JP2001234152A - Conductive adhesive - Google Patents

Conductive adhesive

Info

Publication number
JP2001234152A
JP2001234152A JP2000047211A JP2000047211A JP2001234152A JP 2001234152 A JP2001234152 A JP 2001234152A JP 2000047211 A JP2000047211 A JP 2000047211A JP 2000047211 A JP2000047211 A JP 2000047211A JP 2001234152 A JP2001234152 A JP 2001234152A
Authority
JP
Japan
Prior art keywords
powder
conductive adhesive
conductive
particle size
flake
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000047211A
Other languages
Japanese (ja)
Inventor
Masafumi Tanaka
政史 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP2000047211A priority Critical patent/JP2001234152A/en
Publication of JP2001234152A publication Critical patent/JP2001234152A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Abstract

PROBLEM TO BE SOLVED: To obtain a conductive adhesive which gives a cured item excellent in electrical conductivity, adhesiveness, resistances to heat and moisture, workability, thermal conductivity, reflecting properties, or the like. SOLUTION: This adhesive contains a conductive powder, an organic resin, and a diluent. The conductive powder has a cumulative 10% particle size of 2.0 μm or higher and mainly comprises at least one flaky powder selected from among flaky powders of silver, platinum, and aluminum. The compounding ratio of the flaky powder is 50-90 wt.% and that of the organic resin is 3-40 wt.%.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、ＬＥＤ等の赤外か
ら紫外域までを含む発光波長放出型半導体素子をリード
フレーム、プリント配線基板（ＰＷＢ）、フレキシブル
プリント基板（ＦＰＣ）等へ接着する際に適用される導
電性接着剤に係り、特に、作業性、接着性、導電性、耐
熱性、熱伝導性、発光波長の反射性に優れた導電性接着
剤の改良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for bonding a semiconductor device such as an LED, which emits light having a wavelength in the infrared to ultraviolet range, to a lead frame, a printed wiring board (PWB), a flexible printed board (FPC), or the like. TECHNICAL FIELD The present invention relates to a conductive adhesive applied to, for example, an improvement in a conductive adhesive excellent in workability, adhesiveness, conductivity, heat resistance, heat conductivity, and reflection of emission wavelength.

【０００２】[0002]

【従来の技術】導電性接着剤は、半導体素子やチップ部
品等をリードフレームや各種基板に接着し、電気的若し
くは熱的導通を得るために用いられるものであるが、従
来、この種の接着方法としては、Ａｕ−Ｓｉ共晶ハンダ
や錫−鉛ハンダ等の各種ハンダを用いてリードフレーム
若しくは各種基板上に半導体素子やチップ部品を接着す
るハンダ接合法が主流であった。2. Description of the Related Art A conductive adhesive is used for bonding a semiconductor element or chip part to a lead frame or various substrates to obtain electrical or thermal conduction. As a method, a solder bonding method of bonding a semiconductor element or a chip component onto a lead frame or various substrates using various solders such as Au-Si eutectic solder or tin-lead solder has been mainly used.

【０００３】しかし、従来のハンダ接合法では、Ａｕが
高価であること、半導体素子等に悪影響を及ぼす熱応力
の緩和性に欠けること、耐熱特性に欠けること、作業温
度が比較的高温である等の不都合があるため、近年、上
述した導電性接着剤を用いる方法が主流となっている。[0003] However, in the conventional solder bonding method, Au is expensive, lacks relaxation of thermal stress that adversely affects semiconductor elements, lacks heat resistance, and requires a relatively high working temperature. In recent years, the method using the above-described conductive adhesive has become mainstream.

【０００４】ところで、近年、ＬＥＤをはじめとする発
光波長放出型半導体素子には、小型化、高精度化、高性
能化が求められている。そして、上記発光波長放出型半
導体素子を基板等に接着させる際、発光波長放出型半導
体素子における小型化の進行に対応してその接着面積が
減少するため、導電性接着剤には従来より強い接着性が
求められる。[0004] In recent years, emission wavelength emission type semiconductor devices such as LEDs have been required to be smaller, more accurate, and have higher performance. When the emission wavelength emitting semiconductor device is adhered to a substrate or the like, the adhesive area decreases in accordance with the progress of miniaturization of the emission wavelength emission semiconductor device. Sex is required.

【０００５】また、上記高精度化、高性能化に関して
は、発光波長放出型半導体素子の小型化による高性能化
によりその発熱量が増加するため、導電性接着剤には高
熱伝導性、及び、放熱性、耐熱性等が求められる。[0005] Further, regarding the above-mentioned high precision and high performance, since the calorific value increases due to the high performance due to the miniaturization of the emission wavelength emission type semiconductor element, the conductive adhesive has high thermal conductivity and high heat conductivity. Heat dissipation and heat resistance are required.

【０００６】更に、接着された発光波長放出型半導体素
子の発光効率を上げるため、導電性接着剤には発光波長
の反射性も求められている。Further, in order to increase the luminous efficiency of the bonded emission wavelength emission type semiconductor device, the conductive adhesive is required to have reflectivity of the emission wavelength.

【０００７】そして、この種の導電性接着剤としては、
従来、導電性粉体、有機樹脂、希釈剤、触媒等を主成分
とする組成物が利用されており、上記導電性粉体には、
金、銀、銅等の金属粉末やカーボン等が適用され、有機
樹脂にはエポキシ樹脂、フェノール樹脂等の熱硬化性樹
脂が適用されている。[0007] As this kind of conductive adhesive,
Conventionally, a conductive powder, an organic resin, a diluent, a composition containing a catalyst and the like as a main component is used, the conductive powder,
Metal powders such as gold, silver, and copper, carbon, and the like are applied, and thermosetting resins such as an epoxy resin and a phenol resin are applied to the organic resin.

