JP2002021297A - Joint material - Google Patents
Joint materialInfo
- Publication number
- JP2002021297A JP2002021297A JP2000202645A JP2000202645A JP2002021297A JP 2002021297 A JP2002021297 A JP 2002021297A JP 2000202645 A JP2000202645 A JP 2000202645A JP 2000202645 A JP2000202645 A JP 2000202645A JP 2002021297 A JP2002021297 A JP 2002021297A
- Authority
- JP
- Japan
- Prior art keywords
- gypsum board
- metal plate
- bonding material
- melt adhesive
- hot melt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finishing Walls (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば石膏ボード
やパネル等を柱等に接合する接合材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joining material for joining, for example, a gypsum board or a panel to a pillar or the like.
【０００２】[0002]
【従来の技術】従来、石膏ボードやパネル等を柱などに
接合するために、釘、木ねじ、ステープル、接着剤等が
用いられてきた。2. Description of the Related Art Conventionally, nails, wood screws, staples, adhesives, and the like have been used to join gypsum boards and panels to columns and the like.
【０００３】[0003]
【発明が解決しようとする課題】ところで、近年ではリ
フォーム時や解体後の石膏ボードの再利用や、施工時の
騒音等の抑制が求められてきている。By the way, in recent years, there has been a demand for reuse of a gypsum board after reforming or dismantling, and suppression of noise and the like during construction.
【０００４】しかし、従来の釘、ステープル、木ねじ等
で石膏ボードを柱に固定すると、打撃音や電動ドライバ
ー等の騒音が発生する問題があると共に、石膏ボードを
柱から剥がすときに、石膏ボードが壊れてしまい、石膏
ボードの再利用ができなくなったり、破損した石膏ボー
ドの嵩が大きくなって、分別等の手間がかかったり、廃
棄コストが高くなる問題がある。[0004] However, when the gypsum board is fixed to the pillar with conventional nails, staples, wood screws, etc., there is a problem that a hitting sound and a noise such as an electric screwdriver are generated. There is a problem in that the gypsum board is broken and cannot be reused, the bulk of the damaged gypsum board becomes large, it takes time to separate and the like, and the disposal cost increases.
【０００５】即ち、釘やステープルの場合、石膏ボード
から抜くときに、接着剤では石膏ボードを柱から剥がす
ときに、それぞれ石膏ボードが原形を留めないほどに損
壊してしまう。[0005] That is, in the case of nails and staples, when the gypsum board is peeled off from the pillar with the adhesive when the gypsum board is removed from the gypsum board, each gypsum board is damaged so as not to retain its original shape.
【０００６】また、ネジの場合、畳１畳分の石膏ボード
上に４０本以上のネジが使用され、取り外しに時間がか
かるために、ボードを破壊して解体しており、石膏ボー
ドの再使用は不可能であった。[0006] In the case of screws, more than 40 screws are used on a gypsum board for one tatami mat, and it takes time to remove the board. Was impossible.
【０００７】本発明は、このような問題に着目してなさ
れたものであり、石膏ボード等の取り付け作業において
騒音が発生せず、内装の改装時或いは建物の解体時に、
石膏ボードの損壊を防止して、石膏ボードの再利用を極
力可能とするほか、廃棄処理にあっても極力手間及びコ
ストのかからない接合材を提供することを目的とする。The present invention has been made in view of such a problem, and does not generate noise in the work of attaching a gypsum board or the like.
Another object of the present invention is to prevent the gypsum board from being damaged so that the gypsum board can be reused as much as possible, and to provide a bonding material that requires as little labor and cost as possible in disposal processing.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するため
に、本発明の請求項１にかかる接合材は、小片からなる
金属板の少なくとも片面にホットメルト接着剤層を形成
したことを特徴とする。In order to solve the above-mentioned problems, a bonding material according to claim 1 of the present invention is characterized in that a hot-melt adhesive layer is formed on at least one surface of a small metal plate. I do.
【０００９】また、本発明の請求項２の接合材は、請求
項１の接合材において、石膏ボードと柱との間に配置さ
れ、前記石膏ボードの表側からの電磁誘導により前記金
属板を誘導加熱して前記ホットメルト接着剤層を少なく
とも前記石膏ボード若しくは前記柱のいずれかに接着す
ることを特徴とする。The bonding material according to claim 2 of the present invention is the bonding material according to claim 1, which is disposed between the gypsum board and the column, and guides the metal plate by electromagnetic induction from the front side of the gypsum board. The method is characterized in that the hot melt adhesive layer is bonded to at least either the gypsum board or the pillar by heating.
