JP2001298255A - Method of manufacturing thick printed board - Google Patents
Method of manufacturing thick printed boardInfo
- Publication number
- JP2001298255A JP2001298255A JP2000121081A JP2000121081A JP2001298255A JP 2001298255 A JP2001298255 A JP 2001298255A JP 2000121081 A JP2000121081 A JP 2000121081A JP 2000121081 A JP2000121081 A JP 2000121081A JP 2001298255 A JP2001298255 A JP 2001298255A
- Authority
- JP
- Japan
- Prior art keywords
- thick
- thick film
- conductor layer
- printed
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、セラミック基板の
表面に、２層以上の厚膜導体層と厚膜抵抗体を印刷・焼
成する厚膜印刷基板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thick-film printed circuit board by printing and firing two or more thick-film conductor layers and thick-film resistors on the surface of a ceramic substrate.
【０００２】[0002]
【従来の技術】例えば、ハイブリッドＩＣ基板は、セラ
ミック基板の表面に、Ｃｕ導体、Ａｇ系導体等の低融点
金属のペーストで厚膜導体を印刷して焼成した後、Ｒｕ
Ｏ2 系等のペーストで厚膜抵抗体を印刷して焼成するよ
うにしている。最近のハイブリッドＩＣ基板は、電流容
量を大きくするために、厚膜導体の厚みを従来の１０μ
ｍ前後から３０μｍ以上にすることが要求されることが
増えつつある。しかし、１回の厚膜印刷で３０μｍ以上
の厚みをつけることは困難であるため、厚膜印刷を２回
以上重ねて“厚付け”するようにしている。この際、２
層以上の厚膜導体層の印刷を先に行った後で２層以上の
厚膜導体層を同時焼成すると、厚膜導体層の剥離や亀裂
が発生するため、２層以上の厚膜導体層を同時焼成する
ことはほとんど不可能である。2. Description of the Related Art For example, a hybrid IC substrate is formed by printing a thick-film conductor on a surface of a ceramic substrate with a paste of a low-melting-point metal such as a Cu conductor or an Ag-based conductor and firing it.
The thick film resistor is printed with an O 2 -based paste or the like and fired. In recent hybrid IC substrates, in order to increase the current capacity, the thickness of the thick film conductor is reduced to the conventional 10 μm.
It is increasingly required that the thickness be about 30 m or more from around m. However, since it is difficult to provide a thickness of 30 μm or more in one thick film printing, the thick film printing is repeated “thickly” two or more times. At this time, 2
If two or more thick-film conductor layers are simultaneously fired after printing of one or more thick-film conductor layers, peeling or cracking of the thick-film conductor layers occurs, so two or more thick-film conductor layers It is almost impossible to co-fire.
【０００３】従って、例えば２層の厚膜導体層と厚膜抵
抗体を形成する場合は、図３及び図４に示すように、ま
ず、セラミック基板１１の表面に１層目の厚膜導体層１
２を印刷し、これを乾燥させて焼成する。この後、１層
目の厚膜導体層１２上に、２層目の厚膜導体層１３を印
刷し、これを乾燥させて焼成する。その後、セラミック
基板１１の表面に、厚膜抵抗体１４を１層目の厚膜導体
層１２に跨がって印刷し、これを乾燥させて焼成する。
最後に、厚膜抵抗体１４上にオーバーコートガラス（図
示せず）を印刷し、これを乾燥させて焼成する。Therefore, when forming two thick film conductor layers and a thick film resistor, for example, as shown in FIGS. 3 and 4, first, a first thick film conductor layer is formed on the surface of the ceramic substrate 11. 1
2 is printed, dried and fired. Thereafter, a second thick film conductor layer 13 is printed on the first thick film conductor layer 12, which is dried and fired. Thereafter, a thick-film resistor 14 is printed on the surface of the ceramic substrate 11 so as to straddle the first thick-film conductor layer 12, dried, and fired.
Finally, an overcoat glass (not shown) is printed on the thick film resistor 14, dried and fired.