【０００８】[0008]

【発明が解決しようとする課題】ところで、従来の導電
性接着剤においては、適用されている金属粉末の粒径が
小さかったり粒度分布が広かったりしてその硬化物の反
射率が低く、基板等に接着された発光波長放出型半導体
素子の発光効率を上げる上において十分でない問題点を
有していた。By the way, in the conventional conductive adhesive, the reflectance of the cured product is low due to the small particle size or wide particle size distribution of the applied metal powder, and the substrate and the like are hardly used. There is a problem that it is not enough to increase the luminous efficiency of the emission wavelength emitting semiconductor device bonded to the semiconductor device.

【０００９】本発明はこの様な問題点に着目してなされ
たもので、その課題とするところは、反射率に優れ、し
かも、作業性、接着性、導電性、耐熱性、熱伝導性等に
優れた硬化物を与える導電性接着剤を提供することにあ
る。The present invention has been made in view of such problems, and has as its object to be excellent in reflectivity, workability, adhesiveness, conductivity, heat resistance, heat conductivity and the like. It is an object of the present invention to provide a conductive adhesive which gives a cured product excellent in the above.

【００１０】[0010]

【課題を解決するための手段】そこで、この様な課題を
解決するために本発明者が鋭意研究を重ねたところ、導
電性粉末として、積算１０％粒径が２．０μｍ以上で、
かつ、銀、白金、アルミニウムから選択されたフレーク
状粉末の１種類又は２種以上の混合物を適用した場合、
発光波長の反射性に優れ、しかも、作業性、接着性、導
電性、耐熱性、熱伝導性等の特性も良好な導電性接着剤
を提供できることを見出すに至った。Means for Solving the Problems Accordingly, the present inventors have conducted intensive studies in order to solve such problems, and as a result, the conductive powder has an integrated 10% particle size of 2.0 μm or more.
And, when one or a mixture of two or more flake-like powders selected from silver, platinum, and aluminum are applied,
It has been found that a conductive adhesive excellent in reflectivity of emission wavelength and excellent in workability, adhesiveness, conductivity, heat resistance, heat conductivity and the like can be provided.

【００１１】本発明はこの様な技術的発見に基づき完成
されたものである。The present invention has been completed based on such technical findings.

【００１２】すなわち、請求項１に係る発明は、導電性
粉末、有機樹脂および希釈剤を含有する導電性接着剤を
前提とし、積算１０％粒径が２．０μｍ以上で、銀、白
金、アルミニウムから選択されたフレーク状粉末の１種
類又は２種以上の混合物にて上記導電性粉末の主成分が
構成され、かつ、上記フレーク状粉末の配合割合が５０
〜９０重量％、有機樹脂の配合割合が３〜４０重量％の
範囲内にそれぞれ設定されていることを特徴とし、請求
項２に係る発明は、導電性粉末、有機樹脂および希釈剤
を含有する導電性接着剤を前提とし、積算５０％粒径が
７．０μｍ以上で、銀、白金、アルミニウムから選択さ
れたフレーク状粉末の１種類又は２種以上の混合物にて
上記導電性粉末の主成分が構成され、かつ、上記フレー
ク状粉末の配合割合が５０〜９０重量％、有機樹脂の配
合割合が３〜４０重量％の範囲内にそれぞれ設定されて
いることを特徴とし、また、請求項３に係る発明は、導
電性粉末、有機樹脂および希釈剤を含有する導電性接着
剤を前提とし、積算９０％粒径が１５μｍ以上で、銀、
白金、アルミニウムから選択されたフレーク状粉末の１
種類又は２種以上の混合物にて上記導電性粉末の主成分
が構成され、かつ、上記フレーク状粉末の配合割合が５
０〜９０重量％、有機樹脂の配合割合が３〜４０重量％
の範囲内にそれぞれ設定されていることを特徴とする。That is, the invention according to claim 1 is based on the premise that a conductive adhesive containing a conductive powder, an organic resin, and a diluent is used. The main component of the conductive powder is composed of one or a mixture of two or more of the flake powders selected from the group consisting of:
The present invention according to claim 2 is characterized in that the compounding ratio of the organic resin is set in the range of 3 to 40% by weight, and the conductive resin, the organic resin and the diluent are contained. Assuming a conductive adhesive, the main component of the conductive powder is one or a mixture of two or more flake-like powders having an integrated 50% particle size of 7.0 μm or more and selected from silver, platinum, and aluminum. And the compounding ratio of the flake powder is set in the range of 50 to 90% by weight, and the compounding ratio of the organic resin is set in the range of 3 to 40% by weight, respectively. The invention according to the present invention is based on a conductive adhesive containing a conductive powder, an organic resin and a diluent, and has an integrated 90% particle size of 15 μm or more, silver,
1 of flaky powder selected from platinum and aluminum
The main component of the conductive powder is composed of a kind or a mixture of two or more kinds, and the compounding ratio of the flake powder is 5%.
0 to 90% by weight, 3 to 40% by weight of organic resin
Are set within the range of.

【００１３】[0013]

【発明の実施の形態】以下、本発明の実施の形態につい
て詳細に説明する。Embodiments of the present invention will be described below in detail.

【００１４】まず、本発明に係る導電性接着剤において
必須成分としての銀、白金、アルミニウム粉末は、導電
性媒体、熱伝導媒体および発光波長の反射媒体として作
用するものである。そして、積算１０％粒径が２．０μ
ｍ以上で、かつ、銀、白金、アルミニウムから選択され
たフレーク状粉末の１種類又は２種以上の混合物を適用
した場合、上述したように優れた導電性、熱伝導性等を
確保しながら発光波長の反射性が向上することを見出し
本発明は完成されている。尚、積算１０％粒径が２．０
μｍ以上で、かつ、銀、白金、アルミニウムから選択さ
れたフレーク状粉末の１種類又は２種以上の混合物を適
用することを前提に、導電性接着剤の使用方法や求めら
れている特性に合わせて球状粉や針状粉の金属粉末を併
用してもよい。また、上記フレーク状粉末として、銀
粉、白金粉、アルミニウム粉のいずれも適用できるが、
価格、取扱い性、保存性、得られる導電性接着剤の特性
等を考慮した場合、上記フレーク状粉末としては一般的
に銀粉が望ましい。First, silver, platinum, and aluminum powders, which are essential components in the conductive adhesive according to the present invention, function as a conductive medium, a heat conductive medium, and a reflective medium for emission wavelength. And the integrated 10% particle size is 2.0μ
m or more, and when one or a mixture of two or more flake-like powders selected from silver, platinum, and aluminum are applied, light emission is performed while ensuring excellent electrical conductivity and thermal conductivity as described above. The present invention has been completed by finding that the reflectivity of the wavelength is improved. The cumulative 10% particle size is 2.0
μm or more, and based on the premise that one or a mixture of two or more flake-like powders selected from silver, platinum, and aluminum are applied, according to the method of using the conductive adhesive and the required characteristics. Metal powder such as spherical powder or acicular powder may be used in combination. In addition, as the flake powder, any of silver powder, platinum powder, and aluminum powder can be used.
In consideration of the price, handleability, storability, characteristics of the obtained conductive adhesive, etc., silver powder is generally desirable as the flake powder.

