JP2001192863A - Copper alloy material and producing method therefor - Google Patents
Copper alloy material and producing method thereforInfo
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- JP2001192863A JP2001192863A JP2000006087A JP2000006087A JP2001192863A JP 2001192863 A JP2001192863 A JP 2001192863A JP 2000006087 A JP2000006087 A JP 2000006087A JP 2000006087 A JP2000006087 A JP 2000006087A JP 2001192863 A JP2001192863 A JP 2001192863A
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- copper
- copper alloy
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- layers
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、強度、導電性、め
っき性に優れる、電子機器部品に適した銅合金材料、お
よびその安価な製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy material which is excellent in strength, conductivity and plating properties and is suitable for electronic equipment parts, and an inexpensive production method thereof.
【０００２】[0002]
【従来の技術】従来より、半導体リードフレーム、コネ
クター、スイッチリレーなどの接点バネ、端子などの電
子機器部品には導電性、伝熱性、機械的強度、加工性、
耐食性などに優れるＣｕ−Ｃｏ−Ａｇ−Ｂｅ合金やＣｕ
−Ｎｉ−Ｓｉ合金などの銅合金材料が多用されている。
これらの銅合金材料の製造は、通常、電気銅に合金元素
を添加して溶解鋳造し、得られる銅合金鋳塊に、熱間圧
延、面削、冷間圧延（中間焼鈍を含む）、仕上圧延、低
温焼鈍、スリッター加工、めっき処理を施して行われ
る。前記めっき処理により耐食性、半田付け性、ボンデ
ィング性、電気接続性などが改善される。2. Description of the Related Art Conventionally, electronic devices such as contact springs and terminals, such as semiconductor lead frames, connectors, and switch relays, have been required to have conductivity, heat conductivity, mechanical strength, workability, and the like.
Cu-Co-Ag-Be alloy and Cu with excellent corrosion resistance
-Copper alloy materials such as Ni-Si alloys are frequently used.
In the production of these copper alloy materials, usually, an alloying element is added to electrolytic copper and melted and cast, and the resulting copper alloy ingot is subjected to hot rolling, facing, cold rolling (including intermediate annealing), finishing Rolling, low-temperature annealing, slitting, and plating are performed. The plating treatment improves corrosion resistance, solderability, bonding properties, electrical connectivity, and the like.
【０００３】[0003]
【発明が解決しようとする課題】最近、電子機器の小型
化に伴い、そこに用いられる銅合金材料には、強度或い
は導電性の向上が強く求められるようになり、これに応
じて、種々元素を添加した新しい銅合金材料が提案され
ている。しかしこれら新銅合金材料では電子機器部品に
要求される強度或いは導電性が充分に得られず、また添
加元素によっては不めっき、めっき層の密着不良、めっ
き表面での異常析出などが起き、めっき性に劣る。この
ため、より複雑なめっき前処理法が検討されている。さ
らにこれらの新銅合金材料は製造工程が従来材よりも複
雑で製造コストが大幅に高くなるという問題がある。本
発明は、強度、導電性、めっき性に優れる銅合金材料お
よびその安価な製造方法の提供を目的とする。Recently, with the miniaturization of electronic equipment, copper alloy materials used therefor have been required to have higher strength or higher conductivity. There has been proposed a new copper alloy material to which is added. However, with these new copper alloy materials, the strength or conductivity required for electronic equipment parts is not sufficiently obtained, and depending on the added element, non-plating, poor adhesion of the plating layer, abnormal precipitation on the plating surface, etc. occur, and the plating Poor sex. For this reason, more complicated plating pretreatment methods are being studied. Further, these new copper alloy materials have a problem that the manufacturing process is more complicated than the conventional materials and the manufacturing cost is significantly higher. An object of the present invention is to provide a copper alloy material having excellent strength, conductivity, and plating properties, and an inexpensive manufacturing method thereof.
【０００４】[0004]
【課題を解決するための手段】請求項１記載の発明は、
銅層と銅合金層が交互に５層以上積層されており、最外
層の少なくとも一方が銅層からなることを特徴とする銅
合金材料である。According to the first aspect of the present invention,
A copper alloy material in which five or more copper layers and copper alloy layers are alternately laminated, and at least one of the outermost layers is made of a copper layer.
