JP2001142313A - Electrically semiconductive belt - Google Patents

Electrically semiconductive belt

Info

Publication number
JP2001142313A
JP2001142313A JP32458899A JP32458899A JP2001142313A JP 2001142313 A JP2001142313 A JP 2001142313A JP 32458899 A JP32458899 A JP 32458899A JP 32458899 A JP32458899 A JP 32458899A JP 2001142313 A JP2001142313 A JP 2001142313A
Authority
JP
Japan
Prior art keywords
component
polyimide resin
weight
skeleton
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32458899A
Other languages
Japanese (ja)
Other versions
JP4263825B2 (en
Inventor
Toshihiko Tomita
俊彦 富田
Toshiaki Iwamoto
登志明 岩元
Yoshinobu Watanabe
義宣 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP32458899A priority Critical patent/JP4263825B2/en
Publication of JP2001142313A publication Critical patent/JP2001142313A/en
Application granted granted Critical
Publication of JP4263825B2 publication Critical patent/JP4263825B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electrically semiconductive belt which has excellent functions of transfer, transportation or the like and excellent durability by improving balance between flexibility and rigidity. SOLUTION: In the electrically semiconductive belt constituted by containing an electrically conductive filler in a polyimide resin, the polyimide resin is a copolymer which is formed by repetition of A component constituted by imide bonding of a whole aromatic skeleton being a tetracarboxylic acid residue and a p-phenylene skeleton being a diamine residue and B component constituted by imide bonding of the whole aromatic skeleton being the tetracarboxylic acid residue and a diphenylether skeleton being the diamine residue and/or a blending body constituted by blending a polymer having repetitive units of the A component and a polymer having repetitive units of the B component. Further when molar % of the A component in total repetitive units of the polyimide resin is R and parts by weight of the electrically conductive filler per polyimide resin 100 parts by weight is W, formula: 65-W<=R is satisfied.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ポリイミド樹脂に
導電性フィラーを含有してなる半導電性ベルトに関し、
特に電子写真記録装置の中間転写ベルトや転写搬送べル
ト等として有用なものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductive belt comprising a polyimide resin containing a conductive filler,
In particular, it is useful as an intermediate transfer belt or a transfer belt in an electrophotographic recording apparatus.

【0002】[0002]

【従来の技術】従来より電子写真方式で像を形成記録す
る電子写真記録装置としては、複写機やレーザープリン
タ、ビデオプリンタやファクシミリ、それらの複合機等
が知られている。この種の装置では装置寿命の向上など
を目的として、感光ドラム等の像担持体上の像を中間転
写ベルトに一旦転写し、それを印刷シート上に転写・定
着させる中間転写方式等が一部採用されている。また装
置の小型化等を目的に、搬送ベルトで印刷シートを搬送
しながら転写を行う方式も採用されている。
2. Description of the Related Art Conventionally, copiers, laser printers, video printers, facsimile machines, multifunction machines and the like have been known as electrophotographic recording apparatuses for forming and recording images by electrophotography. In order to improve the life of the apparatus, an intermediate transfer method for temporarily transferring an image on an image carrier such as a photosensitive drum to an intermediate transfer belt, and then transferring and fixing the image on a printing sheet has been partially adopted. Has been adopted. Further, for the purpose of downsizing the apparatus, a method of performing transfer while conveying a printing sheet by a conveying belt has been adopted.

【0003】この様な中間転写ベルトや転写搬送ベルト
等に用い得る半導電性ベルトとして、例えば特開平5−
77252号公報及び特開平10−63115号公報に
は、機械特性や耐熱性に優れたポリイミド樹脂に導電性
フィラーを分散してなる中間転写ベルトが提案されてい
る。
As a semiconductive belt that can be used for such an intermediate transfer belt or a transfer conveyance belt, for example, Japanese Patent Application Laid-Open No.
JP-A-77252 and JP-A-10-63115 propose an intermediate transfer belt in which a conductive filler is dispersed in a polyimide resin having excellent mechanical properties and heat resistance.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、これま
でに提案されているポリイミド樹脂からなる半導電性ベ
ルトは可とう性と剛性のバランスが悪く、中間転写ベル
トや転写搬送べルトとしての耐久性等が十分とは言えな
かった。例えば、特開平10−63115号公報のベル
トでは、3,3’,4,4’−ビフェニルテトラカルボ
ン酸二無水物とp−フェニレンジアミンと重合物である
ポリアミド酸(Uワニス−S)をポリイミド樹脂の原料
とし、これに導電性フィラーを分散したベルトが開示さ
れているが、このタイプの中間転写ベルトでは、可とう
性が不十分で、切り裂き強度の低下が見られ、長期使用
においてベルト端部から割れが生じ易いという問題があ
る。
However, the semiconductive belts made of polyimide resin which have been proposed so far have poor balance between flexibility and rigidity, and have poor durability as an intermediate transfer belt and a transfer belt. But not enough. For example, in the belt disclosed in JP-A-10-63115, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, p-phenylenediamine and a polyamic acid (U varnish-S), which is a polymer, are made of polyimide. A belt in which a conductive filler is dispersed as a raw material for a resin is disclosed. However, this type of intermediate transfer belt has insufficient flexibility, shows a decrease in tear strength, and has a belt end in long-term use. There is a problem that a crack is easily generated from the part.

【0005】一方、ジアミン成分として、屈曲性を有す
る4,4’−ジアミノジフェニルエーテルのみを用いて
製造したポリイミド製の半導電性ベルトも知られている
が、引っ張り弾性率が十分でないため、中間転写ベルト
等に使用すると、画像にズレが生じ易く、特にカラー画
像の場合に色ズレの問題が顕著になる。
[0005] On the other hand, a polyimide semiconductive belt manufactured using only 4,4'-diaminodiphenyl ether having flexibility as a diamine component is also known. However, since the tensile elasticity is not sufficient, an intermediate transfer belt is required. When used for a belt or the like, the image is likely to be misaligned, and the problem of color misalignment is particularly noticeable in the case of a color image.

【0006】そこで、本発明の目的は、可とう性と剛性
のバランスを改善することで、転写、搬送等の機能が良
好で、耐久性にも優れる半導電性ベルトを提供すること
にある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductive belt which improves the balance between flexibility and rigidity, has good functions such as transfer and conveyance, and has excellent durability.