【００１５】次に、本発明に係る導電性接着剤におい
て、積算１０％粒径が２．０μｍ以上で、かつ、銀、白
金、アルミニウムから選択されたフレーク状粉末の配合
割合についてこれを５０〜９０重量％の範囲内に設定す
る理由は、５０重量％未満であると、この導電性接着剤
で構成された硬化物の電気的導通性が十分でなく、熱伝
導性や発光波長の反射性も低下するからである。他方、
９０重量％を超えた場合、得られる導電性接着剤の接着
強度が著しく低下し接着剤としての機能を果たさなくな
るからである。従って、積算１０％粒径が２．０μｍ以
上で、かつ、銀、白金、アルミニウムから選択されたフ
レーク状粉末の配合割合についてこれを５０〜９０重量
％の範囲内に設定することを要する。Next, in the conductive adhesive according to the present invention, the cumulative 10% particle size is 2.0 μm or more, and the mixing ratio of the flake powder selected from silver, platinum and aluminum is 50 to 50%. The reason for setting the content within the range of 90% by weight is that if the content is less than 50% by weight, the cured product made of this conductive adhesive will not have sufficient electrical conductivity, and will have thermal conductivity and reflectivity of emission wavelength. Is also reduced. On the other hand,
If the content exceeds 90% by weight, the adhesive strength of the obtained conductive adhesive will be remarkably reduced, and the conductive adhesive will not function as an adhesive. Therefore, it is necessary that the cumulative 10% particle size is 2.0 μm or more, and the mixing ratio of the flake powder selected from silver, platinum, and aluminum is set in the range of 50 to 90% by weight.

【００１６】尚、銀、白金、アルミニウムから選択され
るフレーク状粉末については、積算１０％粒径が２．０
μｍ以上のもの(請求項１)に加えて、積算５０％粒径が
７．０μｍ以上のもの(請求項２)および積算９０％粒径
が１５μｍ以上のもの(請求項３)も同様の条件で適用す
ることができる。The flake powder selected from silver, platinum and aluminum has an integrated 10% particle size of 2.0%.
In addition to those having a particle size of at least 50 μm (claim 1), those having an integrated 50% particle size of at least 7.0 μm (claim 2) and those having an integrated 90% particle size of at least 15 μm (claim 3) have the same conditions. Can be applied.

【００１７】そして、各請求項に規定する要件(すなわ
ち、積算１０％粒径が２．０μｍ以上、積算５０％粒径
が７．０μｍ以上、積算９０％粒径が１５μｍ以上のい
ずれかの要件)を満たす銀、白金、アルミニウムから選
択されたフレーク状粉末を適用することにより、反射性
に優れ、かつ、作業性、接着性、導電性、耐熱性、熱伝
導性等に優れた硬化物を与える導電性接着剤を提供でき
るが、各請求項に規定する各要件(すなわち、積算１０
％粒径が２．０μｍ以上で、積算５０％粒径が７．０μ
ｍ以上、かつ、積算９０％粒径が１５μｍ以上の全ての
要件)を満たす銀、白金、アルミニウムから選択された
フレーク状粉末を適用した場合、上記反射性が更に改善
された導電性接着剤を提供することが可能となる。The requirements defined in each claim (that is, any one of the requirements of an integrated 10% particle size of 2.0 μm or more, an integrated 50% particle size of 7.0 μm or more, and an integrated 90% particle size of 15 μm or more) By applying a flake powder selected from silver, platinum, and aluminum that satisfies), a cured product with excellent reflectivity and excellent workability, adhesiveness, conductivity, heat resistance, heat conductivity, etc. The conductive adhesive to be provided can be provided.
% Particle size is 2.0 μm or more, and the integrated 50% particle size is 7.0 μm.
m or more, and 90% of the total particle size is 15 μm or more), a flake-form powder selected from silver, platinum, and aluminum is applied. Can be provided.

【００１８】次に、本発明に用いられる有機樹脂として
は、公知の樹脂の内、接着性が認められる全ての樹脂が
利用でき、特に制限はない。公知の樹脂として、主に電
子材料の注形や接着に使用されているエポキシ樹脂やポ
リイミド樹脂、フェノール樹脂、シリコーン樹脂等が挙
げられると共に、その他接着性のある樹脂として、ウレ
タン樹脂、アクリル樹脂、アセタール樹脂等が挙げられ
る。また、使用用途を考えると液状のものが望ましく、
更に反射性の向上を考えると無色透明であることが望ま
しい。また、電子材料に使用されることを考えると、塩
素イオンをはじめとするイオン性不純物などが８００ｐ
ｐｍ以下であることが望ましい。また、これ等樹脂は単
独でも複数種類を混合して適用してもよく任意である。Next, as the organic resin used in the present invention, any of known resins having adhesiveness can be used, and there is no particular limitation. Known resins include epoxy resins and polyimide resins, phenolic resins, silicone resins, and the like, which are mainly used for casting and bonding of electronic materials, as well as other adhesive resins, urethane resins, acrylic resins, Acetal resins and the like can be mentioned. Also, considering the intended use, liquid is desirable,
Further, considering the improvement of the reflectivity, it is desirable that the material be colorless and transparent. Considering that it is used for electronic materials, ionic impurities such as chlorine ions are 800p
pm or less. These resins may be used singly or as a mixture of two or more kinds.

