JP2001240756A - Curable composition - Google Patents
Curable compositionInfo
- Publication number
- JP2001240756A JP2001240756A JP2000055227A JP2000055227A JP2001240756A JP 2001240756 A JP2001240756 A JP 2001240756A JP 2000055227 A JP2000055227 A JP 2000055227A JP 2000055227 A JP2000055227 A JP 2000055227A JP 2001240756 A JP2001240756 A JP 2001240756A
- Authority
- JP
- Japan
- Prior art keywords
- component
- group
- curable composition
- present
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 38
- 150000001875 compounds Chemical class 0.000 claims abstract description 15
- 229920000620 organic polymer Polymers 0.000 claims abstract description 11
- -1 vinylsiloxane skeleton Chemical group 0.000 claims description 24
- 125000003342 alkenyl group Chemical group 0.000 claims description 16
- 239000003054 catalyst Substances 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 10
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 claims description 4
- 229920002367 Polyisobutene Polymers 0.000 claims description 3
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 abstract description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 38
- 229920000642 polymer Polymers 0.000 description 24
- 229910052697 platinum Inorganic materials 0.000 description 16
- 239000000463 material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 239000000178 monomer Substances 0.000 description 8
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 7
- 229930195734 saturated hydrocarbon Natural products 0.000 description 7
- 239000005062 Polybutadiene Substances 0.000 description 6
- 229920002857 polybutadiene Polymers 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 239000004014 plasticizer Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920001083 polybutene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- GVJHHUAWPYXKBD-UHFFFAOYSA-N (±)-α-Tocopherol Chemical compound OC1=C(C)C(C)=C2OC(CCCC(C)CCCC(C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- BVTLTBONLZSBJC-UHFFFAOYSA-N 2,4,6-tris(ethenyl)-2,4,6-trimethyl-1,3,5,2,4,6-trioxatrisilinane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O1 BVTLTBONLZSBJC-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005662 Paraffin oil Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 235000006708 antioxidants Nutrition 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical compound CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 2
- HYWCXWRMUZYRPH-UHFFFAOYSA-N trimethyl(prop-2-enyl)silane Chemical compound C[Si](C)(C)CC=C HYWCXWRMUZYRPH-UHFFFAOYSA-N 0.000 description 2
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 2
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 1
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 1
- ISBHMJZRKAFTGE-ONEGZZNKSA-N (e)-pent-2-enenitrile Chemical compound CC\C=C\C#N ISBHMJZRKAFTGE-ONEGZZNKSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- CEDCUGJMWLHFCR-UHFFFAOYSA-N 1-ethenyl-4-hex-1-enoxybenzene Chemical compound CCCCC=COC1=CC=C(C=C)C=C1 CEDCUGJMWLHFCR-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- FALCMQXTWHPRIH-UHFFFAOYSA-N 2,3-dichloroprop-1-ene Chemical compound ClCC(Cl)=C FALCMQXTWHPRIH-UHFFFAOYSA-N 0.000 description 1
- WHCIAGVVOCLXFV-UHFFFAOYSA-N 2-(1,3-benzothiazol-2-ylsulfanyl)-1,3-benzothiazole Chemical compound C1=CC=C2SC(SC=3SC4=CC=CC=C4N=3)=NC2=C1 WHCIAGVVOCLXFV-UHFFFAOYSA-N 0.000 description 1
- MHNNAWXXUZQSNM-UHFFFAOYSA-N 2-methylbut-1-ene Chemical compound CCC(C)=C MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 description 1
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 238000005727 Friedel-Crafts reaction Methods 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- UIEXFJVOIMVETD-UHFFFAOYSA-N P([O-])([O-])[O-].[Pt+3] Chemical compound P([O-])([O-])[O-].[Pt+3] UIEXFJVOIMVETD-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- WTARULDDTDQWMU-UHFFFAOYSA-N Pseudopinene Natural products C1C2C(C)(C)C1CCC2=C WTARULDDTDQWMU-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 229930003427 Vitamin E Natural products 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- CUJRVFIICFDLGR-UHFFFAOYSA-N acetylacetonate Chemical compound CC(=O)[CH-]C(C)=O CUJRVFIICFDLGR-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- XCPQUQHBVVXMRQ-UHFFFAOYSA-N alpha-Fenchene Natural products C1CC2C(=C)CC1C2(C)C XCPQUQHBVVXMRQ-UHFFFAOYSA-N 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229930006722 beta-pinene Natural products 0.000 description 1
- ZPECUSGQPIKHLT-UHFFFAOYSA-N bis(ethenyl)-dimethoxysilane Chemical compound CO[Si](OC)(C=C)C=C ZPECUSGQPIKHLT-UHFFFAOYSA-N 0.000 description 1
- QRHCILLLMDEFSD-UHFFFAOYSA-N bis(ethenyl)-dimethylsilane Chemical compound C=C[Si](C)(C)C=C QRHCILLLMDEFSD-UHFFFAOYSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000001047 cyclobutenyl group Chemical group C1(=CCC1)* 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 125000000298 cyclopropenyl group Chemical group [H]C1=C([H])C1([H])* 0.000 description 1
- STRNXFOUBFLVIN-UHFFFAOYSA-N diethyl but-2-ynedioate Chemical compound CCOC(=O)C#CC(=O)OCC STRNXFOUBFLVIN-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 1
- WERMRYHPOOABQT-UHFFFAOYSA-N dimethoxy-bis(prop-2-enyl)silane Chemical compound C=CC[Si](OC)(CC=C)OC WERMRYHPOOABQT-UHFFFAOYSA-N 0.000 description 1
- VHILMKFSCRWWIJ-UHFFFAOYSA-N dimethyl acetylenedicarboxylate Chemical compound COC(=O)C#CC(=O)OC VHILMKFSCRWWIJ-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- ZDSFBVVBFMKMRF-UHFFFAOYSA-N dimethyl-bis(prop-2-enyl)silane Chemical compound C=CC[Si](C)(C)CC=C ZDSFBVVBFMKMRF-UHFFFAOYSA-N 0.000 description 1
- XNMQEEKYCVKGBD-UHFFFAOYSA-N dimethylacetylene Natural products CC#CC XNMQEEKYCVKGBD-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- GCSJLQSCSDMKTP-UHFFFAOYSA-N ethenyl(trimethyl)silane Chemical compound C[Si](C)(C)C=C GCSJLQSCSDMKTP-UHFFFAOYSA-N 0.000 description 1
- NUFVQEIPPHHQCK-UHFFFAOYSA-N ethenyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)C=C NUFVQEIPPHHQCK-UHFFFAOYSA-N 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000002828 fuel tank Substances 0.000 description 1
- LCWMKIHBLJLORW-UHFFFAOYSA-N gamma-carene Natural products C1CC(=C)CC2C(C)(C)C21 LCWMKIHBLJLORW-UHFFFAOYSA-N 0.000 description 1
- WIGCFUFOHFEKBI-UHFFFAOYSA-N gamma-tocopherol Natural products CC(C)CCCC(C)CCCC(C)CCCC1CCC2C(C)C(O)C(C)C(C)C2O1 WIGCFUFOHFEKBI-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- PKELYQZIUROQSI-UHFFFAOYSA-N phosphane;platinum Chemical compound P.[Pt] PKELYQZIUROQSI-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- STAPBGVGYWCRTF-UHFFFAOYSA-M sodium;2-(4-chloro-2-methylphenoxy)acetate Chemical compound [Na+].CC1=CC(Cl)=CC=C1OCC([O-])=O STAPBGVGYWCRTF-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- UFHILTCGAOPTOV-UHFFFAOYSA-N tetrakis(ethenyl)silane Chemical compound C=C[Si](C=C)(C=C)C=C UFHILTCGAOPTOV-UHFFFAOYSA-N 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- OVFFWUHKSNMAOJ-UHFFFAOYSA-N tris(ethenyl)-[ethenyl(dimethyl)silyl]oxysilane Chemical compound C=C[Si](C)(C)O[Si](C=C)(C=C)C=C OVFFWUHKSNMAOJ-UHFFFAOYSA-N 0.000 description 1
- PKRKCDBTXBGLKV-UHFFFAOYSA-N tris(ethenyl)-methylsilane Chemical compound C=C[Si](C)(C=C)C=C PKRKCDBTXBGLKV-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 235000019165 vitamin E Nutrition 0.000 description 1
- 229940046009 vitamin E Drugs 0.000 description 1
- 239000011709 vitamin E Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0271—Sealing or supporting means around electrodes, matrices or membranes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/183—Sealing members
- H01M50/19—Sealing members characterised by the material
- H01M50/193—Organic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明はヒドロシリル化反応
により硬化する有機重合体において、室温でのポットラ
イフの確保が可能である硬化性組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curable composition which can secure a pot life at room temperature in an organic polymer which is cured by a hydrosilylation reaction.