【０００５】請求項２記載の発明は、銅合金層が、合金
元素としてＡｇ、Ｓｎ、Ｚｎ、Ｎｉ、Ｃｒのうちの１種
または２種以上を含む銅合金からなることを特徴とする
請求項１記載の銅合金材料である。According to a second aspect of the present invention, the copper alloy layer is made of a copper alloy containing one or more of Ag, Sn, Zn, Ni, and Cr as alloying elements. 2. The copper alloy material according to item 1.
【０００６】請求項３記載の発明は、銅箔の片面または
両面に、銅以外の金属元素層を被覆する操作と、銅層を
被覆する操作をこの順に交互に施して、最外層の少なく
とも一方が銅層からなる５層（銅箔を含む）以上の積層
体を作製し、前記積層体に熱処理および減面加工を施す
ことを特徴とする銅合金材料の製造方法である。According to a third aspect of the present invention, an operation of coating a metal element layer other than copper on one or both surfaces of a copper foil and an operation of coating a copper layer are alternately performed in this order, so that at least one of the outermost layers is formed. Is a method for producing a copper alloy material, comprising preparing a laminate of five or more layers (including a copper foil) made of a copper layer, and subjecting the laminate to heat treatment and surface reduction.
【０００７】[0007]
【発明の実施の形態】本発明の銅合金材料は図１に示す
ように、銅層１と銅合金層２が交互に５層以上積層さ
れ、且つ最外層の少なくとも一方が銅層からなるもので
ある。本発明の銅合金材料は銅層１により導電性が確保
され、銅合金層２により強度が確保される。銅層１は銅
を９９．９wt％以上含む純銅により形成される。銅合金
層２は任意の銅合金により形成されるが、特にＡｇ、Ｓ
ｎ、Ｚｎ、Ｎｉ、Ｃｒのうちの１種または２種以上を含
む銅合金で形成するのが高強度が得られ望ましい。DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 1, a copper alloy material according to the present invention has a structure in which five or more copper layers 1 and copper alloy layers 2 are alternately laminated, and at least one of the outermost layers is a copper layer. It is. In the copper alloy material of the present invention, conductivity is secured by the copper layer 1 and strength is secured by the copper alloy layer 2. The copper layer 1 is formed of pure copper containing 99.9% by weight or more of copper. The copper alloy layer 2 is formed of an arbitrary copper alloy.
It is desirable to use a copper alloy containing one or more of n, Zn, Ni, and Cr because high strength can be obtained.
【０００８】本発明の銅合金材料は最外層の少なくとも
一方を銅層とし、この銅層の表面をめっき面とする。こ
のため従来の簡単なめっき前処理法によっても良好なめ
っき性が得られる。銅合金材料の両表面にめっきする場
合は最外層の両方を銅層とする。本発明において、銅層
と銅合金層の積層数を５層以上とする理由は、５層未満
では機械的性質などにおける均一性が充分に得られない
ためである。In the copper alloy material of the present invention, at least one of the outermost layers is a copper layer, and the surface of the copper layer is a plating surface. Therefore, good plating properties can be obtained even by a conventional simple plating pretreatment method. When plating both surfaces of the copper alloy material, both of the outermost layers are copper layers. In the present invention, the reason why the number of layers of the copper layer and the copper alloy layer is five or more is that if the number is less than five, sufficient uniformity in mechanical properties and the like cannot be obtained.
【０００９】銅層と銅合金層の厚さの比率は特に限定し
ないが、銅層の合計厚さは、銅合金材料全体の厚さの２
％〜５０％にするのが望ましい。２％未満では十分な導
電性が得られない上、めっき面となる銅層の表面にまで
銅合金層の合金元素が拡散して良好なめっき性が得られ
なくなる恐れがあり、５０％を超えると銅合金層が減少
して十分な強度が得られなくなるためである。Although the ratio of the thickness of the copper layer to the thickness of the copper alloy layer is not particularly limited, the total thickness of the copper layer is two times the total thickness of the copper alloy material.
