JP2002012896A - Agent for cleansing off and method for cleansing - Google Patents
Agent for cleansing off and method for cleansingInfo
- Publication number
- JP2002012896A JP2002012896A JP2000199274A JP2000199274A JP2002012896A JP 2002012896 A JP2002012896 A JP 2002012896A JP 2000199274 A JP2000199274 A JP 2000199274A JP 2000199274 A JP2000199274 A JP 2000199274A JP 2002012896 A JP2002012896 A JP 2002012896A
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- JP
- Japan
- Prior art keywords
- cleaning
- component
- removing agent
- components
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えばプリント配
線板やＩＣ等の各種電子部品の半田付け後に部品表面に
固着した半田フラックス残渣の除去、ならびに電子部品
の熱処理によって端子表面や半田表面に生じる酸化皮膜
の如き金属表面の酸化皮膜の除去に用いる洗浄除去剤及
び洗浄方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the removal of solder flux residue adhered to the surface of various electronic components such as printed wiring boards and ICs after soldering, and the heat treatment of the electronic components results in the production of terminal and solder surfaces. The present invention relates to a cleaning remover and a cleaning method used for removing an oxide film on a metal surface such as an oxide film.
【０００２】[0002]
【従来の技術】一般的に、電子部品の半田付けにおいて
は、接合部を清浄にして且つ接合面の酸化を防ぐための
半田フラックスとして、ロジン、活性ロジン、ステアリ
ン酸、オレイン酸、塩酸アニリン、尿素、エチレンジア
ミン等の有機系フラックスが汎用されている。しかる
に、これら半田フラックスは、そのままの形又は熱によ
る炭化や分解等で生じた変性物として半田付け後の部品
表面に残留し、回路断線や導電不良等の要因となること
から、洗浄によって前記変性物を含む半田フラックス残
渣を除去することが肝要である。また、電子部品や機械
部品の表面には油脂成分等の有機質の汚れが付着してい
ることも多く、用途によってはその汚れを洗浄除去する
必要がある。2. Description of the Related Art Generally, in soldering electronic components, rosin, activated rosin, stearic acid, oleic acid, aniline hydrochloride, and the like are used as solder fluxes for cleaning a joint and preventing oxidation of a joint surface. Organic fluxes such as urea and ethylenediamine are widely used. However, these solder fluxes remain on the component surface after soldering as they are or as denatured substances generated by carbonization or decomposition by heat, etc. It is important to remove the solder flux residue containing the material. In addition, organic dirt such as an oil component often adheres to the surface of electronic parts and mechanical parts, and it is necessary to wash and remove the dirt depending on the use.
【０００３】一方、電子部品によっては端子表面や半田
表面に酸化皮膜が生じる場合があり、この電子部品に半
田付けをする場合に半田付けの不良が発生するおそれが
あるので、この酸化皮膜を除去することが望ましい。On the other hand, depending on the electronic component, an oxide film may be formed on a terminal surface or a solder surface. When soldering to the electronic component, there is a possibility that a soldering defect may occur. It is desirable to do.
【０００４】従来、半田フラックス残渣や有機質の汚れ
の洗浄除去には、フッ素系溶剤や塩素系溶剤が汎用され
てきたが、近年ではオゾン層破壊の原因になることや毒
性の問題等によって使用できなくなってきている。そこ
で、これらに代替する新しい洗浄除去剤として、例えば
特開平７−３２９４号公報では、炭素数３以上のアルコ
ール溶剤と、炭化水素溶剤と、塩基性物質としての第４
級アンモニウム塩基との３成分からなる洗浄組成物が提
案されている。Conventionally, fluorine-based solvents and chlorine-based solvents have been widely used for cleaning and removing solder flux residues and organic dirt. However, in recent years, they can be used due to problems such as ozone layer destruction and toxicity. It's gone. Therefore, as a new cleaning and removing agent which substitutes for these, for example, Japanese Patent Application Laid-Open No. 7-3294 discloses an alcohol solvent having 3 or more carbon atoms, a hydrocarbon solvent, and a fourth substance as a basic substance.
Cleaning compositions comprising three components with a quaternary ammonium base have been proposed.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前記提
案の洗浄組成物では、半田フラックス残渣や有機質の汚
れに対し、ある程度の洗浄除去効果が得られるものの充
分とは言えない上、電子部品の端子表面や半田表面に生
じた酸化皮膜に対する除去作用は殆どなく、またイソプ
ロピルアルコール等の引火点の低い低級アルコール溶剤
を用いる点で取扱い上の危険性があるといった難点があ
った。とりわけ、上記の酸化皮膜については、元来より
除去困難とされており、フッ素系溶剤や塩素系溶剤によ
る洗浄でも効果はない。また酸やアルカリによる洗浄で
は、酸化皮膜は除去できても素材が侵されることにな
り、特に電子部品が対象である場合には到底採用できな
い。However, the cleaning composition proposed above can provide a certain level of cleaning and removing effect on solder flux residue and organic dirt, but cannot be said to be sufficient. There is almost no effect of removing an oxide film formed on the surface of the solder or the surface of the solder, and there is a danger in handling since a lower alcohol solvent having a low flash point such as isopropyl alcohol is used. In particular, the above-mentioned oxide film is originally considered to be difficult to remove, and cleaning with a fluorine-based solvent or a chlorine-based solvent has no effect. Further, in the case of cleaning with an acid or an alkali, even if the oxide film can be removed, the material is eroded.
【０００６】本発明は、上述の事情に鑑みて、各種電子
部品や機械部品等の半田付け後に部品表面に固着した半
田フラックス残渣及び油脂の如き有機質の汚れを確実に
除去できる洗浄除去剤及び洗浄方法を提供することを第
一の目的とし、また該半田フラックス残渣及び有機質の
汚れの除去に加え、電子部品の端子表面や半田表面に生
じた酸化皮膜の如き金属表面の酸化皮膜の除去も可能な
洗浄除去剤及び洗浄方法を提供することを第二の目的と
している。SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a cleaning and removing agent and a cleaning agent that can reliably remove organic contaminants such as solder flux residues and oils and fats fixed on the surface of components after soldering various electronic components and mechanical components. The primary object of the present invention is to provide a method, and in addition to removing the solder flux residue and organic dirt, it is also possible to remove an oxide film on a metal surface such as an oxide film generated on a terminal surface of an electronic component or a solder surface. A second object is to provide a simple cleaning remover and a cleaning method.
【０００７】[0007]
【課題を解決するための手段】上記第一の目的を達成す
るために、本発明の請求項１に係る洗浄除去剤は、ａ）
３−メトキシ・３−メチル・１−ブタノールと、ｂ）Ｎ
−メチル・２−ピロリドンとを必須成分として含有する
ものとしている。In order to achieve the first object, the cleaning and removing agent according to claim 1 of the present invention comprises:
3-methoxy-3-methyl-1-butanol and b) N
-Methyl-2-pyrrolidone as an essential component.
【０００８】また、請求項１の洗浄除去剤の好適態様と
して、請求項２では前記のａ成分／ｂ成分の重量比が１
１／８９〜９４／６の範囲にある構成、請求項３では洗
浄除去剤における前記ａ成分及びｂ成分と共に、ｃ）ベ
ンゾトリアゾール、ベンゾチアゾール、２−メルカプト
ベンゾチアゾール、２−メルカプトベンゾイミダゾー
ル、チオ尿素の群より選ばれる少なくとも一種の腐食抑
制剤成分がａ，ｂ成分の合量に対して０．０５〜６重量
％の範囲で含まれる構成、請求項４ではＰＨが５．１〜
８．９の範囲にある構成、をそれぞれ採用している。[0008] In a preferred embodiment of the cleaning and removing agent of the first aspect, the weight ratio of the component a / b is 1 in the second aspect.