【0007】[0007]

【課題を解決するための手段】本発明者らは、上記目的
を達成すべく、ポリイミド樹脂の共重体化もしくはブレ
ンド化、またその成分及び量などについて鋭意研究した
ところ、導電性フィラーの含有量と剛直成分(ハードセ
グメント)の比率の関係が特定条件を満たす場合に、可
とう性と剛性のバランスが良好になることを見出し、本
発明を完成するに至った。
Means for Solving the Problems In order to achieve the above object, the present inventors have conducted extensive studies on the copolymerization or blending of the polyimide resin and the components and amounts thereof. It has been found that when the relationship between the ratio of the rigid component and the ratio of the rigid component (hard segment) satisfies a specific condition, the balance between flexibility and rigidity is improved, and the present invention has been completed.

【0008】即ち、本発明は、ポリイミド樹脂に導電性
フィラーを含有してなり、表面抵抗率が108 〜1016
Ω/□、体積抵抗率が108 〜1016Ω・cmである半
導電性ベルトにおいて、前記ポリイミド樹脂は、テトラ
カルボン酸残基である全芳香族骨格とジアミン残基であ
るp−フェニレン骨格とがイミド結合してなるA成分
と、テトラカルボン酸残基である全芳香族骨格とジアミ
ン残基であるジフェニルエーテル骨格とがイミド結合し
てなるB成分とを繰返してなる共重合体、及び/又は前
記A成分を繰返し単位とする重合体と前記B成分を繰返
し単位とする重合体とを混合してなるブレンド体である
と共に、前記ポリイミド樹脂の全繰返し単位中の前記A
成分のモル%をR、前記導電性フィラーのポリイミド樹
脂100重量部に対する重量部数をWとするとき、65
−W≦Rを満たすことを特徴とする。
That is, the present invention comprises a polyimide resin containing a conductive filler and has a surface resistivity of 10 8 to 10 16.
In the semiconductive belt having a resistance of Ω / □ and a volume resistivity of 10 8 to 10 16 Ω · cm, the polyimide resin is a wholly aromatic skeleton which is a tetracarboxylic acid residue and a p-phenylene skeleton which is a diamine residue. And / or a copolymer obtained by repeating a component A having an imide bond with a component A and a component B having an imide bond between a wholly aromatic skeleton that is a tetracarboxylic acid residue and a diphenyl ether skeleton that is a diamine residue, and / or Or a blend obtained by mixing a polymer having the component A as a repeating unit and a polymer having the component B as a repeating unit, and the A in all the repeating units of the polyimide resin.
When the mole% of the component is R and the number of parts by weight of the conductive filler is 100 parts by weight of polyimide resin, W is 65%.
−W ≦ R is satisfied.

【0009】上記において、前記ポリイミド樹脂は、
3,3’,4,4’−ビフェニルテトラカルボン酸二無
水物とp−フェニレンジアミンと4,4’−ジアミノジ
フェニルエーテルとの共重合体であることが好ましい。
In the above, the polyimide resin comprises:
It is preferably a copolymer of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, p-phenylenediamine and 4,4'-diaminodiphenyl ether.

【0010】また、前記導電性フィラーがカーボンブラ
ックであることが好ましい。
It is preferable that the conductive filler is carbon black.

【0011】[作用効果]本発明によると、実施例の結
果が示すように、半導電性ベルトの可とう性と剛性のバ
ランスが良好になるため、転写、搬送等の機能が良好
で、耐久性にも優れる半導電性ベルトとなる。その理由
の詳細は明確ではないが、次のように推測される。
[Effects] According to the present invention, as shown in the results of the examples, the balance between the flexibility and the rigidity of the semiconductive belt is improved, so that the functions such as transfer and conveyance are excellent and the durability is improved. It becomes a semiconductive belt which is excellent in the property. Although the details of the reason are not clear, it is speculated as follows.

【0012】B成分は屈曲性のジフェニルエーテル骨格
を有するため、そのモル比率を変えることで、可とう性
と剛性のバランスを変化させることができる。一方、導
電性フィラーはその量によって、ベルトの機械特性を変
化させるが、上記のバランスへの影響が大きいため、導
電性フィラーの含有量に応じて、A成分の適切なモル%
の範囲を変える必要が生じる。その際、上記の条件を満
たすことで、転写、搬送等の機能が良好で、耐久性にも
優れる半導電性ベルトとなると考えられる。
Since the component B has a flexible diphenyl ether skeleton, the balance between flexibility and rigidity can be changed by changing the molar ratio. On the other hand, the amount of the conductive filler changes the mechanical properties of the belt depending on the amount thereof. However, since the influence on the balance is large, an appropriate mole% of the component A is selected according to the content of the conductive filler.
Needs to be changed. In this case, it is considered that a semiconductive belt having good functions such as transfer and conveyance and excellent durability can be obtained by satisfying the above conditions.

【0013】前記ポリイミド樹脂が、3,3’,4,
4’−ビフェニルテトラカルボン酸二無水物とp−フェ
ニレンジアミンと4,4’−ジアミノジフェニルエーテ
ルとの共重合体である場合、3,3’,4,4’−ビフ
ェニルテトラカルボン酸二無水物とp−フェニレンジア
ミンによりA成分が形成され、3,3’,4,4’−ビ
フェニルテトラカルボン酸二無水物と4,4’−ジアミ
ノジフェニルエーテルによりB成分が形成され、これら
が共重合成分となるため、ブレンド体と比べて、導電性
フィラーの分散性が良好になる。また、3,3’,4,
4’−ビフェニルテトラカルボン酸二無水物がビフェニ
ル骨格を有するため、耐吸湿性や耐クリープ性でも優れ
た半導電性ベルトとなる。
The polyimide resin is 3, 3 ', 4,
In the case of a copolymer of 4'-biphenyltetracarboxylic dianhydride, p-phenylenediamine and 4,4'-diaminodiphenyl ether, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and Component A is formed by p-phenylenediamine, and component B is formed by 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and 4,4'-diaminodiphenyl ether, and these are copolymerized components. Therefore, the dispersibility of the conductive filler becomes better than that of the blend. Also, 3,3 ', 4,
Since 4'-biphenyltetracarboxylic dianhydride has a biphenyl skeleton, a semiconductive belt excellent in moisture absorption resistance and creep resistance is obtained.

【0014】前記導電性フィラーがカーボンブラックで
ある場合、導電性の調整に伴う機械特性の変動が小さ
く、上記のように可とう性と剛性のバランスを良好にす
ることで、更に機械特性を改善することができる。
[0014] When the conductive filler is carbon black, fluctuations in mechanical properties due to the adjustment of conductivity are small, and as described above, the balance between flexibility and rigidity is improved to further improve mechanical properties. can do.