【００１０】なお、請求項１、請求項２の接合材におい
て、両面にホットメルト接着剤層を形成しても良く、ホ
ットメルト接着剤層上に仮止め用両面テープを貼り付
け、剥離紙を当該両面テープに貼り付けても良い。ま
た、粘着力の弱いテープの上に前記接合材を多数仮止め
して貼り合わせておき、使用時に当該粘着力の弱いテー
プを剥がして使用しても良い。In the bonding material according to claim 1 or 2, a hot-melt adhesive layer may be formed on both sides, and a double-sided tape for temporary fixing is attached on the hot-melt adhesive layer, and a release paper is formed. It may be attached to the double-sided tape. Alternatively, a large number of the bonding materials may be temporarily fixed on a tape having a weak adhesive force and bonded together, and the tape having a weak adhesive force may be peeled off at the time of use.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態にかか
る接合材を図面に基づいて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A bonding material according to an embodiment of the present invention will be described below with reference to the drawings.
【００１２】図１はこの発明の実施の形態にかかる接合
材１の構成を示しており、この接合材１としての金属板
２の表裏両面に、ホットメルト接着剤層３が形成されて
いる。FIG. 1 shows a configuration of a bonding material 1 according to an embodiment of the present invention. A hot melt adhesive layer 3 is formed on both front and back surfaces of a metal plate 2 as the bonding material 1.
【００１３】金属板２は、アルミニュウム、鉄等の板状
のものを使用でき、形状は正方形や長方形などの四角形
（例えば１辺が１ｃｍ〜１０ｃｍ大の正方形）、丸形の
形状を有し、誘導加熱接着に適した肉厚（例えば、０．
１ｍｍ〜２ｍｍ）を有する。The metal plate 2 may be in the form of a plate such as aluminum or iron, and may have a square shape such as a square or a rectangle (for example, a square having a side of 1 cm to 10 cm in size) or a round shape. Thickness suitable for induction heating bonding (for example,
1 mm to 2 mm).
【００１４】ホットメルト接着剤は、周知のものを用い
ており、固形の熱可塑性樹脂接着剤を高温に加熱し溶融
させて被着体に塗布し、圧着する接着剤からなる。この
ホットメルト接着剤は、例えば、プラスチック用語辞典
等に記載されているような周知の素材（ポリ酢酸ビニ
ル、エチレン酢酸ビニル共重合体、ポリイミド、フェノ
キシ樹脂、エチルセルロース、ポリイソブチレン、石油
樹脂、ポリエステル、テルペン樹脂、アスファルト、ロ
ジン及びその誘導体等）からなる。As the hot melt adhesive, a well-known hot melt adhesive is used, which is a solid thermoplastic resin adhesive which is heated to a high temperature, melted, applied to an adherend, and pressed. This hot melt adhesive is, for example, a well-known material (polyvinyl acetate, ethylene vinyl acetate copolymer, polyimide, phenoxy resin, ethyl cellulose, polyisobutylene, petroleum resin, polyester, etc. Terpene resin, asphalt, rosin and derivatives thereof).
【００１５】接合材１は、図２に示すように、ホットメ
ルト接着剤層３の面に予め両面テープ６を貼り付けて、
両面テープ６の上に剥離紙を貼り付けておくものでも良
い。As shown in FIG. 2, the bonding material 1 has a double-sided tape 6 adhered to the surface of the hot melt adhesive layer 3 in advance.
A release paper may be attached on the double-sided tape 6.
【００１６】図３はこの接合材１により石膏ボード５を
柱４に取り付ける情況を示す。接合材１によって、柱４
に石膏ボード５を接合する場合には、柱４、４或いは接
合材１の柱４側の面に、例えば接合材１よりも小さな両
面テープ６を仮止めし、石膏ボード５を柱４、４の所定
の位置に位置決めして押さえておく。FIG. 3 shows a situation in which the gypsum board 5 is attached to the pillar 4 by the bonding material 1. Pillar 4 by joining material 1
When the gypsum board 5 is bonded to the pillars 4, 4 or the double-sided tape 6 smaller than the bonding material 1, for example, is temporarily fixed to the pillar 4 side surface of the bonding material 1, and the gypsum board 5 is bonded to the pillars 4, 4. At a predetermined position.