% To 50%. If it is less than 2%, sufficient conductivity cannot be obtained, and alloy elements of the copper alloy layer may diffuse to the surface of the copper layer serving as a plating surface, so that good plating properties may not be obtained. This is because the copper alloy layer decreases and sufficient strength cannot be obtained.
【００１０】請求項３記載の発明は、例えば、図２
（イ）に示すように、銅箔３の片面に、銅以外の金属元
素層４を被覆する操作と、銅層５を被覆する操作をこの
順に交互に各２回施して５層（銅箔を１層と数える）の
積層体６を作製し、積層体６に熱処理を施して、隣接す
る各層間で相互拡散を起こさせて銅合金層を形成し、次
いで減面加工を施して所望の厚さに仕上げて銅合金材料
を製造する方法である。The invention described in claim 3 is, for example, shown in FIG.
As shown in (a), the operation of coating the metal element layer 4 other than copper on one surface of the copper foil 3 and the operation of coating the copper layer 5 are alternately performed twice in this order, thereby forming five layers (copper foil). Is counted as one layer), and the laminate 6 is subjected to a heat treatment to cause mutual diffusion between adjacent layers to form a copper alloy layer, and then subjected to surface reduction processing to obtain a desired surface. This is a method of manufacturing a copper alloy material by finishing to a thickness.
【００１１】或いは、図２（ロ）に示すように、銅箔３
の両面に、銅以外の金属元素層４を被覆する操作と、銅
層５を被覆する操作をこの順に交互に各２回施して５層
（銅箔を１層と数える）の積層体７を作製し、以下図２
（イ）に示した場合と同じようにして銅合金材料を製造
する方法である。この発明では、被覆を両面に同時に行
うことにより、図２（イ）に示した方法より高い生産性
が得られる。[0011] Alternatively, as shown in FIG.
An operation of coating the metal element layer 4 other than copper and an operation of coating the copper layer 5 are alternately performed twice in this order on both surfaces of the two layers to form a laminate 7 of five layers (the copper foil is counted as one layer). Figure 2
This is a method for producing a copper alloy material in the same manner as in (a). In the present invention, by performing coating on both surfaces simultaneously, higher productivity can be obtained than in the method shown in FIG.
【００１２】請求項３記載の発明において、前記銅箔に
は、電解銅箔、圧延銅箔など任意の銅箔が使用できる
が、コストと品質の面から電解銅箔が望ましい。また前
記２種の被覆操作を交互に施して層数を５層以上とする
理由は、得られる銅合金材料の機械的性質を均一化する
ためである。また合金濃度が強度的に最適となる銅合金
層と銅層との境界近傍部分を増やすためである。In the third aspect of the present invention, any copper foil such as an electrolytic copper foil or a rolled copper foil can be used as the copper foil, but an electrolytic copper foil is desirable from the viewpoint of cost and quality. The reason why the two kinds of coating operations are alternately performed to make the number of layers five or more is to make the mechanical properties of the obtained copper alloy material uniform. Another reason is to increase the portion near the boundary between the copper alloy layer and the copper layer where the alloy concentration is optimal in strength.
【００１３】銅以外の金属元素層には、銅との間で合金
を形成する任意の金属元素が使用できる。特に、Ａｇ、
Ｓｎ、Ｚｎ、Ｎｉ、Ｃｒは銅合金層が高強度となり望ま
しい。前記銅以外の金属元素層は複数の金属元素で形成
しても良い。For the metal element layer other than copper, any metal element which forms an alloy with copper can be used. In particular, Ag,
Sn, Zn, Ni, and Cr are desirable because the copper alloy layer has high strength. The metal element layer other than copper may be formed of a plurality of metal elements.
【００１４】銅以外の金属元素層または銅層の被覆に
は、蒸着法、化学めっき法、電気めっき法などが適用さ
れる。特に電気めっき法はコスト的に有利である。熱処
理条件は特に限定しないが、雰囲気は非酸化性、処理温
度は１５０℃〜８００℃、処理時間は３０秒〜４時間が
適当である。For the coating of a metal element layer other than copper or a copper layer, a vapor deposition method, a chemical plating method, an electroplating method, or the like is applied. In particular, the electroplating method is advantageous in cost. The heat treatment conditions are not particularly limited, but the atmosphere is non-oxidizing, the processing temperature is 150 ° C. to 800 ° C., and the processing time is 30 seconds to 4 hours.
