JP2002038292A - Electroforming master block and manufacturing method - Google Patents
Electroforming master block and manufacturing methodInfo
- Publication number
- JP2002038292A JP2002038292A JP2000225025A JP2000225025A JP2002038292A JP 2002038292 A JP2002038292 A JP 2002038292A JP 2000225025 A JP2000225025 A JP 2000225025A JP 2000225025 A JP2000225025 A JP 2000225025A JP 2002038292 A JP2002038292 A JP 2002038292A
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- insulating layer
- transfer
- conductor
- transfer region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Landscapes
- Decoration By Transfer Pictures (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、転写対象物に導電
体を転写する際に使用する電鋳母型およびその製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroforming mold used for transferring a conductor to a transfer object and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】以下、従来の電鋳母型について図面を参
照しながら説明する。2. Description of the Related Art A conventional electroforming mold will be described below with reference to the drawings.
【０００３】図８は従来の電鋳母型の断面図である。FIG. 8 is a sectional view of a conventional electroformed mold.
【０００４】従来の電鋳母型は図８に示すように、導電
性を有するベース板１の上面に、所定のパターンとなる
転写領域を除いた部分に絶縁層２が備えられ、この絶縁
層２と転写領域との界面のなす角αは垂直になってい
る。As shown in FIG. 8, the conventional electroformed mold has an insulating layer 2 provided on the upper surface of a base plate 1 having conductivity, except for a transfer region where a predetermined pattern is formed. The angle α formed by the interface between the transfer region 2 and the transfer region is vertical.
【０００５】また、めっき液の中に電鋳母型を含侵して
ベース板１を通電することにより、ベース板１の絶縁層
２に囲まれた転写領域にめっきを形成し、所定のパター
ンを有する導電体を電鋳母型に設けていた。そして、転
写対象物をこの電鋳母型のベース板１の導電体が設けら
れた面に押し当てて、この導電体を転写領域から上に引
き出し、転写対象物に導電体を転写していた。When the base plate 1 is energized by impregnating the electroplating mold in a plating solution, plating is formed in a transfer region surrounded by the insulating layer 2 of the base plate 1 and a predetermined pattern is formed. The conductor having the metal mold was provided in the electroformed mother mold. Then, the object to be transferred is pressed against the surface of the electroformed mother mold base plate 1 on which the conductor is provided, and the conductor is pulled out from the transfer area to transfer the conductor to the object to be transferred. .
【０００６】[0006]
【発明が解決しようとする課題】しかしながら上記従来
の電鋳母型は、転写対象物に転写する導電体をベース板
の転写領域に形成し、転写対象物にこの導電体を押し当
てて転写する際、この導電体を転写領域から上に引き出
して転写対象物に転写しようとすると、なす角αが垂直
となった絶縁層２と転写領域との界面において導電体と
界面の間に摩擦が発生してしまうため、導電体が転写領
域から上に引き出されず、これにより、導電体が転写対
象物に転写されず、転写不良が起こるという課題を有し
ていた。However, in the above-mentioned conventional electroforming mold, a conductor to be transferred to a transfer object is formed in a transfer region of a base plate, and the conductor is pressed against the transfer object to transfer. At this time, when the conductor is pulled out from the transfer area and is to be transferred to the transfer target, friction occurs between the conductor and the interface at the interface between the insulating layer 2 and the transfer area where the angle α is vertical. As a result, the conductor is not pulled out of the transfer region, and the conductor is not transferred to the transfer target, which causes a problem of poor transfer.
【０００７】本発明は上記従来の課題を解決するもの
で、転写不良を低減させることができる電鋳母型を提供
することを目的とするものである。An object of the present invention is to solve the above-mentioned conventional problems and to provide an electroformed mold capable of reducing transfer defects.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に本発明は、以下の構成を有するものである。To achieve the above object, the present invention has the following arrangement.
