JP2002026551A - Heat radiating structure of transmitting/receiving unit - Google Patents
Heat radiating structure of transmitting/receiving unitInfo
- Publication number
- JP2002026551A JP2002026551A JP2000203084A JP2000203084A JP2002026551A JP 2002026551 A JP2002026551 A JP 2002026551A JP 2000203084 A JP2000203084 A JP 2000203084A JP 2000203084 A JP2000203084 A JP 2000203084A JP 2002026551 A JP2002026551 A JP 2002026551A
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- heat
- circuit board
- grease
- transmitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、携帯電話機に使用
される送受信ユニットの放熱構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiation structure of a transmitting / receiving unit used in a portable telephone.
【０００２】[0002]
【従来の技術】従来の送受信ユニットの放熱構造を図５
に基づいて説明すると、金属板を折り曲げして形成され
た箱形のカバー２１は、周囲に複数個の孔２１ａを有す
る矩形状の上面壁２１ｂと、この上面壁２１ｂの四方か
ら折り曲げされて形成された側面壁２１ｃと、上面壁２
１ｂと側面壁２１ｃとによって形成された空洞の収納部
２１ｄとを有する。2. Description of the Related Art FIG.
The box-shaped cover 21 formed by bending a metal plate is formed by bending a rectangular upper wall 21b having a plurality of holes 21a around it and by bending the upper wall 21b from all sides. Side wall 21c and top wall 2
1b and a hollow storage portion 21d formed by the side wall 21c.
【０００３】複数のプリント基板が積層されて形成さ
れ、外周端部に複数個のサイド電極２２ａを設けた回路
基板２２の上面には、抵抗、コンデンサ等の種々の電気
部品２３と、パワーアンプ等の発熱部品２４が搭載され
ている。そして、この回路基板２２には、電気部品２３
と発熱部品２４とがカバー２１によって覆われてた状態
で、カバー２１の側面壁２１ｃの下端部が半田付けされ
ている。このような構成により送受信ユニットＳ２が形
成されている。On a top surface of a circuit board 22 which is formed by laminating a plurality of printed boards and has a plurality of side electrodes 22a at the outer peripheral end, various electric components 23 such as resistors and capacitors, a power amplifier and the like are provided. Are mounted. The circuit board 22 includes an electric component 23.
The lower end of the side wall 21c of the cover 21 is soldered in a state where the heat generating component 24 and the heat generating component 24 are covered by the cover 21. The transmission / reception unit S2 is formed by such a configuration.
【０００４】このような構成を有する従来の送受信ユニ
ットＳ２は、携帯電話機のマザー基板２５上に回路基板
２２が載置され、サイド電極２２ａがマザー基板２５の
上面に設けられた導電パターン（図示せず）半田付けさ
れて、マザー基板２５に電気的に接続された状態で取り
付けられている。In the conventional transmission / reception unit S2 having such a configuration, a circuit board 22 is mounted on a mother board 25 of a portable telephone, and a side electrode 22a is provided on a top surface of the mother board 25 in a conductive pattern (not shown). Rather, it is soldered and attached in a state of being electrically connected to the motherboard 25.
【０００５】そして、このような状態で送受信ユニット
Ｓ２が使用された際、発熱部品２４によって収納部２１
ｄ内の空気が熱せられ、熱せられた空気は、孔２１ａの
みを通してカバー２１外に放熱されるため、放熱性が悪
いものであった。When the transmission / reception unit S2 is used in such a state, the heat-generating component 24 causes the storage section 21 to be closed.
The air inside d was heated, and the heated air was radiated to the outside of the cover 21 only through the hole 21a, and thus had poor heat radiation.
【０００６】[0006]
【発明が解決しようとする課題】従来の送受信ユニット
の放熱構造は、カバー２１内に収納された発熱部品２４
で熱せられた空気が上面壁２１ｂの周囲に設けられた孔
２１ａのみを通してカバー２１外に放熱されるため、放
熱性が悪いという問題がある。The heat radiating structure of the conventional transmitting / receiving unit includes a heat generating component 24 housed in a cover 21.