【００１９】尚、本発明に係る導電性接着剤において、
上記有機樹脂の配合割合についてこれを３〜４０重量％
の範囲内に設定する理由は、３重量％未満であると得ら
れる導電性接着剤の接着強度が低下し、また、４０重量
％を超えるとこの導電性接着剤で構成される硬化物の導
電性、熱伝導性、波長反射性等が低下してしまうからで
ある。In the conductive adhesive according to the present invention,
3 to 40% by weight of the above organic resin
If the amount is less than 3% by weight, the adhesive strength of the conductive adhesive obtained is reduced, and if it exceeds 40% by weight, the conductivity of the cured product composed of this conductive adhesive is reduced. This is because the properties, thermal conductivity, wavelength reflectivity and the like are reduced.

【００２０】また、本発明で適用される希釈剤は、有機
樹脂の希釈剤として作用しかつ硬化時には液体として存
在しないものであれば任意の材料を使用できる。一般的
には、その作業性や安全性等から、２，２，４−トリメ
チル−３−ヒドロキシジペンタンイソブチレート、２，
２，４−トリメチルペンタン−１，３−イソブチレー
ト、イソブチルブチレート、ジエチレングリコールモノ
ブチルエーテル、エチレングリコールモノブチルエーテ
ル等が例示され、また、有機樹脂にエポキシ樹脂が適用
されている場合には、加熱時にエポキシ樹脂及び硬化剤
と反応し得る、例えば、フェニルグリシジルエーテル、
エチレングリコールジグリシジルエーテル、エチルヘキ
シルグリシジルエーテルや、３−アミノプロピルトリエ
トキシシラン、３−グリシドキシプロピルトリメトキシ
シラン、３−グリシドキシプロピルメチルジメトキシシ
ラン、２−（３，４−エポキシシクロヘキシル）エチル
トリメトキシシラン等が挙げられる。As the diluent applied in the present invention, any material can be used as long as it functions as a diluent for the organic resin and does not exist as a liquid at the time of curing. In general, 2,2,4-trimethyl-3-hydroxydipentaneisobutyrate, 2,2
Examples include 2,4-trimethylpentane-1,3-isobutylate, isobutyl butyrate, diethylene glycol monobutyl ether, ethylene glycol monobutyl ether, and the like. When an epoxy resin is applied to an organic resin, the epoxy resin is heated when heated. And a curing agent, for example, phenyl glycidyl ether,
Ethylene glycol diglycidyl ether, ethylhexyl glycidyl ether, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl Trimethoxysilane and the like.

【００２１】尚、本発明では特に規定していないが、本
発明に係る導電性接着剤に求められる特性を阻害しない
範囲で有機樹脂の触媒や硬化剤等、また、作業性向上の
ためのチクソ調整剤等を配合してもよい。Although not particularly specified in the present invention, a catalyst or a curing agent of an organic resin and a thixotropic compound for improving workability are provided as long as the properties required for the conductive adhesive according to the present invention are not impaired. You may mix a regulator etc.

【００２２】[0022]

【実施例】以下、本発明の実施例について具体的に説明
する。Embodiments of the present invention will be specifically described below.

【００２３】［実施例１〜６］以下の表１に記載した組
成(重量％)を内容とする各成分を３本ロール型混練機を
使用して混練し、実施例に係る導電性接着剤を得た。Examples 1 to 6 Each component having the composition (% by weight) shown in Table 1 below was kneaded using a three-roll kneader, and the conductive adhesive according to the examples was used. I got

【００２４】尚、表１中において、金属粉末は、積算１
０％粒径が２．４μｍ以上で、積算５０％粒径が８．２
μｍ以上、かつ、積算９０％粒径が２３μｍ以上のフレ
ーク状銀粉(Ａｇ粉Ａ)、積算１０％粒径が１．５μｍ以
上である本発明の範囲外であるフレーク状銀粉(Ａｇ粉
Ｂ)、積算１０％粒径が３．２μｍ以上のフレーク状白
金粉(Ｐｔ粉)、積算１０％粒径が４．３μｍ以上のフレ
ーク状アルミニウム粉(Ａｌ粉)の４種類を使用した。ま
た、これ等金属粉末の粒径については、レーザー式粒度
分布測定装置により測定している。Note that, in Table 1, the metal powder was calculated by integrating 1
0% particle size is 2.4 μm or more and integrated 50% particle size is 8.2
flake silver powder (Ag powder A) having an average particle size of 90 μm or more and an average 90% particle size of 23 μm or more, and flake silver powder (Ag powder B) having an integrated 10% particle size of 1.5 μm or more and out of the scope of the present invention Four types of flaky platinum powder (Pt powder) having an integrated 10% particle size of 3.2 μm or more and aluminum flake (Al powder) having an integrated 10% particle size of 4.3 μm or more were used. The particle size of these metal powders is measured by a laser type particle size distribution measuring device.

【００２５】また、有機樹脂には、ビスフェノールＡジ
グリシジルエーテル(エポキシ樹脂)、フェノール樹脂及
びポリイミド樹脂を使用した。As the organic resin, bisphenol A diglycidyl ether (epoxy resin), phenol resin and polyimide resin were used.

【００２６】希釈剤には、フェニルグリシジルエーテル
(希釈剤Ａ)、ジエチレングリコールモノブチルエーテル
(希釈剤Ｂ)を使用した。The diluent is phenylglycidyl ether
(Diluent A), diethylene glycol monobutyl ether
(Diluent B) was used.

【００２７】その他に、有機樹脂にエポキシ樹脂を使用
した場合のみ硬化剤としてジシアンジアミドと２−フェ
ニル−４，５ジヒドロキシメチルイミダゾールの混合物
を使用した。In addition, a mixture of dicyandiamide and 2-phenyl-4,5 dihydroxymethylimidazole was used as a curing agent only when an epoxy resin was used as the organic resin.