【0002】[0002]
【従来の技術】分子中に少なくとも1個のアルケニル基
を有する有機重合体を分子中に2個のヒドロシリル基を
有する硬化剤で架橋する硬化性組成物が、特開平2−7
5644号、特開平3−181565号公報等に開示さ
れている。この組成物の硬化物は、優れた耐候性、耐熱
性、低透湿性等を有しており、幅広い用途への利用が期
待されている。2. Description of the Related Art A curable composition in which an organic polymer having at least one alkenyl group in a molecule is crosslinked with a curing agent having two hydrosilyl groups in a molecule is disclosed in Japanese Patent Application Laid-Open No. 2-7 / 1990.
No. 5,644, and JP-A-3-181565. The cured product of this composition has excellent weather resistance, heat resistance, low moisture permeability and the like, and is expected to be used for a wide range of applications.
【0003】しかしながら、当該硬化性組成物は、保存
温度でのポットライフと硬化温度での迅速な硬化との両
立が困難であるという問題があった。However, the curable composition has a problem that it is difficult to achieve both pot life at a storage temperature and rapid curing at a curing temperature.
【0004】[0004]
【発明が解決しようとする課題】本発明の目的は、分子
中に少なくとも1個のアルケニル基を有する有機重合体
を分子中に少なくとも2個のヒドロシリル基を有する硬
化剤で架橋する硬化性組成物において、その組成物の保
存温度でのポットライフを確保するとともに、硬化温度
での迅速な硬化を可能としたものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a curable composition for crosslinking an organic polymer having at least one alkenyl group in a molecule with a curing agent having at least two hydrosilyl groups in a molecule. In the above, the pot life at the storage temperature of the composition is ensured, and rapid curing at the curing temperature is enabled.
【0005】[0005]
【課題を解決するための手段】本発明者らは、ビニルシ
ロキサン骨格を有する化合物を添加することにより、ポ
ットライフを確保しつつ、硬化温度で迅速に硬化可能で
ある硬化性組成物を見出した。なお、本発明のビニルシ
ロキサン骨格を有する化合物とは、CH2=CH−Si
−Oで表される部分を有する化合物を表すが、具体的に
は、ケイ素原子上にビニル基を有するポリオルガノシロ
キサンであることが好ましい。Means for Solving the Problems The present inventors have found a curable composition which can be rapidly cured at a curing temperature while ensuring a pot life by adding a compound having a vinylsiloxane skeleton. . The compound having a vinylsiloxane skeleton according to the present invention refers to CH 2 CHCH—Si
It represents a compound having a moiety represented by -O, and specifically, is preferably a polyorganosiloxane having a vinyl group on a silicon atom.
【0006】すなわち、本発明は、下記の成分(A)、
(B)、(C)及び(D)を必須成分としてなる硬化性
組成物に関する。 (A)分子中に少なくとも1個のヒドロシリル化反応可
能なアルケニル基を含有する有機重合体 (B)分子中に少なくとも2個のヒドロシリル基を含有
する硬化剤 (C)ヒドロシリル化触媒 (D)下記一般式に示すようなビニルシロキサン骨格を
有する化合物That is, the present invention provides the following component (A):
The present invention relates to a curable composition containing (B), (C) and (D) as essential components. (A) an organic polymer containing at least one hydrosilyl-reactive alkenyl group in the molecule; (B) a curing agent containing at least two hydrosilyl groups in the molecule; (C) a hydrosilylation catalyst; Compound having a vinylsiloxane skeleton as shown in the general formula
【0007】[0007]
【化2】 また本発明においては、(A)成分の有機重合体がポリ
イソブチレンであることが好ましい。Embedded image In the present invention, the organic polymer as the component (A) is preferably polyisobutylene.
【0008】また本発明においては、(B)成分の硬化
剤が分子中に少なくとも2個のヒドロシリル基を含有す
るポリオルガノハイドロジェンポリシロキサンであるこ
とが好ましい。In the present invention, the curing agent of the component (B) is preferably a polyorganohydrogenpolysiloxane containing at least two hydrosilyl groups in the molecule.
【0009】また本発明においては、(D)成分のビニ
ルシロキサン骨格を有する化合物がジビニルテトラメチ
ルジシロキサン、テトラメチルテトラビニルシクロテト
ラシロキサンであることが好ましい。In the present invention, the compound having a vinylsiloxane skeleton as the component (D) is preferably divinyltetramethyldisiloxane or tetramethyltetravinylcyclotetrasiloxane.
【0010】[0010]
【発明の実施の形態】本発明に用いる(A)成分は、分
子中に少なくともヒドロシリル化反応可能な1個のアル
ケニル基を有する有機重合体である。ここで、有機重合
体とは、主鎖を構成する繰り返し単位が有機基により構
成される重合体を意味し、例えば飽和炭化水素重合体、
ポリエーテル系重合体、ポリエステル重合体、アクリル
重合体、フェノール重合体等を挙げることができるが、
これらの中で飽和炭化水素重合体が好ましい。DETAILED DESCRIPTION OF THE INVENTION The component (A) used in the present invention is an organic polymer having at least one alkenyl group capable of undergoing a hydrosilylation reaction in the molecule. Here, the organic polymer means a polymer in which the repeating unit constituting the main chain is constituted by an organic group, for example, a saturated hydrocarbon polymer,
Polyether polymers, polyester polymers, acrylic polymers, phenolic polymers and the like can be mentioned,
Of these, saturated hydrocarbon polymers are preferred.