【０００９】本発明の請求項１に記載の発明は、特に所
定のパターンとなる転写領域を除いた部分に設けた絶縁
層を有する導電性のベース板であって、このベース板と
絶縁層は転写領域との界面に前記転写領域が前記ベース
板から遠ざかる方向に向かって広がりを持つように構成
した傾斜部を備えたもので、転写対象物に転写する導電
体をベース板の転写領域に形成し、転写対象物にこの導
電体を押し当てて転写する際、導電体を転写領域から引
き出して転写対象物に転写するとき、導電体はベース板
から離れれば絶縁層と転写領域との界面と接することは
ないため、絶縁層と転写領域との界面において導電体と
界面の間に摩擦が発生することを防止できるという作用
を有するものである。According to the first aspect of the present invention, there is provided a conductive base plate having an insulating layer provided especially at a portion other than a transfer region for forming a predetermined pattern. At the interface with the transfer area, the transfer area is provided with an inclined portion configured to expand in a direction away from the base plate, and a conductor to be transferred to a transfer target is formed in the transfer area of the base plate. When the conductor is pressed against the transfer object and transferred, when the conductor is pulled out of the transfer area and transferred to the transfer object, the conductor is separated from the base plate and the interface between the insulating layer and the transfer area. Since they do not touch each other, they have the effect of preventing the occurrence of friction between the conductor and the interface at the interface between the insulating layer and the transfer region.
【００１０】請求項２に記載の発明は、特に、絶縁層の
傾斜部は、転写領域近傍にベース板と直交する方向に突
出する突出部を備えたもので、導電体が絶縁層の突出部
より突出した部分に囲まれた場所にも形成された場合、
絶縁層の傾斜部における突出部によって、めっきがベー
ス板と水平方向に形成されないため、導電体の幅を狭く
できるという作用を有するものである。According to a second aspect of the present invention, in particular, the inclined portion of the insulating layer is provided with a projecting portion protruding in a direction orthogonal to the base plate in the vicinity of the transfer region, and the conductor is made of the projecting portion of the insulating layer. If it is also formed in a place surrounded by more protruding parts,
Since the plating is not formed in the horizontal direction with respect to the base plate due to the projecting portion in the inclined portion of the insulating layer, the width of the conductor can be reduced.
【００１１】請求項３に記載の発明は、特に、絶縁層の
傾斜部は、ベース板の転写領域とのなす角を９５°以上
としたもので、転写対象物に転写する導電体をベース板
の転写慮域に形成し、転写対象物にこの導電体を押し当
てて転写する際、導電体を転写領域から引き出して転写
対象物に転写するとき、導電体はベース板から離れれば
絶縁層と転写領域との界面と接することはあり得ないた
め、絶縁層と転写領域との界面において導電体と界面の
間に摩擦が発生することをより確実に防止できると言う
作用を有するものである。According to a third aspect of the present invention, in particular, the inclined portion of the insulating layer has an angle of 95 ° or more with the transfer region of the base plate. When the conductor is pulled out of the transfer area and transferred to the transfer object when the conductor is pressed against the transfer object and transferred to the transfer object, the conductor is separated from the base plate by an insulating layer. Since it is impossible to come into contact with the interface with the transfer region, it has the effect of reliably preventing the occurrence of friction between the conductor and the interface at the interface between the insulating layer and the transfer region.
【００１２】請求項４に記載の発明は、特に、導電性を
有するベース板の所定パターンとなる転写領域を除いた
部分に絶縁層を形成しプリベークする工程と、前記絶縁
層を１４０℃以上の温度でポストベークすることによ
り、前記絶縁層と前記転写領域との界面に前記転写領域
が前記ベース板から遠ざかる方向に向かって広がりを持
つような傾斜部を構成する工程とを備えたもので、絶縁
層の上面は収縮し、絶縁層の下面はベース板と接するた
め収縮せず、これにより、絶縁層は転写領域との界面に
転写領域がベース板から遠ざかる方向に向かって広がり
を持つ傾斜部が形成されるという作用を有するものであ
る。According to a fourth aspect of the present invention, in particular, there is provided a step of forming an insulating layer on a portion of a base plate having conductivity except for a transfer region serving as a predetermined pattern, and pre-baking the insulating layer. Post-baking at a temperature to form an inclined portion at the interface between the insulating layer and the transfer region such that the transfer region has an extension in a direction away from the base plate, The upper surface of the insulating layer contracts, and the lower surface of the insulating layer does not contract because the lower surface of the insulating layer contacts the base plate, whereby the insulating layer is inclined at an interface with the transfer region so that the transfer region expands in a direction away from the base plate. Is formed.
【００１３】[0013]
【発明の実施の形態】以下、本発明の一実施の形態にお
ける電鋳母型について、図面を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electroforming master according to an embodiment of the present invention will be described with reference to the drawings.