Since the air heated in step (1) is radiated to the outside of the cover 21 only through the holes 21a provided around the upper wall 21b, there is a problem that heat radiation is poor.
【０００７】そこで、本発明は、放熱性の良好な送受信
ユニットの放熱構造を提供することを目的とする。Accordingly, an object of the present invention is to provide a heat radiation structure of a transmission / reception unit having good heat radiation.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するため
の第１の解決手段として、電気部品と発熱部品を上面に
搭載した回路基板と、この回路基板を上面に載置して取
り付けるマザー基板とを備え、前記回路基板の下面には
接地用の導電パターンを設けると共に、前記発熱部品の
下面と対向する前記回路基板の箇所には複数個の孔を設
け、この孔には、前記接地用導電パターンに接触した熱
伝導材を充填し、前記マザー基板の上面には導電パター
ンを設けると共に、この導電パターン上には放熱グリー
スを設け、前記接地用導電パターンを前記放熱グリース
に接触した状態で、前記回路基板が前記マザー基板上に
取り付けられた構成とした。As a first means for solving the above-mentioned problems, a circuit board on which electric components and heat-generating components are mounted on an upper surface, and a mother board on which the circuit board is mounted and mounted on the upper surface A conductive pattern for grounding is provided on the lower surface of the circuit board, and a plurality of holes are provided on a portion of the circuit board facing the lower surface of the heat-generating component. Filling the heat conductive material in contact with the conductive pattern, providing a conductive pattern on the upper surface of the mother board, providing a heat radiation grease on the conductive pattern, and contacting the grounding conductive pattern with the heat radiation grease. The circuit board is mounted on the mother board.
【０００９】また、第２の解決手段として、前記放熱グ
リースが導電グリース、或いはシリコングリースで形成
された構成とした。As a second solution, the heat radiation grease is made of conductive grease or silicon grease.
【００１０】[0010]
【発明の実施の形態】本発明の送受信ユニットの放熱構
造の図面を説明すると、図１は本発明の送受信ユニット
の放熱構造に係る要部断面斜視図、図２は本発明の送受
信ユニットの放熱構造に係り、回路基板を下面から見た
斜視図、図３は本発明の送受信ユニットの放熱構造に係
り、マザー基板の要部の斜視図、図４は本発明の送受信
ユニットの放熱構造に係り、要部の拡大断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS A drawing of a heat radiating structure of a transmitting / receiving unit of the present invention will be described. FIG. 1 is a perspective view showing a main part of a heat radiating structure of a transmitting / receiving unit of the present invention, and FIG. FIG. 3 is a perspective view of a main part of a mother board, and FIG. 4 is a perspective view of a main part of a mother board, and FIG. 4 is a perspective view of a main part of a transmitter / receiver unit of the present invention. It is an expanded sectional view of an important section.
【００１１】次に、本発明の送受信ユニットの放熱構造
を図１〜図４に基づいて説明すると、金属板を折り曲げ
して形成された箱形のカバー１は、周囲に設けられた複
数個の孔１ａを有する矩形状の上面壁１ｂと、この上面
壁１ｂの四方から折り曲げされて形成された側面壁１ｃ
と、上面壁１ｂと側面壁１ｃとによって形成された空洞
の収納部１ｄとを有する。Next, the heat radiation structure of the transmitting / receiving unit of the present invention will be described with reference to FIGS. 1 to 4. A box-shaped cover 1 formed by bending a metal plate is provided with a plurality of peripherally provided plural covers. A rectangular upper wall 1b having a hole 1a, and a side wall 1c formed by being bent from four sides of the upper wall 1b
And a hollow storage section 1d formed by the upper wall 1b and the side wall 1c.