【００１５】減面加工は、通常、圧延加工により施され
る。銅合金材料は減面加工により所望厚さに仕上げら
れ、また強度が向上する。減面加工率は５％〜８０％が
適当である。熱処理と減面加工は必要に応じ複数回施し
ても良い。熱処理前に軽く減面加工を施すと各層の密着
性が向上して熱処理時における相互拡散が促進され、熱
処理時間が短縮される。The surface reduction processing is usually performed by rolling. The copper alloy material is finished to a desired thickness by surface reduction processing, and the strength is improved. An appropriate area reduction rate is 5% to 80%. The heat treatment and the surface reduction may be performed a plurality of times as necessary. If the surface is lightly reduced before the heat treatment, the adhesion between the layers is improved, the mutual diffusion during the heat treatment is promoted, and the heat treatment time is shortened.
【００１６】[0016]
【実施例】以下に、本発明を実施例により詳細に説明す
る。 （実施例１）厚さ１０μｍの電解銅箔の両面にめっき前
処理を常法により施し、次いでその両面に表１に示す銅
以外の金属元素層と銅層を交互に電気めっきして、合計
層数が５〜２５層で、厚さが約３００μｍの積層体を作
製し、この積層体に熱処理および圧延加工をこの順に施
して厚さ１５０μｍの銅合金板を製造した。銅以外の金
属元素層は種々の元素で形成した。The present invention will be described below in detail with reference to examples. (Example 1) A plating pre-treatment was performed on both sides of a 10 μm-thick electrolytic copper foil by a conventional method, and then a metal element layer other than copper and a copper layer shown in Table 1 were alternately electroplated on both sides to obtain a total. A laminate having 5 to 25 layers and a thickness of about 300 μm was prepared, and the laminate was subjected to heat treatment and rolling in this order to produce a copper alloy plate having a thickness of 150 μm. Metal element layers other than copper were formed of various elements.
【００１７】電気めっき条件([a]電解液組成、 [b]めっ
き温度と電流密度) を下記に示す。 〔Ｃｕめっき〕 [a]ＣｕＳＯ4 １９０ｇ／リットル、Ｈ2 ＳＯ4 ６０ｇ
／リットル、ＮａＣｌ０．１ｇ／リットル。[b]５０
℃、１０Ａ／ｄｍ2 。 〔Ａｇめっき〕 [a]ＡｇＣＮ１０ｇ／リットル、ＫＣＮ６０ｇ／リット
ル、Ｋ2 ＣＯ3 ３０ｇ／リットル。 [b]３０℃、０．２Ａ／ｄｍ2 。 〔Ｓｎめっき〕 [a]ＳｎＳＯ4 ４０ｇ／リットル 、Ｈ2 ＳＯ4 ６０ｇ
／リットル、クレゾールスルフォン酸４０ｇ／リット
ル、ゼラチン２ｇ／リットル。[b]２０℃、１Ａ／ｄｍ2
。 〔Ｚｎめっき〕 [a]ＺｎＳＯ4 ３８０ｇ／リットル、ＮＨ2 ＳＯ4 ３０
ｇ／リットル。 [b]４５℃、２０Ａ／ｄｍ2 。 〔Ｎｉめっき〕 [a]ＮｉＳＯ4 ３５０ｇ／リットル、ＮｉＣｌ2 ３０ｇ
／リットル、Ｈ3 ＢＯ3 ３０ｇ／リットル。 [b]５０℃、５Ａ／ｄｍ2 。 〔Ｃｒめっき〕 [a]ＣｒＯ3 ２５０ｇ／リットル、Ｈ2 ＳＯ4 １．５ｇ
／リットル。 [b]４０℃、１０Ａ／ｄｍ2 。The electroplating conditions ([a] composition of electrolytic solution, [b] plating temperature and current density) are shown below. [Cu plating] [a] CuSO 4 190 g / liter, H 2 SO 4 60 g
/ Liter, NaCl 0.1 g / liter. [b] 50
℃, 10A / dm 2. [Ag plating] [a] AgCN 10 g / liter, KCN 60 g / liter, K 2 CO 3 30 g / liter. [b] 30 ° C., 0.2 A / dm 2 . [Sn Plating] [a] SnSO 4 40g / l, H 2 SO 4 60g
/ Liter, cresolsulfonic acid 40 g / liter, gelatin 2 g / liter. [b] 20 ° C., 1 A / dm 2
. [Zn plating] [a] ZnSO 4 380 g / liter, NH 2 SO 4 30
g / liter. [b] 45 ° C., 20 A / dm 2 . [Ni plating] [a] NiSO 4 350 g / liter, NiCl 2 30 g
/ Liter, H 3 BO 3 30g / liter. [b] 50 ° C., 5 A / dm 2 . [Cr plating] [a] CrO 3 250 g / l, H 2 SO 4 1.5 g
/liter. [b] 40 ° C., 10 A / dm 2 .