【００１４】図１は本発明の一実施の形態における電鋳
母型を示す断面図である。FIG. 1 is a sectional view showing an electroformed mold according to an embodiment of the present invention.
【００１５】本実施の形態における電鋳母型は、ベース
板１１の絶縁層１２と、転写領域１３との界面に、転写
領域１３がベース板１１から遠ざかる方向に向かって広
がりを持つように構成した傾斜部１４を備えている。The electroformed mold according to the present embodiment is configured such that the transfer region 13 has an extension at the interface between the insulating layer 12 of the base plate 11 and the transfer region 13 in the direction away from the base plate 11. The inclined portion 14 is provided.
【００１６】ベース板１１は少なくともその上面が導電
性を有し、ベース板１１として、例えば、ニッケル板、
プラスチックの上面にニッケルめっきを施したものなど
が使用できる。また、後に転写領域１３に形成する銀な
どの導電体（図示せず）とベース板１１との離型性を向
上させるために、ベース板１１の表面に酸化膜またはカ
ップリング処理膜などを設けてもよい。At least the upper surface of the base plate 11 has conductivity. As the base plate 11, for example, a nickel plate,
A plastic plated with nickel on the upper surface can be used. Further, in order to improve the releasability of a conductor (not shown) such as silver formed later in the transfer region 13 and the base plate 11, an oxide film or a coupling treatment film is provided on the surface of the base plate 11. You may.
【００１７】絶縁層１２はベース板１１の上面に備えら
れ、所定の厚みになっている。The insulating layer 12 is provided on the upper surface of the base plate 11 and has a predetermined thickness.
【００１８】転写領域１３はベース板１１の上面に開口
を有するように設けられ、後に転写領域１３を埋めるよ
うに導電体（図示せず）が形成される。The transfer region 13 is provided so as to have an opening on the upper surface of the base plate 11, and a conductor (not shown) is formed to fill the transfer region 13 later.
【００１９】傾斜部１４は転写領域１３と絶縁層１２と
の界面に、転写領域１３がベース板１１から遠ざかる方
向に向かって広がりを持つように構成されている。この
傾斜部１４は、直線、曲線、あるいは直線と曲線とが混
ざったもののうち、どれでもよい。The inclined portion 14 is formed at the interface between the transfer region 13 and the insulating layer 12 such that the transfer region 13 expands in the direction away from the base plate 11. The inclined portion 14 may be any of a straight line, a curved line, or a mixture of a straight line and a curved line.
【００２０】以下、絶縁層１２の傾斜部１４とベース板
１１の転写領域１３とのなす角βと転写率との関係につ
いて説明する。The relationship between the angle β between the inclined portion 14 of the insulating layer 12 and the transfer region 13 of the base plate 11 and the transfer rate will be described below.
【００２１】（表１）は絶縁層１２の傾斜部１４とベー
ス板１１の転写領域１３とのなす角β（以下テーパ角度
βとする）と、転写率の関係を示している。Table 1 shows a relationship between an angle β (hereinafter referred to as a taper angle β) formed between the inclined portion 14 of the insulating layer 12 and the transfer region 13 of the base plate 11 and a transfer rate.
【００２２】このとき、試料としてテーパ角度βの異な
る電鋳母型を各々１００００個作製して導電体を転写
し、その転写率（全試料に対して導電体を転写対象物に
確実に転写できた試料の割合）を算出した。At this time, 10,000 electroformed masters each having a different taper angle β are prepared as samples, and the conductor is transferred. The transfer ratio (the conductor can be reliably transferred to the transfer object for all samples) Of the sample).
