JP2001259991A - Wire for wire saw - Google Patents
Wire for wire sawInfo
- Publication number
- JP2001259991A JP2001259991A JP2000072022A JP2000072022A JP2001259991A JP 2001259991 A JP2001259991 A JP 2001259991A JP 2000072022 A JP2000072022 A JP 2000072022A JP 2000072022 A JP2000072022 A JP 2000072022A JP 2001259991 A JP2001259991 A JP 2001259991A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- cutting
- yield point
- habit
- saw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、シリコン、太陽
電池等の硬質材料の切断、スライスに用いられるワイヤ
ソー用のワイヤに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire for a wire saw used for cutting and slicing hard materials such as silicon and solar cells.
【０００２】[0002]
【従来の技術とその課題】ワイヤソーは、複数の溝ロー
ラに所定のピッチでワイヤを巻き掛けたワイヤ列を走行
させ、このワイヤ列に被切断材（ワーク）を押し付けな
がら、ワイヤ列とワークとの間に砥液を注ぎつつ、砥粒
の研削作用により、ワークを多数のウエハに切断する装
置である。2. Description of the Related Art In a wire saw, a wire row in which a wire is wound around a plurality of groove rollers at a predetermined pitch is run, and while a material to be cut (work) is pressed against the wire row, the wire row and the work are joined together. This is an apparatus that cuts a work into a large number of wafers by a grinding action of abrasive grains while pouring an abrasive liquid during the process.
【０００３】ところで、このようなワイヤソーに使用さ
れるワイヤに求められる特性としては、切断工程におい
てワイヤのフリーコイル径やねじれ、うねりといった線
癖が変化しないということが重要である。切断後、フリ
ーコイル径が初期よりも小さくなったり、ワイヤに微小
な波（うねり）といった悪い線癖が付くと、スライス面
の精度を著しく低下させるという問題が生じる。Meanwhile, as a characteristic required for a wire used in such a wire saw, it is important that a wire habit such as a free coil diameter, twist, and undulation does not change in the cutting process. After the cutting, if the free coil diameter becomes smaller than the initial value or if the wire has a bad habit such as a minute wave (undulation), there arises a problem that the accuracy of the slice surface is significantly reduced.
【０００４】そこで、この発明は、切断後においても、
良好な線癖を保持するワイヤソー用ワイヤを提供しよう
とするものである。[0004] Therefore, the present invention, even after cutting,
An object of the present invention is to provide a wire for a wire saw that maintains a good wire habit.
【０００５】[0005]
【課題を解決するための手段】この発明は、シリコン、
太陽電池等の硬質材料の切断、スライスに使用されるワ
イヤソー用ワイヤにおいて、降伏点が引張り強さの９０
％以上、好ましくは９５％以上に規定したことを特徴と
するものである。SUMMARY OF THE INVENTION The present invention is directed to silicon,
In a wire for a wire saw used for cutting and slicing a hard material such as a solar cell, the yield point has a tensile strength of 90%.
% Or more, preferably 95% or more.
【０００６】高い降伏点を有するワイヤは、切断加工に
よる線癖の変化が少なく、降伏比（＝降伏点／引張り強
さ）を９０％以上にすることにより、切断後もワイヤの
線癖を良好に保持することができる。[0006] A wire having a high yield point has a small change in line habit due to the cutting process, and has a yield ratio (= yield point / tensile strength) of 90% or more, so that the wire habit is good even after cutting. Can be held.
【０００７】高い降伏点は、伸線加工時の温度調整、伸
線時のダイス形状や逆張力等の伸線加工条件を調整する
ことによって、得ることができる。[0007] A high yield point can be obtained by adjusting the temperature during wire drawing and the wire drawing conditions such as the die shape and reverse tension during wire drawing.
【０００８】また、ワイヤソー用ワイヤとして、好まし
い引張り強さは、３２００ＭＰａ以上である。[0008] The preferred tensile strength of the wire for a wire saw is 3200 MPa or more.
【０００９】[0009]
【発明の実施の形態】φ０．１６ｍｍのワイヤソー用ワ
イヤを、異なる伸線加工条件で、種々の降伏比（＝降伏
点／引張り強さ）を有する６種のワイヤを作製した。こ
の６種のワイヤを使用して、シリコンインゴットの切断
を行い、使用後のワイヤの線癖を評価した。表１に、引
張り強さ、降伏点、降伏比、使用後のワイヤの線癖を示
す。但し、降伏点は、０．２％永久伸びに対する荷重を
平行部の原断面積で除した値である。BEST MODE FOR CARRYING OUT THE INVENTION Six kinds of wires having various yield ratios (= yield point / tensile strength) were prepared from wire for a wire saw of φ0.16 mm under different drawing conditions. Using these six types of wires, a silicon ingot was cut, and the wire habit after use was evaluated. Table 1 shows the tensile strength, yield point, yield ratio, and wire habit after use. Here, the yield point is a value obtained by dividing the load with respect to the 0.2% permanent elongation by the original sectional area of the parallel portion.