【0011】また、ヒドロシリル化反応可能なアルケニ
ル基とは、ヒドロシリル化反応に対して活性のある炭素
−炭素2重結合を含む基であれば特に制限されるもので
はない。アルケニル基としては、ビニル基、アリル基、
メチルビニル基、プロペニル基、ブテニル基、ペンテニ
ル基、ヘキセニル基等の脂肪族不飽和炭化水素基、シク
ロプロペニル基、シクロブテニル基、シクロペンテニル
基、シクロヘキセニル基等の環式不飽和炭化水素基が挙
げられる。The alkenyl group capable of undergoing a hydrosilylation reaction is not particularly limited as long as it is a group containing a carbon-carbon double bond which is active in the hydrosilylation reaction. As the alkenyl group, a vinyl group, an allyl group,
Methyl vinyl group, propenyl group, butenyl group, pentenyl group, aliphatic unsaturated hydrocarbon group such as hexenyl group, cyclopropenyl group, cyclobutenyl group, cyclopentenyl group, cyclic unsaturated hydrocarbon group such as cyclohexenyl group and the like. Can be
【0012】本発明においては、(A)成分は、1分子
中にアルケニル基を1〜10個有することが好ましく、
1.1〜4個有することがより好ましく、1.2〜3個
有することがさらに好ましい。さらに、本発明における
(A)成分は、上記ヒドロシリル化反応可能なアルケニ
ル基を重合体末端に有するものであることが望ましい。
このようにアルケニル基が重合体末端にあるときは、最
終的に形成される硬化物の有効網目鎖量が多くなり、高
強度で高伸びのゴム状硬化物が得られやすくなるなどの
点から好ましい。(A)成分が飽和炭化水素系重合体で
ある場合、その骨格をなす重合体は、(1)エチレン、
プロピレン、1ーブテン、イソブチレンなどのような炭
素数1〜6 のオレフィン系化合物を主モノマーとして
重合させる、(2)ブタジエン、イソプレンなどのよう
なジエン系化合物を単独重合させたり、上記オレフィン
系化合物とジエン系化合物とを共重合させたりした後水
素添加する、などの方法により得ることができる。末端
に官能基を導入しやすい、分子量制御しやすい、末端官
能基の数を多くすることができるなどの点から、イソブ
チレン系重合体や水添ポリブタジエン系重合体あるいは
水添ポリイソプレン系重合体であるのが望ましい。In the present invention, the component (A) preferably has 1 to 10 alkenyl groups in one molecule,
It is more preferable to have 1.1 to 4, more preferably 1.2 to 3. Further, the component (A) in the present invention desirably has the alkenyl group capable of undergoing the hydrosilylation reaction at the polymer terminal.
As described above, when the alkenyl group is at the polymer terminal, the amount of effective network chains of the finally formed cured product increases, and a high-strength, high-elongation rubber-like cured product is easily obtained. preferable. When the component (A) is a saturated hydrocarbon polymer, the polymer constituting the skeleton is (1) ethylene,
(2) polymerizing a olefinic compound having 1 to 6 carbon atoms such as propylene, 1-butene and isobutylene as a main monomer; (2) homopolymerizing a diene-based compound such as butadiene and isoprene; Hydrogenation after copolymerization with a diene-based compound or hydrogenation can be used. Isobutylene-based polymers, hydrogenated polybutadiene-based polymers, or hydrogenated polyisoprene-based polymers can be used to easily introduce a functional group into the terminal, easily control the molecular weight, and increase the number of terminal functional groups. It is desirable to have.
【0013】前記イソブチレン系重合体は、単量体単位
のすべてがイソブチレン単位から形成されていてもよ
く、イソブチレンと共重合性を有する単量体単位をイソ
ブチレン系重合体中の好ましくは50%(重量%、以下
同様)以下、更に好ましくは30%以下、特に好ましく
は20%以下の範囲で含有してもよい。[0013] In the isobutylene-based polymer, all of the monomer units may be formed from isobutylene units, and the monomer units having copolymerizability with isobutylene are preferably 50% ( % By weight, the same applies hereinafter), more preferably 30% or less, particularly preferably 20% or less.
【0014】このような単量体成分としては、例えば炭
素数4〜12のオレフィン、ビニルエ−テル、芳香族ビ
ニル化合物、ビニルシラン類、アリルシラン類等が挙げ
られる。このような共重合体成分の具体例としては、例
えば1−ブテン、2−ブテン、2−メチル−1−ブテ
ン、3−メチル−1−ブテン、ペンテン、4−メチル−
1−ペンテン、ヘキセン、ビニルシクロヘキサン、メチ
ルビニルエ−テル、エチルビニルエ−テル、イソブチル
ビニルエ−テル、スチレン、α−メチルスチレン、ジメ
チルスチレン、p−t−ブトキシスチレン、p−ヘキセ
ニルオキシスチレン、p−アリロキシスチレン、p−ヒ
ドロキシスチレン、β−ピネン、インデン、ビニルジメ
チルメトキシシラン、ビニルトリメチルシラン、ジビニ
ルジメトキシシラン、ジビニルジメチルシラン、1,3
−ジビニル−1,1,3,3−テトラメチルジシロキサ
ン、トリビニルメチルシラン、テトラビニルシラン、ア
リルジメチルメトキシシラン、アリルトリメチルシラ
ン、ジアリルジメトキシシラン、ジアリルジメチルシラ
ン、γ−メタクリロイルオキシプロピルトリメトキシシ
ラン、γ−メタクリロイルオキシプロピルメチルジメト
キシシラン等が挙げられる。Examples of such monomer components include olefins having 4 to 12 carbon atoms, vinyl ethers, aromatic vinyl compounds, vinyl silanes, allyl silanes and the like. Specific examples of such a copolymer component include, for example, 1-butene, 2-butene, 2-methyl-1-butene, 3-methyl-1-butene, pentene, and 4-methyl-
1-pentene, hexene, vinylcyclohexane, methylvinyl ether, ethylvinyl ether, isobutylvinyl ether, styrene, α-methylstyrene, dimethylstyrene, pt-butoxystyrene, p-hexenyloxystyrene, p-allyloxy Styrene, p-hydroxystyrene, β-pinene, indene, vinyldimethylmethoxysilane, vinyltrimethylsilane, divinyldimethoxysilane, divinyldimethylsilane, 1,3
Divinyl-1,1,3,3-tetramethyldisiloxane, trivinylmethylsilane, tetravinylsilane, allyldimethylmethoxysilane, allyltrimethylsilane, diallyldimethoxysilane, diallyldimethylsilane, γ-methacryloyloxypropyltrimethoxysilane, γ-methacryloyloxypropylmethyldimethoxysilane and the like.