【００１２】複数のプリント基板が積層され、外周端部
に複数のサイド電極２２ａを有する回路基板２は、特
に、図２，図４に示すように、その上面に設けられた第
１と第２の導電パターン２ｂ、２ｃと、下面に設けられ
た接地用導電パターン２ｄと、第２の導電パターン２ｃ
と接地用導電パターン２ｄとの間において、上下に貫通
して設けられた複数の小さな孔２ｅとを有する。また、
これ等の孔２ｅ内には、銀等の導電ペースト等からなる
熱伝導材３が充填されて、この熱伝導材３は、第２の導
電パターン２ｃと接地用導電パターン２ｄとに接触した
状態となっている。The circuit board 2 on which a plurality of printed boards are laminated and which has a plurality of side electrodes 22a at the outer peripheral end thereof has, in particular, first and second boards provided on the upper surface thereof as shown in FIGS. Conductive patterns 2b, 2c, a ground conductive pattern 2d provided on the lower surface, and a second conductive pattern 2c.
And a plurality of small holes 2e vertically penetrating between the ground pattern 2d and the ground conductive pattern 2d. Also,
These holes 2e are filled with a heat conductive material 3 made of a conductive paste such as silver or the like, and the heat conductive material 3 is in contact with the second conductive pattern 2c and the grounding conductive pattern 2d. It has become.
【００１３】そして、回路基板２の上面には、抵抗、コ
ンデンサ等の種々の電気部品４と、パワーアンプ等の発
熱部品５が搭載されている。特に、図４に示すように、
発熱部品５の下面には、端部近傍に設けられた配線用電
極５ａと、中央部に設けられた取付用電極５ｂとを有
し、そして、配線用電極２ａと取付用電極２ｂには、金
属ボールからなるボール・グリッド・アレー６が付着さ
れている。On the upper surface of the circuit board 2, various electric components 4 such as a resistor and a capacitor and a heat generating component 5 such as a power amplifier are mounted. In particular, as shown in FIG.
The lower surface of the heat-generating component 5 has a wiring electrode 5a provided near the end and a mounting electrode 5b provided in the center, and the wiring electrode 2a and the mounting electrode 2b have: A ball grid array 6 composed of metal balls is attached.
【００１４】そして、このような発熱部品５は、図４に
示すように、回路基板２上に載置されて、第１と第２の
導電パターン２ｂ、２ｃ上にボール・グリッド・アレー
６を位置させた状態で、クリーム半田（図示せず）によ
り、配線用電極５ａが第１の導電パターン２ｂに半田付
けされると共に、取付用電極５ｂが第２の導電パターン
２ｃに半田付けされている。The heat generating component 5 is mounted on the circuit board 2 as shown in FIG. 4, and a ball grid array 6 is formed on the first and second conductive patterns 2b and 2c. In the positioned state, the wiring electrode 5a is soldered to the first conductive pattern 2b by cream solder (not shown), and the mounting electrode 5b is soldered to the second conductive pattern 2c. .
【００１５】また、回路基板２の下面には、図２，図４
に示すように、接地用導電パターン２ｄを覆うレジスト
層７が設けられると共に、発熱部品５の下面と対向する
接地用導電パターン２ｄの一部分において、レジスト層
７が存在しない露出部２ｆを設けている。また、接地用
導電パターン２ｄは、サイド電極２ａの接地用のものと
導通されている。即ち、発熱部品５の熱は、その下面の
孔２ｅに充填された熱伝導材３を介して、回路基板２の
下面側の接地用導電パターン２ｄに導かれるようになっ
ている。The lower surface of the circuit board 2 is shown in FIGS.
As shown in FIG. 7, a resist layer 7 covering the grounding conductive pattern 2d is provided, and an exposed portion 2f where the resist layer 7 does not exist is provided in a part of the grounding conductive pattern 2d facing the lower surface of the heat generating component 5. . The ground conductive pattern 2d is electrically connected to the ground electrode of the side electrode 2a. That is, the heat of the heat-generating component 5 is guided to the grounding conductive pattern 2d on the lower surface side of the circuit board 2 via the heat conductive material 3 filled in the hole 2e on the lower surface.