【００１０】[0010]
【表１】 [Table 1]
【００１１】表１の通り、降伏比が９０％以下の試料Ａ
のワイヤは、使用後の線癖が悪い。一方、降伏比が９０
％以上のＢ〜Ｆのワイヤは、使用後も３００ｍｍ以上の
フリーコイル径を保持し、うねりも存在しない。特に、
降伏比が９５％以上のＤ〜Ｆのワイヤは、使用後のフリ
ーコイルがより大きく、さらに良好な線癖を有する。As shown in Table 1, Sample A having a yield ratio of 90% or less was used.
Wire has poor wire habit after use. On the other hand, the yield ratio is 90
% Or more of the BF wires maintain a free coil diameter of 300 mm or more even after use, and have no undulation. In particular,
The DF wire having a yield ratio of 95% or more has a larger free coil after use, and has a better wire habit.
【００１２】また、表１の通り、降伏点が３２００ＭＰ
ａ以下の試料Ａのワイヤは、使用後の線癖が悪い。一
方、降伏点が３２００ＭＰａ以上のＢ〜Ｆのワイヤは、
使用後の線癖が良好である。特に、降伏点が３３５０Ｍ
Ｐａ以上のＤ〜Ｆのワイヤは、使用後のフリーコイルが
より大きく、さらに良好な線癖を有する。As shown in Table 1, the yield point is 3200MP.
The wire of sample A below a has poor wire habit after use. On the other hand, the wires of BF having a yield point of 3200 MPa or more are:
Good wire habit after use. In particular, the yield point is 3350M
The wires D to F of Pa or more have a larger free coil after use, and have a better wire habit.
【００１３】以上のことから、降伏比が９０％以上、好
ましくは９５％以上であるワイヤ、もしくは降伏点が３
２００ＭＰａ以上、好ましくは３３５０ＭＰａ以上であ
るワイヤは、使用後において良好な線癖を有することが
確認できた。From the above, a wire having a yield ratio of 90% or more, preferably 95% or more, or a yield point of 3% or more.
It was confirmed that the wire having a pressure of 200 MPa or more, preferably 3350 MPa or more had a good wire habit after use.
【００１４】[0014]
【発明の効果】この発明に係るワイヤソー用ワイヤは、
使用後においても良好な線癖を保持するので、スライス
面の精度を低下させることがない。The wire for a wire saw according to the present invention comprises:
Since a good line habit is maintained even after use, the accuracy of the slice plane does not decrease.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 清水 健一 伊丹市昆陽北一丁目１番１号 住友電気工 業株式会社伊丹製作所内 (72)発明者 星間 昭人 伊丹市昆陽北一丁目１番１号 住友電気工 業株式会社伊丹製作所内 Ｆターム(参考） 3C058 AA05 AA09 CA05 CB01 DA03 DA17 3C069 AA01 BA06 BB03 CA03 EA02 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kenichi Shimizu 1-1-1, Koyokita-Kita, Itami-shi Itami Works, Sumitomo Electric Industries, Ltd. No. 1 Sumitomo Electric Industries, Ltd. Itami Works F term (reference) 3C058 AA05 AA09 CA05 CB01 DA03 DA17 3C069 AA01 BA06 BB03 CA03 EA02
Claims (3)
断、スライスに使用されるワイヤソー用ワイヤにおい
て、降伏点が、引張り強さの９０％以上に規定されてい
ることを特徴とするワイヤソー用ワイヤ。1. A wire saw wire used for cutting and slicing hard materials such as silicon and solar cells, wherein the yield point is defined to be 90% or more of the tensile strength. .
る請求項１記載のワイヤソー用ワイヤ。2. The wire for a wire saw according to claim 1, which has a tensile strength of 3200 MPa or more.
求項１又は２記載のワイヤソー用ワイヤ。3. The wire for a wire saw according to claim 1, which has a yield point of 3200 MPa or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000072022A JP2001259991A (en) | 2000-03-15 | 2000-03-15 | Wire for wire saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000072022A JP2001259991A (en) | 2000-03-15 | 2000-03-15 | Wire for wire saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001259991A true JP2001259991A (en) | 2001-09-25 |
Family
ID=18590497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000072022A Pending JP2001259991A (en) | 2000-03-15 | 2000-03-15 | Wire for wire saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001259991A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013176814A (en) * | 2012-02-28 | 2013-09-09 | Kanai Hiroaki | Saw wire with excellent cutting property, and method for manufacturing the same |
| DE102021121134A1 (en) | 2021-08-13 | 2023-02-16 | voestalpine Wire Rod Austria GmbH | Saw wire and method for its manufacture |
-
2000
- 2000-03-15 JP JP2000072022A patent/JP2001259991A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013176814A (en) * | 2012-02-28 | 2013-09-09 | Kanai Hiroaki | Saw wire with excellent cutting property, and method for manufacturing the same |
| DE102021121134A1 (en) | 2021-08-13 | 2023-02-16 | voestalpine Wire Rod Austria GmbH | Saw wire and method for its manufacture |
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