、さらにマイカ層やその含浸樹脂にマイカより熱伝導
率の良い無機質粉末を含有させることにより、その放熱
効果を高めることができ、最近の小型化、高性能化の電
気機器の特に高電圧用コイル用絶縁材料としての要求を
満たすことができる。このように電気機器の絶縁特性を
高性能に維持できると、その電気機器の動作特性を損な
わないようにできる。このことから、上記発明におい
て、「マイカ基材シート状体」を「コイル用マイカ基材
絶縁シート状体」とすることもでき、さらに「コイル」
を「小型コイル」、「小型化・高性能化コイル」とする
こともできる。また、これら発明において、これら及び
絶縁コイル（小型絶縁コイル又は小型化・高性能化絶縁
コイル）の製造方法とし、これらに準用できる。また、
本発明のマイカ基材シート状体は耐熱電気絶縁放熱スペ
ーサーとして、例えばパワートランジスタ放熱用絶縁板
などにおいて放熱性を向上した材料としても使用するこ
とができる。In this way, the mica-based sheet material of the present invention and the insulated coil using the same are obtained. By including the inorganic powder having a higher thermal conductivity than mica in the adhesive layer, the inorganic powder The particle size can be made wider, the time and effort for selecting the particle size can be saved, and the means for mixing with the adhesive can be easily performed. The adhesive layer can be formed, for example, by impregnating the resin in the gap of the mica layer. Since it is not necessary to infiltrate the resin into the gaps, the composition and thickness can be made uniform, the coating operation is easy, and it has the effect that heat dissipation can be promoted by improving the thermal conductivity. Inclusion of an inorganic powder, which has better thermal conductivity than mica, in the impregnating resin can enhance its heat dissipation effect, and especially for high-voltage coils of recent miniaturized and high-performance electrical equipment. It can meet the requirements of the edge material. If the insulation characteristics of the electric device can be maintained at high performance in this way, the operating characteristics of the electric device can be maintained. From this, in the above-mentioned invention, the "mica base material sheet-like body" can also be referred to as a "mica base material insulating sheet-like body for a coil", and further "coil"
Can also be referred to as a "small coil" or a "smaller size / higher performance coil". Moreover, in these inventions, these and the insulating coil (small insulating coil or small-sized / high-performance insulating coil) can be applied to these and can be applied correspondingly. Also,
The mica base sheet of the present invention can be used as a heat-resistant electric insulation heat dissipation spacer, for example, as a material having improved heat dissipation in a power transistor heat dissipation insulating plate.
【００１２】[0012]
【発明の実施の形態】次に本発明の実施の形態を説明す
る。マイカを含有するマイカ層として焼成集成マイカの
み、あるいは焼成集成マイカ１００重量部に対して芳香
族ポリアミドフィブリット（濾水度６０°ＳＲ）５〜８
５重量部、あるいはさらに焼成集成マイカ１００重量部
に対して窒化ホウ素（粒径約３０μｍ〜１００μｍ）５
〜８５重量部を水中に分散し、その分散液を長網式抄紙
機にて抄造し、厚さ０．０５〜０．１２ｍｍのそれぞれ
に対応する３種類の集成マイカ基材箔を作製した。裏打
ち材として厚さ０．０３ｍｍ〜０．０８ｍｍのガラスク
ロスにエポキシ−アミン系の熱硬化性樹脂を主成分とす
る接着剤に窒化ホウ素（粒径約０．１μｍ〜１００μ
ｍ）を全固形分中５〜５０重量％になるように混合した
窒化ホウ素含有接着剤をロールコータにより塗布し、こ
れに上記３種類のそれぞれの集成マイカ基材箔を接合
し、３種類のマイカ基材シート状体を作製した。エポキ
シ−酸無水物系の熱硬化性樹脂を主成分とする含浸用樹
脂組成物、あるいはこれに窒化ホウ素（粒径約０．１μ
ｍ〜１５μｍ）を全固形分中３０重量％ロールミルによ
り混合して作製した窒化ホウ素含有含浸用樹脂液のそれ
ぞれを、真空度約１ｍｍＨｇ、温度約９０℃で乾燥し水
分などの揮発成分を除いた上記３種類のそれぞれのマイ
カ基材シート状体１００重量部に対して固形分で３０〜
５０重量部引き続いて同じ条件で含浸させ、１時間加熱
して半硬化状態の含浸樹脂層を形成した。このようにし
て３種類の無含浸マイカ基材シート状体に２種類の含浸
用組成物を含浸させ半硬化状態にした６種類の含浸マイ
カ基材シート状体を作製した。次に、上記３種類の無含
浸のマイカ基材シート状体、上記６種類の含浸マイカ基
材シート状体のそれぞれをコイル導体上に半掛け３回巻
き（幅の半分を重ねながら巻く巻き方）した後、前者の
３種類の無含浸マイカ基材シート状体については、真空
度約１ｍｍＨｇ、温度約９０℃で乾燥し水分などの揮発
成分を除いた後、エポキシ−酸無水物系熱硬化性樹脂を
主成分とする含浸用樹脂組成物を同じ条件で含浸させ、