The composition in the range of 1/89 to 94/6, and in claim 3, c) benzotriazole, benzothiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, At least one corrosion inhibitor component selected from the group of urea is contained in the range of 0.05 to 6% by weight based on the total amount of the components a and b.
8.9.
【０００９】更に、請求項５に係る洗浄方法は、同様目
的において、前記請求項１〜４のいずれかの洗浄除去剤
を用いた洗浄により、半田付け後の部品表面に残留する
半田フラックス及びその変性物を除去することを特徴と
している。Further, a cleaning method according to a fifth aspect of the present invention provides, for the same purpose, a solder flux remaining on the surface of a component after soldering by cleaning using the cleaning and removing agent according to any one of the first to fourth aspects, and a method for cleaning the same. It is characterized in that denatured substances are removed.
【００１０】一方、前記第二の目的を達成するために、
本発明の請求項６に係る洗浄除去剤は、ａ）３−メトキ
シ・３−メチル・１−ブタノールと、ｄ）水溶性チオグ
リコール酸塩ととを必須成分として含有するものとして
いる。On the other hand, in order to achieve the second object,
The cleaning and removing agent according to claim 6 of the present invention contains a) 3-methoxy-3-methyl-1-butanol and d) a water-soluble thioglycolate as essential components.
【００１１】また、請求項６の洗浄除去剤の好適態様と
して、請求項７では前記のａ成分／ｄ成分の重量比が２
７／７３〜８７／１３の範囲にある構成、請求項８では
前記ａ成分及びｄ成分と共に、ｅ）ポリオキシエチレン
アルキルエーテルが洗浄除去剤全量中の０．７〜２０重
量％を占める割合で含まれてなる構成、請求項９では前
記ａ成分及びｄ成分と共に、ｆ）水溶性クエン酸塩が洗
浄除去剤全量中の０．７〜１０重量％を占める割合で含
まれてなる構成、請求項１０では前記ａ成分及びｄ成分
と共に、前記請求項３記載のｃ成分の腐食抑制剤成分
と、ｇ）塩酸アルキルジ（アミノエチル）グリシン又は
／及びナトリウムアルキルジ（アミノエチル）グリシン
とが、それそれ洗浄除去剤全量中の０．７〜１０重量％
を占める割合で含まれてなる構成、請求項１１ではＰＨ
が５．１〜８．９の範囲にある構成、をそれぞれ採用し
ている。In a preferred embodiment of the cleaning and removing agent according to claim 6, in claim 7, the weight ratio of the component a / d is 2.
The composition in the range of 7/73 to 87/13, wherein the component (a) and the component (d) are used together with the component (a) and the component (d) in a proportion of e) polyoxyethylene alkyl ether which accounts for 0.7 to 20% by weight of the total amount of the cleaning remover. Claim 10 wherein, in addition to the components a and d, f) a water-soluble citrate is contained in a proportion occupying 0.7 to 10% by weight of the total amount of the cleaning and removing agent. In claim 10, the corrosion inhibitor component of component c according to claim 3 together with the components a and d, and g) alkyldi (aminoethyl) glycine hydrochloride or / and sodium alkyldi (aminoethyl) glycine, 0.7 to 10% by weight of the total amount of the cleaning and removing agent
, And in claim 11, PH
Is in the range of 5.1 to 8.9.
【００１２】更に、請求項１２に係る洗浄方法は、前記
請求項６〜１１のいずれかに記載の洗浄除去剤を用いた
洗浄により、金属表面の酸化皮膜を除去することを特徴
としている。A cleaning method according to a twelfth aspect is characterized in that an oxide film on a metal surface is removed by cleaning using the cleaning remover according to any one of the sixth to eleventh aspects.
【００１３】[0013]
【発明の実施の形態】本発明に係る第一の洗浄除去剤
は、既述のように、ａ）３−メトキシ・３−メチル・１
−ブタノールと、ｂ）Ｎ−メチル・２−ピロリドンとを
必須成分として含有するものであり、これを用いること
により、電子部品の半田付け後の表面に固着した半田フ
ラックス残渣（熱による炭化や分解等で生じた変性物を
含む…以下同様）や油脂等の有機系の汚れを確実に洗浄
できることが判明している。すなわち、これらａ，ｂ両
成分は共に常温下で液状を呈する化合物であり、半田フ
ラックスに多用されるロジンや高級脂肪酸、油脂等に対
する溶解力を発揮する溶剤として機能し、本洗浄除去剤
中に被洗浄物を浸漬して超音波洗浄等の洗浄処理を施し
た際、ａ，ｂ両成分が協働して前記の有機系の汚れを完
全に溶解する上、ａ，ｂ両成分が共に水溶性であるた
め、次いで水洗を行うことによって汚れを溶解した洗浄
除去剤を被洗浄物の表面から容易に除去できる。DETAILED DESCRIPTION OF THE INVENTION As described above, the first cleaning and removing agent according to the present invention comprises: a) 3-methoxy-3-methyl-1
-Butanol and b) N-methyl-2-pyrrolidone as essential components, and by using this, a solder flux residue (carbonization or decomposition by heat) adhered to the surface of an electronic component after soldering. It has been found that organic stains such as oils and fats can be reliably removed. That is, both of these components a and b are compounds that exhibit a liquid state at room temperature, function as a solvent that exerts a dissolving power for rosin, higher fatty acids, oils, and the like frequently used in solder flux, and are contained in the present cleaning and removing agent. When the object to be cleaned is immersed and subjected to a cleaning treatment such as ultrasonic cleaning, the components a and b cooperate to completely dissolve the organic dirt, and both the components a and b are dissolved in water. Then, the washing and removing agent in which the dirt is dissolved can be easily removed from the surface of the object to be washed by washing with water.
【００１４】ここで、ａ成分の３−メトキシ・３−メチ
ル・１−ブタノールは前記のようにロジンや高級脂肪
酸、油脂等に対する溶解力を有するが、その溶解力はｂ
成分のＮ−メチル・２−ピロリドンに比較して弱いた
め、このａ成分単独では前記の有機系の汚れを完全に溶
解除去するには不充分である。一方、ｂ成分のＮ−メチ
ル・２−ピロリドンは、強力な前記溶解力を有する反
面、金属に対する若干の酸化腐食性があるため、やはり
単独では支障を生じる。しかるに、本発明の第一の洗浄
除去剤では、ａ，ｂ両成分の併用によって両者の利点が
活かされ、金属の酸化腐食を抑えて有機系の汚れに対す
る優れた溶解除去性を発揮させることを可能にしてい
る。また、この洗浄除去剤は、ａ，ｂ両成分が共に水溶
性であるために引火点が高く、且つ両成分が低毒性でも
あることから、取扱い中の安全性にも優れている。Here, the 3-methoxy-3-methyl-1-butanol of the component a has a dissolving power for rosin, higher fatty acids, oils and fats as described above, and the dissolving power for the b-component is b
Since component a is weaker than N-methyl-2-pyrrolidone as a component, component a alone is not sufficient to completely dissolve and remove the organic dirt. On the other hand, N-methyl-2-pyrrolidone as the component (b) has a strong dissolving power, but has a slight oxidative corrosion property against metals, so that it alone causes a problem. However, in the first cleaning and removing agent of the present invention, the combined use of both components a and b makes use of the advantages of both, and suppresses the oxidative corrosion of the metal to exhibit excellent dissolving and removing properties for organic dirt. Making it possible. Further, this cleaning and removing agent has a high flash point because both components a and b are water-soluble, and also has excellent safety during handling because both components have low toxicity.