【００１６】そして、この回路基板２には、電気部品４
と発熱部品５とがカバー１によって覆われてた状態で、
カバー１の側面壁１ｃの下端部が半田付けされている。
このような構成により本発明の送受信ユニットＳ１が形
成されている。The circuit board 2 has electric components 4
And the heating component 5 are covered by the cover 1,
The lower end of the side wall 1c of the cover 1 is soldered.
The transmission / reception unit S1 of the present invention is formed by such a configuration.
【００１７】携帯電話機に使用されるマザー基板８は、
図３に示すように、上面に設けられた接地用の第１の導
電パターン９ａと、この第１の導電パターン９ａを囲む
ように配置された複数の配線用の第２の導電パターン９
ｂとが設けられている。また、マザー基板８の上面に
は、第１の導電パターン９ａの一部の露出部９ｃと、第
２の導電パターン９ｂの接続部９ｄを除いた部分にレジ
スト層１０が設けられると共に、露出部９ｃ上には、図
４に示すように、導電グリース、シリコングリース等か
らなる放熱グリース１１が設けられている。また、第２
の導電パターン９ａは、第２の導電パターン９ｂの接地
用のものと導通されている。The mother board 8 used for the mobile phone includes:
As shown in FIG. 3, a first conductive pattern 9a for grounding provided on the upper surface and a second conductive pattern 9 for wiring arranged so as to surround the first conductive pattern 9a.
b. On the upper surface of the mother substrate 8, a resist layer 10 is provided on a part of the first conductive pattern 9a except for a part of the exposed part 9c and a part of the second conductive pattern 9b other than the connection part 9d. As shown in FIG. 4, a heat radiation grease 11 made of conductive grease, silicon grease, or the like is provided on 9c. Also, the second
Conductive pattern 9a is electrically connected to the second conductive pattern 9b for grounding.
【００１８】そして、上記のような構成を有する本発明
の送受信ユニットＳ１は、サイド電極２ａが接続部ｄに
一致した状態で、マザー基板８上に回路基板２が載置さ
れ、サイド電極２ａが接続部９ｄに半田付けされて、マ
ザー基板８に電気的に接続された状態で取り付けられて
いる。この回路基板２がマザー基板８に取り付けられた
際、接地用導電パターン２ｄの露出部２ｆは、放熱グリ
ース１１に接触して、放熱グリース１１を介して接地用
導電パターン２ｄと第１の導電パターン９ａとが電気的
に接続された状態となる。なお、ここでは、接地用導電
パターン２ｄが放熱グリース１１を介して第１の導電パ
ターン９ａに電気的に接続されたもので説明したが、両
者が電気的に導通しないものでも良い。In the transmitting / receiving unit S1 of the present invention having the above-described configuration, the circuit board 2 is mounted on the motherboard 8 with the side electrode 2a coinciding with the connection portion d, and the side electrode 2a is It is soldered to the connection part 9d and is attached in a state of being electrically connected to the motherboard 8. When the circuit board 2 is mounted on the mother board 8, the exposed portion 2f of the grounding conductive pattern 2d comes into contact with the heat radiation grease 11, and the grounding conductive pattern 2d and the first conductive pattern 9a is electrically connected. Although the ground conductive pattern 2d is described here as being electrically connected to the first conductive pattern 9a via the heat radiation grease 11, the two may not be electrically conductive.
