JP2001219369A - Polishing shape predicting method, and polishing method and device - Google Patents

Polishing shape predicting method, and polishing method and device

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Publication number
JP2001219369A
JP2001219369A JP2000031019A JP2000031019A JP2001219369A JP 2001219369 A JP2001219369 A JP 2001219369A JP 2000031019 A JP2000031019 A JP 2000031019A JP 2000031019 A JP2000031019 A JP 2000031019A JP 2001219369 A JP2001219369 A JP 2001219369A
Authority
JP
Japan
Prior art keywords
polishing
pressing force
sample
force distribution
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000031019A
Other languages
Japanese (ja)
Other versions
JP2001219369A5 (en
Inventor
Takashi Fujita
隆 藤田
Meii Dan
明偉 談
Yuzo Kozai
雄三 香西
Motoyuki Obara
基之 小原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
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Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP2000031019A priority Critical patent/JP2001219369A/en
Publication of JP2001219369A publication Critical patent/JP2001219369A/en
Publication of JP2001219369A5 publication Critical patent/JP2001219369A5/ja
Withdrawn legal-status Critical Current

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To predict the polishing shape in actual polishing with high accuracy and to obtain the desired polishing shape on the basis of the predicted polishing shape. SOLUTION: This polishing shape predicting method comprises a process for measuring the distribution of pressure force between a sample and an abrasive pad by using a distribution of pressing force measuring device for measuring thee pressing force to press an abrasive pad to a surface to be polished of a sample at plural points between the sample and the abrasive pad, a process for predicting the polishing shape in actual grinding on the basis of the measured distribution of pressure force, a process for judging whether the polishing can be started or not on the basis of the prediction, and a process for executing the polishing with pressure.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は半導体デバイスウェ
ハ等の試料の被研磨面を研磨パッドに押付けて研磨する
実研磨での研磨形状を予測する研磨形状予測方法及び研
磨方法並びに研磨装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing shape prediction method, a polishing method, and a polishing apparatus for predicting a polishing shape in actual polishing in which a surface to be polished of a sample such as a semiconductor device wafer is pressed against a polishing pad for polishing.

【０００２】[0002]

【従来の技術】円板形の試料の研磨方法は表１に示す如
く大きく分けて平面創成研磨方式と全面均等研磨方式と
がある。2. Description of the Related Art As shown in Table 1, polishing methods for a disk-shaped sample are roughly classified into a planar generating polishing method and a uniform polishing method over the entire surface.

【０００３】[0003]

【表１】 [Table 1]

【０００４】平面創成研磨方式は、元々平面度が悪い試
料に高精度の平面度を有する研磨定盤及び研磨パッドを
当てて研磨し、研磨定盤及び研磨パッドの平面度を試料
に転写することにより試料の平面度を強制的に創成する
研磨方法である。この研磨方法は、高精度な厚み制御が
必要であるシリコン試料研磨、石英試料研磨等のプロセ
スに適用される。[0004] In the flat surface generating polishing method, a sample having originally poor flatness is polished with a polishing platen and a polishing pad having high precision flatness, and the flatness of the polishing platen and the polishing pad is transferred to the sample. This is a polishing method in which the flatness of the sample is forcibly created by the method. This polishing method is applied to processes such as silicon sample polishing and quartz sample polishing that require highly accurate thickness control.

【０００５】全面均等研磨方式は、半導体デバイスウェ
ハ等の試料の層間膜等を研磨する化学機械研磨（ＣＭ
Ｐ）において、未研磨の試料がどのような被研磨面状態
を有している場合でも、その被研磨面状態に倣って被研
磨面状態を保ちつつ全面を等分量に研磨除去する方法で
ある。[0005] The uniform polishing method is a chemical mechanical polishing (CM) for polishing an interlayer film of a sample such as a semiconductor device wafer.
In P), even if the unpolished sample has any polished surface state, the entire surface is polished and removed in equal amounts while maintaining the polished surface state according to the polished surface state. .

【０００６】平面創成研磨方式は、高精度な厚み精度を
確保するために厚み寸法が大きい部分を選択的に研磨除
去し、全面を平坦化するのに対し、全面均等研磨方式
は、試料の被研磨面状態に関わらず被研磨面状態を保ち
つつ全面を等分量に研磨除去し、未研磨の被研磨面状態
と近似した被研磨面状態が保たれる。[0006] In the flat surface generation polishing method, a portion having a large thickness is selectively polished and removed and the entire surface is flattened in order to secure high thickness accuracy. Regardless of the polished surface state, the entire surface is polished and removed in equal amounts while maintaining the polished surface state, and the polished surface state similar to the unpolished polished surface state is maintained.

【０００７】この全面均等研磨方式では、比較的軟質の
研磨パッドを使用することが望ましい。これは、研磨パ
ッドの表面が試料の被研磨面に倣うことにより、全面が
均等に接触し、全面均等に研磨することが可能であると
考えられるためである。しかし、デバイス層間膜の研磨
では、上述の全面均等に研磨することに加えて、局所的
に微小な凹凸を平らにする性能も要求されている。この
局所的な部分を平らにするには、比較的硬質な研磨パッ
ドが良いと考えられる。In this overall uniform polishing method, it is desirable to use a relatively soft polishing pad. This is because when the surface of the polishing pad follows the surface to be polished of the sample, it is considered that the entire surface is in uniform contact and the entire surface can be polished uniformly. However, in the polishing of the device interlayer film, in addition to the above-mentioned uniform polishing of the entire surface, the ability to locally flatten minute irregularities is also required. It is considered that a relatively hard polishing pad is good for flattening this localized portion.

【０００８】この二つの性能を同時に満たす研磨方法と
して従来２層パッドなるものが使用されてきた。この２
層パッドは、試料の被研磨面に接触する表面部が比較的
硬質の材料で構成され、局所的には、凹凸を平らにする
平坦化が可能なようになっており、研磨パッドの内部
は、比較的軟質の材料を使用することで被研磨面の形状
に関わらず、試料の被研磨面を均等に研磨することが可
能に構成されている。Conventionally, a two-layer pad has been used as a polishing method for simultaneously satisfying these two performances. This 2
The layer pad is made of a relatively hard material at the surface portion that comes into contact with the surface to be polished of the sample, and locally, it is possible to flatten the unevenness locally, and the inside of the polishing pad is By using a relatively soft material, it is possible to uniformly polish the polished surface of the sample regardless of the shape of the polished surface.

【０００９】また、３層の研磨パッドを有する研磨装置
も知られている。３層の研磨パッドは、試料の被研磨面
に当る表面部は比較的硬質であり、研磨剤の搬送性がよ
い発泡性のポリウレタンからなる合成樹脂材料で構成さ
れ、裏面はエポキシ樹脂、グラスファイバー等の比較的
硬質の硬質合成樹脂板により裏打ちされ、研磨パッドの
表面硬度を上げて局所的な平坦化が可能なように構成さ
れている。また、前記硬質合成樹脂板の裏面には、スポ
ンジ等の比較的軟質の材料が敷かれており、硬質合成樹
脂板のクッション的な役割を果たすようになっている。
これによって研磨パッドの表面は硬度が高いながらも試
料の被研磨面の凹凸に追従するような働きを有するた
め、平坦化研磨及び均等研磨を両立することが可能であ
る。[0009] A polishing apparatus having a three-layer polishing pad is also known. The three-layer polishing pad has a relatively hard surface corresponding to the surface to be polished of the sample and is made of a synthetic resin material made of foamable polyurethane, which has a good abrasive transportability, and an epoxy resin, glass fiber on the back surface. The polishing pad is backed by a relatively hard hard synthetic resin plate, and is configured to increase the surface hardness of the polishing pad to enable local flattening. Also, a relatively soft material such as a sponge is spread on the back surface of the hard synthetic resin plate, and plays a cushion-like role of the hard synthetic resin plate.
Thus, the surface of the polishing pad has a function of following the irregularities of the surface to be polished of the sample while having a high hardness, so that both flattening polishing and uniform polishing can be achieved.

【００１０】特開平５−２８５８２５号公報に示される
研磨パッドにあっても上述したところと同様に表面部
は、研磨の局所的な平坦化に寄与し、研磨パッドの裏面
の板部材がクッションの役割を果たしている。In the polishing pad disclosed in Japanese Patent Application Laid-Open No. 5-285825, the surface portion contributes to the local flattening of polishing similarly to the above, and the plate member on the back surface of the polishing pad serves as a cushion. Plays a role.

【００１１】また、特開平９−２９６２２号公報では、
直径寸法が異なる複数が同心的に配され、夫々が独立し
て回転可能な円環部材を有する研磨定盤が設けられてお
り、前記円環部材の回転数を変化させることにより研磨
形状の制御を可能とした研磨装置が開示されている。In Japanese Patent Application Laid-Open No. 9-29622,
A plurality of polishing plates each having a different diameter dimension are concentrically arranged, and each has a polishing platen having an independently rotatable annular member. The polishing shape is controlled by changing the number of revolutions of the annular member. There is disclosed a polishing apparatus that enables the above.

【００１２】また、特開平９−２３２２６１号公報で
は、試料の被研磨面と反対の裏面側に複数の押付力検出
素子を配設して押付力を測定し、夫々の押付力検出素子
間の押付力の差が所定値以上になったときに研磨を終了
するようにした研磨方法が開示されている。In Japanese Patent Application Laid-Open No. 9-232261, a plurality of pressing force detecting elements are arranged on the back side opposite to the polished surface of the sample to measure the pressing force. There is disclosed a polishing method in which polishing is terminated when a difference in pressing force becomes equal to or more than a predetermined value.

【００１３】また、特開平９−２６０３１６号公報で
は、試料の被研磨面と反対の裏面側又は研磨パッドの裏
面側若しくはこれらの両方に、押付力検出素子群と局所
押付機構群とを配設し、押付力分布を調整するようにし
た研磨方法が開示されている。In Japanese Patent Application Laid-Open No. 9-260316, a pressing force detecting element group and a local pressing mechanism group are provided on the back surface opposite to the surface to be polished of a sample, the back surface of a polishing pad, or both. In addition, a polishing method that adjusts the distribution of the pressing force is disclosed.

【００１４】[0014]

【発明が解決しようとする課題】ところが上述したよう
な従来の研磨方法及び研磨装置は、試料の被研磨面状態
に合わせて研磨パッドの表面を倣わせ、被研磨面状態を
保ちつつ全ての試料を研磨しているため、研磨した後の
研磨形状が許容されない試料についても研磨されること
になる。However, in the conventional polishing method and polishing apparatus as described above, the surface of the polishing pad is copied according to the state of the surface to be polished of the sample, and all of the sample is maintained while maintaining the state of the surface to be polished. Is polished, so that a sample whose polished shape after polishing is not allowed is polished.

【００１５】本発明は斯かる事情に鑑みてなされたもの
であり、試料と研磨パッドとの間の押付力分布に基づい
て実研磨での研磨形状を予測することができ、また、こ
の予測結果に基づいて研磨開始の可否を判定し、研磨す
ることができる研磨形状予測方法及び研磨方法並びに研
磨装置を提供することを目的とする。The present invention has been made in view of such circumstances, and it is possible to predict a polishing shape in actual polishing based on a distribution of a pressing force between a sample and a polishing pad. It is an object of the present invention to provide a polishing shape prediction method, a polishing method, and a polishing apparatus capable of judging whether or not to start polishing based on the above, and performing polishing.

【００１６】また、予め準備されている複数の研磨基板
の一つを前記予測結果に基づいて選択し、この選択した
研磨基板に取り替えたり、又は、直径寸法が異なる複数
が同心的に配され、夫々が独立して研磨パッドの方向へ
の移動が可能な円環部材を有する研磨定盤の前記円環部
材を前記予測結果に基づいて夫々移動させることによ
り、前記押付力分布を補正したりすることができる研磨
形状予測方法及び研磨方法並びに研磨装置を提供するこ
とを目的とする。Further, one of a plurality of polishing substrates prepared in advance is selected on the basis of the prediction result, and the selected polishing substrate is replaced or a plurality of polishing substrates having different diameters are concentrically arranged. The pressing force distribution is corrected by moving the annular members of the polishing platen each having an annular member capable of independently moving in the direction of the polishing pad based on the prediction result. It is an object of the present invention to provide a polishing shape prediction method, a polishing method, and a polishing apparatus that can perform the polishing.

【００１７】[0017]

【課題を解決するための手段】第１発明に係る研磨形状
予測方法は、円板形の試料を回転させつつその被研磨面
を研磨パッドに押付けて研磨する実研磨での研磨形状を
予測する方法であって、前記試料と研磨パッドとの間の
第１の押付力分布を測定し、測定した第１の押付力分布
に基づいて前記被研磨面をその直径方向に区分した複数
の試料区分域に加わる第２の押付力分布を算出し、この
算出した第２の押付力分布に基づいて実研磨での研磨形
状を予測することを特徴とする。According to a first aspect of the present invention, there is provided a polishing shape estimating method for estimating a polishing shape in actual polishing in which a disk-shaped sample is rotated and a surface to be polished is pressed against a polishing pad and polished. A method, comprising: measuring a first pressing force distribution between the sample and a polishing pad; and dividing the surface to be polished in the diameter direction based on the measured first pressing force distribution. The method is characterized in that a second pressing force distribution applied to the region is calculated, and a polishing shape in actual polishing is predicted based on the calculated second pressing force distribution.

【００１８】第２発明に係る研磨形状予測方法は、円板
形の試料を回転させつつその被研磨面を研磨パッドに押
付けて研磨する実研磨での研磨形状を予測する方法であ
って、前記試料と研磨パッドとの間の第１の押付力分布
を測定し、測定した第１の押付力分布に基づいて前記被
研磨面をその直径方向に区分した複数の試料区分域に加
わる第３の押付力分布を算出し、この算出した第３の押
付力分布及び該第３の押付力分布で実研磨したときの研
磨形状の相関関係を予め求めてあり、前記試料と研磨パ
ッドとの間の第１の押付力分布を測定し、測定した第１
の押付力分布に基づいて前記被研磨面をその直径方向に
区分した複数の試料区分域に加わる第２の押付力分布を
算出し、この算出した第２の押付力分布の形状と、予め
求められた相関関係とを比較して実研磨での研磨形状を
予測することを特徴とする。A polishing shape predicting method according to a second aspect of the present invention is a method for predicting a polishing shape in actual polishing in which a disk-shaped sample is rotated and a surface to be polished is pressed against a polishing pad and polished. Measuring a first pressing force distribution between the sample and the polishing pad, and applying a third pressing force applied to a plurality of sample sections in which the surface to be polished is divided in the diameter direction based on the measured first pressing force distribution. The pressing force distribution is calculated, and the correlation between the calculated third pressing force distribution and the polishing shape when actual polishing is performed with the third pressing force distribution is obtained in advance, and the correlation between the sample and the polishing pad is determined. Measuring the first pressing force distribution and measuring the measured first pressing force distribution;
Calculating a second pressing force distribution applied to a plurality of sample sections in which the surface to be polished is divided in the diameter direction based on the pressing force distribution, and calculating the shape of the calculated second pressing force distribution in advance. It is characterized in that a polishing shape in actual polishing is predicted by comparing with the obtained correlation.