【0015】前記水添ポリブタジエン系重合体や他の飽
和炭化水素系重合体においても、上記イソブチレン系重
合体の場合と同様に、主成分となる単量体単位の他に、
他の単量体単位を含有させてもよい。[0015] In the hydrogenated polybutadiene-based polymer and other saturated hydrocarbon-based polymers, similarly to the case of the isobutylene-based polymer, in addition to the monomer unit as a main component,
Other monomer units may be contained.
【0016】また、本発明の(A)成分として用いる飽
和炭化水素系重合体には、本発明の目的が達成される範
囲でブタジエン、イソプレンのようなポリエン化合物の
ごとき重合後2重結合の残るような単量体単位を少量、
好ましくは10%以下の範囲で含有させてもよい。In the saturated hydrocarbon polymer used as the component (A) of the present invention, a double bond remains after polymerization, such as a polyene compound such as butadiene or isoprene, as long as the object of the present invention is achieved. A small amount of such monomer units,
Preferably, it may be contained in a range of 10% or less.
【0017】前記飽和炭化水素系重合体(好ましくはイ
ソブチレン系重合体、水添ポリイソプレンまたは水添ポ
リブタジエン系重合体)の数平均分子量(GPC法、ポ
リスチレン換算)は100000以下、更には500〜
100000程度であるのが好ましく、特に1000〜
40000程度の液状物、すなわち流動性を有するもの
であるのが取り扱いやすさなどの点から好ましい。The saturated hydrocarbon polymer (preferably an isobutylene polymer, a hydrogenated polyisoprene or a hydrogenated polybutadiene polymer) has a number average molecular weight (GPC method, calculated as polystyrene) of 100,000 or less, and more preferably 500 to 500.
It is preferably about 100,000, particularly 1000 to
A liquid substance of about 40,000, that is, a substance having fluidity is preferred from the viewpoint of easy handling.
【0018】また、本発明の(A)成分の製造方法とし
ては、特開平3ー152164や特開平7ー30490
9各公報に開示されているような、水酸基などを有する
重合体に不飽和基を有する化合物を反応させ重合体に不
飽和基を導入する方法が挙げられる。またハロゲン原子
を有する重合体に不飽和基を導入する方法としてはアル
ケニルフェニルエーテルとフリーデルクラフツ反応を行
う方法、ルイス酸存在下アリルトリメチルシランなどと
置換反応を行う方法、種々のフェノール類とフリーデル
クラフツ反応を行い水酸基を導入した上でさらに前記の
アルケニル基導入方法を併用する方法などが挙げられ
る。さらに米国特許第4316973号、特開昭63ー
105005号公報、特開平4ー288309号公報に
開示されているような単量体の重合時に不飽和基を導入
する方法も可能である。The method for producing the component (A) of the present invention is described in JP-A-3-152164 and JP-A-7-30490.
9, a method of reacting a compound having an unsaturated group with a polymer having a hydroxyl group or the like to introduce an unsaturated group into the polymer as disclosed in each of the publications. Examples of a method for introducing an unsaturated group into a polymer having a halogen atom include a method of performing a Friedel-Crafts reaction with alkenyl phenyl ether, a method of performing a substitution reaction with allyltrimethylsilane or the like in the presence of a Lewis acid, and a method of freeing various phenols. A method in which a Delft-Crafts reaction is performed to introduce a hydroxyl group, and then the above-described alkenyl group introduction method is further used in combination. Further, a method of introducing an unsaturated group during polymerization of a monomer as disclosed in U.S. Pat. No. 4,316,973, JP-A-63-105005, and JP-A-4-288309 is also possible.
【0019】本発明の(B)成分である硬化剤として
は、分子内に少なくとも2個のヒドロシリル基を含有す
るものであれば、制限はない。ここで、ヒドロシリル基
1個とはSiH基1個をさす。従って、同一Siに水素
原子が2個結合している場合はヒドロシリル基2個と計
算する。The curing agent as the component (B) of the present invention is not limited as long as it contains at least two hydrosilyl groups in the molecule. Here, one hydrosilyl group refers to one SiH group. Therefore, when two hydrogen atoms are bonded to the same Si, it is calculated as two hydrosilyl groups.
【0020】(B)成分としては、オルガノハイドロジ
ェンポリシロキサンが好ましいものの一つに挙げられ
る。ここで言うオルガノハイドロジェンポリシロキサン
とは、Si原子上に炭化水素基および水素原子を有する
ポリシロキサンを示し、その構造について具体的に示す
と、As the component (B), an organohydrogenpolysiloxane is one of preferred examples. Here, the organohydrogenpolysiloxane refers to a polysiloxane having a hydrocarbon group and a hydrogen atom on a Si atom, and when its structure is specifically shown,
【0021】[0021]
【化3】 などで示される鎖状、環状のものが挙げられる。Embedded image And the like.
【0022】上記の各種のヒドロシリル基含有基のう
ち、本発明の(B)成分であるヒドロシリル基含有硬化
剤の(A)成分などの各種有機重合体に対する相溶性が
良好である点を考慮すれば、特に下記のものが好まし
い。Among the above-mentioned various hydrosilyl group-containing groups, consideration is given to the fact that the hydrosilyl group-containing curing agent as the component (B) of the present invention has good compatibility with various organic polymers such as the component (A). In particular, the following are preferable.
【0023】[0023]
【化4】 Embedded image
【0024】[0024]
【化5】 またこれら(B)成分に含まれるヒドロシリル基の個数
については少なくとも1分子中に2個あればよいが、2
〜40個が好ましく、3〜30個がより好ましい。本発
明の組成物をヒドロシリル化反応により硬化させる場合
には、該ヒドロシリル基の個数が2より少ないと、硬化
が遅く硬化不良を起こす場合が多い。また、該ヒドロシ
リル基の個数が40より多くなると、(B)成分である
硬化剤の安定性が悪くなり、その上硬化後も多量のヒド
ロシリル基が硬化物中に残存し、ボイドやクラックの原
因となる。Embedded image The number of hydrosilyl groups contained in the component (B) may be at least two in one molecule.
-40 are preferred, and 3-30 are more preferred. In the case where the composition of the present invention is cured by a hydrosilylation reaction, if the number of the hydrosilyl groups is less than 2, curing is slow and curing failure often occurs. When the number of the hydrosilyl groups is more than 40, the stability of the curing agent (B) becomes poor, and after the curing, a large amount of the hydrosilyl groups remains in the cured product, causing voids and cracks. Becomes
【0025】また、本発明の硬化性組成物において、
(A)成分中のアルケニル基と(B)成分中のヒドロシ
リル基との比率は、通常、モル比で1:0.5〜1:5
であり、好ましくは1:0.8〜1:3であり、さらに
好ましくは1:1〜1:2.5である。Further, in the curable composition of the present invention,
The ratio of the alkenyl group in the component (A) to the hydrosilyl group in the component (B) is usually from 1: 0.5 to 1: 5 in molar ratio.
, Preferably 1: 0.8 to 1: 3, more preferably 1: 1 to 1: 2.5.
【0026】本発明の(C)成分であるヒドロシリル化
触媒については、特に制限はなく、任意のものが使用で
きる。The hydrosilylation catalyst which is the component (C) of the present invention is not particularly limited, and any catalyst can be used.