【０００４】[0004]
【発明が解決しようとする課題】しかし、上記従来の製
造方法では、印刷を１回行う毎に、その都度、焼成する
ため、焼成回数が多くなり、生産性が低下する欠点があ
る。特に、厚膜導体層１２，１３としてＣｕ等の卑金属
を用いる場合は、焼成中に厚膜導体層１２，１３が酸化
するのを防止するために、窒素ガス等の還元雰囲気（不
活性雰囲気）中で焼成する必要があるため、焼成回数が
多くなれば、還元雰囲気の消費量や消費電力が増えて焼
成コストが高くつき、生産性の低下と相俟って、生産コ
ストが高くつくという欠点がある。しかも、厚膜抵抗体
１４を印刷する際に、図５に示すように、３０μｍ以上
の厚い厚膜導体層１２，１３の上にスクリーンマスク１
５をセットして２０μｍ前後の厚膜抵抗体１４を印刷す
るので、厚膜抵抗体１４の印刷膜厚が安定せず、抵抗値
のばらつきが大きくなるという欠点もある。However, in the above-described conventional manufacturing method, firing is performed each time printing is performed, so that firing is performed many times, so that there is a disadvantage that productivity is reduced. In particular, when a base metal such as Cu is used as the thick film conductor layers 12 and 13, a reducing atmosphere (inert atmosphere) such as nitrogen gas is used to prevent the thick film conductor layers 12 and 13 from being oxidized during firing. The disadvantage is that if the number of firings increases, the amount of power consumed in the reducing atmosphere and the power consumption increase, and firing costs increase. There is. Further, when printing the thick film resistor 14, as shown in FIG. 5, the screen mask 1 is placed on the thick film conductor layers 12 and 13 having a thickness of 30 μm or more.
Since 5 is set to print the thick film resistor 14 of about 20 μm, there is also a disadvantage that the printed film thickness of the thick film resistor 14 is not stable, and the variation of the resistance value becomes large.
【０００５】本発明はこのような事情を考慮してなされ
たものであり、従ってその目的は、セラミック基板の表
面に２層以上の厚膜導体層と厚膜抵抗体を印刷・焼成す
る際の焼成回数を少なくできて、生産性向上、焼成コス
ト低減を実現できると共に、厚膜抵抗体の抵抗値のばら
つきを少なくすることができて、品質向上も実現できる
厚膜印刷基板の製造方法を提供することにある。The present invention has been made in view of such circumstances, and accordingly, has as its object the purpose of printing and firing two or more thick-film conductor layers and thick-film resistors on the surface of a ceramic substrate. Provided is a method for manufacturing a thick-film printed circuit board that can reduce the number of firings, improve productivity and reduce firing costs, and can also reduce the variation in the resistance value of a thick-film resistor and improve quality. Is to do.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明の厚膜印刷基板の製造方法は、セラミック基
板の表面に１層目の厚膜導体層を印刷して焼成し、その
後、セラミック基板の表面に厚膜抵抗体を印刷した後
に、１層目の厚膜導体層上に２層目の厚膜導体層を印刷
し、その後、厚膜抵抗体と２層目の厚膜導体層とを同時
焼成するようにしたものである。つまり、本発明は、１
層目の厚膜導体層の印刷・焼成後に、厚膜抵抗体を印刷
することで、この厚膜抵抗体とその後に印刷する２層目
の厚膜導体層とを同時焼成できるようにしたものであ
る。これにより、焼成回数が従来よりも１回少なくな
る。しかも、１層目の厚膜導体層の焼成後に厚膜抵抗体
を印刷するため、厚膜抵抗体の印刷時にスクリーンマス
クを従来よりセラミック基板の表面に近付けて厚膜抵抗
体を印刷することができ、厚膜抵抗体の印刷膜厚のばら
つき、ひいては抵抗値のばらつきを少なくすることがで
きる。In order to achieve the above-mentioned object, a method of manufacturing a thick-film printed board according to the present invention comprises printing a first thick-film conductor layer on a surface of a ceramic substrate, firing it, After printing the thick film resistor on the surface of the ceramic substrate, a second thick film conductor layer is printed on the first thick film conductor layer, and then the thick film resistor and the second thick film The conductor layer and the conductor layer are co-fired. That is, the present invention
After printing and firing the second thick film conductor layer, the thick film resistor is printed so that this thick film resistor and the second thick film conductor layer to be printed thereafter can be fired simultaneously. It is. As a result, the number of firings is reduced by one compared to the conventional method. In addition, since the thick film resistor is printed after the first thick film conductor layer is fired, the screen mask can be made closer to the surface of the ceramic substrate to print the thick film resistor when printing the thick film resistor. As a result, it is possible to reduce variations in the printed film thickness of the thick film resistor, and furthermore, variations in the resistance value.