【００１９】第３発明に係る研磨形状予測方法は、前記
第１の押付力分布の測定は、前記研磨パッド及び試料を
相対移動させて研磨パッド上の複数の位置で行うことを
特徴とする。In the polishing shape prediction method according to a third aspect of the present invention, the measurement of the first pressing force distribution is performed at a plurality of positions on the polishing pad by relatively moving the polishing pad and the sample.

【００２０】第４発明に係る研磨形状予測方法は、前記
第２及び第３の押付力分布は、前記研磨パッドの被研磨
面との接触域を前記試料区分域と同数に区分したパッド
区分域ごとの平均押付力と、前記試料が一回転する間で
前記試料区分域が前記パッド区分域を通過する割合とに
基づいて算出することを特徴とする。According to a fourth aspect of the present invention, in the method for predicting a polishing shape, the second and third pressing force distributions may be arranged such that a contact area between the polishing pad and a surface to be polished is divided into the same number as the sample section areas. The calculation is based on the average pressing force of each sample and the rate at which the sample section passes through the pad section while the sample makes one rotation.

【００２１】第５発明に係る研磨方法は、円板形の試料
を回転させつつその被研磨面を研磨パッドに押付けて研
磨する研磨方法において、請求項１乃至４記載の研磨形
状予測方法を実行する予測工程と、予測結果に基づいて
研磨開始の可否を判定する研磨開始可否判定工程と、判
定結果に基づいて研磨する研磨工程とからなることを特
徴とする。A polishing method according to a fifth aspect of the present invention is a polishing method in which a polished surface is pressed against a polishing pad while polishing a disk-shaped sample while rotating the disk-shaped sample. And a polishing start determination step of determining whether or not to start polishing based on the prediction result, and a polishing step of performing polishing based on the determination result.

【００２２】第６発明に係る研磨方法は、円板形の試料
を回転させつつその被研磨面を、研磨基板を介して研磨
定盤に取付けられた研磨パッドに押付けて研磨する研磨
方法において、前記研磨基板は前記研磨パッドに加える
押付力分布が異なる複数の種類を備えており、請求項１
乃至４記載の研磨形状予測方法を実行する予測工程と、
予測結果に基づいて前記研磨基板の一つを選択する選択
工程と、前記研磨基板を選択した研磨基板に取り替えて
研磨する研磨工程とからなることを特徴とする。A polishing method according to a sixth aspect of the present invention is a polishing method for polishing by pressing a surface to be polished against a polishing pad attached to a polishing platen via a polishing substrate while rotating a disk-shaped sample. 2. The polishing substrate includes a plurality of types having different distributions of pressing force applied to the polishing pad, and 2.
A prediction step of executing the polishing shape prediction method according to any one of claims 4 to 4,
The method is characterized by comprising a selection step of selecting one of the polishing substrates based on a prediction result, and a polishing step of replacing the polishing substrate with the selected polishing substrate and polishing.

【００２３】第７発明に係る研磨方法は、円板形の試料
を回転させつつその被研磨面を、研磨定盤に取付けられ
た研磨パッドに押付けて研磨する研磨方法において、前
記研磨定盤は直径寸法が異なる複数が同心的に配され、
夫々が独立して前記研磨パッドの方向への移動が可能な
円環部材を備えており、請求項１乃至４記載の研磨形状
予測方法を実行する予測工程と、予測結果に基づいて前
記円環部材を夫々移動させ、これら円環部材の位置を調
整する位置調整工程と、研磨する研磨工程とからなるこ
とを特徴とする。A polishing method according to a seventh aspect of the present invention is a polishing method in which a polished surface is pressed against a polishing pad attached to a polishing plate while the disk-shaped sample is being rotated, and the polishing plate is polished. Plurality of different diameters are arranged concentrically,
5. A polishing step for performing the polishing shape prediction method according to claim 1, further comprising a ring member capable of independently moving in the direction of the polishing pad, and the ring based on a prediction result. The method is characterized by comprising a position adjusting step of adjusting the positions of the annular members by moving the members, and a polishing step of polishing.

【００２４】第８発明に係る研磨方法は、試料の被研磨
面を研磨定盤に取付けられた研磨パッドに押付けて研磨
する研磨方法において、前記研磨定盤は直径寸法が異な
る複数が同心的に配され、夫々が独立して前記研磨パッ
ドの方向への移動が可能な円環部材を備えており、前記
試料の被研磨面と反対側の裏面又は研磨パッドの裏面に
押付力を複数の位置で測定する押付力分布測定器を配し
て押付力分布を測定する測定工程と、測定した押付力分
布に基づいて実研磨での研磨形状を予測する予測工程
と、予測結果に基づいて前記円環部材を夫々移動させ、
これら円環部材の位置を調整する位置調整工程と、研磨
する研磨工程とからなることを特徴とする。In a polishing method according to an eighth aspect of the present invention, in the polishing method, the surface to be polished of the sample is pressed against a polishing pad attached to the polishing table, and the polishing table has a plurality of concentrically different diameters. An annular member, each of which is independently movable in the direction of the polishing pad, and applies a pressing force to the back surface opposite to the surface to be polished of the sample or the back surface of the polishing pad at a plurality of positions. A measuring step of measuring a pressing force distribution by arranging a pressing force distribution measuring device to be measured in, a predicting step of predicting a polishing shape in actual polishing based on the measured pressing force distribution, and the circle based on a predicted result. Move each ring member,
The method is characterized by comprising a position adjusting step of adjusting the positions of these annular members and a polishing step of polishing.

【００２５】第９発明に係る研磨装置は、試料の被研磨
面を研磨パッドに押付けて研磨する研磨装置において、
前記研磨パッドへの押付力を前記試料と研磨パッドとの
間の複数の位置で測定する押付力分布測定器を前記試料
と研磨パッドとの間に配する配置手段と、前記押付力分
布測定器が測定した押付力分布に基づいて実研磨での研
磨形状を予測する研磨形状予測手段とを備えることを特
徴とする。According to a ninth aspect of the present invention, there is provided a polishing apparatus for polishing a sample by pressing a surface to be polished against a polishing pad.
An arranging means for arranging a pressing force distribution measuring device for measuring a pressing force to the polishing pad at a plurality of positions between the sample and the polishing pad between the sample and the polishing pad, and the pressing force distribution measuring device And polishing shape prediction means for predicting a polishing shape in actual polishing based on the measured pressing force distribution.

【００２６】第１０発明に係る研磨装置は、実研磨した
ときの研磨形状を予め設定する設定手段と、前記予測し
た研磨形状と予め設定された研磨形状とを比較する比較
手段と、比較した試料の研磨開始の可否を判定する研磨
開始可否判定手段とを備えることを特徴とする。A polishing apparatus according to a tenth aspect of the present invention comprises a setting means for presetting a polishing shape when actual polishing is performed, a comparing means for comparing the predicted polishing shape with a preset polishing shape, and a sample for comparison. And a polishing start determination unit for determining whether the polishing can be started.

【００２７】第１１発明に係る研磨装置は、前記研磨定
盤は直径寸法が異なる複数が同心的に配され、夫々が独
立して前記研磨パッドの方向への移動が可能な円環部材
を備えており、前記研磨形状予測手段が予測した研磨形
状に基づいて前記円環部材を夫々移動させ、これら円環
部材の位置を調整する位置調整手段を備えることを特徴
とする。A polishing apparatus according to an eleventh aspect of the present invention is characterized in that the polishing platen is provided with a plurality of concentrically arranged polishing plates having different diameters, each of which is independently movable in the direction of the polishing pad. And a position adjusting means for moving the annular members based on the polishing shape predicted by the polishing shape predicting means and adjusting the positions of the annular members.

【００２８】第１２発明に係る研磨装置は、試料の被研
磨面を研磨定盤に取付けられた研磨パッドに押付けて研
磨する研磨装置において、前記研磨定盤は直径寸法が異
なる複数が同心的に配され、夫々が独立して前記研磨パ
ッドの方向への移動が可能な円環部材を備えており、前
記試料の被研磨面と反対側の裏面又は研磨パッドの裏面
に配され、前記研磨パッドへの押付力を複数の位置で測
定する押付力分布測定器と、該押付力分布測定器が測定
した押付力分布に基づいて実研磨での研磨形状を予測す
る研磨形状予測手段と、該研磨形状予測手段が予測した
研磨形状に基づいて前記円環部材を夫々移動させ、これ
ら円環部材の位置を調整する位置調整手段とを備えるこ
とを特徴とする。A polishing apparatus according to a twelfth aspect of the present invention is a polishing apparatus for polishing by pressing a surface to be polished of a sample against a polishing pad attached to a polishing table, wherein a plurality of polishing tables having different diameters are concentric. The polishing pad, each of which is provided with an annular member capable of independently moving in the direction of the polishing pad, and disposed on the back surface opposite to the surface to be polished of the sample or the back surface of the polishing pad. Pressing force distribution measuring device for measuring pressing force at a plurality of positions, polishing shape predicting means for predicting a polishing shape in actual polishing based on the pressing force distribution measured by the pressing force distribution measuring device, The apparatus further comprises a position adjusting means for moving the annular members based on the polishing shape predicted by the shape predicting means and adjusting the positions of the annular members.

【００２９】本発明の研磨方法は上述したところの平面
創成研磨方式ではなく、全面均等研磨方式である。即
ち、試料の被研磨面状態に関わらずその被研磨面状態に
倣って被研磨面状態を保ちつつ全面を等分量に研磨除去
することを目的とするものである。The polishing method of the present invention is not a flat surface generation polishing system as described above, but is an entire surface uniform polishing system. That is, it is an object of the present invention to polish and remove the entire surface in equal amounts while maintaining the polished surface state irrespective of the polished surface state of the sample.

【００３０】ここで、まず研磨の現象を被研磨面の全体
で考えるのでなく、一つの点で起こる現象を考える。次
に、この現象を被研磨面の全体でどのように均等に作用
させるかを、即ち、被研磨面の全体で制御する方法を見
出す。Here, first, a phenomenon that occurs at one point is considered, instead of considering the polishing phenomenon on the entire surface to be polished. Next, a method for controlling how this phenomenon is uniformly applied to the entire surface to be polished, that is, a method for controlling the entire surface to be polished will be found.

【００３１】一般に研磨量に比較的大きく影響する要因
として試料の研磨パッドへの押付力があり、この押付力
は殆ど研磨量に対して比例関係にある。この押付力を円
板形の試料の被研磨面をその直径方向に区分した複数の
試料区分域ごとに制御することができれば被研磨面を任
意の形状に研磨することが可能となり、また、均一に研
磨することが可能となる。従来の上述したところの２層
パッド等の研磨パッド構成とした場合、研磨パッドの裏
面側にある軟質部材が試料の被研磨面に追従するという
効果により均等に研磨されると云うように考えられてい
たが、これはとりもなおさず、被研磨面の全面に研磨パ
ッドが均等に押付力を及ぼすことによるものであるとい
っていることに外ならない。Generally, a factor that relatively largely affects the polishing amount is a pressing force of the sample against the polishing pad, and this pressing force is almost proportional to the polishing amount. If this pressing force can be controlled for each of a plurality of sample sections in which the surface to be polished of the disk-shaped sample is divided in the diameter direction, the surface to be polished can be polished to an arbitrary shape and the uniformity can be obtained. Can be polished. In the case of a conventional polishing pad structure such as a two-layer pad described above, it is considered that the soft member on the back side of the polishing pad is evenly polished by the effect of following the polished surface of the sample. However, this is not to say that this is due to the fact that the polishing pad exerts a uniform pressing force on the entire surface to be polished.

【００３２】本発明はこの均等に押付力を及ぼす方法に
ついて、実際に押付力の分布を測定し、測定した第１の
押付力分布の形態を独自の手法により解析して被研磨面
の複数の試料区分域に加わる第２の押付力分布を算出
し、この算出した第２の押付力分布に基づいて実研磨で
の研磨形状を予測する。According to the present invention, a method of uniformly applying the pressing force is to actually measure the distribution of the pressing force and analyze the form of the measured first pressing force distribution by a unique method to analyze a plurality of the polished surfaces. A second pressing force distribution applied to the sample section is calculated, and a polishing shape in actual polishing is predicted based on the calculated second pressing force distribution.

【００３３】しかして、第１発明乃至第４発明及び第９
発明にあっては、実研磨の前工程として試料と研磨パッ
ドとの間の第１の押付力分布を測定し、測定した第１の
押付力分布に基づいて被研磨面をその直径方向に区分し
た複数の試料区分域に加わる第２の押付力分布を算出す
ることにより、実研磨での研磨形状を高精度に予測する
ことができる。従って、この予測した研磨形状が所望の
研磨形状に対し許容されない試料が実研磨されることを
防止でき、予測した研磨形状が所望の研磨形状に対し許
容される試料についてのみ実研磨することができる。ま
た、請求項３にあっては、試料と研磨パッドとの間の押
付力分布評価の評価域を研磨に寄与する接触域にできる
限り近づけることができるため、第２の押付力分布の形
状から実研磨での研磨形状をより一層精度よく予測する
ことができる。Thus, the first to fourth inventions and the ninth invention
In the present invention, the first pressing force distribution between the sample and the polishing pad is measured as a pre-process of actual polishing, and the surface to be polished is divided in the diameter direction based on the measured first pressing force distribution. By calculating the second distribution of the pressing force applied to the plurality of sample sections, it is possible to accurately predict the polishing shape in actual polishing. Therefore, it is possible to prevent actual polishing of a sample whose predicted polishing shape is not permissible for a desired polishing shape, and to perform actual polishing only for a sample whose predicted polishing shape is permissible for a desired polishing shape. . According to the third aspect, the evaluation area of the pressing force distribution evaluation between the sample and the polishing pad can be made as close as possible to the contact area contributing to polishing. The polishing shape in actual polishing can be more accurately predicted.

【００３４】第５発明及び第１０発明にあっては、実研
磨での研磨形状を予測した後、この予測結果に基づいて
研磨開始の可否を自動的に判定することができ、研磨開
始が可能な試料の全てを所望の研磨形状に研磨すること
が可能である。According to the fifth and tenth aspects of the present invention, after the polishing shape in actual polishing is predicted, it is possible to automatically determine whether or not polishing is to be started based on the prediction result. It is possible to polish all of the various samples into a desired polish shape.