１００℃より１８０℃まで段階的に昇温させて樹脂を完
全硬化させ、後者の６種類については１００℃より１８
０℃まで段階的に昇温させ樹脂を完全硬化させ、それぞ
れの絶縁コイルを作製した。このようにすると、接着層
を媒介してコイル導体に発生した熱が放熱され、接着層
は組成が均一、厚さが均一であるのでその放熱の効率が
良く、その促進をすることができる。BEST MODE FOR CARRYING OUT THE INVENTION Next, embodiments of the present invention will be described. As a mica layer containing mica, only calcined mica, or aromatic polyamide fibrite (freeness 60 ° SR) per 100 parts by weight of calcined mica 5-8
5 parts by weight, or further 100 parts by weight of the calcined mica, boron nitride (particle size: about 30 μm to 100 μm) 5
~ 85 parts by weight was dispersed in water, and the dispersion was made into paper by a Fourdrinier paper machine to prepare three types of laminated mica substrate foils having a thickness of 0.05 to 0.12 mm. A glass cloth having a thickness of 0.03 mm to 0.08 mm is used as a backing material, and an adhesive containing an epoxy-amine thermosetting resin as a main component is used as a boron nitride (particle size of about 0.1 μm to 100 μm).
m) is mixed in an amount of 5 to 50% by weight based on the total solid content, a boron nitride-containing adhesive is applied by a roll coater, and the above three types of mica base foils are joined together to form three types of adhesives. A mica base sheet was prepared. An impregnating resin composition containing an epoxy-anhydride type thermosetting resin as a main component, or a boron nitride (particle size: about 0.1 μm)
m-15 μm) in a total solid content by mixing with a 30 wt% roll mill, and each of the boron nitride-containing impregnating resin liquids was dried at a vacuum degree of about 1 mmHg and a temperature of about 90 ° C. to remove volatile components such as water. The solid content is 30 to 30 parts by weight with respect to 100 parts by weight of each of the above three kinds of mica base sheet.
Subsequently, 50 parts by weight was impregnated under the same conditions and heated for 1 hour to form a semi-cured impregnated resin layer. In this way, 6 kinds of impregnated mica base sheet were prepared by impregnating 3 kinds of non-impregnated mica base sheet with 2 kinds of impregnating compositions to give a semi-cured state. Next, each of the above-mentioned three types of non-impregnated mica base sheet and the above-mentioned six types of impregnated mica base sheet are half-hanged on the coil conductor and wound three times (winding while overlapping half width). ), The former three types of non-impregnated mica-based sheet materials are dried at a vacuum degree of about 1 mmHg and a temperature of about 90 ° C. to remove volatile components such as water, and then epoxy-anhydride thermal curing. Impregnating a resin composition for impregnation containing a hydrophobic resin as a main component under the same conditions,
The resin is completely cured by gradually raising the temperature from 100 ° C to 180 ° C, and the latter six types are heated from 100 ° C to 18 ° C.
The temperature was raised stepwise to 0 ° C. to completely cure the resin, and each insulated coil was produced. In this case, the heat generated in the coil conductor is radiated through the adhesive layer, and the adhesive layer has a uniform composition and a uniform thickness, so that the efficiency of heat dissipation is good and can be promoted.