【００１５】第一の洗浄除去剤におけるａ成分の３−メ
トキシ・３−メチル・１−ブタノールとｂ成分のＮ−メ
チル・２−ピロリドンとの配合比率は、ａ成分／ｂ成分
の重量比で１１／８９〜９４／６の範囲が好適であり、
ａ成分が少な過ぎると金属に対する酸化腐食性が現れ、
ｂ成分が少な過ぎると有機系の汚れに対する溶解力が不
充分になる。The mixing ratio of 3-methoxy-3-methyl-1-butanol as the component a and N-methyl-2-pyrrolidone as the component b in the first cleaning and removing agent is represented by the weight ratio of component a to component b. The range of 11/89 to 94/6 is preferred,
If the amount of the component a is too small, oxidative corrosion of metal appears,
If the amount of the component (b) is too small, the dissolving power for organic stains becomes insufficient.
【００１６】また、この第一の洗浄除去剤としては、金
属に対する酸化腐食性をより確実に抑えるために、ｃ成
分としてベンゾトリアゾール、ベンゾチアゾール、２−
メルカプトベンゾチアゾール、２−メルカプトベンゾイ
ミダゾール、チオ尿素の群より選ばれる少なくとも一種
の腐食抑制剤成分を配合することが推奨される。しかし
て、これらｃ成分中でも、ベンゾトリアゾールは他の腐
食抑制剤成分に比較し、銅、真鍮、半田等の非鉄金属類
に対して変色防止及び腐食抑制の効果に優れている点か
ら最も好適である。このようなｃ成分の腐食抑制剤成分
の配合量は、前記ａ，ｂ成分の合量に対して０．０５〜
６重量％の範囲とするのがよく、少な過ぎては充分な腐
食抑制作用が発現せず、多過ぎてもそれ以上の腐食（酸
化）抑制作用の増加がなくコスト高になる。As the first cleaning and removing agent, benzotriazole, benzothiazole and 2-benzothiazole are used as the component c in order to more reliably suppress the oxidative corrosion of metals.
It is recommended that at least one corrosion inhibitor component selected from the group consisting of mercaptobenzothiazole, 2-mercaptobenzimidazole and thiourea be blended. Thus, among these c components, benzotriazole is the most suitable because it is superior in the effect of preventing discoloration and inhibiting corrosion of non-ferrous metals such as copper, brass and solder, as compared with other corrosion inhibitor components. is there. The compounding amount of the corrosion inhibitor component of the component c is 0.05 to 0.05 with respect to the total amount of the components a and b.
The content is preferably in the range of 6% by weight. If the amount is too small, a sufficient corrosion inhibiting effect is not exhibited, and if it is too large, the corrosion (oxidation) inhibiting effect is not further increased and the cost is increased.
【００１７】上記第一の洗浄除去剤による洗浄操作は、
有機系の半田フラックスを用いて半田付けを行った電子
部品や機械部品等を当該洗浄除去剤中に所要時間浸漬す
るだけでよく、これによって部品表面に残留しているフ
ラックス残渣が他の有機質の汚れと共に除去剤中に溶解
する。しかして、この浸漬においては、特に超音波洗浄
を採用すれば、フラックス残渣を含む汚れをより確実に
短時間で溶解除去できる。また、この浸漬後に水洗を行
うことにより、汚れを含む当該洗浄除去剤を部品表面か
ら完全に取り除くことができる。なお、この第一の洗浄
除去剤は、前記ａ，ｂ，ｃ成分に水を加えた希釈液形態
をも包含するが、希釈した分だけ洗浄性が低下すること
になる。The cleaning operation using the first cleaning and removing agent is as follows:
It is only necessary to immerse electronic parts and machine parts, etc., which have been soldered using an organic solder flux, in the cleaning and removing agent for a required time. It dissolves in the remover together with the stain. Thus, in this immersion, particularly when ultrasonic cleaning is adopted, the dirt including the flux residue can be more reliably dissolved and removed in a short time. In addition, by performing water washing after this immersion, the cleaning and removing agent including dirt can be completely removed from the component surface. The first cleaning and removing agent also includes a diluent in which water is added to the components a, b, and c, but the cleaning property is reduced by an amount corresponding to the dilution.
【００１８】本発明の第二の洗浄除去剤は、前記第一の
洗浄除去剤に用いたａ成分の３−メトキシ・３−メチル
・１−ブタノールと、ｄ）水溶性チオグリコール酸塩と
を必須成分として含むものであり、前記の半田フラック
ス残渣や油脂等の有機系の汚れの溶解除去に加えて、
ａ，ｄ両成分の協働によって金属表面の酸化皮膜も溶解
除去できるという優れた特徴を有している。また、ｄ成
分も水溶性であるため、第一の洗浄除去剤と同様に、水
洗によって前記汚れや酸化皮膜を溶解した当該洗浄除去
剤を被洗浄物の表面から容易に除去できると共に、引火
点が高く、且つａ，ｄ成分が共に低毒性であるため、取
扱い中の安全性にも優れている。The second cleaning and removing agent of the present invention comprises the component a-methoxy-3-methyl-1-butanol used in the first cleaning and removing agent and d) a water-soluble thioglycolate. Included as an essential component, in addition to dissolving and removing organic dirt such as the solder flux residue and oils and fats described above,
It has an excellent feature that an oxide film on a metal surface can be dissolved and removed by cooperation of both components a and d. In addition, since the d component is also water-soluble, it is possible to easily remove the dirt and the oxide film dissolved by water washing from the surface of the object to be cleaned, as well as the first cleaning and removing agent, as well as the flash point. , And both components a and d have low toxicity, so that they are excellent in safety during handling.
【００１９】上記ｄ成分の水溶性チオグリコール酸塩と
しては、特に制約はないが、例えば、チオグリコール酸
アンモニウム、チオグリコール酸ナトリウム、チオグリ
コール酸カリウム、チオグリコール酸モノエタノールア
ミン、チオグリコール酸ジエタノールアミン、チオグリ
コール酸トリエタノールアミン等が好適てものとして挙
げられる。そして、これらチオグリコール酸塩は、濃度
１０〜５０％程度の水溶液としてａ成分の３−メトキシ
・３−メチル・１−ブタノールに混合すればよい。The water-soluble thioglycolate salt of the component d is not particularly limited, but examples thereof include ammonium thioglycolate, sodium thioglycolate, potassium thioglycolate, monoethanolamine thioglycolate, and diethanolamine thioglycolate. And triethanolamine thioglycolate. These thioglycolates may be mixed as an aqueous solution having a concentration of about 10 to 50% with 3-methoxy-3-methyl-1-butanol as the component a.
【００２０】この第二の洗浄除去剤における上記のａ成
分とｄ成分との配合比率は、ａ成分／ｄ成分の重量比で
２７／７３〜８７／１３が範囲が好適であり、ａ成分が
少な過ぎると半田フラックス残渣を始めとする有機系の
汚れに対する溶解力が不充分になり、ｄ成分が少な過ぎ
ると金属表面の酸化皮膜の除去性が悪くなる。The compounding ratio of the component a and the component d in the second cleaning and removing agent is preferably in the range of 27/73 to 87/13 in terms of the weight ratio of the component a / d. If the amount is too small, the dissolving power for organic dirt such as solder flux residue becomes insufficient, and if the d component is too small, the removability of the oxide film on the metal surface deteriorates.