【0027】具体的に例示すれば、塩化白金酸、白金の
単体、アルミナ、シリカ、カ−ボンブラック等の担体に
固体白金を担持させたもの;白金−ビニルシロキサン錯
体{例えば、Ptn(ViMe2SiOSiMe2Vi)
n、Pt〔(MeViSiO)4〕m};白金ーホスフ
ィン錯体{例えば、Pt(PPh3)4、Pt(PB
u3)4};白金ーホスファイト錯体{例えば、Pt〔P
(OPh)3〕4、Pt〔P(OBu)3〕4(式中、Me
はメチル基、Buはブチル基、Viはビニル基、Phは
フェニル基を表し、n、mは整数を表す)、Pt(ac
ac)2、また、Ashbyらの米国特許第31596
01及び3159662号明細書中に記載された白金−
炭化水素複合体、並びにLamoreauxらの米国特
許第3220972号明細書中に記載された白金アルコ
ラ−ト触媒も挙げられる。なお、本発明の白金−ビニル
シロキサン錯体においては、白金(Pt)と配位子との
比率は、モル比で白金:配位子=1:0.2〜1:4で
あることが好ましい。More specifically, solid platinum is supported on a carrier such as chloroplatinic acid, platinum alone, alumina, silica, and carbon black; a platinum-vinylsiloxane complex {for example, Ptn (ViMe 2 SiOSiMe 2 Vi)
n, Pt [(MeViSiO) 4 ] m}; platinum-phosphine complex {for example, Pt (PPh 3 ) 4 , Pt (PB
u 3 ) 4 }; platinum-phosphite complex {for example, Pt [P
(OPh) 3 ] 4 , Pt [P (OBu) 3 ] 4 (where Me is
Represents a methyl group, Bu represents a butyl group, Vi represents a vinyl group, Ph represents a phenyl group, n and m represent integers, and Pt (ac
ac) 2 , also U.S. Pat. No. 31,596 to Ashby et al.
No. 01 and 3159662.
Also included are hydrocarbon complexes, as well as the platinum alcoholate catalyst described in Lamoreaux et al., U.S. Pat. No. 3,220,972. In the platinum-vinylsiloxane complex of the present invention, the ratio of platinum (Pt) to the ligand is preferably platinum: ligand = 1: 0.2 to 1: 4 in molar ratio.
【0028】また、白金化合物以外の触媒の例として
は、RhCl(PPh3)3、RhCl 3、Rh/Al
2O3、RuCl3、IrCl3、FeCl3、AlCl3、
PdCl2・2H2O、NiCl2、TiCl4、等が挙げ
られる。これらの触媒は単独で使用してもよく、2種以
上併用しても構わない。触媒活性の点から塩化白金酸、
白金−オレフィン錯体、白金−ビニルシロキサン錯体、
Pt(acac)2等が好ましい。触媒量としては特に
制限はないが、(A)成分中のアルケニル基1molに
対して10-1〜10-8molの範囲で用いるのがよい。
好ましくは10-2〜10-6molの範囲で用いるのがよ
い。また、ヒドロシリル化触媒は、一般に高価で腐食性
であり、また、水素ガスを大量に発生して硬化物が発泡
してしまう場合があるので10-1モル以上用いない方が
よい。本発明においては、貴金属触媒を用いたアルケニ
ル基に対するSi−H基の付加反応によって硬化性組成
物が硬化するので、硬化速度が非常に速く、ライン生産
を行う上で好都合である。Examples of catalysts other than platinum compounds include
Is RhCl (PPhThree)Three, RhCl Three, Rh / Al
TwoOThree, RuClThree, IrClThree, FeClThree, AlClThree,
PdClTwo・ 2HTwoO, NiClTwo, TiClFour, Etc.
Can be These catalysts may be used alone or in combination of two or more.
It may be used together. From the viewpoint of catalytic activity, chloroplatinic acid,
Platinum-olefin complex, platinum-vinylsiloxane complex,
Pt (acac)TwoAre preferred. Especially for the amount of catalyst
There is no limitation, but 1 mol of alkenyl group in component (A)
10 for-1-10-8It is good to use in the range of mol.
Preferably 10-2-10-6Use in the range of mol
No. Also, hydrosilylation catalysts are generally expensive and corrosive.
In addition, a large amount of hydrogen gas is generated and the cured product foams
10-1It is better not to use more than mole
Good. In the present invention, an alkane using a noble metal catalyst is used.
Curable composition by addition reaction of Si-H group to
Since the material cures, the curing speed is very fast, and line production
It is convenient in performing.
【0029】(D)成分であるビニルシロキサン骨格を
有する化合物は、特に制限はなく任意のものを使用でき
る。具体的に例示すれば、ジビニルテトラメチルジシロ
キサン(特に1,3−ジビニル−1,1,3,3−テト
ラメチルジシロキサン)、ジメチルテトラビニルジシロ
キサン(特に1,3−ジメチル−1,1,3,3−テト
ラビニルジシロキサン)、トリメチルトリビニルシクロ
トリシロキサン(特に1,3,5−トリメチル−1,
3,5−トリビニルシクロトリシロキサン)、テトラメ
チルテトラビニルシクロテトラシロキサン(特に1,
3,5,7−テトラメチル−1,3,5,7−テトラビ
ニルシクロテトラシロキサン)等があげられるが、これ
らに限定されるわけではない。The compound having a vinylsiloxane skeleton as the component (D) is not particularly limited, and any compound can be used. Specifically, divinyltetramethyldisiloxane (especially 1,3-divinyl-1,1,3,3-tetramethyldisiloxane) and dimethyltetravinyldisiloxane (especially 1,3-dimethyl-1,1) , 3,3-tetravinyldisiloxane), trimethyltrivinylcyclotrisiloxane (especially 1,3,5-trimethyl-1,
3,5-trivinylcyclotrisiloxane), tetramethyltetravinylcyclotetrasiloxane (especially 1,
3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane) and the like, but are not limited thereto.
【0030】(D)成分の使用量としては、必要とされ
る保存温度、ポットライフ時間、硬化温度、硬化時間に
より、任意に選ばれるが、通常は、使用する触媒の白金
原子モル数に対して5〜10000倍モルであり、10
〜1000倍モルであるのが好ましく、20〜500倍
モルであることがより好ましい。使用量が5倍以下であ
る場合は、組成物が室温、数分で硬化してしまい、使用
量が10000倍モル以上になってしまうと、60〜1
00℃の温度範囲で硬化させた場合、硬化しなかった
り、硬化時間が長くなってしまうという欠点がある。The amount of the component (D) used is arbitrarily selected depending on the required storage temperature, pot life time, curing temperature, and curing time. 5 to 10000-fold molar, and 10
The molar ratio is preferably from 1000 to 1000 times, more preferably from 20 to 500 times. When the used amount is 5 times or less, the composition is cured at room temperature in a few minutes, and when the used amount is 10000 times or more, 60 to 1 times.