【００１３】[0013]
【実施例】次に本発明の実施例を説明する。 実施例１ 焼成集成マイカ１００部を水中に分散し、その分散液を
長網式抄紙機にて抄造し、厚さ０．０８ｍｍのマイカ層
としての集成マイカ基材箔を作製した。裏打ち材として
厚さ０．０３ｍｍのガラスクロスにエポキシ−アミン系
の熱硬化性樹脂を主成分とする接着剤（エピコート８２
８（油化シエルエポキシ社製エポキシ樹脂）１００重量
部とＢＦ3 モノエチルアミン３重量部からなる）に窒化
ホウ素（粒径約０．１〜１００μｍ）を全固形分中３０
重量％になるように混合した窒化ホウ素含有接着剤をロ
ールコータにより塗布し、これに上記集成マイカ基材箔
を接合し、マイカ基材シート状体を作製した。次に、上
記マイカ基材シート状体を導体上に半掛け３回巻きした
後、真空度約１ｍｍＨｇ、温度約９０℃で乾燥し水分な
どの揮発成分を除いた後、エポキシ−酸無水物系の熱硬
化性樹脂を主成分とする含浸用樹脂組成物（エピコート
８２８（油化シエルエポキシ社製エポキシ樹脂）１００
重量部とカヤハードＭＣＤ（日本化薬株式会社製酸無水
物）９０重量部を主成分とする含浸用樹脂組成物）を含
浸させ、１００℃より１８０℃まで段階的に昇温させて
樹脂を完全硬化させ、導体上に絶縁層を形成した絶縁コ
イルを作製した。上記マイカ基材シート状体について、
含浸性、破壊電圧を測定した結果を表１に示す。また、
導体上に形成された絶縁層を切り取り、表面を研磨した
後、破壊電圧と熱伝導率を測定した結果を表１に示す。
なお、破壊電圧はＪＩＳ Ｃ２１１６の方法、熱伝導率
は定常状態における低沸点液体の蒸発量から通過熱量を
求める方法（柴山科学器械製作所製熱伝導率測定装置）
により求めた。また、含浸性は官能テストにより１００
×１００ｍｍの大きさの試験片の上にヒマシ油６０部、
トルエン４０部からなる混合液を０．０２ｍｌ滴下し、
液が浸透拡散する状態を観察し、３段階評価を行い、不
良、良好、優良とした。Next, embodiments of the present invention will be described. Example 1 100 parts of calcined laminated mica was dispersed in water, and the dispersion was made into paper by a Fourdrinier paper machine to prepare a laminated mica base foil as a mica layer having a thickness of 0.08 mm. A 0.03 mm-thick glass cloth is used as a backing material, and an adhesive containing an epoxy-amine-based thermosetting resin as a main component (Epicoat 82
8 (Epoxy resin manufactured by Yuka Shell Epoxy Co., Ltd.) and 100 parts by weight of BF 3 monoethylamine and 3 parts by weight of boron nitride (particle size: about 0.1 to 100 μm) in total solid content of 30
A boron nitride-containing adhesive mixed so as to have a weight% was applied by a roll coater, and the above mica base foil was bonded thereto to produce a mica base sheet. Next, after the above mica-based sheet material is wound on a conductor three times and wound three times, it is dried at a vacuum degree of about 1 mmHg and a temperature of about 90 ° C. to remove volatile components such as water, and then an epoxy-anhydride system. Resin composition for impregnation containing the thermosetting resin as a main component (Epicoat 828 (Epoxy resin manufactured by Yuka Shell Epoxy Co., Ltd.) 100
Parts by weight and Kayahard MCD (Nippon Kayaku Co., Ltd. acid anhydride) 90 parts by weight as a main component are impregnated and impregnated, and the temperature is gradually raised from 100 ° C to 180 ° C to complete the resin. An insulating coil was prepared by curing and forming an insulating layer on the conductor. Regarding the mica substrate sheet,
The results of measuring the impregnating property and the breakdown voltage are shown in Table 1. Also,
Table 1 shows the results of measuring the breakdown voltage and the thermal conductivity after cutting off the insulating layer formed on the conductor and polishing the surface.
The breakdown voltage is the method of JIS C2116, and the thermal conductivity is the method of obtaining the passing heat quantity from the evaporation quantity of the low boiling point liquid in the steady state (Shibayama Scientific Instrument Co., Ltd. thermal conductivity measuring device).
Determined by Also, the impregnation property is 100 by sensory test.
60 parts of castor oil on a test piece with a size of 100 mm,
0.02 ml of a mixed solution consisting of 40 parts of toluene was added dropwise,
The state in which the liquid permeated and diffused was observed, and three-stage evaluation was performed, and the results were rated as poor, good, and excellent.