【００２８】そして、得られた各実施例に係る導電性接
着剤について、１８０℃のオーブンに６０分間放置して
硬化させた後、以下に述べる評価方法に従って『シート
抵抗値（ｍΩ）』、『接着強度（Ｎ：ニュートン）』、
『耐熱強度（Ｎ）』、『高温耐湿性』、『作業性』、
『熱伝導性』及び『反射性』をそれぞれ測定した。After the obtained conductive adhesive according to each of the examples was cured by being left in an oven at 180 ° C. for 60 minutes, the “sheet resistance value (mΩ)”, “ Adhesive strength (N: Newton)
"Heat resistance (N)", "High temperature and humidity resistance", "Workability",
"Thermal conductivity" and "reflection" were measured respectively.

【００２９】結果を以下の表２に示す。The results are shown in Table 2 below.

【００３０】［比較例１〜３］実施例と同様、表１に記
載した組成を内容とする各成分を３本ロール型混練機を
使用して混練し、比較例１〜３に係る導電性接着剤を得
た。[Comparative Examples 1 to 3] In the same manner as in the examples, each component having the composition shown in Table 1 was kneaded using a three-roll kneader, and the conductivity according to Comparative Examples 1 to 3 was obtained. An adhesive was obtained.

【００３１】そして、得られた各比較例に係る導電性接
着剤についても実施例と同様の方法により特性評価を行
った。この結果についても以下の表２に示す。The properties of the obtained conductive adhesives of Comparative Examples were also evaluated in the same manner as in Examples. The results are also shown in Table 2 below.

【００３２】[0032]

【表１】 （評価方法） (1)シート抵抗値（ｍΩ）の測定 アルミナ基板上の２ｍｍ離れた電極間に、これ等電極に
重ねて幅２ｍｍ、長さ５ｍｍの長方形状に実施例並びに
比較例に係る各導電性接着剤を印刷し、かつ、１８０℃
のオーブン中に６０分間放置して各導電性接着剤を硬化
させた後、室温まで冷却し、上記電極間の抵抗値を測定
した。結果を表２に示す。[Table 1] (Evaluation method) (1) Measurement of sheet resistance value (mΩ) Between electrodes 2 mm apart on an alumina substrate, these electrodes were superimposed on these electrodes in a rectangular shape having a width of 2 mm and a length of 5 mm according to Examples and Comparative Examples. Print conductive adhesive and 180 ° C
After being left in an oven for 60 minutes to cure each conductive adhesive, it was cooled to room temperature and the resistance between the electrodes was measured. Table 2 shows the results.

【００３３】(2)接着強度（Ｎ：ニュートン）の測定 銀メッキが施された２．５ｃｍ角の銅基板上に実施例並
びに比較例に係る各導電性接着剤を滴下し、１．５ｍｍ
角のシリコンチップを載せ、１８０℃のオーブン中に６
０分間放置して各導電性接着剤を硬化させた。次に、室
温まで冷却した後、上記銅基板に対し水平方向から上記
シリコンチップに力を加え、このシリコンチップが剥が
れたときの力を接着強度として測定した。この結果も表
２に示す。(2) Measurement of Adhesive Strength (N: Newton) Each of the conductive adhesives according to Examples and Comparative Examples was dropped on a silver-plated 2.5 cm square copper substrate, and 1.5 mm
Place the silicon chip on the corner and place in a 180 ° C oven
Each conductive adhesive was cured by leaving it to stand for 0 minutes. Next, after cooling to room temperature, a force was applied to the silicon chip from the horizontal direction with respect to the copper substrate, and the force when the silicon chip was peeled was measured as the adhesive strength. The results are also shown in Table 2.

【００３４】(3)耐熱強度（Ｎ）の測定 銀メッキが施された２．５ｃｍ角の銅基板上に実施例並
びに比較例に係る各導電性接着剤を滴下し、１．５ｍｍ
角のシリコンチップを載せ、１８０℃のオーブン中に６
０分間放置して各導電性接着剤を硬化させた。次に、室
温まで冷却し、かつ、３５０℃に加熱してあるホットプ
レート上に上記銅基板を２０秒間放置し、その後加熱し
たまま上記銅基板に対し水平方向から上記シリコンチッ
プに力を加え、このシリコンチップが剥がれたときの力
を耐熱強度として測定した。この結果も表２に示す。(3) Measurement of Heat Resistance (N) Each of the conductive adhesives according to the examples and comparative examples was dropped on a silver-plated 2.5 cm square copper substrate, and 1.5 mm
Place the silicon chip on the corner and place in a 180 ° C oven
Each conductive adhesive was cured by leaving it to stand for 0 minutes. Next, the copper substrate was cooled to room temperature and left on a hot plate heated to 350 ° C. for 20 seconds, and then, while heating, a force was applied to the silicon chip from the horizontal direction with respect to the copper substrate, The force when the silicon chip was peeled was measured as heat resistance. The results are also shown in Table 2.

【００３５】(4)高温耐湿性の評価 上記(1)で作製したシート抵抗値の測定試料を、湿度８
５％ＲＨ、温度８５℃で５００時間保持した後、室温ま
で冷却し、(1)と同様にしてシート抵抗値を測定した。
そして、(1)で測定した抵抗値をもとにここで測定した
抵抗値の倍率を求めた。(4) Evaluation of High-Temperature Humidity Resistance The sample for measuring the sheet resistance value prepared in the above (1) was tested at a humidity of 8
After maintaining at 5% RH and a temperature of 85 ° C. for 500 hours, it was cooled to room temperature, and the sheet resistance was measured in the same manner as in (1).
Then, the magnification of the resistance value measured here was determined based on the resistance value measured in (1).

【００３６】また、上記(2)で作製した接着強度の測定
試料と同様にして作製した試料を、湿度８５％ＲＨ、温
度８５℃で５００時間保持した後、室温まで冷却し、
(2)と同様にして接着強度を測定した。そして、(2)で測
定した接着強度をもとにここで測定した接着強度の倍率
を求めた。A sample prepared in the same manner as the adhesive strength measurement sample prepared in (2) above was held at a humidity of 85% RH and a temperature of 85 ° C. for 500 hours, and then cooled to room temperature.
The adhesive strength was measured in the same manner as in (2). Then, the magnification of the adhesive strength measured here was determined based on the adhesive strength measured in (2).