【０００７】[0007]
【発明の実施の形態】以下、本発明の一実施形態を図１
及び図２に基づいて説明する。まず、図２（ｃ）に基づ
いて、本実施形態の製造方法で製造した厚膜印刷基板の
構造を説明する。セラミック基板２１は、１６００℃前
後で焼成するアルミナ基板、ＡｌＮ基板等、又は、８０
０℃〜１０００℃で焼成する低温焼成セラミック基板の
いずれのセラミック基板であっても良く、また、多層基
板、単層基板のいずれであっても良い。このセラミック
基板２１の表面には、厚膜抵抗体２２を接続するための
２層の厚膜導体層２３，２４が印刷・焼成されている。
本実施形態では、厚膜導体層２３，２４は、例えばＣｕ
導体ペーストで形成されているが、Ａｇ、Ａｇ／Ｐｄ、
Ａｇ／Ｐｔ等のＡｇ系導体やＡｕ系導体等の他の低融点
金属ペーストを用いても良い。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG.
A description will be given based on FIG. First, the structure of a thick-film printed board manufactured by the manufacturing method of the present embodiment will be described with reference to FIG. The ceramic substrate 21 is an alumina substrate fired at about 1600 ° C., an AlN substrate, or the like.
The ceramic substrate may be any of low-temperature fired ceramic substrates fired at 0 ° C. to 1000 ° C., and may be any of a multilayer substrate and a single-layer substrate. On the surface of the ceramic substrate 21, two thick film conductor layers 23 and 24 for connecting the thick film resistor 22 are printed and fired.
In the present embodiment, the thick film conductor layers 23 and 24 are made of, for example, Cu.
Ag, Ag / Pd,
Other low melting point metal pastes such as Ag-based conductors such as Ag / Pt and Au-based conductors may be used.
【０００８】また、セラミック基板１１の表面には、１
層目の厚膜導体層２３に跨がって厚膜抵抗体２２が印刷
・焼成されている。この厚膜抵抗体２２は、例えばＲｕ
Ｏ2系の厚膜抵抗体ペーストで形成されている。この厚
膜抵抗体２２の表面には、オーバーコートガラス（図示
せず）が印刷・焼成され、厚膜抵抗体２２の表面がオー
バーコートガラスで覆われて保護されている。On the surface of the ceramic substrate 11, 1
The thick-film resistor 22 is printed and baked over the thick-film conductor layer 23 of the layer. This thick film resistor 22 is, for example, Ru
It is formed of an O 2 -based thick film resistor paste. An overcoat glass (not shown) is printed and fired on the surface of the thick film resistor 22, and the surface of the thick film resistor 22 is covered and protected by the overcoat glass.
【０００９】次に、上記構成の厚膜印刷基板の製造方法
を図１及び図２を用いて説明する。予め、焼成されたア
ルミナ基板等のセラミック基板２１の表面に、例えばＣ
ｕ等の低融点金属ペーストで１層目の厚膜導体層２３を
スクリーン印刷し、この厚膜導体層２３を乾燥させて焼
成する［図２（ａ）参照］。尚、セラミック基板２１が
低温焼成セラミック基板である場合には、セラミック基
板２１と１層目の厚膜導体層２３とを同時焼成するよう
にしても良い。この際、厚膜導体層２３としてＣｕ導体
を用いる場合は、酸化防止のために還元雰囲気（窒素ガ
ス）中で焼成する必要があるが、Ａｇ系導体やＡｕ系導
体を用いた場合には、酸化雰囲気（空気）中で焼成する
ことが可能である。Next, a method for manufacturing the thick film printed circuit board having the above configuration will be described with reference to FIGS. For example, a C
The first thick film conductor layer 23 is screen-printed with a low melting point metal paste such as u, and the thick film conductor layer 23 is dried and fired (see FIG. 2A). When the ceramic substrate 21 is a low-temperature fired ceramic substrate, the ceramic substrate 21 and the first thick conductor layer 23 may be fired simultaneously. At this time, when a Cu conductor is used as the thick film conductor layer 23, it is necessary to bake in a reducing atmosphere (nitrogen gas) to prevent oxidation, but when an Ag-based conductor or an Au-based conductor is used, It is possible to fire in an oxidizing atmosphere (air).
【００１０】１層目の厚膜導体層２３の焼成後、図２
（ｂ）に示すように、セラミック基板２１の表面に例え
ばＲｕＯ2 系の厚膜抵抗体２２のペーストを１層目の厚
膜導体層２３に跨がってスクリーン印刷し、これを乾燥
させる。尚、この厚膜抵抗体２２の印刷・乾燥は、必要
に応じて２回以上繰り返して、厚膜抵抗体２２を厚付け
するようにしても良い。After firing of the first thick conductor layer 23, FIG.