【0015】[0015]

【発明の実施の形態】以下、本発明の実施の形態につい
て説明する。本発明の半導電性ベルトは、ポリイミド樹
脂に導電性フィラーを含有してなるものである。
Embodiments of the present invention will be described below. The semiconductive belt of the present invention comprises a polyimide resin containing a conductive filler.

【0016】本発明におけるポリイミド樹脂は、テトラ
カルボン酸残基である全芳香族骨格とジアミン残基であ
るp−フェニレン骨格とがイミド結合してなるA成分
と、テトラカルボン酸残基である全芳香族骨格とジアミ
ン残基であるジフェニルエーテル骨格とがイミド結合し
てなるB成分とを繰返してなる共重合体、及び/又は前
記A成分を繰返し単位とする重合体とB成分を繰返し単
位とする重合体とを混合してなるブレンド体である。但
し、前述のような理由より、共重合体を使用するのが好
ましい。
The polyimide resin according to the present invention comprises a component A in which a wholly aromatic skeleton, which is a tetracarboxylic acid residue, and an imide bond with a p-phenylene skeleton, which is a diamine residue, A copolymer obtained by repeating an aromatic skeleton and a B component formed by an imide bond of a diphenyl ether skeleton serving as a diamine residue, and / or a polymer having the A component as a repeating unit and a B component as a repeating unit. It is a blend obtained by mixing with a polymer. However, it is preferable to use a copolymer for the reasons described above.

【0017】かかる共重合体は、例えばA成分を形成す
るための全芳香族骨格を有するテトラカルボン酸二無水
物等の酸成分、及びp−フェニレン骨格を有するジアミ
ン成分、並びにB成分を形成するための全芳香族骨格を
有するテトラカルボン酸二無水物等の酸成分(A成分と
同じ場合は不要)、及びジフェニルエーテル骨格を有す
るジアミン成分を共重合することで得ることができる。
また、ブレンド体は、例えばA成分を形成するための全
芳香族骨格を有するテトラカルボン酸二無水物等の酸成
分、及びp−フェニレン骨格を有するジアミン成分を予
め重合してポリアミド酸(重合ワニス)を得ると共に、
B成分を形成するための全芳香族骨格を有するテトラカ
ルボン酸二無水物等の酸成分、及びジフェニルエーテル
骨格を有するジアミン成分を予め重合してポリアミド酸
(重合ワニス)を得た後、両者のポリアミド酸を混合し
てからイミド転化することで得ることができる。
Such a copolymer forms, for example, an acid component such as a tetracarboxylic dianhydride having a wholly aromatic skeleton for forming the A component, a diamine component having a p-phenylene skeleton, and a B component. Component (e.g., unnecessary when it is the same as the component A) having a wholly aromatic skeleton and a diamine component having a diphenyl ether skeleton.
The blend is prepared by pre-polymerizing an acid component such as a tetracarboxylic dianhydride having a wholly aromatic skeleton for forming the A component and a diamine component having a p-phenylene skeleton, for example, to obtain a polyamic acid (polymerized varnish). ) And get
An acid component such as a tetracarboxylic dianhydride having a wholly aromatic skeleton and a diamine component having a diphenyl ether skeleton for forming the B component are previously polymerized to obtain a polyamic acid (polymerized varnish). It can be obtained by mixing an acid and then performing imide conversion.

【0018】上記の全芳香族骨格を有するテトラカルボ
ン酸二無水物としては、ピロメリット酸二無水物、3,
3’,4,4’−ビフェニルテトラカルボン酸二無水
物、2,3,3’,4’−ビフェニルテトラカルボン酸
二無水物、2,3,6,7−ナフタレンテトラカルボン
酸二無水物、1,2,5,6−ナフタレンテトラカルボ
ン酸二無水物、1,4,5,8−ナフタレンテトラカル
ボン酸二無水物、又はこれらの芳香環を低級アルキル基
等で置換した化合物等が挙げられる。これらのうち、特
に3,3’,4,4’−ビフェニルテトラカルボン酸二
無水物が好ましい。
The tetracarboxylic dianhydride having a wholly aromatic skeleton includes pyromellitic dianhydride, 3,
3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, Examples thereof include 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, and compounds in which the aromatic ring is substituted with a lower alkyl group or the like. . Of these, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride is particularly preferred.

【0019】また、p−フェニレン骨格を有するジアミ
ン成分としては、p−フェニレンジアミン又はその芳香
環を低級アルキル基等で置換した化合物等が挙げられ
る。ジフェニルエーテル骨格を有するジアミン成分とし
ては、4,4’−ジアミノジフェニルエーテル、 3,
3’−ジアミノジフェニルエーテル又はこれらの芳香環
を低級アルキル基等で置換した化合物等が挙げられる。
Examples of the diamine component having a p-phenylene skeleton include p-phenylenediamine or a compound in which an aromatic ring thereof is substituted with a lower alkyl group or the like. Examples of the diamine component having a diphenyl ether skeleton include 4,4′-diaminodiphenyl ether,
Examples include 3′-diaminodiphenyl ether or a compound in which these aromatic rings are substituted with a lower alkyl group or the like.

【0020】本発明における導電性フィラーとしては、
導電性もしくは半導電性の微粉末が使用でき、特に制限
はないが、ケッチエンブラック、アセチレンブラック等
のカーボンブラック、アルミニウムやニッケル等の金
属、酸化錫等の酸化金属化合物、チタン酸カリウム等が
例示できる。そしてこれらを単独、あるいは併用して使
用してもよい。本発明では、カーボンブラックを導電性
フィラーとして使用するのが好ましいが、特に、平均一
次粒子径が、5〜100nmのものが好ましく、特に1
0〜50nmのものが好ましい。平均一次粒子径が10
0nmを超えるものは、機械特性や電気抵抗値の均一性
が不十分になり易い傾向がある。
As the conductive filler in the present invention,
Conductive or semiconductive fine powders can be used, and there is no particular limitation, but carbon black such as ketchen black, acetylene black, metals such as aluminum and nickel, metal oxide compounds such as tin oxide, potassium titanate, and the like. Can be illustrated. These may be used alone or in combination. In the present invention, it is preferable to use carbon black as the conductive filler, but it is particularly preferable that the average primary particle size is 5 to 100 nm, and particularly preferable that the average primary particle size be 1 to 100 nm.
It is preferably from 0 to 50 nm. Average primary particle size is 10
If the thickness exceeds 0 nm, the mechanical properties and the uniformity of the electrical resistance tend to be insufficient.