【００２３】[0023]
【表１】 [Table 1]
【００２４】（表１）から明らかなように、テーパ角度
βを９５°以上とすれば、転写率が良好になることがわ
かる。すなわち、転写対象物に転写する導電体をベース
板１１の転写領域１３に形成し、転写対象物にこの導電
体を押し当てて転写する際、導電体を転写領域１３から
引き出して転写対象物に転写するとき、導電体はベース
板１１から離れれば絶縁層１２と転写領域１３との界面
と接することはあり得ないため、絶縁層１２と転写領域
１３との界面において導電体と界面の間に摩擦が発生す
ることをより確実に防止できる。なお、テーパ角度βは
短絡すべきでない導電体同士が短絡しない程度に、かつ
転写領域１３が設けられるようにする必要がある。As is clear from Table 1, when the taper angle β is set to 95 ° or more, the transfer rate is improved. That is, a conductor to be transferred to the transfer target is formed in the transfer region 13 of the base plate 11, and when the conductor is pressed against the transfer target and transferred, the conductor is pulled out from the transfer region 13 and is transferred to the transfer target. When transferring, the conductor cannot come into contact with the interface between the insulating layer 12 and the transfer region 13 if it is separated from the base plate 11, so that the conductor between the conductor and the interface at the interface between the insulating layer 12 and the transfer region 13 The occurrence of friction can be more reliably prevented. It is necessary that the taper angle β is such that the conductors that should not be short-circuited do not short-circuit, and that the transfer region 13 is provided.
【００２５】また、このように構成された電鋳母型の転
写領域１３には、図２（ａ）に示すように、絶縁層１２
の傾斜部１４とベース板１１の転写領域１３とに接する
導電体１５が充填されて形成される。あるいは、図２
（ｂ）に示すような絶縁層１２の上面より突出するよう
なきのこ状の導電体１５を形成しても良い。この導電体
１５は絶縁層１２の傾斜部１４と接するように形成され
るため、導電体１５はベース板から遠ざかる方向に向か
って広がりを持つような形状をしている。Further, as shown in FIG. 2A, an insulating layer 12
The conductor 15 is in contact with the inclined portion 14 of the base plate 11 and the transfer region 13 of the base plate 11, and is formed by filling. Alternatively, FIG.
A mushroom-shaped conductor 15 projecting from the upper surface of the insulating layer 12 as shown in FIG. Since the conductor 15 is formed so as to be in contact with the inclined portion 14 of the insulating layer 12, the conductor 15 has a shape that expands in a direction away from the base plate.
【００２６】このとき、めっき液の中に電鋳母型を含侵
してベース板１１を通電することにより、ベース板１１
の絶縁層１２に囲まれた転写領域１３にめっきを形成
し、所定のパターンを有する導電体１５を電鋳母型に設
ける。At this time, when the base plate 11 is energized by impregnating the electroforming master mold into the plating solution, the base plate 11
Is formed on the transfer region 13 surrounded by the insulating layer 12, and a conductor 15 having a predetermined pattern is provided on the electroforming master.
【００２７】以上のように本実施の形態における電鋳母
型は、導電性を有するベース板１１の絶縁層１２と転写
領域１３との界面に、転写領域１３がベース板１１から
遠ざかる方向に向かって広がりを持つように構成した傾
斜部１４を備えているため、転写対象物に転写する導電
体１５をベース板１１の転写領域１３に形成し、転写対
象物にこの導電体１５を押し当てて転写する際、導電体
１５を転写領域１３から引き出して転写対象物に転写す
るとき、導電体１５はベース板１１から離れれば絶縁層
１２と転写領域１３との界面と接することはなく、これ
により、絶縁層１２と転写領域１３との界面において導
電体１５と界面の間に摩擦が発生しないため、導電体１
５が転写領域１３から上に引き出されないことがなくな
り、この結果、転写不良を低減できるという効果が得ら
れる。As described above, the electroformed master according to the present embodiment is arranged such that the transfer region 13 faces the interface between the insulating layer 12 of the conductive base plate 11 and the transfer region 13 in a direction away from the base plate 11. The conductor 15 to be transferred to the transfer target is formed in the transfer region 13 of the base plate 11 and the conductor 15 is pressed against the transfer target because the inclined portion 14 is provided so as to have a wide spread. When transferring, when the conductor 15 is pulled out of the transfer region 13 and transferred to the transfer target, the conductor 15 does not come into contact with the interface between the insulating layer 12 and the transfer region 13 if the conductor 15 is separated from the base plate 11. Since no friction occurs between the conductor 15 and the interface at the interface between the insulating layer 12 and the transfer region 13, the conductor 1
5 is not pulled out from the transfer region 13 upward, and as a result, an effect of reducing transfer failure can be obtained.
【００２８】以下、本実施の形態における電鋳母型と従
来の電鋳母型における導電体の転写不良の違いについて
説明する。The difference between the electroforming master in the present embodiment and the transfer failure of the conductor in the conventional electroforming master will be described below.