【００１４】実施例２ 実施例１において、焼成集成マイカ１００部の代わり
に、焼成集成マイカ１００重量部、芳香族ポリアミドフ
ィブリット（濾水度６０°ＳＲ）４０重量部を用いた以
外は同様にしてマイカ基材シート状体、絶縁コイルを作
製し、実施例１と同様に試験した結果を表１に示す。Example 2 The same procedure as in Example 1 was carried out except that 100 parts by weight of the mica for calcination and 40 parts by weight of the aromatic polyamide fibrite (freeness of 60 ° SR) were used in place of 100 parts of the mica for calcination. Table 1 shows the results of a mica-based sheet and an insulating coil produced by the above method and tested in the same manner as in Example 1.
【００１５】実施例３ 実施例１において、焼成集成マイカ１００部の代わり
に、焼成集成マイカ１００重量部、芳香族ポリアミドフ
ィブリット（濾水度６０°ＳＲ）４０重量部及び窒化ホ
ウ素（粒径約３０μｍ〜１００μｍ）３０重量部を用い
た以外は同様にしてマイカ基材シート状体、絶縁コイル
を作製し、実施例１と同様に試験した結果を表１に示
す。Example 3 In Example 1, 100 parts by weight of mica prepared by calcining, 40 parts by weight of aromatic polyamide fibrite (freezing degree 60 ° SR) and boron nitride (particle size: A mica base sheet and an insulating coil were prepared in the same manner except that 30 parts by weight (30 μm to 100 μm) were used, and the results of the same test as in Example 1 are shown in Table 1.
【００１６】実施例４〜６ 実施例１で用いたエポキシ−酸無水物系の熱硬化性樹脂
を主成分とする含浸用樹脂組成物を、真空度約１ｍｍＨ
ｇ、温度約９０℃で乾燥し水分などの揮発成分を除いた
上記実施例１〜３の３種類のそれぞれのマイカ基材シー
ト状体１００重量部に対して固形分で６０重量部含浸さ
せ、１時間加熱して半硬化状態の含浸樹脂層を形成し
た。このようにして３種類の無含浸マイカ基材シート状
体に含浸用組成物を含浸させ半硬化状態にしたそれぞれ
実施例４〜６の含浸マイカ基材シート状体を作製した。
次に、上記３種類の含浸マイカ基材シート状体のそれぞ
れを導体上に半掛け３回巻きした後、１００℃より１８
０℃まで段階的に昇温させ樹脂を完全硬化させ、それぞ
れ実施例４〜６の絶縁コイルを作製した。上記含浸マイ
カ基材シート状体について、破壊電圧を測定した結果を
表１に示す。また、導体上に形成された絶縁層を切り取
り、表面を研磨した後、破壊電圧と熱伝導率を測定した
結果を表１に示す。Examples 4 to 6 The impregnating resin composition containing an epoxy-anhydride type thermosetting resin as a main component used in Example 1 was vacuumed at a vacuum degree of about 1 mmH.
g, 100 parts by weight of each of the three types of mica-based sheet-like materials of the above-mentioned Examples 1 to 3 which have been dried at a temperature of about 90 ° C. to remove volatile components such as water, and impregnated with 60 parts by weight of a solid content, It was heated for 1 hour to form a semi-cured impregnated resin layer. In this way, three types of non-impregnated mica base sheet were impregnated with the impregnating composition to be in a semi-cured state. Thus, the impregnated mica base sheet of Examples 4 to 6 was produced.
Next, each of the above-mentioned three types of impregnated mica base sheet is wound on the conductor three times and wound three times.
The temperature was raised stepwise to 0 ° C. to completely cure the resin, and the insulating coils of Examples 4 to 6 were produced. Table 1 shows the results of measuring the breakdown voltage of the impregnated mica substrate sheet. In addition, Table 1 shows the results of measuring the breakdown voltage and the thermal conductivity after cutting the insulating layer formed on the conductor and polishing the surface.
【００１７】実施例７〜９ 実施例４〜６において、それぞれに用いた含浸用樹脂組
成物の代わりにその含浸用樹脂組成物に窒化ホウ素（粒
径約０．１μｍ〜１５μｍ）を全固形分中３０重量％混
合した窒化ホウ素含有含浸用樹脂組成物を用いた以外は
同様にしてそれぞれ実施例７〜９の含浸マイカ基材シー
ト状体、絶縁コイルを作製し、実施例１と同様に試験し
た結果を表１に示す。Examples 7 to 9 Instead of the impregnating resin composition used in each of Examples 4 to 6, boron nitride (particle size: about 0.1 μm to 15 μm) was added to the impregnating resin composition in a total solid content. The impregnated mica base sheet and insulating coil of Examples 7 to 9 were produced in the same manner except that the boron nitride-containing resin composition for impregnation containing 30% by weight of the mixture was used, and tested in the same manner as in Example 1. The results obtained are shown in Table 1.