【0021】導電性フィラーの配合量はフィラーの種
類、粒子径、分散状態によっても異なるが、ポリイミド
樹脂(固形分)100重量部に対して、1〜50重量部
の範囲が好ましく、2〜30重量部がより好ましい。本
発明では、導電性フィラーを選択することと適当な配合
量の組み合わせにより、中間転写ベルト等に適した表面
抵抗率(108 〜1016Ω/□)と体積抵抗率(108
〜1016Ω・cm)の範囲に調整される。
The amount of the conductive filler varies depending on the type, particle size and dispersion state of the filler, but is preferably in the range of 1 to 50 parts by weight, and more preferably 2 to 30 parts by weight, per 100 parts by weight of the polyimide resin (solid content). Parts by weight are more preferred. In the present invention, the surface resistivity (10 8 to 10 16 Ω / □) and the volume resistivity (10 8 ) suitable for the intermediate transfer belt and the like are selected by a combination of the selection of the conductive filler and the appropriate compounding amount.
〜1010 16 Ω · cm).

【0022】体積抵抗率等が高すぎるとトナー像の転写
時に転写ベルトが著しく帯電することから像担持体と離
れる際、剥離放電が起こり転写されたトナー像が飛散す
る。また、体積抵抗率等が低すぎる場合、転写ベルトと
像担持体との間に過大な電流が流れることから、ベルト
に転写されたトナー像が像担持体に戻ってしまう。かか
る観点より、好ましくは、表面抵抗率が1010〜1015
Ω/□、体積抵抗率が1010〜1015Ω・cmである。
If the volume resistivity is too high, the transfer belt is remarkably charged at the time of transfer of the toner image. Therefore, when the transfer belt is separated from the image carrier, a peeling discharge occurs and the transferred toner image is scattered. If the volume resistivity or the like is too low, an excessive current flows between the transfer belt and the image carrier, so that the toner image transferred to the belt returns to the image carrier. From this viewpoint, preferably, the surface resistivity is 10 10 to 10 15
Ω / □, volume resistivity is 10 10 to 10 15 Ω · cm.

【0023】本発明では、導電性フィラーの配合量に応
じて適切なポリイミド樹脂の組成範囲が存在する。即
ち、本発明の半導電性ベルトは、ポリイミド樹脂の全繰
返し単位中の前記A成分のモル%をR、導電性フィラー
のポリイミド樹脂100重量部に対する重量部数をWと
するとき、65−W≦Rを満たすことを特徴し、好まし
くは、70−W≦R≦100−(W/20)を満たす場
合である。Rが小さ過ぎると、引張り弾性率が低下し易
く、ベルトとしては、伸びが大きく使用が困難になる。
Rが大き過ぎると、引き裂き強度が低下し易く、使用時
に割れの発生が生じ易くなる傾向がある。
In the present invention, there is an appropriate composition range of the polyimide resin depending on the amount of the conductive filler. That is, the semiconductive belt of the present invention is such that when the mole% of the A component in all the repeating units of the polyimide resin is R and the number of parts by weight of the conductive filler relative to 100 parts by weight of the polyimide resin is W, 65-W ≦ R is satisfied, and preferably, 70-W ≦ R ≦ 100- (W / 20). If R is too small, the tensile modulus tends to decrease, and the belt becomes too long to use.
If R is too large, the tear strength tends to decrease, and cracks tend to occur during use.

【0024】本発明の半導電性ベルトは、例えば、ポリ
イミドの前駆体であるポリアミド酸を合成する際に使用
する溶媒に導電性フィラーを均一分散させた後、ジアミ
ン成分(p−フェニレンジアミンと4,4’−ジアミノ
ジフェニルエーテル等)と酸二無水物成分(3,3’,
4,4’−ビフェニルテトラカルボン酸二無水物等)を
特定量添加し共重合してポリアミド酸溶液を得た後、こ
のポリアミド酸溶液をベルト状に製膜し、加熱乾燥、イ
ミド転化を行って製造することができる。また、その
際、ポリアミド酸として、上記の如き混合物を使用する
ことで、ポリイミド樹脂のブレンド体に導電性フィラー
を含有してなる半導電性ベルトを製造することができ
る。
The semiconductive belt of the present invention is prepared, for example, by uniformly dispersing a conductive filler in a solvent used for synthesizing a polyamic acid which is a precursor of polyimide, and then diamine component (p-phenylenediamine and 4 , 4'-diaminodiphenyl ether, etc.) and an acid dianhydride component (3,3 ',
(4,4′-biphenyltetracarboxylic dianhydride, etc.) and a specific amount thereof is added and copolymerized to obtain a polyamic acid solution. Then, the polyamic acid solution is formed into a belt-like film, dried by heating, and subjected to imide conversion. Can be manufactured. In this case, by using the above-mentioned mixture as the polyamic acid, it is possible to produce a semiconductive belt in which a conductive filler is contained in a polyimide resin blend.

【0025】上記したテトラカルボン酸二無水物とジア
ミンを重合反応させる際の溶媒としては、溶解性などの
点により極性溶媒が好ましく、例えば、N−メチル−2
−ピロリドン、N,N−ジアルキルアミド類が好まし
い。重合反応させる際のモノマー濃度は、5〜30重量
%が好ましい。また、反応温度は80℃以下に設定する
ことが好ましく、特に好ましくは5〜50℃であり、反
応時間は約0.5〜10時間である。
As a solvent for the polymerization reaction of the above-mentioned tetracarboxylic dianhydride and diamine, a polar solvent is preferable from the viewpoint of solubility and the like. For example, N-methyl-2
-Pyrrolidone, N, N-dialkylamides are preferred. The monomer concentration during the polymerization reaction is preferably 5 to 30% by weight. The reaction temperature is preferably set to 80 ° C. or lower, particularly preferably 5 to 50 ° C., and the reaction time is about 0.5 to 10 hours.