【００３５】第６発明にあっては、予測した研磨形状に
基づいて複数の研磨基板の一つを選択し、この研磨基板
を取り替えるため、研磨パッドに加わる押付力分布を予
測した研磨形状に最適な押付力分布に変えることがで
き、試料を所望の研磨形状に研磨することができる。According to the sixth aspect of the present invention, one of a plurality of polishing substrates is selected based on the predicted polishing shape, and since this polishing substrate is replaced, the distribution of the pressing force applied to the polishing pad is optimized for the predicted polishing shape. And the sample can be polished to a desired polishing shape.

【００３６】第７発明及び第８発明と、第１１発明及び
第１２発明とにあっては、予測した研磨形状に基づいて
研磨定盤の円環部材を独立して夫々移動させるため、研
磨パッドに加わる押付力分布を予測した研磨形状に最適
な押付力分布に補正することができ、試料を予め定めた
研磨形状に研磨することができる。In the seventh and eighth inventions and the eleventh and twelfth inventions, the polishing pad is used for independently moving the annular members of the polishing platen based on the predicted polishing shape. Can be corrected to a pressing force distribution optimal for the predicted polishing shape, and the sample can be polished to a predetermined polishing shape.

【００３７】[0037]

【発明の実施の形態】以下本発明をその実施の形態を示
す図面に基づいて詳述する。 実施の形態１ 図１は本発明に係る研磨装置の要部の構成を示す縦断面
図である。この研磨装置は、その表面が下向きとなる研
磨パッド２を有し、鉛直線の回りを回転が可能であり、
鉛直線の長手方向に昇降が可能な平面視円形の研磨定盤
１と、該研磨定盤１の下側に前記研磨パッド２と向き合
うように複数が配され、鉛直線の回りを回転が可能な平
面視円形の試料保持器３と、これら試料保持器３を支持
し、鉛直線の回りを回転が可能な支持定盤４と、前記研
磨パッド２の中央部にシリカ等の研磨粒子が含有された
研磨液（研磨剤）を供給する管状の研磨剤供給部５とを
備え、前記試料保持器３が保持する円板形の試料Ａを研
磨パッド２に押付けた状態で研磨定盤１、試料保持器３
及び支持定盤４を夫々回転させ、前記研磨剤供給部５か
ら研磨定盤１の中央部へ研磨剤を供給しつつ前記試料Ａ
の被研磨面ａを研磨し、該被研磨面ａを平坦化すること
が可能としてある。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings showing the embodiments. Embodiment 1 FIG. 1 is a longitudinal sectional view showing a configuration of a main part of a polishing apparatus according to the present invention. This polishing apparatus has a polishing pad 2 whose surface faces downward, can rotate around a vertical line,
A polishing platen 1 having a circular shape in a plan view and capable of ascending and descending in the longitudinal direction of a vertical line, and a plurality of polishing plates 2 are arranged below the polishing platen 1 so as to face the polishing pad 2 and can rotate around the vertical line. A sample holder 3 having a circular shape in a plan view, a supporting platen 4 supporting the sample holder 3 and rotatable around a vertical line, and containing abrasive particles such as silica in the center of the polishing pad 2. And a tubular polishing agent supply section 5 for supplying a polishing liquid (polishing agent). The polishing platen 1 is pressed while the disk-shaped sample A held by the sample holder 3 is pressed against the polishing pad 2. Sample holder 3
And the supporting platen 4 is rotated to supply the polishing agent from the polishing agent supply unit 5 to the center of the polishing platen 1 while the sample A
Is polished, and the polished surface a can be planarized.

【００３８】試料保持器３は研磨パッド２と向き合う面
に負圧によって前記試料Ａを吸着保持することが可能な
吸着保持部３ａを有している。試料保持器３は研磨定盤
１の半径寸法よりも小さい直径寸法であり、研磨定盤１
の回転中心に対し偏倚した位置に回転が可能に複数が配
されており、研磨定盤１の下降により研磨パッド２を試
料Ａに押付けて接触させ、該試料Ａに適宜の研磨圧を加
えることができるようにしてある。The sample holder 3 has, on a surface facing the polishing pad 2, a suction holding portion 3a capable of holding the sample A by suction under a negative pressure. The sample holder 3 has a diameter smaller than the radius of the polishing table 1, and the polishing table 1
The polishing pad 2 is pressed against the sample A by lowering the polishing table 1 to apply a suitable polishing pressure to the sample A. I can do it.

【００３９】図２は研磨装置が用いられる研磨システム
を模式的に示す平面図である。前記研磨装置が収容され
た研磨室Ｂと、該研磨室Ｂ及びクリーンルーム室Ｃの間
に中間室Ｄを介して配され、前記試料Ａが搬出入される
ロード室Ｅと、前記研磨室Ｂ及びロード室Ｅの境界部の
側方に配され、研磨された試料Ａを洗浄する洗浄室Ｆと
を備えており、クリーンルーム室Ｃからロード室Ｅへ搬
入された試料カセット１０内の試料Ａを中間室Ｄを介し
て研磨室Ｂへ搬送し、研磨された後の試料Ａが洗浄室Ｆ
へ搬送され、自動で洗浄された後の試料Ａがロード室Ｅ
の元の試料カセット１０に回収できるシステムになって
いる。FIG. 2 is a plan view schematically showing a polishing system using the polishing apparatus. A polishing chamber B in which the polishing apparatus is housed; a load chamber E disposed between the polishing chamber B and the clean room chamber C via an intermediate chamber D to which the sample A is carried in and out; A cleaning chamber F for cleaning the polished sample A, which is disposed on the side of the boundary portion of the load chamber E, and intermediate the sample A in the sample cassette 10 carried into the load chamber E from the clean room chamber C; The sample A after being transported to the polishing chamber B through the chamber D and polished is
The sample A after being transported to the
Of the original sample cassette 10.

【００４０】ロード室Ｅにはクリーンルーム室Ｃから搬
出入ゲートを経て搬入された試料カセット１０内の試料
Ａを移送ゲートから中間室Ｄへ搬入する搬送アーム１１
と、洗浄室Ｆ内の試料Ａを移送ゲートから搬入する搬入
アーム１２と、試料ステージ１３とが設けられている。The transfer arm 11 for loading the sample A in the sample cassette 10 loaded from the clean room C through the loading / unloading gate into the intermediate chamber D through the loading / unloading gate.
, A loading arm 12 for loading the sample A in the cleaning chamber F from the transfer gate, and a sample stage 13.

【００４１】中間室Ｄには前記搬送アーム１１が搬送し
た試料Ａを支持する試料ステージ１４と、該試料ステー
ジ１４上の試料Ａを移送ゲートを介して研磨室Ｂへ搬送
する搬送アーム１５が設けられている。The intermediate chamber D is provided with a sample stage 14 for supporting the sample A transferred by the transfer arm 11 and a transfer arm 15 for transferring the sample A on the sample stage 14 to the polishing chamber B via a transfer gate. Have been.

【００４２】研磨室Ｂには、前記搬送アーム１５が搬送
した試料Ａを受け取るロードリフト１６と、該ロードリ
フト１６上の試料Ａを前記試料保持器３に移載する移載
アーム１７と、夫々の試料保持器３に保持された試料Ａ
及び研磨パッド２の間の測定位置と待機位置とに移動が
可能であり、試料Ａ及び研磨パッド２に当接して押付力
分布を測定するセンサーシート６と、試料保持器３と一
次洗浄部１８との間にて試料Ａを移載する移載アーム１
９と、研磨された試料Ａを前記試料保持器３からアンロ
ードリフト２０に移載する移載アーム２１と、アンロー
ドリフト２０上の試料Ａを試料カセット２２に一枚ごと
に搬送する搬送アーム２３とを備えている。In the polishing chamber B, a load lift 16 for receiving the sample A transported by the transport arm 15, and a transfer arm 17 for transferring the sample A on the load lift 16 to the sample holder 3, respectively. A held in the sample holder 3
And a sensor sheet 6 that can move to a measurement position and a standby position between the polishing pad 2 and the sample sheet 3 for measuring the pressing force distribution by contacting the sample A and the polishing pad 2, the sample holder 3, and the primary cleaning unit 18. Transfer arm 1 for transferring sample A between
9, a transfer arm 21 for transferring the polished sample A from the sample holder 3 to the unload lift 20, a transfer arm 23 for transferring the sample A on the unload lift 20 to the sample cassette 22 one by one, It has.

【００４３】洗浄室Ｆには、前記搬送アーム１１と同様
に構成された搬送アーム、洗浄手段、乾燥手段等が設け
られており、洗浄した後の試料Ａは前記搬入アーム１２
によってロード室Ｅの試料ステージ１３に移載される。The cleaning chamber F is provided with a transfer arm, a washing means, a drying means, etc., which are constructed in the same manner as the transfer arm 11.
Is transferred to the sample stage 13 in the load chamber E.

【００４４】センサーシート６には、該センサーシート
６が測定した押付力分布を表示することが可能な第１の
情報処理装置２４と、センサーシート６が測定した第１
の押付力分布の測定値に基づいて押付力分布積算値及び
押付力分布積算値均一性を求める第２の情報処理装置２
５とが夫々接続されている。押付力分布積算値及び押付
力分布積算値均一性の説明は後述する。The sensor sheet 6 has a first information processing device 24 capable of displaying the distribution of the pressing force measured by the sensor sheet 6, and a first information processing device 24 capable of displaying the distribution of the pressing force measured by the sensor sheet 6.
Second information processing apparatus 2 for obtaining a pressing force distribution integrated value and a pressing force distribution integrated value uniformity based on the measured value of the pressing force distribution of FIG.
5 are connected to each other. The description of the pressing force distribution integrated value and the uniformity of the pressing force distribution integrated value will be described later.

【００４５】次に押付力分布の測定システムについて説
明する。押付力分布測定器を構成するセンサーシート６
は、導電性の液体が格子状の複数の室に封入されてお
り、その格子の交点で押付力を検知する。センサーシー
ト６に押付力が加わるとその押付力に応じて格子状の室
に封入された液体が押しつぶされ、この液体の断面積が
小さくなることに付随する電気抵抗値の変化により押付
力の大小を検知する。また、センサーシート６は前記試
料Ａの大きさによりも若干大きく形成されており、例え
ば４４行４４列の格子の室を有する。即ち、一つの試料
Ａの被研磨面ａを４４×４４等分した各点の押付力を測
定することができるようにしてある。この被研磨面ａの
全面を含む４４×４４の押付力の配列からなるマトリッ
クスを押付力分布と呼ぶ。Next, a system for measuring the distribution of pressing force will be described. Sensor sheet 6 constituting the pressing force distribution measuring device
In the (2), a conductive liquid is sealed in a plurality of lattice-shaped chambers, and a pressing force is detected at an intersection of the lattice. When a pressing force is applied to the sensor sheet 6, the liquid sealed in the lattice-shaped chamber is crushed in accordance with the pressing force, and the magnitude of the pressing force is changed due to a change in electric resistance value accompanying a decrease in the cross-sectional area of the liquid. Is detected. The sensor sheet 6 is formed slightly larger than the size of the sample A, and has, for example, a 44 × 44 lattice chamber. That is, the pressing force at each point obtained by equally dividing the polished surface a of one sample A by 44 × 44 can be measured. A matrix composed of an array of 44 × 44 pressing forces including the entire surface to be polished a is called a pressing force distribution.

【００４６】図３は押付力分布の測定方法を示す断面
図、図４は押付力分布を測定する過程を示す説明図であ
る。押付力分布の測定方法は、全ての試料保持器３に試
料Ａを保持した状態で、夫々の試料Ａの上に前記センサ
ーシート６を配置する（図４の＃１）。これらセンサー
シート６には、コネクターを通して前記第１の情報処理
装置２４が接続されている。FIG. 3 is a sectional view showing a method of measuring the pressing force distribution, and FIG. 4 is an explanatory diagram showing a process of measuring the pressing force distribution. The method of measuring the pressing force distribution is such that the sensor sheet 6 is arranged on each sample A while holding the sample A in all the sample holders 3 (# 1 in FIG. 4). The first information processing device 24 is connected to these sensor sheets 6 through connectors.

【００４７】そして、センサーシート６の上側から研磨
パッド２が設けられた研磨定盤１を回転させることなく
下降し、実研磨時に用いる押付力で研磨パッド２をセン
サーシート６に押付ける（図４の＃２）。この押付けに
よりセンサーシート６が押付力分布を測定する。即ち、
研磨パッド２の押付けにより該研磨パッド２と試料Ａと
の間に挟まれたセンサーシート６の夫々の格子の交点で
の押付力が測定され（図４の＃３）、この測定された複
数箇所での押付力が第１の押付力分布として第１の情報
処理装置２４に表示される。この測定した第１の押付力
分布を一つの測定値として前記第２の情報処理装置２５
に保存する。Then, the polishing platen 1 provided with the polishing pad 2 is lowered from the upper side of the sensor sheet 6 without rotating, and the polishing pad 2 is pressed against the sensor sheet 6 by a pressing force used in actual polishing (FIG. 4). # 2). By this pressing, the sensor sheet 6 measures the pressing force distribution. That is,
By pressing the polishing pad 2, the pressing force at the intersections of the respective grids of the sensor sheet 6 sandwiched between the polishing pad 2 and the sample A is measured (# 3 in FIG. 4), and the measured plural positions are measured. Is displayed on the first information processing device 24 as a first pressing force distribution. The measured first pressing force distribution is regarded as one measured value, and the second information processing device 25 is used as the measured value.
To save.

【００４８】図５は押付力分布を測定する箇所について
の説明図である。第１の押付力分布を測定する箇所は、
試料保持器３に保持された試料Ａの上に置いたセンサー
シート６及び試料Ａの位置はそのままの状態とし、押付
けを解除した状態で研磨パッド２を１／８回転させて上
述したところと同様の手順で押付力分布を測定し、さら
に、研磨パッド２を１／８回転させて上述したところと
同様の手順で押付力分布を測定するという要領で、これ
を最初から数えて８回行い、これら測定した押付力分布
を前記第２の情報処理装置２５に保存する。この８回と
いう測定回数については、前記研磨装置において、試料
Ａと研磨パッド２との間の押付力分布評価の評価域が、
研磨パッド２の研磨に寄与する接触域の半分以上となる
ためである（図６参照）。FIG. 5 is an explanatory diagram of a portion where the pressing force distribution is measured. The place where the first pressing force distribution is measured is as follows:
The positions of the sensor sheet 6 and the sample A placed on the sample A held by the sample holder 3 are left as they are, and the polishing pad 2 is rotated by 1/8 of a turn in a state where the pressing is released. The pressing force distribution was measured by the procedure described above, and the pressing force distribution was measured by the same procedure as that described above by rotating the polishing pad 2 by 1/8. The measured pressing force distribution is stored in the second information processing device 25. With respect to the number of measurements of eight times, in the polishing apparatus, the evaluation range of the pressing force distribution evaluation between the sample A and the polishing pad 2 is:
This is because it is more than half of the contact area that contributes to polishing of the polishing pad 2 (see FIG. 6).