【００３７】そして、シート抵抗値に対する倍率が１．
２倍以内で、かつ、接着強度に対する倍率が０．５倍以
上であれば良で○とし、それ以外の場合は不可で×とし
た。この結果も表２に示す。The magnification with respect to the sheet resistance value is 1.
When the ratio was within 2 times and the magnification with respect to the adhesive strength was 0.5 times or more, it was evaluated as good (○), and otherwise, it was unacceptable (x). The results are also shown in Table 2.

【００３８】(5)作業性の評価 実施例並びに比較例に係る各導電性接着剤を、２００メ
ッシュのスクリーンにて１ｍｍ角四方の正方形を１０個
印刷し、印刷面に欠けやかすれ等があるものは不可で×
とし、これら欠けやかすれが観察されない場合は良で○
とした。この結果を表２に示す。(5) Evaluation of workability The conductive adhesives according to Examples and Comparative Examples were printed on a 200-mesh screen in 10 squares each having a size of 1 mm square, and the printed surface had chipping or blurring. Things are not possible ×
If no chipping or fading is observed, it is OK.
And Table 2 shows the results.

【００３９】(6)熱伝導性の評価 リードフレーム上に実施例並びに比較例に係る各導電性
接着剤を滴下し、半導体チップをマウントし、１８０℃
のオーブン中で６０分間放置して硬化させた。硬化後、
リードフレーム及び半導体チップの電極部にマイクロプ
ローブをあて最初５ｍＡの電流を３ｍｓ流し電圧を測定
する。このときの電圧値をＶ１とする。続けて、３００
ｍＡの電流を５０ｍｓ流して半導体チップを発熱させ、
その後再び５ｍＡの電流を３ｍｓ流し電圧を測定する。
そして、このときの電圧値をＶ２とし、|Ｖ１−Ｖ２|の
値が８０ｍＶ以下であれば熱伝導性は良で○とし、それ
以外は不可で×とした。この結果も表２に示す。(6) Evaluation of thermal conductivity Each of the conductive adhesives according to Examples and Comparative Examples was dropped on a lead frame, and a semiconductor chip was mounted.
And left to cure in the oven for 60 minutes. After curing,
A microprobe is applied to the electrode portions of the lead frame and the semiconductor chip, and a current of 5 mA is first passed for 3 ms, and the voltage is measured. The voltage value at this time is defined as V1. Continue, 300
mA current is applied for 50 ms to cause the semiconductor chip to generate heat,
Thereafter, a current of 5 mA is applied again for 3 ms, and the voltage is measured.
The voltage value at this time was set to V2. If the value of | V1-V2 | was 80 mV or less, the thermal conductivity was evaluated as good, and the others were evaluated as unsatisfactory. The results are also shown in Table 2.

【００４０】(7)反射性の評価 反射性の評価には光沢度測定装置を用いた。まず、基板
に実施例並びに比較例に係る各導電性接着剤を１ｃｍ角
の正方形に印刷し、１８０℃のオーブン中で６０分間放
置して硬化させた。各導電性接着剤が硬化された各基板
を光沢度測定装置にセットし、各基板に対し垂直方向か
ら光を導電性接着剤に照射し、光に対し４５度方向の反
射率を測定した。反射率が７０％以上であれば反射性は
良で○とし、反射率が７０％以下の場合は不可で×とし
た。この結果も表２に示す。(7) Evaluation of reflectivity The reflectivity was evaluated using a gloss measuring device. First, the conductive adhesives according to Examples and Comparative Examples were printed on a substrate in a square shape of 1 cm square, and left to cure in an oven at 180 ° C. for 60 minutes. Each substrate on which each conductive adhesive was cured was set in a gloss measuring device, and light was irradiated to the conductive adhesive from the direction perpendicular to each substrate, and the reflectance of the substrate in the 45-degree direction was measured. When the reflectivity was 70% or more, the reflectivity was good, and the result was evaluated as good, and when the reflectivity was 70% or less, the result was unacceptable. The results are also shown in Table 2.

【００４１】(8)総合評価 これ等７項目において、シート抵抗値は３０００ｍΩ以
下、接着強度は３０Ｎ以上、耐熱強度は５Ｎ以上で、か
つ、高温耐湿性、作業性、熱伝導性及び反射性について
は良（○）の条件を満たしたもののみ良で○とし、１つ
でも以上の条件を満たさないものがある場合は不可で×
とした。この結果を表２に示す。(8) Comprehensive Evaluation In these seven items, the sheet resistance value was 3000 mΩ or less, the adhesive strength was 30 N or more, the heat resistance was 5 N or more, and the high-temperature moisture resistance, workability, thermal conductivity and reflectivity were measured. Is good if only the condition that satisfies the condition of good (O) is marked as good, and if at least one of the conditions does not satisfy the above condition, it is unacceptable.
And Table 2 shows the results.

【００４２】[0042]

【表２】 『考察』 １．表２から明らかなように実施例１〜６に係る導電性
接着剤については、導電性、接着性、耐熱性、高温耐湿
性、作業性、熱伝導性及び反射性に優れた性能を具備し
ていることが確認される。 ２．他方、比較例１〜３に係る導電性接着剤について
は、導電性、接着性、耐熱性、高温耐湿性、作業性、熱
伝導性及び反射性の全てを満たすものはなく、総合評価
が×となっている。[Table 2] "Discussion" 1. As is clear from Table 2, the conductive adhesives according to Examples 1 to 6 have performances excellent in conductivity, adhesiveness, heat resistance, high-temperature moisture resistance, workability, heat conductivity, and reflectivity. It is confirmed that. 2. On the other hand, none of the conductive adhesives according to Comparative Examples 1 to 3 satisfy all of conductivity, adhesiveness, heat resistance, high-temperature moisture resistance, workability, heat conductivity and reflectivity, and the overall evaluation is ×. It has become.