【００１７】次に、電磁誘導装置７を石膏ボード５の接
合材１の仮止め箇所に当てて高周波を発生させ、接合材
１の金属板２を誘導加熱する。これによって、石膏ボー
ド５と柱４との間に挟まれた接合材１のホットメルト接
着剤層３は溶融して柱４と石膏ボード５とが接着され
る。Next, the electromagnetic induction device 7 is applied to the temporarily fixed portion of the joining material 1 of the gypsum board 5 to generate a high frequency, and the metal plate 2 of the joining material 1 is induction-heated. Thereby, the hot melt adhesive layer 3 of the bonding material 1 sandwiched between the gypsum board 5 and the pillar 4 is melted, and the pillar 4 and the gypsum board 5 are bonded.
【００１８】なお、この電磁誘導装置７は、高周波発生
回路、高周波発生回路から高周波電流が供給されるコイ
ル、金属探知器、電源回路を備え、コンセントから交流
電流を取り出して電源回路で変圧し、高周波発生回路に
よりコイルに高周波電流を供給すると共に、金属探知器
により金属板２を探知するものである。なお、電磁誘導
装置７は、誘導電流のインピーダンス変化により金属板
２を検知したときにランプを点灯したり、アラーム等の
探知音を発生したり、自動的に誘導電流を発生させても
よい。The electromagnetic induction device 7 includes a high-frequency generating circuit, a coil to which a high-frequency current is supplied from the high-frequency generating circuit, a metal detector, and a power supply circuit. A high-frequency generating circuit supplies a high-frequency current to the coil, and a metal detector detects the metal plate 2. The electromagnetic induction device 7 may turn on a lamp when detecting the metal plate 2 based on a change in impedance of the induced current, generate a detection sound such as an alarm, or automatically generate the induced current.
【００１９】ところで、図４に示すように、金属２が帯
状に長い金属板８であると、石膏ボード５のかげになる
ために、金属のどこが接着されているかどうかは判定で
きず、一度誘導加熱したところＡを再度誘導加熱して剥
がしてしまうことも生じるが、この実施の形態のように
金属小片により接合材１を構成すると、誘導加熱時に接
合材１の全面が柱４及び石膏ボード５に接着されるた
め、かかる事態が発生せず、信頼性の高い接合を行うこ
とができると共に、加熱効率が高く、接着作業時間を少
なくでき、ホットメルト接着剤３の使用量も少なく低コ
ストの内装作業を行うことができる。As shown in FIG. 4, if the metal 2 is a long metal plate 8 in a strip shape, it becomes a shadow of the gypsum board 5, so it cannot be determined whether the metal is bonded. In this case, A may be peeled off again by induction heating, but when the joining material 1 is formed of small metal pieces as in this embodiment, the entire surface of the joining material 1 is attached to the pillars 4 and the gypsum board 5 at the time of induction heating. Since the bonding is performed, such a situation does not occur, a highly reliable bonding can be performed, the heating efficiency is high, the bonding operation time can be reduced, the amount of the hot melt adhesive 3 used is small, and the low cost interior is used. Work can be done.
【００２０】また、図４の帯状金属板全体を誘導加熱接
着して石膏ボード５を取り付ける場合には、接着箇所の
省略等により生じた一部非接着の部分を、剥離作業のと
きの誘導加熱によって接着して、剥離が不能になること
がある。When the gypsum board 5 is attached by inductively bonding the entire strip-shaped metal plate shown in FIG. 4, a part of the non-adhered portion caused by the omission of the adhering portion or the like is removed by induction heating during the peeling operation. May be adhered, making peeling impossible.
【００２１】しかし、本実施の形態のような金属小片に
より金属板２を構成することにより、石膏ボード５の上
から金属板２を金属探知器により探知し、誘導加熱すれ
ば、金属板２のホットメルト接着剤の接着機能を解消し
て石膏ボード５を剥離することができる。However, when the metal plate 2 is constituted by the small metal pieces as in the present embodiment, the metal plate 2 is detected from above the gypsum board 5 by a metal detector, and if the metal plate 2 is induction-heated, the metal plate 2 is removed. The gypsum board 5 can be peeled off by eliminating the adhesive function of the hot melt adhesive.
【００２２】すなわち、このような接合材１によれば、
剥離作業が簡単であり、石膏ボードの損傷を防止して再
使用が可能となったり、剥がした石膏ボードを積層でき
るので嵩張らず、金属小片を容易に除去できるので、廃
棄する場合においても手間やコストがかからないことと
なる。That is, according to such a bonding material 1,
The peeling work is easy, the gypsum board can be reused by preventing damage, and the peeled gypsum board can be laminated so that it is not bulky and metal pieces can be easily removed, so it is troublesome even when disposing it There will be no cost.