When cured in a temperature range of 00 ° C., there are disadvantages that the composition is not cured or the curing time is long.
【0031】なお、保存温度とは、本発明の硬化性組成
物を保存するときの温度であるが、これは通常、−30
〜45℃であるが、好ましくは0〜40℃であり、より
好ましくは10〜35℃である。また、硬化温度とは、
本発明の硬化性組成物を硬化させるときの温度である
が、これは通常、50〜300℃であるが、好ましくは
55〜200℃であり、より好ましくは60〜100℃
である。なお、ポットライフとは、本発明の硬化性組成
物の保存できる期間をいう。The storage temperature is the temperature at which the curable composition of the present invention is stored, which is usually -30.
It is -45 degreeC, Preferably it is 0-40 degreeC, More preferably, it is 10-35 degreeC. The curing temperature is
The temperature at which the curable composition of the present invention is cured is usually 50 to 300 ° C, preferably 55 to 200 ° C, and more preferably 60 to 100 ° C.
It is. In addition, the pot life refers to a period during which the curable composition of the present invention can be stored.
【0032】また、本発明の硬化性組成物には、加熱硬
化型の硬化性組成物において一般的に知られている保存
改良剤を添加することができる。この保存安定性改良剤
としては、具体的には、脂肪族不飽和結合を含有する化
合物、有機リン化合物、有機硫黄化合物、窒素含有化合
物、スズ系化合物、有機過酸化物等を好適に用いること
ができる。さらに具体的には、2−ベンゾチアゾリルサ
ルファイド、ベンゾチアゾ−ル、チアゾ−ル、ジメチル
アセチレンダイカルボキシレ−ト、ジエチルアセチレン
ダイカルボキシレ−ト、BHT、ブチルヒドロキシアニ
ソ−ル、ビタミンE、2−(4−モルフォジニルジチ
オ)ベンゾチアゾ−ル、3−メチル−1−ブテン−3−
オ−ル、アセチレン性不飽和基含有オルガノシロキサ
ン、アセチレンアルコ−ル、3−メチル−1−ブチル−
3−オ−ル、ジアリルフマレ−ト、ジアリルマレ−ト、
ジエチルフマレ−ト、ジエチルマレ−ト、ジメチルマレ
−ト、2−ペンテンニトリル、2,3−ジクロロプロペ
ン等が挙げられるが、これらに限定されるわけではな
い。The curable composition of the present invention may contain a storage improver generally known for heat-curable curable compositions. As the storage stability improver, specifically, a compound containing an aliphatic unsaturated bond, an organic phosphorus compound, an organic sulfur compound, a nitrogen-containing compound, a tin compound, an organic peroxide, or the like is preferably used. Can be. More specifically, 2-benzothiazolyl sulfide, benzothiazole, thiazole, dimethylacetylene dicarboxylate, diethylacetylene dicarboxylate, BHT, butylhydroxyanisole, vitamin E, -(4-morphodinyldithio) benzothiazole, 3-methyl-1-butene-3-
Allyl, acetylenically unsaturated group-containing organosiloxane, acetylene alcohol, 3-methyl-1-butyl-
3-ol, diallyl fumarate, diallyl maleate,
Examples include, but are not limited to, diethyl fumarate, diethyl maleate, dimethyl maleate, 2-pentenenitrile, 2,3-dichloropropene, and the like.
【0033】また、本発明の硬化性組成物には、さらに
目的に応じて各種可塑剤や各種無機フィラーを添加する
ことができる。Further, various plasticizers and various inorganic fillers can be added to the curable composition of the present invention according to the purpose.
【0034】可塑剤としては、本組成物の流動性を改善
するために添加するものであり、一般的に使用されてい
る可塑剤が使用できるが、本発明に用いる飽和炭化水素
系重合体と相溶性のよいものが好ましい。可塑剤の具体
例としては、例えばポリブテン、水添ポリブテン、α−
メチルスチレンオリゴマ−、液状ポリブタジエン、水添
液状ポリブタジエン、パラフィン油、ナフテン油、アタ
クチックポリプロピレン等が挙げられるが、その中でも
好ましくは不飽和結合を含まない水添ポリブテン、水添
液状ポリブタジエン、パラフィン油、ナフテン油、アタ
クチックポリプロピレンなどの炭化水素系化合物類が好
ましい。The plasticizer is added to improve the fluidity of the present composition. Generally used plasticizers can be used, but the saturated hydrocarbon polymer used in the present invention can be used. Those having good compatibility are preferred. Specific examples of the plasticizer include, for example, polybutene, hydrogenated polybutene, α-
Methylstyrene oligomer, liquid polybutadiene, hydrogenated liquid polybutadiene, paraffin oil, naphthenic oil, atactic polypropylene and the like, among which hydrogenated polybutene preferably containing no unsaturated bond, hydrogenated liquid polybutadiene, paraffin oil, Hydrocarbon compounds such as naphthenic oil and atactic polypropylene are preferred.
【0035】またさらに、本発明の硬化性組成物には、
必要に応じてその他の充填剤、酸化防止剤、紫外線吸収
剤、顔料、界面活性剤等や硬化性組成物に接着性を付与
するために接着性付与剤を適宜添加することができる。
この充填剤の具体例としては、例えばシリカ、アルミ
ナ、炭酸カルシウム、酸化チタン、亜鉛華、硫酸バリウ
ム、クレイ、タルク等の無機化合物やポリプロピレン、
ポリエチレン、ポリアクリル酸エステル等の有機フィラ
ー等が挙げられる。また、接着性付与剤として、触媒を
不活性化しないような各種シランカップリング剤、例え
ば具体的にはエポキシ系、オレフィン系、メタクリル
系、エステル系、3級アミン系シランカップリング剤が
挙げられる。本発明の組成物の使用方法は、特に制限は
ないが、金型成型や押出成型などにより成型したものを
使用する方法と、ビード状、又は、スプレー噴霧、ロー
ル塗工等、施工時に基材上に吐出して硬化させて使用す
る方法とが例示される。Further, the curable composition of the present invention includes:
If necessary, other fillers, antioxidants, ultraviolet absorbers, pigments, surfactants, and the like, and an adhesiveness-imparting agent for imparting adhesiveness to the curable composition can be appropriately added.
Specific examples of the filler include silica, alumina, calcium carbonate, titanium oxide, zinc white, barium sulfate, clay, inorganic compounds such as talc and polypropylene,
Organic fillers such as polyethylene and polyacrylic acid ester are exemplified. Examples of the adhesion-imparting agent include various silane coupling agents that do not deactivate the catalyst, for example, epoxy-, olefin-, methacryl-, ester-, and tertiary-amine-based silane coupling agents. . The method of using the composition of the present invention is not particularly limited, and a method of using one molded by die molding or extrusion molding, and a bead, or spray spraying, roll coating, etc. And a method of discharging and hardening it above.