【0026】ポリイミド樹脂に導電性フィラーを均一に
分散する方法としては特に制限はなく、ポリイミドの前
駆体であるポリアミド酸溶液に導電性フィラーをプラネ
タリーミキサーやビーズミルや三本ロール等で混合・分
散する方法や、ポリアミド酸合成時に使用する溶媒中に
導電性フィラーをボールミルあるいは超音波等で分散
後、この溶媒を用いてポリアミド酸を合成する方法等が
ある。
The method for uniformly dispersing the conductive filler in the polyimide resin is not particularly limited, and the conductive filler is mixed and dispersed in a polyamic acid solution, which is a precursor of the polyimide, with a planetary mixer, a bead mill, a three-roll mill, or the like. Or a method in which a conductive filler is dispersed in a solvent used for synthesizing a polyamic acid by a ball mill or ultrasonic waves, and then the polyamic acid is synthesized using the solvent.

【0027】製膜法については特に制限はなく、金型の
内周面、あるいは外周面に導電性フィラーを含有するポ
リアミド酸を浸漬法、遠心成型法、コーティング法等に
より塗布した後、溶媒除去、イミド転化し、その後、金
型より剥離することにより得ることが出来る。その際、
イミド転化の加熱温度は、ポリイミド樹脂の種類にもよ
るが、例えば300〜450℃で行われ、イミド転化が
十分完了するまで行うのが好ましい。また、必要に応じ
て、金型を離型処理してもよく、また、脱泡工程を行っ
てもよい。
There is no particular limitation on the film forming method. Polyamide acid containing a conductive filler is applied to the inner or outer peripheral surface of the mold by a dipping method, a centrifugal molding method, a coating method or the like, and then the solvent is removed. Imide conversion and then peeling off from the mold. that time,
The heating temperature of the imide conversion depends on the kind of the polyimide resin, but is preferably, for example, 300 to 450 ° C., and is preferably performed until the imide conversion is sufficiently completed. If necessary, the mold may be subjected to a mold release treatment, or a defoaming step may be performed.

【0028】以上のようにして得られる本発明の半導電
性ベルトは、引張り弾性率が3920N/mm2 以上
で、かつ、引き裂き強度が2.94N/mm2 以上であ
ることが好ましく、引張り弾性率が4900N/mm2
以上で、かつ、引き裂き強度が3.43N/mm2 以上
であることがより好ましい。
The semiconductive belt of the present invention obtained as described above preferably has a tensile modulus of 3920 N / mm 2 or more and a tear strength of 2.94 N / mm 2 or more. Rate is 4900N / mm 2
More preferably, the tear strength is 3.43 N / mm 2 or more.

【0029】本発明の半導電性ベルトの厚さは、その使
用目的などに応じて適宜決定しうるが、一般には強度や
柔軟性等の機械特性などの点により、厚さ5〜500μ
mが好ましく、厚さ20〜200μmがより好ましい。
The thickness of the semiconductive belt of the present invention can be appropriately determined according to the purpose of use, etc., but is generally 5 to 500 μm in view of mechanical properties such as strength and flexibility.
m is preferred, and a thickness of 20 to 200 μm is more preferred.

【0030】本発明の半導電性ベルトは、前記のような
電気特性および機械特性により、電子写真記録装置の中
間転写ベルトや転写搬送べルト等として有用である。
The semiconductive belt of the present invention is useful as an intermediate transfer belt, a transfer belt and the like of an electrophotographic recording apparatus due to the above-mentioned electric and mechanical characteristics.

【0031】[0031]

【実施例】以下、本発明の構成と効果を具体的に示す実
施例等について説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments and the like specifically showing the configuration and effects of the present invention will be described below.

【0032】実施例1−1 1847gのN−メチル−2−ピロリドン(NMP)中
に乾燥したカーボンブラック(三菱化学社製,MA−1
00,平均一次粒子径22nm)77.0g(ポリイミ
ド固型分100重量部に対し20重量部)をボールミル
で6時間(室温)混合した。このNMPに3,3’,
4,4’−ビフェニルテトラカルボン酸二無水物(BP
DA)294.2gとp−フェニレンジアミン(PD
A)と4,4’−ジアミノジフェニルエーテル(DD
E)をモル比PDA/DDE=8/2でそれぞれ86.
56g、40gを溶解し、窒素雰囲気中において、室温
で4時間撹拌しながら反応させて、ポリアミド酸溶液を
得た。
Example 1-1 Carbon black (MA-1 manufactured by Mitsubishi Chemical Corporation) dried in 1847 g of N-methyl-2-pyrrolidone (NMP)
Then, 77.0 g (20 parts by weight based on 100 parts by weight of the polyimide solid component) of 77.0 g (average primary particle diameter 22 nm) were mixed in a ball mill for 6 hours (room temperature). This NMP has 3,3 ',
4,4'-biphenyltetracarboxylic dianhydride (BP
DA) 294.2 g and p-phenylenediamine (PD
A) and 4,4′-diaminodiphenyl ether (DD
E) at a molar ratio of PDA / DDE = 8/2, respectively.
56 g and 40 g were dissolved and reacted while stirring at room temperature for 4 hours in a nitrogen atmosphere to obtain a polyamic acid solution.

【0033】内径300mm、長さ500mm、の内面
に上記ポリアミド酸溶液をディスペンサーで厚さ400
μmに塗布後、1500rpmで10分間回転させ均一
な塗布面を得た。次に、250rpmで回転させなが
ら、金型の外側より60℃の熱風を30分間あてた後、
150℃で60分間加熱、その後300℃まで2℃/分
の昇温速度で昇温し、更に300℃で30分間加熱し、
溶媒の除去、脱水閉環水の除去、及びイミド転化を行っ
た。その後室温に戻し、金型から剥離し、目的とする中
間転写ベルトを得た。この物の厚さは75μmであっ
た。
The above polyamic acid solution was applied to the inner surface having an inner diameter of 300 mm and a length of 500 mm with a dispenser to a thickness of 400 mm.
After coating at μm, the coating was rotated at 1500 rpm for 10 minutes to obtain a uniform coating surface. Next, while rotating at 250 rpm, hot air of 60 ° C. was applied from the outside of the mold for 30 minutes,
Heated at 150 ° C. for 60 minutes, then heated to 300 ° C. at a rate of 2 ° C./min, and further heated at 300 ° C. for 30 minutes;
Removal of solvent, removal of dehydrated ring-closing water, and imide conversion were performed. Thereafter, the temperature was returned to room temperature, and the resultant was peeled from the mold to obtain a target intermediate transfer belt. The thickness of this product was 75 μm.