【００２３】[0023]
【発明の効果】請求項１、２の接合材によれば、接着さ
れる柱等に接合材を貼り付け、接合材のホットメルト層
側に石膏ボードを接触させておき、石膏ボードの上から
電磁誘導加熱を行うと、ホットメルト層が溶けて石膏ボ
ードと接合材とが接合される。According to the first and second bonding materials, the bonding material is adhered to the pillar or the like to be bonded, and the gypsum board is brought into contact with the hot melt layer side of the bonding material. When the electromagnetic induction heating is performed, the hot melt layer melts and the gypsum board and the joining material are joined.
【００２４】これにより、金属板を帯状に長く形成した
帯状金属板全体を全部接合する必要がないので、加熱効
率が高く、作業時間を少なくできる。また、帯状金属板
全体を接合するとむらが生じ易いが、小片とすることに
より、接着剤の量を顕著に少なくできると共に、全体接
着のように一部が充分に接着されていないなどの接合む
らが生じないために、単位面積当たりの荷重がアップ
し、保持力が安定する。[0024] This eliminates the need to join the entire strip-shaped metal plate in which the metal plate is formed in a long strip shape, so that the heating efficiency is high and the work time can be reduced. In addition, although the unevenness tends to occur when the entire belt-shaped metal plate is joined, the use of small pieces makes it possible to remarkably reduce the amount of the adhesive, and the unevenness in the joining such that a part is not sufficiently adhered as in the case of the entire adhesion. Does not occur, the load per unit area increases, and the holding force is stabilized.
【００２５】特に、接合材が金属板小片からなる場合に
は、電磁誘導加熱の際に誘導時のインピーダンス変化に
より金属板小片を確実に検出でき、金属板小片全体を誘
導加熱するために、どこの部分が接着されているかがす
ぐ判る。このため、施工スピードの向上と確実な接着を
得ることができる。In particular, when the joining material is made of a small metal plate, the small metal plate can be reliably detected by the impedance change at the time of induction during electromagnetic induction heating. You can easily see if the part is adhered. For this reason, it is possible to improve the construction speed and obtain reliable bonding.
【００２６】また、剥離の際には、小片の場合には必ず
小片全体が接着されているために、電磁誘導装置により
誘導加熱すれば、小片のホットメルト剤は接着機能を失
って剥離する。In the case of peeling, since the small pieces are always bonded together in the case of a small piece, if induction heating is performed by an electromagnetic induction device, the hot melt agent of the small piece loses its adhesive function and peels off.
【００２７】このため、剥離作業が簡単であり、石膏ボ
ードの損傷を防止して再使用が可能となったり、剥がし
た石膏ボードを積層できるので嵩張らず、金属小片を容
易に除去できるので、廃棄する場合においても手間やコ
ストがかからない。For this reason, the peeling operation is simple, the gypsum board can be prevented from being damaged and reused, and the peeled gypsum board can be laminated so that it is not bulky and small metal pieces can be easily removed. In this case, no labor or cost is required.
【図１】図１は本発明の１実施の形態にかかる接合材の
構成を示す斜視図。FIG. 1 is a perspective view showing a configuration of a bonding material according to one embodiment of the present invention.
【図２】図２は仮止め用の両面テープを設けたホットメ
ルト接着剤の平面図。FIG. 2 is a plan view of a hot melt adhesive provided with a double-sided tape for temporary fixing.
【図３】図３は図１の接合材を用いて石膏ボードを取り
付ける場合の説明図。FIG. 3 is an explanatory view of a case where a gypsum board is attached using the bonding material of FIG. 1;
【図４】帯状金属板を用いるときの説明図。FIG. 4 is an explanatory diagram when a band-shaped metal plate is used.