【0036】本発明の組成物は、シーリング材、ガスケ
ット材料、接着剤、封止材料・ポッティング材や各種コ
ーティング材、防振材料等、低透湿性、低吸湿性、低気
体透過性、耐熱性、耐候性、電気絶縁性、振動吸収性を
活かした幅広い応用分野への使用が期待できる。具体的
な用途に、特に制限はないが、たとえば、コンデンサー
やリチウム系電池、燃料電池、バッテリー、化学プラン
ト、エンジン、燃料タンク等に用いるガスケットシール
材料や、建築用シール、屋上防水や太陽電池封止等屋外
使用部材向けのガスケット材料、パイプ、電気回路封止
用ボックス、工業用缶や食品用缶やビン等の蓋用やイン
クカートリッジ等高性能インク材向け等に用いるパッキ
ング、電子回路の表面保護用コート、ICカード等カー
ド材料、燃料電池等耐薬品性が必要なアルミ製等のパッ
キング材料用の表面コーティング材料、遮音性、防振用
シート材料、機械や電気機器用ロール材料、水素、酸素
等気体が通過するパイプやジョイント部向けのシール材
料等が例示される。The composition of the present invention can be used as a sealing material, a gasket material, an adhesive, a sealing material, a potting material, various coating materials, a vibration-proof material, etc., with low moisture permeability, low moisture absorption, low gas permeability, heat resistance. It can be expected to be used in a wide range of application fields, utilizing its weather resistance, electrical insulation, and vibration absorption. Although there are no particular restrictions on specific applications, for example, gasket seal materials used for capacitors, lithium batteries, fuel cells, batteries, chemical plants, engines, fuel tanks, etc., architectural seals, rooftop waterproofing and solar cell seals Gasket materials for outdoor use such as stoppers, pipes, boxes for sealing electric circuits, lids for industrial cans, food cans, bottles, etc., packing used for high-performance ink materials such as ink cartridges, and the surface of electronic circuits Protective coats, card materials such as IC cards, surface coating materials for packing materials such as aluminum that require chemical resistance such as fuel cells, sound insulation, vibration-proof sheet materials, roll materials for machinery and electrical equipment, hydrogen, Examples thereof include a pipe through which a gas such as oxygen passes and a sealing material for a joint portion.
【0037】以下に、実施例に基づき本発明を更に詳細
に説明するが、本発明はこれらにより何ら制限を受ける
ものではない。Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto.
【0038】[0038]
【実施例】実施例1 特開昭63ー105005号公報により合成した(A)
成分である分子量約10000のアリル基末端ポリイソ
ブチレン(鐘淵化学工業(株)製、EP400A )4
0g及び(B)成分であるα-メチルスチレン変性メチ
ルハイドロジェンポリシロキサン(鐘淵化学工業(株)
製、CR100)を2g混合し、さらに可塑剤としてP
AO5004(出光石油化学製)を12g、酸化防止剤
としてMARKAO−50(アデカアーガス(株)製)
を0.4gを手混ぜで十分混合した。この配合物に、
白金ビニルシロキサン錯体触媒(8.3×10-5mmo
l/μl、3wt%キシレン溶液)を白金が(A)成分
のアルケニル基量のモル数に対して5×10-4当量、さ
らに、(D)成分のビニルシロキサン骨格をもつ化合物
として、1,3−ジビニル−1,1,3,3−テトラメ
チルジシロキサン(信越化学(株)製、商品名:LS−
7250)を白金に対して100当量となるように加え
て、手混ぜ混合した。この配合物について23℃/2時
間でのポットライフと60℃/1時間での硬化性を調べ
た。結果を表1に示す。 実施例2 (D)成分の1,3−ジビニル−1,1,3,3−テト
ラメチルジシロキサンを白金に対して200当量加えた
以外は実施例1と同様の操作を行った。結果を表1に示
す。 実施例3 (C)成分の白金ビニルシロキサン錯体を白金が(A)
成分のアルケニル基量のモル数に対して2.5×10-4
当量、(D)成分の1,3−ジビニル−1,1,3,3
−テトラメチルジシロキサンを白金に対して50当量加
えた以外は実施例1と同様の操作を行った。結果を表1
に示す。 実施例4 (C)成分の白金ビニルシロキサン錯体を白金が(A)
成分のアルケニル基量のモル数に対して1×10-3当
量、(D)成分の1,3−ジビニル−1,1,3,3−
テトラメチルジシロキサンを白金に対して100当量加
えた以外は実施例1と同様の操作を行った。結果を表1
に示す。 実施例5 (D)成分の1,3、5,7−テトラメチル−1,3,
5,7−テトラビニルシクロテトラシロキサンを白金に
対して25当量加えた以外は実施例1と同様の操作を行
った。結果を表1に示す。 実施例6 (D)成分の1,3、5,7−テトラメチル−1,3,
5,7−テトラビニルシクロテトラシロキサンを白金に
対して200当量加えた以外は実施例1と同様の操作を
行った。結果を表1に示す。 比較例 (D)成分を添加しなかった以外は、実施例1と同様の
操作を行った。結果を表1に示す。Example 1 (A) synthesized according to JP-A-63-105005
Allyl group-terminated polyisobutylene having a molecular weight of about 10,000 (EP400A, manufactured by Kaneka Corporation) 4
0 g and α-methylstyrene-modified methyl hydrogen polysiloxane as component (B) (Kanebuchi Chemical Industry Co., Ltd.)
2 g of CR100) and P as a plasticizer
12 g of AO5004 (manufactured by Idemitsu Petrochemical) and MARKAO-50 (manufactured by Adeka Argus Co., Ltd.) as an antioxidant
Was mixed thoroughly by hand. In this formulation,
Platinum vinyl siloxane complex catalyst (8.3 × 10 -5 mmol
1 / μl, 3 wt% xylene solution) as a compound having 5 × 10 −4 equivalents of platinum with respect to the number of moles of the alkenyl group in the component (A) and a vinylsiloxane skeleton in the component (D). 3-divinyl-1,1,3,3-tetramethyldisiloxane (trade name: LS-, manufactured by Shin-Etsu Chemical Co., Ltd.)
7250) was added so as to be 100 equivalents to platinum, and the mixture was mixed by hand. This composition was examined for pot life at 23 ° C./2 hours and curability at 60 ° C./1 hour. Table 1 shows the results. Example 2 The same operation as in Example 1 was carried out except that 200 equivalents of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane as the component (D) were added to platinum. Table 1 shows the results. Example 3 The platinum-vinylsiloxane complex of the component (C) was replaced with platinum (A)
2.5 × 10 -4 based on the number of moles of the alkenyl group in the component
Equivalent, 1,3-divinyl-1,1,3,3 of component (D)
-The same operation as in Example 1 was performed, except that 50 equivalents of tetramethyldisiloxane were added to platinum. Table 1 shows the results
Shown in Example 4 The platinum-vinylsiloxane complex of the component (C) was replaced with platinum (A)
1 × 10 −3 equivalents to the number of moles of the alkenyl group in the component, and 1,3-divinyl-1,1,3,3-component in the component (D)
The same operation as in Example 1 was performed, except that 100 equivalents of tetramethyldisiloxane was added to platinum. Table 1 shows the results
Shown in Example 5 Component (D) 1,3,5,7-tetramethyl-1,3,3
The same operation as in Example 1 was performed except that 25 equivalents of 5,7-tetravinylcyclotetrasiloxane were added to platinum. Table 1 shows the results. Example 6 Component (D) 1,3,5,7-tetramethyl-1,3,3
The same operation as in Example 1 was performed, except that 200 equivalents of 5,7-tetravinylcyclotetrasiloxane were added to platinum. Table 1 shows the results. Comparative Example The same operation as in Example 1 was performed except that the component (D) was not added. Table 1 shows the results.