As shown in (b), a paste of, for example, a RuO 2 -based thick film resistor 22 is screen-printed on the surface of the ceramic substrate 21 over the first thick-film conductor layer 23 and dried. The printing and drying of the thick film resistor 22 may be repeated two or more times as necessary to thicken the thick film resistor 22.
【００１１】厚膜抵抗体２２の乾燥後、図２（ｃ）に示
すように、１層目の厚膜導体層２３の上に、１層目の厚
膜導体層２３と同じ導体ペーストで２層目の厚膜導体層
２４をスクリーン印刷し、この２層目の厚膜導体層２４
を乾燥させる。After the thick-film resistor 22 is dried, as shown in FIG. 2C, the first thick-film conductor layer 23 is coated on the first thick-film conductor layer 23 with the same conductor paste as that of the first thick-film conductor layer 23. The second thick film conductor layer 24 is screen-printed, and the second thick film conductor layer 24 is printed.
Allow to dry.
【００１２】この後、この２層目の厚膜導体層２４と厚
膜抵抗体２２とを同時焼成する。最後に、厚膜抵抗体２
２上にオーバーコートガラス（図示せず）をスクリーン
印刷し、これを乾燥させて焼成する。Thereafter, the second thick film conductor layer 24 and the thick film resistor 22 are simultaneously fired. Finally, thick film resistor 2
An overcoat glass (not shown) is screen-printed on 2 and dried and fired.
【００１３】尚、厚膜導体層を３層以上にする場合は、
２層目の厚膜導体層２４と厚膜抵抗体２２とを同時焼成
した後に、２層目の厚膜導体層２４の上に３層目の厚膜
導体層をスクリーン印刷して乾燥させ、焼成すれば良
い。When three or more thick film conductor layers are used,
After simultaneously firing the second thick film conductor layer 24 and the thick film resistor 22, the third thick film conductor layer is screen printed on the second thick film conductor layer 24 and dried. What is necessary is just to bake.
【００１４】以上説明した本実施形態の厚膜印刷基板の
製造方法によれば、セラミック基板２１の表面に、２層
の厚膜導体層２３，２４と厚膜抵抗体２２を印刷・焼成
する際に、１層目の厚膜導体層２３の印刷・焼成後に、
厚膜抵抗体２２を印刷することで、この厚膜抵抗体２２
とその後に印刷する２層目の厚膜導体層２４とを同時焼
成することが可能となり、焼成回数を従来よりも１回少
なくすることができる。これにより、生産性を向上でき
ると共に、焼成コストを低減することができ、低コスト
化の要求を満たすことができる。According to the method for manufacturing a thick-film printed board of the present embodiment described above, the two thick-film conductor layers 23 and 24 and the thick-film resistor 22 are printed and fired on the surface of the ceramic substrate 21. After printing and firing the first thick conductor layer 23,
By printing the thick film resistor 22, the thick film resistor 22 is printed.
And the second thick film conductor layer 24 to be printed thereafter can be simultaneously fired, and the number of firings can be reduced by one compared with the conventional case. As a result, productivity can be improved, firing costs can be reduced, and demand for cost reduction can be satisfied.
【００１５】しかも、１層目の厚膜導体層２３の焼成後
に厚膜抵抗体２２を印刷するため、厚膜抵抗体２２の印
刷時にスクリーンマスクを従来よりセラミック基板２１
の表面に近付けて厚膜抵抗体２２を印刷することがで
き、厚膜抵抗体２２の印刷膜厚を安定させることができ
て、抵抗値のばらつきを少なくすることができる。Moreover, since the thick-film resistor 22 is printed after the first thick-film conductor layer 23 is fired, a screen mask is conventionally used when printing the thick-film resistor 22 on the ceramic substrate 21.
The thick film resistor 22 can be printed near the surface of the thick film resistor 22, the printed film thickness of the thick film resistor 22 can be stabilized, and the variation in the resistance value can be reduced.
【００１６】本発明者は、この効果を確認するために、
本実施形態の製造方法（図１及び図２）による厚膜抵抗
体２２の抵抗値のばらつきと、従来の製造方法（図３乃
至図５）による厚膜抵抗体１４の抵抗値のばらつきを測
定したので、その測定結果を次の表１に示す。The present inventor has confirmed the effect by
The variation of the resistance value of the thick film resistor 22 according to the manufacturing method of the present embodiment (FIGS. 1 and 2) and the variation of the resistance value of the thick film resistor 14 according to the conventional manufacturing method (FIGS. 3 to 5) are measured. Table 1 shows the measurement results.