【００１９】そして、このような状態で送受信ユニット
Ｓ１が使用された際、発熱部品５によって収納部１ｄ内
の空気が熱せられ、熱せられた空気は、孔１ａを通して
カバー１外に放熱されると共に、発熱部品５の熱は、そ
の下面の孔２ｅに充填された熱伝導材３を介して、回路
基板２の下面側の接地用導電パターン２ｄに導かれ、且
つ、この接地用導電パターン２ｄに伝達された熱は、放
熱グリース１１を介してマザー基板８の第１の導電パタ
ーン９ａに伝わり、この第１の導電パターン９ａから外
部に放熱されるようになる。従って、発熱部品５の放熱
が良好であると共に、接地導電パターン２ｄが放熱グリ
ース１１を介して第１の導電パターン９ａに確実に接地
できるものである。When the transmitting / receiving unit S1 is used in such a state, the air in the housing portion 1d is heated by the heat-generating component 5, and the heated air is radiated to the outside of the cover 1 through the hole 1a. The heat of the heat generating component 5 is guided to the grounding conductive pattern 2d on the lower surface side of the circuit board 2 via the heat conductive material 3 filled in the hole 2e on the lower surface thereof, and is transmitted to the grounding conductive pattern 2d. The transmitted heat is transmitted to the first conductive pattern 9a of the mother board 8 via the heat radiation grease 11, and is radiated to the outside from the first conductive pattern 9a. Therefore, the heat radiation of the heat generating component 5 is good, and the ground conductive pattern 2 d can be reliably grounded to the first conductive pattern 9 a via the heat radiation grease 11.
【００２０】[0020]
【発明の効果】本発明の送受信ユニットの放熱構造にお
いて、回路基板２の下面には接地用の導電パターン２ｄ
を設けると共に、発熱部品５の下面と対向する回路基板
２の箇所には複数個の孔２ｅを設け、この孔２ｅには、
接地用導電パターン２ｄに接触した熱伝導材３を充填
し、マザー基板８の上面には導電パターン９ａを設ける
と共に、この導電パターン９ａ上には放熱グリース１１
を設け、接地用導電パターン２ｄを放熱グリース１１に
接触した状態で、回路基板２がマザー基板８上に取り付
けられたため、発熱部品５の熱が熱伝導材３，接地用導
電パターン２ｄ、放熱グリース１１を介して導電パター
ン９ａに伝えられて放熱され、放熱性の良好な送受信ユ
ニットの放熱構造を提供できる。In the heat radiation structure of the transmitting / receiving unit of the present invention, the conductive pattern 2d for grounding is provided on the lower surface of the circuit board 2.
And a plurality of holes 2e are provided at locations on the circuit board 2 facing the lower surface of the heat-generating component 5.
The heat conductive material 3 in contact with the grounding conductive pattern 2d is filled, a conductive pattern 9a is provided on the upper surface of the mother board 8, and a heat radiation grease 11 is provided on the conductive pattern 9a.
The circuit board 2 is mounted on the mother board 8 in a state where the grounding conductive pattern 2d is in contact with the heat radiation grease 11, so that the heat of the heat generating component 5 is transferred to the heat conductive material 3, the grounding conductive pattern 2d, and the heat radiation grease. Thus, the heat is transmitted to the conductive pattern 9a through the heat dissipation 11 and is radiated.
【００２１】また、放熱グリース１１が導電グリース、
或いはシリコングリースで形成されたため、接地導電パ
ターン２ｄが放熱グリース１１を介して導電パターン９
ａに確実に接地でき、接地の良好な送受信ユニットの放
熱構造を提供できる。The heat radiation grease 11 is a conductive grease,
Alternatively, since the ground conductive pattern 2 d is made of silicon grease, the conductive pattern 9
a can be reliably grounded, and a radiation structure of the transceiver unit with good grounding can be provided.
【図１】本発明の送受信ユニットの放熱構造に係る要部
断面斜視図。FIG. 1 is a cross-sectional perspective view of a main part according to a heat radiation structure of a transmission / reception unit of the present invention.
【図２】本発明の送受信ユニットの放熱構造に係り、回
路基板を下面から見た斜視図。FIG. 2 is a perspective view of a circuit board according to the heat radiation structure of the transmission / reception unit of the present invention as viewed from below a circuit board.
【図３】本発明の送受信ユニットの放熱構造に係り、マ
ザー基板の要部の斜視図。FIG. 3 is a perspective view of a main part of a mother board according to the heat radiation structure of the transmitting / receiving unit of the present invention.
【図４】本発明の送受信ユニットの放熱構造に係り、要
部の拡大断面図。FIG. 4 is an enlarged cross-sectional view of a main part of the heat radiation structure of the transmission / reception unit of the present invention.