【００２１】この第二の洗浄除去剤においては、上記の
ａ，ｄ成分と共に、ｅ成分としてポリオキシエチレンア
ルキルエーテルを配合することにより、洗浄性を向上さ
せることができる。すなわち、ｅ成分は非イオン界面活
性剤であり、洗浄除去剤の表面張力を小さくして、被洗
浄物の表面に対する洗浄除去剤の濡れを良くすると共
に、有機質の汚れや酸化皮膜への洗浄除去剤の浸透性な
らびに被洗浄物表面からの溶解成分の離脱性を高め、も
ってこれらの溶解を助長する機能を果たす。In the second cleaning and removing agent, the detergency can be improved by blending a polyoxyethylene alkyl ether as the e component together with the a and d components described above. That is, the component e is a nonionic surfactant, which reduces the surface tension of the cleaning and removing agent, improves the wetting of the cleaning and removing agent on the surface of the object to be cleaned, and removes and removes organic dirt and oxide films. It functions to enhance the permeability of the agent and the dissociation of dissolved components from the surface of the object to be cleaned, thereby promoting their dissolution.
【００２２】このようなｅ成分のポリオキシエチレンア
ルキルエーテルとしては、特に制約はないが、第二級ア
ルコールにエチレンオキサイドの７〜１５モルが付加し
たものが最も優れた洗浄効果を示すものとして推奨され
る。しかして、ｅ成分の配合量は、洗浄除去剤全量中の
０．１〜１０重量％を占める範囲が好ましく、少な過ぎ
ては充分な効果が得られず、逆に多過ぎても無駄になる
だけでより以上の効果は得られない。The polyoxyethylene alkyl ether of the component e is not particularly limited, but those obtained by adding 7 to 15 moles of ethylene oxide to a secondary alcohol are recommended as those exhibiting the best cleaning effect. Is done. However, the compounding amount of the e component is preferably in the range of 0.1 to 10% by weight in the total amount of the cleaning and removing agent. If the amount is too small, a sufficient effect cannot be obtained. No further effect can be obtained with just the above.
【００２３】また、第二の洗浄除去剤においては、ａ，
ｄ成分と共に、ｆ成分として水溶性クエン酸塩を配合す
ることが推奨される。この水溶性クエン酸塩は、前記ｅ
成分と同様に非洗浄物の表面に対する洗浄除去剤の濡れ
をよくし、また有機質の汚れや酸化皮膜への洗浄除去剤
の浸透性を高め、これらの溶解を助長する機能に加え、
洗浄除去剤の経時的なＰＨ変動を抑えるＰＨ緩衝剤とし
ての機能を発揮し、洗浄除去剤の保管・管理を容易にす
るという利点がある。In the second cleaning and removing agent, a,
It is recommended to incorporate a water-soluble citrate as the f component together with the d component. This water-soluble citrate is e
In addition to the function of improving the wettability of the cleaning remover on the surface of the non-cleaning material as well as the components, increasing the permeability of the cleaning remover to organic dirt and oxide film, and promoting the dissolution of these,
There is an advantage that it functions as a PH buffer that suppresses a temporal variation of the pH of the cleaning / removing agent, and facilitates storage and management of the cleaning / removing agent.
【００２４】このようなｆ成分の水溶性クエン酸塩とし
ては、例えばクエン酸アンモニウム、クエン酸ナトリウ
ム、クエン酸カリウム、クエン酸モノエタノールアミ
ン、クエン酸ジエタノールアミン、クエン酸トリエタノ
ールアミン等が挙げられる。しかして、このｆ成分の配
合量は、洗浄除去剤全量中の０．７〜１０重量％を占め
る範囲が好ましく、少な過ぎては充分な効果が得られ
ず、逆に多過ぎてもＰＨ緩衝作用に寄与しない上に半田
フラックス残渣等の有機質の汚れの溶解性を却って低下
させることになる。Examples of the water-soluble citrate of the component f include ammonium citrate, sodium citrate, potassium citrate, monoethanolamine citrate, diethanolamine citrate, triethanolamine citrate and the like. It is preferable that the compounding amount of the component f occupies 0.7 to 10% by weight of the total amount of the cleaning and removing agent. If the amount is too small, a sufficient effect cannot be obtained. In addition to not contributing to the function, the solubility of organic dirt such as solder flux residue is rather lowered.
【００２５】更に、第二の洗浄除去剤においては、ａ，
ｄ成分と共に、第一の洗浄除去剤に用いる既述のｃ成分
と、ｇ成分として塩酸アルキルジ（アミノエチル）グリ
シン又は／及びナトリウムアルキルジ（アミノエチル）
グリシンとを配合することが望ましい。すなわち、これ
らｃ成分及びｇ成分は、両者の併用により、当該洗浄除
去剤による金属表面の酸化皮膜除去性を高めると共に、
この酸化皮膜を除去した金属表面の再酸化を抑制する酸
化腐食防止剤として協働して機能する。ただし、ｃ成分
とｇ成分の一方のみの使用では、再酸化の抑制効果は殆
ど得られないことが判明している。Further, in the second cleaning and removing agent, a,
Along with the d component, the above-mentioned c component used for the first cleaning and removing agent, and as the g component, alkyldi (aminoethyl) glycine hydrochloride or / and sodium alkyldi (aminoethyl)
It is desirable to blend with glycine. That is, these c-component and g-component are used in combination with each other to enhance the ability of the cleaning and removing agent to remove an oxide film on the metal surface,
It functions as an oxidative corrosion inhibitor that suppresses reoxidation of the metal surface from which the oxide film has been removed. However, it has been found that the use of only one of the component c and the component g hardly provides an effect of suppressing reoxidation.
【００２６】これらｃ成分及びｇ成分の配合量は、それ
ぞれ洗浄除去剤全量中の０．７〜１０重量％を占める範
囲が好ましく、少な過ぎては充分な効果が得られず、逆
に多過ぎてもより以上の効果はなく洗浄除去剤のコスト
上昇を招くことになる。The amount of each of the components c and g is preferably 0.7 to 10% by weight based on the total amount of the cleaning and removing agent. If the amount is too small, a sufficient effect cannot be obtained. However, there is no further effect and the cost of the cleaning and removing agent is increased.
【００２７】なお、ｇ成分の塩酸アルキルジ（アミノエ
チル）グリシンは、次の一般式； 〔ＲＮＨ・（Ｃ2 Ｈ4 ＮＨ）2 ＣＨ2 ＣＯＯＨ〕・ＨＣ
ｌ で表されるものである。またナトリウムアルキルジ（ア
ミノエチル）グリシンは、次の一般式； ＲＮＨ・（Ｃ2 Ｈ4 ＮＨ）2 ＣＨ2 ＣＯＯＮａ で表されるものである。そして、上記の両化合物として
は、アルキル基（Ｒ）の炭素数が主として１２〜１４程
度のものが一般的に使用される。The alkyl di (aminoethyl) glycine hydrochloride of the g component has the following general formula: [RNH. (C 2 H 4 NH) 2 CH 2 COOH] .HC
l. In addition, sodium alkyldi (aminoethyl) glycine is represented by the following general formula: RNH. (C 2 H 4 NH) 2 CH 2 COONa. As the above both compounds, those in which the alkyl group (R) has mainly about 12 to 14 carbon atoms are generally used.
【００２８】このような第二の洗浄除去剤は、前記のよ
うに半田フラックス残渣や油脂等の有機系の汚れに対す
る溶解除去性と、金属表面の酸化皮膜に対する溶解除去
性とを併せ持つことから、半田付け後の表面に固着して
いるフラックス残渣や油脂等の有機質の汚れの除去と同
時に、電子部品の端子表面や半田表面に生成した酸化皮
膜も除去できる。しかして、この第二の洗浄除去剤は、
半田付け後の電子部品に限らず、一般的な機械部品にお
ける有機質の汚れ及び酸化皮膜の除去にも適用できるこ
とは言うまでもない。なお、酸化皮膜の除去対象となる
金属材料としては、特に制約されないが、銅、ＣｕＮｉ
（白銅）やＣｕＺｎ（黄銅＝真鍮）の如き銅合金、鉄、
銀、錫、ＳｎＰｂ（半田）等が挙げられる。As described above, such a second cleaning and removing agent has both dissolving and removing properties for organic stains such as solder flux residues and oils and fats, and dissolving and removing properties for oxide films on metal surfaces. At the same time as the removal of organic residues such as flux residues and oils and fats adhered to the surface after soldering, the oxide film formed on the terminal surface of the electronic component and the solder surface can be removed. Thus, this second cleaning remover
It goes without saying that the present invention can be applied not only to electronic components after soldering but also to removal of organic dirt and oxide films in general mechanical components. The metal material from which the oxide film is to be removed is not particularly limited, but copper, CuNi
Copper alloys such as (white copper) and CuZn (brass = brass), iron,
Silver, tin, SnPb (solder) and the like can be mentioned.