【００１７】[0017]
【表１】 [Table 1]
【００１８】この測定結果から明らかなように、従来の
製造方法では、厚膜抵抗体１４の抵抗値のばらつきの範
囲が２６〜３３ｍΩ、標準偏差が０．２１ｍΩであるに
対し、本実施形態の製造方法では、厚膜抵抗体２２の抵
抗値のばらつきの範囲が２９〜３２ｍΩ、標準偏差が
０．０６ｍΩであり、抵抗値のばらつきがかなり小さく
なることが確認された。As is apparent from the measurement results, in the conventional manufacturing method, the range of the variation in the resistance value of the thick film resistor 14 is 26 to 33 mΩ and the standard deviation is 0.21 mΩ. In the manufacturing method, the range of the variation of the resistance value of the thick film resistor 22 was 29 to 32 mΩ, and the standard deviation was 0.06 mΩ, and it was confirmed that the variation of the resistance value was considerably small.
【００１９】[0019]
【発明の効果】以上の説明から明らかなように、本発明
の厚膜印刷基板の製造方法では、セラミック基板の表面
に１層目の厚膜導体層を印刷して焼成した後、セラミッ
ク基板の表面に厚膜抵抗体を印刷し、その後、１層目の
厚膜導体層上に２層目の厚膜導体層を印刷した後、厚膜
抵抗体と２層目の厚膜導体層とを同時焼成するようにし
たので、従来の製造方法よりも焼成回数を１回少なくで
きて、生産性向上、焼成コスト低減を実現できると共
に、厚膜抵抗体の抵抗値のばらつきを少なくすることが
できて、品質向上も実現できる。As is apparent from the above description, in the method for manufacturing a thick-film printed board according to the present invention, the first thick-film conductor layer is printed on the surface of the ceramic substrate, baked, and then the ceramic substrate is printed. After printing a thick film resistor on the surface, and then printing a second thick film conductor layer on the first thick film conductor layer, the thick film resistor and the second thick film conductor layer are combined. Since simultaneous firing is performed, the number of firing times can be reduced by one compared to the conventional manufacturing method, and productivity can be improved, firing cost can be reduced, and variation in the resistance value of the thick film resistor can be reduced. Quality can be improved.
【図１】本発明の一実施形態の厚膜印刷基板の製造工程
を示す工程フローチャートFIG. 1 is a process flowchart showing a process of manufacturing a thick-film printed board according to an embodiment of the present invention.
【図２】（ａ）は１層目の厚膜導体層の印刷・焼成時の
状態を示す縦断面図、（ｂ）は厚膜抵抗体の印刷時の状
態を示す縦断面図、（ｃ）は２層目の厚膜導体層の印刷
・焼成時の状態を示す縦断面図FIG. 2A is a longitudinal sectional view showing a state of printing and firing a first thick film conductor layer, FIG. 2B is a longitudinal sectional view showing a state of printing a thick film resistor, and FIG. ) Is a longitudinal sectional view showing the state of printing and firing the second thick conductor layer.
【図３】従来の厚膜印刷基板の製造工程を示す工程フロ
ーチャートFIG. 3 is a process flowchart showing a conventional thick film printed board manufacturing process.
【図４】従来の厚膜印刷基板の製造工程を説明するため
の図であり、（ａ）は１層目の厚膜導体層の印刷・焼成
時の状態を示す縦断面図、（ｂ）は２層目の厚膜導体層
の印刷・焼成時の状態を示す縦断面図、（ｃ）は厚膜抵
抗体の印刷・焼成時の状態を示す縦断面図4A and 4B are diagrams for explaining a conventional manufacturing process of a thick-film printed board, in which FIG. 4A is a longitudinal sectional view showing a state of printing and firing a first thick-film conductor layer, and FIG. Is a vertical cross-sectional view showing the state of the second thick film conductor layer during printing and firing, and (c) is a vertical cross-sectional view showing the state of the thick film resistor during printing and firing.
【図５】従来の厚膜抵抗体の印刷時のスクリーンマスク
の状態を模式的に示す図FIG. 5 is a view schematically showing a state of a screen mask when printing a conventional thick film resistor.