【0039】[0039]
【表1】 [Table 1]
【0040】[0040]
【発明の効果】本発明は、実施例から明らかなように、
有機重合体を用いた付加型硬化系において、組成物のポ
ットライフを確保しつつ、硬化温度での硬化性を確保し
たものである。According to the present invention, as is apparent from the examples,
In an addition-type curing system using an organic polymer, the curability at a curing temperature is secured while ensuring the pot life of the composition.
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4J002 AC111 BB201 CP042 DA096 DE186 EC076 EX037 FD142 FD206 GJ01 GJ02 GL00 GQ00 GQ01 4J100 AA02P AA03P AA04P AA04Q AA05Q AA06P AA06Q AA07Q AA08Q AA09Q AA15Q AA16Q AA20Q AB02Q AB03Q AB07Q AE03Q AL08Q AP16Q AR10Q AS02P AS03P BA03Q BA04Q BA77Q CA01 CA04 CA31 HA03 HA62 HC13 HC77 JA01 JA03 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J002 AC111 BB201 CP042 DA096 DE186 EC076 EX037 FD142 FD206 GJ01 GJ02 GL00 GQ00 GQ01 4J100 AA02P AA03P AA04P AA04Q AA05Q AA06P AA06Q AA07 AQAQ AAQ AAQ AAQ AB03 BA03Q BA04Q BA77Q CA01 CA04 CA31 HA03 HA62 HC13 HC77 JA01 JA03
Claims (4)
(D)を必須成分としてなる硬化性組成物; (A)分子中に少なくとも1個のヒドロシリル化反応可
能なアルケニル基を含有する有機重合体 (B)分子中に少なくとも2個のヒドロシリル基を含有
する硬化剤 (C)ヒドロシリル化触媒 (D)下記一般式に示すようなビニルシロキサン骨格を
有する化合物 【化1】 1. A curable composition comprising the following components (A), (B), (C) and (D) as essential components: (A) at least one hydrosilylation-reactive alkenyl group per molecule (B) a curing agent having at least two hydrosilyl groups in a molecule (C) a hydrosilylation catalyst (D) a compound having a vinylsiloxane skeleton represented by the following general formula:
レンである請求項1記載の硬化性組成物。2. The curable composition according to claim 1, wherein the organic polymer as the component (A) is polyisobutylene.
も2個のヒドロシリル基を含有するポリオルガノハイド
ロジェンポリシロキサンである請求項1又は2いずれか
記載の硬化性組成物。3. The curable composition according to claim 1, wherein the curing agent (B) is a polyorganohydrogenpolysiloxane containing at least two hydrosilyl groups in a molecule.
する化合物がジビニルテトラメチルジシロキサン、テト
ラメチルテトラビニルシクロテトラシロキサンである請
求項1〜3記載の硬化性組成物4. The curable composition according to claim 1, wherein the component (D) having a vinylsiloxane skeleton is divinyltetramethyldisiloxane or tetramethyltetravinylcyclotetrasiloxane.
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JP2000055227A JP2001240756A (en) | 2000-03-01 | 2000-03-01 | Curable composition |
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JP2000055227A JP2001240756A (en) | 2000-03-01 | 2000-03-01 | Curable composition |
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JP2001240756A true JP2001240756A (en) | 2001-09-04 |
Family
ID=18576387
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Cited By (8)
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KR100479857B1 (en) * | 2001-12-28 | 2005-03-30 | 제일모직주식회사 | Silicon resin composition for packaging semiconductor |
KR100493335B1 (en) * | 2002-12-14 | 2005-06-07 | 제일모직주식회사 | Silicon resin composition for semiconductor packages |
US7195720B2 (en) | 2002-02-20 | 2007-03-27 | Kaneka Corporation | Curable composition for heat conductive material |
JP2009524196A (en) * | 2006-01-17 | 2009-06-25 | ヘンケル コーポレイション | Adhesive fuel cell assembly, method, system and sealant composition for manufacturing an adhesive fuel cell assembly |
US8066288B2 (en) | 2005-10-20 | 2011-11-29 | Henkel Corporation | Components comprising polyisobutylene compositions |
US8865800B2 (en) | 2007-04-16 | 2014-10-21 | Dow Corning Corporation | Hydrosilylation curable compositions |
JP2014209488A (en) * | 2006-01-17 | 2014-11-06 | ヘンケル コーポレイションHenkel Corporation | Sealant integrated fuel cell component, and method and system for producing the same |
WO2018012631A1 (en) * | 2016-07-14 | 2018-01-18 | 株式会社スリーボンド | Curable resin composition, cured article, fuel cell, and sealing method |
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2000
- 2000-03-01 JP JP2000055227A patent/JP2001240756A/en active Pending
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100479857B1 (en) * | 2001-12-28 | 2005-03-30 | 제일모직주식회사 | Silicon resin composition for packaging semiconductor |
US7195720B2 (en) | 2002-02-20 | 2007-03-27 | Kaneka Corporation | Curable composition for heat conductive material |
KR100493335B1 (en) * | 2002-12-14 | 2005-06-07 | 제일모직주식회사 | Silicon resin composition for semiconductor packages |
US8066288B2 (en) | 2005-10-20 | 2011-11-29 | Henkel Corporation | Components comprising polyisobutylene compositions |
JP2014209488A (en) * | 2006-01-17 | 2014-11-06 | ヘンケル コーポレイションHenkel Corporation | Sealant integrated fuel cell component, and method and system for producing the same |
JP2009524196A (en) * | 2006-01-17 | 2009-06-25 | ヘンケル コーポレイション | Adhesive fuel cell assembly, method, system and sealant composition for manufacturing an adhesive fuel cell assembly |
JP2014225456A (en) * | 2006-01-17 | 2014-12-04 | ヘンケル コーポレイションHenkel Corporation | Adhesion fuel cell assembly, method, system for manufacturing adhesion fuel cell assembly, and sealant composition |
US8865800B2 (en) | 2007-04-16 | 2014-10-21 | Dow Corning Corporation | Hydrosilylation curable compositions |
WO2018012631A1 (en) * | 2016-07-14 | 2018-01-18 | 株式会社スリーボンド | Curable resin composition, cured article, fuel cell, and sealing method |
CN109476925A (en) * | 2016-07-14 | 2019-03-15 | 三键有限公司 | Hardening resin composition, solidfied material, fuel cell and encapsulating method |
KR20190031477A (en) * | 2016-07-14 | 2019-03-26 | 가부시끼가이샤 쓰리본드 | Curable resin composition, cured product, fuel cell and sealing method |
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