【００４３】まず、比較例１はＡｇ粉末Ａが適用されて
いるため反射性は良(○)であるが、Ａｇ粉末Ａの配合割
合が５０重量％未満かつエポキシ樹脂の配合割合が４０
重量％以上に設定されていることから、シート抵抗値が
上昇（∞ｍΩ）し、かつ、耐熱強度(５Ｎ以下)、作業
性、熱伝導性も不良である結果となっている。First, in Comparative Example 1, the reflectivity was good (○) because Ag powder A was applied, but the mixing ratio of Ag powder A was less than 50% by weight and the mixing ratio of epoxy resin was 40%.
Since it is set to be not less than% by weight, the sheet resistance value is increased (ΩmΩ), and the heat resistance (5 N or less), workability, and heat conductivity are also poor.

【００４４】また、比較例２はＡｇ粉末Ａが適用されて
いるため反射性は良(○)であるが、Ａｇ粉末Ａの配合割
合が９０重量％を超えかつエポキシ樹脂の配合割合が３
重量％以下に設定されていることから、接着強度(３０
Ｎ以下)、耐熱強度(５Ｎ以下)、高温耐湿性、作業性が
不良である結果となっている。In Comparative Example 2, the reflectivity was good (○) because Ag powder A was applied, but the compounding ratio of Ag powder A exceeded 90% by weight and the compounding ratio of epoxy resin was 3%.
Weight percent or less, the adhesive strength (30%
N or less), heat resistance (5 N or less), high temperature and humidity resistance, and poor workability.

【００４５】次に、比較例３は、反射性を除く他の特性
は良(○)であるが、本発明の範囲外であるフレーク状銀
粉(Ａｇ粉Ｂ)が適用されていることから反射性が不良と
する結果となっている。Next, in Comparative Example 3, the properties other than the reflectivity were good (○), but the flake-like silver powder (Ag powder B), which is outside the scope of the present invention, was used. As a result, the property is poor.

【００４６】[0046]

【発明の効果】請求項１記載の発明に係る導電性接着剤
によれば、積算１０％粒径が２．０μｍ以上で、銀、白
金、アルミニウムから選択されたフレーク状粉末の１種
類又は２種以上の混合物にて導電性粉末の主成分が構成
され、請求項２記載の発明に係る導電性接着剤によれ
ば、積算５０％粒径が７．０μｍ以上で、銀、白金、ア
ルミニウムから選択されたフレーク状粉末の１種類又は
２種以上の混合物にて導電性粉末の主成分が構成され、
請求項３記載の発明に係る導電性接着剤によれば、積算
９０％粒径が１５μｍ以上で、銀、白金、アルミニウム
から選択されたフレーク状粉末の１種類又は２種以上の
混合物にて導電性粉末の主成分が構成され、かつ、上記
フレーク状粉末の配合割合が５０〜９０重量％、有機樹
脂の配合割合が３〜４０重量％の範囲内にそれぞれ設定
されているため、導電性、接着性、耐熱性、耐湿性、作
業性、熱伝導性及び反射性に優れた性能を具備してい
る。According to the conductive adhesive according to the first aspect of the present invention, one or two types of flake-like powder selected from silver, platinum, and aluminum having an integrated 10% particle size of 2.0 μm or more are selected. The main component of the conductive powder is composed of a mixture of more than one kind. According to the conductive adhesive according to the second aspect of the present invention, the integrated 50% particle size is 7.0 μm or more, and from silver, platinum, and aluminum. The main component of the conductive powder is composed of one or a mixture of two or more of the selected flake-like powders,
According to the conductive adhesive according to the third aspect of the present invention, the conductive adhesive has a 90% cumulative particle size of 15 μm or more and is formed of one or a mixture of two or more flake-like powders selected from silver, platinum, and aluminum. Since the main component of the conductive powder is constituted, and the compounding ratio of the flake powder is set in the range of 50 to 90% by weight and the compounding ratio of the organic resin is set in the range of 3 to 40% by weight, the conductivity, It has excellent performance in adhesiveness, heat resistance, moisture resistance, workability, thermal conductivity and reflectivity.

【００４７】従って、ＬＥＤ等発光波長放出型半導体素
子の導電性接着剤として使用することにより発光波長放
出型半導体素子の発光効率を上げることができ、エネル
ギー交換率の向上並びに性能全般の向上に寄与できる効
果を有する。Therefore, the use of the conductive adhesive for a light emitting wavelength emitting semiconductor device such as an LED can increase the light emitting efficiency of the light emitting wavelength emitting semiconductor device, thereby contributing to an improvement in energy exchange rate and overall performance. Has an effect that can be.

───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4J040 DF001 EA001 EB031 EC001 EF001 EH031 EK001 HA066 HB15 HB31 HB35 HB36 HB44 JB10 KA01 KA16 KA23 KA32 LA03 LA06 LA07 LA08 LA09 LA10 MA02 NA19 NA20 5F047 BA21 BA52 BA53 CA08  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J040 DF001 EA001 EB031 EC001 EF001 EH031 EK001 HA066 HB15 HB31 HB35 HB36 HB44 JB10 KA01 KA16 KA23 KA32 LA03 LA06 LA07 LA08 LA09 LA10 MA02 NA19 NA20 5F047 BA08 BA52 BA53