【００４９】もしも試料Ａと研磨パッド２との間の押付
力分布評価の評価域が研磨に寄与する接触域の半分未満
であった場合、複数回測定して得られた第１の押付力分
布の形状から実研磨での研磨形状を精度良く予測するこ
とが困難になる。逆に、試料Ａと研磨パッド２との間の
押付力分布評価の評価域を研磨に寄与する接触域にでき
る限り近づけることにより、複数回測定して得られた第
１の押付力分布の形状から実研磨での研磨形状を精度よ
く予測することが可能となる。If the evaluation area of the evaluation of the pressing force distribution between the sample A and the polishing pad 2 is less than half of the contact area contributing to polishing, the first pressing force distribution obtained by performing a plurality of measurements is obtained. It becomes difficult to accurately predict the polishing shape in actual polishing from the shape of the polishing. Conversely, by making the evaluation area of the pressing force distribution evaluation between the sample A and the polishing pad 2 as close as possible to the contact area contributing to polishing, the shape of the first pressing force distribution obtained by performing a plurality of measurements is obtained. From this, it is possible to accurately predict the polishing shape in actual polishing.

【００５０】上述したように取得した８つの第１の押付
力分布は、研磨に関与する研磨パッド２の表面が、一つ
の試料Ａの被研磨面ａに与える全ての押付力分布を示し
ている。The eight first pressing force distributions obtained as described above show all the pressing force distributions that the surface of the polishing pad 2 involved in polishing gives to the polished surface a of one sample A. .

【００５１】図６は測定された押付力分布を処理する方
法についての説明図、図７は押付力帯と押付力帯に加わ
る平均押付力との関係を示す押付力分布区分図、図８は
研磨形状を予測する過程を示す説明図である。測定され
た第１の押付力分布の処理は、前記被研磨面ａをその直
径方向に区分して複数の試料区分域とし、さらに上述し
たように取得した８つの第１の押付力分布を平面視円形
の研磨パッド２の中心と同心上に前記試料区分域と同数
に区分けする（図８の＃４）（図６及び図７参照）。FIG. 6 is an explanatory diagram of a method of processing the measured pressing force distribution, FIG. 7 is a pressing force distribution division diagram showing a relationship between a pressing force band and an average pressing force applied to the pressing force band, and FIG. It is explanatory drawing which shows the process of estimating a grinding | polishing shape. The processing of the measured first pressing force distribution is such that the surface to be polished a is divided in the diameter direction into a plurality of sample division areas, and the eight first pressing force distributions obtained as described above are converted into planes. The polishing pad 2 is divided into the same number as that of the sample division areas concentrically with the center of the circular polishing pad 2 (# 4 in FIG. 8) (see FIGS. 6 and 7).

【００５２】この区分けされた夫々の接触域をパッド区
分域（以下押付力帯という）とし（図８の＃５）、夫々
の押付力帯について、その接触域にある押付力の平均値
を算出する（図８の＃６）。この算出した平均値をその
押付力帯の平均押付力と定義する。Each of the divided contact areas is defined as a pad divided area (hereinafter referred to as a pressing force band) (# 5 in FIG. 8), and for each pressing force band, an average value of the pressing force in the contact area is calculated. (# 6 in FIG. 8). The calculated average value is defined as the average pressing force of the pressing force band.

【００５３】この平均押付力とは、指定の押付力帯が被
研磨面ａの任意の点を通過するときに、研磨パッド２が
試料Ａに与える平均押付力のことである。この平均押付
力を夫々の押付力帯ごとに並べてグラフ化したものを押
付力分布区分図とする（図７参照）。The average pressing force is an average pressing force applied to the sample A by the polishing pad 2 when a specified pressing force band passes an arbitrary point on the surface a to be polished. A graph in which the average pressing force is arranged for each pressing force band and plotted is referred to as a pressing force distribution division diagram (see FIG. 7).

【００５４】実研磨での研磨形状について、研磨装置の
剛性が十分にある状態では、試料保持器３に保持された
試料Ａは自転しているため、研磨の対称性は保たれ、試
料Ａの円周方向での研磨量はほぼ同等であると仮定する
ことができる。よって試料Ａの被研磨面ａでの研磨量形
状評価は、試料Ａの直径方向の研磨量の形状で評価す
る。Regarding the shape of the actual polishing, when the rigidity of the polishing apparatus is sufficient, the sample A held in the sample holder 3 rotates, so that the symmetry of polishing is maintained and the sample A The amount of polishing in the circumferential direction can be assumed to be approximately equal. Therefore, the shape evaluation of the polishing amount on the polished surface a of the sample A is performed based on the shape of the polishing amount in the diameter direction of the sample A.

【００５５】研磨パッド２が試料Ａに及ぼす押付力分布
の形状についても同様に、主として試料Ａの円周方向は
試料Ａが自転していることにより同等に圧力が加わるも
のと仮定し、押付力分布の形状評価も試料Ａの直径方向
の押付力分布形状の評価を考えることとする。Similarly, regarding the shape of the distribution of the pressing force exerted on the sample A by the polishing pad 2, it is assumed that the pressure is applied equally in the circumferential direction of the sample A due to the rotation of the sample A. The shape evaluation of the distribution also considers the evaluation of the pressing force distribution shape in the diameter direction of the sample A.

【００５６】図９は被研磨面の任意の半径寸法の円周が
受ける押付力分布積算値を算出する方法の説明図であ
る。上述で得られた押付力分布区分図（図７参照）に基
づいて、被研磨面ａの任意の半径寸法ｒの円周が受ける
押付力分布積算値を算出し（図８の＃７）、この押付力
分布積算値を前記試料区分域の夫々に加わる第２の押付
力分布とする。この押付力分布積算値を算出するには、
前記被研磨面ａの任意の半径寸法ｒの円周が、１周（２
π）に対して夫々の前記押付力帯を通過する割合、換言
すれば試料が一回転する間で試料区分域が前記押付力帯
を通過する割合を算出する。この通過する割合と前記押
付力帯の平均押付力とを乗算する。この平均押付力を全
ての前記押付力帯について計算し、これらを全て積算し
て半径寸法ｒの押付力分布積算値とする。FIG. 9 is an explanatory diagram of a method of calculating the integrated value of the distribution of the pressing force applied to the circumference having an arbitrary radius of the polished surface. Based on the pressing force distribution section diagram obtained above (see FIG. 7), a pressing force distribution integrated value received on the circumference of an arbitrary radius r of the polished surface a is calculated (# 7 in FIG. 8), The integrated value of the pressing force distribution is defined as a second pressing force distribution applied to each of the sample division areas. To calculate the accumulated value of the pressing force distribution,
The circumference of the polished surface a having an arbitrary radius dimension r is one circumference (2
For π), the ratio of passing the pressing force band in each of the pressing force bands, in other words, the ratio of the sample divided area passing the pressing force band during one rotation of the sample is calculated. This passing ratio is multiplied by the average pressing force of the pressing force band. This average pressing force is calculated for all the pressing force bands, and these are all integrated to obtain a pressing force distribution integrated value of the radius dimension r.

【００５７】例えば、押付力帯Ｐ３について考えれば、
半径寸法ｒの被研磨面ａの円周１周分（２π）に対し
て、区分域が２回だけθ３程通過している。従って、半
径寸法ｒの円周が押付力帯Ｐ３から受ける押付力は、 Ｐｒ３＝Ｐ(3) ＊（２＊θ３／２＊π） （１−１） Ｐ(3) ：Ｐ３の押付力帯が与える平均押付力 Ｐｒ３：半径寸法ｒの円周が押付力帯Ｐ３から受ける押
付力For example, considering the pressing force zone P3,
The sectioned area has passed twice about θ3 for one circumference (2π) of the surface to be polished a with the radius dimension r. Accordingly, the pressing force received by the circumference of the radius dimension r from the pressing force band P3 is: Pr3 = P (3) * (2 * θ3 / 2 * π) (1-1) P (3): The pressing force band of P3. Pressing force given by the pressure Pr3: pressing force that the circumference of the radius dimension r receives from the pressing force band P3

【００５８】このように半径寸法ｒの円周が、押付力帯
Ｐ１からＰ１２まで夫々の押付力帯から受ける平均押付
力を計算する。 Ｐｒｉ＝Ｐ(i) ＊（２＊θｉ／２＊π） （１−２） （ｉ＝１，２，３，４，……，１２） これら平均押付力を全て積算して半径寸法ｒの円周が受
ける押付力分布積算値Ｐｒを算出する。 Pr= Pr1 + Pr2 + Pr3 + Pr4 + ………+ Pr12 （１−３） ∴Pr=P(1)*(2* θ1/2*π)+P(2)*(2*θ2/2*π)+………+P(12)*(2*12/2* π）As described above, the average pressing force received by the circumference of the radius dimension r from the pressing force bands P1 to P12 is calculated. Pri = P (i) * (2 * θi / 2 * π) (1-2) (i = 1, 2, 3, 4,..., 12) These average pressing forces are all integrated and the radius dimension r is calculated. Calculate the pressing force distribution integrated value Pr received by the circumference. Pr = Pr1 + Pr2 + Pr3 + Pr4 + ……… + Pr12 (1-3) ∴Pr = P (1) * (2 * θ1 / 2 * π) + P (2) * (2 * θ2 / 2 * π) + ……… + P (12) * (2 * 12/2 * π)

【００５９】以上では半径寸法ｒを被研磨面ａの半径寸
法以下の任意の半径寸法ｒとしているが、８インチ試料
Ａの場合、半径寸法ｒは０mmから１００mmまでとること
ができる。たとえば半径寸法ｒを２mm刻みで０mmから１
００mmまで計算すると、５１個の押付力分布積算値を求
めることができる。これら５１個の押付力分布積算値の
ばらつきから押付力分布積算値均一性を算出する（図８
の＃８）。ここで押付力分布積算値均一性を次のように
定義する。 ＰＤ(%) ＝StDev.(Pr1〜51)/Average(Pr1 〜51)*100 （１−４） PD：押付力分布積算値均一性StDev.(Pr1〜51) ：押付力
分布積算値の標準偏差Average(Pr1 〜51) ：押付力分布
積算値の平均値In the above description, the radius r is an arbitrary radius r smaller than the radius of the surface a to be polished. However, in the case of the 8-inch sample A, the radius r can be from 0 mm to 100 mm. For example, the radius dimension r is changed from 0 mm to 1 in increments of 2 mm.
By calculating up to 00 mm, 51 pressing force distribution integrated values can be obtained. From the dispersion of the 51 pressing force distribution integrated values, the uniformity of the pressing force distribution integrated values is calculated (FIG. 8).
# 8). Here, the pressing force distribution integrated value uniformity is defined as follows. PD (%) = StDev. (Pr1 to 51) / Average (Pr1 to 51) * 100 (1-4) PD: Uniformity of accumulated value of pressing force distribution StDev. (Pr1 to 51): Standard of accumulated value of pushing force distribution Deviation Average (Pr1 to 51): Average value of accumulated push force distribution

【００６０】次に研磨均一性を算出する（図８の＃
９）。この研磨均一性を算出するには、以下の４８パー
トの研磨量の測定を行い、そのばらつきを評価すること
で求める。４８パートの測定点は、以下の様にとる。 試料Ａはオリフラ方向を２７０°の方向にする。 半径寸法方向(0、20、40、60、80、90、95) 単位(mm) 円周方向(0、45、90、135、180、225、270、315) 単位( °) を満たす夫々の点とする。ただし、オリフラ方向の半径
寸法９５mmの点は削除する。ここで研磨均一性は次のよ
うに定義する。 ＰＵ(%) ＝StDev(PA1 〜48)/Average(PA1 〜48)*100 （１−５） PU：研磨均一性 StDev(PA1 〜48) ：研磨量の標準偏差 Average(PA1 〜48) ：研磨量の平均値Next, the polishing uniformity is calculated (# in FIG. 8).
9). In order to calculate the polishing uniformity, the polishing amount is measured for the following 48 parts, and the polishing amount is determined by evaluating the variation. The measurement points for 48 parts are as follows. The orientation of the sample A is 270 °. Radial dimension direction (0, 20, 40, 60, 80, 90, 95) Unit (mm) Circumferential direction (0, 45, 90, 135, 180, 225, 270, 315) Unit (°) Point. However, a point with a radius of 95 mm in the orientation flat direction is deleted. Here, the polishing uniformity is defined as follows. PU (%) = StDev (PA1 to 48) / Average (PA1 to 48) * 100 (1-5) PU: Polishing uniformity StDev (PA1 to 48): Standard deviation of polishing amount Average (PA1 to 48): Polishing Average value of quantity

【００６１】ここで、（１−４）の数式により求めた押
付力分布積算値均一性と、この押付力分布積算値均一性
を有する状態で研磨した時に得られた研磨均一性（１−
５の数式に基づく）とを比較することにより実研磨での
研磨形状を予測する（図８の＃９）。図１０は押付力分
布積算値均一性と研磨均一性とを比較した一つの例を示
す説明図、図１１は押付力分布積算値均一性と研磨均一
性とを比較した他の例を示す説明図であり、この２例の
場合の研磨条件は表２に示す。Here, the pressing force distribution integrated value uniformity obtained by the equation (1-4) and the polishing uniformity (1-1-) obtained when polishing is performed in a state having the pressing force distribution integrated value uniformity.
Then, the polishing shape in actual polishing is predicted (# 9 in FIG. 8). FIG. 10 is an explanatory view showing one example in which the pressing force distribution integrated value uniformity and the polishing uniformity are compared, and FIG. 11 is an explanatory view showing another example in which the pressing force distribution integrated value uniformity and the polishing uniformity are compared. It is a figure, and the polishing conditions in these two examples are shown in Table 2.

【００６２】[0062]

【表２】 [Table 2]

【００６３】この結果から、押付力分布積算値均一性に
よって得られた押付力分布積算値形状と研磨均一性によ
って得られた研磨形状とはほぼ同等の形状であることが
分かる。From this result, it can be seen that the shape of the integrated value of the pressing force distribution obtained by the uniformity of the integrated value of the pressing force distribution and the polishing shape obtained by the polishing uniformity are almost the same.

【００６４】図１２は押付力分布積算値均一性と研磨均
一性との相関をとった結果の説明図である。上述したと
ころの条件下で測定回数を多くとり、押付力分布積算値
均一性と研磨均一性との相関を調べたところ、図１２に
示すように押付力分布積算値均一性及び研磨均一性に対
し良い相関が得られた。FIG. 12 is an explanatory diagram of a result obtained by correlating the uniformity of the integrated value of the pressing force distribution and the polishing uniformity. Under the conditions described above, the number of measurements was increased, and the correlation between the pressing force distribution integrated value uniformity and the polishing uniformity was examined. As shown in FIG. 12, the pressing force distribution integrated value uniformity and the polishing uniformity were reduced. Good correlation was obtained.