【００２９】（表２）は、本実施の形態における電鋳母
型と、図８に示した従来の電鋳母型との導電体の転写率
を比較した図である。Table 2 shows a comparison of the transfer rate of the conductor between the electroformed master in this embodiment and the conventional electroformed master shown in FIG.
【００３０】このとき、試料として電鋳母型を各々１０
０００個作製して導電体を転写し、その転写率を算出し
た。At this time, each of the electroformed mother dies was
000 pieces were prepared, the conductor was transferred, and the transfer rate was calculated.
【００３１】[0031]
【表２】 [Table 2]
【００３２】（表２）から明らかなように、本実施の形
態における電鋳母型は、従来の電鋳母型に対して転写不
良が低減できたことがわかる。As is clear from Table 2, the electroforming master according to the present embodiment can reduce the transfer failure compared to the conventional electroforming master.
【００３３】また、図３に示すように絶縁層１２の傾斜
部１４に、転写領域１３近傍にベース板１１と直交する
方向に対して突出する突出部１２ａを備えれば、この電
鋳母型に導電体１５を形成したとき図４に示すように、
導電体１５が絶縁層１２の突出部１２ａより突出した部
分に囲まれた場所にも形成されてきのこ状になった場
合、この突出部１２ａによって、めっきが絶縁層１２上
面におけるベース板１１と水平方向に形成されることを
妨げられるため、導電体１５の幅を狭くできる。さら
に、導電体１５間の距離を長くできるため、短絡すべき
でない隣り合う導電体１５同士が短絡することを防ぐこ
とができる。As shown in FIG. 3, if the inclined portion 14 of the insulating layer 12 is provided with a protruding portion 12a protruding in a direction orthogonal to the base plate 11 near the transfer region 13, this electroforming master When the conductor 15 is formed on the substrate, as shown in FIG.
When the conductor 15 is also formed in a place surrounded by a portion of the insulating layer 12 protruding from the protruding portion 12a, the protruding portion 12a causes plating to be performed horizontally with the base plate 11 on the upper surface of the insulating layer 12. In this case, the width of the conductor 15 can be reduced. Further, since the distance between the conductors 15 can be increased, it is possible to prevent adjacent conductors 15 that should not be short-circuited from being short-circuited.
【００３４】以下、本発明の一実施の形態における電鋳
母型の製造方法を図面を参照しながら説明する。Hereinafter, a method for manufacturing an electroformed mold according to an embodiment of the present invention will be described with reference to the drawings.
【００３５】図５（ａ）〜（ｄ）は、本実施の形態の電
鋳母型の製造方法を示す断面図である。FIGS. 5A to 5D are cross-sectional views showing a method of manufacturing an electroformed master according to the present embodiment.
【００３６】まず、図５（ａ）に示すように、ベース板
１１の上面にスピンコータを用いて、ポジ型フォトレジ
ストを所定の膜厚になるように塗布した後、８５℃〜１
１０℃で３０分間オーブンによってプリベークして絶縁
層１２を形成する。このとき、ホットプレートを用いた
場合には、プリベーク時間は１〜１０分で良い。First, as shown in FIG. 5A, a positive photoresist is applied to a predetermined thickness on the upper surface of the base plate 11 using a spin coater.
The insulating layer 12 is formed by pre-baking in an oven at 10 ° C. for 30 minutes. At this time, when a hot plate is used, the pre-bake time may be 1 to 10 minutes.
【００３７】次に、図５（ｂ）に示すように、絶縁層１
２の上面に所定のパターンが形成されたマスク１６を載
置し、上部よりＵＶ光を所定のエネルギー量照射して、
ベース板１１上面にレジスト溶解部１７を形成する。Next, as shown in FIG.
A mask 16 having a predetermined pattern formed thereon is mounted on the upper surface of the second 2, and a predetermined amount of UV light is irradiated from above to apply a predetermined amount of UV light.
A resist dissolving portion 17 is formed on the upper surface of the base plate 11.
【００３８】次に、図５（ｃ）に示すように、マスク１
６を取り除き、露光したベース板１１を現像液に浸漬・
現像し、レジスト溶解部１７を溶解させて、所定のパタ
ーンである転写領域１３を形成する。Next, as shown in FIG.