【図５】従来の送受信ユニットの放熱構造に係る要部断
面斜視図。FIG. 5 is a cross-sectional perspective view of a main part of a conventional heat dissipation structure of a transmission / reception unit.
１ カバー １ａ 孔 １ｂ 上面壁 １ｃ 側面壁 １ｄ 収納部 ２ 回路基板 ２ａ サイド電極 ２ｂ 第１の導電パターン ２ｃ 第２の導電パターン ２ｄ 接地用導電パターン ２ｅ 孔 ２ｆ 露出部 ３ 熱伝導材 ４ 電気部品 ５ 発熱部品 ５ａ 配線用電極 ５ｂ 取付用電極 ６ ボール・グリッド・アレー ７ レジスト層 Ｓ１ 送受信ユニット ８ マザー基板 ９ａ 第１の導電パターン ９ｂ 第２の導電パターン ９ｃ 露出部 ９ｄ 接続部 １０ レジスト層 １１ 放熱グリース DESCRIPTION OF SYMBOLS 1 Cover 1a Hole 1b Top wall 1c Side wall 1d Storage part 2 Circuit board 2a Side electrode 2b First conductive pattern 2c Second conductive pattern 2d Grounding conductive pattern 2e Hole 2f Exposed portion 3 Thermal conductive material 4 Electric component 5 Heat generation Components 5a Wiring electrode 5b Mounting electrode 6 Ball grid array 7 Resist layer S1 Transmitter / receiver unit 8 Mother board 9a First conductive pattern 9b Second conductive pattern 9c Exposed portion 9d Connection portion 10 Resist layer 11 Heat radiation grease
Claims (2)
路基板と、この回路基板を上面に載置して取り付けるマ
ザー基板とを備え、前記回路基板の下面には接地用の導
電パターンを設けると共に、前記発熱部品の下面と対向
する前記回路基板の箇所には複数個の孔を設け、この孔
には、前記接地用導電パターンに接触した熱伝導材を充
填し、前記マザー基板の上面には導電パターンを設ける
と共に、この導電パターン上には放熱グリースを設け、
前記接地用導電パターンを前記放熱グリースに接触した
状態で、前記回路基板が前記マザー基板上に取り付けら
れたことを特徴とする送受信ユニットの放熱構造。1. A circuit board having an electric component and a heat-generating component mounted on an upper surface thereof, and a mother board mounted on the upper surface of the circuit board, and a conductive pattern for grounding is provided on a lower surface of the circuit board. At the same time, a plurality of holes are provided at locations on the circuit board facing the lower surface of the heat-generating component, and the holes are filled with a heat conductive material that is in contact with the grounding conductive pattern. Is provided with a conductive pattern, and heat radiation grease is provided on the conductive pattern,
The heat dissipation structure of a transmission / reception unit, wherein the circuit board is mounted on the mother board while the grounding conductive pattern is in contact with the heat dissipation grease.
はシリコングリースで形成されたことを特徴とする請求
項１記載の送受信ユニットの放熱構造。2. The heat radiating structure for a transmission / reception unit according to claim 1, wherein said heat radiating grease is formed of conductive grease or silicon grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000203084A JP2002026551A (en) | 2000-06-30 | 2000-06-30 | Heat radiating structure of transmitting/receiving unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000203084A JP2002026551A (en) | 2000-06-30 | 2000-06-30 | Heat radiating structure of transmitting/receiving unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002026551A true JP2002026551A (en) | 2002-01-25 |
Family
ID=18700527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000203084A Withdrawn JP2002026551A (en) | 2000-06-30 | 2000-06-30 | Heat radiating structure of transmitting/receiving unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002026551A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294433A (en) * | 2004-03-31 | 2005-10-20 | Nec Electronics Corp | Electronic circuit, electronic circuit with local memory, and its mounting method |
-
2000
- 2000-06-30 JP JP2000203084A patent/JP2002026551A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294433A (en) * | 2004-03-31 | 2005-10-20 | Nec Electronics Corp | Electronic circuit, electronic circuit with local memory, and its mounting method |
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