【００６５】ここで研磨均一性、押付力分布積算値均一
性の符号は次式で定義する。 研磨均一性 PA(0〜50mm)/PA(51 〜100mm)<1→ - （センタースロー
形状） PA(0〜50mm)/PA(51 〜100mm)>1→ + （センターファー
スト形状） PA(0〜50mm) ：半径寸法0mm 〜50mmの平均研磨量 PA(51 〜100mm)：半径寸法51mm〜100mm の平均研磨量 押付力分布積算値均一性 PD(0〜50mm)/PD(51 〜100mm)<1→ - （センタースロー
形状） PD(0〜50mm)/PD(51 〜100mm)>1→ + （センターファー
スト形状） PD(0〜50mm) ：半径寸法0mm 〜50mmの平均押付力分布積
算値均一性 PD(51 〜100mm)：半径寸法51mm〜100mm の平均押付力分
布積算値均一性Here, the signs of the polishing uniformity and the pressing force distribution integrated value uniformity are defined by the following equations. Polishing uniformity PA (0-50mm) / PA (51-100mm) <1 →-(Center slow shape) PA (0-50mm) / PA (51-100mm)> 1 → + (Center first shape) PA (0 ): Average polishing amount of radius 0 mm to 50 mm PA (51 to 100 mm): Average polishing amount of radius 51 mm to 100 mm Pressing force distribution integrated value uniformity PD (0 to 50 mm) / PD (51 to 100 mm) < 1 →-(Center slow shape) PD (0 to 50 mm) / PD (51 to 100 mm)> 1 → + (Center first shape) PD (0 to 50 mm): Uniform average pressing force distribution integrated value of radial dimension 0 mm to 50 mm PD (51 to 100mm): Uniformity of average pressing force distribution integrated value of radius dimension 51mm to 100mm

【００６６】これにより、測定時の押付力分布積算値均
一性から研磨均一性、換言すれば測定時の押付力分布積
算値（第２の押付力分布）から実研磨での研磨形状を図
１０、図１１に基づいて精度よく予測することができ、
また、異なる試料を用いて押付力分布積算値の算出と同
じ方法で予め算出された第３の押付力分布とを比較して
実研磨での研磨形状を精度よく予測することができ、ま
た、次の数式により容易に予測することができる。 Ｙ＝０．９０１１＊Ｘ＋２．０３１１ （１−６） Ｙ：研磨均一性 Ｘ：押付力分布積算値均一性As a result, the polishing shape in actual polishing is determined from the uniformity of the pressing force distribution integrated value at the time of measurement to the polishing uniformity, in other words, the integrated value of the pressing force distribution (second pressing force distribution) at the time of measurement. , And can be accurately predicted based on FIG.
Further, it is possible to accurately predict the polishing shape in actual polishing by comparing the third pressing force distribution calculated in advance by the same method as the calculation of the pressing force distribution integrated value using different samples, and It can be easily predicted by the following formula. Y = 0.9011 * X + 2.0311 (1-6) Y: Polishing uniformity X: Pressing force distribution integrated value uniformity

【００６７】この（１−６）の数式は、研磨均一性が押
付力分布積算値均一性と比較して約２％だけセンターフ
ァースト形状になることを示している。例えば、−３．
５％の押付力分布積算値均一性が得られた場合、表２の
研磨条件下では、研磨均一性は（１−６）の数式に代入
すると−１．１２３％となることから、研磨均一性は
１．１２３％のセンタースロー形状が得られると予測さ
れる。The equation (1-6) indicates that the polishing uniformity has a center-first shape by about 2% as compared with the pressing force distribution integrated value uniformity. For example, -3.
When the pressing force distribution integrated value uniformity of 5% is obtained, the polishing uniformity becomes −1.123% when substituted into the mathematical expression of (1-6) under the polishing conditions in Table 2, so that the polishing uniformity is obtained. The properties are expected to give a center throw shape of 1.123%.

【００６８】以上説明した方法は、次に示す３つのタイ
プの研磨装置においても適用することができる。図１３
は研磨装置の別の構成を示す縦断面図、図１４は図１３
で示す研磨装置の研磨パッド及び試料の間の押付力分布
評価領域を示す説明図である。この研磨装置は、上向き
の研磨パッド２を有する回転が可能な研磨定盤１の上側
に、研磨パッド２と向き合う試料保持部ａを有する回転
が可能な複数の試料保持器３及びこれら試料保持器３を
支持する回転が可能な支持定盤４を配したものである。The method described above can also be applied to the following three types of polishing apparatuses. FIG.
Is a longitudinal sectional view showing another configuration of the polishing apparatus, and FIG.
It is explanatory drawing which shows the pressing force distribution evaluation area | region between a polishing pad and a sample of the polishing apparatus shown by. This polishing apparatus comprises a plurality of rotatable sample holders 3 having a sample holder a facing a polishing pad 2 above a rotatable polishing platen 1 having an upwardly facing polishing pad 2 and these sample holders. 3 is provided with a rotatable support platen 4 for supporting 3.

【００６９】この研磨装置においても、上述したところ
の方法と同様に８箇所程度の第１の押付力分布を測定
し、上述したところの方法と同様に押付力帯の平均押付
力、押付力分布積算値（第２の押付力分布）、押付力分
布積算値均一性を算出する。この実施の形態では、研磨
パッド２及び試料Ａ間の押付力分布の評価領域は、８箇
所を測定することによって、研磨に寄与する接触域の約
８０％以上の接触域を占めている。尚、前記押付力分布
の評価領域は、研磨パッド２の接触域の半分以上の接触
域を占めれば、実研磨での研磨形状を精度よく予測する
ことができる。Also in this polishing apparatus, the first pressing force distribution at about eight places was measured in the same manner as in the method described above, and the average pressing force and the pressing force distribution in the pressing force band were measured in the same manner as in the method described above. The integrated value (second pressing force distribution) and the pressing force distribution integrated value uniformity are calculated. In this embodiment, the evaluation area of the distribution of the pressing force between the polishing pad 2 and the sample A occupies about 80% or more of the contact area contributing to polishing by measuring eight locations. In addition, if the evaluation area of the pressing force distribution occupies half or more of the contact area of the polishing pad 2, the polishing shape in actual polishing can be accurately predicted.

【００７０】その他の構成及び作用は図１乃至図３で示
した研磨装置と同じであるため、同様の部品については
同じ符号を付し、その詳細な説明及び作用の説明を省略
する。Since other configurations and operations are the same as those of the polishing apparatus shown in FIGS. 1 to 3, the same components are denoted by the same reference numerals, and the detailed description and the description of the operations are omitted.

【００７１】図１５はベルト式の研磨装置の構成を示す
模式的正面図、図１６は接触域と、研磨パッド及び試料
の間の押付力分布評価領域との関係を示す説明図、図１
７は被研磨面の任意の半径寸法の円周が受ける押付力分
布積算値を算出する方法の説明図である。この研磨装置
は、離間するローラ間に順回転を可能として張設された
無端状の研磨パッド２ａを有する研磨定盤１の上側に、
研磨パッド２ａと向き合う試料保持部３ａを有する回転
が可能な試料保持器３を配したものである。FIG. 15 is a schematic front view showing the structure of a belt-type polishing apparatus. FIG. 16 is an explanatory view showing the relationship between a contact area and a pressing force distribution evaluation area between a polishing pad and a sample.
FIG. 7 is an explanatory diagram of a method of calculating an integrated value of a pressing force distribution received on a circumference having an arbitrary radius dimension of the polished surface. This polishing apparatus is provided above a polishing platen 1 having an endless polishing pad 2a stretched so as to enable forward rotation between separated rollers,
A rotatable sample holder 3 having a sample holder 3a facing a polishing pad 2a is provided.

【００７２】この研磨装置においては、被研磨面ａと接
触する部分の研磨パッド２ａは直線運動となるため、研
磨パッド２ａの押付力帯はその研磨パッド２ａの運動方
向に沿った平行線となる。研磨パッド２ａと試料Ａとの
間の押付力分布を図１６、図１７に示すように研磨パッ
ド２ａの１周分について順次複数回測定し、第１の押付
力分布を求める。研磨パッド２ａの運動方向に沿って区
分した夫々の押付力帯の平均押付力及び被研磨面ａの任
意の半径寸法ｒの円周が夫々の押付力帯を通過する割合
（図中θの回数）は図１６、図１７に示すような形で求
めることができ、また、押付力分布積算値（第２の押付
力分布）、押付力分布積算値均一性は上述したところの
方法と同様に算出することができる。In this polishing apparatus, the portion of the polishing pad 2a in contact with the surface to be polished a moves linearly, so that the pressing force band of the polishing pad 2a is a parallel line along the direction of movement of the polishing pad 2a. . The pressing force distribution between the polishing pad 2a and the sample A is sequentially measured a plurality of times for one round of the polishing pad 2a as shown in FIGS. 16 and 17, and a first pressing force distribution is obtained. The average pressing force of each pressing force band divided along the movement direction of the polishing pad 2a and the ratio of the circumference of an arbitrary radius r of the polished surface a passing through each pressing force band (the number of times θ in the figure) ) Can be obtained in a form as shown in FIGS. 16 and 17, and the pressing force distribution integrated value (second pressing force distribution) and the pressing force distribution integrated value uniformity are the same as in the method described above. Can be calculated.

【００７３】その他の構成及び作用は図１乃至図３で示
した研磨装置と同じであるため、同様の部品については
同じ符号を付し、その詳細な説明及び作用の説明を省略
する。Since other configurations and operations are the same as those of the polishing apparatus shown in FIGS. 1 to 3, the same reference numerals are given to the same parts, and the detailed description and the description of the operations are omitted.

【００７４】図１８は揺動式の研磨装置の構成を示す一
部を切欠いた斜視図、図１９は接触域と、研磨パッド及
び試料の間の押付力分布評価領域との関係を示す説明
図、図２０は被研磨面の任意の半径寸法の円周が受ける
押付力分布積算値を算出する方法の説明図である。この
研磨装置は、鉛直線の回りを回転が可能な研磨定盤１ａ
（又は研磨パッド２ｂのみ）が試料Ａの直径寸法の２倍
に満たない研磨装置であり、研磨定盤１ａ（又は研磨パ
ッド２ｂのみ）が、鉛直線の回りを前記研磨定盤１ａ
（又は研磨パッド２ｂのみ）と反対方向へ回転が可能な
試料保持器３に対し直線状に一方向及び他方向へ移動
（揺動）することで研磨形状を制御するようにしたもの
である。この研磨装置においては、研磨パッド２ｂの直
径寸法が小さいため、研磨パッド２ｂ上に規定する押付
力帯ではなく、研磨作用分布Ｗ(x) というものを上述し
たところの押付力帯の平均押付力に代用する。これは研
磨パッド２ｂ上に規定するパッド区分域の他に研磨パッ
ド２ｂの周速の影響を加味したものであり、パッド区分
域にその地点の研磨パッドの半径寸法を乗算して夫々の
パッド区分域の平均押付力を算出することができる。FIG. 18 is a partially cutaway perspective view showing the configuration of an oscillating polishing apparatus, and FIG. 19 is an explanatory view showing the relationship between a contact area and a pressing force distribution evaluation area between a polishing pad and a sample. FIG. 20 is an explanatory diagram of a method of calculating an integrated value of a pressing force distribution received on a circumference having an arbitrary radius dimension of the surface to be polished. This polishing apparatus comprises a polishing platen 1a capable of rotating around a vertical line.
(Or only the polishing pad 2b) is a polishing apparatus that is less than twice the diameter of the sample A, and the polishing platen 1a (or only the polishing pad 2b) moves around a vertical line.
The polishing shape is controlled by moving (swinging) linearly in one direction and the other direction with respect to the sample holder 3 rotatable in the opposite direction to (or only the polishing pad 2b). In this polishing apparatus, since the diameter of the polishing pad 2b is small, not the pressing force band defined on the polishing pad 2b, but the average pressing force of the pressing force band described above using the polishing action distribution W (x). Substitute for This takes into account the influence of the peripheral speed of the polishing pad 2b in addition to the pad section area defined on the polishing pad 2b, and multiplies the pad section area by the radius dimension of the polishing pad at that point to obtain each pad section. The average pressing force of the area can be calculated.

【００７５】Ｗ(x) ＝Ｐ(x) ＊ｒ Ｐ(x) ：パッド区分域の(x) 位置から受ける押付力W (x) = P (x) * r P (x): pressing force received from the (x) position of the pad division area

【００７６】この研磨作用分布Ｗ(x) と試料Ａの被研磨
面ａの任意の半径寸法ｒの円周が研磨作用分布Ｗ(x) を
通過する割合（図２０中θの割合）により、上述したと
ころの押付力分布積算値（第２の押付力分布）を算出す
ることができ、また、押付力分布積算値均一性は上述し
たところの方法と同様に算出することができる。The ratio (the ratio of θ in FIG. 20) of the polishing action distribution W (x) and the ratio of the circumference of an arbitrary radius r of the polished surface a of the sample A to pass through the polishing action distribution W (x). The integrated pressing force distribution value (second pressing force distribution) described above can be calculated, and the uniformity of the integrated pressing force distribution value can be calculated in the same manner as the method described above.

【００７７】実施の形態２ 実施の形態２の研磨装置は、研磨定盤１と研磨パッド２
との間に研磨基板７が配されている。この研磨基板７は
図３に記載されている如く両面が高平面精度に加工さ
れ、その一面が研磨定盤１に接触する環状の平面板７ａ
の他面に平面状の弾性部材７ｂが積層、接着され、該弾
性部材７ｂの平面板７ａと反対側の表面に前記研磨パッ
ド２が積層された構成となっている。Embodiment 2 A polishing apparatus according to Embodiment 2 comprises a polishing table 1 and a polishing pad 2.
And the polishing substrate 7 is disposed between them. As shown in FIG. 3, this polishing substrate 7 is processed on both sides with high flatness accuracy, and one side thereof is in contact with the polishing platen 1 in an annular flat plate 7a.
A planar elastic member 7b is laminated and adhered to the other surface of the polishing pad, and the polishing pad 2 is laminated on the surface of the elastic member 7b opposite to the flat plate 7a.