【００１８】（実施例２）厚さ１０μｍの電解銅箔の片
面にめっき前処理を常法により施し、次いで前記電解銅
箔の片面に表１に示す銅以外の金属元素（ＡｇまたはＳ
ｎ）層と銅層を交互に電気めっきして、合計層数が２５
層または５層で、厚さが約３００μｍの積層体を作製し
た。次にこの積層体に熱処理および圧延加工をこの順に
施して厚さ１５０μｍの銅合金板を製造した。前記電解
銅箔は、めっき前処理の際、他面（非めっき面）をマス
クした。Example 2 One side of an electrolytic copper foil having a thickness of 10 μm was subjected to a plating pretreatment by a conventional method, and then a metal element (Ag or S) other than copper shown in Table 1 was applied to one side of the electrolytic copper foil.
n) The layer and the copper layer are alternately electroplated so that the total number of layers is 25.
A layered product having a thickness of about 300 μm was prepared with a single layer or five layers. Next, this laminate was subjected to heat treatment and rolling in this order to produce a copper alloy plate having a thickness of 150 μm. The other surface (non-plated surface) of the electrolytic copper foil was masked during the pre-plating treatment.
【００１９】（比較例１）積層体の層数を４とした他
は、実施例１と同じ方法により銅合金板を製造した。Comparative Example 1 A copper alloy plate was manufactured in the same manner as in Example 1 except that the number of layers in the laminate was four.
【００２０】（比較例２）従来のＣｕ−Ｃｏ−Ａｇ−Ｂ
ｅ合金板またはＣｕ−Ｎｉ−Ｓｉ合金板を常法により製
造した。Comparative Example 2 Conventional Cu-Co-Ag-B
An e-alloy plate or a Cu-Ni-Si alloy plate was manufactured by an ordinary method.
【００２１】実施例１、２、比較例１、２で製造した各
々の銅合金板について、引張強さと導電率を測定した。
またＡｇを５μｍ厚さにめっきし、これを４５０℃で３
０分間、大気中で加熱して膨れの有無を顕微鏡（倍率１
００倍）により調べた。Ａｇめっきは次の工程により行
った。カソード脱脂（メルテックス製クリーナー＃１６
０を６０ｇ／リットル含む電解液使用、脱脂条件は５０
℃、５Ａ／ｄｍ2 、３０ｓｅｃ）・水洗・酸洗（１０％
Ｈ2 ＳＯ4 、室温、３０ｓｅｃ）・水洗・Ａｇストライ
クめっき（ＡｇＣＮ３ｇ／リットルとＫＣＮ６０ｇ／リ
ットル含む電解液使用、めっき条件は３０℃、２Ａ／ｄ
ｍ2 、１０ｓｅｃ）・Ａｇめっき（ＡｇＣＮ５０ｇ／リ
ットルとＫＣＮ６０ｇ／リットルを含む電解液使用、め
っき条件は３０℃、１Ａ／ｄｍ2 、８．５ｍｉｎ）・水
洗・乾燥。なお比較例１のサンプルについては、銅合金
層側表面はマスクしておき、銅層にのみＡｇめっきし
た。結果を表１に示す。表１には製造条件を併記した。With respect to each of the copper alloy sheets produced in Examples 1 and 2 and Comparative Examples 1 and 2, the tensile strength and the electric conductivity were measured.