6 is removed, and the exposed base plate 11 is immersed in a developing solution.
By developing and dissolving the resist dissolving portion 17, the transfer region 13 having a predetermined pattern is formed.
【００３９】最後に、図５（ｄ）に示すように、絶縁層
１２が形成されたベース板１１を１４０℃で３０分、オ
ーブンによってポストベークする。この処理によって、
絶縁層１２の上面は収縮し、絶縁層１２の下面はベース
板１１と接するため収縮せず、これにより、絶縁層１２
と転写領域１３との界面に転写領域１３がベース板１１
から遠ざかる方向に向かって広がりを持つように傾斜部
１４が形成される。Finally, as shown in FIG. 5D, the base plate 11 on which the insulating layer 12 is formed is post-baked in an oven at 140 ° C. for 30 minutes. With this process,
The upper surface of the insulating layer 12 shrinks, and the lower surface of the insulating layer 12 does not shrink due to contact with the base plate 11.
The transfer region 13 is located at the interface between the base plate 11 and the transfer region 13.
The inclined portion 14 is formed so as to have a width in a direction away from the inclined portion.
【００４０】以下、各プリベーク温度における、ポスト
ベーク温度とテーパ角度との関係について説明する。The relationship between the post-bake temperature and the taper angle at each pre-bake temperature will be described below.
【００４１】図６は各プリベーク温度における、ポスト
ベーク温度とテーパ角度との関係を示す図である。FIG. 6 is a diagram showing the relationship between the post-bake temperature and the taper angle at each pre-bake temperature.
【００４２】図６から明らかなように、プリベーク温度
が１１５℃以下の場合、かつポストベーク温度が１４０
℃以上のときは、絶縁層１２と転写領域１３との界面に
転写領域１３がベース板１１の上面から遠ざかる方向に
向かって広がりを持つように傾斜部１４が形成され、そ
のテーパ角度βが９５゜以上となり、これにより、上述
したように絶縁層１２と転写領域１３との界面において
導電体１５と界面の間に摩擦が発生することをより確実
に防止できる。このとき、プリベーク温度に対してポス
トベーク温度が２５℃以上高くなっている。また、ポス
トベーク温度は、絶縁層１２が劣化しない温度にする必
要がある。As is apparent from FIG. 6, when the pre-bake temperature is 115 ° C. or less and the post-bake temperature is 140 ° C.
When the temperature is equal to or higher than 0 ° C., an inclined portion 14 is formed at the interface between the insulating layer 12 and the transfer region 13 so that the transfer region 13 expands in a direction away from the upper surface of the base plate 11, and the taper angle β is 95%. Accordingly, the friction between the conductor 15 and the interface at the interface between the insulating layer 12 and the transfer region 13 can be more reliably prevented as described above. At this time, the post-bake temperature is higher than the pre-bake temperature by 25 ° C. or more. Further, the post-bake temperature needs to be a temperature at which the insulating layer 12 does not deteriorate.
【００４３】以下、上記本実施の形態における電鋳母型
を用いて、導電体１５を転写対象物に転写する方法につ
いて説明する。Hereinafter, a method of transferring the conductor 15 to a transfer target using the electroforming master according to the present embodiment will be described.
【００４４】図７（ａ）（ｂ）は上記本実施の形態の電
鋳母型を用いて、導電体１５を転写対象物に転写する方
法を示す断面図である。FIGS. 7A and 7B are cross-sectional views showing a method of transferring the conductor 15 to a transfer object using the electroforming master of the present embodiment.
【００４５】まず、図７（ａ）に示すように、図２で示
したように電鋳母型に導電体１５を形成し、絶縁層１２
の傾斜部１４と接する導電体１５が転写領域１３に形成
された電鋳母型のベース板１１の導電体１５が形成され
た上面に、転写対象物１８を押し当てる。First, as shown in FIG. 7A, a conductor 15 is formed in an electroformed mold as shown in FIG.
The transfer object 18 is pressed against the upper surface of the electroformed mother die base plate 11 on which the conductor 15 is formed, in which the conductor 15 in contact with the inclined portion 14 is formed in the transfer region 13.
