JP2001351809A - Thick film resistor - Google Patents
Thick film resistorInfo
- Publication number
- JP2001351809A JP2001351809A JP2000167911A JP2000167911A JP2001351809A JP 2001351809 A JP2001351809 A JP 2001351809A JP 2000167911 A JP2000167911 A JP 2000167911A JP 2000167911 A JP2000167911 A JP 2000167911A JP 2001351809 A JP2001351809 A JP 2001351809A
- Authority
- JP
- Japan
- Prior art keywords
- film
- thick film
- resistance
- film resistor
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、絶縁基板の表面に
抵抗ペースト及び電極ペーストを印刷し焼成する厚膜技
術によって抵抗素子並びにその電極を形成した厚膜抵抗
器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistive element and a thick-film resistor having its electrodes formed by a thick-film technique of printing and baking a resist paste and an electrode paste on the surface of an insulating substrate.
【０００２】[0002]
【従来の技術】従来の厚膜抵抗器は、セラミック等から
成る絶縁基板の表面に酸化ルテニウム等から成る抵抗素
子と銀パラジウム合金等から成る電極を具備し、前記抵
抗素子の両端と電極の一部を重合させることによって相
互に連結し電気的導通が確保されていた。2. Description of the Related Art A conventional thick film resistor has a resistance element made of ruthenium oxide or the like and an electrode made of a silver-palladium alloy or the like on the surface of an insulating substrate made of ceramic or the like. By polymerizing the parts, they were connected to each other to ensure electrical conduction.
【０００３】[0003]
【発明が解決しようとする課題】この様な厚膜抵抗器
は、従来より前記抵抗ペースト及び電極ペーストを高温
で焼成する際に生じる材料相互の拡散が原因で抵抗器の
定数のばらつきや温度係数が大きくなるという問題を抱
えていた。しかも、抵抗値のばらつきや温度係数大とい
う傾向は抵抗素子が小型になるほど顕著となることから
高集積化に要求される小型化を妨げる要因となってい
た。又、構造上、前記抵抗素子の両端と電極の一部が重
合するということが前提となっていた為に、両者が形成
される以前に抵抗値を測定することが出来ず、後のトリ
ミング工程が不可欠となって工程を簡素化することが難
しいという欠点もあった。Conventionally, such a thick-film resistor has a problem in that the resistance constant and the temperature coefficient are varied due to the mutual diffusion of the materials generated when the resistor paste and the electrode paste are fired at a high temperature. Had the problem of becoming larger. In addition, the tendency of the resistance value to vary and the temperature coefficient to increase becomes more remarkable as the resistance element becomes smaller, which has been a factor that hinders miniaturization required for high integration. In addition, since it was premised on the structure that both ends of the resistance element and a part of the electrode overlap, the resistance value could not be measured before both were formed, and a subsequent trimming step was performed. Is indispensable, and it is difficult to simplify the process.
【０００４】本発明は、上記実情に鑑みて成されたもの
であって、抵抗素子と電極の素材間の拡散を抑え得る構
造をもった、抵抗値のばらつきが少なく温度係数の小さ
い厚膜抵抗器の提供を目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a structure capable of suppressing diffusion between materials of a resistance element and an electrode, having a small resistance value variation and a small temperature coefficient. The purpose is to provide equipment.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に成された本発明による厚膜抵抗器は、絶縁基板の表面
の中央部に抵抗膜を設けると共に、当該絶縁基板の左右
両端部に電極を設け、前記抵抗膜と電極とを双方の端面
同士の接合のみを以て連結し電気的導通を確保して成る
ことを特徴とする。In order to solve the above-mentioned problems, a thick film resistor according to the present invention is provided with a resistive film at the center of the surface of an insulating substrate and at the left and right ends of the insulating substrate. An electrode is provided, and the resistive film and the electrode are connected only by joining both end surfaces thereof to ensure electrical conduction.