Also, Ag was plated to a thickness of 5 μm, and this was
Heated in the air for 0 minutes and examined for swelling with a microscope (magnification: 1).
00 times). Ag plating was performed by the following steps. Cathode degreasing (Meltex cleaner # 16
The use of an electrolyte containing 60 g / l of 0, the degreasing condition is 50
℃, 5A / dm 2 , 30 sec) ・ Washing ・ Pickling (10%
H 2 SO 4 , room temperature, 30 sec) ・ Washing ・ Ag strike plating (using an electrolyte containing 3 g / L of AgCN and 60 g / L of KCN; plating conditions: 30 ° C., 2 A / d)
m 2, 10 sec), Ag plating (electrolytic solution used containing AgCN50g / l and KCN60g / liter, plating conditions 30 ℃, 1A / dm 2, 8.5min) · washed and dried. In the sample of Comparative Example 1, the copper alloy layer side surface was masked, and only the copper layer was plated with Ag. Table 1 shows the results. Table 1 also shows the manufacturing conditions.
【００２２】[0022]
【表１】 [Table 1]
【００２３】表１より明らかなように、本発明例のＮ
ｏ．１〜１２はいずれも引張強さが６２０ＭＰａ以上、
導電率が７０％ＩＡＣＳ以上であり、電子機器部品に要
求される性能を満足した。まためっき面が銅層のため、
めっき性にも優れた。これに対し、比較例のＮｏ．１
３、１４はいずれも引張強さが低かった。これは強度向
上に大きく寄与する銅合金層内の銅層との境界近傍部分
が少なかったためである。従来材（比較例２、Ｎｏ．１
５、１６）はめっき面に合金元素が析出したため、めっ
き性が劣った。As is evident from Table 1, N of the present invention example
o. Each of 1 to 12 has a tensile strength of 620 MPa or more,
The conductivity was 70% IACS or more, which satisfied the performance required for electronic device parts. Also, since the plating surface is a copper layer,
Excellent plating properties. On the other hand, in Comparative Example No. 1
In both Nos. 3 and 14, the tensile strength was low. This is because the portion near the boundary with the copper layer in the copper alloy layer, which greatly contributes to the strength improvement, was small. Conventional material (Comparative Example 2, No. 1)
In Nos. 5 and 16), the plating element was inferior because the alloy element was precipitated on the plated surface.
【００２４】本発明の銅合金材料の製造工程は、銅箔の
片面または両面に銅以外の金属元素を被覆（電気めっき
など）・熱処理・減面加工の工程からなり、従来の、溶
解鋳造・熱間圧延・面削・冷間圧延（中間焼鈍含む）・
仕上圧延・低温焼鈍・スリッター加工・めっき処理の工
程よりも、工程数が大幅に少ない。従って本発明の製造
方法は、生産性に優れる上、製造コストが安い。The process for producing the copper alloy material of the present invention comprises the steps of coating a metal element other than copper on one or both sides of a copper foil (such as electroplating), heat treatment, and reducing the surface area. Hot rolling / facing / cold rolling (including intermediate annealing)
The number of steps is significantly smaller than the steps of finish rolling, low-temperature annealing, slitting, and plating. Therefore, the production method of the present invention is excellent in productivity and low in production cost.
【００２５】[0025]
【発明の効果】本発明の銅合金材料は、電子機器部品に
要求される性能（引張強さ、導電性など）を満足し、ま
た銅層をめっき面とすることにより、従来の簡単なめっ
き前処理法によっても優れためっき性が得られる。また
本発明の製造方法は、従来の製造方法に比べて工程数が
大幅に少なく、生産性および製造コストの点で有利であ
る。依って、工業上顕著な効果を奏する。The copper alloy material of the present invention satisfies the performance (tensile strength, conductivity, etc.) required for electronic equipment parts, and uses the copper layer as the plating surface to achieve the conventional simple plating. Excellent plating properties can also be obtained by the pretreatment method. Further, the manufacturing method of the present invention has significantly fewer steps than the conventional manufacturing method, and is advantageous in terms of productivity and manufacturing cost. Therefore, an industrially remarkable effect is achieved.