【0034】実施例1−2 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=5/5(それぞれ54.1g/100gで
あり、カーボンブラックの添加量はポリイミド固型分1
00重量部に対し20重量部)とする以外は、実施例1
−1と同様にして、ポリアミド酸溶液を得た。その後、
実施例1−1と同じ方法で製膜し、厚さ75μmの中間
転写ベルトを得た。
Example 1-2 In Example 1-1, the molar ratio between PDA and DDE was changed to PD
A / DDE = 5/5 (54.1 g / 100 g each, and the amount of carbon black added was
Example 1 except that the amount was 20 parts by weight with respect to 00 parts by weight.
In the same manner as in -1, a polyamic acid solution was obtained. afterwards,
A film was formed in the same manner as in Example 1-1 to obtain an intermediate transfer belt having a thickness of 75 μm.

【0035】比較例1−1 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=4/6(それぞれ43.28g/120g
であり、カーボンブラックの添加量はポリイミド固型分
100重量部に対し20重量部)とする以外は、実施例
1−1と同様の操作を行い、厚さ75μmの中間転写ベ
ルトを得た。
Comparative Example 1-1 In Example 1-1, the molar ratio between PDA and DDE was changed to PD.
A / DDE = 4/6 (43.28 g / 120 g each)
The same operation as in Example 1-1 was carried out except that the addition amount of carbon black was changed to 20 parts by weight with respect to 100 parts by weight of the solid part of the polyimide, to obtain an intermediate transfer belt having a thickness of 75 μm.

【0036】比較例1−2 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=10/0(それぞれ108.2g/0gで
あり、カーボンブラックの添加量はポリイミド固型分1
00重量部に対し20重量部)とする以外は、実施例1
−1と同様の操作を行い、厚さ75μmの中間転写ベル
トを得た。
Comparative Example 1-2 In Example 1-1, the molar ratio between PDA and DDE was changed to PD
A / DDE = 10/0 (108.2 g / 0 g respectively, and the amount of carbon black added was 1
Example 1 except that the amount was 20 parts by weight with respect to 00 parts by weight.
By performing the same operation as in Example 1, an intermediate transfer belt having a thickness of 75 μm was obtained.

【0037】実施例2−1 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=9/1(それぞれ97.38g/20g)
とし、かつカーボンブラックの添加量を38.5g(ポ
リイミド固型分100重量部に対し10重量部)とする
以外は、実施例1−1と同様にして、ポリアミド酸溶液
を得た。その後、実施例1−1と同じ方法で製膜し、厚
さ75μmの中間転写ベルトを得た。
Example 2-1 In Example 1-1, the molar ratio between PDA and DDE was changed to PD
A / DDE = 9/1 (97.38 g / 20 g each)
And a polyamic acid solution was obtained in the same manner as in Example 1-1, except that the addition amount of carbon black was 38.5 g (10 parts by weight based on 100 parts by weight of the solid polyimide component). Thereafter, a film was formed in the same manner as in Example 1-1 to obtain an intermediate transfer belt having a thickness of 75 μm.

【0038】実施例2−2 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=6/4(それぞれ64.97g/80g)
とし、かつカーボンブラックの添加量をポリイミド固型
分100重量部に対し10重量部とする以外は、実施例
1−1と同様にして、ポリアミド酸溶液を得た。その
後、実施例1−1と同じ方法で製膜し、厚さ75μmの
中間転写ベルトを得た。
Example 2-2 In Example 1-1, the molar ratio between PDA and DDE was changed to PD
A / DDE = 6/4 (64.97 g / 80 g respectively)
And a polyamic acid solution was obtained in the same manner as in Example 1-1, except that the addition amount of carbon black was changed to 10 parts by weight based on 100 parts by weight of the polyimide solid component. Thereafter, a film was formed in the same manner as in Example 1-1 to obtain an intermediate transfer belt having a thickness of 75 μm.

【0039】比較例2−1 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=5/5(それぞれ54.1g/100g)
とし、かつカーボンブラックの添加量をポリイミド固型
分100重量部に対し10重量部とする以外は、実施例
1−1と同様にして、ポリアミド酸溶液を得た。その
後、実施例1−1と同じ方法で製膜し、厚さ75μmの
中間転写ベルトを得た。
Comparative Example 2-1 In Example 1-1, the molar ratio of PDA to DDE was changed to PD
A / DDE = 5/5 (54.1 g / 100 g each)
And a polyamic acid solution was obtained in the same manner as in Example 1-1, except that the addition amount of carbon black was changed to 10 parts by weight based on 100 parts by weight of the polyimide solid component. Thereafter, a film was formed in the same manner as in Example 1-1, and an intermediate transfer belt having a thickness of 75 μm was obtained.

【0040】比較例2−2 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=4/6(それぞれ43.28g/120
g)とし、かつカーボンブラックの添加量をポリイミド
固型分100重量部に対し10重量部とする以外は、実
施例1−1と同様にして、ポリアミド酸溶液を得た。そ
の後、実施例1−1と同じ方法で製膜し、厚さ75μm
の中間転写ベルトを得た。
Comparative Example 2-2 In Example 1-1, the molar ratio between PDA and DDE was changed to PD.
A / DDE = 4/6 (43.28 g / 120 each)
g), and a polyamic acid solution was obtained in the same manner as in Example 1-1, except that carbon black was added in an amount of 10 parts by weight based on 100 parts by weight of the polyimide solid component. Thereafter, a film was formed in the same manner as in Example 1-1, and had a thickness of 75 μm.
Was obtained.

【0041】実施例3−1 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=7/3(それぞれ75.74g/60g)
とし、かつカーボンブラックの添加量を115.4g
(ポリイミド固型分100重量部に対し30重量部)と
する以外は、実施例1−1と同様にして、ポリアミド酸
溶液を得た。その後、実施例1−1と同じ方法で製膜
し、厚さ75μmの中間転写ベルトを得た。
Example 3-1 In Example 1-1, the molar ratio between PDA and DDE was changed to PD
A / DDE = 7/3 (75.74 g / 60 g respectively)
And the amount of carbon black added is 115.4 g.
A polyamic acid solution was obtained in the same manner as in Example 1-1, except that the amount was 30 parts by weight based on 100 parts by weight of the polyimide solid component. Thereafter, a film was formed in the same manner as in Example 1-1 to obtain an intermediate transfer belt having a thickness of 75 μm.