２１…セラミック基板、２２…厚膜抵抗体、２３…１層
目の厚膜導体層、２４…２層目の厚膜導体層。21: ceramic substrate, 22: thick film resistor, 23: first thick film conductor layer, 24: second thick film conductor layer.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4E351 AA07 BB01 BB05 BB23 BB24 BB31 CC11 CC23 DD01 DD04 DD32 GG06 GG20 5E343 AA02 AA23 BB08 BB16 BB24 BB59 BB63 BB72 DD02 ER35 GG06 GG11 GG13 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4E351 AA07 BB01 BB05 BB23 BB24 BB31 CC11 CC23 DD01 DD04 DD32 GG06 GG20 5E343 AA02 AA23 BB08 BB16 BB24 BB59 BB63 BB72 DD02 ER35 GG06 GG11 GG13
Claims (1)
膜導体層と厚膜抵抗体を印刷・焼成する厚膜印刷基板の
製造方法において、 前記セラミック基板の表面に１層目の厚膜導体層を印刷
して焼成し、その後、前記セラミック基板の表面に前記
厚膜抵抗体を印刷した後に、前記１層目の厚膜導体層上
に２層目の厚膜導体層を印刷し、その後、前記厚膜抵抗
体と前記２層目の厚膜導体層とを同時焼成することを特
徴とする厚膜印刷基板の製造方法。1. A method for manufacturing a thick-film printed board, comprising printing and firing two or more thick-film conductor layers and thick-film resistors on the surface of a ceramic substrate, wherein the first thick film is formed on the surface of the ceramic substrate. Printing and firing the conductor layer, after that, after printing the thick film resistor on the surface of the ceramic substrate, printing the second thick film conductor layer on the first thick film conductor layer, Thereafter, the method includes simultaneously firing the thick film resistor and the second thick film conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000121081A JP2001298255A (en) | 2000-04-17 | 2000-04-17 | Method of manufacturing thick printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000121081A JP2001298255A (en) | 2000-04-17 | 2000-04-17 | Method of manufacturing thick printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001298255A true JP2001298255A (en) | 2001-10-26 |
Family
ID=18631787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000121081A Pending JP2001298255A (en) | 2000-04-17 | 2000-04-17 | Method of manufacturing thick printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001298255A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005236076A (en) * | 2004-02-20 | 2005-09-02 | Toppan Printing Co Ltd | Printed wiring board with built-in element, and its production method |
| KR100642047B1 (en) | 2005-07-29 | 2006-11-10 | 전자부품연구원 | Method for processing a embedded resistor and processing pcb using the same |
| KR100850221B1 (en) * | 2006-10-23 | 2008-08-04 | 트리포드 테크놀로지 코포레이션 | Manufacturing process of passivity element of insertion type |
| JP2009164311A (en) * | 2007-12-28 | 2009-07-23 | Sumitomo Metal Electronics Devices Inc | Substrate for mounting light emitting element and manufacturing method thereof, and light emitting device using same |
| KR20110094002A (en) * | 2008-12-03 | 2011-08-19 | 일리노이즈 툴 워크스 인코포레이티드 | Combination seat heater and occupant sensor antenna |
-
2000
- 2000-04-17 JP JP2000121081A patent/JP2001298255A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005236076A (en) * | 2004-02-20 | 2005-09-02 | Toppan Printing Co Ltd | Printed wiring board with built-in element, and its production method |
| JP4539109B2 (en) * | 2004-02-20 | 2010-09-08 | 凸版印刷株式会社 | Manufacturing method of printed wiring board with built-in element |
| KR100642047B1 (en) | 2005-07-29 | 2006-11-10 | 전자부품연구원 | Method for processing a embedded resistor and processing pcb using the same |
| KR100850221B1 (en) * | 2006-10-23 | 2008-08-04 | 트리포드 테크놀로지 코포레이션 | Manufacturing process of passivity element of insertion type |
| JP2009164311A (en) * | 2007-12-28 | 2009-07-23 | Sumitomo Metal Electronics Devices Inc | Substrate for mounting light emitting element and manufacturing method thereof, and light emitting device using same |
| KR20110094002A (en) * | 2008-12-03 | 2011-08-19 | 일리노이즈 툴 워크스 인코포레이티드 | Combination seat heater and occupant sensor antenna |
| KR101682206B1 (en) | 2008-12-03 | 2016-12-12 | 일리노이즈 툴 워크스 인코포레이티드 | Combination seat heater and occupant sensor antenna |
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