【０００６】尚、抵抗膜と電極の端面とは双方が配列さ
れている方向に面した面であって相互に向き合った面で
ある。この面は必ずしも直立した面であるとは限らず、
抵抗ペーストや電極ペーストの印刷状態によっては曲面
を構成することもあるが、例え抵抗膜と電極とで部分的
な複層構造を構成したとしても厚膜抵抗器の厚みを増加
させる性質の接触のないものを指すこととする。Note that the end surfaces of the resistive film and the electrode are surfaces facing in the direction in which both are arranged, and are surfaces facing each other. This surface is not necessarily upright,
Depending on the printed state of the resistive paste and electrode paste, it may have a curved surface.However, even if a partial multilayer structure is formed by the resistive film and the electrode, the contact with the property of increasing the thickness of the thick film resistor It refers to something that does not exist.
【０００７】[0007]
【発明の実施の形態】以下、本発明による厚膜抵抗器の
実施の形態を図面に基づき説明する。図１に示す例は、
絶縁基板１の表面の中央部に抵抗膜２を設けると共に、
当該絶縁基板１の左右両端部に端子電極３を設け、前記
抵抗膜２と端子電極３とを双方の端面同士の接合のみを
以て連結し、更に、絶縁基板１の端面導通を確保する端
面電極４と、前記抵抗膜２を保護する保護膜５を形成し
たものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the thick film resistor according to the present invention will be described below with reference to the drawings. The example shown in FIG.
A resistance film 2 is provided at the center of the surface of the insulating substrate 1 and
Terminal electrodes 3 are provided at both left and right end portions of the insulating substrate 1, the resistance film 2 and the terminal electrode 3 are connected only by joining both end surfaces thereof, and furthermore, an end surface electrode 4 for ensuring conduction of the end surface of the insulating substrate 1. And a protective film 5 for protecting the resistance film 2.
【０００８】上記厚膜抵抗器の製造工程としては、図４
に示すものが挙げられる。この例では厚膜抵抗器が複数
ピース縦横に並ぶ態様と成るように縦横に走る溝６によ
って区画されたアルミナ純度９６％の絶縁基板１を用
い、銀又は銀パラジウム合金の電極ペーストを前記絶縁
基板１の表面に印刷し１５０℃下で乾燥後８５０℃で焼
成することで端子電極３を形成する。次に酸化ルテニウ
ムベースの抵抗ペーストを前記端子電極３の端面に接す
る様に印刷し１５０℃下で乾燥させ８５０℃で焼成する
ことにより抵抗膜２を形成する。FIG. 4 shows a manufacturing process of the thick film resistor.
The following are mentioned. In this example, an insulating substrate 1 having a purity of 96% is used, which is divided by grooves 6 running vertically and horizontally so that a plurality of thick film resistors are arranged vertically and horizontally. The terminal electrode 3 is formed by printing on the surface of No. 1 and drying at 150 ° C. and firing at 850 ° C. Next, a resistance paste based on ruthenium oxide is printed so as to be in contact with the end face of the terminal electrode 3, dried at 150 ° C., and baked at 850 ° C. to form the resistance film 2.
【０００９】上記抵抗膜２上に下層コート７となる硝子
ペーストを印刷し、１５０℃下で乾燥させ６００℃で焼
成した後にレーザートリミングを行い。次いで上層コー
ト８となる硝子ペーストを印刷し同じく１５０℃下で乾
燥させ６００℃で焼成して保護膜５を形成する。尚、こ
れまでの工程のうち端子電極３の形成と抵抗膜２の形成
はどちらを先に行っても良く、又、前記電極ペーストの
印刷と抵抗ペーストの印刷を終えた後に両者の焼成を同
時に行っても良い。A glass paste to be the lower coat 7 is printed on the resistive film 2, dried at 150 ° C., baked at 600 ° C., and then laser trimmed. Next, a glass paste to be the upper layer coat 8 is printed, similarly dried at 150 ° C., and baked at 600 ° C. to form the protective film 5. In the above steps, either the formation of the terminal electrode 3 or the formation of the resistance film 2 may be performed first, and after the printing of the electrode paste and the printing of the resistance paste are completed, the firing of both of them is simultaneously performed. You may go.