【００２９】なお、このような第二の洗浄除去剤による
洗浄においても、前記第一の洗浄除去剤の場合と同様に
超音波洗浄等を採用することにより、有機質の汚れ及び
酸化皮膜の除去性が向上する。また、第一及び第二の洗
浄除去剤共に、液のＰＨは５．１〜８．９の範囲に設定
するのがよい。すなわち、第一の洗浄除去剤では、上記
ＰＨ範囲に設定することにより、洗浄処理中における被
洗浄物の金属表面の酸化腐食をより確実に防止できる。
また第二の洗浄除去剤では、上記ＰＨ範囲のものを使用
して金属表面の酸化皮膜を除去処理した場合、この除去
後の金属表面への酸化皮膜の再生を効果的に防止できる
が、ＰＨが上記範囲を外れるものを用いて酸化皮膜の除
去処理をおこなった場合、酸化皮膜の再生を抑制する効
果が低くなることが判明している。しかして、このＰＨ
は、各洗浄除去剤における配合成分の種類と量的関係の
調整によって経験的に設定すればよい。In the cleaning with the second cleaning and removing agent, the removal of organic dirt and oxide film can be achieved by employing ultrasonic cleaning or the like as in the case of the first cleaning and removing agent. Is improved. The pH of the liquid for both the first and second cleaning and removing agents is preferably set in the range of 5.1 to 8.9. That is, with the first cleaning and removing agent, by setting the pH in the above-mentioned pH range, it is possible to more reliably prevent the oxidative corrosion of the metal surface of the object to be cleaned during the cleaning process.
In the second cleaning and removing agent, when the oxide film on the metal surface is removed using the above-mentioned pH range, regeneration of the oxide film on the metal surface after the removal can be effectively prevented. It has been found that the effect of suppressing the regeneration of the oxide film decreases when the oxide film is removed using a material outside the above range. And this PH
May be set empirically by adjusting the types and quantitative relationships of the components in each cleaning and removing agent.
【００３０】[0030]
【実施例】以下、本発明を実施例によって具体的に説明
する。The present invention will be specifically described below with reference to examples.
【００３１】製造例１ ａ成分として３−メトキシ・３−メチル・１−ブタノー
ル、ｂ成分としてＮ−メチル・２−ピロリドン、ｃ成分
としてベンゾトリアゾールをそれぞれ使用し、後記表１
記載の配合比率（重量部）でステンレスタンク中に投入
して攪拌混合したのち、濾過しつつ取り出してＮｏ１〜
Ｎｏ１８の洗浄除去剤を得た。なお、これら洗浄除去剤
のＰＨはいずれも５．１〜８．９の範囲にあった。Production Example 1 3-methoxy-3-methyl-1-butanol was used as the component a, N-methyl-2-pyrrolidone as the component b, and benzotriazole as the component c.
The mixture was charged into a stainless steel tank at the indicated mixing ratio (parts by weight), stirred and mixed, and then taken out while filtering.
A cleaning remover of No. 18 was obtained. The pH of these cleaning and removing agents was in the range of 5.1 to 8.9.
【００３２】製造例２ 製造例１と同じａ，ｂ成分と、後記表１記載のｃ成分と
を同表記載の配合比率で用いた以外は、製造例１と同様
にしてＮｏ１９〜Ｎｏ２２の洗浄除去剤を得た。これら
洗浄除去剤のＰＨはいずれも５．１〜８．９の範囲にあ
った。Production Example 2 Washing of Nos. 19 to 22 was carried out in the same manner as in Production Example 1, except that the same a and b components as in Production Example 1 and the c component shown in Table 1 were used at the compounding ratio shown in the same table. A remover was obtained. The pH of these cleaning and removing agents was in the range of 5.1 to 8.9.
【００３３】製造例１及び２で得られた洗浄除去剤Ｎｏ
１〜Ｎｏ２２について、超音波洗浄機による洗浄に用い
たときのフラックス残渣の除去性と、金属に対する酸化
腐食性とをそれぞれ試験した。その結果を後記表１及び
２に示す。なお、各項目の試験方法と評価は次の通りで
ある。The cleaning remover No. obtained in Production Examples 1 and 2
With respect to No. 1 to No. 22, the removability of the flux residue when used for cleaning by an ultrasonic cleaner and the oxidative corrosion property to metal were tested. The results are shown in Tables 1 and 2 below. The test method and evaluation of each item are as follows.
【００３４】〔フラックス残渣の除去性〕銅板（２０ｍ
ｍ×７０ｍｍ×１ｍｍ）の表面にロジン系フラックスを
塗布した上で半田（Ｓｎ６０％，Ｐｂ４０％）付けを行
い、約２４時間放置したものを被洗浄物とし、この被洗
浄物を超音波洗浄機に入れた洗浄除去剤中に浸漬し、液
温を３５〜４０℃に保持して２０分間の超音波洗浄を行
う。そして、取り出した被洗浄物を純水にて５秒間すす
ぎ、イソプロピルアルコールに浸漬して脱水し、自然乾
燥させたのち、アセトンによってフラックス残渣を溶出
させ、除去試験前後の質量差よりフラックス残渣量を求
め、次の三段階で評価した。 ◎…半田フラックス残渣は全くなし △…僅かに半田フラックス残渣がある ×…半田フラックス残渣が顕著にある[Removability of flux residue] Copper plate (20 m
A rosin-based flux is applied to the surface of (m × 70 mm × 1 mm), soldered (Sn 60%, Pb 40%), and left for about 24 hours as an object to be cleaned. And immersed in a cleaning and removing agent, and ultrasonic cleaning is performed for 20 minutes while maintaining the liquid temperature at 35 to 40 ° C. Then, the object to be washed is rinsed with pure water for 5 seconds, immersed in isopropyl alcohol, dehydrated, air-dried, and the flux residue is eluted with acetone. And evaluated in the following three steps. ◎… No solder flux residue △… Slight solder flux residue ×… Solder flux residue is remarkable
【００３５】〔金属に対する酸化腐食性〕銅板、真鍮
板、圧延鋼板、半田の各々を洗浄除去剤中に浸漬し、液
温２０〜２５℃において５日間放置したのち、取り出し
て表面の酸化皮膜をオージェ電子分光法によって定量分
析し、その結果を次の３段階で評価した。 Ａ…新たな酸化皮膜なし。 Ｂ…新たな酸化皮膜が僅かに生成。 Ｃ…新たな酸化皮膜が顕著に生成。[Oxidative Corrosion to Metal] Each of a copper plate, a brass plate, a rolled steel plate, and a solder is immersed in a cleaning remover, left at a liquid temperature of 20 to 25 ° C. for 5 days, taken out, and an oxide film on the surface is removed. Quantitative analysis was performed by Auger electron spectroscopy, and the results were evaluated in the following three stages. A: No new oxide film. B: A new oxide film is slightly formed. C: A new oxide film is remarkably formed.