１ 接合体 ２ 金属板 ３ ホットメルト接着剤層 ４ 支柱 ５ 石膏ボード ６ 仮止め用両面テープ DESCRIPTION OF SYMBOLS 1 Joined body 2 Metal plate 3 Hot-melt adhesive layer 4 Prop 5 Gypsum board 6 Double-sided tape for temporary fixing
───────────────────────────────────────────────────── フロントページの続き (72)発明者 高鶴 充泰 東京都中央区日本橋箱崎町６番６号マック ス株式会社内 (72)発明者 高山 崇 東京都中央区日本橋箱崎町６番６号マック ス株式会社内 (72)発明者 塩谷 力 東京都中央区日本橋箱崎町６番６号マック ス株式会社内 (72)発明者 針谷 工 東京都中央区日本橋箱崎町６番６号マック ス株式会社内 (72)発明者 塩川 博 東京都中央区日本橋箱崎町６番６号マック ス株式会社内 (72)発明者 関口 宣明 東京都中央区日本橋箱崎町６番６号マック ス株式会社内 Ｆターム(参考） 2E110 AA42 AA48 AB04 AB23 CA03 CC03 DA12 DB34 DC17 GB16W ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Mitsuyasu Takatsuru 6-6, Nihonbashi-Hakozakicho, Chuo-ku, Tokyo Inside Max. Co., Ltd. (72) Takashi Takayama 6-6, Nihonbashi-Hakozakicho, Chuo-ku, Tokyo Inside Max. Co., Ltd. (72) Inventor Shioya Riki 6-6, Nihonbashi-Hakozakicho, Chuo-ku, Tokyo Max. Co., Ltd. (72) Inventor Takuya 6-6, Nihonbashi-Hakozakicho, Chuo-ku, Tokyo Max. (72) Inventor Hiroshi Shiokawa Max. 6-6 Nihonbashi Hakozakicho, Chuo-ku, Tokyo (72) Inventor Noriaki Sekiguchi 6-6 Nihonbashi Hakozakicho, Chuo-ku, Tokyo F-term ( Reference) 2E110 AA42 AA48 AB04 AB23 CA03 CC03 DA12 DB34 DC17 GB16W
Claims (2)
ットメルト接着剤層を形成したことを特徴とする接合
材。1. A bonding material characterized in that a hot melt adhesive layer is formed on at least one side of a metal plate made of small pieces.
柱との間に配置され、前記石膏ボードの表側からの電磁
誘導により前記金属板を誘導加熱して前記ホットメルト
接着剤層を少なくとも前記石膏ボード若しくは前記柱の
いずれかに接着することを特徴とする接合材。2. The bonding material according to claim 1, wherein the metal plate is disposed between the gypsum board and the column, and the metal plate is induction-heated by electromagnetic induction from the front side of the gypsum board to at least make the hot melt adhesive layer. A bonding material, which is bonded to either the gypsum board or the pillar.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000202645A JP2002021297A (en) | 2000-07-04 | 2000-07-04 | Joint material |
| US09/897,204 US20020002805A1 (en) | 2000-07-04 | 2001-07-02 | Bonding member and gypsum board mounting method using the same |
| EP01250248A EP1170431A1 (en) | 2000-07-04 | 2001-07-02 | Bonding member and gypsum board mounting method using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000202645A JP2002021297A (en) | 2000-07-04 | 2000-07-04 | Joint material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002021297A true JP2002021297A (en) | 2002-01-23 |
Family
ID=18700141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000202645A Pending JP2002021297A (en) | 2000-07-04 | 2000-07-04 | Joint material |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003014698A (en) * | 2001-06-28 | 2003-01-15 | Max Co Ltd | Method for confirming fusion of hot melt adhesive in hot melt adhesive tape |
| JP2012167239A (en) * | 2011-02-17 | 2012-09-06 | Buraunii:Kk | Attachment method by induction heating, and apparatus therefor |
| JP2012250398A (en) * | 2011-06-01 | 2012-12-20 | Nippon Steel & Sumikin Coated Sheet Corp | Method of manufacturing sandwich panel |
| JP2021504177A (en) * | 2017-11-22 | 2021-02-15 | ディーエスエム アイピー アセッツ ビー．ブイ．Ｄｓｍ Ｉｐ Ａｓｓｅｔｓ Ｂ．Ｖ． | How to manufacture and recycle objects consisting of panels with durable surface covers |
-
2000
- 2000-07-04 JP JP2000202645A patent/JP2002021297A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003014698A (en) * | 2001-06-28 | 2003-01-15 | Max Co Ltd | Method for confirming fusion of hot melt adhesive in hot melt adhesive tape |
| JP4706136B2 (en) * | 2001-06-28 | 2011-06-22 | マックス株式会社 | Melting confirmation method of hot melt adhesive in hot melt adhesive tape |
| JP2012167239A (en) * | 2011-02-17 | 2012-09-06 | Buraunii:Kk | Attachment method by induction heating, and apparatus therefor |
| JP2012250398A (en) * | 2011-06-01 | 2012-12-20 | Nippon Steel & Sumikin Coated Sheet Corp | Method of manufacturing sandwich panel |
| JP2021504177A (en) * | 2017-11-22 | 2021-02-15 | ディーエスエム アイピー アセッツ ビー．ブイ．Ｄｓｍ Ｉｐ Ａｓｓｅｔｓ Ｂ．Ｖ． | How to manufacture and recycle objects consisting of panels with durable surface covers |
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