【００１０】以上の工程を以て厚膜抵抗器の主要部が構
成される。これらの厚膜抵抗器を単位ピース毎に分割す
る訳であるが、分割に際して端子電極３に所定の処理を
施す。即ち、厚膜抵抗器が複数ピース横並びとなった短
冊状と成るように上記工程を終えた基板９を分割し、分
割辺に沿った端面及び前記端子電極３の露出部表面に端
面電極４を前記電極ペーストを１５０℃下で乾燥させ６
００℃で焼成することにより形成する。そして、当該短
冊状の基板１０を単位ピース毎に分割し、最後に端子電
極３の露出面に対してニッケル／錫ハンダのメッキを施
して厚膜抵抗器が完成する。尚、接合面積を調整するこ
とによる抵抗値の調整や抵抗膜２と端子電極３との接合
補強を目的として図２の如く導体膜１１を被着する場合
もある。The main steps of the thick film resistor are constituted by the above steps. These thick film resistors are divided into unit pieces, and a predetermined process is applied to the terminal electrodes 3 at the time of division. That is, the substrate 9 that has been subjected to the above process is divided so that the thick film resistor becomes a strip shape in which a plurality of pieces are arranged side by side, and the end surface electrode 4 is formed on the end surface along the divided side and the exposed surface of the terminal electrode 3. The electrode paste was dried at 150 ° C.
It is formed by firing at 00 ° C. Then, the strip-shaped substrate 10 is divided into unit pieces, and finally, the exposed surface of the terminal electrode 3 is plated with nickel / tin solder to complete a thick film resistor. The conductor film 11 may be applied as shown in FIG. 2 for the purpose of adjusting the resistance value by adjusting the bonding area or reinforcing the bonding between the resistance film 2 and the terminal electrode 3.
【００１１】上記の如く製造された厚膜抵抗器の特性を
表１に基づいて考察すると、種々の抵抗帯域に推奨され
るＡ，Ｂ，Ｃ，Ｄの抵抗ペーストの何れを使用した場合
においても極めて低い温度特性が得られることが観察で
きる。尚、この表で示した０μｍから９０μｍの重なり
寸法は、端子電極３と抵抗膜２の実用範囲内の膜厚によ
っては、例え抵抗膜２と端子電極３とで部分的な複層構
造を構成したとしても厚膜抵抗器の厚みを増加させない
構成が可能と思われる範囲を選択したものであり、５μ
ｍ未満の数字は切り捨ててある。例えば、抵抗膜２の膜
厚が約１０μｍであれば重なり寸法が約１０μｍという
具合に、重なり寸法／抵抗膜厚が１００パーセント程度
以下であることが望ましい。Considering the characteristics of the thick film resistor manufactured as described above with reference to Table 1, it is clear that any of the A, B, C and D resistor pastes recommended for various resistor bands is used. It can be observed that extremely low temperature characteristics are obtained. Note that the overlapping dimension of 0 μm to 90 μm shown in this table may constitute a partial multilayer structure with the resistive film 2 and the terminal electrode 3 depending on the thickness of the terminal electrode 3 and the resistive film 2 within the practical range. Even if it does, the range which seems to be possible to increase the thickness of the thick film resistor is selected.
Numbers less than m have been truncated. For example, if the thickness of the resistance film 2 is about 10 μm, the overlap size / resistance film thickness is desirably about 100% or less such that the overlap size is about 10 μm.
【００１２】[0012]
【表１】 [Table 1]
【００１３】[0013]
【発明の効果】以上の如く本発明による厚膜抵抗器は、
抵抗ペースト及び電極ペーストを高温で焼成する際に生
じる材料相互の拡散を小さく抑え得る構造を持ち、高温
焼成も可能となるので端子電極と絶縁基板との間で十分
な接着力も確保できる。又、前記抵抗素子の両端と端子
電極の一部が完全に重合しない為に、薄型の厚膜抵抗器
を製造できる他、両者が形成される以前に抵抗値を測定
することが可能となるので、製造する抵抗器の仕様によ
ってはトリミング工程を省略し製造工程を簡素化するこ
ともできる。而して、抵抗値のばらつきが少なく、抵抗
値の温度係数が小さい小型高精度の厚膜抵抗器を比較的
安価に提供できることとなる。As described above, the thick film resistor according to the present invention has the following features.