【００１８】比較例１〜３ 実施例１〜３において、窒化ホウ素含有接着剤の代わり
に窒化ホウ素を含有しない以外は同様の接着剤を用いた
以外は同様にしてそれぞれ比較例１〜３の含浸マイカ基
材シート状体、絶縁コイルを作製し、実施例１と同様に
試験した結果を表１に示す。Comparative Examples 1 to 3 In Examples 1 to 3, the impregnations of Comparative Examples 1 to 3 were performed in the same manner except that the same adhesive was used except that the boron nitride-containing adhesive was not contained in place of the boron nitride. Table 1 shows the results of making a mica base sheet and an insulating coil and testing them in the same manner as in Example 1.
【００１９】比較例４〜６ 実施例４〜６において、窒化ホウ素含有接着剤の代わり
に窒化ホウ素を含有しない以外は同様の接着剤を用いた
以外は同様にしてそれぞれ比較例４〜６の含浸マイカ基
材シート状体、絶縁コイルを作製し、実施例１と同様に
試験した結果を表１に示す。Comparative Examples 4 to 6 In the same manner as in Examples 4 to 6, except that the same adhesive was used in place of the boron nitride-containing adhesive but not containing boron nitride, respectively. Table 1 shows the results of making a mica base sheet and an insulating coil and testing them in the same manner as in Example 1.
【００２０】比較例７〜９ 実施例７〜９において、窒化ホウ素含有接着剤の代わり
に窒化ホウ素を含有しない以外は同様の接着剤を用いた
以外は同様にしてそれぞれ比較例７〜９の含浸マイカ基
材シート状体、絶縁コイルを作製し、実施例１と同様に
試験した結果を表１に示す。Comparative Examples 7 to 9 In the same manner as in Examples 7 to 9, except that the same adhesive was used except that the boron nitride-containing adhesive was not used in place of the boron nitride-containing adhesive, the impregnation of Comparative Examples 7 to 9 was performed. Table 1 shows the results of making a mica base sheet and an insulating coil and testing them in the same manner as in Example 1.
【００２１】[0021]
【表１】 [Table 1]
【００２２】[0022]
【発明の効果】本発明によれば、裏打ち材とマイカ層を
接合する接着層にマイカより熱伝導率の良い無機質粉末
を含有させたので、熱伝導性が比較的均一であり、放熱
が比較的均一に行われ、これにさらにマイカ層にもマイ
カより熱伝導率の良い無機質粉末を含有させることによ
り一層熱伝導による放熱が速やかに行われ、特にコイル
用絶縁材料に使用した場合蓄熱し難く、特に最近の小型
化、高性能化のコイルに適するマイカ基材シート状体、
また、これに含浸用樹脂を半硬化状態で含有させたマイ
カ基材シート状体、さらにこの含浸用樹脂にもマイカよ
り熱伝導率の良い無機質粉末を含有させることによりそ
の放熱性を一層向上させさらに小型化、高性能化のコイ
ルに適するようにしたマイカ基材シート状体を提供でき
る。また、これらの前者の無含浸のものを用い樹脂を含
浸させ熱硬化させた絶縁コイル、後者を用い熱硬化させ
た絶縁コイルは、放熱性がよくその動作を損なわないよ
うにでき、特にその含浸用樹脂にマイカより熱伝導率の
良い無機質粉末を含有させることにより一層その放熱性
がよくなり、特に最近の小型化、高性能化の要求に応え
る絶縁コイルを提供することができる。また、絶縁材料
提供者、含浸用樹脂提供者、これらの使用者において従
来の生産工程の大幅な変更をすることなく、生産性を害
することがないようにすることができる。EFFECTS OF THE INVENTION According to the present invention, the adhesive layer for joining the backing material and the mica layer contains an inorganic powder having a better thermal conductivity than that of mica, so that the thermal conductivity is relatively uniform and the heat dissipation is comparative. It is performed uniformly, and the inorganic powder having better thermal conductivity than mica is further contained in the mica layer, so that the heat is more quickly dissipated by heat conduction, especially when used as an insulating material for coils, it is difficult to store heat. , A mica-based sheet, especially suitable for recent miniaturized and high-performance coils,
Further, by further adding a resin for impregnation in a semi-cured state to a mica substrate sheet-like body, and further by incorporating an inorganic powder having a better thermal conductivity than that of mica in the resin for impregnation, the heat dissipation is further improved. Further, it is possible to provide a mica-based sheet material suitable for a coil having a smaller size and higher performance. In addition, these former non-impregnated insulation coils impregnated with resin and heat-cured, and the latter insulation coils heat-cured have good heat dissipation and can be used so that their operation is not impaired. By including an inorganic powder having a thermal conductivity higher than that of mica in the resin for use, the heat radiation property thereof is further improved, and it is possible to provide an insulating coil which meets the recent demands for miniaturization and high performance. Further, it is possible to prevent the productivity from being impaired without significantly changing the conventional production process for the insulating material supplier, the impregnating resin supplier, and these users.