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】導電性粉末、有機樹脂および希釈剤を含有
する導電性接着剤において、 積算１０％粒径が２．０μｍ以上で、銀、白金、アルミ
ニウムから選択されたフレーク状粉末の１種類又は２種
以上の混合物にて上記導電性粉末の主成分が構成され、
かつ、上記フレーク状粉末の配合割合が５０〜９０重量
％、有機樹脂の配合割合が３〜４０重量％の範囲内にそ
れぞれ設定されていることを特徴とする導電性接着剤。1. A conductive adhesive containing a conductive powder, an organic resin and a diluent, wherein one kind of flake-like powder selected from silver, platinum, and aluminum having an integrated 10% particle size of 2.0 μm or more. Or the main component of the conductive powder is composed of a mixture of two or more,
A conductive adhesive characterized in that the compounding ratio of the flake powder is set in the range of 50 to 90% by weight and the compounding ratio of the organic resin is set in the range of 3 to 40% by weight. 【請求項２】導電性粉末、有機樹脂および希釈剤を含有
する導電性接着剤において、 積算５０％粒径が７．０μｍ以上で、銀、白金、アルミ
ニウムから選択されたフレーク状粉末の１種類又は２種
以上の混合物にて上記導電性粉末の主成分が構成され、
かつ、上記フレーク状粉末の配合割合が５０〜９０重量
％、有機樹脂の配合割合が３〜４０重量％の範囲内にそ
れぞれ設定されていることを特徴とする導電性接着剤。2. A conductive adhesive containing a conductive powder, an organic resin and a diluent, wherein one kind of a flake-like powder selected from silver, platinum, and aluminum, having an integrated 50% particle size of 7.0 μm or more. Or the main component of the conductive powder is composed of a mixture of two or more,
A conductive adhesive characterized in that the compounding ratio of the flake powder is set in the range of 50 to 90% by weight and the compounding ratio of the organic resin is set in the range of 3 to 40% by weight. 【請求項３】導電性粉末、有機樹脂および希釈剤を含有
する導電性接着剤において、 積算９０％粒径が１５μｍ以上で、銀、白金、アルミニ
ウムから選択されたフレーク状粉末の１種類又は２種以
上の混合物にて上記導電性粉末の主成分が構成され、か
つ、上記フレーク状粉末の配合割合が５０〜９０重量
％、有機樹脂の配合割合が３〜４０重量％の範囲内にそ
れぞれ設定されていることを特徴とする導電性接着剤。3. A conductive adhesive containing a conductive powder, an organic resin and a diluent, wherein one or two of a flake-like powder selected from silver, platinum and aluminum, having an integrated 90% particle size of 15 μm or more. The main component of the conductive powder is composed of a mixture of more than one kind, and the compounding ratio of the flake powder is set in the range of 50 to 90% by weight, and the compounding ratio of the organic resin is set in the range of 3 to 40% by weight. Conductive adhesive characterized by being done.
JP2000047211A 2000-02-24 2000-02-24 Conductive adhesive Pending JP2001234152A (en)

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ID=18569497

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Cited By (7)

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JP2005197118A (en) * 2004-01-08 2005-07-21 Sumitomo Bakelite Co Ltd Metal containing paste and semiconductor device
JP2009259839A (en) * 2009-07-27 2009-11-05 Sumitomo Bakelite Co Ltd Metal-containing paste and semiconductor device
WO2011030621A1 (en) * 2009-09-14 2011-03-17 ソニーケミカル＆インフォメーションデバイス株式会社 Light-reflective anisotropic electroconductive adhesive agent and light-emitting device
WO2011129373A1 (en) * 2010-04-13 2011-10-20 ソニーケミカル＆インフォメーションデバイス株式会社 Light-reflective anisotropic conductive adhesive agent, and light emitting device
CN102823084A (en) * 2010-04-12 2012-12-12 索尼化学&信息部件株式会社 Method of manufacturing light-emitting device
WO2013051708A1 (en) * 2011-10-07 2013-04-11 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive adhesive and method for producing same, and light-emitting device and method for producing same
JP2014012840A (en) * 2013-07-16 2014-01-23 Univ Of Tokyo Adhesive material composition

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Publication number Priority date Publication date Assignee Title
JP2005197118A (en) * 2004-01-08 2005-07-21 Sumitomo Bakelite Co Ltd Metal containing paste and semiconductor device
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JP2009259839A (en) * 2009-07-27 2009-11-05 Sumitomo Bakelite Co Ltd Metal-containing paste and semiconductor device
WO2011030621A1 (en) * 2009-09-14 2011-03-17 ソニーケミカル＆インフォメーションデバイス株式会社 Light-reflective anisotropic electroconductive adhesive agent and light-emitting device
JP2011057917A (en) * 2009-09-14 2011-03-24 Sony Chemical & Information Device Corp Light-reflective, anisotropic, electroconductive adhesive, and light-emitting device
US9548141B2 (en) 2009-09-14 2017-01-17 Dexerials Corporation Light-reflective anisotropic conductive adhesive and light-emitting device
CN102823084B (en) * 2010-04-12 2015-11-25 迪睿合电子材料有限公司 The manufacture method of light-emitting device
CN102823084A (en) * 2010-04-12 2012-12-12 索尼化学&信息部件株式会社 Method of manufacturing light-emitting device
CN102859673A (en) * 2010-04-13 2013-01-02 索尼化学&信息部件株式会社 Light-reflective anisotropic conductive adhesive agent, and light emitting device
US8916894B2 (en) 2010-04-13 2014-12-23 Dexerials Corporation Light-reflective anisotropic conductive adhesive agent, and light emitting device
JP2011222875A (en) * 2010-04-13 2011-11-04 Sony Chemical & Information Device Corp Light-reflective, anisotropic and conductive adhesive, and light-emitting device
TWI513783B (en) * 2010-04-13 2015-12-21 Dexerials Corp A light reflective anisotropic conductive adhesive and a light emitting device
US9260634B2 (en) 2010-04-13 2016-02-16 Dexerials Corporation Light-reflective anisotropic conductive adhesive agent, and light emitting device
WO2011129373A1 (en) * 2010-04-13 2011-10-20 ソニーケミカル＆インフォメーションデバイス株式会社 Light-reflective anisotropic conductive adhesive agent, and light emitting device
WO2013051708A1 (en) * 2011-10-07 2013-04-11 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive adhesive and method for producing same, and light-emitting device and method for producing same
JP2013082784A (en) * 2011-10-07 2013-05-09 Dexerials Corp Anisotropic conductive adhesive agent, method for producing the same, light emitting device, and method for manufacturing the light emitting device
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JP2014012840A (en) * 2013-07-16 2014-01-23 Univ Of Tokyo Adhesive material composition

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