【００３６】[0036]
【表１】 [Table 1]
【００３７】[0037]
【表２】 [Table 2]
【００３８】表１の結果から、ａ成分とｂ成分とを含む
洗浄除去剤（Ｎｏ３〜１７）は半田付け後の銅板表面に
残留するフラックス残渣に対する溶解除去性を発揮し、
とりわけａ成分／ｂ成分の重量比が１１／８９〜９４／
６の範囲にある洗浄除去剤（Ｎｏ４〜１６）によれば該
フラックス残渣を完全に除去できることが判る。これに
対し、ａ成分を含みｂ成分を含まない洗浄除去剤（Ｎｏ
１，２）では、フラックス残渣の除去性に劣り、逆にｂ
成分を含みａ成分を含まない洗浄除去剤（Ｎｏ１８）で
は、フラックス残渣の除去性は充分であるが、金属表面
を酸化腐食するという問題を生じることが明らかであ
る。また、ａ，ｂ成分の合量に対してｃ成分のベンゾト
リアゾールを０．０５重量％以上配合（Ｎｏ５，８〜１
１，１４〜１７）することにより、金属表面に対する酸
化腐食性が抑えられるが、ａ成分に対するｂ成分の割合
が多過ぎる場合（Ｎｏ１７）は酸化腐食性の抑制効果が
充分ではないことが判る。一方、表２の結果から、ｃ成
分の腐食防止剤としてベンゾチアゾール、２−メルカプ
トベンゾチアゾール、２−メルカプトベンゾイミダゾー
ル、チオ尿素をそれぞれ使用しても、ベンゾトリアゾー
ルの使用時と同等の金属表面に対する酸化腐食性の抑制
効果が得られることが判る。From the results shown in Table 1, the cleaning and removing agents (Nos. 3 to 17) containing the component a and the component b exhibit the dissolving and removing properties for the flux residue remaining on the copper plate surface after soldering.
In particular, the weight ratio of component a / component b is 11/89 to 94 /
It can be seen that the flux residue can be completely removed by using the cleaning remover (Nos. 4 to 16) in the range of No. 6. On the other hand, a cleaning and removing agent (No.
In (1) and (2), the flux residue is inferior in removal property, and
It is clear that the cleaning remover (No 18) containing the component and not containing the component a has sufficient removability of the flux residue, but causes a problem of oxidative corrosion of the metal surface. In addition, benzotriazole of component c is blended in an amount of 0.05% by weight or more based on the total amount of components a and b (Nos. 5, 8 to 1).
1, 14 to 17), the oxidative corrosiveness on the metal surface can be suppressed. However, when the ratio of the b component to the a component is too large (No 17), the effect of suppressing the oxidative corrosiveness is not sufficient. On the other hand, from the results in Table 2, even when benzothiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and thiourea were respectively used as the corrosion inhibitor of the component c, the metal surface equivalent to that of benzotriazole was obtained. It can be seen that the effect of suppressing oxidative corrosion is obtained.
【００３９】製造例３ ａ成分として３−メトキシ・３−メチル・１−ブタノー
ル、ｄ成分としてチオグリコール酸アンモニウム、ｅ成
分としてポリオキシエチレンアルキルエーテル（第二級
アルコールにエチレンオキサイド７〜１５モルが付加し
たもの、アルキル基の炭素数１２）、ｆ成分としてクエ
ン酸アンモニウム、ｃ成分としてベンゾトリアゾール、
ｇ成分として塩酸アルキルジ（アミノエチル）グリシン
（アルキル基の炭素数１２〜１４）をそれぞれ使用し、
後記表３記載の配合比率（重量部）でステンレスタンク
中に投入して攪拌混合したのち、濾過しつつ取り出して
Ｎｏ２３〜Ｎｏ４３の洗浄除去剤を得た。なお、ｄ成分
のチオグリコール酸アンモニウムは３０％水溶液として
配合したが、表３の数値は水を除外したチオグリコール
酸アンモニウム単独の重量部である。これら洗浄除去剤
のＰＨはいずれも５．１〜８．９の範囲にあった。Production Example 3 3-methoxy-3-methyl-1-butanol as component a, ammonium thioglycolate as component d, polyoxyethylene alkyl ether as component e (7 to 15 mol of ethylene oxide in secondary alcohol Addition, an alkyl group having 12 carbon atoms, ammonium citrate as the f component, benzotriazole as the c component,
Using alkyldi (aminoethyl) glycine hydrochloride (alkyl group having 12 to 14 carbon atoms) as a g component,
The mixture was charged into a stainless steel tank at the mixing ratio (parts by weight) described in Table 3 below and stirred and mixed. Then, the mixture was taken out while being filtered to obtain No. 23 to No. 43 cleaning removers. The d-component ammonium thioglycolate was formulated as a 30% aqueous solution, but the values in Table 3 are parts by weight of ammonium thioglycolate alone excluding water. The pH of these cleaning and removing agents was in the range of 5.1 to 8.9.
【００４０】製造例４ Ｎｏ４４ではｄ成分としてチオグリコール酸ナトリウム
（３０％水溶液として配合）を、Ｎｏ４５ではｄ成分と
してチオグリコール酸ジエタノールアミンを、Ｎｏ４６
ではｅ成分としてクエン酸トリエタノールアミンを、Ｎ
ｏ４７ではｇ成分としてナトリウムアルキルジ（アミノ
エチル）グリシン（アルキル基の炭素数１２）をそれぞ
れ用い、他の使用成分は製造例３と同様とし、後記表４
記載の配合比率（重量部）により製造例３と同様にして
Ｎｏ４４〜Ｎｏ４８の洗浄除去剤を得た。これら洗浄除
去剤のＰＨはいずれも５．１〜８．９の範囲にあった。Production Example 4 In No. 44, sodium thioglycolate (mixed as a 30% aqueous solution) was used as the d component, in No. 45, diethanolamine thioglycolate was used as the d component, and in No. 46,
Then, triethanolamine citrate is used as the e component,
In o47, sodium alkyldi (aminoethyl) glycine (alkyl group having 12 carbon atoms) was used as a g component, and the other components used were the same as in Production Example 3;
The cleaning removers No. 44 to No. 48 were obtained in the same manner as in Production Example 3 according to the described mixing ratio (parts by weight). The pH of these cleaning and removing agents was in the range of 5.1 to 8.9.
【００４１】製造例３及び４で得られた洗浄除去剤Ｎｏ
２３〜Ｎｏ４７について、超音波洗浄機による洗浄に用
いたときのフラックス残渣の除去性と、金属表面の酸化
皮膜の除去性を試験した。その結果を後記表３及び４に
示す。なお、各項目の試験方法と評価は次の通りであ
る。The cleaning remover No. obtained in Production Examples 3 and 4
For Nos. 23 to No. 47, the removability of the flux residue and the removability of the oxide film on the metal surface when used for cleaning with an ultrasonic cleaner were tested. The results are shown in Tables 3 and 4 below. The test method and evaluation of each item are as follows.
【００４２】〔フラックス残渣の除去性〕銅板（２０ｍ
ｍ×７０ｍｍ×１ｍｍ）の表面にロジン系フラックスを
塗布した上で半田（Ｓｎ６０％，Ｐｂ４０％）付けを行
い、約２４時間放置したものを空気中で２００℃にて３
０分間加熱し、これを被洗浄物とした。この被洗浄物を
前記製造例１，２の洗浄除去剤による場合と同様にして
超音波洗浄を行い、次いで純水及びイソプロピルアルコ
ールによるすすぎ、脱水、乾燥、フラックス残渣の溶出
を行い、除去試験前後の質量差よりフラックス残渣量を
求め、次の三段階で評価した。 ◎…半田フラックス残渣は全くなし △…僅かに半田フラックス残渣がある ×…半田フラックス残渣が顕著にある[Removability of flux residue] Copper plate (20 m
A rosin-based flux is applied to the surface of (m × 70 mm × 1 mm), soldered (Sn 60%, Pb 40%), and left for about 24 hours.