【００７８】弾性部材７ｂには、研磨パッド２を試料Ａ
に押付ける方向への押付力が加えられたときに複数の部
所が独立して変形するように格子状の溝又はそれに類似
する溝が縦横に交差して刻まれている。この研磨基板７
は、研磨定盤１に複数本のねじ体（図示せず）の締付け
によって取付けができるようになっており、これらねじ
体を取外すことにより弾性値が異なる別の研磨基板７と
簡易に交換することができるようになっている。The polishing pad 2 is attached to the elastic member 7b with the sample A.
A lattice-like groove or a similar groove is formed so as to intersect vertically and horizontally so that a plurality of portions are independently deformed when a pressing force in a pressing direction is applied. This polishing substrate 7
Can be attached to the polishing platen 1 by tightening a plurality of screws (not shown). By removing these screws, the polishing substrate 7 can be easily replaced with another polishing substrate 7 having a different elasticity value. You can do it.

【００７９】研磨定盤１の平面度及び研磨基板７の平面
度は、両方とも十分精度よく確保されているため、ねじ
体の締付けによる取付けであっても互いに歪みがなく取
付けることができるようになっている。The flatness of the polishing platen 1 and the flatness of the polishing substrate 7 are both sufficiently accurate, so that even if the screws are attached by tightening, they can be attached without distortion. Has become.

【００８０】弾性部材７ｂとしては、ＮＢＲゴム、シリ
コンゴム等ＪＩＳＫ６３０１でのゴム硬度で１０乃至７
０程度のゴム硬度を有し、研磨による繰り返し応力下で
ゴムの反発弾性が変化しないものが望ましい。例えば、
スポンジゴム、不織布等は、内部に空隙を有しているた
め、繰り返し応力下では、ゴムの反発弾性が変化し、そ
れに伴って研磨特性も変化し、実用的ではない。The elastic member 7b is made of NBR rubber, silicon rubber, or the like having a rubber hardness of 10 to 7 according to JIS K6301.
Desirably, the rubber has a rubber hardness of about 0 and does not change the rebound resilience of the rubber under repeated stress caused by polishing. For example,
Sponge rubber, nonwoven fabric, and the like have voids inside, so that under repetitive stress, the resilience of the rubber changes, and the polishing characteristics change accordingly, which is not practical.

【００８１】研磨パッド２は環状に形成されており、そ
の内縁部及び外縁部が夫々一対のパッドリング２７，２
７に挾着され、これらパッドリング２７，２７を研磨定
盤１の周縁部に設けられた金具に取付け、研磨基板７の
表面上で一定の張力を保った状態で締め上げることによ
り、研磨パッド２は研磨基板７の表面形状に倣って取付
けられる。このとき、研磨パッド２の表面形状は、研磨
基板７の表面形状を映し出した形になり、研磨パッド２
と試料Ａとの間の押付力分布が一意に決定されることを
意味する。この研磨基板７を表面形状が異なる他の研磨
基板７に変えることにより、その交換された新しい研磨
基板７によって研磨パッド２の表面形状が決まり、研磨
パッド２と試料Ａとの間の押付力分布が一意に決まるこ
とになる。The polishing pad 2 is formed in an annular shape, and its inner edge and outer edge are formed by a pair of pad rings 27, 2 respectively.
7, the pad rings 27, 27 are attached to metal fittings provided on the peripheral portion of the polishing platen 1, and tightened on the surface of the polishing substrate 7 while maintaining a constant tension. 2 is attached according to the surface shape of the polishing substrate 7. At this time, the surface shape of the polishing pad 2 reflects the surface shape of the polishing substrate 7, and the polishing pad 2
Means that the distribution of the pressing force between the sample and the sample A is uniquely determined. By changing the polishing substrate 7 to another polishing substrate 7 having a different surface shape, the surface shape of the polishing pad 2 is determined by the replaced new polishing substrate 7, and the pressing force distribution between the polishing pad 2 and the sample A is determined. Will be uniquely determined.

【００８２】この研磨基板７の表面形状をさまざまな形
状に変えたものを予め何段階かに分けて準備することに
より、研磨パッド２と試料Ａとの間の押付力分布を様々
に変化させることが可能となる。実施の形態２では、実
施の形態１が有する押付力分布積算値均一性と研磨均一
性の相関に基づいて予め様々な押付力分布を有する研磨
基板７を準備する。By changing the surface shape of the polishing substrate 7 into various shapes and preparing it in several stages in advance, the pressing force distribution between the polishing pad 2 and the sample A can be variously changed. Becomes possible. In the second embodiment, polishing substrates 7 having various pressing force distributions are prepared in advance based on the correlation between the integrated pressing force distribution integrated value and the polishing uniformity of the first embodiment.

【００８３】所望の研磨形状の研磨均一性を得るのに必
要な押付力分布を求め、その押付力分布に最も近い研磨
基板７を選択し、この選択した研磨基板７を研磨定盤１
に上述したように取付ける。A distribution of pressing force necessary to obtain polishing uniformity of a desired polishing shape is obtained, a polishing substrate 7 closest to the pressing force distribution is selected, and the selected polishing substrate 7 is polished to a polishing platen 1.
Attach as described above.

【００８４】この研磨基板７を選択する基準を図１２に
示す。予めこの研磨基板７は−７％センタースローから
１％おきに−１％センタースローまでの７種類と、＋１
％センターファストから１％おきに＋５％センターファ
ストまでの５種類との合計１２種類が準備されている。FIG. 12 shows the criteria for selecting the polishing substrate 7. The polishing substrate 7 has seven types, from -7% center throw to -1% center throw every 1%, and +1
A total of 12 types are prepared, including 5 types from% Center Fast to + 5% Center Fast every 1%.

【００８５】例えば、研磨均一性が３％のセンタースロ
ーの研磨形状を得たい場合、実施の形態１で示した数式
（１−６）にＹ＝−３を代入する。この結果、Ｘ＝−
５．５８３という値を得る。ここで、予め準備した研磨
基板７から押付力分布積算値均一性が−５．５８３％の
ものに最も近いものを選ぶ。ここでは、予め準備してい
る様々な押付力分布積算値均一性を有する研磨基板７の
中から−６％のものを選ぶ。For example, when it is desired to obtain a polished shape having a center throw with a polishing uniformity of 3%, Y = −3 is substituted into the equation (1-6) shown in the first embodiment. As a result, X = −
We get the value 5.583. Here, from the previously prepared polishing substrates 7, a polishing substrate having a pressing force distribution integrated value uniformity closest to that of −5.583% is selected. Here, -6% is selected from among the polishing substrates 7 having various pressing force distribution integrated value uniformities prepared in advance.

【００８６】その他の構成及び作用は実施の形態１と同
じであるため、同様の部品については同じ符号を付し、
その詳細な説明及び作用の説明を省略する。[0086] Since other configurations and operations are the same as those of the first embodiment, the same components are denoted by the same reference numerals.
The detailed description and the description of the operation will be omitted.

【００８７】実施の形態３ 図２１は研磨装置が用いられる研磨システムを模式的に
示す平面図である。この研磨システムは基本的に図２の
研磨システムと同じであるが、図２１においては、前記
センサーシート６を自動的に試料Ａと研磨パッド２との
間に配して、研磨パッド２を試料Ａに押付け、自動的に
押付力分布を測定し、測定した押付力分布を基に自動的
に押付力分布を解析し、この解析した第２の押付力分
布、換言すれば上述したところの押付力分布積算値に基
づいて実研磨での研磨形状を予測し、試料保持器３に試
料Ａを保持したまま研磨を開始するか又は中止するかを
判断するように構成されている。Embodiment 3 FIG. 21 is a plan view schematically showing a polishing system using a polishing apparatus. This polishing system is basically the same as the polishing system of FIG. 2, but in FIG. 21, the sensor sheet 6 is automatically arranged between the sample A and the polishing pad 2, and the polishing pad 2 is A, the pressing force distribution is automatically measured, the pressing force distribution is automatically analyzed based on the measured pressing force distribution, and the analyzed second pressing force distribution, in other words, the pressing described above. The polishing shape in the actual polishing is predicted based on the force distribution integrated value, and it is determined whether to start or stop the polishing while holding the sample A in the sample holder 3.

【００８８】研磨装置は、図３に示したものと基本的に
同じであるが、図２１においては、前記センサーシート
６を研磨定盤１の側方に配される搬送アーム２８に保持
して、該搬送アーム２８を鉛直線の方向及び鉛直線と直
交する方向へ動作させることによりセンサーシート６を
試料保持器３に保持された試料Ａ及び研磨パッド２の間
の測定位置と待機位置とに配することができるようにし
てある。The polishing apparatus is basically the same as that shown in FIG. 3, but in FIG. 21, the sensor sheet 6 is held by a transfer arm 28 arranged on the side of the polishing platen 1 in FIG. By moving the transfer arm 28 in the direction of the vertical line and the direction perpendicular to the vertical line, the sensor sheet 6 is moved to the measurement position and the standby position between the sample A and the polishing pad 2 held by the sample holder 3. It can be arranged.

【００８９】センサーシート６は、鉛直線と直交する方
向に配しても撓まないように合成樹脂製の枠体内に設け
られている。センサーシート６には、図２の研磨システ
ムと同じくセンサーシート６が測定した第１の押付力分
布を表示することが可能な第１の情報処理装置２４と、
センサーシート６が測定した第１の押付力分布に基づい
て押付力分布積算値及び押付力分布積算値均一性を算出
する第２の情報処理装置２５とが夫々接続されている。The sensor sheet 6 is provided in a synthetic resin frame so as not to bend even if it is arranged in a direction perpendicular to the vertical line. A first information processing device 24 capable of displaying the first pressing force distribution measured by the sensor sheet 6 as in the polishing system of FIG.
The second information processing devices 25 that calculate the integrated pressing force distribution and the uniformity of the integrated pressing force distribution based on the first pressing force distribution measured by the sensor sheet 6 are connected respectively.

【００９０】図２２は自動的に押付力分布を測定し、測
定した押付力分布に基づいて次の研磨するかどうかの判
断を研磨装置が行う場合のフローチャートである。一回
目の研磨作業が終了し、二階目の研磨作業を行う際に、
自動的に搬送アーム２８が動作し、待機位置に配されて
いるセンサーシート６が測定位置へ搬送され（Ｓ１）、
試料Ａが保持されている夫々の位置で試料Ａと研磨パッ
ド２との間の第１の押付力分布を測定する（Ｓ２）。測
定する方法は実施の形態１に記載されている通りである
が、この測定を研磨装置が自動的に行う。測定した第１
の押付力分布に基づいて押付力分布積算値均一性を算出
し（Ｓ３）、研磨均一性を予測する（Ｓ４）。この予測
された研磨均一性が、予め定められている研磨均一性許
容値内であるか、研磨均一性許容値を外れているかを比
較し（Ｓ５）、研磨均一性許容値内であるときはそのま
ま連続研磨処理を開始することができ（Ｓ６）、また、
研磨均一性許容値を外れている場合は、研磨処理を行う
ことなくアラームを出してオペレータに押付力分布の不
良を知らせるようになっている。FIG. 22 is a flow chart in the case where the pressing force distribution is automatically measured, and the polishing apparatus determines whether or not to perform the next polishing based on the measured pressing force distribution. When the first polishing operation is completed and the second floor polishing operation is performed,
The transfer arm 28 automatically operates, and the sensor sheet 6 arranged at the standby position is transferred to the measurement position (S1).
The first pressing force distribution between the sample A and the polishing pad 2 is measured at each position where the sample A is held (S2). The measuring method is as described in Embodiment Mode 1, but this measurement is automatically performed by the polishing apparatus. First measured
Is calculated based on the pressing force distribution (S3), and the polishing uniformity is predicted (S4). It is compared whether the predicted polishing uniformity is within a predetermined polishing uniformity allowable value or out of the polishing uniformity allowable value (S5), and when it is within the polishing uniformity allowable value, The continuous polishing process can be started as it is (S6).
When the polishing uniformity is out of the allowable range, an alarm is issued without performing the polishing process to notify the operator of the pressing force distribution failure.

【００９１】この押付力分布の測定は、全ての試料Ａに
対して行うのであるが、例えば図１５で示すベルト式の
研磨装置等においては所定の周期で測定するようにして
もよい。その他の構成及び作用は実施の形態１，２と同
じであるため、同様の部品については同じ符号を付し、
その詳細な説明及び作用の説明を省略する。The measurement of the distribution of the pressing force is performed for all the samples A. For example, in a belt-type polishing apparatus shown in FIG. 15, the measurement may be performed at a predetermined cycle. Since other configurations and operations are the same as those of the first and second embodiments, the same components are denoted by the same reference numerals.
The detailed description and the description of the operation will be omitted.

【００９２】実施の形態４ 図２３は研磨装置の構成を示す縦断面図、図２４は研磨
装置の別の構成を示す縦断面図である。この実施の形態
４は試料Ａと研磨パッド２との間の押付力分布を自動的
に測定する研磨装置の別の実施の形態を示すものであ
り、図２３の研磨装置は、前記研磨パッド２の裏面側、
詳しくは、図３に示した研磨パッド２と研磨基板７の弾
性部材７ｂとの間に前記センサーシート６等の押付力分
布測定器を設けてあり、また、図２４の研磨装置は、前
記試料保持器３の試料保持部３ａ、換言すれば試料保持
部３ａに保持される試料Ａの裏面側に前記センサーシー
ト６等の押付力分布測定器を設けてある。Fourth Embodiment FIG. 23 is a longitudinal sectional view showing the structure of a polishing apparatus, and FIG. 24 is a longitudinal sectional view showing another structure of a polishing apparatus. Embodiment 4 shows another embodiment of the polishing apparatus for automatically measuring the pressing force distribution between the sample A and the polishing pad 2. The polishing apparatus shown in FIG. Back side of
Specifically, a pressing force distribution measuring device such as the sensor sheet 6 is provided between the polishing pad 2 shown in FIG. 3 and the elastic member 7b of the polishing substrate 7, and the polishing apparatus shown in FIG. A pressing force distribution measuring device such as the sensor sheet 6 is provided on the back side of the sample holding section 3a of the holder 3, that is, the sample A held by the sample holding section 3a.

【００９３】この押付力分布測定器は、前記センサーシ
ート６である他、複数の圧電素子等の押付力測定器を用
い、これら圧電素子を研磨パッド２の裏面側又は試料保
持部３ａに埋込んでもよく、同様に第１の押付力分布を
測定することができるものであればよい。This pressing force distribution measuring device uses not only the sensor sheet 6 but also a plurality of pressing force measuring devices such as piezoelectric elements, and these piezoelectric elements are embedded in the back side of the polishing pad 2 or the sample holder 3a. Any method may be used as long as the first pressing force distribution can be measured.

【００９４】実施の形態４において、試料保持部３ａに
保持された試料Ａが研磨パッド２に接触して押付力が加
えられたときの第１の押付力分布が例えば前記第１の情
報処理装置２４に表示されるようになっている。In the fourth embodiment, the first pressing force distribution when the sample A held by the sample holding section 3a comes into contact with the polishing pad 2 and a pressing force is applied is, for example, the first information processing apparatus. 24.