【図１】本発明の銅合金材料の実施形態を示す縦断面図
である。FIG. 1 is a longitudinal sectional view showing an embodiment of a copper alloy material of the present invention.
【図２】（イ）、（ロ）は本発明の製造方法で用いる積
層体の実施形態を示すそれぞれ縦断面図である。FIGS. 2A and 2B are longitudinal sectional views respectively showing an embodiment of a laminate used in the manufacturing method of the present invention.
１、５ 銅層 ２ 銅合金層 ３ 銅箔 ４ 銅以外の金属元素層 ６、７ 積層体 1, 5 copper layer 2 copper alloy layer 3 copper foil 4 metal element layer other than copper 6, 7 laminate
Claims (3)
れており、最外層の少なくとも一方が銅層からなること
を特徴とする銅合金材料。1. A copper alloy material in which five or more copper layers and copper alloy layers are alternately laminated, and at least one of the outermost layers comprises a copper layer.
ｎ、Ｚｎ、Ｎｉ、Ｃｒのうちの１種または２種以上を含
む銅合金からなることを特徴とする請求項１記載の銅合
金材料。2. The method according to claim 1, wherein the copper alloy layer comprises Ag, S
The copper alloy material according to claim 1, comprising a copper alloy containing one or more of n, Zn, Ni, and Cr.
元素層を被覆する操作と、銅層を被覆する操作をこの順
に交互に施して、最外層の少なくとも一方が銅層からな
る５層（銅箔を含む）以上の積層体を作製し、前記積層
体に熱処理および減面加工を施すことを特徴とする銅合
金材料の製造方法。3. An operation for coating a metal element layer other than copper on one or both surfaces of a copper foil and an operation for coating a copper layer are alternately performed in this order, and at least one of the outermost layers is made of a copper layer. A method for producing a copper alloy material, comprising: producing a laminate having at least a layer (including a copper foil) and subjecting the laminate to heat treatment and surface reduction.
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| JP2000006087A JP4128715B2 (en) | 2000-01-11 | 2000-01-11 | Method for producing multilayer copper alloy material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000006087A JP4128715B2 (en) | 2000-01-11 | 2000-01-11 | Method for producing multilayer copper alloy material |
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| JP4128715B2 JP4128715B2 (en) | 2008-07-30 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010285653A (en) * | 2009-06-11 | 2010-12-24 | National Institute Of Advanced Industrial Science & Technology | Structural member and method for manufacturing the same |
| WO2013168620A1 (en) * | 2012-05-07 | 2013-11-14 | 田中貴金属工業株式会社 | Electrode material for thermal-fuse movable electrode |
| JP2019079978A (en) * | 2017-10-26 | 2019-05-23 | Jfe精密株式会社 | Heat sink and manufacturing method thereof |
-
2000
- 2000-01-11 JP JP2000006087A patent/JP4128715B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010285653A (en) * | 2009-06-11 | 2010-12-24 | National Institute Of Advanced Industrial Science & Technology | Structural member and method for manufacturing the same |
| WO2013168620A1 (en) * | 2012-05-07 | 2013-11-14 | 田中貴金属工業株式会社 | Electrode material for thermal-fuse movable electrode |
| JP2013235674A (en) * | 2012-05-07 | 2013-11-21 | Tanaka Kikinzoku Kogyo Kk | Electrode material for temperature fuse movable electrode |
| US10176958B2 (en) | 2012-05-07 | 2019-01-08 | Tanaka Kikinzoku Kogyo K.K. | Electrode material for thermal-fuse movable electrode |
| JP2019079978A (en) * | 2017-10-26 | 2019-05-23 | Jfe精密株式会社 | Heat sink and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
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| JP4128715B2 (en) | 2008-07-30 |
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