【００４６】次に、図７（ｂ）に示すように、電鋳母型
から転写対象物１８を引き離して、導電体１５を転写領
域１３から上に引き出して転写対象物１８に転写され
る。Next, as shown in FIG. 7B, the transfer object 18 is separated from the electroforming mold, and the conductor 15 is pulled out from the transfer area 13 and transferred to the transfer object 18.
【００４７】[0047]
【発明の効果】以上のように本発明は、所定のパターン
となる転写領域を除いた部分に設けた絶縁層を有するベ
ース板であって、このベース板の絶縁層は転写領域との
界面に前記ベース板から遠ざかる方向に向かって広がり
を持つように構成した傾斜部を備えたもので、転写対象
物に転写する導電体をベース板の転写領域に形成し、転
写対象物にこの導電体を押し当てて転写する際、導電体
を転写領域から引き出して転写対象物に転写するとき、
導電体はベース板から離れれば絶縁層と転写領域との界
面と接することはなくなるため、絶縁層と転写領域との
界面において導電体と界面の間に摩擦が発生せず、これ
により、導電体が転写領域から上に引き出されないこと
がなくなり、この結果、転写不良を低減できるという効
果が得られるという効果を奏するものである。As described above, the present invention relates to a base plate having an insulating layer provided in a portion other than a transfer region for forming a predetermined pattern, and the insulating layer of the base plate is provided at an interface with the transfer region. With an inclined portion configured to have a spread in a direction away from the base plate, a conductor to be transferred to a transfer target is formed in a transfer area of the base plate, and this conductor is transferred to the transfer target. When pressing and transferring, when extracting the conductor from the transfer area and transferring it to the transfer target,
When the conductor is separated from the base plate, it does not come into contact with the interface between the insulating layer and the transfer region, so that no friction occurs between the conductor and the interface at the interface between the insulating layer and the transfer region. Is prevented from being pulled out from the transfer area, and as a result, the effect of reducing transfer defects can be obtained.
【図１】本発明の一実施の形態における電鋳母型の断面
図FIG. 1 is a cross-sectional view of an electroformed mold according to an embodiment of the present invention.
【図２】（ａ）（ｂ）はそれぞれ同電鋳母型に導電体を
形成した断面図FIGS. 2A and 2B are cross-sectional views each showing a conductor formed in the same electroformed mold;
【図３】本発明の一実施の形態における他の例の電鋳母
型の断面図FIG. 3 is a cross-sectional view of another example of an electroformed mold according to an embodiment of the present invention.
【図４】同電鋳母型に導電体を形成した断面図FIG. 4 is a cross-sectional view in which a conductor is formed on the same electroformed mold.
【図５】（ａ）〜（ｄ）はそれぞれ同電鋳母型の製造方
法を断面図FIGS. 5A to 5D are cross-sectional views illustrating a method of manufacturing the same electroformed mold.
【図６】各プリベーク温度について、ポストベーク温度
とテーパ角度との関係を示す図FIG. 6 is a diagram showing a relationship between a post-bake temperature and a taper angle for each pre-bake temperature.
【図７】（ａ）（ｂ）はそれぞれ同電鋳母型を用いて、
導電体を転写対象物に転写する方法を示す断面図FIGS. 7 (a) and (b) show the same electroformed molds,
Sectional drawing which shows the method of transferring a conductor to a transfer object
【図８】従来の電鋳母型の断面図FIG. 8 is a sectional view of a conventional electroformed mold.
１１ ベース板 １２ 絶縁層 １２ａ 突出部 １３ 転写領域 １４ 傾斜部 DESCRIPTION OF SYMBOLS 11 Base plate 12 Insulating layer 12a Projecting part 13 Transfer area 14 Inclined part
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大野 裕志 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 3B005 EA20 EB01 EB03 EC12 FB21 GB05 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroshi Ohno 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture F-term (reference) in Matsushita Electric Industrial Co., Ltd. 3B005 EA20 EB01 EB03 EC12 FB21 GB05
Claims (4)
部分に設けた絶縁層を有する導電性のベース板であっ
て、このベース板の絶縁層は転写領域との界面は前記転
写領域が前記ベース板から遠ざかる方向に向かって広が
りを持つように構成した傾斜部を備えた電鋳母型。1. A conductive base plate having an insulating layer provided in a portion other than a transfer region serving as a predetermined pattern, wherein an insulating layer of the base plate has an interface with the transfer region in which the transfer region is formed by the transfer region. An electroformed mold having an inclined portion configured to have a width that increases in a direction away from the base plate.