Heating was performed for 0 minutes to obtain an object to be cleaned. The object to be cleaned is subjected to ultrasonic cleaning in the same manner as in the case of using the cleaning remover of Production Examples 1 and 2, followed by rinsing with pure water and isopropyl alcohol, dehydration, drying, and elution of flux residues. The amount of flux residue was determined from the mass difference of the above, and evaluated by the following three steps. ◎… No solder flux residue △… Slight solder flux residue ×… Solder flux residue is remarkable
【００４３】〔酸化皮膜の除去性〕半田付け後の加熱処
理前の銅板と、前記超音波洗浄を経てフラックス残渣の
溶出を行った洗浄処理後の銅板について、表面（銅と半
田）の酸化皮膜をオージェ電子分光法によって定量分析
して比較した。また真鍮板と圧延鋼板についても、加熱
処理前と空気中で２００℃にて３０分間の加熱処理後と
の酸化皮膜を同様に定量分析して比較した。その結果を
次の３段階で評価した。 ◎…加熱処理前と同等の酸化状態（加熱処理による酸化
皮膜が消滅）。 △…加熱処理前より僅かに酸化が進んでいる。 ×…加熱処理前より顕著に酸化が進んでいる。[Removability of oxide film] The oxide film on the surface (copper and solder) of the copper plate before the heat treatment after the soldering and the copper plate after the cleaning treatment in which the flux residue was eluted through the above ultrasonic cleaning. Were quantitatively analyzed by Auger electron spectroscopy and compared. Also for the brass plate and the rolled steel plate, the oxide films before and after the heat treatment at 200 ° C. for 30 minutes in air were quantitatively analyzed and compared in the same manner. The results were evaluated in the following three stages. …: Oxidized state equivalent to that before heat treatment (oxide film disappeared by heat treatment). Δ: Oxidation slightly advanced from before the heat treatment. X: Oxidation is significantly advanced from before the heat treatment.
【００４４】[0044]
【表３】 [Table 3]
【００４５】[0045]
【表４】 [Table 4]
【００４６】表３の結果から、ａ成分とｄ成分とを含む
洗浄除去剤はフラックス残渣と酸化皮膜に対する溶解除
去性を発揮することが明らかである。とりわけ、ａ成分
／ｄ成分の重量比が２７／７３〜８７／１３の範囲にあ
って、且つｅ，ｆ，ｃ，ｇ成分を各々洗浄除去剤全量中
の０．８重量％以上配合した洗浄除去剤（Ｎｏ２９，３
２，３３，３６〜３９）は、フラックス残渣及び酸化皮
膜を完全に除去できることが判る。これに対し、ｄ成分
を含みａ成分を含まない洗浄除去剤（Ｎｏ１〜３）で
は、フラックス残渣及び酸化皮膜の除去性が得られず、
逆にａ成分を含みｄ成分を含まない洗浄除去剤（Ｎｏ４
３）でも酸化皮膜の除去性は得られないこと明らかであ
る。一方、表４の結果から、ｆ，ｃ，ｇ成分の種類が異
なっても、充分なフラックス残渣及び酸化皮膜の除去性
が得られることが判る。From the results shown in Table 3, it is clear that the cleaning and removing agent containing the component a and the component d exhibits a dissolving and removing property for the flux residue and the oxide film. In particular, cleaning in which the weight ratio of the component a / d component is in the range of 27/73 to 87/13, and the components e, f, c, and g are each added in an amount of 0.8% by weight or more based on the total amount of the cleaning remover. Remover (No. 29, 3
2, 33, 36 to 39) show that the flux residue and the oxide film can be completely removed. On the other hand, in the case of the cleaning / removing agent containing the d component and not containing the a component (Nos.
Conversely, a cleaning and removing agent containing component a and not containing component d (No. 4)
It is clear that the oxide film cannot be removed even with 3). On the other hand, from the results in Table 4, it can be seen that even if the types of the f, c, and g components are different, sufficient removal of the flux residue and the oxide film can be obtained.
【００４７】[0047]
【発明の効果】請求項１の発明によれば、洗浄除去剤と
して、各種電子部品や機械部品等の半田付け後に部品表
面に固着した半田フラックス残渣及び油脂の如き有機質
の汚れを確実に除去でき、取扱い上の安全性にも優れる
ものが提供される。According to the first aspect of the present invention, as a cleaning and removing agent, organic dirt such as solder flux residues and oils and fats fixed on the surface of components after soldering various electronic components and mechanical components can be reliably removed. What is excellent in handling safety is provided.
【００４８】請求項２及び請求項３の発明によれば、上
記の洗浄除去剤として、半田フラックス残渣及び油脂の
如き有機質の汚れを確実に除去できる上、洗浄処理中に
おける被洗浄物の金属表面の酸化腐食を生じにくいもの
が提供される。According to the second and third aspects of the present invention, as the above-mentioned cleaning and removing agent, it is possible to reliably remove organic dirt such as solder flux residues and oils and fats, and to further remove the metal surface of the object to be cleaned during the cleaning process. Provided are those which are unlikely to cause oxidative corrosion.
【００４９】請求項４の発明によれば、上記の洗浄除去
剤として、半田フラックス残渣及び油脂の如き有機質の
汚れの除去性がより優れると共に、洗浄処理後の被洗浄
物の金属表面の酸化を生じにくくできるものが提供され
る。According to the fourth aspect of the present invention, the above-mentioned cleaning and removing agent is more excellent in removing organic contaminants such as solder flux residues and oils and fats, and also oxidizes the metal surface of the object to be cleaned after the cleaning treatment. What can be provided that can hardly occur is provided.
【００５０】請求項５の発明に係る洗浄方法によれば、
半田フラックス残渣及び油脂の如き有機質の汚れを効率
よく確実に除去できる。According to the cleaning method of the fifth aspect,
Organic dirt such as solder flux residues and oils and fats can be efficiently and reliably removed.
【００５１】請求項６の発明によれば、洗浄除去剤とし
て、半田フラックス残渣及び油脂の如き有機質の汚れを
確実に除去できる上、被洗浄物の金属表面の酸化皮膜も
除去でき、例えば電子部品の端子表面や半田表面に生じ
た酸化皮膜を半田フラックス残渣と同時に除去すること
を可能にし、また取扱い上の安全性にも優れるものが提
供される。According to the sixth aspect of the present invention, as a cleaning and removing agent, it is possible to reliably remove organic dirt such as solder flux residues and oils and fats, and also to remove an oxide film on a metal surface of an object to be cleaned. An oxide film formed on the surface of the terminal and the surface of the solder can be removed at the same time as the residue of the solder flux, and a product excellent in safety in handling is provided.
【００５２】請求項７及び請求項８の発明によれば、上
記の半田フラックス残渣及び油脂の如き有機質の汚れの
除去性と酸化皮膜の除去性が共により優れる洗浄除去剤
が提供される。According to the seventh and eighth aspects of the present invention, there is provided a cleaning / removing agent which is more excellent in removing organic stains such as solder flux residues and oils and fats and removing oxide films.
【００５３】請求項９の発明によれば、上記の半田フラ
ックス残渣及び油脂の如き有機質の汚れの除去性と酸化
皮膜の除去性が共により優れることに加え、安定性が高
く保管・管理が容易な洗浄除去剤が提供される。According to the ninth aspect of the present invention, the removability of organic dirt such as the above-mentioned solder flux residue and oils and fats and the removability of an oxide film are both more excellent, and the stability is high and storage / management is easy. The present invention provides a simple cleaning and removing agent.