【００９５】図２３の如く研磨パッド２の裏面側に押付
力分布測定器６が設けられた研磨装置、及び図２４の如
く試料の被研磨面と反対側の裏面、換言すれば試料保持
器３の試料保持部３ａに押付力分布測定器６が設けられ
た研磨装置においては、夫々の研磨パッド２と試料Ａと
の間の押付力分布の状態を研磨パッド２及び試料保持器
３が回転中であっても、研磨定盤１内又は試料保持器３
内で測定した第１の押付力分布を電圧に変換し、研磨定
盤１又は試料保持器３（支持定盤４）に搭載される発信
器２８から信号を発信し、この信号を図２１で示す研磨
システムの外部で受信器２９に受信させることにより、
研磨システムの外部で押付力分布の状態を把握すること
が可能にしてある。A polishing apparatus in which a pressing force distribution measuring device 6 is provided on the back side of a polishing pad 2 as shown in FIG. 23, and a back side opposite to a polished surface of a sample as shown in FIG. 24, in other words, a sample holder 3 In the polishing apparatus in which the pressing force distribution measuring device 6 is provided on the sample holding unit 3a, the state of the pressing force distribution between each polishing pad 2 and the sample A is determined while the polishing pad 2 and the sample holder 3 are rotating. Even in the polishing platen 1 or the sample holder 3
The first pressing force distribution measured in the above is converted into a voltage, and a signal is transmitted from a transmitter 28 mounted on the polishing platen 1 or the sample holder 3 (supporting platen 4). By having the receiver 29 receive it outside the polishing system shown,
The state of the pressing force distribution can be grasped outside the polishing system.

【００９６】例えば、研磨定盤１が６０ｒｐｍで回転し
ている場合、１ｓｅｃ間に試料保持器３が一周するよう
に設定された研磨装置において、押付力分布の取り込み
を０．１２５ｓｅｃごとに複数回行うように設定する
と、実施の形態１と同様に研磨パッド２と試料Ａとの相
対位置に応じて８つの押付力分布を得ることができる。
この後は実施の形態１、実施の形態２に応じた手法で押
付力分布の形状を求め、上述したところの方法と同様に
押付力帯の平均押付力、押付力分布積算値（第２の押付
力分布）、押付力分布積算値均一性を求めることによ
り、実研磨での研磨形状を精度よく予測することができ
る。For example, when the polishing table 1 is rotating at 60 rpm, the pressing force distribution is taken in a plurality of times every 0.125 sec in a polishing apparatus in which the sample holder 3 is set to make one round in one second. When the setting is performed, eight pressing force distributions can be obtained according to the relative positions of the polishing pad 2 and the sample A as in the first embodiment.
Thereafter, the shape of the pressing force distribution is obtained by a method according to the first and second embodiments, and the average pressing force in the pressing force band and the integrated pressing force distribution value (second By determining the uniformity of the pressing force distribution and the integrated value of the pressing force distribution, the polishing shape in actual polishing can be accurately predicted.

【００９７】その他の構成及び作用は実施の形態１，２
と同じであるため、同様の部品については同じ符号を付
し、その詳細な説明及び作用の説明を省略する。Other configurations and operations are the same as those of the first and second embodiments.
Therefore, the same reference numerals are given to the same components, and the detailed description and the description of the operation are omitted.

【００９８】実施の形態５ 図２５は研磨装置の構成を示す縦断面図である。この実
施の形態５は前記研磨定盤１が一体物でなく、直径寸法
が異なる複数が実施の形態１で示した複数の押付力帯に
応じて同心的に配され、夫々が独立して前記研磨パッド
２の方向への移動が可能な円環部材１ｂ…と、これら円
環部材１ｂ…を夫々移動させる複数の流体圧シリンダ１
ｃ…とを備え、これら流体圧シリンダ１ｃ…が電磁開閉
弁１ｄ…を介してエアー、油圧等の流体圧源に接続され
ている。Embodiment 5 FIG. 25 is a longitudinal sectional view showing the structure of a polishing apparatus. In the fifth embodiment, the polishing platen 1 is not an integral body, and a plurality of polishing plates having different diameters are arranged concentrically in accordance with a plurality of pressing force bands shown in the first embodiment, and each of the polishing plates 1 is independently formed of the polishing plate. An annular member 1b that can move in the direction of the polishing pad 2, and a plurality of fluid pressure cylinders 1 that respectively move these annular members 1b
c, and these fluid pressure cylinders 1c are connected to a fluid pressure source such as air, hydraulic pressure, etc., via an electromagnetic on-off valve 1d.

【００９９】実施の形態５において、解析用の前記押付
力帯が１２等分されている場合、円環部材１ｂ…も１２
等分される。これら円環部材１ｂ…は前記流体圧シリン
ダ１ｃ…のピストンに夫々独立して直結されており、前
記流体圧シリンダ１ｃ…に封入するエアー等の流体圧力
を調節することにより、夫々の流体圧シリンダ１ｃ…の
ピストンが移動し、夫々の円環部材１ｂ…を独立して移
動させ、相対的に円環部材１ｂ…の位置を調整すること
ができる。各押付力帯の押付力分布は図９と同様にな
る。これにより、実施の形態１で述べた方法により押付
力分布積算値及び押付力分布積算値均一性を求め、実研
磨での研磨形状を予測することが可能である。In the fifth embodiment, when the pressing force band for analysis is divided into twelve, the annular members 1b are also divided into twelve.
Divided equally. These annular members 1b are directly and independently connected to the pistons of the fluid pressure cylinders 1c, respectively. The fluid members of the fluid pressure cylinders 1c are adjusted by controlling the fluid pressure of air or the like. The pistons 1c move, and the respective ring members 1b can be moved independently to adjust the position of the ring members 1b relatively. The pressing force distribution of each pressing force band is the same as in FIG. Thus, the integrated pressing force distribution value and the uniformity of the pressing force distribution integrated value can be obtained by the method described in the first embodiment, and the polishing shape in actual polishing can be predicted.

【０１００】また、実研磨での研磨形状を変化させたい
時は、所望の研磨形状に相当する押付力分布積算値均一
性を予め前記第２の情報処理装置２５に設定し、この所
望の研磨形状の押付力分布積算値均一性と同じに研磨す
るべく夫々の押付力帯の押付力分布を変化させるように
夫々の円環部材１ｂ…に加える流体圧力を調整すること
により、実研磨での研磨形状を自由に調整することが可
能となる。When it is desired to change the polishing shape in actual polishing, the pressing force distribution integrated value uniformity corresponding to the desired polishing shape is set in advance in the second information processing device 25, and the desired polishing is performed. By adjusting the fluid pressure applied to each annular member 1b so as to change the pressing force distribution of each pressing force band in order to polish the same as the pressing force distribution integrated value uniformity of the shape, the actual polishing in actual polishing is performed. The polishing shape can be freely adjusted.

【０１０１】この円環部材１ｂ…を移動させる機構とし
ては、流体圧力である他、夫々の円環部材１ｂ…に鉛直
線の方向に長いボールネジを取付けて、これらボールネ
ジを回転させることにより円環部材１ｂ…を夫々独立し
て移動させ、独立して相対的に円環部材１ｂ…の位置を
調整することができるようにしてもよい。何れにしても
移動方向に夫々の円環部材１ｂ…が独立して移動する機
構であれば、何れの方法でもよい。As a mechanism for moving the ring members 1b, in addition to the fluid pressure, a long ball screw is attached to each of the ring members 1b in the vertical direction, and the ring screws are rotated to rotate the ring members. The members 1b may be moved independently so that the position of the annular members 1b can be relatively adjusted independently. In any case, any method may be used as long as each ring member 1b moves independently in the movement direction.

【０１０２】夫々の円環部材１ｂ…の研磨パッド２と向
き合う面には、弾性部材１ｅが貼着されている。これ
は、隣り合う円環部材１ｂ…の境界に生ずる押付力差を
緩和させて押付力分布をなだらかにし、また一つの円環
部材１ｂにおいても押付力を均等に配分するために取付
けられている。An elastic member 1e is attached to a surface of each of the annular members 1b facing the polishing pad 2. This is provided in order to alleviate the difference in pressing force generated at the boundary between the adjacent annular members 1b to make the distribution of pressing force gentle, and to evenly distribute the pressing force in one annular member 1b. .

【０１０３】[0103]

【発明の効果】以上詳述した如く第１発明乃至第３発明
及び第８発明によれば、実研磨の前工程として試料と研
磨パッドとの間の第１の押付力分布を測定し、測定した
第１の押付力分布に基づいて被研磨面をその直径方向に
区分した複数の試料区分域に加わる第２の押付力分布を
算出することにより、実研磨での研磨形状を高精度に予
測することができるため、予測した研磨形状が所望の研
磨形状に対し許容されない試料が実研磨されることを防
止でき、予測した研磨形状が所望の研磨形状に対し許容
される試料についてのみ実研磨することができる。ま
た、請求項３によれば、第２の押付力分布の形状から実
研磨での研磨形状をより一層精度よく予測することがで
きる。As described in detail above, according to the first to third and eighth aspects of the present invention, the first pressing force distribution between the sample and the polishing pad is measured as a pre-process of actual polishing, and the measurement is performed. Based on the first pressing force distribution obtained, the second pressing force distribution applied to the plurality of sample sections in which the surface to be polished is divided in the diameter direction is calculated, thereby accurately predicting the polishing shape in actual polishing. Therefore, it is possible to prevent a sample whose predicted polishing shape is not acceptable for a desired polishing shape from being actually polished, and perform actual polishing only for a sample whose predicted polishing shape is allowable for a desired polishing shape. be able to. According to the third aspect, the shape of the actual polishing can be more accurately predicted from the shape of the second pressing force distribution.

【０１０４】第４発明及び第９発明によれば、実研磨で
の研磨形状を予測した後、この予測結果に基づいて研磨
開始の可否を自動的に判定することができるとともに、
研磨開始が可能な試料の全てを予め定めた研磨形状に研
磨することが可能である。According to the fourth and ninth aspects of the present invention, after the polishing shape in actual polishing is predicted, it is possible to automatically determine whether or not to start polishing based on the prediction result.
It is possible to polish all of the samples from which polishing can be started to a predetermined polishing shape.

【０１０５】第５発明によれば、予測した研磨形状に基
づいて複数の研磨基板の一つを選択し、この研磨基板を
取り替えることにより、研磨パッドに加わる押付力分布
を予測した研磨形状に最適な押付力分布に変えることが
でき、試料を所望の研磨形状に研磨することができる。According to the fifth aspect, one of the plurality of polishing substrates is selected based on the predicted polishing shape, and by replacing this polishing substrate, the distribution of the pressing force applied to the polishing pad is optimized for the predicted polishing shape. And the sample can be polished to a desired polishing shape.

【０１０６】第６発明及び第７発明と、第１０発明及び
第１１発明とによれば、予測した研磨形状に基づいて研
磨定盤の円環部材を独立して移動させることにより、研
磨パッドに加わる押付力分布を予測した研磨形状に最適
な押付力分布に調整することができ、試料を所望の研磨
形状に研磨することができる。According to the sixth and seventh inventions and the tenth and eleventh inventions, by independently moving the annular member of the polishing platen based on the predicted polishing shape, the polishing pad The distribution of the applied pressing force can be adjusted to the optimum pressing force distribution for the predicted polishing shape, and the sample can be polished to a desired polishing shape.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明に係る研磨装置の要部の構成を示す縦断
面図である。FIG. 1 is a longitudinal sectional view showing a configuration of a main part of a polishing apparatus according to the present invention.

【図２】本発明に係る研磨装置が用いられる研磨システ
ムを模式的に示す平面図である。FIG. 2 is a plan view schematically showing a polishing system in which the polishing apparatus according to the present invention is used.

【図３】押付力分布の測定方法を示す断面図である。FIG. 3 is a sectional view showing a method for measuring a pressing force distribution.

【図４】押付力分布を測定する過程を示す説明図であ
る。FIG. 4 is an explanatory diagram showing a process of measuring a pressing force distribution.

【図５】押付力分布を測定する箇所についての説明図で
ある。FIG. 5 is an explanatory diagram of a place where a pressing force distribution is measured.

【図６】測定された押付力分布を処理する方法について
の説明図であるFIG. 6 is an explanatory diagram of a method for processing a measured pressing force distribution.

【図７】押付力帯と押付力帯に加わる平均押付力との関
係を示す押付力分布区分図である。FIG. 7 is a distribution diagram of a pressing force distribution showing a relationship between a pressing force band and an average pressing force applied to the pressing force band.

【図８】研磨形状を予測する過程を示す説明図である。FIG. 8 is an explanatory diagram showing a process of predicting a polishing shape.

【図９】被研磨面の任意の半径寸法の円周が受ける押付
力分布積算値を算出する方法の説明図である。FIG. 9 is an explanatory diagram of a method of calculating an integrated value of a pressing force distribution received on a circumference having an arbitrary radius dimension of a surface to be polished.

【図１０】押付力分布積算値均一性と研磨均一性とを比
較した一つの例を示す説明図である。FIG. 10 is an explanatory diagram showing one example in which the uniformity of the integrated value of the pressing force distribution and the polishing uniformity are compared.

【図１１】押付力分布積算値均一性と研磨均一性とを比
較した他の例を示す説明図である。FIG. 11 is an explanatory diagram showing another example in which the uniformity of the integrated value of the pressing force distribution and the polishing uniformity are compared.

【図１２】押付力分布積算値均一性と研磨均一性との相
関をとった結果の説明図である。FIG. 12 is an explanatory diagram of a result obtained by correlating the pressing force distribution integrated value uniformity and the polishing uniformity.

【図１３】本発明に係る研磨装置の実施の形態１におけ
る別の構成を示す縦断面図である。FIG. 13 is a longitudinal sectional view showing another configuration of the polishing apparatus according to the first embodiment of the present invention.

【図１４】図１３で示す研磨装置の研磨パッド及び試料
の間の押付力分布評価領域を示す説明図である。14 is an explanatory diagram showing a pressing force distribution evaluation area between a polishing pad and a sample of the polishing apparatus shown in FIG.

【図１５】本発明に係る研磨装置のベルト式の構成を示
す模式的正面図である。FIG. 15 is a schematic front view showing a belt-type configuration of the polishing apparatus according to the present invention.

【図１６】パッド領域と、パッド及び試料の間の押付力
分布評価領域との関係を示す説明図である。FIG. 16 is an explanatory diagram showing a relationship between a pad area and a pressing force distribution evaluation area between a pad and a sample.

【図１７】被研磨面の任意の半径寸法の円周が受ける押
付力分布積算値を算出する方法の説明図である。FIG. 17 is an explanatory diagram of a method of calculating an integrated value of a pressing force distribution received on a circumference having an arbitrary radius dimension of a surface to be polished.