ス板と直交する方向に対して突出する突出部を備えた請
求項１記載の電鋳母型。2. The electroforming mold according to claim 1, wherein the inclined portion of the insulating layer has a protruding portion protruding in a direction orthogonal to the base plate near the transfer region.
とのなす角を９５°以上とした請求項１記載の電鋳母
型。3. The electroforming mold according to claim 1, wherein the angle between the inclined portion of the insulating layer and the transfer region of the base plate is 95 ° or more.
ンとなる転写領域を除いた部分に絶縁層を形成しプリベ
ークする工程と、前記絶縁層を１４０℃以上の温度でポ
ストベークすることにより、前記絶縁層と前記転写領域
との界面に前記転写領域が前記ベース板から遠ざかる方
向に向かって広がりを持つような傾斜部を構成する工程
を備えた電鋳母型の製造方法。4. A step of forming and pre-baking an insulating layer on a portion of the base plate having conductivity except for a transfer region that becomes a predetermined pattern, and post-baking the insulating layer at a temperature of 140 ° C. or more. A method for manufacturing an electroformed mold, comprising a step of forming an inclined portion at an interface between the insulating layer and the transfer region such that the transfer region has an extension in a direction away from the base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000225025A JP4617542B2 (en) | 2000-07-26 | 2000-07-26 | Method for manufacturing conductor using electroforming mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000225025A JP4617542B2 (en) | 2000-07-26 | 2000-07-26 | Method for manufacturing conductor using electroforming mold |
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| Publication Number | Publication Date |
|---|---|
| JP2002038292A true JP2002038292A (en) | 2002-02-06 |
| JP4617542B2 JP4617542B2 (en) | 2011-01-26 |
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ID=18718866
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|---|---|---|---|
| JP2000225025A Expired - Lifetime JP4617542B2 (en) | 2000-07-26 | 2000-07-26 | Method for manufacturing conductor using electroforming mold |
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|---|---|---|---|---|
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| KR100928476B1 (en) | 2004-12-13 | 2009-11-25 | (주)뉴인텍피엔엘 | Method for manufacturing precision pole pole workpiece using uniform growth phenomenon of pole pole workpiece and pole pole workpiece by the method |
| JP2010007127A (en) * | 2008-06-26 | 2010-01-14 | Hitachi Chem Co Ltd | Electroconductive base material for plating, method for manufacturing the same, and method for manufacturing conductor layer pattern using the base material or base material with the conductor layer pattern |
| JP2010007095A (en) * | 2008-06-24 | 2010-01-14 | Hitachi Chem Co Ltd | Plating method |
| US20100021695A1 (en) * | 2006-12-27 | 2010-01-28 | Susumu Naoyuki | Engraved plate and substrate with conductor layer pattern using the same |
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| KR20100063723A (en) * | 2007-08-20 | 2010-06-11 | 무어 월리스 노스 아메리카, 인코포레이티드 | Apparatus and methods for controlling application of a substance to a substrate |
| JP2010196167A (en) * | 2010-02-25 | 2010-09-09 | Hitachi Chem Co Ltd | Metal foil obtained by method of manufacturing patterned metal foil |
| WO2010137568A1 (en) * | 2009-05-25 | 2010-12-02 | 三井金属鉱業株式会社 | Perforated metal foil with substrate, method for manufacturing perforated metal foil with substrate, perforated metal foil, and method for manufacturing perforated metal foil |
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| WO2010137568A1 (en) * | 2009-05-25 | 2010-12-02 | 三井金属鉱業株式会社 | Perforated metal foil with substrate, method for manufacturing perforated metal foil with substrate, perforated metal foil, and method for manufacturing perforated metal foil |
| JP2010196167A (en) * | 2010-02-25 | 2010-09-09 | Hitachi Chem Co Ltd | Metal foil obtained by method of manufacturing patterned metal foil |
| US9466422B2 (en) | 2013-03-28 | 2016-10-11 | Taiyo Yuden Co., Ltd. | Method of manufacturing a laminated electronic component |
| WO2018097559A1 (en) * | 2016-11-28 | 2018-05-31 | 주식회사 티지오테크 | Mother plate, method for manufacturing mother plate, and method for manufacturing mask |
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