【００５４】請求項１０の発明によれば、上記の半田フ
ラックス残渣及び油脂の如き有機質の汚れと酸化皮膜と
を完全に除去できる洗浄除去剤が提供される。According to the tenth aspect of the present invention, there is provided a cleaning / removing agent capable of completely removing an organic dirt such as the above-mentioned solder flux residue and oils and fats and an oxide film.
【００５５】請求項１１の発明によれば、上記の半田フ
ラックス残渣及び油脂の如き有機質の汚れと酸化皮膜と
を除去できる上、洗浄処理後の被洗浄物における金属表
面の再酸化を生じにくくできるものが提供される。According to the eleventh aspect of the present invention, it is possible to remove the organic flux such as the solder flux residue and the oil and fat and the oxide film, and it is possible to prevent the re-oxidation of the metal surface in the object to be cleaned after the cleaning process. Things are provided.
【００５６】請求項１２の発明に係る洗浄方法によれ
ば、半田フラックス残渣及び油脂の如き有機質の汚れと
金属表面の酸化皮膜とを効率よく確実に除去できる。According to the cleaning method of the twelfth aspect, organic dirt such as solder flux residues and oils and fats, and an oxide film on the metal surface can be efficiently and reliably removed.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 池本 浩一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 沼田 学 大阪府茨木市横江１丁目12番14号 クリー ンケミカル株式会社技術部開発課内 (72)発明者 菅野 純二 大阪府大阪市城東区成育３丁目５番19号 株式会社エイケン内 Ｆターム(参考） 4H003 BA12 DA14 DA15 DB02 EB08 EB13 EB20 EB21 ED29 ED31 ED32 FA01 FA15 FA28 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Koichi Ikemoto 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Manabu Numata 1-12-14 Yokoe, Ibaraki City, Osaka Clean Chemical Co., Ltd (72) Inventor Junji Kanno 3-5-19 Seikaiku, Joto-ku, Osaka-shi, Osaka F-term in Aiken Co., Ltd. (Reference) 4H003 BA12 DA14 DA15 DB02 EB08 EB13 EB20 EB21 ED29 ED31 ED32 FA01 FA15 FA28
Claims (12)
タノールと、ｂ）Ｎ−メチル・２−ピロリドンとを必須
成分として含有する洗浄除去剤。1. A cleaning and removing agent comprising a) 3-methoxy-3-methyl-1-butanol and b) N-methyl-2-pyrrolidone as essential components.
８９〜９４／６の範囲にある請求項１記載の洗浄除去
剤。2. The weight ratio of the component a / component b is 11 /
The cleaning and removing agent according to claim 1, wherein the cleaning agent is in the range of 89 to 94/6.
ゾトリアゾール、ベンゾチアゾール、２−メルカプトベ
ンゾチアゾール、２−メルカプトベンゾイミダゾール、
チオ尿素の群より選ばれる少なくとも一種の腐食抑制剤
成分がａ，ｂ成分の合量に対して０．０５〜６重量％の
範囲で含まれてなる請求項１又は２に記載の洗浄除去
剤。3. Along with the components a and b, c) benzotriazole, benzothiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole,
3. The cleaning and removing agent according to claim 1, wherein the at least one corrosion inhibitor component selected from the group consisting of thiourea is contained in the range of 0.05 to 6% by weight based on the total amount of the components a and b. .
項１〜３のいずれかに記載の洗浄除去剤。4. The cleaning and removing agent according to claim 1, wherein the pH is in the range of 5.1 to 8.9.
浄除去剤を用いた洗浄により、半田付け後の部品表面に
残留する半田フラックス及びその変性物を除去すること
を特徴とする洗浄方法。5. A cleaning method using the cleaning and removing agent according to claim 1 to remove solder flux remaining on the surface of a component after soldering and denatured products thereof. Method.
タノールと、ｄ）水溶性チオグリコール酸塩とを必須成
分として含有する洗浄除去剤。6. A cleaning and removing agent comprising a) 3-methoxy-3-methyl-1-butanol and d) a water-soluble thioglycolate as essential components.
７３〜８７／１３の範囲にある請求項６記載の洗浄除去
剤。7. The weight ratio of the component a / d component is 27 /
7. The cleaning and removing agent according to claim 6, which is in the range of 73 to 87/13.
オキシエチレンアルキルエーテルが洗浄除去剤全量中の
０．７〜２０重量％を占める割合で含まれてなる請求項
６又は７に記載の洗浄除去剤。8. The method according to claim 6, wherein e) polyoxyethylene alkyl ether is contained together with the component a and the component d in a proportion of 0.7 to 20% by weight in the total amount of the cleaning and removing agent. Cleaning remover.
性クエン酸塩が洗浄除去剤全量中の０．７〜１０重量％
を占める割合で含まれてなる請求項６〜８のいずれかに
記載の洗浄除去剤。9. The water-soluble citrate, together with the components a and d, is present in an amount of 0.7 to 10% by weight based on the total amount of the cleaning and removing agent.
The cleaning / removing agent according to any one of claims 6 to 8, which is contained in a proportion occupying the following.
求項３記載のｃ成分の腐食抑制剤成分と、ｇ）塩酸アル
キルジ（アミノエチル）グリシン又は／及びナトリウム
アルキルジ（アミノエチル）グリシンとが、それそれ洗
浄除去剤全量中の０．７〜１０重量％を占める割合で含
まれてなる請求項６〜９のいずれかに記載の洗浄除去
剤。10. The corrosion inhibitor component of the component c according to claim 3, together with the components a and d, and g) alkyldi (aminoethyl) glycine hydrochloride or / and sodium alkyldi (aminoethyl) glycine. The cleaning / removing agent according to any one of claims 6 to 9, wherein the cleaning / removing agent is contained in a proportion of 0.7 to 10% by weight of the total amount of the cleaning / removing agent.
求項６〜１１のいずれかに記載の洗浄除去剤。11. The cleaning and removing agent according to claim 6, wherein the pH is in the range of 5.1 to 8.9.
の洗浄除去剤を用いた洗浄により、金属表面の酸化皮膜
を除去することを特徴とする洗浄方法。12. A cleaning method, wherein an oxide film on a metal surface is removed by cleaning using the cleaning remover according to any one of claims 6 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000199274A JP3499809B2 (en) | 2000-06-30 | 2000-06-30 | Cleaning remover and cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000199274A JP3499809B2 (en) | 2000-06-30 | 2000-06-30 | Cleaning remover and cleaning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002012896A true JP2002012896A (en) | 2002-01-15 |
| JP3499809B2 JP3499809B2 (en) | 2004-02-23 |
Family
ID=18697318
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000199274A Expired - Fee Related JP3499809B2 (en) | 2000-06-30 | 2000-06-30 | Cleaning remover and cleaning method |
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| Country | Link |
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| JP (1) | JP3499809B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020116534A1 (en) * | 2018-12-05 | 2020-06-11 | 花王株式会社 | Cleaning of flux residues |
| WO2022050382A1 (en) * | 2020-09-04 | 2022-03-10 | 花王株式会社 | Flux cleaning agent composition |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101796112B1 (en) * | 2016-08-24 | 2017-11-09 | 와이엠티 주식회사 | Cleaning composition for soldering flux residues |
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2000
- 2000-06-30 JP JP2000199274A patent/JP3499809B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020116534A1 (en) * | 2018-12-05 | 2020-06-11 | 花王株式会社 | Cleaning of flux residues |
| CN113165027A (en) * | 2018-12-05 | 2021-07-23 | 花王株式会社 | Cleaning of flux residue |
| WO2022050382A1 (en) * | 2020-09-04 | 2022-03-10 | 花王株式会社 | Flux cleaning agent composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3499809B2 (en) | 2004-02-23 |
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