【図１８】本発明に係る研磨装置の揺動式の構成を示す
一部を切欠いた斜視図である。FIG. 18 is a partially cutaway perspective view showing a swing type configuration of the polishing apparatus according to the present invention.

【図１９】パッド領域と、パッド及び試料の間の押付力
分布評価領域との関係を示す説明図である。FIG. 19 is an explanatory diagram showing a relationship between a pad region and a pressing force distribution evaluation region between a pad and a sample.

【図２０】被研磨面の任意の半径寸法の円周が受ける押
付力分布積算値を算出する方法の説明図である。FIG. 20 is an explanatory diagram of a method for calculating an integrated value of a pressing force distribution received on a circumference having an arbitrary radius dimension of a surface to be polished.

【図２１】実施の形態３の研磨装置が用いられる研磨シ
ステムを模式的に示す平面図である。FIG. 21 is a plan view schematically showing a polishing system using the polishing apparatus of the third embodiment.

【図２２】自動的に押付力分布を測定し、測定した押付
力分布に基づいて次の研磨を行うかどうかの判断を研磨
装置が行う場合のフローチャートである。FIG. 22 is a flowchart in the case where the pressing force distribution is automatically measured and the polishing apparatus determines whether or not to perform the next polishing based on the measured pressing force distribution.

【図２３】本発明に係る研磨装置の実施の形態４の構成
を示す縦断面図である。FIG. 23 is a longitudinal sectional view showing a configuration of a polishing apparatus according to a fourth embodiment of the present invention.

【図２４】本発明に係る研磨装置の実施の形態４の構成
を示す縦断面図である。FIG. 24 is a longitudinal sectional view showing a configuration of a polishing apparatus according to a fourth embodiment of the present invention.

【図２５】本発明に係る研磨装置の実施の形態５の構成
を示す縦断面図である。FIG. 25 is a longitudinal sectional view showing a configuration of a polishing apparatus according to a fifth embodiment of the present invention.

【符号の説明】[Explanation of symbols]

１，１ａ 研磨定盤 １ｂ 円環部材 2,2a, 2b 研磨パッド ３ 試料保持器 ６ センサーシート ７ 研磨基板 Ａ 試料 ａ 被研磨面 1, 1a Polishing surface plate 1b Ring member 2, 2a, 2b Polishing pad 3 Sample holder 6 Sensor sheet 7 Polishing substrate A Sample a Polished surface

───────────────────────────────────────────────────── フロントページの続き (72)発明者 香西 雄三 兵庫県尼崎市扶桑町１番８号 住友金属工 業株式会社半導体装置事業部内 (72)発明者 小原 基之 兵庫県尼崎市扶桑町１番８号 住友金属工 業株式会社半導体装置事業部内 Ｆターム(参考） 3C058 AA07 AA12 AC02 BA01 BA05 BB06 BB08 BB09 CB01 DA17 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yuzo Kosai 1-8 Fuso-cho, Amagasaki-shi, Hyogo Sumitomo Metal Industries, Ltd. Semiconductor Equipment Division (72) Inventor Motoyuki Ohara 1st Fuso-cho, Amagasaki-shi, Hyogo No. 8 Sumitomo Metal Industries, Ltd. Semiconductor Equipment Division F-term (reference) 3C058 AA07 AA12 AC02 BA01 BA05 BB06 BB08 BB09 CB01 DA17

Claims (12)

【特許請求の範囲】[Claims] 【請求項１】 円板形の試料を回転させつつその被研磨
面を研磨パッドに押付けて研磨する実研磨での研磨形状
を予測する方法であって、 前記試料と研磨パッドとの間の第１の押付力分布を測定
し、測定した第１の押付力分布に基づいて前記被研磨面
をその直径方向に区分した複数の試料区分域に加わる第
２の押付力分布を算出し、この算出した第２の押付力分
布に基づいて実研磨での研磨形状を予測することを特徴
とする研磨形状予測方法。1. A method for predicting a polished shape in actual polishing in which a polished surface is pressed against a polishing pad while rotating a disk-shaped sample, and wherein a polishing shape between the sample and the polishing pad is determined. The first pressing force distribution is measured, and based on the measured first pressing force distribution, a second pressing force distribution applied to a plurality of sample sections in which the surface to be polished is divided in the diameter direction is calculated. A polishing shape prediction method, wherein a polishing shape in actual polishing is predicted based on the second pressing force distribution thus obtained. 【請求項２】 円板形の試料を回転させつつその被研磨
面を研磨パッドに押付けて研磨する実研磨での研磨形状
を予測する方法であって、 前記試料と研磨パッドとの間の第１の押付力分布を測定
し、測定した第１の押付力分布に基づいて前記被研磨面
をその直径方向に区分した複数の試料区分域に加わる第
３の押付力分布を算出し、この算出した第３の押付力分
布及び該第３の押付力分布で実研磨したときの研磨形状
の相関関係を予め求めてあり、前記試料と研磨パッドと
の間の第１の押付力分布を測定し、測定した第１の押付
力分布に基づいて前記被研磨面をその直径方向に区分し
た複数の試料区分域に加わる第２の押付力分布を算出
し、この算出した第２の押付力分布の形状と、予め求め
られた相関関係とを比較して実研磨での研磨形状を予測
することを特徴とする研磨形状予測方法。2. A method for predicting a polishing shape in actual polishing in which a polished surface is pressed against a polishing pad while rotating a disk-shaped sample, and wherein a polishing shape between the sample and the polishing pad is determined. The first pressing force distribution is measured, and based on the measured first pressing force distribution, a third pressing force distribution applied to a plurality of sample sections in which the surface to be polished is divided in the diameter direction is calculated. The correlation between the third pressing force distribution obtained and the polishing shape when actual polishing is performed with the third pressing force distribution has been determined in advance, and the first pressing force distribution between the sample and the polishing pad is measured. Calculating, based on the measured first pressing force distribution, a second pressing force distribution applied to a plurality of sample sections in which the surface to be polished is divided in the diameter direction, and calculating the second pressing force distribution By comparing the shape and the correlation determined in advance, the polished shape in actual polishing Polishing shape prediction method characterized by predicting. 【請求項３】 前記第１の押付力分布の測定は、前記研
磨パッド及び試料を相対移動させて研磨パッド上の複数
の位置で行う請求項１及び請求項２記載の研磨形状予測
方法。3. The polishing shape prediction method according to claim 1, wherein the first pressing force distribution is measured at a plurality of positions on the polishing pad by relatively moving the polishing pad and the sample. 【請求項４】 前記第２及び第３の押付力分布は、前記
研磨パッドの被研磨面との接触域を前記試料区分域と同
数に区分したパッド区分域ごとの平均押付力と、前記試
料が一回転する間で前記試料区分域が前記パッド区分域
を通過する割合とに基づいて算出する請求項１乃至請求
項３記載の研磨形状予測方法。4. The second and third pressing force distributions include an average pressing force for each pad section obtained by dividing a contact area of the polishing pad with a surface to be polished into the same number as the sample sections, The polishing shape prediction method according to claim 1, wherein the polishing shape is calculated based on a ratio of the sample division area passing through the pad division area during one rotation. 【請求項５】 円板形の試料を回転させつつその被研磨
面を研磨パッドに押付けて研磨する研磨方法において、 請求項１乃至４記載の研磨形状予測方法を実行する予測
工程と、予測結果に基づいて研磨開始の可否を判定する
研磨開始可否判定工程と、判定結果に基づいて研磨する
研磨工程とからなることを特徴とする試料の研磨方法。5. A polishing method for polishing a polished surface by pressing a surface to be polished against a polishing pad while rotating a disk-shaped sample, a prediction step for executing the polishing shape prediction method according to claim 1, and a prediction result. A polishing method for a sample, comprising: a polishing start propriety judging step of judging whether polishing can be started based on the above, and a polishing step of polishing based on the judgment result. 【請求項６】 円板形の試料を回転させつつその被研磨
面を、研磨基板を介して研磨定盤に取付けられた研磨パ
ッドに押付けて研磨する研磨方法において、 前記研磨基板は前記研磨パッドに加える押付力分布が異
なる複数の種類を備えており、請求項１乃至４記載の研
磨形状予測方法を実行する予測工程と、予測結果に基づ
いて前記研磨基板の一つを選択する選択工程と、前記研
磨基板を選択した研磨基板に取り替えて研磨する研磨工
程とからなることを特徴とする試料の研磨方法。6. A polishing method in which a disk-shaped sample is rotated and a surface to be polished is pressed against a polishing pad attached to a polishing surface plate via a polishing substrate to polish the polishing object, wherein the polishing substrate is the polishing pad. A plurality of types having different pressing force distributions, and a selecting step of selecting one of the polished substrates based on a result of the prediction. A polishing step of polishing the substrate by replacing the polishing substrate with a selected polishing substrate. 【請求項７】 円板形の試料を回転させつつその被研磨
面を、研磨定盤に取付けられた研磨パッドに押付けて研
磨する研磨方法において、 前記研磨定盤は直径寸法が異なる複数が同心的に配さ
れ、夫々が独立して前記研磨パッドの方向への移動が可
能な円環部材を備えており、請求項１乃至４記載の研磨
形状予測方法を実行する予測工程と、予測結果に基づい
て前記円環部材を夫々移動させ、これら円環部材の位置
を調整する位置調整工程と、研磨する研磨工程とからな
ることを特徴とする試料の研磨方法。7. A polishing method for polishing a surface to be polished while rotating a disk-shaped sample while pressing the surface against a polishing pad attached to a polishing surface plate, wherein a plurality of polishing surface plates having different diameters are concentric. 5. A polishing step for executing the polishing shape prediction method according to any one of claims 1 to 4, further comprising an annular member which is arranged in a manner that can be independently moved in the direction of the polishing pad. A polishing method for a sample, comprising: a step of adjusting the positions of the annular members by moving the annular members on the basis of the positions of the annular members, and a polishing step of polishing. 【請求項８】 試料の被研磨面を研磨定盤に取付けられ
た研磨パッドに押付けて研磨する研磨方法において、 前記研磨定盤は直径寸法が異なる複数が同心的に配さ
れ、夫々が独立して前記研磨パッドの方向への移動が可
能な円環部材を備えており、前記試料の被研磨面と反対
側の裏面又は研磨パッドの裏面に押付力を複数の位置で
測定する押付力分布測定器を配して押付力分布を測定す
る測定工程と、測定した押付力分布に基づいて実研磨で
の研磨形状を予測する予測工程と、予測結果に基づいて
前記円環部材を夫々移動させ、これら円環部材の位置を
調整する位置調整工程と、研磨する研磨工程とからなる
ことを特徴とする試料の研磨方法。8. A polishing method for polishing a sample by pressing a surface to be polished against a polishing pad attached to a polishing table, wherein the polishing table has a plurality of concentrically different diameters, each of which is independent. A pressurizing force distribution measuring device for measuring a pressing force at a plurality of positions on a back surface opposite to a surface to be polished of the sample or a back surface of the polishing pad. A measuring step of measuring the pressing force distribution by arranging a vessel, a predicting step of predicting a polishing shape in actual polishing based on the measured pressing force distribution, and moving the annular members based on the predicted results, A method for polishing a sample, comprising: a position adjusting step of adjusting the positions of the annular members; and a polishing step of polishing. 【請求項９】 試料の被研磨面を研磨パッドに押付けて
研磨する研磨装置において、 前記研磨パッドへの押付力を前記試料と研磨パッドとの
間の複数の位置で測定する押付力分布測定器を前記試料
と研磨パッドとの間に配する配置手段と、前記押付力分
布測定器が測定した押付力分布に基づいて実研磨での研
磨形状を予測する研磨形状予測手段とを備えることを特
徴とする研磨装置。9. A polishing apparatus for polishing a sample by pressing a surface to be polished against a polishing pad, wherein the pressing force distribution measuring device measures a pressing force against the polishing pad at a plurality of positions between the sample and the polishing pad. And a polishing shape predicting means for predicting a polishing shape in actual polishing based on a pressing force distribution measured by the pressing force distribution measuring device. Polishing equipment. 【請求項１０】 実研磨したときの研磨形状を予め設定
する設定手段と、前記予測した研磨形状と予め設定され
た研磨形状とを比較する比較手段と、比較した試料の研
磨開始の可否を判定する研磨開始可否判定手段とを備え
る請求項９記載の研磨装置。10. A setting means for presetting a polishing shape at the time of actual polishing, a comparing means for comparing the predicted polishing shape with a preset polishing shape, and judging whether or not polishing of the compared sample can be started. The polishing apparatus according to claim 9, further comprising: a polishing start possibility determination unit that performs polishing. 【請求項１１】 前記研磨定盤は直径寸法が異なる複数
が同心的に配され、夫々が独立して前記研磨パッドの方
向への移動が可能な円環部材を備えており、前記研磨形
状予測手段が予測した研磨形状に基づいて前記円環部材
を夫々移動させ、これら円環部材の位置を調整する位置
調整手段を備える請求項９記載の研磨装置。11. The polishing platen is provided with a plurality of concentrically arranged polishing plates having different diameters, each of which is provided with an annular member capable of independently moving in the direction of the polishing pad. The polishing apparatus according to claim 9, further comprising a position adjusting unit configured to move each of the annular members based on the polishing shape predicted by the unit and adjust the positions of the annular members. 【請求項１２】 試料の被研磨面を研磨定盤に取付けら
れた研磨パッドに押付けて研磨する研磨装置において、 前記研磨定盤は直径寸法が異なる複数が同心的に配さ
れ、夫々が独立して前記研磨パッドの方向への移動が可
能な円環部材を備えており、前記試料の被研磨面と反対
側の裏面又は研磨パッドの裏面に配され、前記研磨パッ
ドへの押付力を複数の位置で測定する押付力分布測定器
と、該押付力分布測定器が測定した押付力分布に基づい
て実研磨での研磨形状を予測する研磨形状予測手段と、
該研磨形状予測手段が予測した研磨形状に基づいて前記
円環部材を夫々移動させ、これら円環部材の位置を調整
する位置調整手段とを備えることを特徴とする研磨装
置。12. A polishing apparatus for polishing by polishing a surface to be polished of a sample against a polishing pad attached to a polishing table, wherein a plurality of polishing tables having different diameters are concentrically arranged, each of which is independent. An annular member capable of moving in the direction of the polishing pad, is disposed on the back surface opposite to the surface to be polished of the sample or the back surface of the polishing pad, and applies a plurality of pressing forces to the polishing pad. Pressing force distribution measuring device to measure at the position, polishing shape prediction means to predict the polishing shape in actual polishing based on the pressing force distribution measured by the pressing force distribution measuring device,
A polishing apparatus comprising: a position adjusting unit that moves each of the annular members based on the polishing shape predicted by the polishing shape predicting unit and adjusts the positions of the annular members.
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