【0042】実施例3−2 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=4/6(それぞれ43.28g/120
g)とし、かつカーボンブラックの添加量をポリイミド
固型分100重量部に対し30重量部とする以外は、実
施例1−1と同様にして、ポリアミド酸溶液を得た。そ
の後、実施例1−1と同じ方法で製膜し、厚さ75μm
の中間転写ベルトを得た。
Example 3-2 In Example 1-1, the molar ratio between PDA and DDE was changed to PD
A / DDE = 4/6 (43.28 g / 120 each)
g) and a polyamic acid solution was obtained in the same manner as in Example 1-1, except that carbon black was added in an amount of 30 parts by weight based on 100 parts by weight of the solid polyimide component. Thereafter, a film was formed in the same manner as in Example 1-1, and had a thickness of 75 μm.
Was obtained.

【0043】比較例3−1 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=3/7(それぞれ32.46g/140
g)とし、かつカーボンブラックの添加量をポリイミド
固型分100重量部に対し30重量部とする以外は、実
施例1−1と同様にして、ポリアミド酸溶液を得た。そ
の後、実施例1−1と同じ方法で製膜し、厚さ75μm
の中間転写ベルトを得た。
Comparative Example 3-1 In Example 1-1, the molar ratio between PDA and DDE was changed to PD
A / DDE = 3/7 (32.46 g / 140 each)
g) and a polyamic acid solution was obtained in the same manner as in Example 1-1, except that carbon black was added in an amount of 30 parts by weight based on 100 parts by weight of the solid polyimide component. Thereafter, a film was formed in the same manner as in Example 1-1, and had a thickness of 75 μm.
Was obtained.

【0044】比較例3−2 実施例1−1において、PDAとDDEのモル比をPD
A/DDE=10/0(それぞれ108.2g/0g)
とし、かつカーボンブラックの添加量をポリイミド固型
分100重量部に対し30重量部とする以外は、実施例
1−1と同様にして、ポリアミド酸溶液を得た。その
後、実施例1−1と同じ方法で製膜し、厚さ75μmの
中間転写ベルトを得た。
Comparative Example 3-2 In Example 1-1, the molar ratio between PDA and DDE was changed to PD.
A / DDE = 10/0 (108.2 g / 0 g respectively)
And a polyamic acid solution was obtained in the same manner as in Example 1-1, except that the addition amount of carbon black was 30 parts by weight with respect to 100 parts by weight of the polyimide solid component. Thereafter, a film was formed in the same manner as in Example 1-1 to obtain an intermediate transfer belt having a thickness of 75 μm.

【0045】実施例4 1480.5gのNMP中に乾燥したカーボンブラック
(三菱化学社製,MA−100,平均一次粒子径22n
m)77.0g(ポリイミド固型分100重量部に対し
20重量部)をボールミルで6時間(室温)混合した。
このNMPにBPDA235.36gとPDA86.5
6gを溶解し、窒素雰囲気中において、室温で4時間撹
拌しながら反応させて、ポリアミド酸溶液を得た。ま
た、カーボンブラックを含まないNMP366.6gに
BPDA58.84gとDDE40gを溶解し、窒素雰
囲気中において、室温で4時間撹拌しながら反応させ
て、ポリアミド酸溶液を得た。両者のポリアミド酸溶液
を30分間攪拌・混合してポリアミド酸混合溶液を得
た。
Example 4 Carbon black (MA-100, manufactured by Mitsubishi Chemical Corporation, average primary particle size: 22 n) in 1480.5 g of NMP
m) 77.0 g (20 parts by weight with respect to 100 parts by weight of polyimide solids) were mixed in a ball mill for 6 hours (room temperature).
235.36 g of BPDA and 86.5 PDA are added to this NMP.
6 g was dissolved and reacted under stirring in a nitrogen atmosphere at room temperature for 4 hours to obtain a polyamic acid solution. Further, BPDA (58.84 g) and DDE (40 g) were dissolved in carbon black-free NMP (366.6 g), and reacted under stirring in a nitrogen atmosphere at room temperature for 4 hours to obtain a polyamic acid solution. The both polyamic acid solutions were stirred and mixed for 30 minutes to obtain a polyamic acid mixed solution.

【0046】内径300mm、長さ500mm、の内面
に上記ポリアミド酸混合溶液をディスペンサーで厚さ4
00μmに塗布後、1500rpmで10分間回転させ
均一な塗布面を得た。次に、250rpmで回転させな
がら、金型の外側より60℃の熱風を30分間あてた
後、150℃で60分間加熱、その後300℃まで2℃
/分の昇温速度で昇温し、更に300℃で30分間加熱
し、溶媒の除去、脱水閉環水の除去、及びイミド転化を
行った。その後室温に戻し、金型から剥離し、目的とす
る中間転写ベルトを得た。この物の厚さは75μmであ
った。
The above polyamic acid mixed solution was applied to an inner surface having an inner diameter of 300 mm and a length of 500 mm with a dispenser to a thickness of 4 mm.
After coating at 00 μm, the coating was rotated at 1500 rpm for 10 minutes to obtain a uniform coating surface. Next, while rotating at 250 rpm, hot air of 60 ° C. was blown from the outside of the mold for 30 minutes, then heated at 150 ° C. for 60 minutes, and then 2 ° C. to 300 ° C.
/ Min, and further heated at 300 ° C. for 30 minutes to remove the solvent, remove dehydrated ring-closed water, and convert to imide. Thereafter, the temperature was returned to room temperature, and the resultant was peeled from the mold to obtain a target intermediate transfer belt. The thickness of this product was 75 μm.

【0047】評価試験 以上の実施例、比較例で得た半導電性ベルトについて下
記の特性を調べた。
Evaluation Test The following characteristics were examined for the semiconductive belts obtained in the above Examples and Comparative Examples.

【0048】(1)表面抵抗率とそのバラツキ ハイレスタIP MCP−HT260(三菱油化製、プ
ローブHR−100)にて印加電圧100V、10秒値
の測定条件による25℃、60%RHでの表面抵抗率を
調べた。また、1本のベルトの10箇所を測定して、そ
の変動幅により表面抵抗率のバラツキを評価した。○は
表面抵抗率のバラツキが1桁以内におさまるものを、×
は表面抵抗率のバラツキが1桁以内におさまらないもの
を表す。
(1) Surface resistivity and its variation The surface at 25 ° C. and 60% RH under the measurement conditions of an applied voltage of 100 V and a value of 10 seconds with Hiresta IP MCP-HT260 (probe HR-100 manufactured by Mitsubishi Yuka). The resistivity was checked. In addition, measurement was made at 10 locations on one belt, and the variation of the surface resistivity was evaluated based on the fluctuation width. ○ indicates that the variation in surface resistivity is within one digit, ×
Indicates that the variation of the surface resistivity does not fall within one digit.