It has a structure that can suppress the mutual diffusion of materials generated when the resistance paste and the electrode paste are fired at a high temperature, and also enables a high-temperature firing, so that a sufficient adhesive force can be secured between the terminal electrode and the insulating substrate. In addition, since both ends of the resistance element and part of the terminal electrode do not completely overlap, a thin thick film resistor can be manufactured, and the resistance value can be measured before both are formed. Depending on the specification of the resistor to be manufactured, the trimming step can be omitted and the manufacturing step can be simplified. Thus, a small and high-precision thick film resistor having a small resistance value variation and a small temperature coefficient of the resistance value can be provided at relatively low cost.
【図１】本発明による厚膜抵抗器の一例を示す断面図で
ある。FIG. 1 is a sectional view showing an example of a thick film resistor according to the present invention.
【図２】本発明による厚膜抵抗器の一例を示す断面図で
ある。FIG. 2 is a sectional view showing an example of a thick film resistor according to the present invention.
【図３】従来の厚膜抵抗器の一例を示す断面図である。FIG. 3 is a sectional view showing an example of a conventional thick film resistor.
【図４】本発明による厚膜抵抗器の製造方法の一例を示
す工程図である。FIG. 4 is a process chart showing an example of a method of manufacturing a thick film resistor according to the present invention.
１ 絶縁基板 ２ 抵抗膜 1 Insulating substrate 2 Resistive film
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E032 BA11 BB01 CA02 CC06 CC08 CC14 DA02 TA11 TB02 5E033 AA03 AA43 BA03 BC01 BE01 BH02 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E032 BA11 BB01 CA02 CC06 CC08 CC14 DA02 TA11 TB02 5E033 AA03 AA43 BA03 BC01 BE01 BH02
Claims (1)
（２）を設けると共に、当該絶縁基板（１）の左右両端
部に電極を設け、前記抵抗膜（２）と電極とを双方の端
面同士の接合のみを以て連結し電気的導通を確保して成
る厚膜抵抗器。1. A resistance film (2) is provided at the center of the surface of an insulating substrate (1), and electrodes are provided at both left and right ends of the insulating substrate (1). A thick film resistor which is connected only by joining both end surfaces to ensure electrical conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000167911A JP3708796B2 (en) | 2000-06-05 | 2000-06-05 | Thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000167911A JP3708796B2 (en) | 2000-06-05 | 2000-06-05 | Thick film resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001351809A true JP2001351809A (en) | 2001-12-21 |
| JP3708796B2 JP3708796B2 (en) | 2005-10-19 |
Family
ID=18671001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000167911A Expired - Fee Related JP3708796B2 (en) | 2000-06-05 | 2000-06-05 | Thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3708796B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324477A (en) * | 2005-05-19 | 2006-11-30 | Toppan Printing Co Ltd | Passive element-contained wiring board and its manufacturing method |
| JP2007173574A (en) * | 2005-12-22 | 2007-07-05 | Taiyosha Electric Co Ltd | Chip resistor |
-
2000
- 2000-06-05 JP JP2000167911A patent/JP3708796B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324477A (en) * | 2005-05-19 | 2006-11-30 | Toppan Printing Co Ltd | Passive element-contained wiring board and its manufacturing method |
| JP4661351B2 (en) * | 2005-05-19 | 2011-03-30 | 凸版印刷株式会社 | Passive element built-in wiring board and manufacturing method thereof |
| JP2007173574A (en) * | 2005-12-22 | 2007-07-05 | Taiyosha Electric Co Ltd | Chip resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3708796B2 (en) | 2005-10-19 |
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