Claims (7)
と、該裏打ち材と該マイカ層を接合する接着層を有する
マイカ基材シート状体において、該マイカ層と該接着層
の内少なくとも接着層にマイカより熱伝導性の良い無機
質粉末を含有するマイカ基材シート状体。1. A mica base sheet having a backing material, a mica layer containing mica, and an adhesive layer for joining the backing material and the mica layer, wherein at least the adhesive between the mica layer and the adhesive layer A sheet of mica-based base material, which contains an inorganic powder having better thermal conductivity than mica in a layer.
カ１００重量部に対し５〜８５重量部の合成繊維フィブ
リッドと、上記集成マイカ１００重量部に対して５ない
し８５重量部の上記集成マイカより熱伝導性の良い無機
質粉末を含有し、かつ該マイカ層に含有させる熱伝導性
の良い無機質粉末の粒径は３０μｍ〜１００μｍであ
り、接着層に含有させる熱伝導性の良い無機質粉末の粒
径は０．１μｍ〜１００μｍである請求項１記載のマイ
カ基材シート状体。2. The mica layer is composed of laminated mica, 5 to 85 parts by weight of synthetic fiber fibrids per 100 parts by weight of the laminated mica, and 5 to 85 parts by weight of the laminated mica based on 100 parts by weight of the laminated mica. The particle size of the inorganic powder having good thermal conductivity, which contains the inorganic powder having good thermal conductivity, is 30 μm to 100 μm, and the particle size of the inorganic powder having good thermal conductivity contained in the adhesive layer. Is 0.1 μm to 100 μm. The mica-based sheet material according to claim 1.
求項１又は２に記載のマイカ基材シート状体。3. The mica-based sheet material according to claim 1, which contains a semi-cured impregnating resin.
伝導性の良い無機質粉末を含有する請求項３記載のマイ
カ基材シート状体。4. The mica base sheet according to claim 3, wherein the impregnating resin in a semi-cured state contains an inorganic powder having a higher thermal conductivity than mica.
マイカ基材シート状体及び含浸樹脂の硬化層により絶縁
層を形成した絶縁コイル。5. An insulating coil in which an insulating layer is formed on the insulating portion of the coil by the mica base sheet according to claim 1 or 2 and a cured layer of impregnated resin.
無機質粉末を含有させ、かつ該無機質粉末の粒径を０．
１〜１５μｍとする請求項５記載の絶縁コイル。6. The impregnated resin layer contains an inorganic powder having a better thermal conductivity than mica, and the inorganic powder has a particle size of 0.
The insulating coil according to claim 5, which has a thickness of 1 to 15 μm.
マイカ基材シート状体及びその含有した半硬化状態の含
浸用樹脂の熱硬化層により絶縁層を形成した絶縁コイ
ル。7. An insulating coil in which an insulating layer is formed on the insulating portion of the coil by the mica base sheet according to claim 3 or 4 and a thermosetting layer of the semi-cured impregnating resin contained therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21397195A JPH0945133A (en) | 1995-08-01 | 1995-08-01 | Mica base sheet-like body and insulated coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21397195A JPH0945133A (en) | 1995-08-01 | 1995-08-01 | Mica base sheet-like body and insulated coil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0945133A true JPH0945133A (en) | 1997-02-14 |
Family
ID=16648104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21397195A Pending JPH0945133A (en) | 1995-08-01 | 1995-08-01 | Mica base sheet-like body and insulated coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0945133A (en) |
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