【0049】(2)体積抵抗率とそのバラツキ ハイレスタIP MCP−HT260(三菱油化製、プ
ローブHR−100)にて印加電圧100V、30秒値
の測定条件による25℃、60%RHでの体積抵抗率を
調べた。また、1本のベルトの10箇所を測定して、そ
の変動幅により体積抵抗率のバラツキを評価した。○は
体積抵抗率のバラツキが1桁以内におさまるものを、×
は体積抵抗率のバラツキが1桁以内におさまらないもの
を表す。
(2) Volume resistivity and its variation Volume at 25 ° C. and 60% RH under the measurement conditions of an applied voltage of 100 V and a value of 30 seconds using Hiresta IP MCP-HT260 (probe HR-100 manufactured by Mitsubishi Yuka). The resistivity was checked. In addition, measurement was made at 10 locations on one belt, and the variation in volume resistivity was evaluated based on the fluctuation width. ○ indicates that the variation in volume resistivity is within one digit, ×
Indicates that the variation in volume resistivity is not within one digit.

【0050】(3)引張り強度、伸び、弾性率 ダンベル3号の打ち抜き試験片(幅5mm)について、
引張り強度(速度100mm/分)、弾性率および破断
時の伸びを調べた。
(3) Tensile Strength, Elongation and Elastic Modulus Dumbbell No. 3 punched test piece (width 5 mm)
Tensile strength (speed 100 mm / min), elastic modulus and elongation at break were examined.

【0051】(4)引き裂き強度 トラウザー引き裂き法にて試験速度10mm/分で引き
裂き強度を測定し、厚さで換算した。
(4) Tear strength The tear strength was measured by a trouser tear method at a test speed of 10 mm / min, and was converted into a thickness.

【0052】(5)画像転写性 実施例、比較例で得た半導電性ベルトを市販の複写機
に、中間転写兼用の記録シート搬送ベルトとして組み込
み、画像転写性のテストを行った。
(5) Image Transfer Property The semiconductive belts obtained in Examples and Comparative Examples were incorporated into a commercially available copying machine as a recording sheet transport belt that also serves as an intermediate transfer, and an image transfer property test was performed.

【0053】以上の評価結果を表1〜表4に示す。Tables 1 to 4 show the above evaluation results.

【0054】[0054]

【表1】 [Table 1]

【表2】 [Table 2]

【表3】 [Table 3]

【表4】 以上の結果、A成分のモル%(R)が小さすぎる比較例
では、引張り弾性率が小さく、画像転写性が悪くなり、
A成分のモル%(R)が大きすぎる比較例では、引き裂
き強度が小さいなどの理由から、ベルトの耐久性が劣っ
ていた。
[Table 4] As a result, in the comparative example in which the mol% (R) of the component A is too small, the tensile elastic modulus is small, and the image transferability is deteriorated.
In the comparative example in which the mole% (R) of the component A was too large, the durability of the belt was inferior because the tear strength was low.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡辺 義宣 大阪府茨木市下穂積1丁目1番2号 日東 電工株式会社内 Fターム(参考) 2H032 BA09 BA18 4F071 AA60 AB03 AF37Y BC07 4J002 CM041 DA036 FD116 GM01 4J043 PA04 QB26 QB31 RA34 SA06 SB03 TA14 TA22 TB01 UA121 UA131 UA132 UB121 ZA44 ZA45 ZB60  ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Yoshinobu Watanabe 1-2-1 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation F-term (reference) 2H032 BA09 BA18 4F071 AA60 AB03 AF37Y BC07 4J002 CM041 DA036 FD116 GM01 4J043 PA04 QB26 QB31 RA34 SA06 SB03 TA14 TA22 TB01 UA121 UA131 UA132 UB121 ZA44 ZA45 ZB60

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 ポリイミド樹脂に導電性フィラーを含有
してなり、表面抵抗率が108 〜1016Ω/□、体積抵
抗率が108 〜1016Ω・cmである半導電性ベルトに
おいて、 前記ポリイミド樹脂は、テトラカルボン酸残基である全
芳香族骨格とジアミン残基であるp−フェニレン骨格と
がイミド結合してなるA成分と、テトラカルボン酸残基
である全芳香族骨格とジアミン残基であるジフェニルエ
ーテル骨格とがイミド結合してなるB成分とを繰返して
なる共重合体、及び/又は前記A成分を繰返し単位とす
る重合体と前記B成分を繰返し単位とする重合体とを混
合してなるブレンド体であると共に、 前記ポリイミド樹脂の全繰返し単位中の前記A成分のモ
ル%をR、前記導電性フィラーのポリイミド樹脂100
重量部に対する重量部数をWとするとき、 65−W≦R を満たすことを特徴とする半導電性ベルト。
1. A semiconductive belt comprising a polyimide resin containing a conductive filler, having a surface resistivity of 10 8 to 10 16 Ω / □ and a volume resistivity of 10 8 to 10 16 Ω · cm. The polyimide resin has an A component in which a wholly aromatic skeleton that is a tetracarboxylic acid residue and an imide bond of a p-phenylene skeleton that is a diamine residue, and a wholly aromatic skeleton that is a tetracarboxylic acid residue and a diamine A copolymer obtained by repeating a B component formed by an imide bond with a diphenyl ether skeleton as a residue, and / or a polymer having the A component as a repeating unit and a polymer having the B component as a repeating unit. The blended product is obtained by mixing, and the mole% of the component A in all the repeating units of the polyimide resin is R;
A semiconductive belt characterized by satisfying 65-W ≦ R, where W is the number of parts by weight with respect to part by weight.
【請求項2】 前記ポリイミド樹脂は、3,3’,4,
4’−ビフェニルテトラカルボン酸二無水物とp−フェ
ニレンジアミンと4,4’−ジアミノジフェニルエーテ
ルとの共重合体である請求項1記載の半導電性ベルト。
2. The method according to claim 2, wherein the polyimide resin is 3, 3 ′, 4,
The semiconductive belt according to claim 1, which is a copolymer of 4'-biphenyltetracarboxylic dianhydride, p-phenylenediamine and 4,4'-diaminodiphenyl ether.
【請求項3】 前記導電性フィラーがカーボンブラック
である請求項1又は2記載の半導電性ベルト。
3. The semiconductive belt according to claim 1, wherein the conductive filler is carbon black.
JP32458899A 1999-11-15 1999-11-15 Semi-conductive belt for intermediate transfer and method for producing the same Expired - Fee Related JP4263825B2 (en)

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